JP2001183392A - Probe card - Google Patents

Abstract

(57) [Summary] [Purpose] Even if the type of chip to be inspected is different,
A probe card includes a card substrate having a plurality of first conductive portions connected to a tester land, a plurality of contacts, and an electrical connection to the contacts. Probe assembly having a plurality of second conductive parts, one or more sheet-like substrates having a plurality of first wirings electrically connected to the second conductive part, and a detachable card board. An assembled plate-shaped conversion unit, wherein the first conductive part is a first conductive part.
And a conversion unit having a plurality of second wirings electrically connected to the wirings. The first conductive portion and the second wiring are electrically connected via a first protruding electrode formed on the card substrate or the conversion unit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a probe card used for testing a semiconductor device.

[0002]

2. Description of the Related Art Generally, a semiconductor wafer includes a plurality of semiconductor devices, that is, IC chips (in the present invention,
Simply referred to as "chips". ) Are formed in a matrix. Each chip has a rectangular shape and has a plurality of electrode pads or electrodes within the rectangle.

[0003] This type of chip is subjected to an energization test (inspection) to determine whether or not the circuit operates according to specifications. Such an energization test is often performed before the wafer is separated from the chip, and a probe card provided with a plurality of probes (or probe elements) whose tips (contacts) are pressed against the electrodes of the chip is used. Done.

As one type of probe card of this kind, a plurality of strip-shaped wirings extending in parallel are formed on one surface of a sheet-like member such as an electrically insulating film, and a part of each wiring is used as a probe element. Some use a film-shaped probe unit (probe sheet).

[0005] The probe elements are divided into one or more probe element groups according to the arrangement of the electrodes of the chip. The probe sheet is directly or indirectly assembled using a suitable member on a card board (wiring board) having a plurality of tester lands connected to a signal channel or a power supply channel of the tester.

The probe element has a part of the wiring therein as a contact pressed against the electrode of the chip. When the contact is pressed against the electrode of the chip, the probe is elastically deformed in an arc shape. The contact is formed so as to be located in a region corresponding to the electrode arrangement of the chip for each probe element group.

A probe card using such a probe sheet is a needle-type probe card in which probes formed of thin metal wires are arranged on a card substrate, and a blade-type probe card in which blade-like probes are arranged in blocks. In comparison with the above, since the need for a needle stand operation is unnecessary, the production is easy and the cost is low.

[0008] However, even though the arrangement pattern of the chip electrodes is the same, the types of signals allocated to the chip electrodes differ for each type of chip depending on the design contents of the chip. Is often fixed.

For this reason, in conducting a current test of the chip,
A probe card having a card substrate having a wiring pattern corresponding to the type of chip to be inspected must be prepared.

Further, in manufacturing a probe card, the card board cannot be standardized, and the wiring pattern of the card board on which the probe sheet is to be assembled must be designed for each type of chip to be inspected, and the card board must be manufactured. . In particular, the wiring pattern of the card board becomes more complicated as the number of contacts and the number of tester lands increase, and such a complicated wiring pattern must be formed on a large wiring board. Therefore, if a card substrate is manufactured for each type of chip to be inspected, it takes a lot of time and money to manufacture a probe card.

[0011]

Therefore, in a probe card, it is important that a common card substrate can be used even if the types of chips to be inspected are different.

[0012]

A probe card according to the present invention has a plurality of tester lands in a peripheral region and has a plurality of first conductive portions electrically connected to the tester lands inside the tester lands. A card substrate having a plurality of contacts and a plurality of second conductive portions electrically connected to the contacts, the probe assembly being assembled to the card substrate; A plate-like conversion unit removably assembled to the card substrate, the plate-like conversion unit being one or more sheet-like substrates having a plurality of first wirings electrically connected to the second conductive portion, And a conversion unit having a plurality of second wirings for electrically connecting the conductive portions to the first wirings. The first conductive portion and the second wiring are electrically connected via a first protruding electrode formed on the card substrate or the conversion unit.

The second wiring of the conversion unit is formed in a pattern connecting a combination of the first conductive part and the first wiring determined by the type of the chip to be inspected. One or more contacts are used for power, and the remaining contacts are used for signals. The contacts are pressed against the electrodes of the chip and the tester lands are connected to the tester.

Thus, the signal electrode of the chip is connected to the signal contact, the second conductive portion, the first wiring, the second wiring,
It is connected to a predetermined signal channel of the tester via the first conductive part, the tester land, and the like. The power supply electrode of the chip is connected to a predetermined power supply channel of the tester via a power supply contact, an appropriate wiring, a tester land and the like.

When the type of the chip to be inspected is changed, the conversion unit is converted to one having a wiring pattern corresponding to the new chip. Thereby, a new combination of the first conductive portion and the first wiring according to the new chip is connected by the second wiring of the conversion unit.
The electrode of the new chip has a predetermined contact, a second conductive part,
The tester is connected to a predetermined signal channel or power supply channel of the tester via a first wiring, a second wiring, a first conductive portion, a tester land, and the like.

When the conversion unit is replaced, the first conductive portion and the second wiring are electrically connected to each other via the first protruding electrode, so that the first conductive portion and the second wiring are connected to each other. The contact can be made easily and reliably, and the electrical connection can be made easily and reliably.

As described above, according to the probe card of the present invention, a large card substrate can be commonly used for different types of chips, and there is no need to form a complicated wiring pattern on the large card substrate.

The sheet substrate is sandwiched between the card substrate and the conversion unit at one end, and the first and second wirings are formed on the sheet substrate or the second unit formed on the conversion unit. May be electrically connected via the protruding electrodes. In this case, the first and second wirings can be easily and surely brought into contact with each other, and the electrical connection can be easily and reliably performed.

The one or more second wirings may extend in a circumferential direction and a radial direction. By doing so, even if the positional relationship between the contact and the corresponding tester land is largely shifted in the circumferential direction, it is possible to easily form a wiring pattern suitable for the positional relationship on the conversion unit.

[0020] The conversion unit may include a ring-shaped conversion substrate having the second wiring. By doing so, a wiring pattern corresponding to the type of the chip to be inspected can be formed on the conversion board. Therefore, when the type of the chip to be inspected is changed, the conversion having the wiring pattern corresponding to the chip is performed. What is necessary is just to replace it with a board.

In a preferred embodiment, the conversion unit includes a ring-shaped conversion substrate having a plurality of third wirings extending in a circumferential direction and a radial direction, and a sheet-shaped auxiliary substrate stacked on the conversion substrate. The auxiliary substrate includes a plurality of fourth wirings extending in a radial direction, and a plurality of fifth wirings around the fourth wiring and extending in a radial direction,
The fourth wiring is electrically connected to the first and third wirings, and the fifth wiring is electrically connected to the third wiring and the first conductive portion, respectively. , The fourth and fifth wirings together form the second wiring. By doing so, a wiring pattern corresponding to the type of the chip to be inspected can be formed on the conversion board. Therefore, when the type of the chip to be inspected is changed, the conversion having the wiring pattern corresponding to the chip is performed. What is necessary is just to replace it with a board.

The conversion board further includes a plurality of third conductive parts electrically connected to one end of the third wiring and the second conductive part, and another end of the third wiring. And a plurality of fourth conductive portions electrically connected to the first conductive portion. By doing so, the work of connecting the third wiring to the first and second conductive portions is facilitated, so that the first and second wirings can be more easily and surely brought into contact. At the same time, the electrical connection can be made more easily and more reliably.

The auxiliary substrate may have a ring shape having an outer diameter larger than the outer diameter of the conversion board and an inner diameter smaller than the inner diameter of the conversion board. By doing so, the probe assembly and the sheet-like substrate can be arranged inside the virtual ring when viewed in plan, and the card substrate can be arranged outside the ring, so that the probe card design is easy. become.

[0024] The conversion unit may further include a ring-shaped cover having a ring-shaped recess opened to the card board side, the recess having the conversion board and the auxiliary board disposed therein. . By doing so, the positional relationship between the conversion board and the auxiliary board can be maintained by the cover, so that the work of replacing the conversion unit, especially the conversion board, becomes easier.

[0025] The card board may have an opening in the center in the thickness direction, and the probe assembly may have the contact on the lower surface side and be arranged in the opening.
With this configuration, the sheet-like substrate can be arranged on the upper surface side of the probe assembly and the card substrate, and the conversion unit can be arranged on the upper surface side of the card substrate. And the electrical connection work becomes easy.

The probe assembly includes a probe sheet having a plurality of wiring portions formed on an electrically insulating sheet member;
A connection board mounted on a lower surface side of the probe sheet, wherein the second conductive portion penetrates the connection board in a thickness direction and is electrically connected to the wiring portion; The contact may be formed on the wiring portion and protrude downward. In this case, since the needle stand operation is not required as compared with the needle type probe card and the blade type probe card, the manufacture is easy and the cost is low.

In a preferred embodiment, the probe sheet has a plurality of probe regions each including a plurality of probe elements provided with the contacts.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS. 1 to 8, a probe card 10 includes a plurality of semiconductor devices (ie, chips) formed in a matrix on a semiconductor wafer.
It is used for a current test. In the following description, it is assumed that all chips have a rectangular shape and a plurality of electrodes are arranged in a line on each side of the rectangle.

The probe card 10 includes a disc-shaped card board 12, a disc-shaped probe assembly 14 assembled to the card board 12, and a plurality of card boards 12 and a plurality of probes arranged on the upper surface of the probe assembly 14. A sheet-like substrate 16,
An annular conversion unit 18 assembled on the upper surface of the card board 12.

The card substrate 12 is a wiring substrate formed from an electrically insulating material such as polyimide, and has a ring shape having a plane circular opening 20 at the center penetrating in the thickness direction. The probe assembly 14 is arranged. The inner peripheral surface forming the opening 20 is a stepped surface having a smaller diameter portion in the upper part than in the lower part.

The card substrate 12 has a plurality of tester lands 22 in a peripheral area electrically connected to a signal channel or a power supply channel of the tester.
In a region inside the tester land 22, a plurality of conductive portions 26 in a region inside the conductive portion 24, and many tester lands 22 and the outside conductive portion 24 are connected to a plurality of wirings 2.
8 are electrically connected individually.

The conductive portions 24 and 26 can be conductive through holes or rod-shaped members. One or more wires 28
Extend in the radial direction, and the other plurality of wirings 28 extend in the circumferential direction and the radial direction. Therefore, the wiring 28
Are formed in multiple layers. The wiring 2 extending in the circumferential direction and the radial direction (that is, in the direction inclined with respect to the radial direction)
Tester land 22 and conductive part 24 connected by 8
Are shifted in the circumferential direction.

Many tester lands 22 connected to the wiring 28 are used for signals, and the remaining one or more tester lands 22 are used for power supply. The outer conductive portion 24 and the wiring 28 are used for signals. The inner conductive portion 26 is electrically connected to the tester land 22 for power supply by wiring (not shown).

The probe assembly 14 has a rectangular film-shaped probe unit, that is, a probe sheet 30, mounted on the lower surface of a connection board 32 formed of an electrically insulating plate member. The probe sheet 30 is a sheet-like member (film-like member) 3 made of an electrically insulating resin.
6. The probe sheet 30 has a plurality of probe regions 38 corresponding to chips to be inspected in a matrix.

The probe region 38 is defined by virtual boundaries corresponding to the boundaries of the chips on the semiconductor wafer. The probe region 38 has the same rectangular shape as the corresponding chip, and has a plurality of probe element groups corresponding to the electrode groups of the chip. In the illustrated example, four probe element groups respectively corresponding to the rectangular sides are provided.

Each probe element group includes a plurality of probe elements 40 each including one end of the wiring 34, as shown in FIGS. Each probe element 40 is independent of an adjacent probe element 40 by a cutout 42 formed in the sheet-like member 36, and has a protruding electrode or contact 44 formed at one end of the wiring 34 at one end.

Although the contact 44 is a pyramidal projection electrode in the illustrated example, it may be a projection electrode having another shape such as a conical shape, a hemispherical shape, a short columnar shape, a ring shape, a rectangular parallelepiped shape, or the like. Good. Each notch 42 has a U-shape including an arcuate portion on the distal end side and a linear portion extending from the arcuate portion to the space between adjacent probe elements 40.

Each wiring 34 has a corresponding probe element 40
Extends from one end to the inside of the corresponding probe region 38. Therefore, the wiring 34 of the adjacent probe region 38
There is no possibility that they will affect each other. The probe element 40 is integrated at its proximal end with the remaining portion of the wiring 34 and the remaining portion of the sheet-like member 36 and has a cut 4
2 can be bent independently.

The probe elements 40 are linearly arranged so that the contacts 44 are arranged in a line along a virtual straight line for each probe element group. When the chip to be inspected has a plurality of electrodes in a zigzag or in multiple rows on each side of the rectangle, the probe elements 40 are linearly arranged so that the contacts 44 are in a zigzag or multiple rows for each probe element group. Are arranged.

The probe sheet 30 also includes a plurality of conductive portions 46 individually connected to the wirings 34, each of the probe regions 3.
8 in the central area. Each conductive portion 46 is a conductive through hole that penetrates the sheet member 36 in the thickness direction. Each wiring 34 is connected to a probe element 40 so as not to be electrically connected to another conductive part 46 other than the corresponding conductive part 46.
To the corresponding conductive portion 46.

The probe sheet 30 is formed, for example, by first forming wirings 34 on a sheet-like member 36 having electrical insulation and elasticity, such as a polyimide resin, and then forming the sheet-like member 3
6, a through hole for the conductive portion 46 is formed, and then each wiring 3
4 is formed with a contact 44, and then a conductive portion 46 is formed in each through hole.
And then forming the notches 42 to form the probe elements 40. The probe sheet 30 may be formed from a plurality of sheet pieces separated from each other.

The wiring 34 can be formed by a known technique such as a printed wiring technique, and the contacts 44 can be formed by a known technique such as an electroforming method. The slit 42 may be formed after the above process is completed, or may be formed after the probe sheet 30 is mounted on the connection board 32 as described later. The material of the contact 44 can be a metal material, such as nickel, which is harder than the electrode material of the chip to be inspected.

The connecting substrate 32 has a plurality of conductive portions 48 penetrating the connecting substrate 32 in the thickness direction and a plurality of recesses 50 opening downward.
And The conductive portions 48 individually correspond to the wires 34 of the probe sheet 30, and are electrically connected at lower ends to the conductive portions 46 electrically connected to the corresponding wires 34.

The recess 50 is a groove having a rectangular cross section, and is formed at a position corresponding to the tip of the probe element 40 of the probe sheet 30. In the recess 50, a long elastic body 52 such as silicone rubber is arranged in a state where a part thereof protrudes downward. The lower surface of the elastic body 52 protruding from the recess 50 is an arc-shaped surface in a transverse section.

The probe sheet 30 is mounted on the lower surface of the connection board 32 in a state where the contacts 44 project downward and the tip of the probe element 40 is in contact with the elastic body 52. As a result, the tip of the probe element 40 projects slightly below other regions of the probe sheet 30.

The probe sheet 30 and the connection board 32
The two conductive portions 46 and 48 may be assembled by bonding with a conductive adhesive such as solder, or the sheet-like member 36 and the connection board 32 may be press-bonded or bonded directly or via an appropriate material. May be assembled.

The probe assembly 14 is formed by a plurality of screw members on the connection board 32 such that the step formed on the outer peripheral surface of the connection board 32 abuts against the step formed on the inner peripheral face of the probe board 12. It is assembled to the probe substrate 12.

In the illustrated example, eight sheet-like substrates 16 each corresponding to a plurality of probe regions 38 are used. As shown in FIGS. 6 and 7, each sheet-like substrate 16 forms a plurality of wirings 54 individually corresponding to the conductive portions 48 of the connection substrate 32 on an electrically insulating sheet-like member or film 56 such as polyimide. Has formed. Each sheet-shaped substrate 16 has a plurality of conductive portions 58 individually connected to the wiring 54 at one end.

Each conductive portion 58 is a conductive through hole penetrating the film 56 in the thickness direction, and
Are electrically connected to the corresponding conductive portions 48. The sheet-like substrate 16 extends from the probe assembly 14 to the probe substrate 12 with the wiring 54 facing upward, and the other end is sandwiched between the card substrate 12 and the conversion unit 18.

The connection substrate 32 and the sheet substrate 16 may be assembled by bonding the conductive portions 48 and 58 of the two with a conductive adhesive such as solder. May be assembled by pressing or bonding.

The conversion unit 18 includes the ring-shaped cover 6.
0, a pair of plate-like elastic rings 62 and 64 having different diameters and inner diameters, a contactor 44 and a tester land 22.
A ring-shaped conversion board 66 for determining a combination with
A ring-shaped and sheet-shaped connection auxiliary substrate 68 is used to form a plate-shaped ring.

The cover 60 has three recesses 70, 72 and 74 which are opened downward and coaxially. An inner elastic ring 62 is arranged in the inner recess 70, an outer elastic ring 64 is arranged in the outer recess 72, and a conversion board 66 is arranged in the middle recess 74. Elastic rings 62, 6
Reference numeral 4 denotes a plate member made of an electrically insulating material such as silicone rubber.

The conversion board 66 is a wiring board formed of an electrically insulating material such as polyimide, has a plurality of conductive portions 76 in an inner region, has a plurality of conductive portions 78 in an outer region, and has The parts 76 and 78 are electrically connected individually by a plurality of wirings 80. The conductive portions 76 and 78 extend in the thickness direction of the conversion board 66, protrude downward, and penetrate the auxiliary board 68. Conductive parts 76, 78
Can be a conductive rod-shaped member.

The one or more wires 80 extend in the radial direction, and the other wires 80 extend in the circumferential direction and in the radial direction (ie, in a direction at an angle to the radial direction). For this reason, the wiring 80 is formed in multiple layers. The positional relationship between the conductive portions 76 and 78 connected by the wiring 80 extending in the circumferential direction and the radial direction is shifted in the circumferential direction. The amount of deviation of the positional relationship between the conductive portions 76 and 78 in the circumferential direction is
It depends on the type of chip to be inspected.

The auxiliary substrate 68 is composed of a plurality of radially extending inner wirings 82 and a plurality of radially extending outer wirings 84 surrounding the wirings 82 and electrically insulating sheet-like members 86 such as polyimide. And has flexibility. The auxiliary substrate 68 has a protruding electrode 88 at a radially inner end of each inner wiring 84 and a protruding electrode 90 at a radially outer end of each outer wiring 86.

Each of the inner wirings 82 is electrically connected to the conductive portion 76 on the inner side of the conversion board 66, and each of the outer wirings 8
4 is electrically connected to a conductive portion 78 outside the conversion board 66. The material of the protruding electrodes 88 and 90 can be a metal material harder than the electrode material of the chip to be inspected, such as nickel. In the illustrated example, the protruding electrodes 88 and 90 are pyramidal protruding electrodes, but may be protruding electrodes having other shapes such as a conical shape, a hemispherical shape, a short columnar shape, a ring shape, and a rectangular parallelepiped shape. .

The auxiliary substrate 68 is arranged on the lower surface of the conversion substrate 66 with the wirings 82 and 84 facing downward. In this state, the wiring 82 is electrically connected to the conductive part 76 inside the conversion board, and the outer wiring 84 is electrically connected to the conductive part 78 outside the conversion board 66.

The conversion unit 18 includes elastic rings 62, 6
4 are arranged in the recesses 70 and 72 of the cover 60,
6 and the auxiliary substrate 68 are arranged in the recesses 70, 72, 74, and then the projecting electrodes 88 and 90 are respectively connected to the wiring 54 of the sheet substrate 16 and the outer conductive portion 2 of the card substrate 12.
4 and is assembled on the upper surface of the card substrate 12 by the plurality of screw members 92 in this state.

When the chip is inspected, the tester land is connected to the tester 22, and the contacts 44 are pressed against the electrodes of the chip. At this time, since the tip of the probe element 40 protrudes below other regions of the probe region 38, each contactor 44 reliably contacts the electrode of the chip.

The signal electrode of the chip is a signal contact 4
4, wiring 34, conductive portion 48, wiring 54, protruding electrode 88,
Wiring 82, conductive part 76, wiring 80, conductive part 78, wiring 8
4, connected to a predetermined signal channel of the tester via the protruding electrode 90, the conductive portion 24, the wiring 28, and the tester land 22. The power supply electrode of the chip includes a power supply contact 44, appropriate wiring, a conductive portion 26, and a tester land 22.
Is connected to a predetermined power supply channel of the tester.

When the type of the chip to be inspected is changed, the conversion unit 18, especially the conversion board 66 and the auxiliary board 6
8 is converted to one having a wiring pattern corresponding to a new chip. As a result, a new combination of the conductive portions 76 and 78 according to the new chip is connected by the wiring 80 of the conversion unit 18, so that the electrodes of the new chip have predetermined contacts, conductive portions, wiring, tester lands. Is connected to a predetermined signal channel or power supply channel of the tester.

When the conversion unit is replaced, the conductive part 24 and the wiring 84 are electrically connected via the protruding electrodes 90, so that the conductive part 24 and the wiring 84 can be easily and reliably brought into contact. It can be easily and surely electrically connected. Further, one end of the sheet-like substrate 16 is sandwiched between the card substrate 12 and the conversion unit 18 so that the wiring 5
Since the wirings 4 and 82 are electrically connected via the protruding electrodes 88, the wirings 54 and 82 can be easily and surely brought into contact with each other, and the wirings can be easily and surely electrically connected.

As described above, according to the probe card 10, the following effects are obtained.

The large card board 12 can be used in common for different types of chips, and there is no need to form a complicated wiring pattern on the large card board 12.

Since the plurality of wirings 80 extend in the circumferential direction and the radial direction, even if the positional relationship between the contactor 44 and the corresponding tester land 22 is largely shifted in the circumferential direction,
A suitable wiring pattern can be easily formed on the conversion board 66.

Since the wiring pattern according to the type of the chip to be inspected can be formed on the conversion substrate 66, when the type of the chip to be inspected is changed, the conversion substrate having the wiring pattern corresponding to the chip is changed. I just need to replace it.

The wiring 54 of the sheet-like substrate 16 and the conversion substrate 6
6 is connected via the wiring 82 of the auxiliary board 68, and the wiring 80 of the conversion board 66 and the conductive portion 24 of the card board 12 are connected via the wiring 84 of the auxiliary board 68. Since the connection work of 54 and 80 and the connection work of the wiring 80 and the conductive part 24 are facilitated, the first and second wirings 28 and 80 can be more easily and surely brought into contact with each other. Electrical connection can be made easier and more reliably.

Since the positional relationship between the conversion board 66 and the auxiliary board 68 is maintained by the cover 60, the conversion unit 1
8, especially, the replacement work of the conversion board 66 becomes easier.

Since the sheet-like substrate 16 is disposed on the upper surface side of the probe assembly 14 and the card substrate 12 and the conversion unit 18 is disposed on the upper surface side of the card substrate 12, members constituting the probe card 10 are provided. The connection work and the electrical connection work between them are facilitated.

Since the probe sheet 30 is used, the operation of setting the needle is unnecessary, as compared with the case of using the probe card of the needle type and the probe card of the blade type.

Although the illustrated example shows a relatively small number of probe regions 38 and probe elements 40, this is for ease of understanding, and therefore, in practice, the number of chips to be tested at one time is limited. It has a corresponding number of probe areas and a number of probe elements corresponding to the number of electrodes provided on the chip.

Although the above embodiment relates to a probe card for a chip having a plurality of electrodes on each side of a rectangle, the present invention not only includes a probe card for such a chip but also a plurality of electrodes in a row. The present invention can also be applied to a probe card for another chip, such as a chip without a chip, a chip having a plurality of electrodes on each of a pair of opposing sides of a rectangle, and the like.

The present invention is not limited to the above embodiment. The present invention can be variously modified without departing from the gist thereof.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing one embodiment of a probe card according to the present invention.

FIG. 2 is a plan view of the probe card shown in FIG.

FIG. 3 is a bottom view of the probe card shown in FIG. 1;

FIG. 4 is a front view of the probe card shown in FIG. 1;

FIG. 5 is a cross-sectional view taken along line 5-5 in FIG. 2, with a part omitted.

FIG. 6 is an enlarged sectional view of the vicinity of a probe assembly of the probe card shown in FIG. 1;

FIG. 7 is an enlarged sectional view of the outer peripheral portion of the probe card shown in FIG.

FIG. 8 is an enlarged bottom view showing a part of a probe region.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Probe card 12 Card board 14 Probe assembly 16 Sheet board 18 Conversion unit 22 Tester land 24, 26 Conductive part of card board 28 Wiring of card board 30 Probe sheet 32 Connection board 34 Wiring of probe sheet 36 Probe sheet sheet Member 38 Probe area 40 Probe element 44 Contact 46 Conductive part of probe sheet 48 Conductive part of connection board 54 Wiring of sheet-like substrate 56 Film of sheet-like substrate (sheet-like member) 58 Conductive part of sheet-like substrate 60 Cover 62, 64 elastic ring 66 conversion board 68 auxiliary board 70, 72, 74 recess of cover 76, 78 conductive part of conversion board 80 wiring of conversion board 82, 84 wiring of sheet board 86 sheet member of sheet board 88, 90 protrusion electrode

Claims (11)

[Claims] 1. A plurality of first tester lands having a plurality of tester lands in a peripheral region and electrically connected to the tester lands.
A card substrate having the conductive portion of the tester land in a region inside the tester land; and a plurality of contacts and a plurality of second contacts electrically connected to the contacts, the probe assembly being assembled to the card substrate. A probe assembly having a conductive portion; one or more sheet-like substrates having a plurality of first wirings electrically connected to the second conductive portion; and a plate-shaped removably assembled to the card substrate. A conversion unit having a plurality of second wirings for electrically connecting the first conductive part to the first wiring, wherein the first conductive part and the second wiring Is a probe card which is electrically connected to the card substrate or via a first protruding electrode formed on the conversion unit. 2. The sheet-like substrate is sandwiched at one end between the card substrate and the conversion unit,
The probe card according to claim 1, wherein the first and second wirings are electrically connected via a second protruding electrode formed on the sheet-like substrate or the conversion unit. 3. The probe card according to claim 1, wherein the at least one second wiring extends in a circumferential direction and a radial direction. 4. The probe card according to claim 3, wherein the conversion unit includes a ring-shaped conversion board having the second wiring. 5. The conversion unit includes: a ring-shaped conversion substrate having a plurality of third wirings extending in a circumferential direction and a radial direction; and a sheet-shaped auxiliary substrate superimposed on the conversion substrate. The substrate has a plurality of fourth wirings extending in the radial direction, and a plurality of fifth wirings around the fourth wiring and extending in the radial direction, wherein the fourth wiring is the first and the fourth wirings. The third wiring and the fifth wiring are electrically connected to the third wiring and the first conductive portion, respectively, so that the third, fourth, and fifth wirings are shared. 4. The probe card according to claim 1, wherein the second wiring is formed by forming the second wiring. 6. The conversion substrate further includes: a plurality of third conductive portions electrically connected to one end of the third wiring and the second conductive portion; The probe card according to claim 5, further comprising an end portion and a plurality of fourth conductive portions electrically connected to the first conductive portion. 7. The auxiliary substrate has a ring shape having an outer diameter larger than an outer diameter of the conversion board and an inner diameter smaller than an inner diameter of the conversion board. The probe card according to 1. 8. The conversion unit further includes a ring-shaped cover having a ring-shaped recess opening toward the card board, the recess having the conversion board and the auxiliary board disposed therein. The probe card according to claim 7. 9. The card board according to claim 1, wherein the card substrate has an opening in the center in the thickness direction, and the probe assembly has the contact on the lower surface side and is arranged in the opening. The probe card according to any one of the above. 10. The probe assembly, comprising: a probe sheet in which a plurality of wiring portions are formed on an electrically insulating sheet member; and a connection board on which the probe sheet is mounted on a lower surface side. The conductive portion of (1) penetrates the connection board in the thickness direction and is electrically connected to the wiring portion, and the contact is formed on the wiring portion and protrudes downward. 10. The probe card according to any one of 1 to 9. 11. The probe card according to claim 10, wherein the probe sheet forms a plurality of probe regions each including a plurality of probe elements provided with the contacts.