JP2001100234A - Electro-optical device, method of manufacturing the same, and method of inspecting dummy electrode of electro-optical device - Google Patents

Abstract

(57) [Problem] To provide a structure, a manufacturing method, and an inspection method capable of suppressing a product defect and a decrease in product quality due to a dummy electrode pattern in an electro-optical device. A dummy electrode pattern (35) is provided on a surface of a mother substrate (30) facing a wiring (42) formed on the mother substrate (40).
Are formed. In the dummy electrode pattern 35, a plurality of bent dummy pattern portions 35a are arranged in parallel. The dummy pattern portion 35a includes the liquid crystal
An extended pattern portion 35b is formed integrally, which extends out of 0A and further extends outside the panel expected area 130. The arrangement of the extension pattern portion 35b is gradually changed as it extends toward the outside of the panel scheduled region 130, and the inspection terminal portion 35c is formed at the tip.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electro-optical device, a method of manufacturing the same, and a method of inspecting a dummy electrode of an electro-optical device, and more particularly, to a method of forming a dummy electrode pattern and an inspection technique thereof.

[0002]

2. Description of the Related Art Generally, an electro-optical device in which an electro-optical material is disposed between two substrates is used as, for example, a display device. In the case of a liquid crystal device as an example of an electro-optical device,
There is provided a liquid crystal panel formed by bonding two transparent substrates via a sealing material and sealing liquid crystal therebetween. In this liquid crystal panel, transparent electrodes and metal electrodes are formed on the surfaces of transparent substrates facing each other with the liquid crystal interposed therebetween, and by applying a predetermined voltage between these opposed electrodes, the alignment state of the liquid crystal is adjusted. Is changed, and a desired display is obtained.

FIGS. 4A and 4B are plan views (a) and (b) showing patterns of electrodes and wirings formed on the surfaces of two mother substrates 10 and 20 used in manufacturing a conventional liquid crystal panel. Panel scheduled regions for forming a plurality of panels are arranged on each of the mother substrates 10 and 20, and one of the panel scheduled regions 11 is shown in FIG.
0,120. Planned panel areas 110 and 120
Shows external shapes of two transparent substrates sandwiching a liquid crystal layer when formed on a liquid crystal panel.

As shown in FIG. 1A, a transparent or reflective electrode 1 having a stripe shape is formed on the surface of a mother substrate 10.
1 are formed in parallel, and from each electrode 11,
The wiring 12 formed of the same material as the electrode is extended. The tip of the wiring 12 is formed as an external terminal 13. On the other hand, as shown in FIG.
A large number of transparent electrodes 21 extending in a stripe shape in a direction perpendicular to the electrodes 11 are formed in parallel on the surface of the electrode 11, and a wiring 22 formed of the same material as the electrodes extends from each electrode 21. Is formed. The tip of the wiring 22 is formed as an external terminal 23.

[0005] The mother substrates 10 and 20 are adhered to each other via a sealing material (not shown), and liquid crystal is injected into the inside of the sealing material (referred to as a liquid crystal sealing region) and sealed. In this state, a pixel intersects the electrode 11 and the electrode 21 extending in a direction orthogonal to each other in a plane as a pixel. The portion where the pixels are arranged is a display drive region X indicated by oblique lines in the drawing. At this time, a dummy electrode pattern 25 including a plurality of dummy pattern portions 25a is formed on the surface of the mother substrate 20 facing the wirings 12 on the mother substrate 10, and the dummy electrode pattern 25 A dummy electrode pattern 26 including a plurality of dummy pattern portions 26a is formed on the surface of the opposing mother substrate 20. Similarly, a dummy electrode pattern 15 composed of a plurality of dummy pattern portions 15a is provided on the surface of mother substrate 10 facing wiring 23 on mother substrate 20.
Are formed, and a dummy electrode pattern 16 composed of a plurality of dummy pattern portions 16a is formed on the surface of the mother substrate 10 facing the end of the electrode 21 on the mother substrate 20.

The display driving area X in the liquid crystal enclosing areas 110A, 120A of the liquid crystal panel constituted by two transparent substrates composed of the panel scheduled areas 110, 120.
As described above, the electrodes 11 and 21 facing each other are disposed on the surfaces of the two transparent substrates. Also, in the peripheral region Y which is in the liquid crystal sealing region but around the display driving region X, the ends of the electrodes 11 and 21 and the wirings 12 and 22 conductively connected to the electrodes are formed.
However, in this peripheral region Y, the electrodes 11,
Since there are no electrodes or wires at the end of 21 or at a portion facing the wires 12 and 22, the dummy electrode patterns 15, 16 and
If 25 and 26 are not formed, the appearance will be different from the display drive area X. In the peripheral area Y, the wiring 1
2, 22, and dummy electrode patterns 15, 16, 25, 26
There is also a portion where is not formed, but in such a portion, in order to make the appearance similar to the above-described display drive region X,
A dummy electrode pattern (not shown) is formed on the surface of any of the transparent substrates.

FIG. 6 shows a display driving area X in the liquid crystal sealing area, a peripheral area Y in the liquid crystal sealing area, and a Z outside the liquid crystal sealing area.
Of the electrode 11 formed on the surface of one substrate and the dummy pattern portions 15A and 15A of the dummy electrode pattern.
B and 15C are shown in plan view with electrodes 21A, 21B and 21C formed on the surface of the opposing substrate and wirings 22A, 22B and 22C respectively connected thereto. In the display drive area X, the electrodes 11
A pixel G is provided at a portion where the
a, Gb, and Gc are arranged in a matrix. The dummy pattern portions 15A, 15B, and 15C are respectively formed in the peripheral region Y so as to face the wirings 22A, 22B, and 22C on the opposing substrate.

When the wiring is not formed only on the surface of one substrate, the dummy electrode pattern is formed only on the surface of one substrate as described above. If no wiring is formed, they are formed on the surfaces of both substrates. The above-described dummy electrode pattern is formed in a portion facing an electrode or a wiring formed on the surface of the other substrate in substantially the same pattern as the electrode or the wiring. This is the pattern of the electrodes and wiring,
If the dummy electrode pattern opposite to the dummy electrode pattern is formed in a different pattern, the electric potential is generated between a plurality of wirings facing the common dummy electrode pattern due to the presence of the electric capacitance via the liquid crystal layer, and the display is performed. This is because the crosstalk phenomenon (abnormal lighting of adjacent pixels) may occur.

[0009]

However, in the above-mentioned conventional liquid crystal device, particularly, in recent years, the display has been rapidly increased in definition and the frame has been narrowed (reducing the width of the portion outside the display drive region). As the number of electrodes increases, the number of wirings increases, and it is becoming difficult to secure a sufficient wiring area, and the spacing between the wirings is reduced, and the wiring resistance is made uniform. In addition, the wiring pattern shape is becoming more complicated. Therefore, the number of dummy electrode patterns formed so as to face the wiring pattern is inevitably increased, the interval between the pattern portions is reduced, and the pattern shape is complicated. Therefore, as shown in FIG. 6, in the dummy electrode pattern 15 facing the wiring 22, a short circuit between the dummy pattern portions occurs, for example, a bridge portion is formed between the adjacent dummy pattern portions 15A and 15B. It is easier. Thus, the adjacent dummy pattern portion 15A
When a short circuit occurs between the dummy patterns 15A and 15B, the potential of the wiring 22A and the potential of the wiring 22B are changed.
5B, the pixels Ga and Gb
Are affected by each other, for example, the above-mentioned display abnormality occurs, for example, a pixel which is not supposed to be lit is lit, and there is a problem that display quality is remarkably deteriorated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a structure, a manufacturing method, and an inspection capable of suppressing a product defect and a decrease in product quality due to a dummy electrode pattern in an electro-optical device. It is to provide a method.

[0011]

In order to solve the above-mentioned problems, an electro-optical device according to the present invention comprises an electro-optical material disposed between a first substrate and a second substrate, and has an electro-optical material disposed on a surface of the first substrate. An electro-optical device, comprising: a plurality of first electrodes and a first wiring; and a plurality of second electrodes and a second wiring on a surface of the second substrate facing the first substrate. The first electrode and the first wiring or the second electrode on the surface of at least one of the substrate and the second substrate;
In a region where the electrode and the second wiring are not formed, a plurality of the second electrodes or the second
A wiring or a first electrode or a dummy electrode pattern having a plurality of dummy pattern portions facing the first wiring is provided, and each of the dummy pattern portions is provided with an inspection terminal portion. Are arranged in a predetermined area.

According to the present invention, the inspection terminals are provided on the plurality of dummy patterns facing the electrodes and the wirings of the other substrate, and the inspection terminals are arranged in a predetermined area, so that the dummy terminals are arranged. Inspection of the electrode pattern can be performed easily and reliably, and deterioration of the product quality due to a short circuit between the dummy pattern portions can be avoided.

Further, another electro-optical device according to the present invention comprises a first electro-optical device.
An electro-optical material disposed between a substrate and a second substrate, comprising a plurality of first electrodes and a first wiring on a surface of the first substrate, a surface of the second substrate facing the first substrate; An electro-optical device comprising a plurality of second electrodes and a second wiring thereon, wherein the first electrode and the first wiring on a surface of at least one of the first substrate and the second substrate Alternatively, in a region where the second electrode and the second wiring are not formed, a plurality of the second
An electrode or the second wiring or a dummy electrode pattern having a plurality of dummy pattern portions facing the first electrode or the first wiring is provided, and the dummy pattern portion is provided outside a region where the electro-optical material is arranged. An extended pattern portion extending is formed, and an inspection terminal portion is provided on the extended pattern portion.

According to the present invention, the dummy pattern portion is formed with the extended pattern portion extending outside the area where the electro-optical material is arranged, and the extended pattern portion is provided with the inspection terminal portion. Inspection terminal portions can be arranged without being affected by the required pattern shape (for example, a pattern shape that matches the pattern shape of the electrodes and wiring formed on the opposing substrate). The degree of freedom of
The inspection for the dummy electrode pattern can be performed more easily.

Still another electro-optical device according to the present invention includes a first electro-optical device.
An electro-optical material disposed between a substrate and a second substrate, comprising a plurality of first electrodes and a first wiring on a surface of the first substrate, a surface of the second substrate facing the first substrate; An electro-optical device comprising a plurality of second electrodes and a second wiring thereon, wherein the first electrode and the first wiring on a surface of at least one of the first substrate and the second substrate Alternatively, in a region where the second electrode and the second wiring are not formed, a plurality of the second
An electrode or the second wiring or a dummy electrode pattern having a plurality of dummy pattern portions facing the first electrode or the first wiring is provided, and the dummy pattern portion is provided outside a region where the electro-optical material is arranged. An extended pattern portion is formed, and the extended pattern portion extends to an outer end of the one substrate.

According to the present invention, it is possible to provide an inspection terminal portion in advance of the extension pattern portion, remove the substrate portion on which the inspection terminal portion is formed after inspecting the dummy electrode pattern.

In the present invention, it is preferable that the plurality of inspection terminals are arranged at equal intervals from each other.

According to the present invention, since the plurality of inspection terminal portions are arranged at equal intervals, drive control of the probe is facilitated when scanning the probe, and a probe card or the like is used. In this case, since the probe arrangement of the probe card can be made regular, it is easy to increase the density and to share the probe card.

In the present invention, the dummy electrode pattern is supplied with at least mutually different potentials among the plurality of second electrodes or the second wirings or the first electrode or the first wirings on the other substrate. It is preferable that the dummy pattern portions that are separated from each other are formed so as to be arranged for each of the portions facing the possibility.

Since the dummy pattern portion is formed for each portion of the other substrate opposite to the portion to which a different potential may be supplied, the influence between the portions to which different potentials are supplied through the dummy pattern portion is provided. Can be completely avoided.

Next, in a method of manufacturing an electro-optical device according to the present invention, an electro-optical material is disposed between a first substrate and a second substrate, and a plurality of first electrodes and a plurality of first electrodes are provided on a surface of the first substrate. First
A method of manufacturing an electro-optical device, comprising: a plurality of second electrodes and a plurality of second wires on a surface of the second substrate facing the first substrate, wherein the first substrate and the second substrate are provided.
A plurality of second electrodes on a surface of at least one of the substrates on which the first electrode and the first wiring or the second electrode and the second wiring are not formed; Alternatively, a dummy electrode pattern including a dummy electrode pattern having a plurality of dummy pattern portions facing the second wiring or the first electrode or the first wiring, and then inspecting for a short circuit between the dummy pattern portions is formed. It is characterized by having a process.

According to the present invention, by providing the dummy electrode inspection step, the presence / absence of a short circuit between the dummy patterns is inspected. Electrical interaction between electrodes and wirings on the other substrate through the patterns can be reduced.

In the present invention, it is preferable that inspection terminals are provided on the plurality of dummy pattern portions, respectively, and the inspection terminals are formed so as to be arranged in a predetermined area.

According to the present invention, since the inspection terminals are arranged in the predetermined area, the dummy electrode inspection step can be easily performed.

In the present invention, it is preferable that the plurality of inspection terminal portions are formed so as to be arranged at equal intervals.

In the present invention, it is preferable that an arrangement region of the plurality of inspection terminal portions on the one substrate is removed after the dummy electrode inspection step.

According to the present invention, the arrangement area of the inspection terminal section is removed after the dummy electrode inspection step, so that the degree of freedom in pattern design with respect to the position and arrangement of the arrangement area of the inspection terminal section is increased. For example, it is possible to form the inspection terminal portion so as to facilitate the inspection.

Further, in the method for inspecting a dummy electrode of an electro-optical device according to the present invention, an electro-optical material is arranged between a first substrate and a second substrate, and the first electrode and the first electrode are disposed on the surface of the first substrate. A second wiring on a surface of the second substrate facing the first substrate; and a second electrode on a surface of the second substrate, the first electrode and the second electrode on at least one of the first substrate and the second substrate. In a region where the first wiring or the second electrode and the second wiring are not formed, a plurality of the second electrodes or the second wirings or the first electrode or the first wiring on the other substrate is opposed. A method for inspecting a dummy electrode of an electro-optical device provided with a dummy electrode pattern having a plurality of dummy pattern portions, wherein a plurality of the dummy pattern portions are provided with respective inspection terminal portions, and the plurality of the inspection terminal portions have a predetermined area. It formed so as to be arranged in, characterized by examining the short existence between the dummy pattern portion by making electrical contact to said test terminal portions.

In the present invention, it is preferable that the plurality of inspection terminal portions are formed so as to be arranged at equal intervals.

In the present invention, it is preferable that an arrangement area of the plurality of inspection terminal portions on the one substrate is removed after the dummy electrode inspection step.

[0031]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an electro-optical device according to an embodiment of the present invention; Each of the embodiments described below relates to a liquid crystal panel in a passive matrix type liquid crystal device. However, the present invention is not limited to such a liquid crystal panel, and can be applied to various liquid crystal panels. The present invention can be applied to various electro-optical devices other than the liquid crystal device, such as a display and an electroluminescence panel.

First Embodiment FIG. 1 is a schematic plan view showing a surface pattern structure of mother substrates 30 and 40 for manufacturing a liquid crystal panel according to a first embodiment of the present invention. FIG. 3A is a perspective view illustrating a schematic structure of a liquid crystal panel 101 manufactured using mother substrates 30 and 40.

A liquid crystal enclosing area 130A surrounded by a sealing material (not shown) and a liquid crystal panel 101 shown in FIG. An overhang area 130 </ b> B is formed so as to overhang the portion further outward. A large number of stripe-shaped electrodes 31 are formed in parallel in the liquid crystal sealing region 130A. The electrode 31 may be a transparent electrode made of ITO (indium tin oxide) or the like, depending on the structure of the liquid crystal panel 101, or
A reflective electrode made of an aluminum thin film or the like may be used.
One end of the electrode 31 continues to the wiring 32 as it is, and extends so as to be drawn out from the liquid crystal sealing area 130A to the overhanging area 130B.

On the other hand, panel scheduled area 140 of mother substrate 40
Inside, a liquid crystal enclosing area 140A surrounded by a sealing material (not shown) and an extending area 140B formed so as to extend further outward than the outer end of the opposing substrate when the liquid crystal panel 101 is formed are set. Is done. A large number of stripe-shaped electrodes 41 are formed in parallel in the liquid crystal sealing region 140A. This electrode 41 is also used in the liquid crystal panel 101.
Depending on the structure, a transparent electrode or a reflective electrode may be used. However, when the liquid crystal panel 101 is a reflective liquid crystal panel, usually, one of the electrodes 31 and 41 is a reflective electrode, and the other is a transparent electrode. Also,
When the liquid crystal panel 101 is a transmissive liquid crystal panel,
Usually, both electrodes 31 and 41 are transparent electrodes.

1 (a) and 1 (b), the hatched portions in the figure show the display driving region X, and the portions around the display driving region X and inside the liquid crystal sealing regions 130A and 140A are the peripheral region Y. The outside of the liquid crystal enclosing areas 130 and 140 within the panel scheduled areas 130 and 140, that is, the outside of the sealing material, is outside the liquid crystal enclosing area Z.

In this embodiment, a dummy electrode pattern 35 is formed on the surface of the mother substrate 30 facing the wiring 42 formed on the mother substrate 40. In the dummy electrode pattern 35, a plurality of bent dummy pattern portions 3 are provided.
5a are in parallel. An extended pattern portion 35b is formed integrally with the dummy pattern portion 35a. The extended pattern portion 35b extends outside the liquid crystal sealing region 130A and further extends outside the panel expected region 130. The arrangement of the extension pattern portion 35b is gradually changed as it extends toward the outside of the panel scheduled region 130, and the inspection terminal portion 35c is formed at the tip. Multiple extension pattern portions 35b
The inspection terminal portions 35c respectively formed in the inspection region 3
They are arranged in a line at equal intervals in OC.

The electrode 41 formed on the mother substrate 40
Dummy electrode pattern 36 is formed on the surface of mother substrate 30 facing the end of. Dummy electrode pattern 36
Inside, a plurality of strip-shaped dummy pattern portions 36a are arranged in parallel. The dummy pattern portion 36a extends outside the liquid crystal sealing region 130A, and further extends to the panel scheduled region 13A.
An extended pattern portion 36 extending to the outside of 0
It is formed integrally with b. The extension pattern 36b extends almost straight toward the outside of the panel scheduled area 140,
The inspection terminal portion 36c is closer to the tip of the portion.
Since the dummy pattern portions 36a are originally arranged in a line at regular intervals, each dummy pattern portion 36a is formed to extend to the outside of the panel expected region 130 as it is, and the inspection terminal portions 36c ahead thereof are also arranged in a line at regular intervals. Are arranged.

On the other hand, the wiring 32 formed on the motherboard 30
Dummy electrode pattern 45 is formed on the surface of mother substrate 40 opposite to. In the dummy electrode pattern 45, a plurality of bent dummy pattern portions 45a are arranged in parallel. The dummy pattern portion 45a extends outside the liquid crystal sealing region 140A, and further extends into the panel scheduled region 1
An extended pattern portion 4 extending to the outside of 40
5b are integrally formed, and the tip of the extension pattern portion 45b is an inspection terminal portion 45c. The inspection terminal portions 45c respectively formed on the plurality of extension pattern portions 45b are:
They are arranged in a line at equal intervals.

The electrode 31 formed on the mother substrate 30
Dummy electrode pattern 46 is formed on the surface of mother substrate 40 facing the end of. Dummy electrode pattern 46
Inside, a plurality of strip-shaped dummy pattern portions 46a are arranged in parallel. The dummy pattern portion 46a extends outside the liquid crystal sealing region 140A, and further extends to the panel scheduled region 14A.
An extended pattern portion 46 extending to the outside of 0
It is formed integrally with b. The portion of the extension pattern portion 46b near the tip is an inspection terminal portion 46c. Since the dummy pattern portions 46a are originally arranged in a line at regular intervals, each dummy pattern portion 46a is formed as it is to extend outside the panel scheduled area 140 as it is, and the inspection terminal portions 46c ahead thereof are also arranged in a line at regular intervals. Are arranged.

In the present embodiment, the mother substrate 30 and the mother substrate 40 are bonded together via a sealing material (not shown), and liquid crystal is injected into the sealing material.
The liquid crystal panel 101 as shown in FIG. 3A is formed by separating along the boundary of 0 and 140 by a scribe-break method or the like. This liquid crystal panel 10
1, a panel substrate 131 formed by separating a panel scheduled region 130 and a panel substrate 1 formed by separating a panel scheduled region 140
41 are bonded to each other. Panel substrate 13
1 is provided with an overhang region 130B that extends beyond the outer end of the panel substrate 141, and the panel substrate 141 is provided with an overhang region 140B that extends beyond the outer end of the panel substrate 131. Can be These overhang areas 13
0B and 140B, wiring 3
2 and 42 are drawn out, and the external terminal portions 33 and 4 are
3 are formed.

In this embodiment, as shown in FIGS. 1A and 1B, after the patterns of the electrodes and wirings are formed on the surfaces of the mother substrates 30 and 40, the mother substrate 30 and the mother substrate 40 are formed. Before bonding, the inspection areas 30C and 30D on the motherboard 30 and the inspection areas 40C and 4C on the motherboard 40 are bonded together.
A probe or a probe card is brought into contact with 0D, and a pattern inspection of the dummy electrode patterns 35, 36, 45, 46 is performed. This pattern inspection is to electrically confirm whether or not a short circuit has occurred between the dummy pattern portions 35a, 36a, 45a, 46a in the pattern. In each of the inspection regions 30C, 30D, 40C, and 40D, inspection terminal portions 35c, 36c, 45c, and 46c that are conductively connected to the respective dummy pattern portions are arranged in a line with each other and at equal intervals. Therefore, for example, two probes, that is, the probe pair is brought into contact with two adjacent test terminal portions to detect the presence or absence of a short circuit, and the probe pair is moved so that the pair of test terminal portions contacted by the probe moves sequentially. In the case of scanning, the scanning mode of the probe pair can be set as predetermined, and the presence or absence of a short circuit between the dummy pattern portions can be detected easily and reliably. On the other hand, when a short circuit between a large number of test terminals is to be detected at once using a probe card having a predetermined probe arrangement, the test terminals 35c, 36c, and 45c arranged in the test area. , 46c and the arrangement of the probes of the probe card need only be matched, so that the presence or absence of a short circuit between the dummy patterns can be easily and reliably detected.

The extended pattern portions 35b, 36b, 45b, 46b having the inspection terminal portions 35c, 36c, 45c, 46c arranged in a predetermined area in a predetermined manner are all provided for performing the above-mentioned dummy electrode inspection. However, these extension patterns extend outside the liquid crystal enclosing area 130A and further extend outside the panel scheduled areas 130 and 140, so that the inspection terminal 35c is located at a position outside the panel scheduled areas 130 and 140. , 36c, 45c, 46c. Therefore, when the liquid crystal panel 101 is completed, the inspection terminal portions 35c, 36c, 45c, 46c located outside the panel scheduled regions 130, 140 are provided.
Has been removed, the extended pattern portions of the respective dummy pattern portions are left as extended to the outer ends of the panel substrates 131 and 141.

FIG. 5 is an enlarged plan view showing the detailed structure of the dummy pattern portion in the above embodiment. In FIG. 5, the electrodes 31 and the electrodes 41 are arranged so as to intersect with each other two-dimensionally in the display driving area X in the liquid crystal enclosing area, and the intersection between the two forms a pixel area. The dummy pattern portion 35a is formed along the wiring 42 on the opposing panel substrate 141 in the peripheral region Y in the liquid crystal sealing region. In the case of illustration, the dummy pattern portion 35a
Exhibits the function as the original dummy electrode in the peripheral region Y. When the dummy pattern portion 35a goes out of the peripheral region Y to outside the liquid crystal sealing region Z, the extension pattern portion 3
5b, which further extends, and the portion beyond the extension pattern portion 35b becomes the above-described inspection terminal portion 35c (not shown). At the boundary between the peripheral area Y and the liquid crystal enclosure area Z in FIG. 5, a sealing material (not shown) is arranged between the substrates.

According to the configuration of the present embodiment, the inspection terminal portions are formed in each dummy pattern portion of the dummy electrode pattern, and the inspection terminal portions are arranged in a predetermined area in a predetermined manner. In addition, a dummy electrode inspection process such as the presence or absence of a short circuit between dummy pattern portions can be performed by means that matches a predetermined mode of the inspection terminal portion. Therefore, regardless of the pattern shape of the dummy electrode pattern,
The dummy electrode inspection step can be performed easily and reliably.

In particular, in the above embodiment, the inspection terminals are arranged at regular intervals, so that the probe can be easily scanned, and a probe card that matches the arrangement of the inspection terminals can be easily formed. Alternatively, the probe card can be shared with another test object.

In the above embodiment, an extension pattern portion is formed in each dummy pattern portion of the dummy electrode pattern, and an inspection terminal portion is provided in the extension pattern portion, so that the pattern shape of the dummy electrode pattern itself can be reduced. The liquid crystal panel can be configured without largely changing the dummy electrode pattern without impairing the original function.

Further, in the above embodiment, the inspection terminal is provided at a place where each of the extension pattern portions extends and goes out of the panel expected area, so that the liquid crystal panel is completed through the dummy electrode inspection process. In this case, the inspection terminal does not remain on the liquid crystal panel. Therefore, the inspection terminal portion that comes into contact with the probe or the like in the dummy electrode inspection process does not remain on the liquid crystal panel, so that the cleanliness of the liquid crystal panel can be easily maintained, and product defects due to adhesion of foreign matter and contamination can be reduced.

[Second Embodiment] Next, FIGS. 2 and 3
A second embodiment according to the present invention will be described in detail with reference to FIG. In this embodiment, a plurality of electrodes 51 similar to those of the first embodiment and lead-out wirings 52a conductively connected to the electrodes 51 are formed in a liquid crystal enclosing region 150A in a panel scheduled region 150 on the mother substrate 50. ing. Dummy electrode patterns 55, 56, and 57 are formed on both sides of the arrangement portion of the electrodes 51 in the panel scheduled region 150. Further, connecting wires 52b and 52c are formed so as to extend from the end of the liquid crystal sealing region 150A to the adjacent overhang region 150B. This connection wiring 52
b and 52c are conductively connected to an electrode 61 to be described later via a vertical conducting portion (not shown).

In the liquid crystal sealing area 160A in the panel scheduled area 160 on the mother substrate 60, the same electrode 61 as in the first embodiment and the wirings 62a and 62b conductively connected to this electrode are provided.
Are formed. The wiring 52 on the mother substrate 50
A dummy electrode pattern 65 is formed on the surface of the mother substrate 60 facing the portion a. In the dummy electrode pattern 65, a plurality of dummy pattern portions 65a are formed in parallel. Further, on the surface of the mother substrate 60 facing the end of the electrode 51 on the mother substrate 50, a strip-shaped dummy pattern portion 6 is formed.
A dummy electrode pattern 65 formed by arranging a plurality of 5a in parallel is formed. Furthermore, on the surface of the motherboard 60 facing the dummy electrode pattern 57 on the motherboard 50,
A dummy electrode pattern 67 is formed by arranging a plurality of strip-shaped dummy pattern portions 67a in parallel. That is,
The dummy patterns 57 and 67 face each other.

The plurality of dummy pattern portions 55 a in the dummy electrode pattern 55 on the motherboard 50 are formed in a pattern corresponding to the wiring 62 b on the motherboard 60. In the dummy pattern portion 55a, the liquid crystal sealing region 150
An extended pattern portion 55b protruding from A is provided, and further extends outside the planned panel region 150, and a test terminal portion 55c is provided at a tip thereof in the test region 50C. The plurality of inspection terminal portions 55c are arranged in a line at equal intervals.

The plurality of dummy pattern portions 56 a in the dummy electrode pattern 56 on the motherboard 50 are formed in a pattern corresponding to the wiring 62 a on the motherboard 60. In the dummy pattern portion 56a, an extended pattern portion 56b protruding from the liquid crystal enclosing region 150A is provided, and further extends outside the panel scheduled region 150, and a test terminal portion 56c is provided at the tip thereof in the test region 50D. . The plurality of inspection terminal portions 56c are arranged in a line at equal intervals.

On the other hand, the plurality of dummy pattern portions 65 a in the dummy electrode pattern 65 on the motherboard 60 are formed in a pattern substantially corresponding to the wiring 52 a on the motherboard 50. In the dummy pattern portion 65a, the extended pattern portion 65b extends out of the liquid crystal enclosing region, and a test terminal portion 65c is provided at the tip thereof in the test region 60C. The inspection terminals 65c are arranged in a line at equal intervals.

The plurality of dummy pattern portions 66 a in the dummy electrode pattern 66 on the motherboard 60 are formed in a pattern substantially corresponding to the end of the electrode 61 on the motherboard 60. In the dummy electrode pattern 66, the dummy pattern portion 65a extends outward from the inside of the liquid crystal enclosing region 160A as an extended pattern portion 65b, and a portion near the leading end thereof serves as an inspection terminal portion 65c in the inspection region 60D.

In this embodiment, the mother substrates 50 and 60 are bonded together via a sealing material, a liquid crystal is injected into the sealing material, and the sealing is performed.
The liquid crystal panel 102 shown in FIG. 3 (b) is formed by separating along the boundary line 160 by the scribe-break method or the like. The liquid crystal panel 102 includes a liquid crystal layer sealed with a sealant between a panel substrate 151 corresponding to the panel expected area 150 and a panel substrate 161 corresponding to the panel expected area 160. The end of the panel substrate 151 extends further outward than the outer edge of the panel substrate 161 to form an extended region 150B. On the surface of the overhang region 150B, the above-mentioned extraction wiring 52a and connection wirings 52b and 52c are formed. An integrated circuit chip having a liquid crystal driver circuit (not shown) is mounted on the leading ends of these wires.

In this embodiment, as in the first embodiment, the dummy electrode inspection step for detecting a short circuit between the dummy pattern portions of the dummy electrode pattern can be performed easily and reliably. In addition, the dummy pattern portion that needs to be inspected in the dummy electrode inspection step is limited to a portion where wirings and electrodes facing each other exist. For example, a portion where the dummy pattern portions face each other like the dummy electrode patterns 57 and 67 is Testing is not required.

The electro-optical device and the method of manufacturing the same and the method of inspecting the dummy electrode of the electro-optical device according to the present invention are not limited to the illustrated examples described above, but may be variously modified without departing from the gist of the present invention. Of course, changes can be made.

For example, in the above embodiment, the inspection terminal portion is formed outside the panel scheduled area so that the inspection terminal portion does not remain on the panel substrate of the liquid crystal panel. And may be configured to remain on the surface of the panel substrate. In this case, the formation site of the inspection terminal portion is Z outside the liquid crystal sealing region, that is,
It is preferable that the portion between the sealing material disposition portion and the outside thereof and the outer edge portion of the panel scheduled region be designed without substantially affecting the shape of the dummy pattern portion in the liquid crystal sealing region.

[0058]

As described above, according to the present invention,
Inspection terminal portions are provided on a plurality of dummy pattern portions facing the electrodes and wirings of the other substrate, and these inspection terminal portions are arranged in a predetermined area, so that the inspection of the dummy electrode pattern can be easily and reliably performed. This makes it possible to avoid a decrease in product quality due to a short circuit between the dummy pattern portions.

[Brief description of the drawings]

FIGS. 1A and 1B are plan views (a) and (b) showing a surface pattern structure on a mother substrate according to a first embodiment of the present invention.

FIGS. 2A and 2B are plan views showing a surface pattern structure on a mother substrate according to a second embodiment of the present invention. FIGS.

FIG. 3A is an external perspective view of a liquid crystal panel formed according to the first embodiment, and FIG. 3B is an external perspective view of a liquid crystal panel formed according to the second embodiment.

4A and 4B are plan views showing a surface pattern structure on a mother substrate for manufacturing a conventional liquid crystal device.

FIG. 5 is an enlarged plan view showing a detailed structure of a dummy electrode pattern in the first embodiment.

FIG. 6 is an enlarged plan view showing a detailed structure of a conventional dummy electrode pattern.

[Explanation of symbols]

 30, 40, 50, 60 Mother substrate 31, 41, 51, 61 Electrode 32, 42, 62a, 62b Wiring 52a Leading wiring 52b, 52c Connecting wiring 35, 36, 45, 46 Dummy electrode pattern 35a, 36a, 45a, 46a Dummy pattern part 35b, 36b, 45b, 46b Extension pattern part 35c, 36c, 45c, 46c Inspection terminal part X Display drive area Y Peripheral area Z Outside liquid crystal sealing area

Continued on the front page F-term (reference) 2G014 AA03 AA25 AB21 AB55 AC09 2H088 EA03 FA06 FA10 FA13 FA14 FA16 FA18 FA30 HA06 MA16 2H092 GA05 GA33 GA57 GA61 JB77 MA57 NA25 NA27 NA29 PA06 5C094 AA09 AA42 AA43 AA48 DB01 EA01 EB02 FA01 FB12 GB01 GB10

Claims (12)

[Claims] An electro-optical material disposed between a first substrate and a second substrate, a plurality of first electrodes and a first wiring on a surface of the first substrate; First
An electro-optical device comprising a plurality of second electrodes and a second wiring on a surface facing a substrate, wherein the first electrode is provided on a surface of at least one of the first substrate and the second substrate. And in a region where the first wiring or the second electrode and the second wiring are not formed, a plurality of the second electrodes or the second wirings or the first electrode or the first wiring on the other substrate. A dummy electrode pattern having a plurality of opposing dummy pattern portions is provided, and each of the dummy pattern portions is provided with an inspection terminal portion, and the inspection terminal portions are arranged in a predetermined region. Electro-optical device. 2. An electro-optical material is disposed between a first substrate and a second substrate, the electro-optical material including a plurality of first electrodes and a first wiring on a surface of the first substrate, and First
An electro-optical device comprising a plurality of second electrodes and a second wiring on a surface facing a substrate, wherein the first electrode is provided on a surface of at least one of the first substrate and the second substrate. And in a region where the first wiring or the second electrode and the second wiring are not formed, a plurality of the second electrodes or the second wirings or the first electrode or the first wiring on the other substrate. A dummy electrode pattern having a plurality of opposing dummy pattern portions is provided, and an extension pattern portion extending outside the area where the electro-optical material is arranged is formed in the dummy pattern portion, and an inspection terminal portion is provided in the extension pattern portion. An electro-optical device provided. 3. An electro-optical material is disposed between a first substrate and a second substrate, the electro-optical material including a plurality of first electrodes and a first wiring on a surface of the first substrate, and First
An electro-optical device comprising a plurality of second electrodes and a second wiring on a surface facing a substrate, wherein the first electrode is provided on a surface of at least one of the first substrate and the second substrate. And in a region where the first wiring or the second electrode and the second wiring are not formed, a plurality of the second electrodes or the second wirings or the first electrode or the first wiring on the other substrate. A dummy electrode pattern having a plurality of opposing dummy pattern parts is provided, and the dummy pattern part is formed with an extended pattern part extending outside the area where the electro-optical material is arranged, and the extended pattern part is provided on the one substrate. An electro-optical device extending to an outer end of the electro-optical device. 4. The electro-optical device according to claim 1, wherein the plurality of inspection terminals are arranged at equal intervals. 5. The method according to claim 1, wherein:
In the paragraph, the dummy electrode pattern may be supplied with at least mutually different potentials among the plurality of second electrodes or the second wirings or the first electrode or the first wirings on the other substrate. An electro-optical device, wherein the dummy pattern portions separated from each other are arranged at respective portions opposed to each other. 6. An electro-optical material is disposed between a first substrate and a second substrate, the electro-optical material including a plurality of first electrodes and a first wiring on a surface of the first substrate, and First
A method for manufacturing an electro-optical device comprising a plurality of second electrodes and second wirings on a surface facing a substrate, wherein the electro-optical device includes a first electrode and a second substrate. In a region where the first electrode and the first wiring or the second electrode and the second wiring are not formed, a plurality of the second electrodes or the second wirings or the first electrode or the second A method of manufacturing an electro-optical device, comprising: forming a dummy electrode pattern having a plurality of dummy pattern portions opposing each of one wiring, and thereafter inspecting a short circuit between the dummy pattern portions. Method. 7. The electro-optical device according to claim 6, wherein inspection terminals are provided on the plurality of dummy pattern portions, respectively, and the inspection terminals are formed so as to be arranged in a predetermined area. Manufacturing method. 8. The method for manufacturing an electro-optical device according to claim 7, wherein the plurality of inspection terminal portions are formed so as to be arranged at equal intervals. 9. The method according to claim 7, wherein an arrangement area of the plurality of inspection terminal portions on the one substrate is
A method for manufacturing an electro-optical device, comprising: removing after the dummy electrode inspection step. 10. An electro-optical material disposed between a first substrate and a second substrate, comprising a first electrode and a first wiring on a surface of the first substrate, wherein the first electrode and the first wiring are provided on the second substrate. A second electrode and a second wiring are provided on a surface facing the substrate, and the first electrode and the first wiring or the second electrode and the second wiring on at least one of the first substrate and the second substrate. In a region where no is formed, a dummy electrode pattern having a plurality of the second electrodes or the second wirings on the other substrate or a plurality of dummy pattern portions facing the first electrodes or the first wirings is provided. A method of inspecting a dummy electrode of an electro-optical device, comprising: providing a plurality of the dummy pattern portions with respective inspection terminal portions; forming the plurality of the inspection terminal portions so as to be arranged in a predetermined region; Electrical The dummy electrode examination method for an electrooptic device characterized by by taking the Ntakuto inspecting short existence between the dummy pattern portion. 11. The method according to claim 10, wherein the plurality of inspection terminals are formed so as to be arranged at equal intervals. 12. The method according to claim 10, wherein
A method for inspecting a dummy electrode of an electro-optical device, comprising: removing an array region of the plurality of inspection terminals on the one substrate after the dummy electrode inspection step.