JP2001198684A - Laser processing method, method of manufacturing ink jet recording head using the laser processing method, ink jet recording head manufactured by the manufacturing method - Google Patents

Abstract

(57) [Summary] [PROBLEMS] There is no generation of by-products, and the heat energy converted during laser processing is fundamentally prevented from being accumulated in a workpiece such as a resin, and is melted in the workpiece. A laser processing method capable of performing high-definition processing without causing thermal expansion, a method of manufacturing an ink jet recording head using the laser processing method, and an ink jet recording head manufactured by the manufacturing method. A plurality of processing shapes arranged at predetermined intervals are simultaneously sublimated by using a femtosecond laser, or two or more kinds of different materials are subjected to sublimation at substantially the same time in the same process. Sublimation processing is performed by condensing light having a light energy of not less than a predetermined energy density inside a transparent workpiece or irradiating a material (B) located inside the workpiece.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method. The present invention relates to a manufactured ink jet recording head.

[0002]

2. Description of the Related Art Conventionally, a laser processing method using an ultraviolet laser has been used as a laser processing method for finely processing a structure requiring a fine structure and precision. Examples of such fine processing include processing of an ink flow path and an ink discharge port of an inkjet head. JP-A-2-121842 or JP-A-2-21845
In Japanese Patent Application Laid-Open No. H11-157, it is described that high-precision processing can be performed by processing an ink flow path and an ink discharge port using an excimer laser, which is a typical ultraviolet laser.
In other words, this excimer laser excites a mixed gas of a rare gas and a halogen gas by discharge excitation to produce short pulses (15 to 35 ns).
These lasers can oscillate ultraviolet light, whose oscillation energy is several hundred mJ / pulse, and the pulse repetition frequency is 10 to 50.
0 Hz. When high-brightness short-pulse ultraviolet light such as excimer laser light is applied to the polymer resin surface, an Ablative Photodecomposition (APD) process occurs in which the irradiated area is instantaneously decomposed and scattered with plasma emission and impact sound. This process enables so-called laser ablation processing of the polymer resin.

[0003] As a laser processing, a YAG laser generally used before that has a defect that a hole is formed but an edge surface is roughened, and a CO2 laser which is an infrared ray has a defect that a crater is generated around the hole. . These laser processings are so-called laser thermal processings, and processing is performed by converting light energy into heat energy. In the laser ablation processing using an excimer laser, sublimation etching is performed by a photochemical reaction that breaks a covalent bond of carbon atoms, so that the processing shape is not easily broken and extremely high-precision processing can be performed. Here, the laser ablation processing method means a method of performing sublimation processing by laser without passing through a liquid state. In particular, in the field of ink jet technology, the laser ablation processing technology using these excimer lasers has made tremendous progress with the practical use, and it is new to memory that it has reached today.

As the laser processing technology using the excimer laser is put into practical use, the following has been found. That is, the oscillation pulse time of the irradiation laser is about several tens nanoseconds for the excimer laser, which is the above-described ultraviolet laser, and about 100 picoseconds to several nanoseconds for the harmonic oscillation ultraviolet light of the YAG laser. The irradiated laser light does not use all its light energy to break the covalent bonds of atoms. Then, due to light energy that is not used for breaking covalent bonds of atoms, the laser-processed portion of the workpiece is scattered before being completely decomposed, thereby generating by-products around the processed portion. In addition, a part of light energy that is not used for breaking covalent bonds of atoms is converted to heat energy. Since the energy density of excimer laser light is only 100 megawatts at the maximum in oscillation pulses, it is difficult to process metals, ceramics, minerals (such as silicon) with high thermal conductivity, and quartz and glass with low light absorption. Therefore, it can only be used for sublimation ablation processing of organic fat materials. Etc. are known.

[0005]

All of these are inevitable phenomena caused by the use of excimer lasers, and various re-use techniques have been proposed so that these phenomena do not affect the actual head. I have. For example, assembling the inkjet recording head with the above-mentioned by-products remaining causes clogging of the discharge port, so that a by-product removal step is newly provided. In addition, since a part of the light energy is converted into heat energy, the workpiece may thermally expand during processing or may partially melt, so a material having a high glass transition point is used. Or lowering the processing pitch. As described above, since none of the techniques can be fundamentally solved, it is a reality that various restrictions are brought about during laser processing.

On the other hand, in the above-mentioned ink jet recording head, in recent years, high definition of image quality has been demanded, and therefore, arrangement density of ejection ports and ink flow paths of 300 to 400 dpi has conventionally been sufficient. Stuff but recently 600dp
Array densities up to i and 1200dpi have been required. Accordingly, there is a need for a forming method for forming minute intervals or minute shapes, such as an arrangement interval of a discharge port or a recording liquid flow path of 50 μm or less and a processing diameter of 20 μm or less, with higher precision. However, the phenomenon seen in the above-mentioned excimer laser becomes more conspicuous as the processing interval and the processing diameter become finer, and thus, the production of the above-mentioned high-definition type head has begun to be limited.

Accordingly, the present inventors have recognized that all of the above phenomena are caused by laser ablation processing using an ultraviolet laser typified by an excimer laser, and have been given a completely new technology without being bound by the prior art. Intensive research from a standpoint has shown that these phenomena can be fundamentally solved, and the innovative laser ablation processing can respond to the microfabrication technology that will be further advanced in the future, and further improve versatility. It is a technique found.

SUMMARY OF THE INVENTION The present invention has been made in view of the above technical problem, and it is an object of the present invention to produce by-products such as grease without heat and by converting heat energy during laser processing. A laser processing method capable of fundamentally preventing and processing a workpiece with high definition without causing melting and thermal expansion of a workpiece, a method of manufacturing an inkjet recording head using the laser processing method, and a method of manufacturing the same. An object of the present invention is to provide a manufactured ink jet recording head. Further, the present invention provides a laser processing method capable of processing by a simple and simple processing step when forming a fine structure on a workpiece formed of a plurality of materials, and an inkjet using the laser processing method. It is an object of the present invention to provide a method of manufacturing a recording head and an ink jet recording head manufactured by the method. In addition, the present invention uses a laser processing method capable of simplifying the alignment process, increasing the accuracy of the internal structure such as positional accuracy, and reducing the manufacturing cost, and the like. It is an object of the present invention to provide a method of manufacturing an ink jet recording head and an ink jet recording head manufactured by the manufacturing method. Further, the present invention provides a laser processing method capable of improving the processing efficiency by configuring a workpiece so as to absorb the radiation energy of a laser, and a method of manufacturing an ink jet recording head using the laser processing method. It is an object of the present invention to provide an ink jet recording head manufactured by the manufacturing method.

[0009]

In order to achieve the above object, the present invention provides a laser processing method configured as described in the following (1) to (47), and manufacture of an ink jet recording head using the laser processing method. A method and an ink jet recording head manufactured by the manufacturing method. (1) In a laser processing method of performing laser ablation processing on a workpiece by irradiating the workpiece with laser light, the laser light is emitted from a laser oscillator that oscillates with a pulse emission time of 1 picosecond or less as the laser light. A laser processing method, wherein a plurality of processing shapes arranged at predetermined intervals are simultaneously formed using a plurality of pulses of laser light having a very large spatial and temporal energy density. (2) The laser processing method according to (1), wherein the workpiece is a resin, Si, or a Si compound material. (3) For a workpiece composed of two or more different materials, the spatial and temporal energy density radiated from a laser oscillator oscillating at a pulse emission time of 1 picosecond or less. A laser processing method comprising: condensing and irradiating a large number of pulses of laser light at a predetermined energy density; and sublimating the two or more different materials almost simultaneously in the same process. (4) The workpiece composed of two or more different materials is a workpiece configured in a joined state, and the workpiece is not warped in the same process. The laser processing method according to the above (3), wherein sublimation processing is performed almost simultaneously. (5) The above (3) or (3), wherein the two or more different materials are made of any combination of an organic resin material, a metal material, an inorganic compound material, a glass material, a mineral material and the like. The laser processing method according to 4). (6) In a laser processing method for performing laser ablation processing on a workpiece by irradiating the workpiece with laser light, the laser light is emitted from a laser oscillator that oscillates with a pulse emission time of 1 picosecond or less. Very large spatial and temporal energy density, using a plurality of pulses of laser light, focused at a predetermined energy density or more inside a transparent workpiece at the light wavelength of the laser light, the workpiece Laser processing method, wherein sublimation processing is performed. (7) In a laser processing method for performing laser ablation processing on a workpiece by irradiating the workpiece with laser light, the laser light is emitted from a laser oscillator that oscillates with a pulse emission time of 1 picosecond or less. By using a plurality of pulses of laser light having a very large spatial and temporal energy density and passing through the material (A) which is substantially transparent at the light wavelength of the laser light and has low light absorption, the material (A) A) a laser absorptivity at a light wavelength of the laser light higher than that of the laser light, and irradiating the material (B) located inside the workpiece to process the material (B). (8) In the sublimation processing of the workpiece, when sublimating the structure inside the workpiece, a discharge port for releasing a substance produced by sublimation vaporization in the processing to the outside is formed in advance. The laser processing method according to the above (6) or (7), wherein the structure is processed later. (9) When processing the structure, the structure is processed from a position in contact with the discharge port (8).
2. The laser processing method according to 1. above. (10) The process according to any one of (1) to (9), wherein the workpiece is mixed and colored with a dye that absorbs a wavelength range corresponding to the oscillation wavelength of the laser beam, and is processed. Laser processing method. (11) The laser processing method according to any one of (1) to (10), wherein the wavelength of the laser light is in a range of 350 to 1000 nm. (12) The pulse emission time of the laser light is 500 femtoseconds or less.
The laser processing method according to any one of the above. (13) The laser processing method according to any one of (1) to (12), wherein the laser oscillator is a laser oscillator having a light-propagating spatial compression device. (14) The laser processing method according to (13), wherein the light propagation spatial compression device is configured by a chirping pulse generation unit and a longitudinal mode synchronization unit using optical wavelength dispersion characteristics. . (15) an ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, an ink flow path communicating the discharge port with the liquid chamber, An energy generating element that is provided in a part of the ink flow path and generates energy for discharging ink;
An ink supply port for supplying ink from the outside to the liquid chamber, a member forming at least a part of an ink passage through which the ink passes through the ink jet recording head, a method of manufacturing an ink jet recording head for processing by laser light, A laser beam of a plurality of pulses, having a very large spatial and temporal energy density emitted from a laser oscillator oscillating with a pulse emission time of 1 picosecond or less as the laser light, is used as a part of the ink passage. A method for manufacturing an ink jet recording head, comprising forming a concave portion or a through hole. (16) A plurality of recesses or through-holes which are to be part of the ink passage are simultaneously formed at a predetermined interval by irradiating a laser beam through a mask having a plurality of opening patterns formed at a predetermined pitch. (1)
5) The method for manufacturing an ink jet recording head according to 5). (17) The method of manufacturing an ink jet recording head according to the above (15) or (16), wherein the member forming at least a part of the ink passage is a resin. (18) The method according to any one of the above (15) to (16), wherein the member forming at least a part of the ink passage is made of Si or a Si compound material. (19) The method according to any one of (16) to (18), wherein the recess is a groove serving as the ink flow path. (20) The method of manufacturing an ink jet recording head according to any one of (16) to (18), wherein the through hole serves as the discharge port. (21) an ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, an ink flow path communicating the discharge port with the liquid chamber, An energy generating element that is provided in a part of the ink flow path and generates energy for discharging ink;
An ink supply port for supplying ink from outside to the liquid chamber, a member constituting at least a part of an ink passage of the ink jet recording head, and the like are formed of two or more kinds of different materials, A method for manufacturing an ink jet recording head for processing a member formed of two or more different materials by a laser processing method, wherein the laser oscillator oscillates with a pulse emission time of 1 picosecond or less as the laser light. Sublimation processing of members made of two or more different materials almost simultaneously in the same process using a plurality of pulses of laser light having a very large spatial and temporal energy density radiated from A method for manufacturing an ink jet recording head, comprising: (22) The member formed of the two or more different materials is a member that forms at least a part of an ink passage of an ink jet recording head that is configured in a joined state, and the members are formed in the same process. The method for manufacturing an ink jet recording head according to the above (21), wherein sublimation processing is performed almost simultaneously without causing warpage. (23) The above (21) or (), wherein the two or more different materials are made of any combination of an organic resin material, a metal material, an inorganic compound material, a glass material, a mineral material and the like. 22. The method for manufacturing an inkjet recording head according to 22). (24) an ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, an ink flow path communicating the discharge port with the liquid chamber, An energy generating element that is provided in a part of the ink flow path and generates energy for discharging ink;
A member forming at least a part of an ink passage of an ink jet recording head including an ink supply port for supplying ink from outside to the liquid chamber is formed of a transparent ink flow path forming body, and is formed by a laser processing method. A method of manufacturing an ink jet recording head to be processed, comprising: a multi-pulse laser having a very large spatial and temporal energy density emitted from a laser oscillator which oscillates with a pulse emission time of 1 picosecond or less as the laser light. Using a light, condensing the light at a predetermined energy density or more inside a transparent ink flow path forming body at a light wavelength of the laser light, and subjecting the ink flow path and the like to sublimation processing. Method. (25) an ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, an ink flow path communicating the discharge port with the liquid chamber, An energy generating element that is provided in a part of the ink flow path and generates energy for discharging ink;
A member that constitutes at least a part of the ink passage of the ink jet recording head including an ink supply port for supplying ink to the liquid chamber from the outside is made of a material that is substantially transparent and has a low light absorption rate of laser light ( A) and the material (A)
A method for manufacturing an ink jet recording head, which is formed of a material (B) having a higher light absorptance of laser light than that of a workpiece and located inside a workpiece, and processing by a laser processing method,
The laser light emitted from a laser oscillator oscillating at a pulse emission time of 1 picosecond or less has a very large spatial and temporal energy density, and a plurality of pulses of laser light is used. The lower material (A) is passed through, and the light absorption of laser light is higher than that of the material (A);
A method for manufacturing an ink jet recording head, comprising irradiating a material (B) located inside a workpiece with sublimation processing on the material (B). (26) In the processing of the ink flow path and the like, the ink flow path and the like are processed after forming a discharge port for releasing a substance produced by sublimation vaporization in the processing to the outside in advance. The method for manufacturing an ink jet recording head according to the above (24) or (25). (27) The method for manufacturing an ink jet recording head according to the above (26), wherein upon processing the ink flow path and the like, the ink flow path and the like are processed from a position in contact with the discharge port. (28) The process according to any one of (15) to (27), wherein the workpiece is mixed and colored with a dye that absorbs a wavelength range corresponding to the oscillation wavelength of the laser light, and is processed. A method for manufacturing an ink jet recording head. (29) The wavelength of the laser light is in a range of 350 to 1000 nm, (15) to (28).
The method for manufacturing an ink jet recording head according to any one of the above. (30) The pulse emission time of the laser beam is 500 femtoseconds or less.
9) The method for manufacturing an ink jet recording head according to any one of 9). (31) The method for manufacturing an ink jet recording head according to any one of the above (15) to (30), wherein the laser oscillator is a laser oscillator having a spatial compression device for light propagation. (32) The inkjet recording head according to (31), wherein the light propagation spatial compression device is configured by a chirping pulse generation unit and a longitudinal mode synchronization unit using optical wavelength dispersion characteristics. Manufacturing method. (33) In the above (31), the spatial compression device for light propagation is configured by using a longitudinal mode locking method utilizing chirped pulse generation means and light wavelength dispersion characteristics of a diffraction phase grating. The manufacturing method of the ink jet recording head according to the above. (34) an ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, an ink flow path communicating the discharge port with the liquid chamber, An energy generating element that is provided in a part of the ink flow path and generates energy for discharging ink;
An ink supply port for supplying ink from outside to the liquid chamber; a member forming at least a part of an ink passage of the ink jet recording head; The laser light emitted from a laser oscillator that oscillates with a pulse emission time of 1 picosecond or less has a very large spatial and temporal energy density, and uses a plurality of pulses of laser light. An ink jet recording head having a concave portion or a through hole. (35) A plurality of concave portions or through holes which are part of the ink passage are simultaneously formed at predetermined intervals by irradiating a laser beam through a mask having a plurality of opening patterns formed at a predetermined pitch. Alternatively, the inkjet recording head according to the above (34), wherein the inkjet recording head is a through hole. (36) The ink jet recording head according to the above (34) or (35), wherein the member forming at least a part of the ink passage is made of a resin. (37) The inkjet recording head according to any one of (34) to (36), wherein the member forming at least a part of the ink passage is made of Si or a Si compound material. (38) The inkjet recording head according to any one of (35) to (37), wherein the recess is a groove serving as the ink flow path. (39) The ink jet recording head according to any one of (35) to (38), wherein the through hole serves as the discharge port. (40) an ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, an ink flow path communicating the discharge port with the liquid chamber, An energy generating element that is provided in a part of the ink flow path and generates energy for discharging ink;
An ink supply port for supplying ink from outside to the liquid chamber, a member constituting at least a part of an ink passage of the ink jet recording head, and the like are formed of two or more kinds of different materials, An ink jet recording head obtained by processing a member formed of two or more different materials by a laser processing method, wherein the laser beam oscillates with a pulse emission time of 1 picosecond or less as the laser light. The member formed by using a plurality of pulses of laser light having a very large radiated spatial and temporal energy density, and thereby sublimating two or more different materials almost simultaneously in the same process. An ink jet recording head comprising: (41) The member formed of two or more different materials is a member that forms at least a part of an ink passage of an ink jet recording head that is formed in a joined state, and the members are formed in the same process. The ink jet recording head according to the above (40), which is a member formed by sublimation processing almost simultaneously without causing warpage. (42) The material according to (40) or (), wherein the two or more different materials are made of an arbitrary combination of an organic resin material, a metal material, an inorganic compound material, a glass material, a mineral material, and the like. 41. The ink jet recording head according to 41). (43) an ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, an ink flow path communicating the discharge port with the liquid chamber, An energy generating element that is provided in a part of the ink flow path and generates energy for discharging ink;
A member forming at least a part of an ink passage of an ink jet recording head including an ink supply port for supplying ink from outside to the liquid chamber is formed of a transparent ink flow path forming body, and is formed by a laser processing method. An ink jet recording head for processing, wherein a plurality of pulses of laser light having a very large spatial and temporal energy density emitted from a laser oscillator oscillating at a pulse emission time of 1 picosecond or less as the laser light are used. An ink jet recording head comprising: the member formed by condensing light at a predetermined energy density or more within a transparent ink flow path forming body at a light wavelength of the laser light and performing sublimation processing. (44) an ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, an ink flow path communicating the discharge port with the liquid chamber, An energy generating element that is provided in a part of the ink flow path and generates energy for discharging ink;
A member that constitutes at least a part of the ink passage of the ink jet recording head including an ink supply port for supplying ink to the liquid chamber from the outside is made of a material that is substantially transparent and has a low light absorption rate of laser light ( A) and the material (A)
A method for manufacturing an ink jet recording head, which is formed of a material (B) having a higher light absorptance of laser light than that of a workpiece and located inside a workpiece, and processing by a laser processing method,
The laser light emitted from a laser oscillator oscillating at a pulse emission time of 1 picosecond or less has a very large spatial and temporal energy density, and a plurality of pulses of laser light is used. The lower material (A) is passed through, and the light absorption of laser light is higher than that of the material (A);
An ink jet recording head comprising the member formed by irradiating a material (B) located inside a workpiece with sublimation processing. (45) In the processing of the ink flow path and the like, the ink flow path and the like are processed after forming a discharge port for releasing a substance produced by sublimation vaporization in the processing to the outside in advance. The ink jet recording head according to the above (43) or (44). (46) The method for manufacturing an ink jet recording head according to the above (45), wherein the ink flow path and the like are processed from a position in contact with the discharge port when the ink flow path and the like are processed. (47) The inkjet according to any one of (34) to (46), further including the member processed by mixing and coloring a dye that absorbs a wavelength range corresponding to an oscillation wavelength of the laser light. Recording head.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In an embodiment of the present invention,
By applying the configuration of the present invention described above, processing that cannot be achieved by the above-described conventional ablation processing can be performed. Note that a plurality of pulses of laser light having a very large spatial and temporal energy density emitted from a laser oscillator which oscillates with a pulse emission time of 1 picosecond or less as laser light used in the configuration of the present invention described above. Is a so-called femto described in “Integration of next-generation optical technology” (published in 1992 by Optronics Co., Ltd., part 1 element technology; generation and compression of ultrashort optical pulses, pages 24 to 31). There are femtosecond lasers that are commercially available today and are generally commercially available, and have a pulse emission time of 150 femtoseconds or less and a light energy of 500 microjoules per pulse. According to this, the energy density of the emitted laser light reaches a level of about 3 GW in the oscillation pulse.

That is, when the discharge port of an ink jet recording head is processed by, for example, the conventional ablation processing method using an excimer laser or the like, the discharge port is formed because the oscillation pulse time width of the irradiated laser beam is long. The light energy absorbed by the resin plate used to perform the heat conversion is partially converted into heat energy, and is thermally diffused with a predetermined conductivity throughout the resin plate, whereby the resin plate expands, and this expansion expands as the etching process proceeds. Further enlargement, the nozzle direction is directed outward, and the edge is drooped, so that ink droplets cannot be discharged straight and parallel. On the other hand, according to the configuration using a laser that oscillates with a pulse emission time of 1 picosecond or less by the femtosecond laser,
The temporal energy density at the time of laser processing can be dramatically increased, and a workpiece such as a resin can be ablated with very little light energy.
In addition, by applying the above-described configuration, almost no by-products are generated during laser processing, so that a conventionally required by-product removal step can be omitted. Sex can be significantly improved. In addition, by applying the above-described configuration, light energy of laser light applied to a workpiece such as a resin is converted into thermal energy, and processing is completed before the energy is accumulated in the workpiece. The object causes thermal expansion during processing and deteriorates processing accuracy, or the problem of partial melting is solved, enabling high-precision processing.For example, if the ink path is processed by this, It is possible to form ink discharge ports arranged in parallel and at high density, and to manufacture an ink jet recording head that discharges ink droplets straight and parallel, so that the performance of the ink jet recording head can be remarkably improved. Here, the ink passage means an ink discharge port, an ink flow path, a liquid chamber, an ink supply port, or the like, which refers to an entire portion in contact with ink and through which ink passes.

Also, by applying the above configuration, a laser oscillator that oscillates with a pulse emission time of 1 picosecond or less can be applied to a workpiece made of two or more different materials. By irradiating a plurality of pulses of laser light having a large spatial and temporal energy density with a predetermined energy density and performing laser processing, the two or more kinds of different materials can be substantially processed in the same process. Sublimation processing can be performed at the same time. In addition, by applying the above-described configuration, even metals, ceramics, and minerals (such as silicon) having high thermal conductivity can be concentrated in energy and can be easily processed.
Further, since the light energy density of glass, quartz, or optical crystals having a low light absorption rate reaches a gigawatt range, it is 10 to 100 times larger than that of an excimer laser.
Since the energy density can be doubled or more, processing can be performed with these materials if the absorption is about 0.1 to 1%. Therefore, according to this, sublimation ablation processing can be performed on the above-mentioned various materials almost equally, so that two or more kinds of dissimilar materials are irradiated by one ultrashort pulse laser irradiation step, that is, by one step. The composite material can be processed almost simultaneously to form a structure. Moreover, even if the two or more different materials have a large difference in linear expansion coefficient,
According to the present invention, since heat is less likely to be transmitted during ablation processing than in the past, peeling between dissimilar materials due to stress due to thermal expansion can be suppressed. Also, as a feature of the laser oscillator here, the light wavelength of the laser that emits with a pulse oscillation time of 1 picosecond or less does not necessarily need to be ultraviolet light, and is a wavelength at which the workpiece absorbs light. Visible light and infrared light may be used, and since the temporal light energy density is extremely large, the material is sublimated in a short time, so that ablation without a liquid phase can be caused.

Further, by applying the above-described structure to the processing and manufacturing of an ink jet recording head, it has been generally used for a structure of an ink discharge port or an ink flow path, an ink liquid chamber or an ink supply port of an ink jet. In addition, not only resin materials such as polyimide and polysulfone, but also inorganic material, glass material, metal material, further semiconductor material, or even a recording head constituent member of any combination of these materials, by this laser processing method, In one step, these can be ablated almost simultaneously. Therefore, according to this, the structure of the ink discharge port, the ink flow path, the ink liquid chamber, or the ink supply port can be provided with a degree of freedom of compound selection. Further, for example, if a material having a small thermal expansion, such as a composite material of a metal material and a resin material or a glass material and a resin material, is used for the orifice plate or the ink flow path constituting member, the displacement due to the shearing force of the joining surface of each member is prevented. It is also possible to use a material that is less susceptible to such temperature changes (environmental changes) to form an inkjet recording head or printer so that it can be transported by sea mail that passes directly below the equator. In addition, it is possible to reduce distribution costs. In addition, if a composite material of a ceramic material and a glass material is used, an ink jet recording head having excellent durability and storability that does not corrode even with strongly alkaline ink can be manufactured.

In addition, the internal processing is performed by applying a processing method of sublimating the work by condensing the work to a predetermined energy density or more inside the transparent work at the light wavelength of the laser light. In this case, the process is performed after securing a discharge port for discharging the sublimated and vaporized workpiece material to the outside. In this case, the reason why such a discharge port is secured is to prevent a problem that the pressure of the sublimation gas inside the workpiece increases and the workpiece breaks or cracks. Therefore, by using this processing method, for example, a method of sublimation forming an ink flow path or the like, after assembling an inkjet recording head, a sublimation process is generated from a region exceeding an ablation processing threshold of a workpiece. In addition, it is possible to form an ink flow path and the like inside the workpiece. Further, according to this, sublimation processing is performed only when light is collected at an energy density higher than the ablation processing threshold value of the workpiece in the transparent workpiece at the light wavelength of the laser beam or more. The energy density is very high, and in order to cause processing, it is actually necessary to consider the following. That is, first, the material to be processed is transparent to the laser light wavelength, so that the laser light can enter the inside of the material to be processed. ) Since the laser light necessary for processing does not occur, the light absorptance at the wavelength of the laser light needs to be about 0.1%. Next, second, 0.
Even if the light absorption rate is 1%, the energy density of the laser beam is required to reach the sublimation threshold energy density. For example, when a polysulfone resin is used as the material to be processed, an energy of about 15 MW / cm ² is used. Density absorption is the threshold for ablation processing, and sublimation processing is performed in a region above this energy density.To actually perform processing, polysulfone is colorless and transparent in the visible to near infrared region, and laser light is used. When the wavelength is 775 nm, the light absorption rate is about 0.1%, so that the irradiation energy density of the laser beam requires an energy density of 15 GW / cm ² .

In contrast to the femtosecond laser used here, for example, at a UV wavelength of 248 nm of a krypton fluorine excimer laser, which is a high-power laser, under the condition that a molecular bond breaking reaction by a photochemical reaction does not occur, In the case of performing internal processing of a laser beam, assuming that the workpiece is a material that transmits ultraviolet light and absorbs ultraviolet light at a rate of 0.1% and has an ablation threshold of 15 MW / cm ² , the required laser irradiation energy Density is 1
5 GW / cm ² , whereas the typical oscillation energy density of a general purpose krypton fluorine excimer laser is:
Since the pulse emission time is about 20 nanoseconds and the energy per pulse is 400 millijoules, only about 20 megawatts of power can be obtained and the total energy is 0.35
If not concentrate in the region of mm square (0.12mm ^2), 1
Energy densities of 5 GW / cm ² cannot be reached. Further, in consideration of the absorption and scattering of the laser radiation light in the optical system, in reality, it can only cope with processing of a smaller area.

On the other hand, among the femtosecond lasers described above, for example, those which are commercially available in recent years and which oscillate with an extremely short pulse actually exist. Some have an emission time of less than 150 femtoseconds and a light energy of 800 microjoules per pulse. According to this, the energy density of the emitted laser light reaches a level of about 5.3 GW in the oscillation pulse. That is, it is necessary to obtain an energy density of 15 GW / cm ² for internal processing of the polysulfone.
Simultaneous processing is possible in the area of mm square (36 mm ² ).

Further, by applying the above-described structure, for example, as shown in the figure, the material (A) which is substantially transparent at the light wavelength of the laser beam and has a low light absorption coefficient is passed through, and the material (A) is passed through. ) Has a higher light absorptance at the wavelength of the laser light than that of the laser light, and by irradiating the material (B) located inside the workpiece, it is possible to process and form a structure on the material (B). Become. However, also in this processing method, when performing internal processing, it is performed after securing a discharge port for discharging the sublimated and vaporized workpiece material to the outside. Further, in this processing method, the workpiece is subjected to sublimation processing at a portion having an energy density equal to or higher than the ablation processing threshold value, but does not exceed the ablation processing threshold value in the material (A) through which laser light passes. Since processing must be performed on the internal material (B) at a setting exceeding the ablation processing threshold value, in actuality, the following should be considered in the selection of the material (A) and the material (B) and the irradiation of the laser beam. Is required.

Here, when the material (A) and the material (B) are made of a resin material, for example, when a polysulfone resin is used, the absorption at an energy density of about 15 MW / cm ² is the ablation processing threshold value. If the wavelength of the laser light used is 775 nm, the light absorption of the polysulfone resin is about 0.1%, that is, the material (A) is irradiated with a laser irradiation energy density of 15 GW or less.
(Polysulfone resin) transmits laser light without being processed. Therefore, when a blue polysulfone obtained by dispersing and mixing a blue pigment in the same polysulfone resin as the material (B) so as to absorb black light at a laser beam wavelength of 775 nm is used, the light absorption at a light wavelength of 775 nm is reduced to about 70%. The ablation threshold of the blue polysulfone resin is 15 megawatts / cm ² ÷ 0.7 = 21 megawatts / cm ² .
When the laser beam is irradiated at an energy density of 021 gigawatts / cm ² or more, the material (B) is processed. Therefore, by irradiating a laser beam at an energy density of 0.1 to 1 GW / cm ² , only the material (B) disposed inside the material (A) is processed. Further, by processing the workpiece by mixing and coloring a dye that absorbs a wavelength range corresponding to the oscillation wavelength of the laser light, it is possible to improve processing efficiency.

[0019]

EXAMPLES Examples of the present invention will be described below, but the present invention is not limited to these examples. [Embodiment 1] FIG. 1 is a schematic view showing the progress of a process over time in (a) to (e) of a method for processing an ejection port of an ink jet recording head according to this embodiment. In FIG. 2A, reference numeral 2 denotes a resin plate serving as a base material for forming ink discharge ports. As shown in FIG. Through a mask having a plurality of opening patterns to be formed, the resin plate 2 is irradiated with a plurality of discharge port shapes. Here, in this embodiment, a femtosecond laser is used, the laser light to be irradiated is near infrared light having a wavelength of 775 nm, and the irradiation pulse time width is 150 pulses per pulse.
At femtoseconds, laser radiation energy was 15 μJ per pulse and irradiation energy density (fluence) was about 1 J / cm ² per pulse.

In the stage (c), the light-irradiated portion 20
3 is ablated and etched gradually.
At the stage (d), the etching is further advanced, and the state 202 is a state in which one thin skin is left just before the resin plate 2 penetrates. (E) shows a state in which the penetrating processing of the resin plate 2 in a predetermined pattern is completed, the irradiation of the laser beam is stopped, and the ink discharge ports 201 are formed. A point to be noted in this processing process is that the processing proceeds faithfully with light irradiation.

The details will be described in comparison with the description of the conventional example shown in FIG. FIGS. 2A to 2E are schematic views showing the progress of the process over time from (a) to (e) in the method of processing the discharge ports of the ink jet recording head according to the conventional example. 2A, reference numeral 2 denotes a resin plate serving as a base material for forming an ink discharge port. As shown in FIG. Irradiated. Here, the laser light to be irradiated is far ultraviolet light having a wavelength of 248 nm, the irradiation pulse time width is 15 nanoseconds per pulse, and the laser radiation light energy is 500 pulses per pulse.
At mJ, the irradiation energy density (fluence) was about 1 J / cm ² per pulse. At the stage (c), the light-irradiated portion 213 is ablated and gradually etched, but is absorbed by the resin plate 2 because the oscillation pulse time width of the irradiated laser light is as long as 15 nanoseconds. The light energy is partially converted to heat energy, and is thermally diffused with a predetermined conductivity throughout the resin plate, and the resin plate 2 expands in the direction of the arrow in the figure. Next, at the stage (d), the etching process further proceeds. During this time, the expansion of the resin plate 2 gradually progresses in the direction of the arrow in the figure.

At the stage (d), the etching is further advanced, and the state 212 is a state in which one thin skin is left just before the resin plate 2 penetrates. At this stage, the thermal expansion of the resin plate further progresses, and as can be seen from FIG.
In the processing state of No., the direction of the nozzle is more outward toward the outer nozzle from the center. Further, since the amount of heat stored in the resin plate increases with the progress of the etching process, the resin near the laser beam irradiation is melted, and the edge of the etching is dropped and the curvature is increased. In (e),
This is a state where the penetrating processing of the resin plate 2 in a predetermined pattern is completed, the irradiation of the laser beam is stopped, and the ink discharge ports 211 are formed.

As described above, when the conventional laser processing method is used, in the case of the ink ejection port as an example, the nozzle direction is directed outward, and the edge is dripped. With such an ink ejection port, ink droplets cannot be discharged straight and parallel. On the other hand, by performing the photo-etching process according to the method of the present invention, it is possible to suppress the generation of heat accumulation in the material to be processed. Can be manufactured in such a manner that the ink jet recording head emits straight and parallel light.

Further, when the laser-processed surface and the surface shape of the present embodiment were observed, it was found that a very smooth surface was formed as compared with the above-described processed surface of the conventional example, and almost no burrs were observed on the surface. This means that unnecessary ink turbulence in the ink passage portion of the ink jet recording head and the cause of disturbing the ejection direction are further reduced, which is preferable for performing high-quality ink ejection. is there.

The pulse oscillation time of the laser beam in the present embodiment will be described below. Investigation on the pulse oscillation time dependence of the laser ablation threshold fluence of gold. In the region where the pulse oscillation time is longer than 100 ps, the threshold is determined mainly by the thermal diffusion of the input pulse energy. Proportional. When the pulse oscillation time becomes less than 100 ps, it gradually begins to deviate from the behavior of t ^1/2 . Then, when the pulse oscillation time reaches 1 ps, the threshold value becomes substantially constant. This is because the thermal diffusion length (Dt) ^1/2 is approximately equal to or less than the laser absorption length (1 / α) of the workpiece. That is, in this time region, almost no thermal diffusion is recognized by the end of the pulse.
By setting the pulse oscillation time to 1 ps or less in this way, even in a metal having high thermal conductivity, the processed portion is not denatured by heat.
It can be seen from the following that good processing is possible even if the workpiece is a material other than metal. Further, by setting the pulse oscillation time of the laser light to 500 fs or less, much of the energy of the laser light can be applied to the workpiece, and the processed shape is more stabilized.

It is not necessary that the wavelength of the laser radiated at a pulse oscillation time of 1 picosecond or less used herein be ultraviolet light. Although it does not matter, the laser power can be easily secured by using a visible light to a near infrared light such as a laser light wavelength of 350 to 1000 nm.
In addition, a general-purpose material can be used for an optical system such as a lens, and the damage to the optical system is small, and the running cost can be significantly reduced as compared with a conventional ultraviolet laser. Further, according to this embodiment, the processing material is not limited to the resin material. For example, SUS
And the like, opaque ceramics, Si, and the like have been difficult to process by conventional irradiation with ultraviolet laser light, but such ceramic materials or metal materials can also be processed. And, even if the material has a high heat conduction efficiency, such as a metal material, the processing process ends before the thermal diffusion proceeds from the time of light irradiation. It is possible to perform precision processing.

Furthermore, even if it is a material having high light transmission efficiency (transmittance) such as quartz, optical crystal, or glass material, even if it has a slight light absorption due to high temporal concentration of energy. It is possible to perform ablation processing. That is, the processing material is not limited to resin materials such as polyimide and polysulfone, which have been generally used for the structure of the ink discharge port or ink flow path or ink liquid chamber or ink supply port of the ink jet recording head. Laser ablation can be performed on inorganic materials, glass materials, metal materials, and even semiconductor materials, so that the structure of the ink discharge port, ink flow path, ink liquid chamber, or ink supply port has a high degree of freedom in material selection. be able to. Therefore, conventionally, when an ink flow path, a liquid chamber, an ink supply port, and the like are formed on a Si substrate, they are often formed by anisotropic etching. It is possible to process a desired shape on the Si substrate without the restrictions described above.

Further, if a ceramic material or a glass material is used as the above-mentioned workpiece, an ink jet recording head having excellent durability and storability that does not corrode even with a strongly alkaline ink can be manufactured. If a high melting point material such as a ceramic material is used for the ejection port plate, high heat treatment or the like can be performed for water repellent treatment of the surface of the ink ejection port. Further, the use of a semiconductor material makes it possible to form a structure directly on an integrated circuit. In addition, since a material having a small linear expansion coefficient can be used, it is possible to prevent a displacement due to a shearing force of a joint surface of each member.

FIG. 3 is a schematic optical path diagram of a mask pattern projection optical system of the laser processing apparatus according to the present embodiment. A light beam 1 oscillated from a laser body (not shown) is guided to an optical integrator 10 such as a fly-eye, and the incident laser light beam is decomposed into a plurality of light beams.
Thus, the laser light is superposed on the mask 12 having a plurality of opening patterns formed at a predetermined pitch, the illumination intensity of the laser is corrected substantially uniformly, and the mask is illuminated. The field lens 11 projects a point image focused at a plurality of points by the fly-eye lens 10 onto the position of the aperture 13 of the mask pattern projection lens 14 to form a Koehler illumination system. In such an optical system, a laser beam is illuminated on the mask 12, and a mask pattern formed on the mask 12 is projected by a projection imaging lens 14 onto a surface of a workpiece, for example, the orifice plate 2. The orifice plate 2 is processed by the oscillation.

[Embodiment 2] FIGS. 4 and 5 are views showing the steps of processing a cantilever in Embodiment 2 of the present invention. Next, (a) to (d) of FIG. 4 and (e) of FIG.
(G), a method of manufacturing an electrostatic cantilever will be described. (A) First, an aluminum thin film 42 is formed on a silicon substrate 41 by vapor deposition or sputtering.
A resin film 43 (actually, a resist film) coated thereon by spin coating is prepared. Next, in the step (b), the resin film 43 is partially removed by patterning laser irradiation to form an electron contact surface A. Then, in the step (c), a metal film 44 (an elastic metal film such as aluminum or copper) is deposited. And so on.

Next, the metal film 44, the resin film 43, the aluminum film 42 and a part of the silicon substrate 41 are simultaneously removed by sublimation ablation by irradiating an extremely short pulse laser having a predetermined pattern as shown in FIG. The laser used at this time was near-infrared light having a wavelength of 775 nm, the irradiation pulse time width was 150 femtoseconds per pulse, the laser radiation light energy was 800 microjoules per pulse, and the irradiation energy density (fluence) was about 50 joules / cm ²
And the pulse energy density is about 300 tera watts / cm ²
I went in. Next, in the step (e), the resin layer 43 is melted and removed, and a cantilever structure is completed. After this, (f)
By drawing a wire from the silicon substrate and applying an electric field, charges are accumulated at the tip of the cantilever. When a predetermined electric field is applied to fill the charge, the cantilever portion 44 opens and lifts due to electrostatic repulsion as shown in FIG. That is, a microlever that can be opened and closed by the switching of the electric field is manufactured.

What should be noted in this processing process is that
In the case of manufacturing using a conventional lithography process in that different kinds of materials are processed in the same step in the step (d), a resist coat and a resist are applied to each of the different materials. Although a structure can be formed only by a series of processes of patterning exposure, resist development, etching using a resist pattern, and resist ashing, it can be processed by an extremely simple process.

[Embodiment 3] FIG. 6 is a view showing a method of forming an ink discharge port in an orifice plate of an ink jet recording head according to Embodiment 3 of the present invention. Next, a method of processing and forming the ink discharge ports 40 in the orifice plate 60 of the ink jet recording head will be described with reference to FIGS. (A)
Prepares an orifice plate material in which a thin copper layer 62 is inserted into a polysulfone sheet 61. Inserting the copper foil 62 with the polysulfone sheet 61 is based on the fact that the thermal expansion of the polysulfone sheet is performed by the top plate 70 made of silicon and the ink ejection pressure generating element 81 which constitute the ink flow path, ink liquid chamber, etc. of the ink jet main body. The thermal expansion of the silicon IC circuit board 80 as close as possible to prevent the ink jet recording head from heating up, and also prevent the bonding of the orifice plate 60 from heating during distribution. The copper foil has a heat radiation function for preventing deformation of the orifice plate 60 due to local temperature rise. And so on.

Next, as shown in (b), an ultra-short pulse laser having a predetermined pattern is irradiated by a mask projection optical system or the like to simultaneously subject the polysulfone layer 61 and the copper foil layer 62 to sublimation ablation so that the ink discharge ports 40 are formed. Form. The laser used at this time is the same as that of the second embodiment, and is a near-infrared ray having a wavelength of 775 nm, and the irradiation pulse time width is 150 pulses per pulse.
At femtoseconds, laser radiation energy was 800 microjoules per pulse, irradiation energy density (fluence) was about 10 joules / cm ² and pulse energy density was about 60 tera watts / cm ² . Next, the orifice plate 60 having the ink discharge ports 40 formed in the step (c) is placed in the ink jet main body 65 by the ink flow path 7.
The main part of the ink jet recording head is manufactured by aligning and bonding the position of the first position.

[Embodiment 4] FIGS. 7 and 8 are views showing a method of processing and forming an ink flow path and an ink liquid chamber on a top plate of an ink jet recording head according to Embodiment 4 of the present invention. Next, (a) to (c) of FIG. 7 and (d) to (d) of FIG.
According to (e), a method of processing and forming the ink flow path 71 and the ink liquid chamber 72 on the top plate 70 of the inkjet recording head will be described. (A) is a polysulfone plate 6
1 with glass filler mixed to reduce the thermal expansion coefficient,
This plate material is irradiated with an ultrashort pulse laser having a predetermined pattern by a mask projection optical system or the like as shown in FIG. 2B, and is subjected to sublimation ablation processing together with a glass filler, as shown in FIG. A chamber 72 is formed. The laser used at this time is the same as in the second and third embodiments,
At near-infrared light of 75 nm, irradiation pulse time width is 150 femtoseconds per pulse, laser radiation light energy is 800 microjoules per pulse, and irradiation energy density (fluence) is about 10 joules / cm 2.
At a pulse energy density of about 60 terawatts / cm ² . Next, in the step (d), the ink discharge pressure generating element 8
The silicon IC circuit board 80 in which 1 is formed is bonded and bonded by aligning the ink flow path 71 and the ink discharge pressure generating element 81. Next, in the step (e), the orifice plate 60 is bonded and bonded by aligning the ink discharge port 40 and the ink flow path 71, thereby manufacturing a key portion of the ink jet recording head.

Embodiment 5 FIG. 10 shows Embodiment 5 of the present invention.
FIG. 3 is a diagram showing a main part of ink ejection of the surface ejection type ink jet recording head in FIG. Next, the present embodiment will be described with reference to FIGS. (A) is a view of the main part of the ink discharge of the surface discharge type ink jet recording head viewed from the ink discharge surface, and (b) is a cross-sectional view taken along a line BB in FIG. In a state where a transparent resin plate 1020 in the range from visible light to near infrared ray is bonded and bonded onto a silicon IC circuit board 1010 on which 1011 is mounted, a near-infrared ultra-short pulse (1 picosecond or less) laser beam having a wavelength of 775 nm is applied to the resin. A predetermined position inside the plate 1020 is condensed and irradiated, and the ink liquid chamber 1024, the ink flow path 1023, the ink buffer chamber 1022, and the ink discharge port 1021 are processed and formed by the method described with reference to FIG. .

The details of the laser used at this time are
With a near-infrared light of 75 nm, the irradiation pulse time width is 150 femtoseconds per pulse, and the laser radiation light energy is about 10 μm in the area of φ10 μm by condensing laser light reduced to 5.0 nanojoules per pulse. Internal processing was performed by setting the energy density to 20 gigawatts / cm ² .

The resin plate 1020 is connected to the silicon IC circuit board 101 on which the ink discharge pressure generating element 1011 is mounted.
After bonding on top of the ink jet chamber 1024, the ink liquid chamber 1024, the ink flow path 1023, the ink buffer chamber 1022, and the ink discharge port 1021 are processed and formed. Since laser processing can be performed based on the pattern of the IC circuit board 1010, the ink liquid chamber 102 is provided on the resin plate 1020.
4, ink flow path 1023, ink buffer chamber 1022,
Further, as compared with the case where the ink discharge port 1021 is processed and formed and then the alignment bonding is performed with the silicon substrate 1010,
Since the joining alignment error can be eliminated, the ink liquid chamber 1024, the ink flow path 1023, the ink buffer chamber 1022, and the ink discharge port 1021 can be formed with high accuracy.

Embodiment 6 FIG. 11 shows Embodiment 6 of the present invention.
FIG. 3 is a view showing a main part of ink discharge of an end face discharge type ink jet recording head in which an ink flow path is formed by a laser processing method in FIG. Next, FIG.
(B) The production of the YMC color circulating nozzle type ink jet recording head of this embodiment will be described with reference to FIGS. (A) is a top view of an end face discharge type ink jet recording head, and (b), (c), and (d) are cross-sectional arrows at positions CC, DD, and EE in FIG. It is. As shown in these figures, a silicon IC circuit board 1130 on which an ink discharge pressure generating element 1131 is mounted.
A resin plate 1140 in which an ink nozzle buffer chamber 1141 and an ink discharge port 1142 are formed is joined and formed thereon, and an ink liquid chamber 1152 and an ink supply port 1153 are formed thereon from visible light formed by molding or the like. A resin plate 1150 that is transparent in the near-infrared region is joined, and inside the resin plate 1150, a near-infrared ultra-short pulse (1 picosecond or less) laser beam having a wavelength of 775 nm is focused and irradiated to a predetermined position inside the resin plate 1150. Then, the ink flow path 1151 is processed and formed by the method described with reference to FIG. As an assembling method, a resin plate 1
150, the ink flow path 115 is formed by the laser processing method.
After processing and forming 1, a method of aligning and joining the resin plate 1150 on the resin plate 1020 may be used.

The details of the laser used at this time are
With a near-infrared light of 75 nm, the irradiation pulse time width is 150 femtoseconds per pulse, and the laser radiation energy is about 10 μm in the area of φ10 μm by condensing the laser light reduced to 3.5 nanojoules per pulse. Internal processing was performed by setting the energy density to 15 GW / cm ² .

In this ink jet recording head,
Since the ink flow path 1151 can be turned three-dimensionally inside the resin plate 1150, in this embodiment, the three color inks of YMC (yellow, magenta, and cyan) are supplied to the ink supply ports 1153Y for each color. 1153M,
1153C, the ink liquid chamber 1152 for each color.
Y, 1152M, and 1152C, the ink flow paths 1151Y, 1151M, and 1151C corresponding to the respective colors are piped to the ink nozzle buffer 1141 so as to form an array that circulates in the YMC color order.
41Y, 1141M, and 1141C are configured so that ink can be ejected in a circulating arrangement.

By forming the ink flow path 1151 in the resin plate by three-dimensionally arranging them, the YMC three-color ink liquid chambers are connected to the YMC circulating one-dimensional array discharge nozzles for each color, and the three-color colors are adjacent. It is possible to form an ink jet recording head having an array of ejection cells, and in recording by this ink jet recording head, there is no need to perform registration of each color, so that color shift hue change does not occur and complicated color There is no need to perform the registration correction function or registration adjustment between each color,
A stable color reproduction image can be printed. Needless to say, not only YMC three colors but also YM
Similarly, for the four colors CK (yellow, magenta, cyan, and black), the YMCK
CK circulating one-dimensional array discharge nozzles are connected for each color, and 4
It is also possible to create an ink jet recording head having an array of ejection cells of adjacent color.

Embodiment 7 FIG. 13 shows Embodiment 7 of the present invention.
FIG. 3 is a diagram for describing an outline of a processing method in FIG. In FIG. 13, a mask 136 is illuminated with a laser beam 131 emitted from a laser oscillator (not shown) that emits a laser beam for an extremely short pulse emission time (1 picosecond or less), and a laser beam that has passed through a mask pattern 138 is projected. The image is projected through 137. The formed image is focused on the surface of the material (B) 133 located behind the material (A) 132. On the other hand, the workpiece is held by the base plate 134 with the material (A) 132 and the material (B) 133. In this setting, the laser beam 131 is applied to the mask pattern 138.
And passes through the material (A) 132 which is transparent at the light wavelength of the laser light and has a light absorption of about 0.1% while keeping its energy substantially, and the light absorption at the light wavelength of the laser light Is irradiated to the material (B) 133 set to 50% or more. The material (B) 133 which receives laser irradiation and absorbs light energy of 50% or more causes a sublimation phenomenon due to energy absorption exceeding an ablation processing threshold due to a predetermined energy density of the laser light, and causes a hole in a workpiece. 135 is formed.

FIG. 14 is a view showing a main part of ink ejection of the surface ejection type ink jet recording head in this embodiment. Next, the present embodiment will be described with reference to FIGS. (A) is a view of the main part of the ink discharge of the surface discharge type ink jet recording head viewed from the ink discharge surface side,
(B) is a cross-sectional view taken along the line BB in FIG. (A), and shows a near-infrared region, which is a wavelength region of a laser beam to be used, on a silicon IC circuit board 1410 on which an ink discharge pressure generating element 1411 is mounted. Blue polysulfone plate 14 in which a blue pigment having a light absorption of about 60% at 775 nm is dispersed and mixed.
And a colorless polysulfone plate 1420 having an optical absorptance of 0.5% or less in a near infrared region of 775 nm, which is a wavelength region of a laser beam used, on the blue polysulfone plate 1430. And a near-infrared ultra-short pulse (1 picosecond or less) laser beam having a wavelength of 775 nm is transmitted through the colorless polysulfone plate 1420 and irradiated on a predetermined position of the blue polysulfone plate 1430, so that the ink liquid chamber 1433,
The ink flow path 1432 and the ink buffer chamber 1431 are processed and formed by the method described with reference to FIG.

Laser energy transfer used at this time
Details are in the near infrared wavelength of 775 nm, irradiation pulse time
Width is 150 femtoseconds per pulse, laser emission
Light energy is 400 microjoules per pulse.
The laser light that has been dimmed to 20 mm × 17
Illuminate and illuminate an area of 0 mm about 50 MW / cm ^Two
Through the mask pattern at an energy density of
Approximately 4 mm x 3
Reduce to within 4mm and pass through mask and optics
Approximately 1 GW / cm from energy loss^TwoEnergy
The workpiece is irradiated with laser at a high density. I mentioned earlier
As shown, light of wavelength 775 nm of colorless polysulfone resin
The absorptivity is about 0.1%, the wavelength of blue polysulfone resin is 7
The light absorption of 75nm is about 60%, and polysulfone resin
Ablation threshold of about 15 meg in absorption value
Watt / cm^TwoColorless because of its energy density
Laser irradiation ablation processing threshold of polysulfone resin
The value is about 15 GW / cm^TwoThe blue polysulfone tree
Laser irradiation ablation processing threshold of fat is about 0.025
GW / cm^TwoIrradiates the workpiece
About 1 GW / cm^TwoLaser light with an energy density of
Blue color passing through colorless polysulfone plate 1420
Absorbed by polysulfone plate 1430
The resulfone plate 1430 is processed into a predetermined pattern.
It will be.

A blue polysulfone plate 1430 and a colorless polysulfone plate 1420 are connected to a silicon IC circuit board 141 on which an ink discharge pressure generating element 1411 is mounted.
After joining on top of the ink jet pressure generating element 1, the ink liquid chamber 1433, the ink flow path 1432, and the ink buffer chamber 1431 are processed and formed.
Since the laser processing can be performed based on the pattern of the silicon IC circuit board 1410 or 411, the ink liquid chamber 1433 and the ink
432, the alignment of the ink buffer chamber 1431 with the silicon substrate 1410 after processing and formation can eliminate the alignment error, so that the ink liquid chamber 1433 and the ink flow path 143 can be formed with high accuracy.
2. The ink buffer chamber 1431 can be formed.

The essential parts of the ink jet recording head of the above-described Embodiments 5 to 7 can be manufactured as an ink jet recording head through the following steps. In addition to connecting an electric substrate on which terminals for driving the ink ejection pressure generating element are patterned, an aluminum or alumina ceramic base plate is joined to a silicon IC substrate for heat dissipation, and then a holder for holding each member and an ink supply By combining the ink tanks, an ink jet recording head is assembled to form a unit having a function as an ink jet recording head.

Embodiment 8 FIG. 15 shows Embodiment 8 of the present invention.
FIG. 3 is a schematic optical path diagram of a mask pattern projection optical system of the laser processing apparatus in FIG. In this embodiment, a laser that oscillates with a pulse emission time of 1 picosecond or less is used as the laser oscillation device. Specifically, the laser light to be irradiated is near infrared light having a wavelength of 775 nm, Is 150 femtoseconds per pulse, laser emission light energy is 15 μJ per pulse, and an orifice plate made of 50 μm thick polysulfone is used for the ink jet recording head body. did.

In FIG. 15, a light beam 1501 oscillated from a laser body (not shown) is guided to an optical integrator 1510 such as a fly-eye, and the incident laser light beam is divided into a plurality of light beams.
Thus, the laser light is superposed on a mask 151 having a plurality of opening patterns formed at a predetermined pitch, the laser illumination intensity is corrected to be approximately uniform, and the mask is illuminated. Further, the field lens 1511 converts the point images focused to a plurality of points by the fly-eye lens 1510,
Aperture 151 of mask pattern projection lens 1513
Projection to the position No. 2 forms a Koehler illumination system.

In such an optical system, the laser beam is applied to the mask 1
The mask pattern illuminated on the mask 51 and formed on the mask 151 is focus-projected on the surface of the orifice plate 152 of the inkjet recording head 153, which is a workpiece, by the projection imaging lens 1513. Processed.

With the laser processing apparatus described above,
The ink discharge port, which is a workpiece, is processed, and details thereof will be described with reference to FIG. As shown in FIG. 16, the laser light to be irradiated is near infrared light having a wavelength of 775 nm,
The irradiation pulse oscillation time width uses a light source of 150 femtoseconds per pulse, mixes a blue dye into the polysulfone resin to be processed, and colors the polysulfone resin entirely blue inside. An orifice plate of the above-mentioned polysulfone having a thickness of 50 μm was used for the main body of the ink jet recording head, and an ink discharge nozzle was formed on the orifice plate by using the above-described optical system.

As a result, when a blue colored polysulfone resin is used for the precursor orifice plate, an ink discharge port is formed by laser irradiation of about 100 pulses, and when a colorless and transparent polysulfone resin as a primary color is used for the orifice plate. As compared with the case where the ink ejection port is formed by laser irradiation of about 2000 pulses, processing efficiency about 20 times was obtained. In this case, it is not only an advantage that the processing efficiency is simply improved, but the processing efficiency can be made equal at the same laser oscillation energy, and the processing area can be expanded over a wide range.

Next, an ink jet recording head manufactured by applying the processing method of the first embodiment will be described with reference to FIG. In FIG. 17, reference numeral 33 denotes a substrate on which an ink discharge pressure generating element 34 such as an electrothermal conversion element or an electromechanical conversion element for discharging ink is provided.
Is provided. The ink discharge pressure generating element 34 is arranged in an ink flow path 31 communicating with the discharge port 201, and each ink flow path 31 communicates with a common liquid chamber 32. An ink supply pipe (not shown) is connected to the ink supply port of the common liquid chamber 32, and ink is supplied from the ink tank via the ink supply pipe. Reference numeral 35 denotes a top plate having a concave portion for forming the ink flow path 31 and the common liquid chamber 32.
1. A common liquid chamber 32 is formed. Further, a discharge port 20 is provided at the ink flow path end side of the joined body of the substrate 33 and the top plate 35.
1 is provided with a discharge port plate 2 (hereinafter, referred to as an orifice plate).

Such an ink jet recording head is
It can be created as follows. That is, first,
Heater 34 which is a heating resistance element for generating ink ejection pressure
And an integrated circuit such as a shift register (not shown) and electric wiring are patterned on a silicon substrate to form a substrate 33, and an ink flow path 31 and an ink liquid chamber 32 are formed.
The concave portion and the ink supply port (not shown) are formed by chemical etching on a silicon plate to form a top plate 35.
Create Thereafter, the substrate 33 and the top plate 35 are aligned and joined so that the arrangement of the ink discharge side end face, the ink flow path 31 and the heater 34 match. After this alignment bonding, the orifice plate 2 is aligned and bonded to the ink discharge side end surface of the bonded body of the top plate 35 and the substrate 33 so that the nozzle (discharge port) 201 is at a predetermined position. . Thereafter, a heater driving terminal (not shown) is connected to the patterned electric board, and a base plate made of aluminum, ceramic, or the like is joined to the board 33. Next, an ink jet recording head is assembled by connecting a holder holding each member and an ink tank for supplying ink.

By manufacturing the ink jet recording head in this manner, it is possible to prevent a change in the ink ejection direction position due to the processing of the ejection port in a non-uniform direction. In the present embodiment, an orifice plate made of polysulfone having a thickness of 50 μm is used for the ink jet recording head main body, and the orifice plate includes:
Using the above optical system, the laser light to be irradiated has a wavelength of 77
In the near infrared of 5 nm, the irradiation pulse time width is 150 femtoseconds per pulse, and the laser radiation energy is:
The ink discharge port was formed at a rate of 15 μJ per pulse and an irradiation energy density (fluence) of about 1 J / cm ² per pulse. When 50 ink jet recording heads were created and the shapes of the ejection ports were observed, the edges of each of the ejection ports were clearly formed, and the ink ejection ports aligned in high density in parallel were formed. The variation in the opening diameter of the ink ejection side end of each ejection port has also been significantly reduced as compared with the related art. Also, when printing was actually performed with the ink jet recording head created in this way, uniformly arranged print dots were recorded,
The dot shape was also a beautiful circular shape, and an image of excellent print quality was obtained. In the above description, an example of the method of forming the ink ejection port is shown. However, the present invention is not limited to this, and may be applied to the case where the ink flow path, the ink liquid chamber, and the ink supply port are processed. Can achieve the above-mentioned effects. Furthermore, in the above description,
Although the ink jet recording head has been described, the present invention is not limited to this. For example, the present invention can be suitably applied to laser processing in micromachining of a semiconductor substrate or the like, and the present invention includes these.

[0056]

As described above, according to the present invention, it is possible to cope with high definition, there is no generation of by-products, and heat energy converted during laser processing is covered with resin or the like. It can be fundamentally prevented from being accumulated in the workpiece. Further, according to the present invention, the temporal energy density during laser processing can be dramatically increased, and a workpiece such as a resin can be ablated with very little light energy. Further, according to the present invention, almost no by-products are generated at the time of laser processing, so that a conventionally required by-product removal step can be omitted, and the productivity of the inkjet recording head can be significantly reduced. Can be improved. Further, according to the present invention, the light energy of the laser beam applied to the workpiece such as a resin is converted into thermal energy, and the processing is completed before the energy is accumulated in the workpiece. This solves the problem that the processing accuracy is degraded due to thermal expansion inside, or partial melting is caused. For this reason, high-precision processing becomes possible, and the performance of the inkjet recording head can be remarkably improved. Regarding the processing materials,
Not only resin materials, but also materials with high heat conduction efficiency, such as ceramic materials or metal materials, are processed through the liquid phase state because the processing process ends before thermal diffusion progresses from the point of light irradiation. It is possible to perform no ablation processing. Furthermore, even if the material has high light transmission efficiency (transmittance) such as quartz, optical crystal, or glass material, the ablation process can be performed even if the light absorptance is slight due to the high temporal concentration of energy. Can be awakened. That is, it is possible to increase the degree of freedom in selecting a material as a constituent member of the ink jet recording head.
Further, according to the present invention, since a material having a small coefficient of linear expansion can be used, it is possible to prevent a displacement due to a shearing force of a joining surface of each member. In addition, if a ceramic material or a glass material is used, an ink jet recording head having excellent durability and storability that does not corrode even against strongly alkaline ink can be produced. It is possible to create a structure directly. If a high melting point material such as a ceramic material is used for the ejection port plate, high heat treatment or the like can be performed for water repellent treatment of the surface of the ink ejection port.

Further, according to the present invention, it is possible to subject the two or more kinds of materials of different materials to sublimation processing at substantially the same time in the same step. Even if the difference is large, according to the present invention, heat is less likely to be transmitted during ablation processing than in the past, so that separation between dissimilar materials can be suppressed by stress due to thermal expansion. When a fine structure is formed on a workpiece made of a material, a laser processing method using a simple and simple processing step, a method for manufacturing an ink jet recording head using the laser processing method, and ink jet recording using the manufacturing method A head can be realized. According to the present invention, the light wavelength of the laser emitted at a pulse oscillation time of 1 picosecond or less does not necessarily need to be ultraviolet light. But
Since the temporal light energy density is very large, the material is sublimated in a short time in the processing, so that it is possible to perform ablation processing without passing through a liquid phase. Further, by configuring the method of manufacturing an ink jet recording head by this laser processing method, it has been generally used in the structure of an ink discharge port or ink flow path or ink liquid chamber or ink supply port of an ink jet until now. Not only resin materials such as polyimide and polysulfone, but also inorganic materials,
This laser processing method enables the ablation processing of a glass material, a metal material, a semiconductor material, or a recording head constituent member made of any combination of these materials almost simultaneously in one step. Therefore, according to this, the structure of the ink discharge port, the ink flow path, the ink liquid chamber, or the ink supply port can be provided with a degree of freedom of compound selection. Further, for example, when a material having a small thermal expansion, which is a composite material of a metal material and a resin material or a glass material and a resin material, is used for the orifice plate or the ink flow path constituting member, no displacement occurs due to the shearing force of the joining surface of each member. In addition, it is possible to transport by sea mail that passes directly below the equator by configuring the ink jet recording head or printer with materials that are not easily affected by such temperature changes (environmental changes) etc. Thus, it is possible to reduce distribution costs. In addition, if a composite material of a ceramic material and a glass material is used, an ink jet recording head having excellent durability and storability that does not corrode even with strongly alkaline ink can be manufactured.

Further, according to the present invention, as described above, the laser beam is focused at a predetermined energy density or more inside the transparent workpiece at the light wavelength of the laser beam, thereby exceeding the ablation threshold for the workpiece. The sublimation process occurs from the region that has been set, and the internal portion of the workpiece can be selectively sublimated, thereby simplifying the alignment process and improving the positional accuracy of the internal structure. Laser processing method that can achieve higher precision and lower manufacturing cost,
Alternatively, a method for manufacturing an ink jet recording head using the laser processing method and an ink jet recording head according to the manufacturing method can be realized. Further, according to the present invention, by using the above-described laser processing method to configure a method for manufacturing an ink jet recording head, the members constituting the ink jet recording head can be aligned by an assembly error due to the assembly, and the ink caused by the joint deformation. In addition to suppressing the deterioration of the ejection characteristics, it is possible to form the ink flow path three-dimensionally inside a resin workpiece such as polysulfone or polyimide to create three colors of YMC (yellow, magenta, and cyan). An ink jet recording head having an arrangement of ejection cells in which three color colors are adjacent to each other by connecting a circulating one-dimensional array ejection nozzle of YMC from the ink liquid chamber of Y, or YMCK (yellow, magenta, cyan, Similarly, the four colors of YMCK are also used for the four colors of black). Circulating one-dimensional array discharge nozzles of YMCK from the liquid chamber connected to the respective colors can be four-color form an ink jet recording head having an array of adjacent discharge cells. Therefore, in the recording by the ink jet recording head, since it is not necessary to perform registration between respective colors, there is no occurrence of color shift and hue change, and a complicated color registration correction function and registration adjustment between respective colors need to be performed. Is eliminated, and a stable color reproduction image can be printed.

Further, according to the present invention, as described above, the material (A) which is substantially transparent at the light wavelength of the laser light and has a low light absorptivity is passed through, and the laser light is made higher than the material (A). By irradiating the material (B) located inside the workpiece with a high light absorptance at the light wavelength of, the structure can be processed and formed on the material (B), thereby simplifying the alignment process. Can also
A laser processing method capable of improving the positional accuracy of the internal structure and the like, reducing manufacturing costs, and the like, or a method of manufacturing an inkjet recording head using the laser processing method and an inkjet recording head by the manufacturing method. ,
Can be realized. Further, according to the present invention, by configuring a method for manufacturing an ink jet recording head using the above-described laser processing method, it is possible to form an ink flow path and the like inside after assembling the ink jet recording head. Thus, it is possible to suppress the alignment error caused by the assembly and the deterioration of the ink ejection characteristics caused by the joint deformation. Further, according to the present invention, it is possible to improve the processing efficiency by configuring the workpiece so as to absorb the radiation energy of the laser.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating a method of processing an ink ejection port of an inkjet recording head according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram for explaining an ink ejection port processing method of an ink jet recording head in a conventional example in comparison with the first embodiment.

FIG. 3 is a schematic diagram of an optical system of the laser processing apparatus according to the first embodiment of the present invention.

FIGS. 4A to 4D are views showing a process of processing a cantilever manufactured by laser processing according to a second embodiment of the present invention.

FIGS. 5 (e) to (g) are views showing a cantilever processing step subsequent to (a) to (d) processing steps in Embodiment 2 of the present invention.

FIG. 6 is a diagram illustrating a process of processing an ink ejection port manufactured by laser processing according to a third embodiment of the present invention.

FIGS. 7A to 7C are diagrams illustrating processing steps of an ink flow path and an ink liquid chamber manufactured by laser processing according to a fourth embodiment of the present invention.

8 (d) to (e) are views showing processing steps subsequent to the processing steps (a) to (c) in Embodiment 4 of the present invention.

FIG. 9 is a diagram illustrating a laser internal processing method according to a fifth embodiment of the present invention.

10A and 10B are diagrams illustrating a main part of ink discharge of a surface discharge type ink jet recording head in which an ink flow path is formed by a laser processing method according to a fifth embodiment of the present invention, and FIG.
3A is a view of the main part of the ink discharge of the surface discharge type ink jet recording head as viewed from the ink discharge surface, and FIG. 3B is a cross-sectional view taken along the line BB in FIG.

11A and 11B are diagrams illustrating a main part of ink ejection of a YMC color circulating nozzle type ink jet recording head in which an ink flow path is formed by a laser processing method according to a sixth embodiment of the present invention, and FIG. FIG. 4B is a cross-sectional view taken along the line CC in FIG.

FIGS. 12 (c) and (d) are cross-sectional views taken along line DD and line EE in FIG. 11 (a).

FIG. 13 is a diagram illustrating a laser processing method according to a seventh embodiment of the present invention.

FIG. 14 is a diagram showing a main part of ink ejection of a surface ejection type ink jet recording head in which an ink flow path is formed by a laser machining method according to a seventh embodiment of the present invention.

FIG. 15 is a schematic optical path diagram of a mask pattern projection optical system of a laser processing apparatus according to an eighth embodiment of the present invention.

FIG. 16 is a diagram illustrating a correlation between a laser oscillation wavelength and an absorption spectrum of a workpiece for describing a processing method according to an eighth embodiment of the present invention.

FIG. 17 is a schematic view showing an ink jet recording head manufactured by applying a laser processing method according to an embodiment of the present invention.

[Description of Signs 1] 1: Laser light 2: Orifice plate 10: Fly eye lens 11: Field lens 12: Mask 13: Aperture 14: Projection lens 31: Ink flow path 32: Ink liquid chamber 33: Substrate 34: Ink ejection Pressure generating element 35: top plate 201: ink discharge port 202: ink discharge port 203: during ink discharge port etching process 211: ink discharge port 212: during ink discharge port etching process 213: during ink discharge port etching process 40: ink discharge Exit 41: Silicon substrate 42: Aluminum film 43: Resin film 44: Metal film 60: Orifice plate 61: Polysulfone layer 62: Copper foil layer 65: Inkjet main body 70: Top plate 71: Ink flow path 72: Ink liquid chamber 80: Substrate 81: Ink discharge pressure generating element 9 : Laser beam 92: Workpiece 93: Processed cavity 100: Laser beam 1010: Silicon circuit board mounted with ink discharge pressure generating element 1011: Ink discharge pressure generating element 1012: Ink supply port 1020: Resin plate 1021: Ink discharge port 1022: Ink buffer chamber 1023: Ink flow path 1024: Ink liquid chamber 1130: Silicon circuit board mounted with ink discharge pressure generating element 1131: Ink discharge pressure generating element 1140: Resin plate 1141Y, 1141M, 1141C: Ink nozzle buffer chamber 1142: Ink Discharge port 1150: resin plate 1151Y, 1151M, 1151C: ink flow path 1152Y, 1152M, 1152C: ink liquid chamber 1153Y, 1153M, 1153C: ink supply port 131: laser beam 132: material ( 133: material (B) 134: base plate 135: hole 136: mask 137: mask projection lens 138: mask pattern 1410: silicon circuit board with ink discharge pressure generating element 1411: ink discharge pressure generating element 1412: ink supply port 1420: Colorless polysulfone plate 1421: Ink ejection port 1430: Blue polysulfone plate 1431: Ink buffer chamber 1432: Ink flow path 1433: Ink liquid chamber 151: Mask 152: Orifice plate 153: Ink jet recording head body 1501: Laser beam 1510: Fly eye lens 1511: Field lens 1512: Aperture 1513: Projection lens

Continuation of the front page (31) Priority claim number Japanese Patent Application No. 11-316818 (32) Priority date November 8, 1999 (11.8 November 1999) (33) Priority claim country Japan (JP) (31) Priority claim number Japanese Patent Application No. Hei 11-316850 (32) Priority date November 8, 1999 (11.8 November 1999) (33) Priority claim country Japan (JP)

Claims (47)

[Claims] 1. A laser processing method for performing laser ablation processing on a workpiece by irradiating the workpiece with laser light, wherein the laser beam is emitted from a laser oscillator oscillating at a pulse emission time of 1 picosecond or less. A laser processing method, wherein a plurality of processing shapes arranged at predetermined intervals are simultaneously formed by using a plurality of pulses of laser light having a very large spatial and temporal energy density. 2. The method according to claim 1, wherein the workpiece is a resin or Si or S
The laser processing method according to claim 1, wherein the laser processing method is an i-compound material. 3. A spatial and temporal energy radiated from a laser oscillator oscillating with a pulse emission time of 1 picosecond or less for a workpiece composed of two or more different materials. A laser processing method comprising: condensing and irradiating a plurality of pulses of laser light having a high density at a predetermined energy density; and sublimating the two or more different materials almost simultaneously in the same process. 4. A workpiece formed of two or more different materials is a workpiece configured in a joined state, and warps the workpiece in the same process. And sublimation processing is performed at substantially the same time.
2. The laser processing method according to 1. above. 5. The material of two or more different materials is an organic resin material, a metal material, an inorganic compound material, a glass material,
The laser processing method according to claim 3, wherein the laser processing method is made of any combination of a mineral material and the like. 6. A laser processing method for performing laser ablation processing on a workpiece by irradiating the workpiece with a laser beam, wherein the laser beam is emitted from a laser oscillator that oscillates with a pulse emission time of 1 picosecond or less as the laser light. The laser light of a plurality of pulses, which has a very large spatial and temporal energy density, is condensed to a predetermined energy density or more inside a transparent workpiece at the light wavelength of the laser light, and A laser processing method characterized by sublimating a workpiece. 7. A laser processing method for performing laser ablation processing on a workpiece by irradiating the workpiece with a laser beam, wherein the laser beam is emitted from a laser oscillator that oscillates with a pulse emission time of 1 picosecond or less as the laser light. Using a plurality of pulses of laser light having a very large spatial and temporal energy density, and passing through the material (A) which is substantially transparent at the light wavelength of the laser light and has a low light absorption rate; Laser processing characterized in that the material (B) is processed by irradiating a material (B) located inside a workpiece to be processed, which has a higher light absorptivity at the light wavelength of the laser light than (A). Method. 8. In the sublimation processing of the workpiece, when sublimating the structure inside the workpiece, an outlet for releasing a substance produced by sublimation vaporization in the processing to the outside is provided in advance. The laser processing method according to claim 6, wherein after the formation, the structure is processed. 9. The laser processing method according to claim 8, wherein, when processing the structure, the structure is processed from a position in contact with the emission port. 10. The process according to claim 1, wherein the workpiece is mixed and colored with a dye absorbing a wavelength range corresponding to the oscillation wavelength of the laser beam. Laser processing method. 11. The laser beam has a wavelength of 350 to 1000.
The laser processing method according to claim 1, wherein the laser processing method is within a range of nm. 12. The pulse emission time of said laser light is 500
13. The method according to claim 1, wherein the time is less than a femtosecond.
The laser processing method according to any one of the above. 13. The laser processing method according to claim 1, wherein said laser oscillator is a laser oscillator having a spatial compression device for light propagation. 14. A laser processing apparatus according to claim 13, wherein said spatial compression device for light propagation comprises chirping pulse generation means and longitudinal mode synchronization means utilizing optical wavelength dispersion characteristics. Method. 15. An ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, and an ink flow path communicating between the discharge port and the liquid chamber. An ink generating element provided in a part of the ink flow path for generating energy for discharging ink, and an ink supply port for supplying ink from outside to the liquid chamber; In a method of manufacturing an ink jet recording head for processing a member forming at least a part of an ink passage by a laser beam, a spatial time radiated from a laser oscillator oscillating as a laser beam with a pulse emission time of 1 picosecond or less. Using a plurality of pulses of laser light having a very large energy density, and forming a recess or through which becomes a part of the ink passage A method for producing an ink jet recording head and forming a. 16. A plurality of recesses or through-holes forming a part of said ink passage are formed simultaneously at a predetermined interval by irradiating a laser beam through a mask having a plurality of opening patterns formed at a predetermined pitch. The method for manufacturing an ink jet recording head according to claim 15, wherein: 17. The method according to claim 15, wherein the member forming at least a part of the ink passage is made of a resin. 18. The method according to claim 15, wherein the member forming at least a part of the ink passage is made of Si or a Si compound material. 19. The method according to claim 16, wherein the recess is a groove serving as the ink flow path. 20. The method according to claim 16, wherein the through-hole serves as the discharge port. 21. An ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, and an ink flow path communicating the discharge port with the liquid chamber. An energy generating element provided in a part of the ink flow path for generating energy for discharging ink, an ink supply port for supplying ink to the liquid chamber from outside, and the like, An ink jet recording head in which a member constituting at least a part of the above is formed of two or more kinds of different materials, and a member formed of the two or more kinds of different materials is processed by a laser processing method. Wherein the spatial and temporal energy density emitted from the laser oscillator oscillating at a pulse emission time of 1 picosecond or less as the laser light is non- Large, using a laser beam of plural pulses, the manufacturing method of the ink jet recording head, characterized in that the sublimation process almost simultaneously two or more kinds of the material member formed by of Tsu different material in the same step. 22. The member made of two or more different materials is a member constituting at least a part of an ink passage of an ink jet recording head formed in a joined state, and the member is the same. 3. Sublimation processing is performed almost simultaneously without causing warpage in the process.
2. The method for manufacturing an ink jet recording head according to item 1. 23. The material of the two or more different materials,
23. The method according to claim 21, wherein the method comprises any combination of an organic resin material, a metal material, an inorganic compound material, a glass material, a mineral material, and the like. 24. An ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, and an ink flow path communicating between the discharge port and the liquid chamber. An ink passage provided in a part of the ink flow path, for generating energy for discharging ink, an ink supply port for supplying ink to the liquid chamber from outside, and the like. Forming a member constituting at least a part of a transparent ink flow path forming body, and processing by a laser processing method, wherein the laser light as a pulse emission time of 1 picosecond or less Using a multi-pulse laser beam with a very large spatial and temporal energy density emitted from a laser oscillator It is condensed more than a predetermined energy density at the inside of the transparent ink flow path structure in the long, manufacturing method for an ink jet recording head, which comprises sublimating processing an ink flow path and the like. 25. An ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, and an ink flow path communicating between the discharge port and the liquid chamber. An ink passage provided in a part of the ink flow path, for generating energy for discharging ink, an ink supply port for supplying ink to the liquid chamber from outside, and the like. A member (A) that is substantially transparent and has a low light absorption rate of laser light; a light absorption rate of laser light is higher than the material (A); A method of manufacturing an ink jet recording head formed of a material (B) located in the above and processed by a laser processing method, wherein the laser light oscillates with a pulse emission time of 1 picosecond or less. A laser beam having a very large spatial and temporal energy density emitted from a laser oscillator and having a plurality of pulses is used to pass through the material (A) having a low light absorption rate of the laser beam, and the material (A) Also has high light absorption of laser light,
A method for manufacturing an ink jet recording head, comprising irradiating a material (B) located inside a workpiece with sublimation processing on the material (B). 26. In the processing of the ink flow path and the like, a discharge port for discharging a substance produced by sublimation vaporization in the processing to the outside is formed in advance, and then the ink flow path and the like are processed. Claim 24 or Claim 25
3. The method for manufacturing an ink jet recording head according to item 1. 27. The method of manufacturing an ink jet recording head according to claim 26, wherein, when processing the ink flow path and the like, the ink flow path and the like are processed from a position in contact with the discharge port. 28. The process according to claim 15, wherein the workpiece is mixed and dyed with a dye absorbing a wavelength range corresponding to the oscillation wavelength of the laser beam. Of manufacturing an inkjet recording head. 29. The laser beam has a wavelength of 350 to 1000.
29. The method according to claim 19, wherein the distance is in the range of nm.
The method for manufacturing an ink jet recording head according to any one of the above items. 30. A pulse emission time of said laser beam is 500
3. The method according to claim 1, wherein the time is less than a femtosecond.
10. The method for manufacturing an ink jet recording head according to any one of items 9 to 9. 31. The method according to claim 15, wherein the laser oscillator has a light-propagating spatial compression device. 32. An ink jet recording apparatus according to claim 31, wherein said light propagation spatial compression device comprises chirping pulse generation means and longitudinal mode synchronization means utilizing light wavelength dispersion characteristics. Head manufacturing method. 33. A spatial compression apparatus for light propagation according to claim 31, wherein said apparatus is configured by using a longitudinal mode locking method utilizing chirped pulse generation means and light wavelength dispersion characteristics of a diffraction phase grating. 3. The method for manufacturing an ink jet recording head according to item 1. 34. An ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, and an ink flow path communicating the discharge port with the liquid chamber. An energy generating element provided in a part of the ink flow path for generating energy for discharging ink, an ink supply port for supplying ink to the liquid chamber from outside, and the like, In an ink jet recording head obtained by processing a member forming at least a part of a laser beam, a spatial and temporal energy radiated from a laser oscillator oscillating at a pulse emission time of 1 picosecond or less as the laser beam Very high density, using a plurality of pulses of laser light, a recess or part of the ink path formed by this Ink jet recording head and having a through hole. 35. A plurality of recesses or through-holes which become a part of the ink passage are simultaneously formed at a predetermined interval by irradiating a laser beam through a mask having a plurality of opening patterns formed at a predetermined pitch. 35. The ink jet recording head according to claim 34, wherein the concave portion or the through hole is formed. 36. A member forming at least a part of said ink passage is made of resin.
36. The ink jet recording head according to claim 35. 37. The ink jet recording head according to claim 34, wherein a member forming at least a part of said ink passage is made of Si or a Si compound material. 38. The ink jet recording head according to claim 35, wherein the recess is a groove serving as the ink flow path. 39. An ink jet recording head according to claim 35, wherein said through hole serves as said discharge port. 40. An ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, and an ink flow path communicating the discharge port with the liquid chamber. An ink passage provided in a part of the ink flow path, for generating energy for discharging ink, an ink supply port for supplying ink to the liquid chamber from outside, and the like. Is formed by using two or more kinds of different materials, and the members formed by using two or more kinds of different materials are processed by a laser processing method. A recording head, wherein a spatial and temporal energy density emitted from a laser oscillator oscillating at a pulse emission time of 1 picosecond or less as the laser light is extremely high. Listening, ink jet recording head using a laser beam of plural pulses, thereby comprises said member formed by substantially simultaneously sublimation process two or more different Tsu was made of the material in the same step. 41. The member made of two or more different materials is a member constituting at least a part of an ink passage of an ink jet recording head formed in a joined state, and the members are the same. The inkjet recording head according to claim 40, wherein the inkjet recording head is a member formed by sublimation processing almost simultaneously without causing warpage in a process. 42. The two or more different materials are:
42. The ink jet recording head according to claim 40, comprising an arbitrary combination of an organic resin material, a metal material, an inorganic compound material, a glass material, a mineral material and the like. 43. An ink discharge port for discharging ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the discharge port, and an ink flow path communicating between the discharge port and the liquid chamber. An energy generating element provided in a part of the ink flow path for generating energy for discharging ink, an ink supply port for supplying ink to the liquid chamber from outside, and the like, An ink jet recording head formed by forming a member constituting at least a part of a transparent ink flow path forming body with a laser processing method, wherein the laser light oscillates with a pulse emission time of 1 picosecond or less. A laser light emitted from a laser oscillator and having a very large spatial and temporal energy density and a plurality of pulses is used. It is condensed more than a predetermined energy density at the inside of the transparent ink flow path structure, the ink jet recording head which comprises said member formed by sublimation process. 44. An ink ejection port for ejecting ink droplets to be attached to a recording medium, a liquid chamber for storing ink to be supplied to the ejection port, and an ink flow path communicating between the ejection port and the liquid chamber. An ink passage provided in a part of the ink flow path, for generating energy for discharging ink, an ink supply port for supplying ink to the liquid chamber from outside, and the like. A member (A) that is substantially transparent and has a low light absorption rate of laser light; a light absorption rate of laser light is higher than the material (A); A method of manufacturing an ink jet recording head formed of a material (B) located in the above and processed by a laser processing method, wherein the laser light oscillates with a pulse emission time of 1 picosecond or less. A laser beam having a very large spatial and temporal energy density emitted from a laser oscillator and having a plurality of pulses is used to pass through the material (A) having a low light absorption rate of the laser beam, and the material (A) Also has high light absorption of laser light,
An ink jet recording head comprising the member formed by irradiating a material (B) located inside a workpiece with sublimation processing. 45. In the processing of the ink flow path and the like, a discharge port for discharging a substance produced by sublimation vaporization in the processing to the outside is formed in advance, and then the ink flow path and the like are processed. Claim 43 or Claim 44
3. The ink jet recording head according to item 1. 46. The method for manufacturing an ink jet recording head according to claim 45, wherein the processing of the ink flow path and the like is performed from the position in contact with the discharge port. 47. The member according to claim 34, further comprising the member processed by mixing and coloring a dye absorbing a wavelength range corresponding to an oscillation wavelength of the laser light.
Item 7. The ink jet recording head according to item 1.