JP2001225195A - Substrate crimping device - Google Patents

Abstract

(57) Abstract: When bonding a bonded substrate, the cells of the bonded substrate are pressed from above and below by applying a uniform pressing force in a state where there is no variation in temperature over the whole. The gap can be formed with extremely high precision. SOLUTION: A fixed press member 12S located at a lower portion and a movable press member 12R located at an upper portion are provided with liquid chambers 34S, 34R by flexible sheets 33S, 33R, respectively.
The hydraulic oil heated by the heater 38 is supplied from the tank 37 to the liquid chambers 34S and 34R in a state where the hydraulic oil is pressurized by the pump 43, and the drainage passages 36S and 36R are throttled. As a result, the liquid chamber 34
A back pressure is generated in S, 34R, and the bonding substrate 4 is pressurized by this pressure under heating based on the temperature of the hydraulic oil, thereby forming a cell gap between the upper and lower substrates 1 and 2 and a sealing material. 3 is cured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for press-bonding upper and lower substrates under heat and pressure so as to form a predetermined cell gap between the upper and lower substrates in a manufacturing process of a liquid crystal substrate or the like. The present invention relates to a substrate pressure bonding apparatus.

[0002]

2. Description of the Related Art For example, a color TFT (Thin Film Tran)
sistor) liquid crystal panel, CF (Color Filt)
er) It is assembled so that substrates are opposed to each other with a liquid crystal interposed therebetween. For this purpose, first, a sealing material having a predetermined thickness is supplied in the vicinity of the outer periphery of the surface of the TFT substrate (or CF substrate), and the mating substrates are overlapped with each other, and the sealing material is compressed. It is compressed so as to have a predetermined gap, and the sealing material interposed between the TFT substrate and the CF substrate is cured so that the two substrates are fixed in a joined state. Liquid crystal is injected into the liquid crystal, and the injection port is closed.

In the above configuration, the TFT substrate is a lower substrate, and the CF substrate is an upper substrate, and a joining substrate is formed by overlapping these upper and lower substrates. The bonding of the bonding substrate is generally performed by pressing from above and below in a heated state. The crimping device used for this is
Upper and lower press members are used, at least one of which can be displaced in a direction to approach or separate from the other, but the lower press member is usually fixed, and the upper press member approaches or separates from the lower press member. It can be displaced in the direction. Therefore, the lower press member is a fixed press member, and the upper press member is a movable press member. Each of the upper and lower press members has a built-in heater, and is heated to a predetermined set temperature by the heater. The press member is made of a metal material from the viewpoint of strength, heat transfer efficiency, and the like. Therefore, if the pressing member is brought into direct contact with the substrate, the substrate may be damaged. For this reason, a cushion made of rubber, sponge, or the like is attached to the pressing surface, and the cushion is applied to the substrate. I try to contact them.

[0004] The pressing means is provided on a pressing stage, and the bonded substrate is carried on a fixed pressing member of the pressing stage by a robot, a conveyor belt or the like, and is pressed from above and below by lowering the movable pressing member. As a result, the sealing material between the two substrates is compressed by a predetermined amount, and the sealing material is cured by heating. As a result, the gap formed between the two substrates, the so-called cell gap, becomes constant, and in this state, the upper and lower substrates are joined in a stable state.
The bonded substrate thus pressed is placed in a heating furnace, and the sealing material is further heated and completely cured.

[0005]

The most important thing in press-bonding the bonding substrate is to apply a uniform pressing force over the entire bonding substrate, and to heat the bonding substrate to a uniform temperature over the entire bonding substrate. There must be. If the pressing force is not uniform, there is a problem that the cell gap between the upper and lower substrates is not uniform, and if the temperature varies, the degree of curing of the sealing material partially changes. When the bonding substrate is pressurized, the cushioning material is elastically deformed between the two pressing members and the upper and lower surfaces of the bonding substrate, so that a uniform pressing force cannot always be applied to the whole. In particular, as the size of the bonding substrate increases, it becomes more difficult to make the pressure uniform. In addition, when the pressure bonding is repeatedly performed, the cushion material is deteriorated due to the influence of heat or the like, and there is a possibility that the cushion material is partially deformed. Therefore, the cushioning material must be replaced at an appropriate time, and the replacement of the cushioning material is performed by removing the cushioning material from the press member and attaching a new cushioning material. Since the attachment must accurately produce flatness, the work is extremely troublesome and takes a long time. Furthermore, the temperature control of the press member is performed by a heater built in the press member. However, even if a large number of rod heaters are provided and the press member uses a member having extremely good heat transfer efficiency, the heater is still used. There may be a slight temperature difference between the provided portion and the other portion, for example, a temperature variation of about several degrees Celsius.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to apply a uniform pressing force to a bonding substrate in a state in which there is no temperature variation throughout the pressure bonding. It is an object of the present invention to perform pressure bonding so that the cell gap of the bonded substrate can be formed with extremely high precision by pressing from above and below so as to act.

[0007]

Means for Solving the Problems To achieve the above-mentioned object, the present invention provides a method in which a bonding substrate having a sealing material interposed between upper and lower substrates is pressed under heating by upper and lower pressing members. A liquid chamber which is provided in pressurizing portions of upper and lower pressurizing members and in which a working liquid is supplied and which can be expanded and contracted, for performing pressure bonding so that a predetermined cell gap is formed between both substrates. And a pressure guiding means for supplying a pressurized working liquid into the liquid chamber, and a heating means for heating the working liquid supplied to the pressure guiding means. Is what you do.

Here, the flexible chamber is constructed such that a flexible sheet made of an elastic member such as rubber or a non-elastic member such as a soft resin sheet is attached to each press member. it can. The working liquid supplied to the liquid chamber constituting the flexible chamber can be stored in a tank. In this case, the heating means can be constituted by a heater or the like provided in the tank. In order to strictly control the temperature, a temperature sensor and a stirring means in the tank may be provided. Preferably, the working liquid is circulated between the tank and the liquid chamber. For this purpose, a supply path for supplying the working liquid between the tank and the liquid chamber and a return path for returning the working liquid from the liquid chamber to the tank may be provided. In this case, the pressure guiding means is provided with a pump for pumping the working liquid in the supply path, and is provided with a throttle portion of the flow path for generating the back pressure in the return path for returning the working liquid from the liquid chamber to the tank. Configuration. The restricting section may always restrict the flow path, may be constituted by a variable restrictor, or may be switched by a switching valve between a path through the restrictor flow path and a path without the restrictor. Can also. In order to suppress temperature variation in the liquid chamber,
For example, a partition wall for forming a passage through which the working liquid heated from the supply side to the discharge side of the working liquid flows in the liquid chamber is provided. Here, various liquids can be used as the working liquid, but those having low viscosity, being chemically stable, and having a high vaporization temperature are preferably used, and it is most preferable to use hydraulic oil. Further, since the working liquid is used, the temperature of the liquid supplied to the liquid chamber can be continuously or stepwise increased.
Further, it is also possible to configure so that the working liquid is pressurized continuously or stepwise.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows two substrates arranged vertically, and FIG. 2 shows a cross section in a state where the two substrates are bonded to each other. In the figure, 1 is a lower substrate made of, for example, a TFT substrate or the like, 2 is an upper substrate made of, for example, a CF substrate, and the lower substrate 1 and the upper substrate 2 are made of a sealing material 3 provided on the lower substrate 1 side. The sealing material 3 is fixed by being bonded by hardening the sealing material 3 by pressing under heating, and a liquid crystal is sealed in a portion surrounded by the sealing material 3. Then, in order to make the thickness of the liquid crystal uniform, it is necessary to accurately adjust the cell gap G between the lower substrate 1 and the upper substrate 2. Further, in the step of superposing the two substrates 1 and 2, the two substrates 1 and 2 are superposed to each other in an extremely strictly aligned state to form the bonding substrate 4. The gap is temporarily fixed by a UV curable resin 5 at a required portion.

FIG. 3 shows a schematic configuration of the crimping device. In the figure, reference numeral 10 denotes a pressure bonding stage, and the pressure bonding stage 10 has a configuration including a loading / unloading section 11 for the bonding substrate 4 and a press section 12. Loading / Unloading unit 1
A transfer belt 13 is provided for transferring the bonding substrate 4 into and out of the pressure bonding stage 10 from 1. The press section 12 has a lower fixed press member 1.
2S, and a movable press member 12R that can be displaced in a direction approaching / separating from the fixed press member 12S by a lifting / lowering drive unit 14 such as a cylinder.

The conveyor belt 13 is provided with a fixed press member 12S.
The transport surface 13a has a width wider than the width of the bonding substrate 4. The transport belt 13 is provided to be wound between a driving pulley 15a and a driven pulley 15b located before and after the fixed press member 12S.
The transport surface 13a runs over the fixed press member 12S. The tension roller 16 is engaged at a position on the winding side of the conveyor belt 13 around the driven pulley 15b, the position of which is changed from the conveyor surface 13a.
Further, the transport belt 13 is drawn around via guide rollers 17, 17 via a tension roller 16, so that a surface 13b opposite to the transport surface 13a also extends to the upper side of the fixed press member 12S. The surface of the conveyor belt 13 on the side opposite to the conveyor surface 13a is almost in contact with the fixed press member 12S, and the conveying surface 13a of the conveyor belt 13 is always at a predetermined conveying height by the action of the tension roller 16 at all times. Position and held in tension. The tension roller 16 has a cylinder,
A driving means 18 composed of a solenoid or the like is connected and provided. Accordingly, by actuating the driving means 18, tension is applied to the transport belt 13 to allow the bonded substrate 4 to be transported, and the tension of the transport belt 13 is lost, and the transport surface 13 a and the opposite side of the transport surface 13 a are removed. The surface 13b can be changed to a state where the surface 13b overlaps the upper surface of the fixed press member 12S.

In order to supply the bonding substrate 4 to the pressure bonding stage 10 and to take out the pressed bonding substrate 4 after pressing,
The substrate transfer means 20 shown in FIG. 4 is provided. The substrate transfer means 20 has a slide base 22 that engages with a guide rail 21. The slide base 22 has a substantially L-shape, and the slide base 22 has a Z-axis guide 22a. The Z-axis guide 22a is provided with an elevating block 24 that moves up and down by a cylinder 23. The elevating block 24 has a support table 26 equipped with a pair of transport conveyors 25U and 25L at the top and bottom. Installed. Therefore, the substrate transfer means 20
Are reciprocated along the guide rail 21 between the pre-process, the pressure bonding stage 10 and the post-process. Therefore, the substrate transfer means 20 is positioned at the connection portion with the previous step, receives the bonding substrate 4 to be subjected to crimping, moves to the crimping stage 10 along the guide rail 21, and carries in the bonding substrate 4. The sheet is sent from the unloading section 11 to the press section 12. Further, the bonding substrate 4 after the pressure bonding is performed.
Is taken into the substrate transfer means 20 and sent out to a subsequent process. A pair of upper and lower transport conveyors 25 are provided on the substrate transfer means 20.
The reason why the U and 25L are provided is that, in the crimping stage 10, the bonding substrate 4 to be crimped with the bonded substrate 4 which has been crimped.
This is in order to make it possible to transfer the data interchangeably.

Next, in the pressing stage 10, fixed and movable press members 12S,
FIG. 5 shows an example of a specific configuration of the 12R. Here, the fixed press member 12S and the movable press member 12R are configured such that the former is fixedly held and the latter is driven up and down by the lifting drive means 14, but the configuration of the press member is substantially Are the same.

The fixed press member 12S is connected to the base 3
The pressure plate 32S is mounted on the base 30S with a heat insulating material layer 31S interposed therebetween. A flexible sheet 33S is attached to the surface of the pressure plate 32S, and a liquid chamber 34S is formed between the pressure plate 32S and the flexible sheet 33S. Therefore, the liquid chamber 34S defined by the flexible sheet 33S and the pressure plate 32S functions as a scalable expansion / contraction chamber. Further, the pressurizing plate 32S is provided with a liquid guide passage 35S and a drainage passage 36S, and the liquid guide passage 35S and the drainage passage 36S are provided in the liquid chamber 34S at substantially diagonal positions of the pressurizing plate 32S. It is open. On the other hand, the movable press member 12R side also
R, heat insulating material layer 31R, pressing plate 32R, flexible sheet 33
An R and a liquid chamber 34R are provided, and a liquid guide passage 35R and a drain passage 36R are formed in the pressure plate 32R.

Reference numeral 37 denotes a tank for storing a working oil as a working liquid, from which the working oil heated to a predetermined temperature is supplied to the liquid chambers 34S, 34R of the press members 12S, 12R. Is done. Here, the liquid chamber 3
The working oil supplied to the 4S, 34R is always maintained at a constant temperature state, that is, a set temperature. Therefore, a heater 38 as a heating means and a stirring means 39 are provided in the tank 37.
And a temperature sensor 40 is attached. Therefore, by operating the heater 38 based on the temperature of the hydraulic oil detected by the temperature sensor 40, the hydraulic oil in the tank 37 is strictly controlled so as to reach the set temperature, and the inside of the tank 37 is stirred by the stirring means 39. By stirring, the temperature is made uniform throughout the tank 37. Here, the set temperature of the hydraulic oil depends on the curing temperature of the sealing material 3 provided between the upper and lower substrates 1 and 2, and is strictly controlled so as to be higher than the curing temperature. For example, if the curing temperature of the sealing material 3 is 140 ° C., the temperature of the hydraulic oil is set to 150 ° C., which is higher than that. It is desirable to provide a temperature sensor in each of the liquid chambers 34S and 34R to detect whether the operating oil temperature inside the liquid chambers is at a set temperature.

A supply pipe 41 and a return pipe 42 are connected to the tank 37. These supply pipes 41 and return pipes 42 are branched pipes 41S, 41R and 42 on the way.
S, 42R, and branch into the liquid guide passages 35S, 35R, respectively.
R and the drain passages 36S, 36R. Therefore, a path for circulating hydraulic oil is formed between the tank 37 and the liquid chambers 34S and 34R. The supply pipe 41 is provided with a pump 43 for pumping hydraulic oil. By driving the pump 43, the hydraulic oil sucked from the tank 37 is supplied to the supply pipe 41.
And the liquid chamber 34S via the branch pipes 41S and 41R.
A circulation flow path is formed in which the hydraulic oil is supplied to the liquid chamber 34R, and from the liquid chambers 34S and 34R to the tank 37 via the branch pipes 42S and 42R via the return pipe 42 to the tank 37. Here, the drainage passages 36S, 3 provided in the pressure plates 32S, 32R.
The cross-sectional area of the passage 6R is smaller than the cross-sectional areas of the liquid guide passages 35S and 35R. Therefore, the drain passages 36S,
The 36R functions as a throttle passage, and the pump 4
3 is increased, the drainage passages 36S, 3
The throttle effect is exerted on the 6R side, and a back pressure is generated in the liquid chambers 34S and 34R. Therefore, the liquid chambers 34S, 3R are formed by the pump 43 and the liquid guide passages 35S, 35R as throttle passages.
Pressure guiding means for guiding pressure into 4R is configured.

The present embodiment is configured as described above. Therefore, a method for performing pressure bonding of the bonding substrate 4 with such an apparatus configuration will be described. In the previous step, the lower substrate 1 and the upper substrate 2 are overlapped with the sealing material 3 interposed therebetween, and the bonding substrate 4 thus formed is formed.
Is a state in which the sealing material 3 is uncured, that is, there is a possibility that the upper and lower substrates 1 and 2 may be displaced when an external force is applied. In the case where the temporary fixing is performed by the ultraviolet-curing resin 5, although it has a certain fixing strength, if a large external force is applied, there is a possibility that the upper and lower substrates 1 and 2 may be displaced. Therefore, when the process shifts from the previous process to the pressure bonding process, the upper and lower substrates 1 and 2 are maintained in a state where no external force acts in a direction in which they are shifted from each other.

The bonding substrate 4 is supplied to the crimping stage 10 from the previous process by the substrate transfer means 20, and the loading / unloading section 11 and the pressing section 12 constituting the crimping stage 10 are provided.
It is carried in. When the bonding of the bonding substrate 4 is continuously performed, a new bonding substrate 4 is moved to the bonding stage 1.
Prior to carrying the substrate 4 into the container 0, the bonded substrate 4 that has already been pressed must be taken out. Since the substrate transfer means 20 is provided with a pair of transport conveyors 25U and 25L on the upper and lower sides, a single bonded substrate 4 is received by one of the upper and lower transport conveyors, for example, the transport conveyor 25U from the previous process. The bonding substrate 4 is held at a predetermined position.
Note that the bonded substrate 4 after the pressure bonding may be discharged from the opposite side.

When the substrate transfer means 20 is transported to a position facing the loading / unloading section 11 of the pressure bonding stage 10, first, the transport conveyor 2 on which the bonding substrate 4 is not placed is placed.
5L is arranged at the same height position as the conveyor belt 13 of the pressure bonding stage 10. Then, the transfer belt 13 and the transfer conveyor 2 are brought into a state where tension is applied.
By driving the 5L, the bonded substrate 4 after the processing is transferred from the loading / unloading section 11 to the transport conveyor 25L of the substrate transferring means 20. After that, the support table 26
Is lowered, and the conveyor 25U on which the bonding substrate 4 to be subjected to pressure bonding is placed is arranged at the same height position as the conveyor belt 13. Then, the conveyor 25U and the conveyor belt 1
By driving the bonding substrate 4, the bonding substrate 4 is
Is carried into the press section 12 from the carry-in / carry-out stage 11.

By the way, the pump 43 is always operated, and the operating oil heated by the heater 38 is supplied to the liquid chamber 34.
S, 34R and the tank 37 are circulated. As a result, the interiors of the liquid chambers 34S and 34R and the flexible sheets 33S and 33R are substantially maintained at the set temperature. However, the discharge flow rate of the pump 43 at this time is to circulate the hydraulic oil and to maintain the temperature in the liquid chambers 34S and 34R at the set temperature, so that the discharge flow rate is set to the drain paths 36S and 36R. Back pressure in the throttle passage
Alternatively, even if a back pressure is generated, only a small pressure is generated in the liquid chambers 34S and 34R.

When the bonding substrate 4 is carried in from the substrate transfer means 20 to a predetermined position of the press section 12, the driving means 18
By displacing the tension roller 16, the conveyor belt 13 is loosened. As a result, the transport belt 13 is placed on the flexible sheet 33S constituting the pressing surface of the fixed press member 12S. Here, it is desirable, but not essential, to apply a sufficient pressure to the liquid chamber 34S to support the weight of the transport belt 13 and the bonding substrate 4. Thereby, when the transport belt 13 is placed on the flexible sheet 33S, the flexible sheet 33S
Is stably held, and there is no possibility that the bonding substrate 4 is displaced.

In this state, the lifting drive means 14 is operated to lower the movable press member 12R. The movable press member 12R is lowered to a position where the flexible sheet 33R comes into contact with the surface of the upper substrate 2 of the bonding substrate 4.
As a result, as shown in FIG. 6, the bonding substrate 4 is held between the upper and lower press members 12S and 12R. Therefore, the discharge pressure of the pump 43 is increased. As a result, the internal pressure of the liquid chambers 34S, 34R increases, and the flexible sheets 33S, 33R tend to expand. As a result, as shown by arrows in FIG. 6, a substantially uniform pressing force acts on the upper and lower substrates 1 and 2 as a whole, and the sealing material 3 between the two substrates 1 and 2 is compressed,
In the meantime, an appropriate cell gap is formed. Moreover, since the inside of the liquid chambers 34S and 34R is maintained at the set temperature,
This heat acts on the bonding substrate 4 via the flexible sheets 33S and 33R, and as a result, the sealing material 3 is heated and hardened.

Since the bonding of the bonding substrate 4 is performed by the action of hydraulic pressure, even if the bonding substrate 4 has a large area, a uniform pressing force is applied over the entire surface. Become. As a result, the cell gap G formed between the two substrates 1 and 2 becomes uniform over the entire circumference. In addition, since hydraulic oil whose temperature is strictly controlled is introduced into the liquid chambers 34S and 34R, temperature variations and the like are eliminated over the entirety, and a uniform temperature state can be achieved over the entire circumference of the sealing material 3. it can. as a result,
The pressure bonding on the bonding substrate 4 can be performed with extremely high precision.

Further, the pressing force at the time of press-fitting the bonding substrate 4 is based on the liquid pressure, and the flexible sheets 33S, 33
Since the pressing force is not applied by elastically deforming R, the pressing force does not change even if the pressing is repeated. Therefore, the stability and durability of each part constituting the fixed press member 12S and the movable press member 12R are remarkably improved, and there is no need to replace parts. As a result, the maintainability of the device is improved.

Here, the flexible sheets 33S, 33R defining the liquid chambers 34S, 34R need to have flexibility, but do not need to have elasticity.
The flexible sheets 33S and 33R are connected to the bonding substrate 4
It is necessary to form with a softer member. Flexible sheet 3
When the 3S and 33R are formed of a stretchable member, for example, a rubber material, the movable press member 12
At the time of lowering of the R, the flexible sheet 33R does not necessarily
It is not necessary to make contact with the upper substrate 2, and it is sufficient that the upper substrate 2 is slightly brought into contact with the upper substrate 2. Alternatively, the upper substrate 2 may be stopped with a slight gap. In this state, the liquid chambers 34S, 3
When pressure is introduced into the inside of the bonding substrate 4R, the flexible sheets 33S and 33R tend to elastically deform in the swelling direction.
Can be acted upon. However, if one of the flexible sheets 33S and 33R is formed of a member having elasticity, the other side may not have elasticity. When both of the flexible sheets 33S and 33R are made of a non-stretchable and flexible resin material or the like, a load is applied to the extent that a pressing force is applied when the movable press member 12R descends. You can do it. However, it is desirable that this load be small. Therefore, the liquid chamber 34
When pressure is generated in S and 34R to press-bond the bonding substrate 4, the flexible sheets 33S and 33R bend, so that a pressing force can be applied to the bonding substrate 4.

Incidentally, when the bonding substrate 4 is compressed,
The temperature and pressure of the liquid chambers 34S, 34R must be set very accurately. Therefore, as shown in FIG. 7, a temperature sensor 50 is provided in the liquid chambers 34S and 34R, and the temperature of the hydraulic oil in the liquid chambers 34S and 34R is detected by the temperature sensor 50, and the inside of the tank 37 is detected. Control of the heater 38 for heating can be performed. Thereby, the temperature in the liquid chambers 34S and 34R can be always kept constant. Further, a relief valve 51 is provided downstream of the pump 43, and when the pressure of the pump 43 exceeds a set pressure,
The working oil is returned to the tank 37 via the relief valve 51. Further, the drain passages 136S, 136
R and discharge pipe 14 including branch pipes 142S and 142R
2 is connected to the liquid introduction passages 35S, 35R and the branch pipes 41S, 41.
The same passage cross-sectional area as that of the supply-side pipe 41 including R is provided so as to be substantially the same, and in the middle of the return-side pipe 42, a throttle portion C is provided in the flow channel at the switching position a, and a throttle portion of the flow channel is provided at the switching position b. The configuration is such that a switching valve 52 is provided.

With the above configuration, when the bonding substrate 4 is not pressed, the switching valve 52 is set to the switching position b, and the pump 43 is operated, so that a large amount of hydraulic oil is supplied to the liquid chamber 34S. , 34R and the tank 37, the temperature in the liquid chambers 34S, 34R can be kept constant. In addition, since the temperature of the hydraulic oil in the liquid chambers 34S and 34R is constantly detected by the temperature sensor 50, when the temperature decreases, the temperature in the tank 37 by the heater 38 increases, and when the hydraulic oil temperature increases. , The temperature in the tank 37 by the heater 38 is controlled to be lowered. Thereby, the temperature management in the liquid chambers 34S and 34R can be extremely increased.

When the bonding of the bonding substrate 4 is started, the switching valve 52 is switched to the switching position a.
As a result, a back pressure is generated on the upstream side of the throttle section S, and the pressure in the liquid chambers 34S and 34R increases. However,
Since the relief valve 51 is provided on the downstream side of the pump 43, when the pressure in the liquid chambers 34S, 34R exceeds the set pressure of the relief valve 51, the relief valve 51 is opened, and the excess hydraulic oil is stored in the tank. It will be refluxed to 37. Therefore, the inside of the liquid chambers 34S and 34R can be maintained at a pressure state substantially matching the cracking pressure of the relief valve 51.

It should be noted that the discharge piping 1 is also
The hydraulic oil is recirculated into the tank 37 through 42. This is to prevent the temperature of the hydraulic oil from lowering even during pressure bonding. If the drop does not occur, the switching valve 52
In the switching position a, the flow path may be cut off without providing a throttle.

Further, the flow of the hydraulic oil is controlled by the liquid chambers 34S, 34.
The liquid chambers 34S, 34
It is necessary to prevent stagnation of hydraulic oil from occurring in R. For this purpose, for example, as shown in FIG. 8, partition walls 60 are provided on the surfaces of the pressurizing plates 132S and 132R, and as shown by arrows in FIG. It can be flowing.

Next, FIG. 9 shows a third embodiment of the present invention. In this embodiment, the pressure condition and the temperature condition can be changed while the bonding substrate is pressed.

In the figure, 201 is a low-temperature supply tank,
Reference numeral 202 denotes a high-temperature supply tank.
02 is mixed by a mixing ratio setting valve 203.
It is possible to mix at a ratio of 0: high temperature 0 to low temperature 0: high temperature 100. 205 is a hydraulic pressurizing press member 12S
The pump 205 is used to supply the liquid to the liquid chambers 34S and 34R of the movable press member 12R.
6 is driven. The liquid chambers 34S, 34R
Is provided with a variable throttle 207 for generating a back pressure. A pressure gauge 208 is provided upstream of the variable throttle 207, and the pressure of the motor 2 is determined by the pressure detected by the pressure gauge 208.
06 drive control is performed. This allows the pump 20
No. 5 can continuously change the discharge pressure from a substantially no-load state to a maximum pressure state. In addition, 2
09 is a relief valve for setting the maximum pressure in the circuit.

Here, the low temperature supply tank 201 is
Sealing material 3 provided between R and 34S between substrates 1 and 2
If the temperature can be reduced to a temperature below the curing temperature of, for example, the curing temperature of the sealing material 3 is about 140 ° C., the temperature is maintained at about 100 ° C. In the high-temperature supply tank 202, the maximum temperature at which the sealing material 3 acts at the time of pressing, for example, 15
It is adjusted to 0 ° C.

Reference numeral 210 denotes a distribution valve, and reference numerals 211 and 212 denote replenishment tanks. In the replenishment tanks 211 and 212, preheating is performed so that the temperature conditions of the hydraulic oil in the low-temperature supply tank 201 and the high-temperature supply tank 202 are the same. deep.
Then, the low-temperature supply tank 201 and the high-temperature supply tank 202
When the liquid volume of the pump decreases, it is detected and the pumps 213, 2
By operating the fuel tank 14, the tanks 201 and 202 can be replenished with hydraulic oil whose temperature is controlled.

With the above configuration, the opening area of the variable throttle 207 is first maximized, and the working oil having a low temperature of 100% is supplied by the mixing ratio setting valve 203. The insides of the liquid chambers 34S and 34R of the 12R are cooled down to the press temperature or lower. In this state, the bonding substrate 4 is fixed to the fixed pressing member 12S.
The movable press member 12R is set down, and the flexible sheet 33 constituting both press members 12S and 12R is lowered.
S, sandwich between 33R. In this state, the mixture ratio setting valve 203 increases the ratio of the high-temperature hydraulic oil. As a result, the temperature in the liquid chambers 34S and 34R is increased. After the temperature has risen to some extent, the variable throttle 207 is continuously throttled and the torque of the motor 206 is increased to increase the discharge pressure of the pump 205. As a result, the pressure applied to the bonding substrate 4 increases continuously, and the heating temperature also increases continuously.
Then, the high-temperature hydraulic oil is supplied from the mixing ratio setting valve 203 to 10
By keeping the pressure at 0% and maintaining the discharge pressure of the pump 205 at the maximum pressure for a predetermined time, the pressure bonding of the bonding substrate 4 is completed.

When the bonding substrate 4 is press-bonded in this way, the movable press member 12R is raised, and the bonding substrate 4 is discharged from the press section 12. Thereafter, the variable throttle 207 is fully opened, and the mixing ratio setting valve 203 is opened.
In a state where 100% of the low-temperature hydraulic oil is supplied. As a result, a large amount of low-temperature hydraulic oil flows into the liquid chambers 34S and 34R, and the temperature drops to a temperature equal to or lower than the curing temperature of the sealing material 3, so that the next bonding substrate 4 is prepared for pressure bonding.
Therefore, by appropriately setting the operating conditions of the mixing ratio setting valve 203, the temperature rising characteristics in the liquid chambers 34S and 34R can be set arbitrarily, and the pressure increasing characteristics can be set arbitrarily by operating the variable throttle 207 and the pump 205. it can. And one
Necessary crimping can be performed in steps, that is, without transferring the bonding substrate 4.

[0037]

As described above, according to the present invention, when bonding a bonding substrate, the bonding substrate is pressed from above and below in such a manner that a uniform pressing force is applied in a state where there is no variation in temperature throughout. Accordingly, there is an effect that the cell gap of the bonded substrate can be formed with extremely high precision.

[Brief description of the drawings]

FIG. 1 is an external view showing a stage before bonding a lower substrate and an upper substrate.

FIG. 2 is a cross-sectional view of a bonded substrate obtained by bonding a lower substrate and an upper substrate.

FIG. 3 is a schematic configuration diagram of a pressure bonding stage.

FIG. 4 is a diagram illustrating a configuration of a substrate transfer unit.

FIG. 5 is a configuration explanatory view of fixed and movable press members constituting a press section.

FIG. 6 is an operation explanatory view showing a state in which the bonding substrate is pressed by upper and lower pressing members in the pressing unit.

FIG. 7 shows the second embodiment, and is an explanatory view of a configuration of a fixed and movable press member constituting a press section.

FIG. 8 is a plan view showing another configuration example of the pressing plate.

FIG. 9 is a schematic configuration diagram of a substrate pressing device according to a third embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Lower board | substrate 2 Upper board | substrate 3 Sealing material 4 Bonding board 10 Compression stage 11 Loading / unloading part 12 Press part 12S Fixed press member 12R Movable press member 13 Transport belt 14 Elevation drive means 20 Substrate transfer means 25U, 25L Transport conveyor 30S, 30R
Base 31S, 31R Heat insulating material layer 32S, 32R, 132S, 132R Pressing plate 33S, 33R Flexible sheet 34S, 34R
Liquid chamber 35S, 35R Liquid guide passage 36S, 36R, 136S, 136R Drain passage 37 Tank 38 Heater 39 Stirrer 40 Temperature sensor 41 Supply pipe 42, 142 Return pipe 43 Pump 50 Temperature sensor 51 Relief valve 52 Switching valve 60 Partition wall 201 Low temperature supply tank 202 High temperature supply tank 203 Mixing ratio setting valve 205 Pump 205 Motor 207 Variable throttle

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) G09F 9/00 338 G09F 9/00 338 9/30 320 9/30 320 (72) Inventor Hiroshi Umezu Shibuya-ku, Tokyo 3-16-3 F-term in Hitachi Electronics Engineering Co., Ltd. (Reference) 2H088 FA03 FA04 FA17 FA30 HA01 HA08 MA17 2H090 JB02 LA03 LA04 4E090 AA01 AA08 AB02 BA01 CA01 DA01 DA07 FA02 GA03 HA07 5C094 AA03 AA43 AA55 BA43 DA01 EB02 EC02 FA02 GB01 5G435 AA17 BB12 KK05 KK10

Claims (7)

[Claims] 1. A bonding substrate in which a sealing material is interposed between upper and lower substrates is pressed under heating by upper and lower pressing members so that a predetermined cell gap is formed between the two substrates. A flexible chamber which is provided in the pressurizing portions of upper and lower pressurizing members and is supplied with a working liquid therein to form a scalable liquid chamber; and supplies the pressurized working liquid into the liquid chamber. And a heating means for heating the working liquid supplied to the pressure guiding means. 2. The apparatus according to claim 1, wherein the flexible chamber is formed by a flexible sheet attached to a pressing portion of each of the press members. 3. A working liquid is stored in a tank in a predetermined amount. The heating means is provided in the tank, and the tank and the liquid chamber are connected by a fluid passage. 2. The apparatus according to claim 1, wherein the working liquid is circulated between the tank and the liquid chamber. 4. The pressure guiding means includes:
A pump is provided in a supply-side path for supplying the working liquid into the liquid chamber, and a throttle section of the flow path is provided in a return-side path for returning the working liquid from the liquid chamber to the tank. The substrate pressing device according to claim 3, wherein 5. The liquid chamber is provided with a partition wall for forming a passage through which the working liquid heated from the supply side to the discharge side of the working liquid flows. 5. The substrate crimping apparatus according to 4. 6. The apparatus according to claim 1, wherein the working liquid is a working oil. 7. The apparatus according to claim 1, wherein the temperature of the working liquid in the liquid chamber is increased continuously or stepwise and the pressure is increased continuously or stepwise.