JP2001127551A - Temperature compensated piezoelectric oscillator - Google Patents

Abstract

[PROBLEMS] To provide a temperature-compensated piezoelectric oscillator while maintaining the accuracy of the temperature-compensated piezoelectric oscillator itself even if the ambient temperature of the piezoelectric vibrator changes due to heat generated by semiconductor components constituting the temperature-compensated piezoelectric oscillator. Reduce the size of the oscillator. To solve these problems, the present invention relates to a temperature-compensated piezoelectric oscillator container including a piezoelectric vibrator and a semiconductor component, which is opposed to a semiconductor component mounting side of a laminated substrate on which the semiconductor component is mounted. Temperature compensation in which the piezoelectric vibrator is mounted on the other laminated substrate surface, the container on the semiconductor component mounting side is constituted by a wall extending from the laminated substrate, and the container is also constituted by the wall extending from the laminated substrate on the other piezoelectric vibrator mounting side. The problem of the temperature-compensated piezoelectric oscillator container is that the outer dimensions of the container on which the semiconductor components are mounted are smaller than the container on which the piezoelectric vibrator is mounted. Is the solution.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a container structure of a miniaturized oscillator mainly used in the field of mobile communication such as wireless communication equipment and mobile phones.

[0002]

2. Description of the Related Art In recent years, with the spread of computers and mobile phones, their functions and performance have been improved day by day, and at the same time, in deployments intended to be mobile, lightening, thinning, and low height have been rapidly increasing. It is changing, and the electronic component industry is tackling this as one of the issues. At the heart of most electronic devices, such as computers and mobile phones, an oscillator that generates a clock signal and a signal from a local oscillator is an indispensable part. In accordance with the trend of the downsizing, the oscillator itself is also strongly demanded to be reduced in size (weight reduction, thickness reduction, height reduction, volume reduction).

[0003] A general piezoelectric oscillator is a type in which a printed pattern for an oscillation circuit is arranged on a laminated substrate, a capacitor which forms an oscillation circuit on the same plane as a substrate in which a single substrate is subjected to multilayer printing and a conduction pattern is arranged, An oscillator is formed by mounting a hermetically sealed piezoelectric vibrator in the same atmosphere as semiconductor components such as resistors and integrated circuits.

However, recently, in order to effectively bring out the characteristics of the temperature-compensated piezoelectric oscillator, a piezoelectric vibrator is mounted on the other laminated substrate surface of the laminated substrate on which the semiconductor components are mounted, opposite to the semiconductor component mounting side. On the component mounting side, a container is formed by a wall extending from the laminated substrate, and on the other piezoelectric vibrator mounting side, a container structure is formed by forming a container with a wall extending from the laminated substrate, and the piezoelectric vibrator and the semiconductor component are separated. Attention is also focused on the piezoelectric oscillator with the container configuration described above.

[0005]

As described above, as a recent trend, in the field of mobile communications typified by computers and portable telephones, there is a strong demand for miniaturization in addition to the demand for high-precision oscillators. As described in the related art, while effectively utilizing the characteristics of the temperature-compensated piezoelectric oscillator, the semiconductor component mounting side of the laminated board on which the semiconductor components are mounted is intended to solve the current demand for miniaturization. It is difficult to respond sufficiently to future demands for miniaturization even with a piezoelectric oscillator that has a piezoelectric vibrator mounted on the other laminated substrate surface opposite to There is a problem that.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a temperature-compensated piezoelectric oscillator comprising a piezoelectric vibrator and a semiconductor component. The piezoelectric vibrator is mounted on the other opposing laminated substrate surface, the semiconductor component mounting side constitutes a container with a wall extending from the laminated substrate, and the other piezoelectric vibrator mounting side also extends from the laminated substrate. In a temperature-compensated piezoelectric oscillator comprising a container with a wall, the outer dimensions of the container on which the semiconductor component is mounted are smaller than those of the container on which the piezoelectric vibrator is mounted. This is a container for a piezoelectric oscillator. The container is made of a ceramic material, and the container on which the piezoelectric vibrator is mounted has a closed structure with a lid.

[0007] In short, the piezoelectric vibrator (for example, a crystal vibrator) and the semiconductor component are housed in opposite directions with respect to the laminated substrate, but the piezoelectric vibrator itself needs to secure a variable width and increase the CI value. In order to prevent this, it is necessary to secure a certain size (external dimensions), whereas the semiconductor component (IC chip) has a much smaller external dimension, so that both (the piezoelectric vibrator and the semiconductor component) are housed. It is intended to reduce the size of the container to a size that is sufficient to achieve miniaturization and low volume.

[0008]

BACKGROUND A piezoelectric vibrator constituting a temperature-compensated oscillator has a temperature characteristic in which the frequency changes depending on the environmental temperature. As an example, in the case of an AT-cut crystal unit, the temperature at which the center frequency fluctuates least is set to around 25 ° C, and the temperature characteristics peculiar to the AT-cut crystal unit are such that the frequency fluctuation becomes large on the high temperature side and low temperature side. It is known to have.

[0009] As a recent trend, miniaturization, weight reduction, and price reduction have been rapidly developed mainly in the field of mobile communication such as wireless communication equipment and mobile phones. Therefore, in order to reduce the size and cost of a temperature-compensated oscillator that meets these demands, a semiconductor component and a hermetically sealed piezoelectric vibrator are mounted on the same plane of a laminated substrate. Therefore, a mounting area is required for the structure of the airtight container of the piezoelectric vibrator, which imposes restrictions on miniaturization.

Further, if only the piezoelectric vibrator is hermetically sealed (contained) in the same container as the oscillating circuit component without hermetically sealing it, especially in the case of a temperature-compensated piezoelectric oscillator, the temperature-compensated oscillator may be used. At present, it is difficult to maintain the temperature compensation characteristics because the temperature of the surrounding environment of the piezoelectric vibrator changes due to the heat generated by the semiconductor components constituting the temperature compensated oscillator.

On the other hand, regarding the realization of a low price, the cost of the semiconductor component is higher than the cost of the piezoelectric vibrator in the piezoelectric vibrator and the semiconductor component constituting the temperature compensated oscillator, and the defect of the temperature compensated oscillator is reduced. Since the factors are often caused by the characteristics of the piezoelectric vibrator, it is considered necessary to satisfy the desired characteristics of the piezoelectric vibrator before assembly and to reduce the consumption of the semiconductor components. The piezoelectric vibrator is mounted on the other laminated substrate surface of the laminated substrate opposite to the semiconductor component mounting side, and the semiconductor component mounting side forms a container with a wall extending from the laminated substrate, and the container is also laminated on the other piezoelectric vibrator mounting side Attention has also been focused on a piezoelectric oscillator having a container structure in which a container is constituted by a wall extending from a substrate and a container structure in which a piezoelectric vibrator and a semiconductor component are separated.

[0012]

Embodiments of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same reference numeral indicates the same object. FIG. 1 shows a partial cross-sectional view of the temperature compensated piezoelectric oscillator of the present invention. In FIG. 1, a temperature-compensated piezoelectric oscillator 3 includes a ceramic laminated substrate 4 on which a piezoelectric vibrator 1 and a semiconductor component 2 are mounted. The piezoelectric vibrator 1 and the semiconductor component 2 are mounted in a positional relationship between the front and back of the laminated substrate. I have.

A printed pattern (not shown) is formed on both sides of the laminated substrate 4 and the piezoelectric vibrator 1
An output from an electrode (not shown) of a (for example, a quartz oscillator) is printed in a conductive pattern on both sides of the laminated substrate 4 so as to penetrate the laminated substrate 4 and be connected to an oscillation circuit stage of the semiconductor component 2. I have. The mounting surface of the temperature-compensated piezoelectric oscillator 3 on the printed circuit board is on the side of the container 6 for housing the semiconductor component 2, and the pattern of mounting and conduction on the printed circuit board is not shown.

The semiconductor component 2 is housed in a container covered by a wall extending from the laminated substrate 1, and the piezoelectric vibrator 1 is mounted on the other surface of the laminated substrate 4 (front and back). A wall is also provided on the mounting side to form a container, and the semiconductor component 2 and the piezoelectric vibrator 1 are in the form of an integrally formed container (the laminated substrate 4, the container 6, and the container 7). The temperature-compensated piezoelectric oscillator 3 is configured such that the component 2 and the piezoelectric vibrator 1) are located on opposite surfaces. At this time, the bonding and conduction between the piezoelectric vibrator 1 and the laminated substrate 4 are performed using a general material such as solder or a conductive adhesive, and the bonding and conduction between the semiconductor component 2 and the laminated substrate 4 are performed by wire bonding or flip chip bonding. Has been done in the implementation.

On the other hand, the container structure, which can be said to be a feature of the present invention, is a form in which the piezoelectric vibrator 1 and the semiconductor component are housed in directions opposite to each other with respect to the laminated substrate. ) Is much smaller in outer dimensions, so that the size of the container (piezoelectric vibrator and semiconductor component) is reduced to a sufficient size to accommodate both, thereby realizing the miniaturization and low volume. In contrast to the container 7 (dimension L1 and dimension W1) that accommodates the piezoelectric vibrator 1, the container 6 (dimension L2 and dimension L2) on which the semiconductor component 2 is mounted is mounted.
(Dimension W21) has smaller outer dimensions (L1> L)
2, W1 ≧ W2). Note that the external dimensions are reduced along the outer circumference, and an outline thereof is shown in a perspective view of FIG.

As shown in FIG. 2, a lid 5 (for example, a metal plate and a seam seal) is placed over the end of the container 7 on which the piezoelectric vibrator 1 shown in FIG. Can be. Further, the sealing between the lid 5 and the laminated substrate 4 is not limited by a sealing method such as an adhesive, glass frit welding, solder welding, or seam welding.

As described above, in the temperature-compensated piezoelectric oscillator 3 of the present invention, the piezoelectric vibrator 1 is mounted on the surface of the other laminated substrate of the laminated substrate 4 on which the semiconductor components 2 are mounted. The side on which the semiconductor component 2 is mounted has a container structure in which ceramic walls extend from the laminated substrate 4, and the other side (container) on which the piezoelectric vibrator 1 is mounted has a closed structure with a lid 5.

The material of the lid 5 for covering the piezoelectric vibrator 1 described in the present embodiment is formed of a ceramic material, a metal material, a resin material, or the like to form a closed container, and protects the semiconductor component 2 on the other surface. Needless to say, the same effect can be obtained even when the container 6 is covered with a material or the lid 6 is closed on the end surface of the container 6 on the side where the semiconductor component 2 is stored. In this embodiment, the container 7 on which the piezoelectric vibrator 1 is housed and the container 6 on which the semiconductor component 2 is mounted are described in an integrated manner. Even if the temperature-compensated piezoelectric oscillator 3 is configured in the form described above, the aforementioned (L1> L2, W1 ≧ W2,
Volume: container configuration satisfying the condition of container 7 ≧ container 6) is sufficient. Further, in the substrate of the present embodiment, a laminated substrate is described as an example, but a single plate substrate provided with conducting means (on the front and back of the substrate) by through holes or the like can also provide the same effect.

[0019]

According to the present invention, the semiconductor component and the piezoelectric vibrator constituting the oscillation circuit are mounted on the front and back of the substrate, and the semiconductor is mounted on the temperature-compensated piezoelectric oscillator. By reducing the external dimensions of the device, the footprint of the temperature-compensated piezoelectric oscillator can be reduced and the volume can be reduced while maintaining the characteristics of the entire temperature-compensated piezoelectric oscillator.

[Brief description of the drawings]

FIG. 1 is a partial sectional view showing a container structure of the present invention.

FIG. 2 is a side view of the present invention in which a lid is placed on the side where the piezoelectric vibrator is mounted.

FIG. 3 is a perspective view of a container according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 piezoelectric vibrator 2 semiconductor component 3 temperature-compensated piezoelectric oscillator 4 laminated substrate 5 lid 6 container on which semiconductor component is mounted 7 container on which piezoelectric vibrator is stored

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Claims (5)

[Claims] A piezoelectric oscillator comprising a piezoelectric vibrator and a semiconductor component, wherein the piezoelectric vibrator is mounted on the other substrate surface of the substrate on which the semiconductor component is mounted, the surface being opposite to the semiconductor component mounting side; A temperature-compensated piezoelectric oscillator in which a semiconductor component mounting side forms a container with a wall extending from the substrate, and the other piezoelectric vibrator mounting side also forms a container with a wall extending from the substrate, wherein the piezoelectric vibrator is mounted. A temperature-compensated piezoelectric oscillator, wherein the outer dimensions of the container on which the semiconductor component is mounted are smaller than those of the container on the side. 2. A piezoelectric oscillator comprising a piezoelectric vibrator and a semiconductor component, wherein the piezoelectric vibrator is mounted on the other substrate surface of a substrate on which the semiconductor component is mounted, opposite to the semiconductor component mounting side container. A temperature-compensated piezoelectric oscillator constituting the container on the side, wherein the container on which the semiconductor component is mounted has a smaller outer dimension than the container on which the piezoelectric vibrator is mounted. Type piezoelectric oscillator. 3. The temperature compensated piezoelectric oscillator according to claim 1, wherein the container material is formed of a ceramic material. 4. A temperature-compensated piezoelectric oscillator, wherein the container on which the piezoelectric vibrator according to claim 1 is mounted has a closed structure with a lid. 5. A temperature-compensated type wherein the volume of the container on which the semiconductor component is mounted is smaller than the volume of the container on which the piezoelectric vibrator according to claim 1 is mounted. Piezoelectric oscillator.