JP2001155309A - Thin film magnetic head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To precisely form the magnetic pole part of a thin film magnetic head and to improve electromagnetic transducing characteristics. SOLUTION: A recording head in the thin film magnetic head processes a lower magnetic pole layer 8 (8a-8c), an upper magnetic pole layer 13, a recording gap layer 12 provided between the individual magnetic pole parts of these magnetic pole layers, and a thin film coil 10 arranged between the lower and upper magnetic pole layers 8, 13 in a state it is insulated against these layers. The upper magnetic pole layer 13 is formed on the upper face of the flat recording gap layer 12, and shaped to form a gap 60 partially between itself and the recording gap layer 12, defining a throat height with the end on the air bearing face 30 side of the gap 60.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a thin-film magnetic head having at least an inductive electromagnetic transducer and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as the areal recording density of a hard disk drive has been improved, the performance of a thin film magnetic head has been required to be improved. As the thin-film magnetic head, a composite thin-film magnetic layer having a structure in which a recording head having an inductive electromagnetic transducer for writing and a reproducing head having a magnetoresistive (hereinafter also referred to as MR (Magnetoresistive)) element for reading is laminated. Heads are widely used.

In order to increase the recording density of the performance of the recording head, it is necessary to increase the track density in the magnetic recording medium. For this purpose, a narrow track in which the width of the lower magnetic pole and the upper magnetic pole formed above and below the recording gap layer on the air bearing surface (the medium facing surface), that is, the track width is reduced from several microns to submicron dimensions. It is necessary to realize a recording head having a structure, and semiconductor processing technology is used to achieve this.

Here, referring to FIGS. 12 to 15,
As an example of a conventional method of manufacturing a thin film magnetic head, an example of a method of manufacturing a composite thin film magnetic head will be described. 12 to 15, (a) shows a cross section perpendicular to the air bearing surface of the thin film magnetic head, and (b) shows a cross section of the magnetic pole portion of the thin film magnetic head parallel to the air bearing surface.

In this manufacturing method, first, as shown in FIG.
So, for example, Altic (Al _TwoO_Three・ From TiC)
On a substrate 101 made of, for example, alumina (Al_TwoO_Three)
The insulating layer 102 having a thickness of about 5 to 10 μm.
Stack. Next, a magnetic material is formed on the insulating layer 102.
A lower shield layer 103 for a reproducing head is formed.

Next, on the lower shield layer 103, for example, alumina is sputtered by 100 to 200 nm.
To form a lower shield gap film 104 as an insulating layer. Next, the lower shield gap film 1
The MR element 105 for reproduction is formed to a thickness of several tens nm on the substrate 04. Next, a pair of electrode layers 106 that are electrically connected to the MR element 105 are formed on the lower shield gap film 104.

Next, an upper shield gap film 107 as an insulating layer is formed on the lower shield gap film 104 and the MR element 105, and the MR element 105 is embedded in the shield gap films 104, 107.

Next, on the upper shield gap film 107, an upper shield layer and lower magnetic pole layer (hereinafter, referred to as a lower magnetic pole layer) 108 made of a magnetic material and used for both the read head and the write head is formed. It is formed to a thickness of about 3 μm.

Next, as shown in FIG. 13, a recording gap layer 109 made of an insulating film, for example, an alumina film is formed on the lower magnetic pole layer 108 to a thickness of 0.2 μm. Next, to form a magnetic path, the recording gap layer 109 is partially etched to form a contact hole 109a. Next, on the recording gap layer 109 in the magnetic pole portion, the upper magnetic pole chip 1 made of a magnetic material for a recording head is formed.
10 is formed to a thickness of 0.5 to 1.0 μm. At this time, at the same time, contact holes 109a for forming magnetic paths are formed.
A magnetic layer 11 made of a magnetic material for forming a magnetic path
9 is formed.

Next, as shown in FIG. 14, the upper magnetic pole tip 110 is used as a mask to perform ion milling.
The recording gap layer 109 and the lower magnetic pole layer 108 are etched. As shown in FIG. 14B, the structure in which the side walls of the upper magnetic pole portion (the upper magnetic pole tip 110), the write gap layer 109, and a part of the lower magnetic pole layer 108 are formed vertically and self-aligned is a trim. (Trim) structure.

Next, an insulating layer 111 made of, for example, an alumina film is formed on the entire surface to a thickness of about 3 μm. Next, the insulating layer 111 is polished and flattened to reach the surfaces of the upper pole tip 110 and the magnetic layer 119.

Next, on the flattened insulating layer 111,
For example, a first type for an induction type recording head made of copper (Cu)
The thin-film coil 112 of the layer is formed. Next, the insulating layer 11
1 and the coil 112, a photoresist layer 113
Is formed in a predetermined pattern. Next, heat treatment is performed at a predetermined temperature to planarize the surface of the photoresist layer 113. Next, a second-layer thin-film coil 114 is formed on the photoresist layer 113. Next, the photoresist layer 1 is formed on the photoresist layer 113 and the coil 114.
15 are formed in a predetermined pattern. Next, heat treatment is performed at a predetermined temperature to planarize the surface of the photoresist layer 115.

Next, as shown in FIG. 15, an upper magnetic pole layer 116 made of a magnetic material for a recording head, for example, permalloy is formed on the upper magnetic pole tip 110, the photoresist layers 113 and 115, and the magnetic layer 119. I do. next,
On the upper magnetic pole layer 116, an overcoat layer 117 made of, for example, alumina is formed. Finally, the slider including the above layers is machined to form the air bearing surfaces 118 of the recording head and the reproducing head, thereby completing the thin-film magnetic head.

FIG. 16 is a plan view of the thin-film magnetic head shown in FIG. Note that, in this drawing, the overcoat layer 117, other insulating layers and insulating films are omitted.

In FIG. 15, TH indicates the throat height, and MR-H indicates the MR height. In addition,
The throat height refers to the length (height) of the portion where the two magnetic pole layers face each other via the recording gap layer, that is, the magnetic pole portion, from the end on the air bearing surface side to the end on the opposite side. The MR height refers to the length (height) from the end on the air bearing surface side of the MR element to the end on the opposite side. In FIG. 15, P2W represents the magnetic pole width, that is, the recording track width. As a factor that determines the performance of the thin-film magnetic head, there is an Apex Angle as indicated by θ in FIG. 15 in addition to the throat height and the MR height. The apex angle is a top surface of the insulating layer 111 and a straight line connecting a corner of a side surface on a magnetic pole side in a coil portion (hereinafter, referred to as an apex portion) which is covered with the photoresist layers 113 and 115 and is raised in a mountain shape. With the angle.

[0016]

To improve the performance of the thin-film magnetic head, the throat height TH, MR height MR-H, apex angle .theta.
It is important to accurately form the recording track width P2W.

In particular, in recent years, in order to enable high areal density recording, that is, to form a recording head having a narrow track structure, a submicron size of 1.0 μm or less is required for the track width P2W. For this purpose, a technology for processing the upper magnetic pole into a submicron size using a semiconductor processing technology is required.

The problem here is that it is difficult to finely form the upper magnetic pole layer formed on the apex portion.

As a method of forming the upper magnetic pole layer, for example, a frame plating method is used as shown in Japanese Patent Application Laid-Open No. Hei 7-262519. When the upper magnetic pole layer is formed by using the frame plating method, first, a thin electrode film made of, for example, permalloy is entirely formed on the apex portion by, for example, sputtering. Next, a photoresist is applied thereon and patterned by a photolithography process to form a frame (outer frame) for plating. Then, the upper magnetic pole layer is formed by plating using the previously formed electrode film as a seed layer.

However, there is a height difference of, for example, 7 to 10 μm or more between the apex portion and other portions. On this apex portion, a photoresist is applied in a thickness of 3 to 4 μm. If the thickness of the photoresist on the apex portion is required to be at least 3 μm or more, the photoresist having fluidity is gathered on the lower side, so that the photoresist having a thickness of, for example, 8 to 10 μm or more below the apex portion. A resist film is formed.

In order to realize a recording track width of a submicron size as described above, it is necessary to form a resist trench pattern with a submicron size interval using a photoresist film. Therefore, on the Apex section, 8 to 1
A submicron trench pattern must be formed with a photoresist film having a thickness of 0 μm or more. However, it is extremely difficult in the manufacturing process to form such a thick photoresist pattern at narrow intervals.

Moreover, at the time of photolithographic exposure,
Exposure light is reflected by a base electrode film as a seed layer,
The photoresist is also exposed to the reflected light, causing the photoresist pattern to be distorted and the like, making it impossible to obtain a sharp and accurate photoresist pattern.

In particular, in the region on the slope of the apex portion, not only the reflected light in the vertical direction but also the reflected light returning from the base electrode film when the exposure light is reflected by the base electrode film is reflected from the slope of the apex portion. The reflected light in the oblique direction or the horizontal direction is also included, so that the photoresist is exposed to the reflected light, and the photoresist pattern is greatly deformed.

On the other hand, for example, JP-A-6-68424, JP-A-6-309621, and JP-A-6-31
As disclosed in Japanese Patent No. 4413, a thin-film magnetic head having an upper pole layer formed on a flat surface has also been proposed. According to such a thin film magnetic head, the problem in forming the upper magnetic pole layer on the apex portion is solved.

Here, the position of the end of the magnetic pole portion opposite to the air bearing surface is called a throat height zero position.
In the thin-film magnetic head disclosed in JP-A-6-68424, the throat height zero position is defined by the end of the upper magnetic pole. In the thin-film magnetic head disclosed in JP-A-6-309621, the throat height zero position is set to the lower part. The throat height zero position is defined by the ends of the upper magnetic pole and the lower magnetic pole in the thin-film magnetic head disclosed in JP-A-6-314413. In any of the thin film magnetic heads, the end faces of the magnetic poles defining the throat height zero position are perpendicular to the recording gap layer. Therefore, in any of the thin-film magnetic heads, the distance between the lower magnetic pole layer and the upper magnetic pole layer is a constant distance equal to the thickness of the recording gap layer from the air bearing surface to the throat height zero position. From the height zero position, it suddenly increases on the side opposite to the air bearing surface.

However, in the structure in which the distance between the lower magnetic pole layer and the upper magnetic pole layer changes rapidly near the throat height zero position, the flow of magnetic flux passing through the magnetic pole layer toward the recording gap layer is reduced. It was found that the magnetic flux rapidly changed near the zero height position, and as a result, the magnetic flux was saturated near the zero throat height position, and the electromagnetic conversion characteristics of the thin film magnetic head deteriorated. Specifically, the electromagnetic conversion characteristics include an overwrite characteristic, which is a characteristic when data is overwritten in an area of the recording medium on which data has already been written, and a non-linear transition shift.
ition Shift; hereinafter, referred to as NLTS. ).

The present invention has been made in view of the above problems, and an object of the present invention is to provide a thin film magnetic head capable of forming a magnetic pole portion with high accuracy and improving electromagnetic conversion characteristics, and a method of manufacturing the same. To provide.

[0028]

A thin-film magnetic head according to the present invention is magnetically coupled to each other, includes magnetic pole portions facing each other on a medium facing surface side facing a recording medium, and includes at least one layer. A first magnetic layer, a second magnetic layer, a gap layer provided between a magnetic pole portion of the first magnetic layer and a magnetic pole portion of the second magnetic layer, at least a part of the first magnetic layer and the second magnetic layer. A thin-film coil provided in a state insulated from the first and second magnetic layers, wherein the second magnetic layer is in contact with a flat surface including the gap layer and is separated from the medium facing surface. At a predetermined position to form a gap partly with the gap layer,
It has a throat height defining layer that defines the throat height by the end of the gap on the medium facing surface side.

A method of manufacturing a thin-film magnetic head according to the present invention includes a first and a first magnetic layer which are magnetically connected to each other, include magnetic pole portions facing each other on a medium facing surface side facing a recording medium, and each include at least one layer. A second magnetic layer, a gap layer provided between a magnetic pole portion of the first magnetic layer and a magnetic pole portion of the second magnetic layer, and at least a part between the first and second magnetic layers. A method for manufacturing a thin-film magnetic head comprising: a thin-film coil provided in a state insulated from first and second magnetic layers, the method comprising: forming a first magnetic layer; A step of forming a gap layer on the magnetic layer, a step of forming a second magnetic layer on the gap layer, and a step of forming a thin-film coil, wherein the step of forming the second magnetic layer comprises: In contact with the flat surface including the gap layer, Forming a throat height defining layer that has a shape that partially forms a gap with the gap layer at a predetermined position away from the surface, and defines a throat height by an end of the gap on the medium facing surface side Is included.

In the thin film magnetic head or the method of manufacturing the same according to the present invention, the throat height is defined by the end on the medium facing surface side of the gap formed partially between the throat height defining layer and the gap layer. The flow of the magnetic flux toward the gap layer through the throat height defining layer smoothly changes near the end of the gap on the medium facing surface side, that is, near the throat height zero position.

In the thin-film magnetic head or the method of manufacturing the same according to the present invention, the boundary between the gap and the throat height defining layer may be curved.

In the thin-film magnetic head or the method of manufacturing the same according to the present invention, the first magnetic layer includes a first portion disposed at a position facing at least a part of the thin-film coil;
A second portion including a magnetic pole portion, the second portion including a magnetic pole portion, wherein at least a portion of the thin film coil is disposed on a side of the second portion of the first magnetic layer. May be done. In this case, at least a portion of the thin-film coil disposed on the side of the second portion of the first magnetic layer is covered, and the surface of the gap layer on the side of the gap layer in the second portion of the first magnetic layer. May be provided with a flattened insulating layer. The end of the gap on the medium facing surface side may be arranged at a position closer to the medium facing surface than the end of the second portion of the first magnetic layer opposite to the medium facing surface.

In the thin-film magnetic head or the method of manufacturing the same according to the present invention, the throat height defining layer may include a portion defining a track width.

In the method of manufacturing a thin film magnetic head of the present invention, the step of forming the throat height defining layer includes the steps of: forming a seed layer for plating on the gap layer;
Forming a positive resist layer on the seed layer;
A light-shielding region corresponding to the shape of the frame for forming the throat height defining layer by a plating method, a void-corresponding region provided at a position corresponding to the void, and blocking at least a part of light for exposure; The resist layer is exposed using a photomask having a region and a light transmitting region other than the region corresponding to the void, and then developed to form a frame on the seed layer and correspond to the void on the seed layer. The method may include a step of forming a resist remaining portion at a position, a step of forming a throat height defining layer by a plating method using a frame, and a step of removing the frame and the resist remaining portion to form a void portion. .

[0035]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, a thin-film magnetic head and a method of manufacturing the same according to an embodiment of the present invention will be described with reference to FIGS. 3 to 8, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section of the magnetic pole portion parallel to the air bearing surface.

In the method of manufacturing a thin-film magnetic head according to the present embodiment, first, as shown in FIG. 3, for example, alumina (Al) is formed on a substrate 1 made of AlTiC (Al ₂ O ₃ .TiC). _The insulating layer 2 made of ₂ O ₃ ) is about 5 μm
Is deposited with a thickness of Next, a magnetic material,
For example, a lower shield layer 3 made of permalloy for a reproducing head is formed to a thickness of about 3 μm. Lower shield layer 3
Is selectively formed on the insulating layer 2 by plating using a photoresist film as a mask, for example. next,
Although not shown, an insulating layer made of, for example, alumina is formed to a thickness of, for example, 4 to 5 μm, and
Polishing is performed by (chemical mechanical polishing) until the lower shield layer 3 is exposed, and the surface is flattened.

Next, as shown in FIG. 4, on the lower shield layer 3, a lower shield gap film 4 as an insulating film is formed.
Is formed to a thickness of, for example, about 20 to 40 nm. next,
On the lower shield gap film 4, a reproducing MR element 5
Is formed to a thickness of several tens of nm. The MR element 5 is formed, for example, by selectively etching an MR film formed by sputtering. As the MR element 5, an element using a magneto-sensitive film exhibiting a magnetoresistance effect, such as an AMR element, a GMR element, or a TMR (tunnel magnetoresistance effect) element can be used. Next, a pair of electrode layers 6 electrically connected to the MR element 5 are formed on the lower shield gap film 4 to a thickness of several tens of nm. next,
An upper shield gap film 7 as an insulating film is formed on the lower shield gap
The MR element 5 is formed in a thickness of 0 to 40 nm and is buried in the shield gap films 4 and 7. Shield gap film 4,
Examples of the insulating material used for 7 include alumina, aluminum nitride, diamond-like carbon (DLC), and the like. Further, the shield gap films 4 and 7 may be formed by a sputtering method or may be formed by a chemical vapor deposition (CVD) method. When the shield gap films 4 and 7 made of an alumina film are formed by the CVD method, the material is, for example, trimethyl aluminum (Al).
(CH ₃ ) ₃ ) and H ₂ O are used. When the CVD method is used, it is possible to form the thin, dense shield gap films 4 and 7 with few pinholes.

Next, on the upper shield gap film 7,
The first portion 8a of the upper shield layer and lower magnetic pole layer (hereinafter, referred to as lower magnetic pole layer) 8 made of a magnetic material and used for both the read head and the write head is approximately 1.0 to 1.5.
It is selectively formed with a thickness of μm. The lower pole layer 8
The first part 8a and the second part 8b described later,
And a third portion 8c. The first portion 8a of the lower magnetic pole layer 8 is arranged at a position facing at least a part of a thin film coil described later.

Next, the second portion 8b and the third portion 8b of the lower pole layer 8 are placed on the first portion 8a of the lower pole layer 8.
c is formed to a thickness of about 1.5 to 2.5 μm. The second portion 8b forms the magnetic pole portion of the lower magnetic pole layer 8, and is connected to the surface (upper side in the drawing) of the first portion 8a on which the thin film coil is formed. The third portion 8c is a portion for connecting the first portion 8a and an upper magnetic pole layer described later.

The first portion 8a, the second portion 8b, and the third portion 8c of the lower magnetic pole layer 8 are made of NiFe (Ni: 80).
Wt%, Fe: 20 wt%) or NiFe which is a high saturation magnetic flux density material (Ni: 45 wt%, Fe: 55 wt%)
Or the like, and may be formed by a sputtering method using a material such as FeN or FeZrN which is a high saturation magnetic flux density material. In addition, CoFe, Co-based amorphous material or the like, which is a high saturation magnetic flux density material, may be used.

Next, as shown in FIG. 5, an insulating film 9 made of, for example, alumina is entirely
Formed to a thickness of

Next, the photoresist is patterned by a photolithography process to form a frame 19 for forming a thin film coil by a frame plating method. Next, the thin film coil 10 made of, for example, copper (Cu) is
For example, a thickness of about 1.0 to 2.0 μm and 1.2 to 2.0 μm.
It is formed with a coil pitch of 2.0 μm. Next, the frame 19 is removed. In the drawing, reference numeral 10a indicates a connection portion for connecting the thin-film coil 10 to a conductive layer (lead) described later.

Next, as shown in FIG. 6, an insulating layer 11 made of, for example, alumina is formed with a thickness of about 3 to 4 μm on the whole. Next, the insulating layer 11 is polished by, for example, CMP until the second portion 8b and the third portion 8c of the lower magnetic pole layer 8 are exposed, and the surface is flattened. Here, in FIG. 6, the thin film coil 10 is not exposed,
The thin-film coil 10 may be exposed.

Next, on the exposed second and third portions 8b and 8c of the lower magnetic pole layer 8 and the insulating layer 11, a recording gap layer 12 made of an insulating material, for example, 0.2 to 0.
It is formed to a thickness of 3 μm. Generally, the insulating material used for the recording gap layer 12 includes alumina, aluminum nitride, silicon oxide-based material, silicon nitride-based material, diamond-like carbon (DLC), and the like.
Further, the recording gap layer 12 may be formed by a sputtering method or a CVD method. When the recording gap layer 12 made of an alumina film is formed by the CVD method, for example, trimethyl aluminum (Al (CH ₃ ) ₃ ) and H ₂ O are used as materials. C
The use of the VD method makes it possible to form a thin, dense recording gap layer 12 with few pinholes.

Next, in order to form a magnetic path, a contact hole is formed by partially etching the recording gap layer 12 on the third portion 8c of the lower magnetic pole layer 8. In the portion above the connection portion 10a of the thin film coil 10, the recording gap layer 12 and the insulating layer 11 are partially etched to form a contact hole.

Next, as shown in FIG. 7, on the recording gap layer 12, an air bearing surface (a medium facing surface) is formed.
The upper pole layer 13 is formed to have a thickness of about 2.0 to 3.0 μm from 30 to a portion above the third portion 8 c of the lower pole layer 8, and is connected to the connection portion 10 a of the thin-film coil 10. The conductive layer 21 is formed to a thickness of about 2.0 to 3.0 μm. The upper magnetic pole layer 13 is connected to and magnetically coupled to the third portion 8c of the lower magnetic pole layer 8 through a contact hole formed in a portion above the third portion 8c of the lower magnetic pole layer 8. I have.

The upper magnetic pole layer 13 is made of NiFe (Ni: 80).
Wt%, Fe: 20 wt%) or NiFe which is a high saturation magnetic flux density material (Ni: 45 wt%, Fe: 55 wt%)
Or the like, and may be formed by a sputtering method using a material such as FeN or FeZrN which is a high saturation magnetic flux density material. In addition, CoFe, Co-based amorphous material or the like, which is a high saturation magnetic flux density material, may be used. Also, to improve high frequency characteristics,
The upper magnetic pole layer 13 may have a structure in which an inorganic insulating film and a magnetic layer such as permalloy are stacked in any number of layers.

In this embodiment, the upper magnetic pole layer 13 is in contact with the upper surface of the flat recording gap layer 12. The upper magnetic pole layer 13 has a shape in which a gap 60 is partially formed between the upper magnetic pole layer 13 and the recording gap layer 12 at a predetermined position away from the air bearing surface 30. The throat height is defined by the end of the. Void 60 and upper pole layer 13
Is a curved surface. More specifically, the boundary surface between the air gap 60 and the upper magnetic pole layer 13 has a shape that forms a part of a cylindrical surface centered on an axis parallel to the air bearing surface 30 and parallel to the recording gap layer 12. Has become.

The air bearing surface 30 of the gap 60
The end on the side is located closer to the air bearing surface 30 than the end of the second portion 8b of the lower magnetic pole layer 8 opposite to the air bearing surface 30. The end of the gap 60 on the side opposite to the air bearing surface 30 is provided with the lower magnetic pole layer 8.
The second portion 8b is located at a position farther from the air bearing surface 30 than the end opposite to the air bearing surface 30. That is, the gap 60 is arranged so as to straddle the position of the end of the second portion 8b of the lower pole layer 8 opposite to the air bearing surface 30.

The method for forming the upper magnetic pole layer 13 and the gap 60 will be described later in detail.

Next, using the upper pole layer 13 as a mask, the recording gap layer 12 is selectively etched by dry etching. For the dry etching at this time, for example, a chlorine-based gas such as BCl ₂ or Cl ₂ or CF ₄ or SF ₆
And reactive ion etching (RIE) using a gas such as a fluorine-based gas. Next, the second portion 8b of the lower magnetic pole layer 8 is formed by, for example, argon ion milling.
Is selectively etched by about 0.3 to 0.6 μm,
The trim structure is as shown in FIG. According to this trim structure, it is possible to prevent the effective track width from increasing due to the spread of the magnetic flux generated when writing in a narrow track.

Next, as shown in FIG. 8, an overcoat layer 17 made of, for example, alumina
It is formed to a thickness of 0 μm, its surface is flattened, and an electrode pad (not shown) is formed thereon. Finally, the slider including the above layers is polished to form the air bearing surfaces 30 of the recording head and the reproducing head, thereby completing the thin-film magnetic head according to the present embodiment.

In this embodiment, the first portion 8a and the second
Magnetic pole layer 8 composed of a portion 8b and a third portion 8c
Corresponds to the first magnetic layer in the present invention, and the upper magnetic pole layer 13 corresponds to the second magnetic layer in the present invention. In the present embodiment, the upper magnetic pole layer 13 is composed of one layer, and the upper magnetic pole layer 13 also corresponds to the throat height defining layer in the present invention.

FIG. 9 is a plan view (a diagram arranged on the upper side in FIG. 9) and a sectional view (a diagram arranged on the lower side in FIG. 9) of a main part of the thin-film magnetic head according to the present embodiment. FIG. In the plan view in FIG. 9, the overcoat layer 17, other insulating layers and insulating films are omitted. In FIG. 9, the symbol TH
Represents the throat height, TH0 represents the throat height zero position, and MR-H represents the MR height.

As shown in FIG. 9, the upper magnetic pole layer 13
It has a first portion 13A and a second portion 13B arranged in order from the air bearing surface 30 side. The width of the first portion 13A is equal to the recording track width, and
The width of B is larger than the width of the first portion 13A. The width of the second portion 13B gradually decreases as approaching the air bearing surface 30. In the upper magnetic pole layer 13, an edge connecting the widthwise edge of the first portion 13 </ b> A and the widthwise edge of the second portion 13 </ b> B is parallel to the air bearing surface 30. In the upper magnetic pole layer 13, the position of the boundary between the first portion 13A and the second portion 13B is arranged at a position farther from the air bearing surface 30 than the throat height zero position TH0.

FIG. 10 is a sectional view of the lower shield layer 3 to the lower pole layer 8 of the thin-film magnetic head according to the present embodiment.
2 is a perspective view showing a part 8b, an insulating film 9 and a part up to the thin film coil 10 with a part cut away. In FIG. 10, reference numeral 8B denotes a lower magnetic pole layer 8 for forming a trim structure.
Represents a portion where the second portion 8b is etched.

FIG. 11 shows a portion obtained by adding the recording gap layer 12 and the upper magnetic pole layer 13 to the portion shown in FIG.
It is a perspective view which cuts out and shows a part.

Next, with reference to FIGS. 1 and 2, a method of forming the upper magnetic pole layer 13 and the gap 60 in this embodiment will be described in detail.

In this forming method, first, a seed layer (electrode film) 51 for plating is formed on the recording gap layer 12 as shown in FIG. Next, a positive resist layer is formed on the seed layer 51. Next, the resist layer is exposed using the photomask 52. Photo mask 5
Reference numeral 2 denotes a light-shielding region 52a corresponding to the shape of a resist frame for forming the upper magnetic pole layer 13 by the frame plating method, and a position corresponding to the gap 60 to be formed. It has a gap corresponding region 52b for blocking the portion, and a light transmitting region 52c other than the light shielding region 52a and the gap corresponding region 52b.
The gap corresponding region 52b may completely block the light for exposure, or may block a part of the light for exposure and transmit the rest (for example, transmittance of 80%).

After exposing the resist layer using the photomask 52, the resist layer 53 is developed to form a resist frame 53 on the seed layer 51, and at the bottom of the trench portion 54 of the resist frame 53, the resist layer 53 is exposed. A resist remaining portion 55 is formed at a position corresponding to the upper gap.
Note that the resist remaining portion 55 is formed by the non-photosensitive resist remaining after development because at least a part of the exposure light is blocked by the gap corresponding region 52b of the photomask 52.

The resist remaining portion 55 is formed such that the end on the air bearing surface side is located at the throat height zero position TH0. The size of the remaining resist portion 55 is
For example, the length in the direction perpendicular to the air bearing surface is 0.3
３3 μm and the height is 0.1-1 μm.

Next, as shown in FIG. 2, the upper magnetic pole layer 1 is formed by frame plating using a resist frame 53.
Form 3 At this time, no seed layer is formed on the remaining resist portion 55. However, the thickness of the plating film forming the upper magnetic pole layer 13 is larger than the height of the resist remaining portion 55 and is larger than half the length of the resist remaining portion 55 in the direction perpendicular to the air bearing surface. Therefore, when the plating layer overhangs on the remaining resist portion 55, a plating layer is also formed on the remaining resist portion 55, and the upper magnetic pole layer 13 continuous before and after the remaining resist portion 55 is obtained.

Next, the gap 60 is formed by removing the resist frame 53, the resist remaining portion 55, and the seed layer 51 existing thereunder. When the seed layer 51 is removed by wet etching, the seed layer 51 can be removed without leaving the seed layer 51 under the gap 60. When the seed layer 51 is removed by dry etching, the seed layer 51
May remain, but this hardly affects the electromagnetic conversion characteristics.

As described above, the thin-film magnetic head according to the present embodiment has a read head and a write head. The reproducing head has a lower shield layer 3 and an upper shield layer (for shielding the MR element 5) which are arranged so that a part of the side facing the recording medium faces the recording medium with the MR element 5 interposed therebetween. A lower magnetic pole layer 8).

The recording heads are magnetically connected to each other,
A lower pole layer 8 (first portion 8a, second portion 8b, and third portion 8c) and an upper pole layer 13 each including at least one layer on the side facing the recording medium. A write gap layer 12 provided between the magnetic pole portion of the lower magnetic pole layer 8 and the magnetic pole portion of the upper magnetic pole layer 13;
And a thin film coil 10 disposed between the upper magnetic pole layer 13 and the upper magnetic pole layer 13 in a state insulated therefrom.

In the present embodiment, the lower magnetic pole layer 8 includes a first portion 8a arranged at a position facing at least a part of the thin film coil 10, and a first portion 8a on the side of the thin film coil 10 (see FIG. 8 (a), and a second portion 8b forming a magnetic pole portion, and the thin-film coil 10 is provided on the side of the second portion 8b of the lower magnetic pole layer 8 (see FIG. a)).

In this embodiment, the upper magnetic pole layer 13 is formed on the upper surface of the flat recording gap layer 12. The upper magnetic pole layer 13 has a shape that partially forms a gap 60 with the recording gap layer 12 at a predetermined position away from the air bearing surface 30.
The throat height is defined by the end on the air bearing surface 30 side.

According to the present embodiment, the thin-film coil 10 is arranged on the first portion 8a of the lower magnetic pole layer 8 and beside the second portion 8b, and the insulating layer 11 covering the thin-film coil 10 is provided.
Is flattened together with the upper surface of the second portion 8b of the lower pole layer 8, so that the first portion 1 that defines the recording track width is formed.
The upper magnetic pole layer 13 having 3A can be formed on a flat surface. Therefore, according to the present embodiment, even when the recording track width is reduced to, for example, a half-micron dimension or a quarter-micron dimension, the upper magnetic pole layer 13 can be formed with high accuracy, and the recording track width is accurately controlled. It becomes possible.

In this embodiment, the upper pole layer 13
A gap 60 is formed between the gap 60 and the recording gap layer 12, and the throat height is defined by the end of the gap 60 on the air bearing surface 30 side. The magnetic flux heading toward the recording gap layer 12 flows once toward the recording gap layer 12 after being once narrowed down by the gap 60. Therefore, according to the present embodiment,
The flow of magnetic flux toward the recording gap layer 12 through the upper magnetic pole layer 13 can be smoothly changed near the end of the air gap 60 on the air bearing surface 30 side, that is, near the throat height zero position TH0. As a result, according to the present embodiment, the electromagnetic conversion characteristics of the recording head, for example, the overwrite characteristics and the NLTS can be improved.

According to the present embodiment, the gap 60
Since the boundary surface between the magnetic pole and the upper magnetic pole layer 13 is a curved surface, the flow of magnetic flux can be changed more smoothly.

In the present embodiment, the end of the air gap 60 on the air bearing surface 30 side is more air than the end of the second portion 8 b of the lower magnetic pole layer 8 on the side opposite to the air bearing surface 30. It is arranged at a position on the bearing surface 30 side. Therefore, according to the present embodiment, at the position of the end of the air gap 60 on the air bearing surface 30 side, that is, at the side opposite to the air bearing surface 30 with respect to the throat height zero position TH0, the second magnetic pole layer 8 8b and upper pole layer 13
Can be prevented from increasing sharply, and the electromagnetic conversion characteristics can be improved. In order to improve the electromagnetic conversion characteristics, it is preferable that the gap portion 60 be disposed so as to straddle the position of the end of the second portion 8b of the lower magnetic pole layer 8 on the side opposite to the air bearing surface 30. .

Further, according to the present embodiment, the upper magnetic pole layer 13 is formed by the frame plating method, the resist remaining portion 55 is formed at that time, and the void portion 60 is formed by using the resist remaining portion 55. As a result, the gap 60 can be easily formed.

In this embodiment, the thin film coil 10
Is formed on the side of the second portion 8b of the lower magnetic pole layer 8, and is formed on the flat insulating film 9. Therefore, according to the present embodiment, it is possible to form the thin-film coil 10 finely and precisely. Further, according to the present embodiment, since the apex portion does not exist, the end of the thin-film coil 10 is located near the end of the second portion 8b of the lower magnetic pole layer 8 opposite to the air bearing surface 30. Can be arranged. From these facts, according to the present embodiment, the magnetic path length can be reduced.

Further, according to the present embodiment, since the magnetic path length can be reduced, the total length of the thin-film coil 10 can be greatly reduced without changing the number of turns. As a result, the resistance of the thin-film coil 10 can be reduced, and accordingly, the thickness of the thin-film coil 10 can be reduced.

In the present embodiment, since the insulating film 9 made of an inorganic material that is thin and has a sufficient withstand voltage is provided between the first portion 8a of the lower magnetic pole layer 8 and the thin-film coil 10, A large withstand voltage can be obtained between the first portion 8 a of the lower magnetic pole layer 8 and the thin-film coil 10.

In this embodiment, the thin film coil 10
Is covered with the insulating layer 11 made of an inorganic insulating material, so that the magnetic pole portion can be prevented from protruding toward the recording medium due to expansion due to heat generated around the thin film coil 10 during use of the thin film magnetic head. .

The present invention is not limited to the above embodiment, and various changes can be made. For example, in the above-described embodiment, the upper magnetic pole layer 13 is constituted by one layer, but the upper magnetic pole layer 13 may be constituted by a plurality of layers. In this case, the layer including the magnetic pole portion corresponds to the throat height defining layer in the present invention.

In the above-described embodiment, a thin-film magnetic head having a structure in which a reading MR element is formed on the substrate side and an inductive electromagnetic transducer for writing is stacked thereon has been described. The order may be reversed.

That is, an inductive electromagnetic transducer for writing may be formed on the substrate side, and an MR element for reading may be formed thereon. In such a structure, for example, the magnetic film having the function of the upper magnetic pole layer shown in the above-described embodiment is formed on the substrate side as a lower magnetic pole layer, and the magnetic film having the above-described structure is opposed to the magnetic pole layer via a recording gap film. It can be realized by forming the magnetic film having the function of the lower magnetic pole layer shown in the embodiment as the upper magnetic pole layer. In this case, it is preferable to use the upper magnetic pole layer of the induction type electromagnetic transducer and the lower shield layer of the MR element together.

The present invention can also be applied to a thin-film magnetic head exclusively for recording provided with only an inductive electromagnetic transducer, and a thin-film magnetic head which performs recording and reproduction by using an inductive electromagnetic transducer.

[0081]

As described above, according to the method of manufacturing a thin film magnetic head according to any one of claims 1 to 6 or the method of manufacturing a thin film magnetic head according to any one of claims 7 to 13, a gap layer is included. Since the throat height defining layer is formed so as to be in contact with the flat surface, the magnetic pole portion can be formed with high accuracy, and is partially formed between the throat height defining layer and the gap layer. Since the throat height is defined by the end of the gap on the medium facing surface side, the flow of magnetic flux toward the gap layer through the throat height defining layer is smoothed near the end of the gap on the medium facing surface side. , And as a result, there is an effect that the electromagnetic conversion characteristics can be improved.

Further, according to the method of manufacturing a thin film magnetic head according to claim 2 or the method of manufacturing a thin film magnetic head according to claim 8,
Since the boundary surface between the air gap and the throat height defining layer is a curved surface, the flow of the magnetic flux can be more smoothly changed.

According to the thin film magnetic head of the fifth aspect or the method of manufacturing a thin film magnetic head of the eleventh aspect, the first magnetic layer is disposed at a position facing at least a part of the thin film coil. A first portion connected to a surface of the first portion on the thin film coil side, the second portion including a magnetic pole portion;
At least a portion of the thin-film coil is disposed on the side of the second portion of the first magnetic layer, and the end of the gap on the medium facing surface side is placed on the first magnetic layer. Since the second portion is disposed at a position closer to the medium facing surface than an end of the second portion opposite to the medium facing surface, the second portion is located on a side opposite to the medium facing surface than a position of an end of the gap on the medium facing surface side. In this case, it is possible to prevent an abrupt increase in the distance between the first magnetic layer and the second magnetic layer, thereby improving the electromagnetic conversion characteristics.

According to the method of manufacturing a thin film magnetic head according to the sixth aspect or the thin film magnetic head of the twelfth aspect, the throat height defining layer includes a portion defining the track width. This has the effect of enabling accurate control.

According to the method of manufacturing a thin film magnetic head according to the thirteenth aspect, since the gap is formed by using the remaining resist, there is an effect that the gap can be easily formed. .

[Brief description of the drawings]

FIG. 1 is a perspective view for explaining a method of forming an upper pole layer and a gap in a thin-film magnetic head according to an embodiment of the present invention.

FIG. 2 is a perspective view for explaining a method of forming an upper pole layer and a gap in the thin-film magnetic head according to one embodiment of the present invention.

FIG. 3 is a cross-sectional view for explaining one step in the method of manufacturing the thin-film magnetic head according to one embodiment of the present invention.

FIG. 4 is a cross-sectional view for explaining a step following the step shown in FIG. 3;

FIG. 5 is a cross-sectional view for explaining a step following the step shown in FIG. 4;

FIG. 6 is a cross-sectional view for explaining a step following the step shown in FIG. 5;

FIG. 7 is a cross-sectional view for explaining a step following the step shown in FIG. 6;

FIG. 8 is a cross-sectional view of the thin-film magnetic head according to one embodiment of the present invention.

FIG. 9 is an explanatory diagram showing a plan view and a cross-sectional view of a main part of the thin-film magnetic head according to one embodiment of the present invention in association with each other.

FIG. 10 is a perspective view showing a main part of the thin-film magnetic head according to one embodiment of the present invention, with a part cut away.

FIG. 11 is a perspective view showing a main part of the thin-film magnetic head according to one embodiment of the present invention, with a part cut away.

FIG. 12 is a cross-sectional view for explaining one step in a conventional method of manufacturing a thin-film magnetic head.

FIG. 13 is a cross-sectional view for explaining a step following the step shown in FIG. 12;

FIG. 14 is a sectional view for illustrating a step following the step shown in FIG. 13;

FIG. 15 is a sectional view for illustrating a step following the step shown in FIG. 14;

FIG. 16 is a plan view of a conventional magnetic head.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Insulating layer, 3 ... Lower shield layer, 5 ... MR
Element 8, lower magnetic pole layer, 8a first part, 8b second
, 8c: third part, 10: thin-film coil, 11 ...
Insulating layer, 12: recording gap layer, 13: upper magnetic pole layer, 1
7 ... overcoat layer, 60 ... voids.

Claims (13)

[Claims] A first and a second magnetic layer magnetically coupled to each other and including magnetic pole portions facing each other on a medium facing surface side facing a recording medium, each including at least one layer; A gap layer provided between the magnetic pole portion of the magnetic layer and the magnetic pole portion of the second magnetic layer, at least a part of which is between the first and second magnetic layers;
A thin-film coil provided in a state insulated from the first and second magnetic layers, wherein the second magnetic layer is formed on a flat surface including the gap layer. A throat height having a shape that partially forms a gap between the gap layer at a predetermined position in contact with and away from the medium facing surface, and defining a throat height by an end of the gap on the medium facing surface side; A thin-film magnetic head having a definition layer. 2. The thin-film magnetic head according to claim 1, wherein a boundary surface between the gap and the throat height defining layer forms a curved surface. 3. The first magnetic layer is connected to a first portion disposed at a position facing at least a part of the thin-film coil, and is connected to a surface of the first portion on the thin-film coil side, A second portion including a magnetic pole portion, wherein at least a part of the thin-film coil is arranged on a side of the second portion of the first magnetic layer. Or the thin-film magnetic head according to 2. 4. The first magnetic layer further covers at least a part of the thin film coil disposed on the side of the second portion of the first magnetic layer, and a surface of the thin film coil on a side of the gap layer is formed of the first magnetic layer. 4. The thin-film magnetic head according to claim 3, further comprising an insulating layer planarized with a surface of the second portion on the gap layer side. 5. The end of the gap on the medium facing surface side is located closer to the medium facing surface than the end of the second portion of the first magnetic layer on the side opposite to the medium facing surface. 5. The thin-film magnetic head according to claim 3, wherein the thin-film magnetic head is arranged. 6. The thin-film magnetic head according to claim 1, wherein the throat height defining layer includes a portion for defining a track width. 7. A first and a second magnetic layer magnetically coupled to each other and including magnetic pole portions facing each other on a medium facing surface side facing a recording medium, each including at least one layer; The magnetic pole portion of the magnetic layer and the second
A gap layer provided between the magnetic pole portion of the magnetic layer,
At least a portion between the first and second magnetic layers,
A method of manufacturing a thin-film magnetic head, comprising: a thin-film coil provided in a state insulated from the first and second magnetic layers, wherein the step of forming the first magnetic layer; Forming the gap layer on the first magnetic layer; forming the second magnetic layer on the gap layer; and forming the thin-film coil; The step of forming a layer has a shape in which a gap is formed in contact with the flat surface including the gap layer and partially with the gap layer at a predetermined position away from the medium facing surface. Forming a throat height defining layer for defining a throat height by an end portion on the medium facing surface side of the thin film magnetic head. 8. The method according to claim 7, wherein a boundary surface between the gap and the throat height defining layer forms a curved surface. 9. The step of forming the first magnetic layer includes: a first portion disposed at a position facing at least a part of the thin film coil; and a surface of the first portion on the thin film coil side. And forming a second portion including a magnetic pole portion, wherein the step of forming the thin film coil comprises: placing at least a portion of the thin film coil on a side of the second portion of the first magnetic layer. 9. The method for manufacturing a thin-film magnetic head according to claim 7, wherein the thin-film magnetic head is disposed. 10. The first magnetic layer further covers at least a portion of the thin-film coil disposed on the side of the second portion of the first magnetic layer, and a surface of the thin-film coil on a gap layer side is formed of the first magnetic layer. 10. The method of manufacturing a thin-film magnetic head according to claim 9, further comprising a step of forming a planarized insulating layer together with the surface of the second portion on the gap layer side. 11. An end of the gap on the medium facing surface side,
11. The thin-film magnetic head according to claim 9, wherein the first magnetic layer is disposed at a position closer to the medium facing surface than an end of the second portion opposite to the medium facing surface. Manufacturing method. 12. The method according to claim 7, wherein the throat height defining layer includes a portion for defining a track width. 13. The step of forming the throat height defining layer includes: a step of forming a seed layer for plating on the gap layer; and a step of forming a positive resist layer on the seed layer. A light-shielding region corresponding to the shape of a frame for forming the throat height defining layer by a plating method, and a void portion corresponding region provided at a position corresponding to the void portion and blocking at least a part of light for exposure. Exposure of the resist layer using a photomask having a light-transmitting region other than the light-shielding region and the cavity corresponding region, and then developed,
Forming the frame on the seed layer and forming a resist remaining portion at a position corresponding to the gap on the seed layer; forming the throat height defining layer by plating using the frame; 13. The method of manufacturing a thin-film magnetic head according to claim 7, further comprising: a step of forming the gap by removing the frame and the remaining resist.