JP2001055274A - Packaging container, semiconductor device, and method of manufacturing semiconductor device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To reduce industrial waste in distribution of semiconductor devices and the like, and to reduce packaging cost, waste disposal cost, and distribution cost. SOLUTION: A box-shaped container body 11 and the container body 1 are provided.
1, a plurality of semiconductor devices housed in a housing recess 13a of a transfer jig 13 such as a tray inside a packing container 10 made of a moisture-proof metal material. 14 and the hygroscopic material 15 are enclosed and distributed. The packaging container 10 can be freely opened and resealed by the user, and accurate moisture-proof management of the semiconductor device 14 can be performed without requiring other equipment such as a dry box.
The packaging container 10 can be reused, and the distribution cost can be reduced by suppressing the discharge of industrial waste.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging container, a semiconductor device, and a technique for manufacturing a semiconductor device.
The present invention relates to a technology that is effective when applied to a packaging technology in the transportation and distribution of semiconductor devices.

[0002]

2. Description of the Related Art For example, in the distribution between a semiconductor device manufacturer and a user who mounts and uses a semiconductor device on a desired device, or in the distribution from a semiconductor device manufacturing plant to a mounting plant, moisture absorption of the semiconductor device is performed. For the purpose of prevention, moisture-proof packaging is generally used.

Conventionally, as this moisture-proof packaging, a semiconductor device and a moisture-absorbing material such as silica gel are stored in a moisture-proof bag manufactured using a film material having a composite structure composed of a resin film and aluminum foil, and heat-sealed before shipment. It is possible to do.

[0004]

When a moisture-proof bag is used as a moisture-proof package as in the above-mentioned prior art, storage in a dry box, resealing of the moisture-proof bag, or In some cases, there is a technical problem that a drying step by baking the semiconductor device before mounting is required, and a complicated moisture proof measure is required on the user side.

Further, since the moisture-proof bag is a composite material of resin and metal, it is difficult to reuse and recycle, so that the amount of industrial waste increases, leading to an increase in packaging cost, waste disposal cost and distribution cost. , There is also a technical problem.

An object of the present invention is to provide a technology capable of reducing industrial waste in distribution of semiconductor devices and the like, and reducing packaging cost, waste disposal cost, and distribution cost.

Another object of the present invention is to provide a technique for facilitating the management of moisture absorption on the user side of a semiconductor device.

Another object of the present invention is to provide a technique capable of reducing the trouble at the time of mounting due to moisture absorption of a semiconductor device.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0010]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

The present invention provides a packaging container comprising a container main body and a lid attached to and detached from the container main body, wherein a moisture absorbing material is enclosed inside the container main body together with a semiconductor device.

Further, the present invention provides a semiconductor device which is sealed together with a moisture absorbing material inside a packaging container comprising a container body and a lid detachably attached to the container body.

According to the present invention, there is provided a semiconductor device manufacturing method including a step of manufacturing a semiconductor device and a step of packing the semiconductor device, wherein a packing container comprising a container body and a lid detachably attached to the container body. The present invention provides a technique for encapsulating and packing a semiconductor device together with a moisture absorbing material inside the device.

More specifically, as an example, a semiconductor device and a hygroscopic material are sealed in a packaging container made of a reusable and recyclable material that has a moisture-proof effect and can be freely opened and closed, and is distributed. After use, collect the packaging and reuse it after cleaning. If it cannot be reused, recycle it as raw material. The packaging container of the present invention can be opened and closed any number of times on the user side, so that the time and labor such as storage in a dry box and bake drying can be omitted.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing an example of a packaging container, a semiconductor device, and a method of manufacturing a semiconductor device according to an embodiment of the present invention.

The packaging container 10 of the present embodiment comprises a box-shaped container body 11 and a lid 12 which is hermetically attached to and detached from the container body 11. Container body 11 and lid 1
2 is made of, for example, a moisture-proof metal material such as stainless steel, and can be reused and recycled.

A plurality of semiconductor devices 14 housed in a housing recess 13a of a transfer jig 13 such as a tray and a hygroscopic material 15 such as silica gel are sealed inside the packing container 10.

In the case of this embodiment, the container body 11 has an opening 11a in the stacking direction of the conveying jig 13 such as a plate-shaped tray.
When the opening 11a is closed by the lid 12, a sealed container is obtained.

The semiconductor device 14 is manufactured through, for example, a well-known wafer process process and a manufacturing process such as a dicing process, a pellet bonding process, a packaging process, and the like, and is housed in the transport jig 13 after a pre-shipment inspection. It is.

In the case where the transfer jig 13 such as a tray is set to have an external size conforming to a predetermined standard according to, for example, the type of the semiconductor device 14 or the number of semiconductor devices 14 to be stored, the present embodiment The inner dimensions of the packaging container 10 in the form are also set in accordance with the outer dimensions of the transport jig 13, the number of storages of the transport jig 13, and the like.

The packaging container 10 in which the semiconductor device is sealed is handed over from the manufacturer to a user who uses the semiconductor device 14 by mounting the semiconductor device 14 on a desired device or a mounting process. The body 12 is opened, the semiconductor device 14 is taken out and used, and then the lid 12 is closed,
The remaining semiconductor device 14 is sealed again together with the hygroscopic material 15.

As a result, the moisture-proof management of the unused semiconductor device 14 can be easily performed without being transferred to a dry box or the like. As a result, the occurrence of troubles such as reflow cracks due to heat treatment such as solder reflow during mounting due to moisture absorption or the like before mounting the semiconductor device 14 is also reduced. In addition, since the moisture-proof management can be performed simply and accurately, complicated operations such as baking drying before use and reheat sealing such as a moisture-proof packaging bag are not required.

The empty packing container 10 is used for the semiconductor device 1.
4 is returned to the shipping process of the manufacturer and reused after cleaning. When the packaging container 10 is discarded, it is delivered to a metal maker or the like, and is recycled as a metal material. As a result, the packaging container 10 does not cause a waste as in the case of a moisture-proof packaging bag or the like.
4, it is possible to reduce industrial waste in distribution and the like, and to reduce packaging costs, waste disposal costs, and distribution costs.

FIG. 2 is a perspective view showing a modification of the packing container according to one embodiment of the present invention. In the configuration of the packing container 20 of FIG. 2, the opening 21a of the container main body 21 is provided at a side portion in a direction intersecting the stacking direction of the plurality of transport jigs 13 housed in a stacked state. , Is different from the configuration of FIG.

That is, in the packing container 20 of FIG.
Any one of the plurality of transport jigs 13 housed in a stacked state therein can be laterally extracted and taken out. Therefore, the plurality of transport jigs 13 can be extracted in an arbitrary order. 13 can be taken out and the internal semiconductor device 14 can be used.

As described above, in the case of the packing container 20, the same effects as those of the above-described packing container 10 of FIG. 1 can be obtained, and furthermore, various removals of the plurality of transport jigs 13 in various orders can be achieved. There is an advantage that a method of using the semiconductor device 14 can be realized.

FIG. 3 is a perspective view showing another modification of the packing container of the present invention. In the packing container 30 of FIG. 2, a shock absorbing buffer member 33 is arranged on the inner periphery of the container body 31, and the transport jig 13 and the semiconductor are sealed inside the container body 31 by the lid 32. The structure is such that the device 14 is protected from impact during transportation. Although not particularly shown, the lid 32
A similar cushioning member may be arranged on the inner peripheral surface of the.

The cushioning member 33 is disposed inside the container body 31 in a non-adhesive manner, and can be easily removed. The cushioning member 33 is made of, for example, a metal plate spring, and can be reused and recycled.

If necessary, a relief groove 33a is provided in the contact portion of the cushioning member 33 with the transport jig 13, so that the worker's hand can be used to insert and remove the transport jig 13 from the container body 31. , The holding operation of the transport jig 13 is facilitated.

As exemplified in FIG. 4, the lid 12, the lid 22, and the lid 32 of the packaging container 10, the packaging container 20, and the packaging container 30 having the above-described configurations shown in FIGS. Hygroscopic material holding structure 12a, hygroscopic material holding structure 22a, and hygroscopic material holding structure 32 for removably holding hygroscopic material 15 on the inner peripheral surface.
a, and the opening and closing of the lid 12, the lid 22, and the lid 32, and at the same time, the removal and storage of the hygroscopic material 15 inside the container body 11, the container body 21, and the container body 31 are realized. The operation for handling the hygroscopic material 15 may be omitted.

In the above-described example, a box-shaped packing container is illustrated. However, as illustrated in FIG. 5, a can-shaped packing container 40 including a cylindrical container body 41 and a lid 42 may be used.

That is, in the example of FIG. 5, as the transport jig, for example, a packing tape 43b in which individual semiconductor devices 14 are individually stored in a plurality of storage portions such as embosses (not shown) arranged in the longitudinal direction. Is illustrated using a tape-and-reel 43 wound around a reel 43a.

The tape-and-reel 43 is stacked in the axial direction of the packing container 40 so that a plurality of the tape-and-reel 43 are housed and sealed together with the hygroscopic material 15.

Since the tape-and-reel 43 is relatively weak to heat due to its material, baking after absorbing moisture is difficult. Therefore, prevention of moisture absorption of the semiconductor device 14 by moisture-proof management like the packing container 40 in the present embodiment. Is more effective.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment and can be variously modified without departing from the gist of the invention. Needless to say, there is.

For example, the shape of the packaging container is not limited to a box shape or a can shape, but may be any shape depending on the shape of the transport jig. The material is not limited to metal as long as the material has a moisture-proof effect and can be reused or recycled. Any material can be used.

The transfer jig of the semiconductor device is not limited to a tray or a tape and reel, but may be of any other form such as a magazine.

[0039]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

According to the packaging container of the present invention, reduction of industrial waste in distribution of semiconductor devices and the like, packaging cost,
The effect of reducing waste treatment costs and distribution costs can be obtained.

Further, according to the packing container of the present invention, an effect is obtained that the moisture absorption management on the user side of the semiconductor device can be facilitated.

Further, according to the packing container of the present invention, the effect that the trouble at the time of mounting due to moisture absorption of the semiconductor device can be reduced can be realized.

According to the semiconductor device of the present invention, it is possible to reduce the amount of industrial waste in the distribution of semiconductor devices and the like, and to reduce packaging costs, waste disposal costs, and distribution costs.

Further, according to the semiconductor device of the present invention, an effect is obtained that the moisture absorption management on the user side of the semiconductor device can be facilitated.

Further, according to the semiconductor device of the present invention, it is possible to reduce the trouble at the time of mounting due to moisture absorption of the semiconductor device.

According to the method of manufacturing a semiconductor device of the present invention,
An effect is obtained that it is possible to reduce industrial waste in distribution of semiconductor devices and the like, and to reduce packaging cost, waste disposal cost, and distribution cost.

Further, according to the method of manufacturing a semiconductor device of the present invention, an effect is obtained that the management of moisture absorption on the user side of the semiconductor device can be facilitated.

Further, according to the method of manufacturing a semiconductor device of the present invention, there is obtained an effect that a trouble at the time of mounting due to moisture absorption of the semiconductor device can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an example of a packaging container, a semiconductor device, and a method for manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a modification of the packaging container according to the embodiment of the present invention.

FIG. 3 is a perspective view showing another modification of the packing container according to the embodiment of the present invention.

FIG. 4 is a perspective view showing a modification of the lid of the packaging container according to the embodiment of the present invention.

FIG. 5 is a perspective view showing another modification of the packing container according to the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Packing container 11 Container main body 11a Opening 12 Lid 12a Hygroscopic material holding structure 13 Transport jig 13a Storage recess 14 Semiconductor device 15 Hygroscopic material 20 Packing container 21 Container main body 21a Opening 22 Lid 22a Hygroscopic material holding structure 30 Packaging container 31 Container main body 32 Lid 32a Hygroscopic material holding structure 33 Buffer member 33a Escape groove 40 Packing container 41 Container main body 42 Lid 43 Tape and reel 43a Reel 43b Packing tape

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3E067 AA11 AB41 AB94 AC04 AC18 BA04A BA05A BA10B BA26B BB11A BC07A CA05 EB17 EE25 3E096 AA06 AA09 BA16 BA17 CA02 CA05 CA06 CA15 DA03 DA17 DA25 DA26 EA06X EA06 GA11 FA16 FA20

Claims (10)

[Claims] 1. A package comprising a moisture-proof container main body and a moisture-proof lid attached to and detached from the container main body, wherein a hygroscopic material is sealed inside the container main body together with a semiconductor device. container. 2. The packaging container according to claim 1, wherein the semiconductor device is sealed inside the packaging container in a state where the semiconductor device is stored in a transport jig. 3. The packaging container according to claim 2, wherein the transport jig is a tray, a tape and reel, or a magazine. 4. The packaging container according to claim 1, wherein the packaging container is made of a metal box or can. 5. A semiconductor device which is sealed together with a hygroscopic material in a packaging container comprising a container body and a lid detachably attached to the container body. 6. The semiconductor device according to claim 5, wherein the semiconductor device is enclosed in the packing container while being housed in a transport jig. 7. The semiconductor device according to claim 6, wherein the transfer jig is a tray, a tape and reel, or a magazine. 8. The semiconductor device according to claim 5, wherein the packaging container is made of a metal box or can. 9. A method for manufacturing a semiconductor device, comprising: a step of manufacturing a semiconductor device; and a step of packing the semiconductor device, wherein the packing container includes a container body and a lid detachably attached to the container body. And packaging the semiconductor device together with a hygroscopic material inside the device. 10. The method of manufacturing a semiconductor device according to claim 9, wherein the semiconductor device is enclosed in the packing container in a state of being housed in a tray, a tape and reel, or a carrying jig made of a magazine. The packing container is
A method for manufacturing a semiconductor device, comprising a metal box or can.