JP2001144227A - Electronic component package and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide an electronic component package which is easy and economical to manufacture and excellent in use performance such as electrical characteristics and mounting workability. A housing container (10) having an electronic component (30) having a plurality of electrode portions (32, 34) on its surface, a flat outer peripheral surface (13), and a housing recess (12) arranged inside the outer peripheral surface (13) and housing the electronic component (30). And a container 1 made of a conductive material
A plurality of wiring portions 22 and 24 formed from the inner surface to the outer peripheral surface 13 of the housing recess 12 of the “0”, and wiring pieces 42 connecting the electrode portions 32 and 34 of the electronic component 30 to the wiring portions 22 and 24. There is provided a connection means, and a filling and curing section 50 in which the filling concave section 12 is filled with a filling and curing material and cured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component package and a method of manufacturing the same, and more particularly, it is used for mounting a minute electronic component such as a diode on a wiring circuit board or the like, and is made of a ceramic or synthetic resin package. And a method of manufacturing such an electronic component package.

[0002]

2. Description of the Related Art Microelectronic components such as diodes and IC chips are sealed in a package of epoxy resin or ceramics to provide mechanical or electrical protection. In this electronic component package, for electrical connection between the electronic component and an external wiring circuit, the electronic component is mounted on a lead frame made of a thin copper plate or the like, and each electrode of the electronic component is electrically connected to the lead frame. In general, a technique of connecting a lead frame terminal to an external wiring circuit by enclosing the lead frame in a package and extending the terminals of the lead frame to the outside of the package is generally adopted.

[0003]

An electronic component package using a lead frame has a problem in that it takes time and effort to manufacture the lead frame. In addition, the lead frame must have a certain thickness in order to enable its processing and handling. The lead frame must have a sufficient distance from the mounting position of the electronic component to the terminal for external connection. For this reason, there is a problem that the thickness and length of the wiring portion increase, and electrical performance such as high-frequency characteristics deteriorates.

The use of a lead frame having a large thickness and a large outer shape increases the size of the entire electronic component package, which imposes restrictions on improving the mounting density and miniaturizing the electronic device. Since the lead frame is manufactured by punching a thin copper plate or the like, a large amount of punching waste is generated, and the disposal rate of raw materials is increased. A high raw material disposal rate increases material costs and adds to disposal costs. In a general lead frame, the disposal rate of raw materials often exceeds 90%.

A lead frame on which electronic components are mounted is placed in a molding die of a transfer molding device and resin-molded, thereby enclosing the electronic components and the lead frame in a molded package. In this method, the surface of the lead frame is easily oxidized at the time of molding, so that a troublesome step of performing acid cleaning or applying solder plating to the surface after molding is required. In transfer molding, burrs are inevitably generated around the molded product, so a deburring step is required after molding. Since a runner for filling the resin is attached to the resin molded product, a step of removing the runner is also required. Resin portions removed as burrs, runners and the like also increase the waste rate of raw materials.

Further, in an electronic component package using a lead frame, since the terminals of the lead frame protrude outside, the terminals are easily bent or cut during handling and mounting work. This causes troubles in the automated mounting process. An object of the present invention is to provide an electronic component package which is easy to manufacture and economical in the above-described electronic component package technology, and which is excellent in use performance such as electrical characteristics and mounting workability.

[0007]

An electronic component package according to the present invention includes an electronic component having a plurality of electrode portions on its surface, a flat outer peripheral surface, and a housing recess arranged inside the outer peripheral surface for housing the electronic component. And a plurality of wiring portions made of a conductive material and formed from the inner surface of the storage recess of the storage container to the outer peripheral surface, and electrically connecting the electrode portion and the wiring portion of the electronic component. Connecting means for connecting;
A filling and curing section formed by filling and curing a filling and curing material in the housing recess.

[Electronic parts] The present invention can be applied to electronic parts used in ordinary electric and electronic technical fields. In addition to a single-function electronic element such as a resistor, a capacitor, a diode, and a transistor, an integrated circuit element in which many functional elements are incorporated can be applied. Light emitting diodes, acoustic components, sensor components, and the like are also applicable.

The electronic component is provided with an electrode portion for connecting to an external circuit at least on a part of the outer surface. One entire surface of the electronic component may be one electrode portion. A pair of electrode portions may be provided symmetrically on two opposing surfaces of the electronic component. A plurality of electrode parts may be provided on one surface of the electronic component. In some cases, a plurality of pairs of electrode portions may be provided symmetrically on the facing surface of the electronic component.

The external shape of the electronic component is generally a rectangular parallelepiped, but may be a polygonal column, a cylinder, or the like. [Accommodation container] Materials used as ordinary package materials can be used. For example, ceramics such as alumina, synthetic resins such as glass epoxy resin, liquid crystal polymers and the like can be mentioned. Both inorganic and organic materials can be used. Electrically insulating materials are preferred. A material having a mechanical protection function, a moisture-proof function, and heat resistance is also preferable. A plurality of materials having different functions can be combined.

The shape and size of the container are not particularly limited as long as electronic components and wiring portions can be arranged. Generally, a rectangular parallelepiped is easy to manufacture and handle, but other polygonal pillars, cylindrical pillars, and those having partial unevenness or a curved surface can also be used. The housing container is provided with a flat outer peripheral surface at a position facing the mounting surface when mounting on an external circuit board or the like. An end of a wiring portion serving as an electrode for connecting to an external circuit is arranged on the outer peripheral surface.

The housing recess is designed in accordance with the shape of the housed electronic component and the arrangement of the wiring portions. at least,
It is desirable to have a structure capable of positioning the electronic component so that it does not move unnecessarily in a state where the electronic component is housed. Specifically, it is only necessary to provide a contact surface that can contact a plurality of side surfaces of the electronic component. It may have a fitting hole in which the electronic component is completely fitted. It is also possible to provide a projection or an uneven portion that comes into contact with or engages with the electronic component.

[0013] A hole may be provided in the bottom surface of the housing recess so as to penetrate the back surface of the housing container. This hole is used when the wiring portion is formed by conductor paste printing. When accommodating a plurality of electronic components, independent accommodating recesses may be provided at a plurality of locations, or a single accommodating recess may be provided with a shape portion capable of accommodating a plurality of electronic components.

The housing recess is provided with a surface on which at least a part of the wiring portion is formed. A flat horizontal surface is preferable to facilitate the formation of the wiring portion, but the wiring portion can be formed on an inclined surface, a vertical surface, or even a curved surface portion, depending on the manufacturing method of the wiring portion. To manufacture the container having the above-described shape, the shape of the container may be formed by performing etching, laser processing, mechanical cutting, or the like on the ceramic plate. It can also be manufactured by filling a molding die with a powder or slurry of a ceramic material, molding and firing. A housing container can also be obtained by performing cutting or the like on the ceramic molded product.

As the storage container, a container manufactured independently may be supplied, or a plurality of storage containers may be supplied as a continuous connection of storage containers. The housing container connecting body is formed by connecting a large number of housing containers in a separable state. A band-shaped container in which the storage containers are arranged in one row or a plurality of rows, or a sheet-shaped container in which the storage containers are arranged in front, rear, left, and right are used. The storage containers are connected to each other via a short connection arm or the like, and can be separated into individual storage containers by cutting off the connection arm. It is also possible to arrange the storage containers in close contact with each other, and to provide an easily separable structure such as a notch groove at the boundary.

[Wiring Portion] As long as it is a conductor material capable of forming a film on the material surface of the container, a wiring material used for ordinary electronic device control can be used. As the conductive material, a conductive metal such as Au, Ag, Cu, An, or Al or an alloy of the conductive metal can be used. A laminated structure using a plurality of conductor materials may be employed. The entire wiring portion may be made of the same conductive material, or the material may be partially changed in accordance with a required function such as a portion connected to an electrode portion or an external wiring.

For forming the film, various thick film and thin film forming techniques such as conductor paste printing, plating, vapor deposition, and sputtering can be applied. In the case of conductor paste printing, after printing, heating and sintering at a predetermined temperature is performed to form a wiring portion. When the printing screen is arranged above the receiving recess and the conductive paste on the printing screen is transferred into the receiving recess, vacuum suction from the through hole provided on the bottom surface of the receiving recess ensures that the inside of the receiving recess is secure and efficient. It is possible to supply the conductive paste.

As a film forming technique, a method in which a film can be formed on a horizontal surface or an inclined surface but not formed on a vertical surface is adopted. If a method of separating or isolating a plurality of wiring portions in a housing recess is adopted. By simply forming the vertical surface, the wiring portions can be reliably isolated on both sides of the vertical surface. This method of isolating the wiring portion using the vertical surface is effective in the case of the above-described conductor paste printing or the like.

Of course, if it is desired to arrange the wiring portion on the vertical surface of the housing recess, a film forming method capable of forming a film on the vertical surface may be adopted. For example, chemical plating can form a film on a vertical surface. In order to form the wiring portion in a predetermined pattern shape, a method capable of patterning simultaneously with film formation may be adopted, or after forming a film in a wide range, unnecessary film portions are deleted according to a predetermined pattern. Can be adopted. For example, in conductive paste printing by silk screen, film formation and patterning can be performed simultaneously. There is also a method of removing unnecessary portions by etching after the entire surface plating. After the formation of the thin film, unnecessary portions can be removed by laser irradiation.

The wiring portion is disposed at least over the outer peripheral surface of the storage container and the inner surface of the storage recess filled with the filling and curing portion. The shape and arrangement of a portion of the wiring portion arranged on the outer peripheral surface of the container is set in consideration of electrode arrangement and connection conditions when mounting the electronic component package. The end of the portion of the wiring portion that is arranged on the inner surface of the housing recess is arranged in a position and shape that facilitates connection with the electrode portion of the electronic component. It is preferable that the wiring path between the location on the outer peripheral surface and the location where the electrode section is connected be set so that pattern formation is facilitated with a distance as short as possible. Not only a straight path but also a curved path or a curved path can be adopted.

As the width and width of the wiring portion become wider and shorter, the electric resistance becomes lower and the electric characteristics become better. The thinner the wiring portion, the higher the high-frequency characteristics and electrostatic resistance, and the higher the electrical performance such as the higher the rush current. Since the wiring portion is supported on the surface of the container, the wiring portion itself does not need to have large mechanical strength and durability, and it is sufficient if the wiring portion has a thickness necessary for exhibiting electrical characteristics. In addition, since there is no need to consider the appropriateness of the punching process such as a lead frame, there is almost no restriction on the shape of the wiring portion.

The thickness of the wiring portion varies depending on the manufacturing method, but is usually set in the range of 1 to 100 μm.
It is preferably set to 1 to 50 μm. The width of the wiring part is
It can be set in the range of 10 to 500 μm. The width and thickness of the wiring portion may be the same over the entire length, or there may be portions where the width and thickness are partially different.

[Connecting Means] As the connecting means, a method capable of electrically connecting the electrode portion and the wiring portion of the electronic component is adopted. The connection means may have a function of mechanically connecting and fixing the electronic component to the container. Basically, the connection technology of electrodes and wiring in the manufacturing technology of various electronic devices can be applied.

For example, techniques such as electronic bonding, eutectic bonding, and conductive bonding can be applied. When the electrode part and the wiring part of the electronic component are in contact with each other, they can be connected with a solder, a conductive foil, a conductive adhesive or the like interposed therebetween. The electrode material and the wiring material can be connected by directly melting or causing metal bonding. When the electrode part and the wiring part of the electronic component are separated from each other, they can be connected with a bonding wire, a wiring piece, or a conductive foil. As the wiring pieces, those obtained by laminating a conductive film on one surface of a flexible synthetic resin sheet can be used.

The connection can also be made by printing and forming a conductive paste on the adjacent electrode portion and the wiring portion, followed by firing and curing. [Filled and cured part] The same cured and cured material as an insulating resin material for resin sealing or a package of a normal electronic component is used. Specifically, a synthetic resin such as a polyimide resin or an epoxy resin, a low-melting glass, or the like is used.

The filling of the hardening material into the housing recess can be performed by using an injection nozzle or the like. However, using a technique of screen printing or mask printing, a shape corresponding to the plane shape of the housing recess exactly is used. Fill hardening material can be applied. When the filling hardening material having fluidity is injected into the housing recess of the housing container, the filling hardening material is filled so as to fill the gap according to the inner shape of the housing recess and the outer shape of the electronic component. The surface of the filled hardening material becomes a flat horizontal surface.

The curing of the filling and curing material varies depending on the characteristics of the material, and curing methods such as room temperature curing, heat curing, light curing, and reaction curing are applied. The hardened filling section must cover the electronic component with a thickness that can provide the necessary protection function, and the hardened filling section does not cover the wiring section of the portion arranged on the outer peripheral surface of the container. Keep it. Normally, the filling and curing portion may be formed from the same height position as the outer peripheral surface of the container to a position slightly lower than the same. [Manufacture of electronic components] Basically, resin sealing technology, package technology, electrode connection technology, and the like of ordinary electronic components can be used.

A method combining the following steps can be adopted. Step (a): The electronic component is housed in a housing container having a housing recess and a wiring portion. Step (b): connecting the electrode part and the wiring part of the electronic component by a connecting means. Step (c): The filling recess is filled with the filling hardening material and hardened. For mounting electronic components in the storage container, a mounting device such as a chip mounter can be used. In the accommodation recess,
If a contact surface or the like for positioning the electronic component is provided, the electronic component can be arranged reliably and accurately.

In the case where the electrodes of the electronic component are brought into contact with the wiring portion arranged on the inner surface of the accommodating concave portion and connected, the connection of the electrodes of the electronic component or the surface of the wiring portion with solder or the like is required before the electronic component is accommodated. The material can be disposed or processed so that the connection function can be exhibited, such as by heating and melting the solder. When the filling recessed material is filled with the curing material and cured, the electronic component package is completed, but various post-processes can be performed if necessary.

For example, in the case of using the above-described housing container connected body, a step of separating the housing containers is performed. A performance test is performed by arranging the containers, and according to the results of the performance test, marking is performed on the surface of a non-defective product or mounted on a carrier tape. Defective products will be discarded or sent to a repair process. [Mounting of Electronic Component Package] In the electronic component package having the above-described structure, only a part of a wiring portion serving as an electrode is exposed on the outer surface, and there is no terminal protruding outside.

Therefore, when the electronic component package is mounted on an external printed circuit board or the like, the exposed wiring portion of the electronic component package is brought into contact with the connection electrode of the printed circuit board, and solder or the like is interposed therebetween. Connection. For such a connection, a technique called surface mounting can be applied. As the mounting device, a normal mounter device for surface mounting, a solder connection processing device, or the like can be used.

If such surface mounting is performed, there is no portion on the printed circuit board that protrudes outside the container, so that
The distance between other electronic components etc. can be set narrow,
Dead space that cannot be substantially used for component mounting on the printed circuit board can be reduced. In other words, the mounting density of components can be increased. Since the wiring part is arranged on the outer periphery of the outer surface of the electronic component package with a sufficient area, when connecting with solder etc., troubles such as lifting of parts called Machtan phenomenon, short-circuiting of wiring, unjoining etc. Is unlikely to occur.

[0033]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiment shown in FIGS. 1 to 7 is directed to an electronic component package using a chip resistor. [Accommodating Container] As shown in FIG. 1, the accommodating container 10 is formed by molding and firing and hardening a ceramic material, and has a substantially rectangular parallelepiped shape. A housing recess 12 is formed in the center of the upper surface of the housing container 10. The outside of the housing recess 12 is a flat outer peripheral surface 13.

The shape of the housing recess 12 is connected to the bottom of the housing recess 12 through an inclined surface 15 that goes down from the outer peripheral surface 13 on one short side of the housing 10 toward the center. Container 1
0 is connected to a horizontal trapezoidal portion 14 via an inclined surface 15 descending toward the center from the outer peripheral surface 13 on the other short side, and from the trapezoidal portion 14 to a bottom of the accommodation recess 12 via a vertical surface 16. . The electronic component is housed in the bottom of the housing recess 12.

As shown in FIG. 2, the storage container 10 made of ceramics is manufactured as a storage container connecting body T in which storage containers 10 having the same shape are vertically and horizontally connected via relatively thin connecting arms 11. ing. In order to separate the individual storage containers 10, it is sufficient to cut off the connection arms 11. By using such a housing container connecting body T, a large number of housing containers 10 can be manufactured with high productivity. Further, the housing container 10 can be easily handled, and various processing steps for the housing container 10 can be collectively performed. Until immediately before the completion of the manufacture of the electronic component package, it is also possible to handle the electronic component package as it is with the housing container connected body T.

As shown in FIG. 1, from the outer peripheral surface 13 on both short sides of the storage container 10 to the inner surface of the storage recess 12 at the center, A
Band-shaped wiring portions 22 and 24 made of a conductive material such as g are formed as films. The wiring portions 22 and 24 are formed by printing a conductive paste in a predetermined pattern on the container 10 by screen printing, and then firing at about 800 ° C.

In FIG. 1B, one wiring portion 22 is arranged from the outer peripheral surface 13 on the right side to the bottom surface of the accommodation recess 12 via the inclined surface 15. Another wiring portion 24 is arranged from the outer peripheral surface 13 on the left side to the surface of the trapezoidal portion 14 via the inclined surface 15. Wiring part 22 and wiring part 2
4 are physically separated from each other by a vertical surface 16.

In order to manufacture the wiring portions 22 and 24 as described above, a wiring technology in an ordinary electronic circuit can be applied.
More specifically, if a mask screen corresponding to the planar shape of the wiring portions 22 and 24 is arranged on the housing container 10 and screen printing is performed using a conductive paste, the outer peripheral surface 13 of the housing container 10 The conductor paste is patterned on the inner surface. When the conductive paste is fired, the wiring portions 22 and 24 are manufactured. In this method, the accommodation recess 12
Of the inner surfaces, the conductor paste is printed on the horizontal surface and the inclined surface, but the conductor paste is not printed on the vertical surface 16, so that the left and right wiring portions 22 and 24 are reliably isolated on the vertical surface 16. Become.

[Specific Dimensions of Storage Container] Storage Container 10
The following is an example of specific dimensions. As the electronic component 30 composed of a chip resistor, a component having a rectangular parallelepiped shape of 0.35 × 0.35 × 0.2 mm is used. The overall shape of the storage container 10 is a rectangular parallelepiped having a height of 0.5 mm, a width of 0.6 mm, and a length of 1.2 mm.
The width of the housing recess 12 is set to 0.4 mm, and the depth of the housing part of the electronic component 30 is set to 0.23 mm. The height difference between the housing part of the electronic component 30 and the trapezoidal surface 14 is set to 0.22 mm.

As for the continuous body T of accommodation containers, the whole is about 10
The storage containers 10 are formed in a cm-square shape, and the storage containers 10 are arranged at equal intervals in the front, rear, left and right directions via a connecting arm 11 having a width of 0.2 mm. As the wiring portion 30, A having the same width as the accommodation recess 12 and a thickness of 20 μm is used.
Place g film. The dimensions of the exposed wiring portions 22a and 24a in the electronic component package P are 0.4 mm × 0.2 mm.

[Manufacture of Electronic Component Package] As shown in FIG.
To accommodate. The electronic component 30 is a rectangular parallelepiped semiconductor diode. Zener diodes can also be used. The upper surface of the electronic component 30 has a ball-shaped electrode 32, and the entire bottom surface of the electronic component 30 is the other electrode 34.

When the electronic component 30 is accommodated in the accommodating recess 12, the electrode 34 on the bottom surface of the electronic component 30 rests on the wiring portion 22 arranged at the bottom of the accommodating recess 12. The electrode 34 of the electronic component 30 and the wiring section 22 are electrically connected by an appropriate connection means. Specifically, connection techniques such as heat welding and eutectic bonding are applied. As shown in FIG. 4, the electrode 32 on the upper surface of the electronic component 30 and the wiring portion 24 having an end in the trapezoidal portion 14 are provided.
Are connected using a strip-shaped wiring piece 42.

The wiring piece 42 is formed by forming a conductor film made of Cu, Ag, Au or the like on one surface of a transparent synthetic resin sheet. The conductor piece side of the wiring piece 42 is arranged so as to be in contact with the wiring part 24 and the upper part of the electrode 32 (see FIG. 6).
The second conductive film is connected to the wiring portion 24 and the electrode 32 by laser welding.

As shown in FIG. 5, the inside of the accommodation recess 12 is filled with a hardening material made of an ethoxy resin, and is heated and hardened to form a hardened hard portion 50. At this time, the filling hardening portion 50 is formed from the same surface as the outer peripheral surface 13 of the storage container 10 to slightly below. Therefore, the portions of the wiring portions 22 and 24 that are arranged on the outer peripheral surface 13 are not embedded in the filling and curing portion 50 but are exposed on the outer surface of the storage container 10 to become the wiring exposed portions 22a and 24a.

Thus, the electronic component package P is manufactured. As shown in FIG. 6, the electronic component package P has a rectangular parallelepiped shape as a whole, and rectangular wiring exposed portions 22a and 24a are exposed near both short sides of one surface. As shown in FIG. 7, when the electronic component package P is mounted on the circuit board 60, the exposed wiring portions 22a and 24a of the electronic component package P are arranged toward the circuit board 60, and the solder 62 or the like is used. Exposed wiring section 2
If the 2a and 24a are connected to the wiring of the circuit board 60, so-called surface mounting can be performed.

[IC Chip] In the embodiment shown in FIG. 8, an IC chip is used as the electronic component 30. The electronic component 30 composed of an IC chip has a flat rectangular parallelepiped shape, and a total of eight electrodes 36 are arranged along both sides on one side. The accommodation recess 12 of the accommodation container 10 has an insertion hole 17 into which the bottom surface and the side surface of the electronic component 30 are fitted closely. A horizontal trapezoidal surface 14 is provided outside the fitting hole 17, and the trapezoidal surface 14 is connected to the outer peripheral surface 13 via the inclined surface 15.

The wiring portion 24 is provided on the outer peripheral surface 13 of the container 10.
, Through the inclined surface 15 to above the trapezoidal surface 14. The ends of the wiring portions 24 arranged on the outer peripheral surface 13 are arranged at four locations at intervals along the long sides on both sides of the storage container 10. The ends of the wiring portions 24 arranged on the trapezoidal surface 14 are spaced from each other on both long sides and both short sides of the rectangular trapezoidal surface 14. Therefore, a part of the wiring part 24 is bent at a right angle on the way.

An electrode 36 is arranged on the upper surface of the electronic component 30 fitted in the fitting hole 17 of the housing recess 12. The electrode 36 and each wiring portion 24 are connected by wire bonding using a bonding wire 44 formed of a thin conductor wire. For the filling and curing unit 50, the same synthetic resin or the like as in the above embodiment is used. The electronic component package P having such a structure has the wiring exposed portions 24a symmetrically arranged along both long sides on one side thereof.

[Transistor] The embodiment shown in FIG.
A transistor is used as the electronic component 30. The electronic component 30 composed of a transistor has a flat rectangular parallelepiped shape, has electrodes 36 at two places on one side, and has electrodes (not shown) on the opposite side. The housing recess 12 of the housing container 10 has a recess that contacts the bottom surface and the side surface in three directions of the electronic component 30, and the inner surface of the recess is a vertical surface 16.

A horizontal trapezoidal surface 14 is formed outside the vertical surface 16 with which the side surfaces in two directions of the electronic component 30 abut, and the trapezoidal surface 14 is connected to the flat outer peripheral surface 13 via the inclined surface 15. I have. The wiring portion 24 is formed from the outer peripheral surface 13 to the top of the trapezoidal surface 14 via the inclined side 15. Electronic component 30
9A, 9B, the right side of FIGS. 9A and 9B is the accommodation recess 1.
2 is connected to the outer peripheral surface 13 via the inclined surface 15. The wiring portion 22 is formed from the outer peripheral surface 13 via the inclined surface 15 to the bottom surface of the housing concave portion 12 which becomes the back surface of the electronic component 30.

The electrode on the back surface of the electronic component 30 is connected to the wiring portion 22 arranged up to the bottom of the housing recess 12.
The two electrodes 36 provided on the upper surface of the electronic component 30 are connected to the wiring section 24 by bonding wires 44. The filling and curing section 50 fills the entire housing recess 12 using the same synthetic resin as in the above embodiment.

The electronic component package P having such a structure has the wiring exposed portions 24a, 24a and 22a arranged on the three sides in the outer periphery of one surface.
[Plural Electronic Components] In the embodiment shown in FIG. 10, a plurality of electronic components are accommodated in one package. Electronic component 30A
Has a relatively flat rectangular parallelepiped shape, and has electrodes (not shown) at four locations on the bottom surface thereof. Such a structure is used in an IC chip or the like.

The electronic component 30B is made of the above-described chip resistor, has a rectangular parallelepiped shape, has a ball-shaped electrode 32 on the upper surface, and the entire bottom surface becomes another electrode 34. The accommodating recess 12 is provided for accommodating the accommodating shape of the electronic component 30A and the electronic component 30B.
Has a structure in which the housing shape is combined. The electronic component 30A is positioned by bringing two corners into contact with the inner wall of the housing recess 12. An inclined surface 15 is provided in three directions from the bottom surface of a housing recess 12 which is a housing location of the electronic component 30A, and the upper end of the inclined surface 15 has a flat outer peripheral surface 13.
Is connected to From the outer peripheral surface 13 in three directions to the inclined surface 15
Then, the wiring portion 22 is formed on the bottom surface of the housing recess 12 to a position on the back surface of the electronic component 30A. The wiring section 22 is connected to an electrode present on the back surface of the electronic component 30A.

The electronic component 30B is accommodated in the electronic component 3
0A is disposed adjacent to one side end. A vertical surface 16, a horizontal trapezoidal surface 14, an inclined surface 15, and a flat outer peripheral surface 13 are arranged at the end of a groove-shaped portion corresponding to the width of the electronic component 30B. A wiring portion 24 is provided from the outer peripheral surface 13 to the inclined surface and the trapezoidal surface 14. The wiring portion 24 and the electrode 32 on the upper surface of the electronic component 30A are connected by a wiring piece 42.

Further, the electronic component 30A and the electronic component 30B
Are provided. The internal wiring section 46 is not used for wiring connection with the outside of the electronic component package P, but performs wiring connection inside the electronic component package P. The internal wiring portion 46 is provided in the housing recess 12.
Are arranged in a strip shape at a position corresponding to the back surface of the electronic component 30B from the back surface of the electronic component 30A. By connecting one end of the internal wiring portion 46 to one electrode on the back surface of the electronic component 30A and connecting the other end of the internal wiring portion 46 to the electrode 32 on the back surface of the electronic component 30B, the electronic components 30A and 30B Connection is established.

The filling and hardening section 50 uses the same synthetic resin as that of the above-described embodiment to fill the entirety of the housing recess 12 including the housing area of the electronic component 30A to the housing area of the electronic component 30B. In the electronic component package P having such a structure, the wiring exposed portions 24a, 24a, and 22a are arranged on three sides of the outer periphery of one surface.

Since a plurality of electronic components 30A and 30B are arranged inside the electronic component package P, complicated functions and excellent performance that cannot be achieved by a single electronic component can be exhibited. Also, the individual electronic components 30A, 3
Compared with the case where the OB is packaged and then the wiring is connected on the circuit board, the whole occupied space is much smaller and the manufacturing operation can be simplified.

[Hybrid Package] FIG. 11 shows a specific example of a hybrid electronic component package accommodating a plurality of electronic components as in the above embodiment. FIG.
(a) As shown in (b), a rectangular parallelepiped container 10 is formed.
Has one accommodating recess 12 at the center, and is connected to the flat outer peripheral surface 13 via the inclined surface 15 on four sides from the accommodating recess 12.

A plurality of electronic components 30, that is, resistors R1, R2, a capacitor C1, and a transistor Tr1 are accommodated in the bottom surface of the accommodation recess 12. Each of the electronic components 30 has a connection electrode on a bottom surface thereof, and is electrically connected to each other by an internal wiring portion 46 arranged on the bottom surface of the housing recess 12. Each of the electronic components 30 (C1...) Is located at a position different from the internal wiring portion 46 at the wiring portion 22 disposed on the bottom surface of the accommodation recess 12.
Is connected. Each of the wiring portions 22 has the inclined surface 1
5 to the outer peripheral surface 13. Two wiring exposed portions 22a are arranged at two locations on the long side of the outer peripheral surface 13 of the storage container 10, respectively.

Further, the electrode on the upper surface of the electronic component 30 (Tr1) and the wiring section 22 connected to the electronic component 30 (R2) are connected by a wiring piece 48. After the electronic components 30 (C1...) Are arranged and connected by wiring in such a structure, the housing recess 12 is filled and hardened with an epoxy resin or the like to form a hardened filling portion 50.

FIG. 11 (c) shows the above wiring structure as a circuit diagram. Where IN, OUT, VC
C and VDD are terminal portions for external connection. FIG.
1 (a) shows the correspondence between each terminal portion and each wiring exposed portion 22a. The obtained hybrid electronic component package P has four exposed wiring portions 22 at four corners on one side.
In this case, the wiring exposed portion 22a can be mounted on the connection electrode of the wiring circuit board.

[0062]

According to the electronic component package and the method of manufacturing the same of the present invention, the electronic component is simply accommodated in the accommodating concave portion of the accommodating container formed in advance and having the wiring portion formed on the inner surface thereof, and the filled hardened portion is sealed. With a simple structure, it is possible to form an electronic component package having an electrode structure on its surface for connecting to an external circuit.

Since the wiring portion is formed directly on the surface of the container without using a lead frame, the overall size is reduced, the cost of raw materials is reduced, and the processing steps are simplified. The film-formed wiring portion can be set to a length and thickness necessary and sufficient for electrical characteristics, so that electrical performance such as internal resistance and high-frequency characteristics is significantly improved.

As compared to packaging by transfer molding, it does not require much time for deburring and runner removal.
The resin material disposal rate is also reduced.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention and is a plan view of a storage container.
(a), vertical sectional view (b) and partial sectional side view (c)

FIG. 2 is a plan view of the housing container connected body.

FIG. 3 is a cross-sectional view illustrating a manufacturing process of an electronic component package, which is an initial stage.

FIG. 4 is a sectional view of the next stage.

FIG. 5 is a cross-sectional view of the manufactured electronic component package.

FIG. 6 is a partially cutaway plan view of an electronic component package.

FIG. 7 is a side view showing a mounting state of the electronic component package.

FIG. 8 is a partially cutaway plan view (a) and a cross-sectional view (b) of an electronic component package showing another embodiment.

FIG. 9 is a sectional view (a) of an electronic component package showing another embodiment and a plan view (b) before filling with a filling hardening material.

FIG. 10A is a cross-sectional view of an electronic component package according to another embodiment, and FIG.

FIG. 11 is a partially cutaway plan view (a), a cross-sectional view taken along a line II (b), and a circuit diagram of an electronic component package showing another embodiment.
(c)

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Storage container 12 Storage recess 13 Peripheral surface 14 Trapezoid surface 15 Inclined surface 16 Vertical surface 22, 24 Wiring part 22a, 24a Wiring exposed part 30, 30A, 30B Electronic component 32, 34 Electrode 42 Wiring piece 50 Filling hardening part P electronic Parts package

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M109 AA01 BA03 CA04 CA12 DA10 DB10

Claims (6)

[Claims] An electronic component having a plurality of electrode portions on its surface, a housing container having a flat outer peripheral surface and a housing recess arranged inside the outer peripheral surface for housing the electronic component, comprising: a conductive material; A plurality of wiring portions formed in a film from the inner surface of the storage recess of the storage container to the outer peripheral surface; connecting means for connecting an electrode portion and a wiring portion of the electronic component; and a filling hardening material filled in the storage recess. An electronic component package comprising a cured and cured portion. 2. The storage recess has a trapezoidal surface shallower than the electronic component accommodating portion between the electronic component accommodating portion and the outer peripheral surface, and the wiring portion has a trapezoidal surface extending from the outer peripheral surface to the trapezoidal surface. Formed over
The electronic component package according to claim 1, wherein an end of the wiring portion is arranged on a trapezoidal surface. 3. The housing recess according to claim 1, wherein the housing recess has an inclined surface connected to the outer peripheral surface, and the wiring portion is arranged on the inner surface of the housing recess through the inclined surface from the outer peripheral surface. Electronic component package. 4. The electronic device according to claim 1, wherein the housing recess has a vertical surface in contact with a side surface of the electronic component, and wiring portions disposed on both sides of the vertical surface are separated by the vertical surface. Electronic component package according to 1. 5. An accommodation recess for accommodating a plurality of electronic components, and an inner wiring portion made of a conductive material and having a film formed on an inner surface of the accommodation recess for connecting electrodes of the plurality of electronic components. The electronic component package according to claim 1. 6. A method of manufacturing an electronic component package according to claim 1, wherein the step (a) of housing the electronic component in a housing container having a housing recess and a wiring portion includes the steps of: Connecting the wiring section and the wiring section with connection means
A method for manufacturing an electronic component package, comprising: (b) and a step (c) of filling and hardening a filling hardening material into a housing recess.