JP2001177011A - Mounting board manufacturing method and mounting board manufactured by the same - Google Patents

Abstract

(57) [Problem] To provide a method for manufacturing a mounting substrate having through conductors embedded at an accurate pitch with good reproducibility. SOLUTION: After a linear conductor 1 is wound around a frame-shaped winding jig 2 under tension, the jig 2 is buried in a softened insulating material, and then the insulating material is solidified to form a block. After that, the block is cut into two or more pieces. The arrangement of the linear conductors may be performed by using a linear conductor placed in a capillary tube instead of the frame-shaped winding jig 2. May be carried out using a plate of an insulating material filled with. Alternatively, it is possible to use a linear conductor coated with a thermoplastic resin and insert it into a through hole formed in a plate of an insulating material to manufacture a mounting board, or cut and bundle them to form a block. May be used to manufacture a mounting substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board, and more particularly, to a method of manufacturing a mounting board having a conductor penetrating a conductive material useful for a wiring board for mounting electronic components such as a semiconductor device. The present invention relates to a mounting substrate manufactured by the method described above.

[0002]

2. Description of the Related Art Various types of mounting boards, such as printed wiring boards, for mounting electronic components such as semiconductor devices such as ICs and LSIs have been proposed. With the progress of higher performance and higher integration, mounting substrates are required to have high flatness and smoothness.

[0003] Glass is very suitable for a high-density mounting substrate because a very high smoothness can be obtained by polishing. However, it is difficult to make the upper and lower surfaces of the glass conductive with the glass substrate as it is.

Therefore, as a general method of providing conduction between the upper and lower surfaces of the glass substrate, there is a method of forming a through hole in the glass substrate and metalizing the wall surface of the through hole by plating. A laser beam is applied to open a through-hole, or a glass substrate, such as photosensitive glass, which has a through-hole formed in advance, and the wall surface of the through-hole is metallized by a plating method. It is possible to make the lower surface conductive.

[0005] However, such a plating method has several disadvantages. First, the cost is increased due to the long process. Secondly, since the conductor is formed by the plating method, the type of the conductor is limited. Due to the large restrictions and the recent demand for higher density integration of semiconductor devices,
It is necessary to wire at a fine pitch of not more than 00 μm, but in the case of a glass substrate, it is very difficult to form a through hole while preventing breakage of glass at such a fine pitch, Can be mentioned.

In order to solve such a problem in the plating method, it has been proposed to manufacture a mounting substrate by embedding the conductor in a state where the conductor is oriented in the thickness direction of the glass substrate and then slicing the glass substrate. (If necessary, refer to Japanese Patent Application Laid-Open No. 10-190190).

As shown in FIG. 3A, first, a molten glass 24 heated and melted using a crucible 23 is poured into a forming frame 21 on which a linear conductor 22 is stretched. In this case, the linear conductor 22 is always kept under tension, and is made of Au, W, Pt, Kovar, stainless steel, or the like. It is not necessary that the glass be in a lump or a powder form be filled in a molding frame and then heated and melted.

Next, as shown in FIG. 3 (b), the molten glass 24 is gradually cooled to room temperature to solidify the molten glass 24 into a glass block 25, and then the molding frame 21 is removed.

Next, as shown in FIG. 3C, the glass block 26 is cut along a cutting line 26 shown by a broken line.

Next, as shown in FIG. 3D, the cut surface of the cut glass substrate 27 is polished,
A mounting board with the through conductor 28 exposed on the upper and lower surfaces is obtained.

[0011]

However, in the above-described method of manufacturing a mounting board, how to apply a conductor to a molding frame and how to always apply tension to the conductor are described. No specific method is disclosed at all, and no specific method for how to remove the molding frame is disclosed.

For example, if the method of applying tension is insufficient,
At the time of heating, it becomes loose and non-parallel, and in extreme cases, there arises a problem that adjacent linear conductors come into contact with each other to cause an electrical short circuit.

Accordingly, the above proposal suggests a mounting substrate having through conductors embedded at an accurate pitch as designed, and in particular, a mounting substrate in which the through conductors are embedded two-dimensionally on the surface of the mounting substrate. It was completely unknown how to manufacture the substrate.

Therefore, the present invention provides a mounting board having through conductors embedded at an accurate pitch as designed.
It is an object of the present invention to provide a method capable of manufacturing such a mounting board with good reproducibility.

[0015]

According to a first aspect of the present invention, a method of manufacturing a mounting substrate according to the present invention uses a frame-shaped winding jig capable of winding a linear conductor under tension. Manufacture mounting boards. Specifically, in this mounting board manufacturing method, after winding a linear conductor on a frame-shaped winding jig under tension, the frame-shaped winding jig is buried in a softened insulating material. Then, after solidifying the softened insulating material into an insulator block, the insulator block is cut into two or more pieces to form a front-to-back conductive substrate in which a linear conductor penetrates both the front and back surfaces. Features.

In a second aspect, a method of manufacturing a mounting substrate according to the present invention includes the steps of manufacturing a mounting substrate using a capillary made of a material having a higher melting point than an insulating material of the mounting substrate for arranging linear conductors. I do. Specifically, the mounting substrate manufacturing method according to this aspect includes a step of passing a linear conductor through a capillary made of a material having a higher melting point than the insulating material of the mounting substrate, and a step of passing the capillary and the insulating material through the linear conductor. And a step of cutting the obtained block at the same time.

Blocking of the capillary tube and the insulating material through the linear conductor by heat treatment can be performed, for example, by (1) arranging the capillary tube through the linear conductor between the plates of the insulating material,
Heat-treating the plate of insulating material, the capillary and the conductor at the same time, or (2) arranging the capillary between the grooves of the insulating material so as to enter the respective grooves, and simultaneously heat-treating the plate of the insulating material, the capillary and the conductor. Or (3) burying the capillaries in the insulating material powder in the same direction, and heat-treating the insulating material powder, the capillaries and the conductor simultaneously.

In a third aspect, the present invention provides a method for manufacturing a mounting board, comprising the steps of: forming an insulating material plate having grooves in which linear conductors can be arranged; and inserting an insulating material inserted between these insulating material plates. A mounting board is manufactured by using the paste. Specifically, this method of manufacturing a mounting board is such that a linear conductor is put in a groove formed in a plate of an insulating material, and the plate of the insulating material is stacked with an insulating paste interposed therebetween. The method includes a step of forming a stack, a step of heat-treating the stack while applying pressure in the stacking direction to form a block, and a step of cutting the obtained block.

In a fourth aspect, a method of manufacturing a mounting board according to the present invention is directed to a mounting board using a board of an insulating material in which a groove is filled with a conductor and a paste of the insulating material inserted between the boards of the insulating material. To manufacture. Specifically, this mounting board manufacturing method includes a step of filling a groove formed in a plate of an insulating material with a conductor, and stacking the plate of the insulating material with an insulating paste interposed therebetween. A step of forming a body, a step of heat-treating the stack while applying pressure in the stacking direction to form a block, and a step of cutting the obtained block.

According to a fifth aspect of the present invention, in a method of manufacturing a mounting board according to the present invention, a mounting board is manufactured using a plate made of an insulating material having through holes and a linear conductor covered with a thermoplastic resin. Specifically, this method of manufacturing a mounting board includes a step of putting a linear conductor coated with a thermoplastic resin into a through hole formed in a plate of an insulating material, and a step of putting a plate of the insulating material and a conductor and a thermoplastic resin. At the same time.
According to this method, it is possible to obtain a mounting substrate having a plate of an insulating material and a conductor whose periphery is covered with a thermoplastic resin and which is embedded in the plate of the insulating material such that an end face is exposed on the front and back surfaces thereof.

According to a sixth aspect, in a method of manufacturing a mounting board according to the present invention, a mounting board is manufactured using a linear conductor coated with a thermoplastic resin. Specifically, this mounting board manufacturing method includes a step of forming a bundle of linear conductors of a predetermined length covered with a thermoplastic resin, a step of heat-treating the bundle and blocking the obtained bundle, And cutting the same.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a method for manufacturing a mounting board according to a first aspect of the present invention will be described with reference to FIG. FIG.
Also shows a schematic configuration of a jig used for carrying out this method. As shown in this figure, first, a wire-shaped conductor 1 is wound around a frame-shaped winding jig 2 under tension, and the frame-shaped winding jig 2 is softened by an insulating material (not shown). After the jig 2 around which the conductor 1 is wound and the insulating material are solidified by solidifying the softened insulating material, the block is cut into two or more pieces to obtain a linear conductive material. A front and back conductive substrate having a body penetrated on both sides is obtained.

As described above, by using the frame-shaped winding jig 2, the linear conductor 1 can be stretched with a stable tension, so that the adjacent linear conductors 1 come into contact with each other. Since the linear conductors 1 can be arranged in two rows by one frame-shaped winding jig 2 without short-circuiting, the mounting having the through conductors arranged in two rows at regular minute pitches A substrate can be realized. Also,
The row pitch can be arbitrarily set according to the thickness of the frame-shaped winding jig 2. In order to maintain the tension of the linear conductor 1 and maintain a minute pitch, the jig 2 is preferably provided with a groove or a notch (not shown) for fixing the conductor in a predetermined position.

It is also possible to stack a plurality of frame-shaped winding jigs 2 formed by winding the linear conductors 1 under tension and to embed them in a softened insulating material after laminating them via a spacer 3. is there. In this manner, by stacking a plurality of frame-shaped winding jigs 2 in which the linear conductors 1 are wound under tension and via the spacers 3, the front and back conductive substrates arranged in four or more rows are reproduced. It is possible to realize a mounting board having an arbitrary row pitch depending on the thickness of the spacer 3. In this case, the thickness of the frame-shaped winding jig 2 or the thickness of the spacer 3 may be different in the same mounting substrate.

Referring now to FIG. 2, an embodiment of the present invention using a frame-shaped winding jig will be described in more detail. In addition,
FIG. 2A is an exploded perspective view of the manufacturing apparatus used in this embodiment, and FIG. 2B is a partial perspective view of a frame-shaped winding jig constituting the manufacturing apparatus.

The manufacturing apparatus shown in FIG.
2, a frame-shaped winding jig for winding a linear conductor 20, which is made of a tungsten (W) wire and is an embedded conductor
1. Spacer 13 having through-holes 14 for spacing frame-shaped winding jigs 11 by a predetermined row pitch, each through-hole 1
2 and 14, the frame-shaped winding jig 11 and the spacer 13
Fixing jig 15 for fixing the fixing member, a frame-shaped pressing member 16 having a through-hole 17 and pressing the frame-shaped winding jig 11 and the spacer 13 from above, and the whole is fixed via the frame-shaped pressing member 16. And assembled in a crucible 19. In order to maintain the tension of the linear conductor 1 and maintain a fine pitch, the frame-shaped winding jig 2 is provided with a means (not shown) such as a groove or a notch capable of fixing the conductor in a predetermined position. Is preferred.

Spacer 13, fixing jig 15, and crucible 1
9 is preferably made of a material having poor wettability with an insulating material such as glass, such as zirconium. By using a material having poor wettability with the insulating material, at least the spacer 13 and the fixing jig 15 can be easily extracted from the block obtained after the heat treatment. It is possible to reuse the pressing member 16 and the like. When the insulating material is glass, it is more advantageous to use, instead of zirconium, boron nitride having a lower wettability with glass. Alumina or the like, which is usually used as a material for the crucible 19, is not preferable because it has good wettability with glass, and the block formed by the heat treatment reacts with the alumina in the crucible so that the block cannot be extracted.

FIG. 2B is a partial perspective view of the frame-shaped winding jig 11 used in the apparatus described with reference to FIG. 2A. The jig 11 has, for example, a thickness t of 1.27 mm. The length L in the direction in which the linear conductor 20 is wound is 100 mm, and the length in the direction perpendicular to the direction is 80 mm. The frame-shaped winding jig 11 can be made of a heat-resistant material such as zirconium.

The frame-shaped winding jig 11 has a tungsten wire having a diameter of 0.15 mm (coefficient of thermal expansion: 4.5 ×) capable of withstanding the working point temperature of glass powder of, for example, Corning glass 7740 (trade name). 10 ^-6 ° C ^-1 , melting point 3653
C.), for example, to form a pitch d of 1.27 mm. When winding the wire, the wire is wound under tension so as not to loosen at the working point temperature of the glass used. The jig 11 has a groove (not shown) for maintaining the tension and the pitch of the wire.

The frame-shaped winding jig 11 on which the linear conductor 20 is wound as described above is, for example, 1.27 having the same thickness as the jig 11.
The stacked body is assembled by stacking via the spacer 13 of mm. For example, the inventors set the frame-shaped winding jig 11 to 12
A stack was assembled by alternately stacking 13 pieces and 13 pieces of spacers 13.

Next, an embodiment of the present invention using a frame-shaped winding jig will be described. First, after assembling the above-mentioned jig and spacer (both made of boron nitride) using a part made of boron nitride in a crucible 19 made of boron nitride, glass powder of glass 7740 (trade name) manufactured by Corning Incorporated is used. Is weighed and placed in the crucible 19. The Corning glass 7740 (trade name) is made of borosilicate, has a coefficient of thermal expansion of 3.25 × 10 ⁻⁶ ° C. ⁻¹ , a melting point of 821 ° C., and a working point of 1 °.
The density was 252 ° C., the density was 2.23 g / cm ³ , and the coefficient of thermal expansion was the coefficient of thermal expansion (4.0 × 1) of the silicon (Si) wafer constituting the semiconductor device mounted on the manufactured mounting substrate.
0 ^-6 ° C ^-1 ) and the thermal expansion coefficient of a tungsten wire (4.5
× 10 ^-6 ° C ^-1 ).

Next, the crucible 19 is covered with a lid (not shown) from above and below so as to cover the entire crucible 19, and placed in an N ₂ atmosphere furnace, and fired near the working point of glass for 3 to 4 hours. The glass powder is melted to block the wire and glass. The reason why the N ₂ atmosphere furnace is used is that when the tungsten wire is fired at a high temperature in an atmospheric furnace, the tungsten wire is oxidized and dispersed in the glass.

Next, the glass was gradually cooled to near the melting point so that cracks did not enter the glass, and then cooled to room temperature. Then, the crucible 19 was taken out of the N ₂ atmosphere furnace, and the screws 18 were removed.
The block together with the jig is taken out of the crucible 19. in this case,
Since boron nitride has poor wettability with glass, the rod-shaped fixing jig 15 fixed in the crucible 19 remains in the crucible 19.

Next, utilizing the poor wettability with glass, the frame-shaped pressing member 16 and the spacer 13 are extracted from the block, and then the frame-shaped winding jig 11 is cut together with the block to form a frame-shaped winding jig. The tool 11 is removed.

Next, the cut glass block is cut into a predetermined thickness perpendicular to the axial direction of the linear conductor 20, for example, 2.
After slicing to a thickness of 0 mm, 0.1
While polishing with a diamond disc of μm or less, the four side faces are chamfered, and the warpage of the surface is 3 μm /
cm or less. Thereafter, formation and patterning of a conductive thin film for forming electrodes or wiring layers connected to the conductors exposed on the front and back surfaces of the substrate are performed, and further, an insulating film and other wiring layers are formed as necessary, and mounted. The substrate is completed. The formation of these electrodes, wiring layers, and insulating films can be performed by a well-known method, and does not need to be described in detail here.

As described above, in this embodiment, since the linear conductors 20 are wound using the frame-shaped winding jig 11, they are wound at a high precision pitch and under a stable tension. A high-density mounting substrate that can be embedded in glass and has no short circuit between the embedded linear conductors 20 can be realized.

Further, since the plurality of frame-shaped winding jigs 11 are laminated via the spacers 13, a high-density mounting board in which the linear conductors 20 are embedded in a two-dimensional matrix having a highly accurate column pitch. Can be realized.

Further, Si constituting the semiconductor device to be mounted is
Since the mounting substrate is composed of glass and linear conductors having the same thermal expansion coefficient as the wafer, when semiconductor devices are mounted, they are excellent in environmental resistance, especially in heat resistance, in high temperature environments. When operated, the mounted semiconductor device does not fall off due to thermal expansion.

Next, another embodiment of the present invention using a frame-shaped winding jig will be described. First, after assembling the above jig in a crucible 19 made of zirconium, glass powder of glass MSX-81P (trade name) manufactured by Nippon Fellow Co., Ltd. is weighed and put into the crucible 19. Nippon Fellow glass MSX-81P (trade name) is a glass containing lead oxide, has a coefficient of thermal expansion of 10 × 10 ^-6 ° C. ^-1 and a softening point of 38.
The working point is 0 ° C., the working point is 1252 ° C. or less (approximately 600 ° C.), the density is 6.23 g / cm ³ , and the coefficient of thermal expansion is the coefficient of thermal expansion of the Si wafer constituting the semiconductor device mounted on the manufactured mounting board ( Although it is larger than 4.0 × 10 ⁻⁶ ° C. ⁻¹ ), the fluidity is good.

In this example, the frame-shaped winding jig 11
A platinum (Pt) wire having a diameter of 0.15 mm (thermal expansion coefficient: 9.1 × 10 ⁻⁶ ° C. ⁻¹ , melting point: 2042 ° C.) that can withstand the working point temperature of the glass powder of MSX-81P (trade name) was used. For example, it is wound so as to have a pitch d of 1.27 mm. When winding the Pt wire, it is wound under tension so as not to loosen at the working point temperature.

Next, a lid (not shown) is placed on the crucible 19 from above and below so as to seal the crucible 19, and the crucible 19 is placed in an atmospheric furnace, and is baked for 3 to 4 hours near the glass working point to obtain glass powder. To block the wire and glass.
In this case, the working point temperature of glass MSX-81P (trade name) manufactured by Nippon Fellow Co., Ltd.
Since the firing temperature is lower than the working point temperature of (trade name), the firing temperature is low, and the Pt wire is hardly oxidized. Therefore, the Pt wire does not disperse in the glass due to oxidation during firing.

Thereafter, in the same manner as in the above-described example, the glass is gradually cooled to a temperature near the melting point so that cracks do not enter the glass, then cooled to room temperature, the crucible 19 is taken out of the atmospheric furnace, and then the screw 18 is removed. Then, the block is taken out of the crucible 19 together with the jig. In this case, since zirconium has poor wettability with glass, the rod-shaped fixing jig 15 fixed in the crucible 19 remains in the crucible 19.

Next, after taking out the frame-shaped pressing member 16 and the spacer 13 from the block by utilizing the poor wettability with the glass, the frame-shaped winding jig 11 is cut together with the block to form the frame-shaped winding jig. The tool 11 is removed.

Next, the sliced glass block is sliced to a predetermined thickness, for example, 2.0 mm, and the front and back surfaces are polished with a diamond disk of 0.1 μm or less, and the four side surfaces are chamfered. Thus, the front and back through substrate has a surface warpage of 3 μm / cm or less. Thereafter, formation and patterning of a conductive thin film for forming electrodes or wiring layers connected to the conductors exposed on the front and back surfaces of the substrate are performed, and further, an insulating film and other wiring layers are formed as necessary, and mounted. The substrate is completed.

As described above, in this example, the glass MSX-8 manufactured by Nippon Fellow Co., Ltd.
Since 1P (trade name) is used, the glass can enter between the pitches of the Pt wire without any gap.
Is more reliable. Other effects such as high-density mounting are substantially the same as those in the above-described example. In addition,
Nippon Fellow Glass MSX-81P (trade name)
It is a glass containing lead oxide, and when fired in an oxygen-free atmosphere, lead precipitates and the deposited lead reacts with the Pt wire, so firing in an oxygen-containing atmosphere, typically in the air, is required. .

Next, a method of manufacturing a mounting substrate using a capillary made of a material having a higher melting point than the insulating material of the mounting substrate for arranging the linear conductors will be described. In this case, the capillary is manufactured from a material having a melting point higher than the melting point of the insulating material such as glass, which constitutes the mounting substrate to be manufactured, and which does not react with the insulating material or the conductor material at the high temperature used for the heat treatment. . The capillary material needs to have a melting point much higher than the melting point of the insulating material, and it is preferable that the difference between the two is, for example, at least about 500 to 600 ° C. As an example, when glass is used as the insulating material, quartz can be preferably used as the capillary material. As the capillary material, an electrically insulating material is generally used, but for the purpose of the present invention, the capillary material may be conductive.

A linear conductor material constituting the conductor of the mounting board is inserted into the capillary. The linear conductor material may be a wire of the conductor material, and its diameter may vary depending on the mounting substrate to be manufactured. Usually, a wire having a diameter of 1 mm or less is used. Can also be used.

The capillary passing through the linear conductor can be formed by (1) arranging the capillaries between the plates of the insulating material so as to be aligned, and heat-treating the plate of the insulating material, the capillaries and the conductor simultaneously, or (2) forming a groove. The capillaries are arranged in the respective grooves between the plates of the insulating material, and the heat treatment is performed on the plates of the insulating material, the capillaries and the conductor at the same time, or (3) the capillaries are aligned and buried in the powder of the insulating material. Then, by simultaneously heat-treating the insulating material powder, the capillary and the conductor, the insulating material is blocked together with the insulating material. This blocking can be performed by putting a combination of each material to be subjected to the heat treatment in a container such as a crucible and heating. The heating temperature is set to a temperature at which the insulating material is melted but the capillary material (and the conductor therein) is not melted. By melting only the insulating material by heating at such a temperature and then cooling, a block in which the linear conductor is embedded in the insulating material is obtained.

The block thus obtained can be sliced into a predetermined thickness to form a mounting board. The surface of the mounting substrate can be polished and smoothed as necessary, and an electrode, a wiring layer, or an insulating film can be formed on the surface.

When selecting a linear conductor and an insulating material,
In order to prevent cracks and the like from occurring in the manufactured substrates, it is desirable that the thermal expansion coefficients be close to each other. In addition, it is better to remove the gaps and the like between the capillary material and the linear conductor by improving the compatibility between the capillary material and the linear conductor, because the wet process when the wiring and the like are formed on the completed substrate causes moisture to penetrate into the substrate and the wiring and the like. This is preferable because the possibility of swelling can be prevented.

When a combination of a capillary and a linear conductor is used, the following advantages are obtained. First, by heat-treating a capillary having a higher melting point than the insulating material, that is, having higher heat resistance than the insulating material, together with the insulating material, the capillary is not melted or softened even in a state where the insulating material is molten. The insulating material can be melted while maintaining the tension applied to the conductor (while maintaining the position of the linear conductor in the capillary), and the linear conductor is cut or sagged by heat in the process of blocking. It can eliminate the problem of sluggishness. This facilitates the production of a highly reliable mounting substrate in which the conductor penetrates the front and back of the substrate and has no short circuit between adjacent conductors.

Secondly, by using a material having a very high melting point, such as quartz, as a capillary material, borosilicate glass or the like having a high melting point but a small coefficient of thermal expansion can be used as an insulating material. A suitable substrate having a small coefficient of thermal expansion can be manufactured.

An example of manufacturing a mounting substrate using a combination of a capillary and a linear conductor will be described with reference to the drawings.

First, the block of (1)
To explain the example, as shown in FIG.
Quartz (working point: around 2300 ° C, coefficient of thermal expansion: 1 × 10
^-6° C ^-1Before and after) Capillary tube 41 (outer diameter: 0.40 mm)
0.15 mm outer diameter tungsten wire 42 (thermal expansion
Number: 4.5 × 10^-6° C^-1, Melting point: 3653 ° C).
The capillary 41 containing the tungsten wire is 1 m thick.
m Pyrex glass manufactured by Corning
Number: 4 × 10^-6° C^-1Before and after, working point: around 1250 ° C)
It is arranged in a certain direction at a certain interval between the plates 43. With wire
In order to fix the position of the capillary 41, both ends of the wire 41
A heat resistant metal (not shown)
And desirable.

Next, the capillary tube 41 with wire and the glass plate 43 are placed in a container 44 made of Denki Kagaku Kogyo Co., Ltd. made of boron nitride having a purity of 99% or more, and the container is sealed with a lid 45 made of boron nitride. The glass is melted by heat treatment in an atmosphere furnace at 1250 ° C. for 3 hours. Since the glass after melting is heat-treated near the working point, the glass plates are integrated into a block shape together with the capillary tube 41 containing the wire. In order to prevent cracks and the like in the glass of the block, the container 44 is gradually cooled to around the melting point (around 800 ° C.) in the furnace, and then taken out of the furnace while being cooled to room temperature.
The block (not shown) is taken out of the container 44 and removed if there is a weight for fixing the position of the wire 42. Next, the taken-out block is sliced to a desired thickness to obtain a substrate on which wires penetrate the front and back. Polish the substrate surface after slicing and chamfer the four sides so that they do not interfere with subsequent steps. Subsequently, formation and patterning of a conductive thin film for forming an electrode or a wiring layer connected to a conductor exposed on the front and back surfaces of the substrate are performed, and further, an insulating film and other wiring layers are formed as necessary, and mounted. Complete the substrate.

Next, an example of blocking according to the above (2) will be described. As shown in FIG. 5, an outer diameter of 0.15 m was placed in a boron nitride container 54 having a purity of 99% or more manufactured by Denki Kagaku Kogyo.
m germanium (Ge) wire 52 (thermal expansion coefficient:
5.7 × 10 ⁻⁶ ° C. ⁻¹ , melting point: 960 ° C.), quartz capillary tubes 51 having an inner diameter of 0.15 mm and arranged in a fixed direction at a constant interval, and MSX- manufactured by Nippon Fellows Co., Ltd. A glass powder 55 of 82P (thermal expansion coefficient: 4.2 × 10 ⁻⁶ ° C. ⁻¹ , working point: 1000 ° C.) is filled. Incidentally, the boron nitride container 54 is provided with a tapered portion 56 in consideration of a volume reduction due to melting of the glass powder 55 in the container. The volume reduction when using glass powder is quite large, about 3 times the volume of the block to be made.
The container 54 should be designed to have a capacity to allow for this, since it consumes up to six times the volume of glass powder.

The container 54 containing the wire-containing capillary tube 52 and the glass powder 55 is sealed with a lid 57, and heat-treated at 1,000 ° C. for 3 hours in a furnace in a nitrogen atmosphere, and the glass powder 55 and the germanium wire 52 are heated. Is melted. This melting blocks the glass together with the capillary tube 52 containing the wire. In order to prevent cracks in the glass of the block, the container 54 is gradually cooled in the furnace to a temperature near the softening point (630 ° C.) of the glass powder, and then the container 54 is taken out of the furnace while being cooled to room temperature. Block from container 54 (not shown)
And slicing to obtain a substrate having a desired thickness. The surface of the substrate after the slicing is polished and the side surfaces are chamfered so as not to hinder the subsequent steps. Subsequently, the formation and patterning of a conductive thin film forming an electrode or a wiring layer connected to the conductor exposed on the front and back surfaces of the substrate are performed,
Further, an insulating film and other wiring layers are formed as necessary, and the mounting substrate is completed.

Next, an example of blocking according to the above (3) will be described. As shown in FIG. 6, a 0.15 mm outer diameter germanium wire 62 (thermal expansion coefficient: 5.7 × 10 ⁻⁶ ° C. ⁻¹ , melting point: 96) in a quartz capillary 61 having an inner diameter of 0.15 mm.
0 ° C). Pyrex glass manufactured by Corning (Coefficient of thermal expansion: about 4 × 10 ^-6 ° C ^-1 ; working point: 12
A groove 67 is dug in a certain direction at a certain interval on the surface of the plate 63 (at about 50 ° C.) so that the capillary 61 can be inserted therein, and MSF-82P (manufactured by Nippon Fellow Co., Ltd.)
Spray glass powder (not shown) of 4.2 × 10 ⁻⁶ ° C. ⁻¹ , working point: 1000 ° C.). The capillaries 61 are arranged one by one in the groove 67, and M
While packing SX-82P glass powder (not shown),
Another glass plate 63 is stacked. This operation is repeated a predetermined number of times to form a stacked body 68 in which the glass plates 63 are stacked with the wire-containing capillary tube 61 interposed therebetween.

The obtained stack 68 is placed in a boron nitride container 64 having a purity of 99% or more manufactured by Denki Kagaku Kogyo Co., Ltd.
Seal 4 Next, the container 64 is transferred to a furnace and heat-treated in a nitrogen cloud atmosphere at 1000 ° C. for 3 hours to block the glass (Pyrex glass and MSX-82P) together with the wire-containing capillary tube 61. In order to prevent cracks in the glass of the block, MSX-82P
The glass powder is gradually cooled to around the softening point (630 ° C.), then cooled to room temperature, and the container 64 is taken out of the furnace. Subsequently, a block (not shown) is removed from the container 64 and sliced to obtain a substrate having a desired thickness. The surface of the substrate after the slicing is polished and the side surfaces are chamfered so as not to hinder the subsequent steps. Subsequently, formation and patterning of a conductive thin film for forming an electrode or a wiring layer connected to a conductor exposed on the front and back surfaces of the substrate are performed, and further, an insulating film and other wiring layers are formed as necessary, and mounted. Complete the substrate.

Next, a description will be given of a method of manufacturing a mounting substrate using a plate of an insulating material having grooves and a paste of the insulating material.
As the plate of the insulating material forming the groove, a glass plate as mentioned in the above example can be used. The groove can be easily formed by a known method such as etching.

The paste can be prepared using an insulating powder such as a glass powder. The powder is preferably selected such that its melting point is lower than the melting point of the plate material,
By doing so, the paste material is melted while maintaining the tension and the posture applied to the linear conductor accommodated in the groove of the plate material, and the plate of the insulating material is integrated with the linear conductor into a block shape. Can be. Generally, the paste is prepared by mixing the insulating material powder and the binder with a small amount of liquid, and the binder and the liquid component are removed before the heat treatment for blocking.

The linear conductor housed in the groove of the plate of insulating material may be a wire of conductor material as mentioned above. Put such a linear conductor in the groove of the plate of insulating material, put the insulating material plate in the same way with another plate with the linear conductor in the groove, and put a paste between them A stack is formed by stacking another plate (a groove is formed at a position corresponding to the position of the conductor contained in the plate below) on top of the stack. Next, a heat treatment is applied to the stacked body under pressure to melt the paste, and the plates of the insulating material are joined together to form a block including the linear conductor. The block thus formed is sliced to a predetermined thickness,
It can be a mounting substrate. The surface of this mounting substrate can be polished and smoothed as necessary.

An example of a method of manufacturing a mounting board using a plate of an insulating material having grooves and a paste of the insulating material will be described with reference to FIG.

First, a semicircle (diameter) was placed on the surface of a 1.27 mm thick Pyrex glass plate manufactured by Corning (thermal expansion coefficient: about 4 × 10 ⁻⁶ ° C.- ¹ ; working point: about 1250 ° C.). 0.15 mm) grooves 72 are dug at a pitch of 1.27 mm. Nippon Fellows glass powder MSX-82P (Coefficient of thermal expansion: 4.2 × 10 ^-6 ° C ^-1 , working point: 1000 ° C)
570 g and a binder BR-101 manufactured by Sekisui Chemical Co., Ltd.
(Glass transition point: around 260 ° C) 30g and 15mmφ
The Al ₂ O ₃ balls are mixed in a ball mill for 5 hours or more in a dry system. A few drops of terpineol are added to the mixture, and the mixture is mixed for 3 hours or more with a grinder to prepare a glass paste. This paste is applied to the surface joined to another glass plate after the glass plate 71 to form a paste layer 74. A tungsten wire 73 having a diameter of 0.15 mm (coefficient of thermal expansion: 4.5 × 10 ⁻⁶ ° C. ⁻¹ , melting point: 3653 ° C.) is inserted into the groove 7.
Put in 2. It is desirable to attach heat-resistant weights to both ends of the wire 73.

A plurality of glass plates 71 accommodating the wires 73 in the grooves 72 on the upper surface are stacked so that the positions of the grooves 72 are aligned with each other, and another plate 71 is placed on the top, and the stack 78 To form This stack 78 was made of a container 7 made of boron nitride having a purity of 99% or more manufactured by Denki Kagaku Kogyo.
Put in 5. A heat-resistant lid (not shown) made of zirconia is placed on the stack 78 and hermetically closed, and the container 75 is placed in a heating furnace. First, the container 75 containing the stack 78 is placed in 35
Heat treatment in the air at about 0 ° C. for several hours to remove the binder component in the paste. Then, the container 7 containing the stack 78 is
5 is heat-treated in a nitrogen atmosphere at 700 ° C. under a heat treatment condition of several tens of minutes, and the stacked body 78 is blocked by pressure bonding with a molten paste. In order to prevent cracks and the like of the glass of the obtained block, the MSX-82P glass powder is gradually cooled in the furnace to near the melting point (630 ° C.), then cooled to room temperature, and the container 75 is taken out of the furnace. Then container 7
A block (not shown) is removed from 5 and sliced to obtain a substrate having a desired thickness. The surface of the substrate after the slicing is polished and the side surfaces are chamfered so as not to hinder the subsequent steps. Subsequently, formation and patterning of a conductive thin film for forming an electrode or a wiring layer connected to a conductor exposed on the front and back surfaces of the substrate are performed, and further, an insulating film and other wiring layers are formed as necessary, and mounted. Complete the substrate.

Next, a method of manufacturing a mounting board using a plate of an insulating material in which a conductor is filled in a groove and a paste of the insulating material will be described. As the plate of the insulating material having the groove, a glass plate as mentioned above can be used. The paste is also as mentioned above.

In this method, a conductive material is filled in the groove of the insulating material plate instead of inserting a wire into the groove. As the conductive material, any material can be used as long as it can fill the grooves of the insulating material plate. However, the conductive material preferably has a thermal expansion coefficient close to that of the insulating material. For example, when glass is used as the insulating material, silicon (Si) can be used as the conductive material. When silicon is used, the grooves of the plate of insulating material can be easily filled by a known method such as chemical vapor deposition (CVD).

A plurality of plates of an insulating material having grooves filled with a conductor are stacked with a paste interposed therebetween.
Form a stack. Next, a heat treatment is performed while the stack is being pressurized to melt the paste, and the plates of the insulating material are joined to form a block including a conductor. The block can be sliced to a predetermined thickness to form a mounting substrate, and the mounting substrate can be polished and smoothed as necessary.

An example of a method of manufacturing a mounting board using a plate of an insulating material in which a conductor is filled in a groove and a paste of the insulating material will be described.
This will be described with reference to FIG.

First, as shown in FIG. 8A, a 1.27 mm thick Pyrex glass manufactured by Corning (thermal expansion coefficient: about 4 × 10 ⁻⁶ ° C.- ¹ ; working point: about 1250 ° C.) One side of the plate 81 (thickness: 1.27 mm) has a depth of 0.1
A 5 mm groove 82 is dug at a pitch of 1,27 mm, and a silicon (Si) film 83 is formed on this surface by a CVD method to a thickness of 150 μm. After that, the S on the portion of the glass plate 81 where the groove is not dug
The i film is removed by reactive ion etching (RIE) (FIG. 8B).

Next, glass powder MS manufactured by Nippon Fellow Co., Ltd.
570 g of X-82P (coefficient of thermal expansion: 4.2 × 10 ⁻⁶ ° C. ⁻¹ , working point: 1000 ° C.) and 30 g of binder BR-101 manufactured by Sekisui Chemical Co., Ltd. (glass transition point: around 260 ° C.)
Is mixed in a ball mill for 5 hours or more in a dry system. A few drops of terpiol are added to the mixture, and the mixture is mixed for at least 3 hours with a raiser to prepare a glass paste. This paste is applied to the surface of the glass plate 81 in which the grooves 82 are filled with Si, as shown in FIG.

Subsequently, these glass plates are stacked, and a glass plate without a groove is placed on the top, and the stack 86 (FIG. 8)
(D)), and this is the purity manufactured by Denki Kagaku Kogyo Co., Ltd.
The container 87 is made of 99% or more boron nitride. A heat-resistant lid (not shown) made of zirconia is placed on the stack 86 and hermetically closed, and the container 87 is placed in a heating furnace. First, the container 87 containing the stack 86 is heat-treated in the atmosphere at about 350 ° C. for several hours to remove the binder component in the paste. Thereafter, the container 87 is heat-treated at 700 ° C. under a heat treatment condition of several tens of minutes in a nitrogen atmosphere, and the stacked body 86 is blocked by pressure bonding with a molten paste. In order to prevent cracking of the glass of the obtained block, MSX-
After gradually cooling to around the melting point (630 ° C.) of the 82P glass powder, the container 87 is cooled to room temperature, and the container 87 is taken out of the furnace.

Thereafter, a block (not shown) is taken out of the container 87 and sliced to obtain a substrate having a desired thickness. The surface of the substrate after the slicing is polished and the side surfaces are chamfered so as not to hinder the subsequent steps. Subsequently, formation and patterning of a conductive thin film for forming an electrode or a wiring layer connected to a conductor exposed on the front and back surfaces of the substrate are performed, and further, an insulating film and other wiring layers are formed as necessary, and mounted. Complete the substrate.

As described above, by using a plate and a paste of an insulating material provided with a groove for manufacturing a block for cutting a substrate, the tension applied to the linear conductor can be maintained.
Alternatively, blocking can be performed while the filled conductor is held in the groove.

Next, a method of manufacturing a mounting substrate using a plate of an insulating material having through holes and a linear conductor covered with a thermoplastic resin will be described. The linear conductor may be made of any conductive material. Preferably, the linear conductor is made of a material having a coefficient of thermal expansion close to that of the insulating material used. As an example, when glass is used as the insulating material, the linear conductor can be made of carbon.

The thermoplastic resin (which also constitutes one of the insulating materials) to be coated on the linear conductor is preferably selected from heat-resistant ones in consideration of the use conditions of the mounting substrate to be manufactured. For example, a thermoplastic polyimide resin or the like can be used.

In this method, a linear conductor covered with a resin is inserted into a through hole of a plate made of an insulating material. The plate may be made from any insulating material and the through holes may be formed in any manner. As an example,
A plate of photosensitive glass PEG3 having predetermined through holes available from HOYA and formed in advance by photolithography can be suitably used. In this case, a plate of any thickness can be used, and by using a plate that matches the thickness required for the mounting substrate, the cutting step after blocking performed by each of the above methods can be omitted. be able to.

When a plate of an insulating material into which a conductor covered with a resin is inserted is heat-treated in the same manner as in the method described above, a mounting substrate is obtained. The surface of the obtained substrate can be polished and smoothed as necessary.

An example of a method of manufacturing a mounting substrate using a plate of an insulating material with through holes and a linear conductor coated with a resin will be described with reference to FIG.

A photosensitive glass (PEG3) plate (obtained from HOYA, thickness: 2.0 mm) 91 having a through hole 92 having a diameter of 0.2 mm is prepared in advance. 0.1 diameter
Linear carbon material 93 having a length of 5 mm and a length of 2.0 mm (obtained from Nijigyo Co., Ltd., thermal expansion coefficient: 3.1 × 10 ⁻⁶ ° C. ⁻¹⁾
Before and after, melting point: 3500 ° C.), thermoplastic polyimide resin PI2611 manufactured by DuPont (coefficient of thermal expansion: 5.2)
× 10 ⁻⁶ ° C. ⁻¹ , glass transition point: around 370 ° C.)
A coating 94 is formed by coating to a thickness of 5 μm. Next, the carbon material 93 on which the film 94 has been formed is inserted into the through hole 92 of the plate 91, and the plate 91 is placed in a furnace and heat-treated at 375 ° C. in a nitrogen atmosphere at several tens of minutes. By melting the resin film 94, the carbon material 93 and the glass plate 9 are melted.
1 and the mounting substrate is obtained. After polishing the substrate surface and chamfering the side surface as necessary, forming and patterning a conductive thin film for forming an electrode or a wiring layer connected to a conductor exposed on the front and back surfaces of the substrate, and further performing an insulating film or Other wiring layers are formed as necessary to complete the mounting substrate.

Next, a method of manufacturing a mounting substrate using a linear conductor covered with a thermoplastic resin will be described. The linear conductor may be a wire of the previously mentioned conductor material. Further, the thermoplastic resin coated on the linear conductor is preferably a heat-resistant thermoplastic resin such as the above-mentioned polyimide resin.

Wires of a predetermined length each having a side surface coated with a thermoplastic resin are bundled, and the bundle is put into a furnace and subjected to a heat treatment, and the thermoplastic resin is melted to block the wires and the resin. This block is sliced into a predetermined thickness to form a mounting board. The surface of the obtained mounting board can be polished and smoothed as necessary.

An example of manufacturing a mounting substrate from a linear conductor covered with a thermoplastic resin will be described with reference to FIG.

[0084] First, as shown in FIG. 10 (a), a tungsten wire 101 with a diameter of 0.15 mm (thermal expansion coefficient: 4.5 × 10 ^-6 ℃ ^-1, mp: 3653 ° C.) DuPont to the side of Thermoplastic polyimide resin PI2611 (coefficient of thermal expansion: 5.2 × 10 ⁻⁶ ° C. ⁻¹ , glass transition point: 370)
(Approx. ° C.) is coated with a thickness of 1 mm to form a film 102, which is bundled so that the wires 101 are arranged in a grid.
This bundle is placed in a furnace and heat-treated at 375 ° C. in a nitrogen atmosphere at tens of minutes. By melting the resin film 102, a block in which the wires are embedded in the resin material is obtained. The block taken out of the furnace is sliced into a substrate 103 having a desired thickness (FIG. 10B). The surface of the substrate is polished, the side surfaces are chamfered, and then the formation and patterning of a conductive thin film for forming an electrode or a wiring layer connected to a conductor exposed on the front and back surfaces of the substrate are performed. A wiring layer is formed as needed to complete a mounting substrate.

As described above, when a linear conductor coated with a thermoplastic resin is used for manufacturing a block for cutting a substrate, the conductor can be prevented from being oxidized, and therefore easily oxidized at a high temperature during heat treatment. It becomes possible to use metal or the like as the conductor. For example, when a metal having a small coefficient of thermal expansion such as tungsten or molybdenum is used as a conductor, these metals have a property of easily oxidizing at a high temperature. Therefore, when glass is used as an insulating material, the melting is performed in an inert atmosphere. Although it is necessary, since the glass having a low softening point contains a large amount of lead oxide, etc., the melting of the lead in an inert atmosphere reduces the lead oxide and deposits lead. There is a problem that the melting furnace is limited. Such a problem can be avoided by using a linear conductor covered with a thermoplastic resin.

Although the embodiments of the present invention have been described above, the present invention is not limited to the configurations and conditions described in each example, and various modifications are possible. For example, in each example of the present invention, W, Pt, or Ge is used as a linear conductor to be embedded, but the conductor is not limited to W, Pt, or Ge, and may be made of stainless steel, Kovar, or the like. Is also good. When glass having a low working point is used as the glass, Au (melting point: 1064.4) is used.
C.) or Cu (melting point 1084.5.degree. C.).

In the above example, the diameter of the cross section of the linear conductor is 0.15 mm, but it is not limited to 0.15 mm. 1m diameter for high density mounting
m or less is preferable, but the present invention is of course practicable even if a linear conductor having a diameter exceeding 1 mm is used. Further, the cross section of the linear conductor does not necessarily have to be circular, but may be elliptical, square, rectangular, polygonal, or star-shaped.

In each of the above examples, glass MSX-81P manufactured by Nippon Fellow Co., Ltd. was used as the insulating material glass.
(Product name), Corning 7740 glass (Product name)
Or Pyrex glass, or a thermoplastic polyimide resin PI2611 manufactured by DuPont. However, it is needless to say that the insulating material is not limited to these materials. Any insulating material may be used as long as it has a viscosity that can be interposed therebetween.

In the above example using the frame-shaped winding jig, powdery glass is used. However, the glass may be poured into a crucible containing a jig assembled with pre-melted glass. is there.

The pitch of the conductors arranged on the substrate is
It may be the same or partially different. For example, when a frame-shaped winding jig is used, the conductors may be wound at the same pitch or partially changed pitches in one frame-shaped winding jig. The conductor may be wound at a different pitch for each jig. Similarly, in the above example using the frame-shaped winding jig, the row pitch is defined by the thickness of the frame-shaped winding jig and the thickness of the spacer, but these thicknesses need not be all the same. Instead, it may be changed for each frame-shaped winding jig or each spacer as needed. In the case where a capillary surrounding the linear conductor is used, the pitch of the conductor can be freely changed by adjusting the interval at which the capillaries are arranged. Also, the pitch of the conductors can be easily adjusted by adjusting the distance between the through holes of the insulating material plate into which the linear conductors are inserted, or by adjusting the thickness of the resin covering the linear conductors. Can be changed.

In the above example using the frame-shaped winding jig, the frame-shaped winding jig, other jigs (spacers) and the crucible are made of zirconium. Low glass MSX- manufactured by Japan Fellow
When 81P is used, for example, stainless steel having poor wettability with such a material may be used.

[0092]

According to the present invention, when a linear conductor is buried in an insulating material such as glass, a short circuit between the linear conductors does not occur and the linear conductors are formed at an accurate minute pitch as designed. A high-density mounting substrate in which a body is embedded can be realized with good reproducibility, and this greatly contributes to cost reduction and improvement in reliability of the high-density mounting substrate.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a manufacturing method of the present invention using a frame-shaped winding jig.

FIG. 2 is a diagram illustrating the manufacture of a mounting board by a manufacturing method of the present invention using a frame-shaped winding jig.

FIG. 3 is an explanatory view of a conventional manufacturing method using a frame-shaped winding jig.

FIG. 4 is a diagram illustrating one embodiment of the manufacturing method of the present invention using a combination of a capillary and a linear conductor.

FIG. 5 is a diagram illustrating another embodiment of the manufacturing method of the present invention using a combination of a capillary and a linear conductor.

FIG. 6 is a diagram illustrating still another embodiment of the production method of the present invention using a combination of a capillary and a linear conductor.

FIG. 7 is a diagram illustrating a manufacturing method of the present invention using a plate of an insulating material having grooves formed therein and a paste of the insulating material.

FIG. 8 is a diagram illustrating a manufacturing method of the present invention using a plate of an insulating material in which a groove is filled with a conductor and a paste of the insulating material.

FIG. 9 is a diagram illustrating a manufacturing method of the present invention using a plate of an insulating material having through holes and a linear conductor coated with a resin.

FIG. 10 is a diagram for explaining the method of the present invention for manufacturing a mounting substrate from a linear conductor covered with a thermoplastic resin.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Linear electric conductor 2 ... Frame-shaped winding jig 3 ... Spacer 4 ... Crucible 5 ... Fixed jig 11 ... Frame-shaped winding jig 12 ... Through-hole 13 ... Spacer 14 ... Through-hole 15 ... Bar-shaped fixed jig Tool 16 ... Frame-shaped pressing member 17 ... Through hole 18 ... Screw 19 ... Crucible 20 ... Linear conductor 21 ... Forming frame 22 ... Linear conductor 23 ... Crucible 24 ... Molten glass 25 ... Glass block 26 ... Cutting line 27 ... glass substrate 28 ... through conductors 41, 51, 61 ... capillaries 42, 52, 73, 101 ... wires 43, 63, 71, 81 ... glass plates 44, 54, 64, 75, 87 ... containers 55 ... glass powder 67, 72, 82 groove 74, 84 paste layer 91 photosensitive glass plate 92 through hole 93 linear carbon material 94, 102 resin film 103 substrate

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Yoshihiko Imanaka 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa F-term in Fujitsu Limited (reference) 5E317 AA27 BB01 BB11 CC08 CC10 CD31 GG01 GG16

Claims (9)

[Claims] After winding a linear conductor on a frame-shaped winding jig under tension, the frame-shaped winding jig is buried in a softened insulating material, and then the softened insulating material is immersed in the softened insulating material. After the material is solidified to form an insulator block, the insulator block is cut into two or more pieces to form a front-to-back conduction substrate having a linear conductor penetrating both the front and back surfaces. Method. 2. The method according to claim 1, wherein a plurality of frame-shaped winding jigs formed by winding the linear conductor under tension are laminated via a spacer, and then embedded in the softened insulating material. The method for manufacturing a mounting board according to claim 1. 3. A step of passing a linear conductor through a capillary made of a material having a higher melting point than the insulating material of the mounting substrate, and simultaneously heat-treating the capillary and the insulating material passing through the linear conductor into blocks. A method for manufacturing a mounting board having a conductor penetrating from front to back, including a step of cutting the obtained block. 4. The blocking is performed by (1) arranging capillaries passing through a linear conductor between plates of an insulating material in the same direction;
Heat-treating the insulating material plate, the capillary and the conductor at the same time; (2) heat-treating the insulating material plate, the capillary and the conductor at the same time by arranging the capillaries between the grooved insulating material plates so as to enter the respective grooves; 4. The method according to claim 3, wherein (3) the capillaries are buried in a powder of an insulating material in the same direction, and the heat treatment is performed on the insulating material powder, the capillaries and the conductor at the same time. 5. A step of placing a linear conductor in a groove formed in a plate of an insulating material and stacking the plate of the insulating material with an insulating paste interposed therebetween to form a stack; A method of manufacturing a mounting substrate in which a conductor penetrates the front and back sides, including a step of heat-treating the stacked body while applying pressure in the stacking direction to form a block, and a step of cutting the obtained block. 6. A step of filling a conductor formed in a groove formed in a plate of insulating material, a step of forming a stack by stacking plates of insulating material with an insulating paste interposed therebetween. A method for manufacturing a mounting substrate having a conductor penetrating from front to back, comprising a step of heat-treating a stacked body while applying pressure in the stacking direction to form a block, and a step of cutting the obtained block. 7. A step of inserting a linear conductor coated with a thermoplastic resin into a through hole formed in a plate of an insulating material, and a step of simultaneously heat-treating the plate of the insulating material, the conductor, and the thermoplastic resin. And a method of manufacturing a mounting board in which a conductor penetrates the front and back. 8. A step of forming a bundle of linear conductors of a predetermined length covered with a thermoplastic resin, a step of heat-treating the bundle to form a block, and a step of cutting the obtained block. A method for manufacturing a mounting substrate in which a conductor penetrates the front and back. 9. A mounting, comprising: a plate of an insulating material; and a conductor whose periphery is covered with a thermoplastic resin and which is embedded in the plate of the insulating material so that an end face is exposed on the front and back surfaces. substrate.