JP2001093634A - Socket for semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide sockets for semiconductor packages of a simple structure, easily applied to semiconductor packages of other kinds, and with increased reliability and durability. SOLUTION: A socket A for semiconductor packages is composed, in such a manner that the socket A is provided with the board-shaped insulation substrate 1 with an upper side 1a confronting a solder ball 22 side of a BGA 21, a through-hole 2 penetrating the substrate 1 from the upper side 1a to an underside 1b, a conductive coil-shaped spring 4 made enable to expand and contract in the direction from the upper surface 1a by the hole 2 to the solder ball 22 of the BGA 21 and given electrical continuity by contacting with the solder ball 22 directly or through a contact terminal 5, and a probe pin 3 s made to go through the hole 2 from the upper surface 1a to the lower surface 1b so as to give electrical continuity with the coil-shaped spring 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for a semiconductor package, for example, a continuity test of a BGA (ball grid array) type or LGA (land grid array) type semiconductor package.

[0002]

2. Description of the Related Art In recent years, electronic devices have been reduced in size and weight, and accordingly, there has been a demand for smaller and more efficient semiconductor packages. BGA (ball grid array) type, LGA (land grid array) type, and the like have attracted attention as semiconductor packages that meet such demands, and QFP (Quad Flat P), which has been generally used until now, has been attracting attention.
The usage track record has been increasing as an alternative to the "acquisition" type. Compared with QFP, BGA and LGA have the advantages that they do not use a lead frame and are easy to handle without fear of lead bending, and that the mounting area can be reduced with the same number of terminals, so that the mounting efficiency is good.

One of the methods for inspecting the continuity of the semiconductor package is a burn-in test. In the burn-in test, the semiconductor package is inspected under a temperature atmosphere of about 125 ° C., and a semiconductor package socket interposed between a terminal of an inspection device and a terminal of the semiconductor package is used. Also, a semiconductor package socket may be used when mounting a semiconductor package. In such a semiconductor package socket, it is indispensable to make elastic contact with these terminals in order not to damage the terminals of the semiconductor package. On the other hand, with the increasing density of semiconductor packages,
As the number of terminals is increased and the terminal pitch is reduced, small and highly reliable semiconductor package sockets that come into contact with such terminals are required.

[0004]

There are various types of semiconductor packages as described above, depending on the number of terminals and the arrangement of terminals. Conventionally, expensive semiconductor package sockets dedicated to each type are used. Have been. Therefore, when inspecting other types of semiconductor packages, etc., it is necessary to prepare semiconductor package sockets corresponding to the types, resulting in an increase in cost. In addition, since such a semiconductor package socket generally has a complicated structure, it takes a long time to repair and deliver when a failure occurs, which may hinder the inspection of the semiconductor package or reduce reliability.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a semiconductor package socket which has a simple structure, can be easily applied to other types of semiconductor packages, and has improved reliability and durability. is there.

[0006]

According to the first aspect of the present invention,
An insulating substrate having a plate-like shape, one end face of which faces the terminal side surface of the semiconductor package, a through hole penetrating from one end face side to the other end face side of the substrate, and the semiconductor from one end face side of the through hole A conductive coil-shaped spring that can be expanded and contracted in the terminal direction of the package and is electrically connected to the terminal of the semiconductor package directly or through a contact, and from one end surface to the other end surface in the through hole; A conductive member provided so as to penetrate to the side and electrically connected to the coiled spring.

With such a configuration, the terminals of the semiconductor package and the other end of the substrate, that is, the terminals of an external device such as an inspection device are at most three members, namely, a contact, a coil spring, In addition, conduction can be achieved through the conductive member. Therefore, the semiconductor package and the external device can be electrically connected with a simple configuration without damaging the terminals of the semiconductor package. Also,
Regarding application to other types of semiconductor packages, the design may be changed so as to change the position and the number of the through holes and the coil-shaped springs, and the present invention can be easily applied.

According to a second aspect of the present invention, there is provided the semiconductor package socket according to the first aspect, wherein the conductive member comprises a rod-shaped rigid probe pin, and a tip end of the probe pin is connected to the other end of the substrate. The coil-shaped spring protrudes from an end face side and is fixed to a base end side of the probe pin.

With this configuration, it is possible to directly conduct from the other end surface of the substrate to the terminal of the external device. In other words, conventionally, it was necessary to conduct from the semiconductor package socket to the terminal of the external device via the secondary socket, the build-up board, the duty board, and the like, and the number of components was large and the configuration was complicated. By using the probe pin, which is a conductive member, the terminal can be directly connected to the terminal of the external device, and the required number of parts can be reduced and the configuration can be simplified. Moreover, since the conductive member is a rigid body, it can be easily inserted into the through hole, and the assembling property to the substrate can be improved.

According to a third aspect of the present invention, there is provided the semiconductor package socket according to the first aspect, wherein the conductive member is a rod-shaped member that is in close contact with the inner peripheral wall of the through-hole, and the other end surface of the rod-shaped member is the other end. It is characterized by being formed flush with the other end surface of the substrate.

With this structure, the other end surface of the substrate, that is, the protruding portion on the terminal side of the external device is eliminated, and if this substrate is placed on the terminal of the external device, conduction with the semiconductor package can be achieved. Can be. Therefore, there is no possibility that the bar-shaped member is deformed or damaged, and the reliability of the semiconductor package socket can be improved.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, first to fourth embodiments of a semiconductor package socket according to the present invention will be described with reference to the drawings.

[First Embodiment] FIG. 1 shows a first embodiment of a socket for a semiconductor package according to the present invention. The present embodiment relates to a semiconductor package socket adapted to a BGA type semiconductor package. This semiconductor package socket A is
From the upper surface (one end surface) 1a side of the substrate 1 to the lower surface (the other end surface)
1b, a through-hole 2 penetrating through the through-hole 2, a probe pin 3 having a distal end 3a protruding from a lower surface 1b, and a coiled spring 4 having one end fixed to the proximal end 1b of the probe pin 3. BGA2 fixed to the other end of the coil spring 4
A contact 5 for contacting one solder ball (terminal of a semiconductor package) 22;

The substrate 1 is made of an insulating material, and has a BGA (semiconductor package) 21 mounted on its upper surface 1a. A plurality of solder balls (terminals of a semiconductor package) 2 disposed on the lower surface of the BGA 21
A through hole 2 penetrating from the upper surface 1a to the lower surface 1b is provided so as to match the number and position of the two.

The probe pin 3 penetrates through the through hole 2,
The distal end portion 3a is fixed to the substrate 1 so as to project from the lower surface 1b. The probe pin 3 is made of a conductive rigid body such as a metal, and the tip 3a is brought into contact with a terminal of an external device such as an inspection device (not shown) so as to conduct. The probe pins 3 may be configured to be fixed to the substrate 1 by soldering or an adhesive, or may be configured to be fixed to the substrate 1 by being pressed into the through holes 2. The proximal end 3 b of the probe pin 3 has a diameter larger than the diameter of the through hole 2, and is not inserted into the through hole 2. A projection 3c is formed from the base end 3b toward the solder ball 22 of the BGA 21.
The protrusion 3c has a cylindrical shape having an outer diameter substantially equal to the inner diameter of the coil spring 4, and fixes one end of the coil spring 4 to the base end 3b.

One end of the coil spring 4 is fixed to the projection 3c of the probe pin 3, and the other end is B
It is extendable toward the solder ball 22 of the GA 21. The coiled spring 4 is made of a conductive material such as a metal, and has a BGA in a natural length state.
It is set longer than the distance up to 21. When the BGA 21 is mounted on the semiconductor package socket A and the other end of the coil spring 4 receives the solder ball 22, the coil spring 4 contracts and comes into elastic contact with the solder ball 22. .

A contact 5 for contacting the solder ball 22 is provided on the other end of the coil spring 4. A hemispherical or funnel-shaped concave portion 5a is formed on the upper surface side of the contact 5, that is, on the side that comes into contact with the solder ball 22, so that the solder ball 22 can be contacted with an appropriate contact pressure without being damaged. The contact 5 is made of a conductive rigid body such as a metal, and the solder ball 22 and the coil spring 4 are electrically connected via the contact 5.

When testing the BGA 21, a high-frequency current is applied to the probe pins 3 from terminals of an external device. The high-frequency current flowing through the probe pin 3 flows through the coil spring 4 and the contact 5 to the solder ball 22, and the BGA 21
And the external device are electrically connected, and the BGA 21 can be inspected.

In the present embodiment, the solder ball 22 of the BGA 21 and the terminal of the external device can be electrically connected through the contact 5, the coil spring 4, and the probe pin 3. Therefore, the BGA 21 and the external device can be electrically connected with a simple configuration without damaging the solder ball 22. In addition, since the probe pins 3 are used, the terminals can be directly connected to the terminals of the external device, and the secondary socket, build-up board, duty board, and the like, which are conventionally required, can be eliminated, and the number of required components can be reduced. A simple configuration can be provided. Furthermore, probe pin 3
Since is a rigid body, it can be easily inserted into the through hole 2, and the assembling property to the substrate 1 can be improved.

In the above-described embodiment, the example in which the coil spring 4 is in contact with the solder ball 22 via the contact 5 has been described, but the coil spring 4 and the solder ball 22 are in direct contact with each other. You may do it. FIG. 2 shows an example of this case. On the other end side of the coil spring 4, a solder ball receiver 4a is formed in a tapered shape so that the solder ball 22 can be contacted with an appropriate contact pressure without damaging it. This solder ball receiver 4a
May be a portion in which the coil spring 4 is simply enlarged in diameter. However, if the solder ball receiver 4a is pressed inward and outward with a mold or the like to deform the spring material into a flat cross section, the solder ball In this case, the contact area with the conductive layer 22 is increased, and the conduction reliability can be improved. In this example, there is an advantage that the number of components can be reduced without the need for a contact, and the device configuration of the semiconductor package socket A can be simplified.

[Second Embodiment] FIG. 3 shows a second embodiment of the semiconductor package socket according to the present invention. In the present embodiment, the semiconductor package socket of the first embodiment is adapted to an LGA type semiconductor package. In the present embodiment, the first
The same components as those of the embodiment are denoted by the same reference numerals,
Detailed description is omitted. The semiconductor package socket B includes a substrate 1, a through hole 2 penetrating from the upper surface (one end surface) 1 a side to the lower surface (the other end surface) 1 b side of the substrate 1, and a front end portion 3 a penetrating through the through hole 2 and having a lower surface. A probe pin 3 protruding from the probe pin 1b, a coiled spring 4 having one end fixed to the base end 1b of the probe pin 3, and a terminal of the LGA 31 fixed to the other end of the coiled spring 4 (terminal of a semiconductor package). 32 and a contact 6 that comes into contact therewith.

The lower surface of the LGA (semiconductor package) 31 has a plurality of flat terminals (semiconductor package terminals).
32 are provided, and the substrate 1 is provided with through holes 2 so as to match the number and position of these terminals 32.

A terminal 32 is connected to the other end of the coil spring 4.
A contact 6 for contacting the contact is provided. The upper surface of the contact 6, that is, the side in contact with the terminal 32 has a conical convex portion 6 a so that the terminal 32 can be contacted with an appropriate contact pressure without damaging the terminal 32. It comes in point contact. The contact 6 is made of a rigid body having conductivity such as a metal, and the terminal 3 is connected through the contact 6.
2 and the coil spring 4 are electrically connected.

When testing the LGA 31, a high-frequency current is applied to the probe pins 3 from terminals of an external device. The high-frequency current that has flowed through the probe pin 3 flows through the coil spring 4 and the contact 6 to the terminal 32, and conducts between the LGA 31 and an external device, so that the LGA 31 can be inspected.

In this embodiment, the terminal 32 of the LGA 31 and the terminal of the external device can be electrically connected through the contact 6, the coiled spring 4, and the probe pin 3. Therefore, the LGA 31 and the external device can be reliably connected with a simple configuration.

In the above embodiment, an example is shown in which the contact 6 having the conical convex portion 6a is in contact with the terminal 32. However, instead of the contact 6, a spherical solder ball is used. May be used. FIG. 4 shows an example of this case. On the other end side of the coil spring 4, a solder ball receiver 4a is formed in a tapered shape, and a solder ball 7 is supported or fixed to the solder ball receiver 4a. The solder ball 7 has the same configuration as the solder ball 22 used as the terminal of the BGA 21 shown in the first embodiment. This solder ball 7 is LGA
The terminal 31 is elastically in contact with the terminal 32.
In this example, since the solder ball 7 has a spherical shape, the contact pressure with the terminal 32 can be further reduced as compared with the contact 6 in which the convex portion 6a has a conical shape. for that reason,
LGA 31 having relatively weak strength against contact pressure of terminal 32
It is effective when making contact.

FIG. 5 shows still another example of the above embodiment. In this example, the other end of the coiled spring 4 is bent toward the LGA 31 to form a projection 4 b, and the projection 4 b contacts the terminal 32. In this way, even if an oxide film is formed on the surface of the terminal 32, the oxide film is removed by the protruding portion 4b having a sharp tip, so that the reliability of conduction can be improved. This is effective when the terminal 32 is brought into contact with the LGA 31 having relatively high strength.

Third Embodiment FIG. 6 shows a third embodiment of the semiconductor package socket according to the present invention. The present embodiment relates to a semiconductor package socket adapted to a BGA type semiconductor package. Note that, in this embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. This semiconductor package socket C is
The substrate 1, a through-hole 2 penetrating from the upper surface 1 a side to the lower surface 1 b side of the substrate 1, a conductive rod-shaped member 11 adhered in the through-hole 2, and a conductive member 11 The coil spring 4 has one end fixed to the upper surface 1a, and a contact 5 fixed to the other end of the coil spring 4 and in contact with the solder ball 22 of the BGA 21.

The rod-shaped member 11 is made of a conductive material such as metal, and is fixed to the substrate 1 in close contact with the through hole 2.
The rod-shaped member 11 has a length from the upper surface 1 a to the lower surface 1 b of the substrate 1, that is, a length substantially equal to the through hole 2. One end of a coil-shaped spring 4 is fixed to the upper surface 11a side of the rod-shaped member 11 by soldering or an adhesive, and the coil-shaped spring 4 is electrically connected to the rod-shaped member 11. Further, the lower surface 11b side of the rod-shaped member 11 is formed flush with the lower surface 1b, and is in direct or indirect contact with a terminal of an external device (not shown) to conduct electricity.

When the BGA 21 is inspected, a high-frequency current flows from the terminal of the external device to the bar-shaped member 11. The high-frequency current flowing through the rod-shaped member 11 is supplied to the coil-shaped spring 4 and the contact 5
Flows to the solder balls 22 through the BGA 21, the BGA 21 and the external device are conducted, and the BGA 21 can be inspected.

In the present embodiment, the lower surface 1a of the substrate 1
If the substrate 1 is placed on a terminal of an external device, the BGA 21 can be electrically connected to the BGA 21 by eliminating the side protruding portion. Therefore, there is no possibility that the rod-shaped member 11 which is a conductive member is deformed or damaged, and the reliability of the semiconductor package socket C can be improved. Further, if the substrate 1 and the terminals of the external device are electrically connected via a plurality of build-up substrates, the pitch conversion from the solder balls 22 to the terminals of the external device can be easily performed.

In the above-described embodiment, an example is shown in which the coil-shaped spring 4 is in contact with the solder ball 22 via the contact 5, but the coil-shaped spring 4 is directly in contact with the solder ball 22. You may do it. FIG. 7 shows an example of this case. The other end of the coil spring 4 is tapered to form a solder ball receiver 4a so that the solder ball 22 can be contacted with an appropriate contact pressure without damaging it. The solder ball receiver 4a may be a portion obtained by merely expanding the diameter of the coil spring 4, but the solder ball receiver 4a is pressed from inside and outside by a mold or the like to deform the spring material into a flat cross section. If put, solder ball 22
The contact area with the contact can be increased, and the conduction reliability can be further increased. In this example, there is an advantage that the number of components can be reduced without requiring a contact, and the device configuration can be simplified.

[Fourth Embodiment] FIG. 7 shows a fourth embodiment of a semiconductor package socket according to the present invention. In the present embodiment, the semiconductor package socket of the third embodiment is adapted to an LGA type semiconductor package. In the present embodiment, the second
The same components as those of the third and third embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted. The socket D for a semiconductor package includes a substrate 1, a through-hole 2 penetrating from the upper surface 1 a side to the lower surface 1 b side of the substrate 1, a conductive rod-shaped member 11 tightly fitted in the through-hole 2, and a rod-shaped member 11. A coiled spring 4 having one end fixed to the upper surface 1a side of the substrate 1 so as to be conductive, and a coiled spring 4 fixed to the other end of the coiled spring 4
And a contact 6 for contacting the terminal 32 of the GA 31.

When the inspection of the LGA 31 is performed, a high-frequency current flows from the terminal of the external device to the bar-shaped member 11. The high-frequency current flowing through the rod-shaped member 11 is supplied to the coil spring 4, the contact 6.
Through the terminal 32, and the LGA 31 is electrically connected to the external device, so that the LGA 31 can be inspected.

In the above embodiment, an example is shown in which the contact 6 having the conical projection 6a is in contact with the terminal 32. However, instead of the contact 6, a spherical solder ball is used. May be used. FIG. 8 shows an example of this case. On the other end side of the coil spring 4, a solder ball receiver 4a is formed in a tapered shape, and a solder ball 7 is supported or fixed to the solder ball receiver 4a. The solder ball 7 has the same configuration as the solder ball 22 used as the terminal of the BGA 21 shown in the first embodiment. This solder ball 7 is LGA
The terminal 31 is elastically in contact with the terminal 32.
In this example, since the solder ball 7 has a spherical shape, the contact pressure with the terminal 32 can be further reduced as compared with the contact 6 in which the convex portion 6a has a conical shape. for that reason,
LGA 31 having relatively weak strength against contact pressure of terminal 32
It is effective when making contact.

In the present embodiment, the lower surface 1a of the substrate 1
If the substrate 1 is placed on the terminal of the external device without the protruding portion on the side, electrical connection with the LGA 31 can be achieved. Therefore, there is no possibility that the rod-shaped member 11 which is a conductive member is deformed or damaged, and the reliability of the semiconductor package socket D can be improved. Further, if the substrate 1 and the terminals of the external device are electrically connected via a plurality of build-up substrates, the pitch conversion from the terminals 32 to the terminals of the external device can be easily performed.

In the above embodiment, an example is shown in which the contact 6 having the conical convex portion 6a is in contact with the terminal 32. However, instead of the contact 6, a spherical solder ball is used. May be used. FIG. 9 shows an example of this case. On the other end side of the coil spring 4, a solder ball receiver 4a is formed in a tapered shape, and a solder ball 7 is supported or fixed to the solder ball receiver 4a. The solder ball 7 has the same configuration as the solder ball 22 used as the terminal of the BGA 21 shown in the first embodiment. This solder ball 7 is LGA
The terminal 31 is elastically in contact with the terminal 32.
In this example, since the solder ball 7 has a spherical shape, the contact pressure with the terminal 32 can be further reduced as compared with the contact 6 in which the convex portion 6a has a conical shape. for that reason,
LGA 31 having relatively weak strength against contact pressure of terminal 32
It is effective when making contact.

FIG. 10 shows still another example of the above embodiment. In this example, the coiled spring 4
Is bent toward the LGA 31 side to form a projection 4 b, and this projection 4 b contacts the terminal 32. In this way, even if an oxide film is formed on the surface of the terminal 32, the oxide film is removed by the protruding portion 4b having a sharp tip, so that the reliability of conduction can be improved. This is effective when the terminal 32 is brought into contact with the LGA 31 having relatively high strength.

Another example of the above embodiment is shown in FIG. In this example, the contact 6 and the rod 1
The conductive member 15 connects the upper surface 11a of the first member 1 and the contact member 6 to the rod-shaped member 11. The conductive member 15 is provided inside the coiled spring 4 and has a length that does not hinder the expansion and contraction of the coiled spring 4. It may be a wire-like linear member or a tape-like planar member. By doing so, the high-frequency current can flow through both the coil spring 4 and the conductive member 15. When the high-frequency current flows through the coil spring 4, the inductance due to the high-frequency current flowing in a coil shape may increase. However, the conductive member 15
By providing the conductive member, the conductive portion can be increased and the high-frequency current can easily flow, and the high-frequency current can be supplied to the conductive member 15.
It can flow straight inside. For this reason, LGA31
Reliability of conduction between the device and an external device can be further improved. Note that this example is not applied only to the present embodiment. Contact 5 in the first to third embodiments
Alternatively, the present invention can be applied between the contact 6 and the probe pin 3 or the rod-shaped member 11.

[0040]

Since the semiconductor package socket according to the present invention has the above-described structure, it can be easily applied to other types of semiconductor packages with a simple structure, and has improved reliability and durability. A semiconductor package socket can be provided.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view showing a first embodiment of a semiconductor package socket according to the present invention.

FIG. 2 is a partial cross-sectional view showing another example of the first embodiment of the semiconductor package socket according to the present invention.

FIG. 3 is a partial sectional view showing a second embodiment of the semiconductor package socket according to the present invention.

FIG. 4 is a partial sectional view showing another example of the second embodiment of the semiconductor package socket according to the present invention;

FIG. 5 is a partial sectional view showing still another example of the second embodiment of the semiconductor package socket according to the present invention;

FIG. 6 is a partial sectional view showing a third embodiment of the semiconductor package socket according to the present invention.

FIG. 7 is a partial sectional view showing another example of the third embodiment of the semiconductor package socket according to the present invention;

FIG. 8 is a partial sectional view showing a fourth embodiment of the semiconductor package socket according to the present invention.

FIG. 9 is a partial sectional view showing another example of the fourth embodiment of the semiconductor package socket according to the present invention;

FIG. 10 is a partial sectional view showing still another example of the fourth embodiment of the semiconductor package socket according to the present invention;

FIG. 11 is a partial sectional view showing still another example of the fourth embodiment of the semiconductor package socket according to the present invention;

[Explanation of symbols]

 A, B, C, D Socket for semiconductor package 1 Substrate 1a Upper surface (one end surface) 1b Lower surface (other end surface) 2 Through hole 3 Probe pin (conductive member) 3a Tip 3b Base end 4 Coiled spring 5, 6 Contact 11 Bar-shaped member 21 BGA (semiconductor package) 22 Solder ball (terminal of semiconductor package) 31 LGA (semiconductor package) 32 terminal (terminal of semiconductor package)

Claims (3)

[Claims] An insulating substrate having a plate-like shape, one end face of which is opposed to a terminal-side face of the semiconductor package; a through hole penetrating from one end face side to the other end face side of the substrate; A conductive coil-shaped spring which is expandable and contractable from an end face in a terminal direction of the semiconductor package and is electrically connected to the terminal of the semiconductor package directly or through a contact, and A socket for a semiconductor package, comprising: a conductive member provided so as to penetrate from the end face side to the other end face side and electrically connected to the coiled spring. 2. The probe according to claim 1, wherein the conductive member comprises a rod-shaped rigid probe pin, a tip end of the probe pin protrudes from the other end surface side of the substrate, and the coil spring is provided on a base end side of the probe pin. 2. The semiconductor package socket according to claim 1, wherein the socket is fixed. 3. The device according to claim 1, wherein the conductive member is a rod-shaped member that is in close contact with the inner peripheral wall of the through-hole, and the other end surface of the rod-shaped member is formed flush with the other end surface of the substrate. Item 7. A semiconductor package socket according to Item 1.