JP2001154610A - Electro-optical device, mounting structure of semiconductor device used therefor, and electronic apparatus - Google Patents

Abstract

(57) [Problem] To provide an electro-optical device capable of reducing a mounting area of a semiconductor device and narrowing a frame, and a mounting structure of a semiconductor device used for the electro-optical device. An electro-optical device having an electro-optical material between a pair of substrates (30, 32) and a semiconductor device (2) mounted on a peripheral portion (32a) of at least one of the pair of substrates (30, 32). In addition, the peripheral portion 32a is the peripheral portion 3
End surface 30 of the other substrate 30 at a position facing 2a
e, substrate terminal portions 6a, 6b are exposed on the surface of the peripheral portion 32a and / or the end surface 30e of the other substrate 30, and the electrode portions 2a, 2b formed on the surface of the semiconductor device 2,
2b is electrically connected to the substrate terminal portions 6a and 6b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electro-optical device, a mounting structure of a semiconductor device used therein, and an electronic apparatus.

[0002]

2. Description of the Related Art Liquid crystal display devices, plasma displays,
2. Description of the Related Art An electro-optical device such as an EL (electroluminescence) is a panel in which an electro-optical material such as a liquid crystal (a material whose optical property changes when a voltage is applied) is disposed between a pair of substrates on which predetermined electrodes are formed. By controlling the voltage between the electrodes and the like, an image is normally displayed in the direction of the surface of the panel. The electro-optical device includes, for example, a semiconductor device (such as an IC) which is a drive circuit for supplying an image signal or an image control signal.
However, it is usually mounted on the frame of the panel. Such a conventional electro-optical device will be described by taking a liquid crystal display device shown in FIGS. 11 to 13 as an example.

FIG. 11 shows an active matrix type TF.
2 shows an equivalent circuit of a D (Thin Film Diode) liquid crystal display device. The liquid crystal display device 110 includes a plurality of scanning lines 1.
12 and a plurality of data lines 114 intersecting with the thin film diode 1 which is a two-terminal switching element.
Reference numeral 20 is used for switching control of each pixel. In each pixel region 116, the thin film diode 12 described above is provided between the scanning line 112 and the data line 114.
0 and a liquid crystal (electro-optical material) 141 are connected in series. Further, the scanning signal driving circuit 200 and the data signal driving circuit 210 are mounted on the liquid crystal display device 110 in a manner described later.

The overall structure of the liquid crystal display device 110 is shown in FIG.
2, an element substrate 130 and a counter substrate 132 are provided substantially in contact with each other.
A liquid crystal (not shown) is sealed between 32. An insulating film 131 is formed on the element substrate 130.
Are provided with a plurality of scanning lines 112. And
A pixel electrode 134 made of a transparent electrode such as ITO is connected to the scanning line 112 via the thin film diode 120.
On the other hand, a plurality of data lines 114 made of transparent electrodes are formed in a rectangular shape on the opposite substrate 132 so as to intersect with the scanning lines 112, and a color filter (not shown)
A black matrix or the like is formed.

The thin-film diode 120 is connected to the scanning line 1
A flaky element portion 1 extending from 12 to the pixel electrode 134 side
12a, and an insulating film is formed on the element portion 112a. Then, the conductive film 11 is formed so as to cover the element portion 112a and partially overlap the pixel electrode 134.
3 (MIM structure). And scanning line 1
12 and a signal applied to the data line 114,
The display operation is controlled by switching the liquid crystal, which is an electro-optical material, to a display state, a non-display state, or an intermediate state.

In the case of the above-mentioned TFD type liquid crystal device, since the scanning lines and the data lines are separately provided on the element substrate and the counter substrate, respectively, usually, as shown in FIG. A drive circuit is mounted on each of the opposing substrates.

In FIG. 1, an element substrate 130 is opposed to an opposing substrate 132 via a seal 150. The sealing section 150 is sealed by the sealing section 152. The left and right sides of the counter substrate 132 are the element substrates 1
The peripheral portion 132 a on the right side of the counter substrate 132 is longer than the left and right sides of the counter substrate 30 and protrudes from the element substrate 130. In this case, the data line 1 formed on the opposite substrate 132
14 extends on the surface of the peripheral portion 132a, and the data signal drive circuit 210 is mounted on this portion and connected to the data line. Further, the data signal drive circuit 210 is electrically connected to the input / output terminal 310 to which a signal is input from the outside.

On the other hand, the upper and lower sides of the element substrate 130 are longer than the upper and lower sides of the opposing substrate 132, and a peripheral portion 130 a on the lower side of the element substrate 130 projects from the opposing substrate 132. Then, the scanning line 1 formed on the element substrate 130
Numeral 12 extends on the surface of the peripheral portion 130a (the back side of the substrate in the figure), and the scanning signal drive circuit 200 is mounted on this portion and connected to the scanning lines. Further, the scanning signal driving circuit 200 is electrically connected to the input / output terminal 300. In this case, the drive circuits 200 and 210 can be mounted by, for example, a COG (Chip On Glass) method in which these drive circuits are connected to scanning lines and data lines on a substrate by bumps.

[0009]

In the above-mentioned electro-optical device, it is necessary to provide a space for mounting a drive circuit (semiconductor device) on the peripheral portion of the substrate. There is a problem that the area occupied by the frame portion (image non-display region) of the electro-optical device increases. In particular, when a data line and a scanning line are separately provided on each substrate as in an electro-optical device of a TFD system, it is necessary to separately mount a data signal driving circuit and a scanning signal driving circuit on each substrate. Therefore, the area of the frame portion tends to be further increased.

The present invention solves the above-mentioned problems in the electro-optical device, reduces the mounting area of the semiconductor device, enables the frame to be narrowed, the mounting structure of the semiconductor device used for the electro-optical device, and electronic equipment. The purpose is to provide.

[0011]

In order to achieve the above-mentioned object, the present invention has an electro-optical material between a pair of substrates, and a semiconductor is provided on a peripheral portion of at least one of the pair of substrates. An electro-optical device in which the device is mounted, wherein the peripheral portion is located outside an end surface of the other substrate at a position facing the peripheral portion, and a surface of the peripheral portion and / or a surface of the other substrate. A substrate terminal portion is exposed on an end face, and an electrode portion formed on a surface of the semiconductor device is electrically connected to the substrate terminal portion.

According to such a configuration, the electrode portion of the semiconductor device can be directly connected to the surface of the peripheral portion of the substrate or the substrate terminal portion exposed on the end surface. Useless wiring portions can be omitted, and the mounting area of the semiconductor device can be significantly reduced.

Further, in the present invention, it is preferable that an end face of the other substrate is inclined with respect to a surface of the substrate.

Further, in the present invention, the semiconductor device has two end faces, an electrode portion is formed on at least one of the two end faces, and an angle formed between the two end faces is equal to a surface of the peripheral edge portion. The electrode portion is connected to the substrate terminal in a state in which the angle is substantially the same as the angle formed by the end surface of the other substrate, and the two end surfaces are substantially in contact with the surface of the peripheral portion and the end surface of the other substrate, respectively. Preferably, it is electrically connected to the unit.

According to such a configuration, the two end surfaces of the semiconductor device can be brought into almost contact with the surface and the end surface of each substrate, and the dead space between the substrate and the semiconductor device can be eliminated. The mounting area can be further reduced.

The present invention is an electro-optical device having an electro-optical material between a pair of substrates, wherein a semiconductor device is mounted on a peripheral portion of at least one of the pair of substrates, The peripheral portion is located outside an end surface of the other substrate at a position facing the peripheral portion, and a substrate terminal portion is exposed on a surface of the peripheral portion and / or an end surface of the other substrate, and Is mounted on a mounting member, and a lead portion of the semiconductor device is electrically connected to an electrode portion formed on a surface of the mounting member, and the electrode portion is electrically connected to the substrate terminal portion. It is characterized by.

Further, in the present invention, it is preferable that an end surface of the other substrate is inclined with respect to a surface of the substrate.

Further, in the present invention, the mounting member has two end faces, the electrode portion is formed on at least one of the two end faces, and an angle formed between the two end faces is a surface of the peripheral portion. And the electrode portion is substantially the same as the angle formed between the substrate and the other substrate and the two end surfaces are substantially in contact with the surface of the peripheral portion and the end surface of the other substrate. Preferably, it is electrically connected to the terminal.

Preferably, the mounting member is made of resin, the electrode part is made of metal foil, and a part of the electrode part is buried in the resin.

Preferably, a conductive film is interposed between the electrode portion and the substrate terminal portion.

Preferably, the semiconductor device has a circuit formed on the surface of a spherical semiconductor.

It is preferable that the electro-optical device is of a matrix type having two-terminal switching elements.

The mounting structure of a semiconductor device according to the present invention is used in each of the above-described electro-optical devices, and the electrode portion formed on the semiconductor device or the mounting member is provided on one of the substrates or the other substrate. It is characterized by being electrically connected to the terminal portion.

According to another aspect of the invention, an electronic apparatus includes the above-described electro-optical devices.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an electro-optical device according to a first embodiment of the present invention will be described with reference to FIGS. In the following description, a device in which a semiconductor device is mounted on a substrate without a mounting member to be described later is referred to as a first invention, and a device using a mounting member is referred to as a second invention.

In FIG. 1, this electro-optical device 80
An active matrix type TFD liquid crystal display device having a plurality of pixels arranged in a matrix. The device substrate (the other substrate) 30 on which a control diode (not shown) for each pixel and a scanning line 12 are provided. A counter substrate (one substrate) 32 is disposed under the element substrate 30 with a seal portion 60 interposed therebetween, and has the data line 14 disposed thereon. The distance between the substrates 30 and 32 is defined by a bead-shaped spacer having a predetermined diameter and glass fibers contained in the sealing portion 60, and a liquid crystal (electro-optical material) is provided in the internal space surrounded by the sealing portion 60 and the substrates 30 and 32. Is enclosed. Note that the present invention is characterized by the mounting mode of the semiconductor device described later, and the other structures of the substrates 30 and 32 and the operation of the liquid crystal display are substantially the same as those of a known electro-optical device (TFD liquid crystal display device or the like). The description is omitted because it is similar.

In this electro-optical device, the opposing substrate 32
Left and right sides of the element substrate 30 are longer than the left and right sides thereof, and a peripheral portion 32a on the left side of the counter substrate 32 projects from the element substrate 30 (for example, the length of the overhang portion is 3 mm).
That is, the peripheral portion 32a is located outside the end surface 30e of the element substrate 30 at a position facing the peripheral portion 32a.
The end surface 30e of the element substrate 30 is formed in an inclined surface so as to form an angle γ = 45 ° with respect to the upper surface thereof, so that mounting of the semiconductor device 2 described later can be performed easily and reliably. ing.

Then, on the upper surface of the peripheral portion 32a,
Semiconductor device 2 which is a driving circuit for a scanning signal and a data signal
Are mounted to constitute the electro-optical device 80. That is, in the present invention, the scanning lines 12 provided on the element substrate 30 and the data lines 14 provided on the counter substrate 32 are connected to one semiconductor device 2 and driven. To do so, the data lines 14 on the counter substrate 32 are bent and extended in the direction of the scanning lines 12 near the peripheral portion 32a so as to be connected to the upper and lower ends of the semiconductor device 2. Has become. Note that an input / output terminal 50 to which a signal is input from the outside is arranged on the edge of the peripheral portion 32a, and the semiconductor device 2 is connected to the input / output terminal 50.

The sectional structure of the above-described electro-optical device 80 is as follows.
As shown in FIG. In this figure, a semiconductor device 2 is formed by molding a predetermined semiconductor circuit with a resin or the like. The semiconductor device 2 has a substantially trapezoidal cross section in the left-right direction (for example, a height of 1 mm and a bottom length of 2 mm), and the length in the longitudinal direction is substantially the same as the upper and lower sides of the element substrate 30 in this example. Land-shaped electrode portions 4a and 4b are formed on the bottom surface 2a and the side surface 2b, respectively. When the semiconductor device 2 is mounted, the upper surface of the semiconductor device 2 is substantially flush with the upper surface of the element substrate 30. On the other hand, the scanning lines 12 are appropriately routed (extended) on the end face 30 e of the element substrate 30 to be exposed as land-like substrate terminal portions 6 b, and the data lines 14 are formed on the surface of the peripheral portion 32 a of the counter substrate 32. It is appropriately routed (extended) and exposed as a land-shaped substrate terminal portion 6a.

The angle θ between the bottom surface 2a and the side surface 2b in the semiconductor device 2 is substantially the same as the angle (= γ) between the surface of the peripheral portion 32a and the end surface 30e of the element substrate 30. When the device 2 is mounted, the bottom surface 2a is almost in contact with the surface of the peripheral portion 32a, and the side surface 2b is almost in contact with the end surface 30e. In this case, as described above, when the end surface 30e is inclined with respect to the surface of the substrate 30, the facing area between the end surface 30e and the side surface 2b increases, and the connection between the electrode portion and the substrate terminal portion 6b is more reliable. Becomes
Further, when the angle γ is an acute angle, the semiconductor device 2 is less likely to come off the substrate 32 after mounting. In this case, for example, an ACF (Anisotropic conductive film) is formed on the bottom surface 2a and the side surface 2b.
m: anisotropic conductive film), and a film-like conductive film 70 containing conductive particles is adhered to each other and thermocompression-bonded to each of the electrode portions 4a and 4b, so that the electrode portion 4a
a, and the electrode portion 4b is electrically connected to the substrate terminal portion 6b.

As described above, according to the present invention, the substrate terminal is exposed on the surface or the end surface of the peripheral portion of the substrate.
The electrode portions of the semiconductor device are directly connected to these substrate terminal portions. Therefore, a useless wiring portion between the semiconductor device and the substrate can be omitted, and the mounting area of the semiconductor device can be significantly reduced, and the frame of the electro-optical device can be narrowed. In particular, when two end faces are formed in a semiconductor device, and the angle between the two end faces is substantially the same as the angle between the surface of the peripheral portion of the substrate and the end face of the other substrate, the end face of the semiconductor device becomes The semiconductor device is substantially in contact with (close to) each substrate, and a dead space between the substrate and the semiconductor device can be eliminated, so that the mounting area of the semiconductor device is further reduced.

Further, in an electro-optical device such as a TFD liquid crystal device in which a semiconductor device needs to be connected to both the element substrate and the counter substrate, the semiconductor device can be mounted directly on the end face of the substrate. It is also possible to control the scanning lines and the data lines provided on the element substrate and the counter substrate with one semiconductor device.

As a method of forming the substrate terminal portions 6a and 6b, for example, a metal film may be formed on the surface or end surface of each of the substrates 30 and 32 using a predetermined mask. In particular, when forming a substrate terminal portion (and its lead wiring) on the end surface of the element substrate, an electrode such as ITO is formed on the front surface side of the element substrate, and then, in the next step, the substrate terminal portion and the lead wiring are provided on the end surface portion. Is preferably formed. At this time, if the edge portion between the end surface and the front surface side of the substrate is chamfered in advance, the above-described film formation of the substrate terminal portion (routing wiring) can be reliably performed.

In the above embodiment, a TFD liquid crystal display device is exemplified as an electro-optical device. However, the present invention is not limited to this, and other liquid crystal devices such as TFT and STN, a plasma display, The invention can be applied to EL (electroluminescence) and the like.
Further, the semiconductor device is not limited to a driving circuit for a scanning signal or a data signal, but may be another control circuit or the like. The scanning signal and the data signal may be driven by one semiconductor device, or may be driven by separate semiconductor devices. Further, there is no limitation on the shape, size, number of mountings, and mounting positions of the semiconductor device. For example, it is possible to provide peripheral portions on a plurality of sides of one substrate, and mount the semiconductor devices there. There is no limitation on the specific mounting method of the semiconductor device, for example, wire bonding, flip chip method, bump method,
A TAB (Tape Automated Bonding) method or the like can be used.

As the electrode section, for example, a bump or a bonding pad can be used. There is no limitation on the number of electrode portions and substrate terminal portions. For example, the substrate terminal portion may be formed only on the surface of the peripheral portion of one substrate, and the electrode portion may be provided only on the bottom surface of the semiconductor device correspondingly. . Further, there is no limitation on the angle (= γ) at which the end surface of the other substrate is inclined with respect to the surface of the other substrate.

Next, another embodiment of the electro-optical device according to the first aspect of the present invention will be described with reference to FIG. In this embodiment, the electro-optical device 90 is an active matrix type TFT liquid crystal display device, and an opposing substrate (one substrate) 37 is disposed to face the lower surface of the element substrate (the other substrate) 35. The left and right sides and the upper and lower sides of the element substrate 35 are shorter than the counter substrate 37, and the peripheral portions of the left side and the lower side of the counter substrate 37 are both the element substrate 3.
5 and the semiconductor device 2
2, 24 are implemented.

In the case of the electro-optical device 90 of the TFT type, since the scanning lines 17 and the data lines 19 are both provided on the element substrate 35 side, the semiconductor devices 22 and 24 as drive circuits are connected to the element substrate 35. There is a need to. Therefore,
The scanning lines 22 are appropriately routed (extended) on the left end surface 35a of the element substrate 35, are exposed as substrate terminals, and the data lines 24 are appropriately routed (extended) on the lower end surface 35b. It is exposed as another board terminal part. On the other hand, predetermined electrode portions are formed on both side end surfaces of the semiconductor devices 22 and 24, and each electrode portion is connected to each of the above-described substrate terminal portions. 55b. The end surfaces 35 a and 35 b are formed at right angles to the surface of the element substrate 35. As described above, the present invention can be effectively applied even when the scanning lines and the data lines are provided on the element substrate side.

Next, an electro-optical device according to a second aspect of the present invention will be described with reference to FIG. In this electro-optical device, instead of the first invention, a semiconductor device is mounted on a substrate via a mounting member, and other configurations are the same as those of the TFD liquid crystal display device shown in FIGS. The description is omitted because it is the same. FIG. 4 is a cross-sectional view corresponding to FIG. 2 (corresponding to a cross-sectional view taken along line AA ′ in FIG. 1).

In this figure, the semiconductor device 2A is molded on a mounting member 8 made of, for example, a polyimide resin. A wiring made of a conductor such as a narrow copper foil is connected to the lead portion 2c of the semiconductor device 2A. The wiring passes through the mounting member 8 and is exposed on the bottom surface 8a and the side surface 8b of the mounting member 8, respectively. And land-shaped electrode portions 4c and 4d. Then, as in the first aspect described above, the angle formed by the bottom surface 8a and the side surface 8b is substantially the same as the angle formed by the surface of the peripheral portion 32a and the end surface 30e of the element substrate 30. A conductive film 70 is appropriately adhered to the side surface 8b, and thermocompression-bonded to each of the electrode portions 4c and 4d.
c, 4d are electrically connected to the substrate terminal portions 6a, 6b, respectively.

Thus, even when the mounting member 8 is used, the mounting area of the semiconductor device can be reduced and the frame of the electro-optical device can be narrowed in the same manner as in the first invention. Here, as a method of manufacturing the mounting member 8, the semiconductor device 2A and the above-described wiring are molded, and then a predetermined end surface is sliced to obtain a bottom surface 8a on which an electrode portion is exposed.
And the side surface 8b. Although the input / output terminals are omitted in FIG.
May be appropriately connected to the input / output terminal.

Further, instead of molding (embedding) the semiconductor device 2A on the mounting member 8, as shown in FIG. 5, the semiconductor device 2A is mounted on the surface (the upper surface in the figure) of the mounting member 8.
May be detachably attached. This has the advantage that replacement of the semiconductor device 2A and the like can be simplified. Also, as shown in FIG.
When the electrode portions 4e and 4f are formed by extending (routing) the wiring along the side and the side surface 8b, each of the electrode portions 4
e, 4f and the contact area between the board terminal portions 6a, 6b are preferably large.

Then, as shown in FIG.
The wiring portion may be embedded in the substrate inside the end face 30e '. In particular, the inclination angle (= γ) of the end face 30e ′ is 90
When it is (or near 90), it is difficult to route scanning lines and data lines along the end face from the back surface of the other substrate. Therefore, as described above, when the scanning lines (data lines) are embedded inside the end face of the substrate, the wiring can be easily routed to the end face of the substrate.

In each of the above embodiments, a semiconductor device in which a predetermined circuit is formed on a normal semiconductor wafer is used. Alternatively, as shown in FIG. (Spherical semiconductor integrated circuit) having a circuit formed on the surface thereof can also be used. In addition,
This embodiment is the same as the TFD liquid crystal display device shown in FIGS. 1 and 2 except for the semiconductor device, and thus the description thereof is omitted. FIG. 7 is a cross-sectional view corresponding to FIG. 2 (corresponding to a cross-sectional view along the line AA ′ in FIG. 1).

In this figure, a semiconductor device 26 is a spherical semiconductor integrated circuit composed of a silicon sphere having a diameter of about 1 mm, and a predetermined portion of the surface thereof has an electrode portion 40a in which a plurality of bumps are arranged circumferentially. , 40b are provided. The semiconductor device 26 is mounted on the counter substrate 32 by connecting the electrode portions 40a and 40b to the substrate terminal portions 6a and 6b, for example, by a flip-chip method. Note that another spherical semiconductor integrated circuit 28 is mounted on the semiconductor device 26, and both are connected via the same bumps as described above.

As described above, when a spherical semiconductor device is used, the surface of the semiconductor device surely comes into contact with the surface of the peripheral portion of the substrate and the end surface of the other substrate. It can be easily connected to the unit. In this embodiment, the case where the spherical semiconductor device 26 is directly mounted on each of the substrates 30 and 32 is exemplified. However, the semiconductor device 26 is mounted on a predetermined mounting member, and mounted on the substrate via this mounting member. May be.

[Electronic Equipment] Specific examples of electronic equipment having the electro-optical device of the present invention will be described below.

FIG. 8 is a perspective view showing an example of a mobile phone.

In FIG. 8, reference numeral 1000 denotes a portable telephone body, and reference numeral 1001 denotes a liquid crystal display unit using the above-described electro-optical device.

FIG. 9 is a perspective view showing an example of a wristwatch-type electronic device.

In FIG. 9, reference numeral 1100 denotes a watch main body, and reference numeral 1101 denotes a liquid crystal display unit using the above-described electro-optical device.

FIG. 10 is a perspective view showing an example of a portable information processing device such as a word processor or a personal computer.

In FIG. 10, reference numeral 1200 denotes an information processing device, reference numeral 1202 denotes an input unit such as a keyboard, and reference numeral 1 denotes an input unit.
Reference numeral 204 denotes an information processing apparatus main body, and reference numeral 1206 denotes a liquid crystal display unit using the above-described electro-optical device.

Since the electronic apparatus shown in FIGS. 8 to 10 is provided with a liquid crystal display unit using the above-described electro-optical device, the electronic apparatus having a small frame area and reduced weight and size can be used. Can be realized.

[0054]

As is apparent from the above description, according to the present invention, the substrate terminal is exposed on the surface or the end surface of the peripheral portion of the substrate, and the electrode of the semiconductor device is directly connected to the substrate terminal. Connected. Therefore, a useless wiring portion between the semiconductor device and the substrate can be omitted, and the mounting area of the semiconductor device can be significantly reduced, and the frame of the electro-optical device can be narrowed. In particular, when two end faces are formed in a semiconductor device, and an angle formed between the two end faces is substantially the same as an angle formed between the surface of the peripheral portion of the substrate and the end face of the other substrate,
Since the end surface of the semiconductor device can be brought into close contact with each substrate to eliminate a dead space between the substrate and the semiconductor device, the mounting area of the semiconductor device can be further reduced.

Further, in the case of a TFD liquid crystal device or the like in which the semiconductor device needs to be connected to both the element substrate and the counter substrate, the semiconductor device can be directly mounted on the end face of the substrate, so that the mounting area can be greatly reduced. It is also possible to control the scanning lines and the data lines provided on the element substrate and the counter substrate with one semiconductor device.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electro-optical device according to a first invention of the present invention.

FIG. 2 is a sectional view taken along the line A-A 'of FIG.

FIG. 3 is a perspective view showing another example of the electro-optical device according to the first invention of the present invention.

FIG. 4 is a partial sectional view showing an electro-optical device according to a second invention of the present invention.

FIG. 5 is a partial sectional view showing another example of the electro-optical device according to the second invention of the present invention.

FIG. 6 is a partial sectional view showing still another example of the electro-optical device according to the second invention of the present invention.

FIG. 7 is a partial cross-sectional view showing an electro-optical device using a spherical semiconductor integrated circuit as a semiconductor device.

FIG. 8 is a perspective view illustrating an example of an electronic apparatus including the electro-optical device according to the invention.

FIG. 9 is a perspective view showing another example of the electronic device.

FIG. 10 is a perspective view showing still another example of the electronic device.

FIG. 11 is an equivalent circuit in a conventional active matrix type TFD liquid crystal display device.

FIG. 12 is a partial cross-sectional perspective view showing a structure of a conventional active matrix type TFD liquid crystal display device.

FIG. 13 is a plan view showing a conventional active matrix type TFD liquid crystal display device.

[Explanation of symbols]

2, 2A, 22, 24, 26, 28 Semiconductor device 2a, 2b End face 2c of semiconductor device Lead portion 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4
0a, 40b Electrode part 6a, 6b Substrate terminal part 8 Mounting member 12, 17 Scan line 14, 19 Data line 30, 35 Element substrate (the other substrate) 32, 37 Opposite substrate (one substrate) 32a Peripheral portion 30e of substrate , 30e 'Edge of the substrate

Claims (12)

[Claims] 1. An electro-optical device having an electro-optical material between a pair of substrates, wherein a semiconductor device is mounted on a peripheral portion of at least one of the pair of substrates, wherein the peripheral portion is , Located outside the end surface of the other substrate at a position facing the peripheral portion, and the surface of the peripheral portion and / or
Alternatively, a substrate terminal portion is exposed on an end surface of the other substrate, and an electrode portion formed on a surface of the semiconductor device is electrically connected to the substrate terminal portion. 2. The electro-optical device according to claim 1, wherein an end surface of the other substrate is inclined with respect to a surface of the substrate. 3. The semiconductor device has two end faces, an electrode portion is formed on at least one of the two end faces, and an angle formed between the two end faces is defined by a surface of the peripheral portion and a surface of the other substrate. The electrode portion is electrically connected to the substrate terminal portion in a state where the two end surfaces are substantially in contact with the surface of the peripheral portion and the end surface of the other substrate, respectively. The electro-optical device according to claim 1, wherein the electro-optical device is connected. 4. An electro-optical device in which an electro-optical material is provided between a pair of substrates, and a semiconductor device is mounted on a peripheral portion of at least one of the pair of substrates. , Located outside the end surface of the other substrate at a position facing the peripheral portion, and the surface of the peripheral portion and / or
Alternatively, a substrate terminal portion is exposed on an end surface of the other substrate, the semiconductor device is mounted on a mounting member, and a lead portion of the semiconductor device is electrically connected to an electrode portion formed on a surface of the mounting member. An electro-optical device, wherein the electrode portion is electrically connected to the substrate terminal portion. 5. The electro-optical device according to claim 4, wherein an end surface of the other substrate is inclined with respect to a surface of the substrate. 6. The mounting member has two end faces,
The electrode portion is formed on at least one of the two end faces,
The angle between the two end surfaces is substantially the same as the angle between the surface of the peripheral portion and the end surface of the other substrate, and the two end surfaces are the surface of the peripheral portion and the end surface of the other substrate. 6. The electro-optical device according to claim 4, wherein the electrode portion is electrically connected to the substrate terminal portion in a state where the electrode portion is substantially in contact with each other. 7. The device according to claim 4, wherein said mounting member is made of resin, said electrode part is made of metal foil, and a part of said electrode part is buried in said resin. The electro-optical device according to any one of the above. 8. The electro-optical device according to claim 1, wherein a conductive film is interposed between the electrode portion and the substrate terminal portion. 9. The semiconductor device according to claim 1, wherein a circuit is formed on a surface of a spherical semiconductor.
9. The electro-optical device according to any one of items 1 to 8. 10. The electro-optical device according to claim 1, wherein the electro-optical device is of a matrix type having two-terminal switching elements. 11. A mounting structure for a semiconductor device used in the electro-optical device according to claim 1, wherein the electrode portion formed on the semiconductor device or the mounting member is the one of the one or more electrodes. A mounting structure for a semiconductor device, wherein the mounting structure is electrically connected to a substrate or a substrate terminal portion of the other substrate. 12. An electronic apparatus comprising the electro-optical device according to claim 1.