JP2001196643A - Chip carrier for mounting optical / electrical element, method of mounting the same, optical / electrical wiring board, method of manufacturing the same, and mounting board - Google Patents

Abstract

(57) [Problem] To provide an optical / electrical element mounting chip carrier capable of mounting an electric element having many input / output terminals at a high speed and an optical / electrical wiring board which can be mounted by the same method as in the past. An insulating substrate, a first metal pad for electrically connecting to an electric element on one surface of the insulating substrate, and a second metal pad for electrically connecting to an optical element on the opposite surface of the insulating substrate. Metal pad 3, a third metal pad 4 for electrical connection with an external substrate in the same plane as the second metal pad, and a first metal pad located on or in the insulating substrate. A light emitting element or the like is mounted on a metal pad and an optical / electrical element mounting chip carrier having electric wirings 5 and 7 for connecting the first metal pad and the third metal pad, and further,
Electrical connection with optical / electrical wiring board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical / electrical element mounting chip carrier for mounting an optical element and an electric element, a mounting method in which the optical element and the electric element are mounted on the chip carrier, and an optical wiring. The present invention relates to an optical / electrical wiring board in which electric wiring is mixed, a method of manufacturing the same, and a mounting board on which a chip carrier having an optical / electrical element is mounted.

[0002]

2. Description of the Related Art Recently, semiconductor large-scale integrated circuits (LSIs)
In such electric elements, the degree of integration of transistors is increased, and the operation speed of the transistor reaches 1 GHz in clock frequency, and the number of input / output terminals exceeds 1,000.

In order to mount the highly integrated electric element on an electric wiring board, a BGA (Ball Grid A) is used.
rray) and CSP (Chip Size Packa)
Ge) and other chip carriers have been developed and put into practical use. FIG. 12 schematically shows a structure in which an electric element is mounted on a BGA and mounted on an electric wiring board.

A so-called build-up multilayer laminate 132 in which insulating layers and conductor layers are alternately laminated on a copper-clad substrate in which glass cloth is impregnated with an epoxy resin or the like is provided with bumps 133 formed of gold or the like on one surface of the laminate 132. An electrical connection is made with the electrodes of the element 131. A pad 137 surface-treated with gold or the like is formed on the opposite surface, and is connected to the electric wiring board 135 via a solder ball 134 by soldering. Electric signals are exchanged with peripheral electric elements (not shown) via electric wiring 136.

[0005] As the clock frequency inside the electric element increases, the signal speed between elements outside the electric element also tends to increase. However, when a high-speed signal flows through the electric wiring between the elements, the influence of noise such as reflection due to a defective shape of the electric wiring cannot be avoided. Also, due to the increase in the number of input / output terminals, the electric wiring density of the electric wiring board increases, and crosstalk between the wirings is inevitable. Further, there is a problem that an electromagnetic wave is generated from the electric wiring and adversely affects the surroundings. For this reason, at present, the signal speed between the electric elements is bothersomely reduced, and the system is constructed so that these problems do not occur. Therefore, in this case, the function of the highly integrated electric element is not sufficiently utilized.

In order to solve such a problem, it has been considered to replace a part of the electric wiring made of copper on the electric wiring board with an optical wiring made of an optical fiber and use an optical signal instead of an electric signal. This is because, in the case of an optical signal, generation of noise and electromagnetic waves can be suppressed.

An optical / electrical wiring board in which a part of the copper wiring on the electric wiring board is replaced with an optical wiring using an optical fiber,
For example, as described in JP-A-3-29905, there has been proposed a substrate in which an optical fiber is fixed on an electric wiring substrate with an insulating film.

However, in such a system in which an electric signal is replaced with an optical signal, the electric signal passes through the electric wiring of the chip carrier from the electric element, and further passes through the electric wiring on the substrate, and then the optical signal installed on the substrate. It is converted to an optical signal by the element,
It needs to be transmitted to the optical fiber on the same board. That is,
As shown in FIG. 13, a light emitting element such as a laser or an optical element 146 which is a light receiving element such as a photodiode is arranged around the BGA chip carrier 142. For this reason, depending on the number of input / output terminals of the electric element, the area where the optical element is installed becomes large, and the mounting density of the substrate is reduced. Further, since the wiring length to the optical element becomes longer and the problem of noise and the like becomes remarkable, the merit of using an optical signal is lost.

Further, in the conventional optical / electrical wiring board, it is difficult to optically match the optical axis of a light emitting element such as a laser diode or the light receiving element such as a photodiode with the optical axis of an optical wiring. I couldn't agree without relying on others. Therefore, as compared with an electric element chip carrier that can be automatically soldered in a reflow furnace or the like, mounting an optical element on an optical / electrical wiring board has a disadvantage that it is very expensive.

Further, when an optical fiber is used as the optical wiring, it cannot cope with an optical wiring having a complicated shape due to the limit of its flexibility, so that the degree of freedom of design is reduced, and high-density wiring or a small-sized substrate is required. There was a problem that it could not cope with.

For this reason, several configurations of optical / electrical wiring boards using so-called optical waveguides as optical wirings have been proposed on electrical wiring boards. In the configuration of the optical waveguide, a core through which an optical signal propagates is embedded in a clad layer that confine the optical signal to the core. The method of forming the core pattern is to form a metal mask by photolithography technology,
It can be produced by dry etching or, if the core material has been given photosensitivity, by exposure and development. For this reason, since the optical wiring can be formed based on the pattern of the photomask, the degree of freedom of the design is increased. Also, transmission over a relatively short distance can be supported.

However, when an optical waveguide is formed on an electric wiring board, the surface of the electric wiring board as a base of the optical wiring layer is
Due to the multilayered electric wiring, very large irregularities are formed. For this reason, if the optical waveguide is formed directly on the surface, there is a problem that the propagation loss of the optical signal increases due to the unevenness.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of the prior art, and is an optical / electrical element mounting chip carrier capable of mounting an electric element having a large number of input / output terminals at high speed, and a conventional method. It is an object of the present invention to provide an optical / electrical wiring board that can be mounted by using the above.

[0014]

In order to achieve the above object in the present invention, according to the first aspect of the present invention, an insulating substrate and a first surface for electrically connecting an electric element to one surface of the insulating substrate are provided. A first metal pad, a second metal pad for electrical connection with the optical element on the opposite surface of the insulating substrate, and a third metal pad for electrical connection with the external substrate in the same plane as the second metal pad. It has a metal pad, a first metal pad and a second metal pad located on or in the insulating substrate, and an electric wiring connecting the first metal pad and the third metal pad. This is a chip carrier for mounting optical / electrical elements.

According to a second aspect of the present invention, an electrical element is mounted on the first metal pad of the chip carrier for mounting an optical / electrical element according to the first aspect, and an optical element is mounted on the second metal pad on the opposite surface. 2. The light according to claim 1, wherein the light emitting element is mounted so that the light emitting surface faces upward from the insulating substrate surface, and the light receiving element is mounted such that the light receiving surface faces upward from the insulating substrate surface. -The method of mounting the chip carrier for mounting the electric element.

According to a third aspect of the present invention, there is provided an optical / electrical wiring board including an optical wiring layer having a core for transmitting light and a clad for burying the core, on the electric wiring of the substrate having the electric wiring. A mirror provided on a part of the core and disposed at a position facing the light-emitting surface and the light-receiving surface of the optical element; a fourth pad disposed at a position facing the third pad; An optical / electrical wiring board comprising: a via hole for electrically connecting a pad to an electric wiring of the board.

According to a fourth aspect of the present invention, there is provided an optical / electrical wiring board including an optical wiring layer having a core for transmitting light and a clad for burying the core, on the electric wiring of the substrate having the electric wiring. A mirror provided on a part of the core and disposed at a position facing the light-emitting surface and the light-receiving surface of the optical element; a fourth pad disposed at a position facing the third pad; An optical / electrical wiring board comprising: a via hole for electrically connecting a pad and an electric wiring of a substrate; and an electric wiring provided on an optical wiring layer.

According to a fifth aspect of the present invention, in the optical / electrical wiring substrate according to any one of the third and fourth aspects, a projection made of the same material as that of the cladding layer is provided around the fourth pad. It is what it was.

According to a sixth aspect of the present invention, there is provided the optical / electrical device according to any one of the third to fifth aspects, wherein a convex lens made of the same material as the clad layer is provided on the surface of the optical wiring layer above the mirror. This is a wiring board.

Further, in the invention according to claim 7, a step of forming a first clad layer on the support, a step of forming a core layer to be an optical wiring, and a step of forming a second clad layer thereon. Forming a mirror on a part of the core, forming an optical wiring film by peeling the optical wiring film from a support, bonding the optical wiring film to a substrate having electrical wiring, and forming electrical wiring and via holes on the substrate. The method for manufacturing an optical / electrical wiring board according to any one of claims 3 and 4, further comprising the step of electrically connecting the fourth pad via the second pad.

According to the invention of claim 8, a step of forming a mold corresponding to the convex portion disposed in advance on the periphery of the fourth pad on the support, and a step of forming a first cladding layer thereon. Forming a core layer to be an optical wiring, forming a second cladding layer thereon, forming a mirror on a part of the core, and peeling the optical wiring film from the support to form an optical wiring film. 6. The method according to claim 5, further comprising a step of forming, a step of bonding the optical wiring film to a substrate having electrical wiring, and a step of electrically connecting the electrical wiring on the substrate and the fourth pad via a via hole. This is a method for manufacturing the optical / electrical wiring board described above.

According to the ninth aspect of the present invention, a step of forming a mold corresponding to the lens and a mold corresponding to the convex portion arranged in the peripheral portion of the fourth pad in advance on the support, and further forming the first Forming a cladding layer, forming a core layer to be an optical wiring, forming a second cladding layer thereon, forming a mirror on a part of the core, Forming an optical wiring film by peeling the optical wiring film from the substrate; bonding the optical wiring film to a substrate having electrical wiring;
7. The method for manufacturing an optical / electrical wiring board according to claim 6, further comprising the step of electrically connecting said pads.

According to a tenth aspect of the present invention, an optical element and an electric element are mounted on the optical / electrical element mounting chip carrier according to the first aspect, and further, the optical element according to any one of the third to sixth aspects. -A mounting substrate characterized by mounting an optical element and a chip carrier for mounting an optical / electric element on which an optical element and an electric element are mounted on an electric wiring board.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION FIG. 1 shows an example of a chip carrier for mounting an optical / electric element according to the present invention.
(A) and (b) of FIG. FIG. 1A is a cross-sectional view in which conductors are formed on both surfaces of a single-layered insulating substrate 1 and connected therebetween by a through hole 6 having a conductor formed on the inner wall surface or inside of the through hole. On the side on which the electric element is mounted, a first metal pad 2 for connecting the electric wiring 5 and the electrode of the electric element is formed. On the side connected to the optical / electrical wiring board, a second metal pad 3 for mounting an optical element is provided.
Third metal pads 4 for connection to the electric wiring board are formed. As the insulating substrate, a substrate obtained by impregnating a polyimide film or a glass cloth with an epoxy resin or the like can be used. Thickness is the former, 30 μm to 100 μm
The latter is 300 μm to 1.6 mm. The diameter of the through-hole for forming the through-hole is 30 to 100 μm mainly by carbon dioxide laser or excimer laser processing in the former, and 100 to 500 μm by drilling in the latter.

FIG. 1B is a cross-sectional view of an example using a multilayer insulated wiring board, which uses a so-called build-up board. As the base substrate, a double-sided copper-clad laminate in which a glass cloth is impregnated with an epoxy resin or the like is used, and the internal wiring layer 7 is formed using a copper foil. At this time, the thickness of the double-sided copper-clad laminate is 300 μm to 1.6 mm, and the thickness of the copper foil is 12 to 38 μm.
m. Through holes 8 used for a normal printed wiring board are formed between the internal wirings on both sides. The diameter of the through hole is 100-500 μm. On both surfaces, a build-up layer is formed by alternately laminating insulating layers such as epoxy resin and copper wiring layers by plating. Epoxy resin thickness is 20
１００100 μm, and the plating thickness is 5-20 μm. The outermost surface is similar to the configuration shown in FIG.
And a second metal pad 3 and a third metal pad 4 on the opposite surface. Via holes 9 are used for interlayer connection of the build-up layer. Via hole diameter is 30
３００300 μm. In the figure, the base substrate layer is a single layer, and a single build-up layer is shown on both sides. However, the present invention is not limited to this, and the base substrate and the build-up layer may each be a multilayer.

The build-up chip carrier of FIG. 1B has a higher degree of freedom in design than the single-layer chip carrier of FIG.

FIG. 1C is a top view showing an example of the side on which the second metal pad 3 and the third metal pad 4 of the chip carrier for mounting an optical / electrical element of the present invention are formed.
As shown, the second metal pad 3 and the third metal pad 4
Can be arranged in an array.

This is because the position of the optical element and the position of the connection portion with the substrate can be determined without being affected by the positions of the electrodes on the electric element and the pitch distance. Connection becomes easier.

2. 2. Mounting of Chip Carrier for Mounting Optical / Electrical Elements FIGS. 2A and 2B are FIGS. 1A and 1B, respectively.
FIG. 3B is a cross-sectional view illustrating an example in which the optical element 11 and the electric element 12 are mounted on the chip carrier for mounting an optical / electric element in FIG. Gold bump 1 on the first metal pad by plating or the like
4 are formed, and the bumps are connected to the electrodes of the electric element 12. In some cases, a photocurable resin layer is formed in a gap between the electric element and the chip carrier. On the other hand, solder bumps 14 are similarly formed on the second metal pad on the opposite side by plating, and an optical element 11 is soldered thereon, and a solder ball 13 is soldered on the third metal pad.

The light emitting surface and the light receiving surface of the optical element are provided on the side facing the optical / electrical wiring board surface. Thus, the optical signal can be spatially transmitted between the optical element and the optical wiring layer.

The optical / electrical mounting chip carrier manufactured in this manner can be mounted on an optical / electrical wiring board by solder reflow similarly to the conventional electric element chip carrier.

3. Optical / Electric Wiring Board FIG. 3A is a cross-sectional view of one example of the optical / electrical wiring board of the present invention.
Shown in The optical wiring layer 21 is fixed on a substrate 24 having an electric wiring 25 with an adhesive 28. On the outermost surface of the optical wiring layer, a fourth metal pad 26 for connecting to the solder ball is formed, and the fourth metal pad is connected to the electric wiring 25 via a via hole 29. The substrate 24 may be a single-layer insulating substrate or a multilayer electric wiring substrate.

The optical wiring layer 21 includes a core 22 through which an optical signal propagates, and a clad 23 that confine the optical signal to the core. Generally, the refractive index of the material forming the core is made higher than that of the cladding, so that the optical signal propagates in the core.

An optical signal propagated in parallel with the plate surface is introduced into a light receiving surface of a light receiving element located above the substrate or an optical signal emitted from a light emitting surface of a light emitting element located above the substrate is introduced into the core. For this purpose, a mirror 27 is provided on a part of the core. The mirror surface interface may be brought into contact with a resin having a lower refractive index than the core, or may be brought into contact with air. Further, a metal thin film may be formed.

FIG. 3B is an example of an optical wiring layer top view near the chip carrier mounting portion of the present invention. Core pattern 2
2 can be formed by photolithography, so that the degree of freedom of optical wiring is high. Similarly, FIG. 3C shows a case where an electric wiring 30 connected to the fourth metal pad 26 is formed on the surface of the optical wiring layer. In this case, it is not necessary to form the via hole 28 directly below the fourth metal pad, and it is possible to form the core pattern directly below the fourth metal pad, and the degree of freedom in designing the optical wiring is increased. .

FIG. 4 is a sectional view showing an example of another optical / electrical wiring board according to the present invention. Fourth metal pad 33
Are formed at the periphery of the optical wiring layer with the same material as the cladding of the optical wiring layer. The connection position of the solder ball is automatically determined by the convex portion. Also, the positional relationship between the second metal pad and the optical element on the chip carrier and between the third metal pad and the solder ball are accurately determined by the solder self-alignment effect. Further, the position of the mirror can be processed to a predetermined position based on an alignment mark (not shown).

For this reason, the chip carrier for mounting the optical / electrical element of the present invention is temporarily fixed on the optical / electrical wiring board, and the optical axis of the optical element and the optical wiring are automatically aligned just by passing the chip carrier through a solder reflow furnace. And the optical axis alignment becomes easier.

FIG. 5 is a sectional view showing an example of another optical / electrical wiring board according to the present invention. In this case, a lens is formed of a cladding material at the same time as the projection 31 provided on the periphery of the fourth metal pad 33. This further facilitates optical axis alignment.

FIGS. 6 (a) and 6 (c) show examples of the shape of the projection formed on the periphery of the fourth metal pad. The periphery may be surrounded as shown in FIG. 6A, or several projections may be arranged as shown in FIG. 6C. FIG. 6B is a cross-sectional view along the line AA ′ in FIG. Similarly, FIG. 6D is a cross-sectional view along BB ′ in FIG. 6C.

4. Method for Manufacturing Optical / Electrical Wiring Board The method for manufacturing an optical / electrical wiring board of the present invention is basically
It is as follows. First, an optical wiring layer is formed on a support separately from a substrate having electric wiring. Next, a mirror is provided on a part of the core, and the optical wiring layer is bonded to the substrate. Further, a pad electrically connected to the electric wiring on the substrate by the via hole is formed on the optical wiring layer.

In the present manufacturing method, the optical wiring is not directly formed on the insulating substrate having the uneven electric wiring, but is formed on another support in advance and attached to the electric wiring substrate. . As a result, the unevenness of the underlying electric wiring board is reduced, and the loss of the optical signal due to the unevenness is reduced to some extent.
Can be reduced.

Hereinafter, two embodiments will be described.

<First Embodiment of Method for Manufacturing Optical / Electrical Wiring Board> The first embodiment of the method for manufacturing an optical / electrical wiring board is described by using a fourth metal pad periphery for mounting a chip carrier. Focusing on the parts, FIG. 7 and FIG.
The description will be made according to the flow of (n).

As shown in FIG. 7A, a release layer 52 of Cr, Cu
Then, a Cu layer was formed to a thickness of about 10 μm in a copper sulfate plating bath.

As shown in FIG. 7B, a polyimide OPI-N1 is formed on the release layer 52 as a first clad 53.
005 (manufactured by Hitachi Chemical Co., Ltd.)
It was imidized at 50 ° C. At this time, the film thickness was 20 μm.

Further, as shown in FIG. 7C, a polyimide OP is formed as a core layer 54 on the first clad 53 layer.
I-N1305 (manufactured by Hitachi Chemical Co., Ltd.) was similarly spin-coated and imidized at 350 ° C. The film thickness at this time is 8
μm. The core and cladding materials used for this optical wiring layer are not limited to polyimide resins, but can be selected from polymer materials such as fluorinated or deuterated epoxy resins and methacrylate resins, depending on the wavelength of light used for optical signals. Materials with low loss can be selected.

Al is vapor-deposited on the surface of the core layer, a predetermined pattern of photoresist is formed, an etching process is performed,
An Al metal mask 55 was formed (FIG. 7D).

As shown in FIG. 7E, using oxygen gas,
The core 54 was etched by reactive ion etching. Further, the Al film serving as a metal mask was removed by etching to form an optical wiring pattern 56. An alignment mark (not shown) was formed simultaneously with the core pattern.

As shown in FIG. 7F, the second clad 5
As No. 7, OPI-1005 is similarly coated and imidized. The cladding thickness at this time is 20 on the core optical wiring layer.
μm.

As shown in FIG. 7G, the core pattern 56
A mirror 58 was formed on a part of the core pattern 56 at an angle of 45 ° with respect to the substrate by machining a part of the core pattern 56 with reference to the alignment mark (not shown) formed at the same time when the substrate was formed.

As shown in FIG. 8 (h), the Cu layer in the peeling layer was dissolved using a ferric chloride solution, and the optical wiring layer was peeled off to produce an optical wiring film.

As shown in FIG. 8 (i), a modified polyimide resin exhibiting thermoplasticity is coated on the substrate 59 having the electric wiring 60 as the adhesive 61 by 20 μm and dried.
The mirror-processed surface of the optical wiring layer was bonded and heated and bonded.

As shown in FIG. 8 (j), holes 62 for via holes were formed at positions where via holes were to be formed using a laser. An excimer laser, a carbon dioxide laser, a YAG laser, or the like is suitable as the laser.

As shown in FIG. 8 (k), Cr and Cr were sputtered on the surface of the optical wiring layer and inside the laser-processed hole.
A Cu metal thin film 63 was formed.

As shown in FIG. 8 (l), a photoresist pattern 64 was formed at a desired position.

As shown in FIG. 8 (m), the inside of the hole 62 and the fourth metal pad 66 were subjected to Cu plating with a thickness of 20 μm in a copper sulfate plating bath using the metal thin film 63 as a cathode.

As shown in FIG. 8 (n), the photoresist pattern 64 is peeled off, and the sputtered Cr and Cu metal thin films are removed by etching.
An electric wiring board was obtained.

<Second Embodiment of Method for Manufacturing Optical / Electrical Wiring Board> The second embodiment of the method for manufacturing an optical / electrical wiring board will be described in connection with the fourth metal pad periphery for mounting a chip carrier. Focusing on the parts, FIG. 9 and FIG.
The description will be made according to the flow of (o).

As shown in FIG. 9A, a thermal oxide film was formed on a silicon wafer as a support 71, and a desired pattern 72 was subjected to reactive ion etching.

After forming the concave portion 73 by wet etching, as shown in FIG. 9B, a release layer 73 is formed on the surface of the silicon wafer as the support 71 and inside the concave portion.
A thin film layer of Cr and Cu was sputtered, and then a Cu layer was formed to a thickness of about 10 μm in a copper sulfate plating bath.

As shown in FIG. 9C, a polyimide OPI-N1 is formed on the release layer 73 as a first clad 75.
005 (manufactured by Hitachi Chemical Co., Ltd.)
It was imidized at 50 ° C. At this time, the film thickness was 20 μm.

Further, as shown in FIG. 9D, a polyimide OP is formed as a core layer 76 on the first clad 75 layer.
I-N1305 (manufactured by Hitachi Chemical Co., Ltd.) was similarly spin-coated and imidized at 350 ° C. The film thickness at this time is 8
μm. The core and cladding materials used for this optical wiring layer are not limited to polyimide resins, but can be selected from polymer materials such as fluorinated or deuterated epoxy resins and methacrylate resins, depending on the wavelength of light used for optical signals. Materials with low loss can be selected.

A predetermined pattern of photoresist is formed by depositing Al on the surface of the core layer, and etching is performed.
An Al metal mask 77 was formed (FIG. 9E).

As shown in FIG. 9F, using oxygen gas,
The core 76 was etched by reactive ion etching. Further, the Al film serving as a metal mask was removed by etching to form an optical wiring pattern 78. An alignment mark (not shown) was formed simultaneously with the core pattern.

As shown in FIG. 9G, the second clad 7
As No. 9, OPI-1005 is similarly coated and imidized. The cladding thickness at this time is 20 on the core optical wiring layer.
μm.

As shown in FIG. 9H, the core pattern 78
A mirror 80 was formed on a part of the core pattern 78 at an angle of 45 ° with respect to the substrate by machining a part of the core pattern 78 with reference to an alignment mark (not shown) formed at the same time when the substrate was formed.

As shown in FIG. 10 (i), the Cu layer in the peeling layer was dissolved using a ferric chloride solution, and the optical wiring layer was peeled off to produce an optical wiring film. On the side opposite to the mirror processing surface, a convex portion 82 and a lens 81 positioned around the fourth metal pad 90 were formed.

As shown in FIG. 11 (j), a modified polyimide resin exhibiting thermoplasticity is coated on a substrate 83 having an electric wiring 85 by 20 μm as an adhesive 84, dried, and the mirror-processed surface of the optical wiring layer is formed. Bonding and heat bonding were performed.

As shown in FIG. 11K, holes 86 for via holes were formed at positions where via holes were to be formed using a laser. An excimer laser, a carbon dioxide laser, a YAG laser, or the like is suitable as the laser.

As shown in FIG. 11 (l), the surface of the optical wiring layer and the inside of the laser-processed hole are sputtered with C.
A metal thin film 87 of r and Cu was formed.

As shown in FIG. 11 (m), a photoresist pattern 88 was formed at a desired position.

As shown in FIG. 11 (n), the inside of the hole 86 and the fourth
Was plated with a 20 μm-thick Cu metal pad 90.

As shown in FIG. 11 (o), the photoresist pattern 88 is peeled off, the metal thin films of sputter Cr and Cu are removed by etching, and the optical / electrical wiring board according to the second embodiment of the present invention is removed. Obtained.

5. Mounting Board An electric element 91, a light receiving element 93, and a light emitting element 92 are mounted on the chip carrier 97 of the present invention, and are mounted on the optical / electrical wiring board according to the first embodiment of the present invention.
(A) of FIG.

The laser light 98 propagating through the core 100 in the optical / electrical wiring board is reflected by the mirror 101 and reaches the light receiving element 93 on the upper part of the board. The laser light 99 emitted from the light emitting element 92 is reflected by the mirror 102 and propagates through the core 100.

Similarly, the chip carrier 1 of the present invention
17, an electric element 111, a light receiving element 113, and a light emitting element 1
FIG. 11 (b) shows an embodiment in which the semiconductor device 12 is mounted and mounted on the optical / electrical wiring board according to the second embodiment of the present invention.

The laser beam 118 propagating through the core 120 in the optical / electrical wiring board is reflected by the mirror 121, condensed via the lens 123, and reaches the light receiving element 113 on the board. The laser light 119 emitted from the light emitting element 112 is condensed via the lens 124, reflected on the mirror 122, and propagates through the core 120.

[0078]

The present invention has the following effects.

First, there is an effect that a highly integrated electric element having a high speed and a large number of input / output terminals can be mounted without being affected by noise, crosstalk and electromagnetic waves and without deteriorating its function. is there.

Second, mounting the optical element on the back surface enables high-density mounting. Further, there is an effect that the pad position can be freely set so that the optical element can be easily mounted.

Third, there is an effect that the conventional reflow process can be used, and at the same time, the optical axis of the optical element and the optical wiring can be easily aligned.

Fourth, apart from a substrate having electric wiring,
Since the optical wiring layer is formed on the support and the optical wiring layer is bonded to the substrate, the electric wiring layer on the substrate is compared with the case where the optical wiring layer is formed directly on the electric wiring on the substrate. There is an effect that the influence of the unevenness can be reduced and the loss of light propagation of the core can be reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view and a top view showing a chip carrier for mounting an optical / electric element of the present invention.

FIG. 2 is a sectional view showing a mounting structure in which an optical element and an electric element are mounted on a chip carrier for mounting an optical / electric element of the present invention.

FIGS. 3A and 3B are a cross-sectional view and a top view showing a portion on which the optical / electrical element mounting chip carrier of the present invention is mounted on the optical / electrical wiring substrate of the present invention. FIGS.

FIG. 4 is a cross-sectional view showing a portion of the optical / electrical wiring board of the present invention on which the chip carrier for mounting an optical / electrical element of the present invention is mounted.

FIG. 5 is a cross-sectional view showing a portion of the optical / electrical wiring board according to the present invention on which the chip carrier for mounting an optical / electrical element according to the present invention is mounted.

FIGS. 6A and 6B are a top view and a cross-sectional view illustrating a projection formed around a fourth metal pad in the optical / electrical wiring board of the present invention.

FIG. 7 is a sectional view for explaining the first embodiment of the method for manufacturing an optical / electrical wiring board according to the present invention.

FIG. 8 is a sectional view for explaining the first embodiment of the method for manufacturing an optical / electrical wiring board according to the present invention.

FIG. 9 is a sectional view for explaining a second embodiment of the method for manufacturing an optical / electrical wiring board according to the present invention.

FIG. 10 shows a second example of the method for manufacturing an optical / electrical wiring board according to the present invention.
Sectional drawing explaining embodiment of 1st Embodiment.

FIG. 11 is a cross-sectional view of a mounting substrate in which the optical / electrical element mounting chip carrier of the present invention is mounted on the optical / electrical wiring substrate of the present invention.

FIG. 12 shows a conventional chip carrier on which electric elements are mounted;
Sectional drawing which shows the structure mounted in the conventional electric wiring board.

FIG. 13 shows a conventional chip carrier on which electric elements are mounted;
Sectional drawing which shows the structure mounted in the conventional optical / electrical wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... 1st metal pad 3 ... 2nd metal pad 4 ... 3rd metal pad 5 ... Electric wiring 6 ... Through hole 7 ... Electric wiring 8 ... Through hole 9 ... Via hole 11 ... Optical element 12 ... Electrical element 13 ... Solder ball 14 ... Bump 21 ... Optical wiring layer 22 ... Core 23 ... Cladding 24 ... Substrate 25 ... Electrical wiring 26 ... Fourth metal pad 27 ... Mirror 28 ... Adhesive layer 29 ... Via hole 30 ... Electric wiring 31 ... Convex part 32 ... Lens 33 ... Fourth metal pad 41 ... Fourth metal pad 42 ... Convex part 43 ... Via hole 51 ... Support body 52 ... Release layer 53 ... First clad 54 ... Core 55 ... Metal mask pattern 56 ... Core pattern 57 ... Second clad 58 ... Mirror 59 ... Substrate 60 ... Electrical wiring 61 ... Adhesive layer 62 ... Hole 63 ... Metal thin film 64 ... Photoresist 65 ... via hole 66 ... fourth metal pad 71 ... support 72 ... oxide film pattern 73 ... concave part 74 ... release layer 75 ... first clad 76 ... core 77 ... metal mask pattern 78 ... core pattern 79 ... second clad 80 ... Mirror 81 ... Lens 82 ... Protrusion 83 ... Substrate 84 ... Adhesive layer 85 ... Electrical wiring 86 ... Hole 87 ... Metal thin film 88 ... Photoresist 89 ... Via hole 90 ... Fourth metal pad 91 ... Electrical element 92 ... Emission Element 93 ... Light receiving element 94 ... Solder ball 95 ... Bump 96 ... Bump 97 ... Chip carrier 98 ... Laser light 99 ... Laser light 100 ... Core 101 ... Mirror 102 ... Mirror 111 ... Electrical element 112 ... Light emitting element 113 ... Light receiving element 114 ... Solder ball 115 ... Bump 116 ... Bump 117 ... Chip carrier 118 ... Laser 119 ... Laser light 120 ... Core 121 ... Mirror 122 ... Mirror 123 ... Lens 124 ... Lens 131 ... Electrical element 132 ... Insulating substrate 133 ... Bump 134 ... Solder ball 135 ... Substrate 136 ... Pad 137 ... Pad 141 ... Electrical element 142 ... Chip Carrier 143 solder ball 144 board 145 electrical wiring 146 optical element 147 optical fiber

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G02B 6/42 H05K 1/18 L 5F041 H01L 23/12 3/34 507C 5F088 23/14 G02B 6/12 B 25/04 M 25/18 H01L 23/12 H 31/02 N 31/0232 L H05K 1/02 23/14 Z 1/18 25/04 Z 3/34 507 31/02 BD (72) Inventor IV Kenta I 1-5-1, Taito, Taito-ku, Tokyo Toppan Printing Co., Ltd. (72) Inventor Koji Ichikawa 1-1-1, Taito, Taito-ku, Tokyo Toppan Printing Co., Ltd. (72) Inventor Takao Minato 1-5-1, Taito, Taito-ku, Tokyo Toppan Printing Co., Ltd. F-term (reference) 2H037 BA03 BA12 CA34 DA03 DA06 DA11 DA17 2H047 KA03 MA07 PA02 PA21 PA24 PA28 QA05 TA05 5E319 AA03 AB05 BB04 CC33 5E336 AA04 AA09 BB02 B B03 BB16 BC15 BC34 CC32 CC36 CC43 CC57 CC58 DD02 DD23 EE03 GG11 GG30 5E338 BB02 BB13 BB25 BB75 CC01 CC10 CD32 EE32 5F041 DA13 DA20 DA83 EE11 EE25 FF14 5F088 BA16 BB01 EA06 EA07 EA08 EA09 EA09 EA09

Claims (10)

[Claims] An insulating substrate, a first metal pad on one side of the insulating substrate for electrical connection with an electrical element, and a second metal pad on the opposite side of the insulating substrate for electrical connection with an optical element. A metal pad, a third metal pad for electrical connection to an external substrate, and a first metal pad and a second metal pad located on or in the insulating substrate in the same plane as the second metal pad. And a chip carrier for mounting an optical / electrical element, comprising an electric wiring connecting the first metal pad and the third metal pad. 2. An optical element is mounted on the first metal pad of the chip carrier for mounting an optical / electric element according to claim 1, and a light emitting element is provided as an optical element on the second metal pad on the opposite surface.
A method for mounting a chip carrier for mounting an optical / electrical element, wherein a light emitting surface is mounted so as to face upward from an insulating substrate surface, and a light receiving element is mounted such that a light receiving surface is directed upward from the insulating substrate surface. 3. The method according to claim 1, further comprising the step of:
An optical / electrical wiring board comprising an optical wiring layer having a core for transmitting light and a cladding for burying the core, the optical / electrical wiring board being provided on a part of the core and facing a light emitting surface and a light receiving surface of an optical element. A light, comprising: a disposed mirror; a fourth pad disposed at a position facing the third pad; and a via hole for electrically connecting the fourth pad to an electric wiring of the substrate.・ Electric wiring board. 4. The method according to claim 1, further comprising the step of:
An optical / electrical wiring board comprising an optical wiring layer having a core for transmitting light and a cladding for burying the core, the optical / electrical wiring board being provided on a part of the core and facing a light emitting surface and a light receiving surface of an optical element. An arranged mirror, a fourth pad arranged at a position facing the third pad, a via hole for electrically connecting the fourth pad to an electric wiring of the substrate, and an electric circuit provided on the optical wiring layer. An optical / electrical wiring board, comprising: a wiring; 5. The optical / electrical wiring board according to claim 3, wherein a projection made of the same material as that of the clad layer is provided around the fourth pad. 6. The optical / electrical wiring board according to claim 3, wherein a convex lens made of the same material as the clad layer is provided on the surface of the optical wiring layer above the mirror. 7. A step of forming a first cladding layer on a support, a step of forming a core layer to be an optical wiring, a step of forming a second cladding layer thereon, and a step of forming a part of the core. A step of forming a mirror, a step of forming an optical wiring film by peeling from the support, a step of bonding the optical wiring film to a substrate having electrical wiring, and a fourth step of connecting the electrical wiring on the substrate with the via hole. 5. The method according to claim 3, further comprising the step of electrically connecting the pads. 8. A step of forming a mold corresponding to a projection previously arranged on the periphery of the fourth pad on the support, a step of forming a first cladding layer thereon, and a core to be an optical wiring A step of forming a layer, a step of forming a second clad layer thereon, a step of forming a mirror on a part of the core, a step of peeling off the support from the support to form an optical wiring film, Bonding the wiring film to the substrate having the electrical wiring; and forming the fourth wiring via the electrical wiring and the via hole on the substrate.
6. The method for manufacturing an optical / electrical wiring board according to claim 5, further comprising the step of electrically connecting said pads. 9. A mold corresponding to a lens in advance on a support,
A step of forming a mold corresponding to the protrusion arranged on the periphery of the fourth pad, a step of forming a first cladding layer thereon, and a step of forming a core layer to be an optical wiring;
A step of forming a second cladding layer from above, a step of forming a mirror on a part of the core, a step of peeling from the support to form an optical wiring film, and the optical wiring film having an electrical wiring 7. The method for manufacturing an optical / electrical wiring board according to claim 6, further comprising a step of adhering to a substrate and a step of electrically connecting a fourth pad via an electric wiring and a via hole on the substrate. 10. An optical element and an electric element are mounted on the chip carrier for mounting an optical / electric element according to claim 1, further comprising:
A mounting board, comprising: the optical / electrical wiring board according to claim 3, and an optical / electrical element mounting chip carrier having the optical / electrical element mounted thereon.