JP2001172364A - Photocurable resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a photocurable resin composition which is excellent in water resistance, adhesion to a substrate, and migration resistance while retaining advantages inherent in an ultraviolet-curable resin composition. SOLUTION: This composition essentially comprises (A) an active energy ray-curable resin having an ethylenical double bond, (B) an epoxy resin, and (C) a photopolymerization initiator. In the second embodiment, (D) a vinyltriazine derivative is incorporated into the composition in addition to the above ingredients. In the third embodiment, (E) a saturated polyester resin is further incorporated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photocurable resin composition, and more particularly to an ultraviolet curable paste for protecting various electrodes such as silver electrodes.

[0002]

2. Description of the Related Art In general, thermosetting, ultraviolet-curing and room temperature-curing resin compositions are known as protective agents for various electrodes in electronic parts and the like. For example, as a thermosetting resin composition, there is a resin composition disclosed in Japanese Patent Publication No. 1-19834, and as an ultraviolet curing resin composition, JP-A-60-103343. There is a resin composition as disclosed in US Pat.

However, among these resin compositions, a thermosetting resin composition requires a long time of heating during the curing treatment, so that workability is poor and adverse effects on other members are feared. . The UV-curable resin composition has the advantage of a high curing rate, but has the disadvantage of poor adhesion due to large curing shrinkage, distortion in the cured product, and poor water resistance. Room-temperature curing resin compositions have the advantage of being inexpensive without the need for curing equipment, but require a long storage time for curing, which necessitates securing a storage place during curing, resulting in poor workability. There is.

On the other hand, as a resin composition capable of overcoming the above-mentioned various drawbacks, a resin composition using a photocationic catalyst characterized by particularly low curing shrinkage among ultraviolet curing resin compositions has been proposed. Yes (Tokuhei 2-30326)
No., JP-A-5-186755). However, when such a resin composition is used on a metal electrode, there is a new problem that corrosion of the metal electrode, which is considered to be caused by the photocationic catalyst, is likely to occur.

On the other hand, as the fine pattern of the external electrode progresses as typified by a flat panel module or the like, a part of the electrode is made of fired silver patterned at a narrow pitch by a photolithographic method. Created with paste. Therefore, even if it is attempted to protect the metal electrode patterned at such a narrow pitch with the conventional resin composition as described above, the fact is that sufficient protection performance cannot be obtained.

[0006]

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-mentioned circumstances, and a main object of the present invention is to provide an ultraviolet-curable resin composition having advantages such as water resistance and water resistance. An object of the present invention is to provide a photocurable resin composition having excellent substrate adhesion and capable of withstanding a short circuit between electrodes due to migration. Here, the performance that can withstand a short circuit between electrodes due to migration is hereinafter simply referred to as “migration resistance”.

[0007]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies for realizing the above-mentioned object, and as a result, have completed the invention having the following features as the main constitutions. That is, according to the first aspect of the present invention, the photocurable resin composition comprises (A) an active energy ray-curable resin having one ethylenically unsaturated double bond in a molecule, and (B) an epoxy resin. , And (C)
It is characterized in that a photo-radical polymerization initiator is used as an essential component, and in the second embodiment, it further comprises (D) a vinyltriazine derivative in addition to the above components. It is characterized in that it further contains (E) a saturated polyester resin in addition to the component, and in the fourth embodiment, it is characterized in that it further contains (F) a silane coupling agent in addition to the above-mentioned components.

In the photocurable resin composition of the present invention, the epoxy resin (B) preferably has a softening point of 40 ° C. or higher and is in a semi-solid or solid state at room temperature, more preferably. An epoxy compound having a partial structure represented by the following general formula (1) in one molecule or an alicyclic epoxy compound having any structure represented by the following formula (2) or (3) is preferable.

Embedded image (Wherein, X represents an epoxy group or / and a vinyl group,
n represents an integer of 1 to 100. However, the molecule contains at least one epoxy group. ) The vinyltriazine derivative (D) is 2,4-diamino-6-vinyl-S
-Triazine, 2,4-diamino-6-methacryloyloxy-S-triazine, and at least one selected from these isocyanuric acid adducts.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The photocurable resin composition of the present invention comprises
(A) The first feature is that an active energy ray-curable resin having one ethylenically unsaturated double bond in a molecule is an essential component. This active energy ray-curable resin (A) has one functional group per molecule per molecule.
It is considered that the above-mentioned limitation minimizes the influence of curing shrinkage during photo-radical polymerization and contributes to the prevention of a decrease in adhesion. When the composition does not adversely affect the curing shrinkage of the composition, that is, within the range of less than 20% by mass of the entire component (A), the activity having two or more ethylenically unsaturated double bonds in the molecule. An energy ray-curable resin can be blended.

The active energy ray-curable resin (A)
Is not particularly limited as long as it is a compound in which an ethylenically unsaturated double bond undergoes radical polymerization upon irradiation with an active energy ray, but a (meth) acrylate-based compound is particularly preferred. Further, it may have a functional group other than an acryloyl group (methacryloyl group). Further, having an aromatic ring or a cyclo ring in the resin skeleton is advantageous in terms of hydrophobicity.
Specifically, 4- (meth) acryloxytricyclo [5.2.1.0 _2.6 ] decane, phenoxyethyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth)
Acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, phenol EO-modified (meth) acrylate, paracumylphenol EO-modified (meth) acrylate, nonylphenol EO-modified (meth) acrylate, nonylphenol PO-modified (meth) acrylate Monofunctional (meth) such as, 2-hydroxy-3-phenoxypropyl acrylate, isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, dicyclopentanyl (meth) acrylate Acrylates and the like can be mentioned.

The monofunctional (meth) acrylates may be those obtained by converting a glycidyl group into (meth) acrylate. Specific examples include (meth) acrylates such as o-phenylphenyl glycidyl ether, naphthyl glycidyl ether, and phenyl glycidyl ether.

The second feature of the photocurable resin composition of the present invention resides in that (B) an epoxy resin is an essential component. Since the epoxy resin (B) does not participate in curing, it is effective in reducing curing shrinkage (improving adhesion).

Examples of the epoxy resin (B) include various commonly used epoxy resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, brominated bisphenol A epoxy resin, hydrogenated bisphenol A Epoxy resin, biphenol type epoxy resin, bixylenol type epoxy resin, alicyclic epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, brominated phenol novolak type epoxy resin, bisphenol A novolak type epoxy resin, etc. Glycidyl ether compounds, glycidyl ester compounds such as terephthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester, dimer acid diglycidyl ester, and triglycidyl Isocyanurate, N, N, N ',
N'-tetraglycidyl metaxylenediamine, N,
Known and commonly used epoxy compounds such as glycidylamine compounds such as N, N ′, N′-tetraglycidylbisaminomethylcyclohexane and N, N-diglycidylaniline are exemplified. These epoxy resins can be used alone or
More than one type can be used in combination. In the photocurable resin composition of the present invention, among these epoxy resins, it is particularly preferable to use an epoxy resin having a softening point of 40 ° C. or more and being in a semi-solid or solid state at room temperature. Thereby, the surface curability (touch dryness) and the water resistance of the resin composition are improved. Furthermore, by selecting an epoxy resin having a hydrophobic skeleton, the hydrophobicity of the resin composition can be improved and migration can be effectively prevented.

The inventors have selected the epoxy resin in a semi-solid or solid state at room temperature as described above from among a number of hydrophobic resins including an epoxy resin as a resin contributing to migration resistance. As a result of stacking,
Among these epoxy resins, those having the following structure in which the allyl group is epoxidized with peracetic acid, rather than the epichlorohydrin derivative, that is, the following general formula (1) in one molecule:
It has been clarified that an epoxy compound having a partial structure represented by the following formula or an alicyclic epoxy compound having a structure represented by the following formula (2) or (3) has excellent migration resistance. This is thought to be because the epoxy compound having the following structure has a lower impurity ion concentration than the epichlorohydrin derivative, and thus has excellent electrical characteristics.

Embedded image (Wherein, X represents an epoxy group or / and a vinyl group,
n represents an integer of 1 to 100. However, the molecule contains at least one epoxy group. )

In particular, in terms of migration resistance, in an epoxy compound having a partial structure represented by the above general formula (1) in one molecule, the number of functional groups represented by the following formulas (a) and (b) The ratio (a) / (b) is 1.0 to an average
It is preferably 4.0.

Embedded image Examples of such an epoxy resin include Celloxide 3150 and Celloxide 208 manufactured by Daicel Chemical Industries, Ltd.
5 and the like.

The polyether type epoxy resin having a functional group represented by the above general formula (1) comprises a compound having an active hydrogen and 4-vinylcyclohexene 1-oxide or, if necessary, another epoxy group. A vinyl group of a polyether compound obtained by reacting a compound having two or more compounds in the presence of a catalyst is partially or completely epoxidized with an oxidizing agent such as a peracid such as peracetic acid or a hydroperoxide. Can be At this time, a small amount of an acetyl group or the like may be introduced. Examples of the compound having active hydrogen include alcohols, for example, linear or branched aliphatic alcohols, preferably polyhydric alcohols such as trimethylolpropane, phenols, carboxylic acids, amines, thiols, and the like. No. The compound having active hydrogen is not limited to the case where only one functional group represented by the general formula (1) is introduced, and a plurality of functional groups can be introduced, and it is more preferable. However, even in the case of introducing a plurality of compounds, if the number of the repeating unit portion of the functional group is too large, it becomes a compound having a high melting point,
It is preferable that the total number be 100 or less. In addition, other polyether-type epoxy resins described in JP-B-7-25864 can also be used. Such a polyether-type epoxy resin is described in detail in the above-mentioned publication, so please refer to the above-mentioned publication for details.

The amount of the epoxy resin (B) is suitably 5 to 60 parts by mass, preferably 5 to 40 parts by mass, per 100 parts by mass of the active energy ray-curable resin (A).
Parts by weight. The reason for this is that if the amount of the epoxy resin (B) is less than 5 parts by mass, it is difficult to obtain the above-described effects, while if the amount exceeds 60 parts by mass, the expected effect is saturated. This is not economical, and may adversely affect the photocurability of the composition.

The photo-radical polymerization initiator (C) is not particularly limited as long as it is a compound that radically polymerizes the active energy ray-curable resin (A) with an active energy ray. Specifically, thioxanthones such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone and 2,4-diisopropylthioxanthone; 2-methylanthraquinone,
Anthraquinones such as ethylanthraquinone, 2-t-butylanthraquinone and 1-chloroanthraquinone;
Benzophenones such as 4,4'-bisdiethylaminobenzophenone; α-hydroxyketones such as 1-hydroxy-cyclohexyl-phenyl-ketone and 2-hydroxy-2-methyl-1-phenylpropan-1-one;
(Bis) acyl phosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide; bis (2,4-cyclopentadien-1-yl) bis (2,6-difluoro-3- (1H-pyrrole-1) −
Titanocenes such as yl) -phenyl) titanium; 2-
Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-methyl-1- [4-
Aminoacetophenones such as (methylthio) phenyl] -2-morpholinopropan-1-one; benzyl, 4,
Α- such as 4′-dimethoxybenzyl, camphorquinone, etc.
And diketones.

The photo-radical polymerization initiator (C)
May be used in combination depending on the light source to be used. For example, aminoacetophenone such as 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one And thioxanthones or aminobenzophenones; combinations of benzophenones and aminobenzophenones; α-hydroxyketones such as 1-hydroxy-cyclohexyl-phenyl-ketone and 2,4,6-trimethylbenzoyldiphenylphosphine oxide; In combination with (bis) acylphosphine oxides.
Further, a tertiary amine such as triethanolamine, a photoinitiator such as isoamyl dimethylaminobenzoate and dimethylaminoethyl methacrylate may be added to these known and commonly used photoradical polymerization initiators.

Among the photo-radical polymerization initiators (C) described above, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxy-cyclohexylphenyl ketone, 1- (4-isopropylphenyl) ) -2-Hydroxy-2-methylpropan-1-one, 2-methyl-1- [4- (methylthio) phenyl]
Phenyl ketone compounds such as -2-morpholinopropan-1-one and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, bis (2,4,6-trimethylbenzoyl) ) (Bis) acylphosphine oxides such as phenylphosphine oxide and titanocene compounds are preferred.

The compounding amount of the photo-radical polymerization initiator (C) is suitably 0.5 to 20 parts by mass, preferably 0.5 part by mass, per 100 parts by mass of the active energy ray-curable resin (A). To 5 parts by mass. If the compounding amount of the photo-radical polymerization initiator (C) is less than 0.5 parts by mass, the photocuring by the active energy ray does not proceed sufficiently, while
This is because, even if it is added in a large amount in excess of parts by mass, the curing is saturated and the curing is not economical, and conversely, the composition may remain after photocuring and deteriorate the properties of the cured product.

The photocurable resin composition of the present invention further comprises a vinyltriazine derivative (D) in addition to the above-mentioned essential components.
Is preferably blended. The purpose of using the vinyl triazine derivative (D) is to more effectively prevent migration of the metal electrode. Specifically, 2,
4-diamino-6-vinyl-S-triazine, 2,4-
Examples include diamino-6-methacryloyloxy-S-triazine and their isocyanuric acid adducts. These vinyl triazine compounds or derivatives (D) thereof are
They can be used alone or as a mixture of two or more.

The amount of the vinyl triazine derivative (D) to be compounded is the same as that of the active energy ray-curable resin (A) 100
The amount is suitably from 0.5 to 20 parts by mass, preferably from 0.5 to 5 parts by mass with respect to parts by mass. The reason is that if the blending amount of the vinyl triazine derivative (D) is less than 0.5 part by mass, it is difficult to sufficiently enhance the migration resistance effect. This is because the effect is saturated, which is not economical, and conversely, the composition may remain after photocuring and deteriorate the properties of the cured product.

The photocurable resin composition of the present invention preferably further contains a saturated polyester resin (E) in addition to the above-mentioned components. The saturated polyester resin (E) is not particularly limited as long as it has an effect of improving the adhesion to the adherend. Specifically, Byron 200 and 22 of the Toyobo Byron series (Toyobo Co., Ltd.)
0, 240, 245, 270, 280, 290, 29
6, 300, 500, 530, 550, 560, 60
0, 630, 650, BX1001, GK110, 13
0, 140, 150, 180, 190, 250, 33
0, 590, 640, 680, 780, 810, 88
0, 890 and the like. Further, this polyester resin has a characteristic of excellent repairability such that an act of peeling a cured product from a base material becomes easy, in addition to an effect of improving adhesion.

The amount of the saturated polyester resin (E) is suitably 5 to 50 parts by mass, preferably 5 to 50 parts by mass, per 100 parts by mass of the active energy ray-curable resin (A).
３０30 parts by mass. The reason for this is that if the amount of the saturated polyester resin (E) is less than 5 parts by mass, it is difficult to obtain the above-mentioned effects, while if the amount exceeds 50 parts by mass, the expected effect is saturated. This is because it is not economical because it is in a state, and on the contrary, there is a possibility that the curability of the composition may be impaired or the properties of the cured product may be deteriorated.

The photocurable resin composition of the present invention may optionally contain a silane coupling agent (F). The purpose of adding the silane coupling agent (F) is to improve the adhesion to the substrate, particularly to glass. The silane coupling agent (F) is not particularly limited as long as it improves the adhesion to the substrate. Specifically, Nippon Unicar Co., Ltd.
A-143, A-150, A-151, A-17 manufactured by
1, A-172, A-174, A-186, A-18
7, A-189, A-1100, A-1120 and A-
1160 or TSL-83 manufactured by Toshiba Silicone Co., Ltd.
10, TSL-8311, TSL-8320, TSL-
8395, TSL-8325, TSL-8331, TS
L-8340, TSL-8345, TSL-8380,
TSL-8350, TSL-8355, TSL-837
0 and TSL-8375.

In the photocurable resin composition of the present invention as described above, it is possible to appropriately add additives in addition to the components described above. For example, curing shrinkage reduction, thermal expansion reduction, dimensional stability improvement, elastic modulus improvement, viscosity adjustment,
An organic or inorganic filler can be blended from the viewpoint of improving thermal conductivity, strength, and toughness. As such a filler, polymers, ceramics, metals, metal oxides, metal salts, and the like can be used, and the shape is not particularly limited, such as a particle shape and a fibrous shape. In addition, when blending the above polymer, it is also possible to dissolve, semi-dissolve or microdisperse in the photocurable resin composition not as a filler but as a polymer blend or polymer alloy. Further, the photocurable resin composition of the present invention may be blended with a coloring agent such as an organic or inorganic pigment or dye as an additive, and used for applications such as paints and inks. Furthermore, in the photocurable composition of the present invention, as other additives, a softener, a plasticizer, a flame retardant, a storage stabilizer, an antioxidant, an ultraviolet absorber, a thixotropic agent, a dispersion stabilizer, A fluidity-imparting agent or the like can be appropriately compounded.

The photocurable resin composition of the present invention is applied on a substrate by a known and common method, and the formed coating layer is irradiated with an active energy ray to convert a compound having an ethylenically unsaturated bond into a photoradical. It is cured by polymerization. As the irradiation light source for the active energy ray, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is suitable. In addition, a laser beam, an electron beam and the like can also be used as an active energy ray for exposure. In addition, the resin composition of the present invention can be used in any form of liquid, paste, and film. When used in a liquid state, the viscosity can be appropriately adjusted using a known viscosity modifier such as an organic solvent in order to adjust the viscosity of the resin composition.

[0029]

EXAMPLES The present invention will be specifically described below with reference to examples and comparative examples, but it goes without saying that the present invention is not limited to the following examples.

Examples 1 to 7 and Comparative Examples 1 to 3 The components shown in Table 1 were mixed in a predetermined ratio by a stirrer to prepare photocurable resin compositions of various component compositions.

[0031]

[Table 1] The abbreviations in the table represent the following contents. TMPTA: trimethylolpropane triacrylate, YX-4000 (manufactured by Yuka Shell Epoxy Co., Ltd.):
Biphenol type solid epoxy resin, EOCN1020
(Manufactured by Nippon Kayaku Co., Ltd.): polyglycidyl ether of O-cresol novolac, celloxide 3150 (manufactured by Daicel Industries, Ltd.): 2,2- (hydroxymethyl) -1
1,2-epoxy-4 (2-oxiranyl) cyclohexane adduct of -butanol, Irgacure 184 (manufactured by Ciba Specialty Chemicals): 1-hydroxy-cyclohexylphenylphenyl-ketone, SP-1
50 (manufactured by Asahi Denka Co., Ltd.): photocationic polymerization catalyst,
T (manufactured by Shikoku Chemicals): 2,4-diamino-6-vinyl-s-triazine, Byron 200 (Toyobo Co., Ltd.)
): Saturated polyester resin, A-174 (silane coupling agent manufactured by Nippon Unicar Co., Ltd.): γ-methacryloxypropyltrimethoxysilane

For each of the resin compositions thus prepared,
The water absorption, migration resistance, and adhesion were evaluated. The method of this evaluation is as follows. In addition, each resin composition was irradiated with an irradiation amount of 2,000 mJ / cm ² using an ultraviolet irradiation device (Metal halide lamp manufactured by Oak Manufacturing Co., Ltd.).
Cured.

(1) Water absorption: Each resin composition sample was poured into a circular Teflon container having a diameter of 150 mm and a depth of 2 mm, and then cured to prepare a pellet for measurement. After measuring the mass (a) of the pellet for measurement, 2
It was immersed in ion-exchanged water at 0 ° C. for 24 hours, and the mass (b) after immersion was measured. The water absorption at this time is ｛((b) −
(A)) / (a)｝ × 100 (%).

(2) Migration resistance test: As a test substrate, a glass plate of Corning 1737 (having a thickness of 0.1 mm) was used.
7 mm) and a comb-shaped electrode (L
/ S = 100/100 μm). After each resin composition was applied to a thickness of 2 mm on the comb-shaped electrode of the test substrate, the resin composition was left in a thermo-hygrostat at a temperature of 85 ° C. and a relative humidity of 85% for 1500 hours. At this time, the voltage applied to the comb-shaped electrode was DC 100 V, and the insulation resistance was measured in a thermo-hygrostat at any time. The evaluation of migration resistance is as follows.
The point at which a value of 10 ⁵ Ω or less was shown was regarded as a short circuit, and the evaluation was performed by the time from the start of the test to the short circuit.

(3) Adhesion test: In the above migration resistance test (2), the temperature was 85 ° C. and the relative humidity was 85.
%, And the adhesion between the glass and silver electrodes and the paste after 1500 hours under DC 100 V was visually confirmed. The evaluation is as follows. ◎: No lifting or peeling was observed even after 1500 hours or more. ○: Slight floating on the electrode was observed after 1500 hours. Δ: peeled off from glass within 1500 hours. ×: peeled immediately after curing

As is evident from the results shown in Table 1, according to the present invention, by adding an epoxy resin as a hydrophobic binder to a resin composition for photo-radical polymerization, a silver electrode having a fine pitch can be obtained. A sufficient electrode protection effect can be obtained. In addition, among the epoxy resins, by using a structure having a particularly small amount of ion residues,
A further effect of preventing migration can be obtained, a decrease in adhesion can be prevented by using a radical polymerization component having 1 functional group as a cross-linking component, and an adhesion to an adherend can be further enhanced by adding a saturated polyester resin. , Became apparent.

[0037]

As described above, according to the present invention, a photocurable resin composition which has the advantages of an ultraviolet curable resin composition and is also excellent in hydrophobicity, substrate adhesion and migration resistance. Things can be provided. Further, according to the present invention, by adding a saturated polyester resin, it is possible to improve the repairability of a cured product composed of the resin composition from a substrate. Therefore, the photocurable resin composition of the present invention has excellent workability as compared with the prior art, and is extremely useful as an ultraviolet curable adhesive excellent in adhesion to various adherends and excellent in preventing migration of various electrodes. Things.

Continued on the front page F-term (reference) 4J002 BG00W BG07W CD01X CD02X CD03X CD05X CD06X CD09X CD10X CD12X CD13X CD15X CF013 CF033 CF183 EE036 EE046 EE056 EN096 EU187 EU236 EV316 EW136 EX008 EZ006 FD146 FD148G01 A01 GP03A01 GP03A01 JA05 JA07 4J038 DB002 DB262 DD182 FA131 FA141 FA151 FA172 JC30 KA03 PA17 PB09 PC02 4J100 AL08P AL10P AQ19Q BA04P BA08P BC23P BC43P CA04 FA03 JA03

Claims (7)

[Claims] (A) an active energy ray-curable resin having one ethylenically unsaturated double bond in the molecule, (B)
A photocurable resin composition comprising an epoxy resin and (C) a photoradical polymerization initiator. 2. The photocurable resin composition according to claim 1, further comprising (D) a vinyltriazine derivative. 3. The photocurable resin composition according to claim 1, further comprising (E) a saturated polyester resin. 4. The photocurable resin composition according to claim 1, further comprising (F) a silane coupling agent. 5. The epoxy resin (B) has a softening point of 4
The photocurable resin composition according to any one of claims 1 to 4, which is in a semi-solid or solid state at room temperature of 0 ° C or higher. 6. The epoxy resin (B) is an epoxy compound having a partial structure represented by the following general formula (1) in one molecule, or one of the structures represented by the following formula (2) or (3): 2. An alicyclic epoxy compound having the formula:
6. The photocurable resin composition according to any one of items 1 to 5. Embedded image (Wherein, X represents an epoxy group or / and a vinyl group,
n represents an integer of 1 to 100. However, the molecule contains at least one epoxy group. ) 7. The vinyltriazine derivative (D) comprises 2,
4-diamino-6-vinyl-S-triazine, 2,4-
The photocurable resin composition according to any one of claims 2 to 6, which is at least one selected from the group consisting of diamino-6-methacryloyloxy-S-triazine and an isocyanuric acid adduct thereof.