JP2001151867A5

JP2001151867A5 -

Info

Publication number: JP2001151867A5
Application number: JP1999339933A
Authority: JP
Filing date: 1999-11-30
Publication date: 2005-01-06

Description

【０００５】
すなわち、本発明は、
（１）（Ａ）エポキシ樹脂、（Ｂ）硬化剤、（Ｃ）下記一般式（Ｉ）で示される環状ホスファゼン化合物、及び（Ｄ）無機充填剤を必須成分とし、（Ｃ）成分の配合量は無機充填剤（Ｄ）を除く配合成分の合計量に対して燐原子の量が０．５〜５重量％となる量で、（Ｄ）成分の配合量が封止用エポキシ樹脂成形材料に対して７０重量％以上である封止用エポキシ樹脂成形材料、及び
【化３】

（ここで、Ｘ¹〜Ｘ⁶のいずれか１又は２は水酸基でそれ以外は水素原子である。）
（２）（Ｃ）成分が下記一般式（II）〜（Ｖ）で示される環状ホスファゼン化合物から選ばれる少なくとも一種である上記（１）記載の封止用エポキシ樹脂成形材料、並びに
【化４】

（３）（Ａ）エポキシ樹脂として、下記一般式（ VI ）で示されるビフェニル型エポキシ樹脂を含む上記（１）または（２）記載の封止用エポキシ樹脂成形材料、
【化１６】

（ここで、Ｒ ¹ 〜Ｒ ⁴ は水素原子及び炭素数１〜１０の置換又は非置換の一価の炭化水素基から選ばれ、全てが同一でも異なっていてもよい。ｎは０〜３の整数を示す。）
（４）（Ｂ）硬化剤として、下記一般式（ VII ）で示されるフェノール・アラルキル樹脂を含む上記（１）〜（３）いずれか記載の封止用エポキシ樹脂成形材料、
【化１７】

（ここで、Ｒは水素原子及び炭素数１〜１０の置換又は非置換の一価の炭化水素基から選ばれ、ｎは０〜１０の整数を示す。）
（５）さらに応力緩和剤を含む上記（１）〜（４）いずれか記載の封止用エポキシ樹脂成形材料、
（６）さらにカップリング剤を含む上記（１）〜（５）いずれか記載の封止用エポキシ樹脂成形材料、
（７）上記（１）〜（６）いずれか記載の封止用エポキシ樹脂成形材料により封止された素子を備えた電子部品装置、
に関する。[0005]
That is, the present invention
(1) (A) epoxy resin, (B) curing agent, (C) cyclic phosphazene compound represented by the following general formula (I), and (D) inorganic filler as essential components, blending amount of (C) component The amount of the phosphorus atom is 0.5 to 5% by weight based on the total amount of the compounding components excluding the inorganic filler (D), and the compounding amount of the component (D) is an epoxy resin molding material for sealing And an epoxy resin molding material for sealing which is 70% by weight or more, and

(Here, any one or two of X ^{1 to} X ⁶ are a hydroxyl group and the others are hydrogen atoms.)
(2) The epoxy resin molding material for sealing according to the above (1), wherein the component (C) is at least one selected from cyclic phosphazene compounds represented by the following general formulas (II) to (V), and

(3) The epoxy resin molding material for sealing according to the above (1) or (2), which comprises a biphenyl type epoxy resin represented by the following general formula ( VI ) as (A) epoxy resin
Embedded image

(Here, R ^{1 to} R ⁴ are selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different. N is 0 to 3) Indicates an integer.)
(4) The epoxy resin molding material for sealing according to any one of the above (1) to (3), which comprises a phenol / aralkyl resin represented by the following general formula ( VII ) as the curing agent (B)
[Image 17]

(Here, R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 0 to 10).
(5) The epoxy resin molding material for sealing according to any one of the above (1) to (4 ), further comprising a stress relaxation agent,
(6) The epoxy resin molding material for sealing according to any one of the above (1) to (5 ), further containing a coupling agent,
(7) An electronic component device comprising an element sealed by the sealing epoxy resin molding material according to any one of the above (1) to (6) ,
About.

【０００７】
中でも接着性、低吸湿性の観点からは、下記一般式（VI）で示されるビフェニル型エポキシ樹脂が好ましい。
【化５】

（ここで、Ｒ¹〜Ｒ⁴は水素原子及び炭素数１〜１０の置換又は非置換の一価の炭化水素基から選ばれ、全てが同一でも異なっていてもよい。ｎは０〜３の整数を示す。）
上記一般式（ VI ）で示されるビフェニル型エポキシ樹脂としては、例えば、４，４’−ビス（２，３−エポキシプロポキシ）ビフェニル又は４，４’−ビス（２，３−エポキシプロポキシ）−３，３’，５，５’−テトラメチルビフェニルを主成分とするエポキシ樹脂、エピクロルヒドリンと４，４’−ビフェノール又は４，４’−（３，３’，５，５’−テトラメチル）ビフェノールとを反応させて得られるエポキシ樹脂等が挙げられる。中でも４，４’−ビス（２，３−エポキシプロポキシ）−３，３’，５，５’−テトラメチルビフェニルを主成分とするエポキシ樹脂が好ましい。このビフェニル型エポキシ樹脂を使用する場合、その配合量は、その性能を発揮するためにエポキシ樹脂全量に対して３０重量％以上とすることが好ましく、５０重量％以上がより好ましく、６０重量％以上がさらに好ましい。[0007]
Among them, a biphenyl type epoxy resin represented by the following general formula (VI) is preferable from the viewpoint of adhesiveness and low hygroscopicity.
[Chemical formula 5]

(Here, R ^{1 to} R ⁴ are selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different. N is 0 to 3) Indicates an integer.)
Examples of the biphenyl type epoxy resin represented by the above general formula ( VI ) include 4,4′-bis (2,3-epoxypropoxy) biphenyl or 4,4′-bis (2,3-epoxypropoxy) -3. Epoxy resin containing epichlorohydrin and 4,4'-biphenol or 4,4 '-(3,3', 5,5'-tetramethyl) biphenol The epoxy resin etc. which are obtained by making it react are mentioned. Among them, an epoxy resin containing 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl as a main component is preferable. When using this biphenyl type epoxy resin, it is preferable to make the compounding quantity into 30 weight% or more with respect to the epoxy resin whole quantity, in order to exhibit the performance, 50 weight% or more is more preferable, 60 weight% or more Is more preferred.

【００３０】
【表１】

[0030]
[Table 1]

【００３１】
【表２】

[0031]
【Table 2】

Claims

(A) an epoxy resin, (B) a curing agent, (C) a cyclic phosphazene compound represented by the following general formula (I), and (D) an inorganic filler as essential components, and the compounding amount of the (C) component is inorganic filling Component (D) in an amount of 0.5 to 5% by weight based on the total amount of the compounding components excluding agent (D), the compounding amount of component (D) is 70 with respect to the epoxy resin molding material for sealing The epoxy resin molding material for sealing which is weight% or more.

(Here, any one or two of X ^{1 to} X ⁶ are a hydroxyl group and the others are hydrogen atoms.)

The epoxy resin molding material for sealing according to claim 1, wherein the component (C) is at least one selected from cyclic phosphazene compounds represented by the following general formulas (II) to (V).

The epoxy resin molding material for sealing according to claim 1 or 2, wherein a biphenyl type epoxy resin represented by the following general formula ( VI ) is contained as the epoxy resin (A) .
[Image 14]

(Here, R ^{1 to} R ⁴ are selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different. N is 0 to 3) Indicates an integer.)

The epoxy resin molding material for sealing according to any one of claims 1 to 3, containing a phenol-aralkyl resin represented by the following general formula ( VII ) as the curing agent (B) .
[Image 15]

(Here, R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 0 to 10).

The epoxy resin molding material for sealing according to any one of claims 1 to 4, further comprising a stress relaxation agent.

The epoxy resin molding material for sealing according to any one of claims 1 to 5, further comprising a coupling agent.

An electronic component device comprising an element sealed by the sealing epoxy resin molding material according to any one of claims 1 to 6 .