JP2001044471A - Method and device for processing of deposit film and the deposit film processed by the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve yield of a deposit film after processing, by removing at least a part of a deposit film by carrying out laser scribing, while letting out a bendable metallic substrate where a deposit film is formed in a surface. SOLUTION: A bendable metallic substrate 100, where a deposit film is formed in a surface, is let out of a feed roller 110 and wound by a winding roller 120. A laser irradiation part 150 for scribing may emit laser through a fiber to have a substrate processing surface irradiate having a laser oscillation part as another housing. Furthermore, the laser irradiation part 150 can be moved in a length direction and in the vertical direction of the bendable metallic substrate 100 by a moving mechanism 151 of the laser irradiation part 150. Practical control of the thickness to be cut by scribing is carried out by setting a parameter, such as the kind of laser, wavelength and energy optimum. Any shape of a scribing portion can be scribed according to the desired function of a deposit film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a deposited film, a processing apparatus and a processing method thereof.

[0002]

In recent years, is expected to global warming greenhouse of increased CO ₂ occurs, clean energy requirements that do not emit CO ₂ is increasingly. Nuclear power generation is an example of an energy source that does not emit CO ₂ , but the problem of radioactive waste has not been solved, and clean energy with higher safety is desired. Under such circumstances, among the clean energies, solar cells are particularly attracting attention because of their cleanliness, safety, and ease of handling.

[0003] As a kind of solar cell, various kinds of solar cells such as a crystalline solar cell, an amorphous solar cell and a compound semiconductor solar cell have been researched and developed. Among these solar cells, thin-film solar cells such as amorphous silicon (including microcrystal) solar cells have excellent features such as easy area enlargement, large light absorption coefficient, and low Si material cost. Has attracted a great deal of attention. However, it has not yet become widespread, and the biggest reason is its high cost.

In order to reduce the cost of the solar cell, it is necessary to reduce the material cost by reducing the components of the solar cell itself, and to reduce the manufacturing cost by developing a manufacturing technique capable of mass production.

[0005] Various technologies have been developed in accordance with the demand for cost reduction of such solar cells.

One of the techniques for reducing the cost of such a solar cell is to make the solar cell monolithic. Here, a monolithic solar cell will be described. FIG. 5 is a schematic view of an example of a known monolithic solar cell. As a method for manufacturing such a monolithic solar cell, first, a substrate 5
The insulating layer 501 is formed on the layer No. 00. When the substrate 500 itself is insulative, the insulating layer 501 is not necessarily provided. Next, a base electrode 502 is formed over the insulating layer 501, and a groove 505 for separating the base electrode is formed for each element. Next, a semiconductor layer 503 to be a photovoltaic layer is formed, and a groove 506 is similarly formed. At this time, the groove 506 is formed slightly deviated from the groove 505. Furthermore, a surface electrode 504 is formed, and the groove 5 is similarly formed.
07 is formed at a position further deviated from the groove 506.
In this manner, the element is separated into a plurality of regions, and the series connection is completed when the surface electrode 504 is filled in the groove 506. In this example, the description has been given on the assumption that the front surface electrode 504 is transparent and is incident first from the front side.

This method can be manufactured by a very simple process of merely providing a groove, and when serializing solar cells, the cost of materials such as connecting parts for serialization is not required. This is a very effective form for cost reduction.

In manufacturing such a monolithic solar cell, a manufacturing technique for forming a groove is very important. As a means for providing the groove, various methods for performing a removal process using a laser beam (so-called laser scribe method) have been conventionally studied.

Next, a method for forming a deposited film while feeding out a flexible substrate, which is another method for reducing the cost of a solar cell, will be described.

As an example, US Pat. No. 4,400,409 describes a method for continuously forming a deposited film on a flexible substrate wound in a roll while continuously feeding the substrate. ing. More specifically, providing a plurality of glow discharge regions, arranging the glow discharge regions along a path through which the substrate sequentially passes through each of the glow discharge regions, and continuously transporting the substrate in its longitudinal direction. It is described that a device having a semiconductor junction can be continuously formed while depositing and forming a semiconductor layer of a suitable conductivity type for each of the glow discharge regions (hereinafter, this deposition film formation method is referred to as an “R to R” method). Abbreviated.).

FIG. 6 shows an apparatus suitable for carrying out the R to R method.
Shown in In FIG. 6, reference numeral 600 denotes a flexible substrate, which is fed out from a feed roller 610 and wound up by a winding roller 620. 630 is a holding roller for holding the position of the substrate 600. A take-up motor 621 is used to rotate the take-up roller 620. Reference numeral 611 denotes a tension motor that generates a desired back tension on the substrate 600 in combination with a built-in slip clutch or the like, thereby preventing the substrate 600 from sagging. Reference numeral 640 denotes an unwinding prevention roller, which is connected to a motor 642 via a suspension device 641. Reference numeral 643 denotes a substrate displacement detection sensor.
By detecting the winding deviation state and driving the motor 642, a favorable winding state can be always maintained. Reference numeral 650 denotes a processing chamber for forming a deposited film.

The roll-shaped flexible substrate 600 is set on the delivery roller 610, and the substrate end is pulled out and pasted on the take-up roller 620 while passing through the holding roller portion. Thereafter, while the tension motor 611 is driven to generate the back tension, the flexible substrate is fed out by the winding roller. In such a state, a deposited film is formed in the processing chamber 650 below the holding roller.

In this patent, an apparatus for performing plasma CVD by the R to R method is described, but a deposited film formed by this apparatus is mainly a semiconductor film made of silicon or the like which performs photoelectric conversion. When an actual film is formed, as described in the description of FIG. 2, it is necessary to form a base electrode, a surface electrode, and further perform cleaning and the like. Since the substrate itself is in the form of a roll, it is most efficient that all such steps are performed consistently in an R to R manner. The R to R method can be said to be a method suitable for mass production, for example, as compared with a conventional batch-type method of forming a deposition pattern because a deposited film can be continuously formed as described above.

To reduce the cost of solar cells, monolithic solar cells using laser scribe and R to R
The R method is effective. A technique combining the two is disclosed in Japanese Patent Application Laid-Open No. 10-27918. In this publication, a transparent substrate on which a thin film layer is deposited is referred to as R to R
An apparatus for performing laser patterning while feeding out by a method is disclosed. According to such an apparatus, since both monolithic processing by laser scribing and the R to R method are performed, it is expected that mass productivity of solar cells is improved.

[0015]

However, as the light-transmitting substrate used in the invention disclosed in Japanese Patent Application Laid-Open No. 10-27918, a flexible and light-transmitting material applicable to the R to R method is used. It is necessary to satisfy the condition of a material that can withstand the temperature during processing and the like at the same time, and is actually limited to a part of resin-based materials such as polyimide, fluorine resin, and polycarbonate resin. As a result of detailed examination, when such a material is used in the R to R method, R t is set between the feed roller and the take-up roller.
o It has been found that the amount of elongation of the substrate due to back tension for stretching the substrate in an R shape makes it difficult to scribe at an accurate position depending on conditions.

In particular, when considering a deposited film having a multilayer structure, it is necessary to accurately control the positional relationship between the upper layer and the lower layer. However, the resin-based substrate having a light-transmitting property has a problem that the scribed positional relationship cannot be accurately controlled due to a large amount of elongation, and the yield of the deposited film after processing is deteriorated.

An object of the present invention is to solve the problem of scribe position accuracy caused by such elongation of the substrate and to improve the yield of the deposited film after processing. Another object of the present invention is to improve the yield, especially when the solar cells are made monolithic, and to improve the mass productivity of the solar cells.

[0018]

The configuration of the present invention which has been made to achieve the above object is as follows.

That is, the deposited film processing apparatus of the present invention has a function of removing at least a part of the deposited film by performing laser scribing while feeding out a flexible metal substrate having a deposited film formed on the surface. It is characterized by.

Further, the method of processing a deposited film according to the present invention is characterized in that at least a part of the deposited film is removed by performing laser scribing while feeding out a flexible metal substrate having a deposited film formed on the surface. I do.

Further, the deposited film of the present invention is processed by removing at least a part of the deposited film by performing laser scribing while feeding out the flexible metal substrate having the deposited film formed on the surface. And

According to a further feature of the present invention, there is provided a support having an internal magnetic force having a function of holding the flexible metal substrate, and holding the flexible metal substrate by the support. "A function of performing laser scribing while holding the flexible metal substrate by holding the flexible metal substrate by using the substrate position holding means for holding a surface opposite to a processing surface of the flexible metal substrate. And also
Laser scribing is performed while holding the surface opposite to the processed surface of the flexible metal substrate by the substrate position holding means. "
And that the deposited film is at least a part of a film constituting a solar cell.

According to the present invention, when performing laser scribing of a deposited film by the R to R method, a flexible metal substrate having a much higher elastic modulus than a resin-based substrate having a light-transmitting property is used. Therefore, it is possible to prevent the scribe position from being shifted due to the extension of the deposition film forming substrate.

In particular, by holding the flexible metal substrate by a support having a magnetic force therein (hereinafter abbreviated as “magnet support”), the necessary back tension itself can be reduced, and It is possible to further prevent the displacement of the scribe position caused by the extension of the film forming substrate.

In particular, by performing laser scribing while holding the surface opposite to the processing surface of the flexible metal substrate by the substrate position holding means, occurrence of chattering of the substrate during the transfer of the substrate can be suppressed. Scribe processing can be performed under stable conditions.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a deposited film of the present invention, a processing apparatus and a processing method thereof will be described.

First, a method of performing laser scribing while feeding out a flexible metal substrate of the present invention is shown in FIG.
This will be described with reference to FIG. FIG. 1 is a schematic diagram showing an example of such a deposited film processing apparatus.

In FIG. 1, reference numeral 100 denotes a flexible metal substrate having a deposited film formed on the surface thereof (on the lower surface in this figure). The flexible metal substrate is fed out from the feed roller 110 and wound on the winding roller 120. Reference numeral 130 denotes a magnet support, which has a rotatable cylindrical shape here. 1
Reference numeral 21 denotes a winding motor, and the winding roller 12
Used to rotate 0. A tension motor 111 generates a desired back tension on the substrate 100 in combination with a built-in slip clutch or the like, thereby preventing the substrate from sagging. Reference numeral 140 denotes an unwinding prevention roller, which is connected to a motor 142 via a suspension device 141. Reference numeral 143 denotes a substrate winding deviation detection sensor which detects a winding deviation state and
By driving No. 2, a favorable winding state can always be maintained. Reference numeral 150 denotes a laser irradiating unit that performs scribing, and the laser is irradiated as shown in 152. The laser irradiation does not necessarily need to be performed by this method. For example, the laser may be irradiated to the processing surface of the substrate via a fiber by using a laser oscillation unit as a separate housing. Reference numeral 151 denotes a moving mechanism of the laser irradiation unit 150, which can move the laser irradiation unit 150 in a direction perpendicular to the longitudinal direction of the flexible metal substrate 100.

According to this structure, since the metal substrate having a large elastic modulus is used as the substrate on which the deposited film is formed, the amount of elongation of the substrate is extremely small even when the back tension for hanging the substrate is applied. As a result, the accuracy of the scribe position is improved. Further, since the magnet support is disposed on the back surface (the upper surface in FIG. 1) of the payout portion of the substrate, the substrate is stuck to the magnet support, and the sag of the substrate is reduced even if the back tension amount is reduced.
As a result, the extension amount of the substrate is further reduced, and the accuracy of the scribe position is further improved. The elongation of the substrate will be described later in detail.

The flexible metal substrate 100 is usually supplied in a roll form for use in the R to R system. The material is preferably a thin plate of stainless steel, Ni-plated steel plate, zinc steel plate, copper, aluminum or the like. In any case, it is necessary to select a material that can withstand the deposition conditions and processing conditions of the deposited film. Also, even if the surface of the flexible metal substrate is a mirror surface,
Appropriate irregularities may be provided. When a magnet support is used in combination, a magnetic material is desirable in order to exert its effect, and a magnetic material may be selected from the above metal materials.

The magnet support 130 can be constructed, for example, as shown in FIG. FIG. 2A is a cross-sectional view of the magnet support viewed from the substrate transport direction.
FIG. 2B is a sectional view taken along the line AA ′ of FIG.

In FIG. 2, reference numeral 131 denotes a flexible metal substrate 10.
The cylindrical member 132 that comes into contact with 0 is a magnet, and has a role of attaching the flexible substrate 100 to the cylindrical member 131. 133 is a shaft, and since the cylindrical member 131 is fixed to the shaft 133 via a bearing 134, it is rotatable. Reference numeral 135 denotes a shaft fixing member, which is entirely fixed to the deposited film processing apparatus wall 136. With such a configuration, the flexible substrate 100 has a rear surface in close contact with the cylindrical member 131 and is transported smoothly without rubbing.

The deposited film formed on the flexible metal substrate may be any thin film formed on the substrate and exerting some function. However, since mass production by the R to R method is efficient, The effects of the present invention are the most effective for monolithic solar cells and the like to exhibit the effect.

For laser scribing, a YAG laser,
CO ₂ laser, excimer laser, etc. can be used,
Particularly, a YAG laser is preferably used. Basic wavelength 1.
0.63 μm of the second harmonic and 0.26 μm of the third harmonic obtained by using a nonlinear optical element in addition to 0.6 μm.
Light of 5 μm can also be used. The YAG laser can continuously oscillate, but the QAG
Often used in switch pulse oscillation operation. Q switch pulse oscillation frequency is usually several KHz to several tens KHz
The duration of one pulse is around 100 nsec.

The thickness, location, and the like for shaving the deposited film may be appropriately selected depending on the purpose. As the thickness, for example, the entire thickness of the deposited film may be removed, or a very small portion (for example, 1/100 of the thickness of the deposited film) on the surface side may be removed. However, in forming a scribe groove of a monolithic solar cell, it is fundamental to scribe the thickness of the uppermost deposited film on the flexible substrate at the time of the scribe.

The actual control of the thickness removed by scribing is performed, for example, by optimally setting parameters such as the type of laser, wavelength, and energy. Of course, the feed speed of the substrate (e.g., the dwell time of the substrate when the stepping roll method is employed) is also a parameter of the scribe depth control. For scribe locations,
Although scribing may be performed in any shape depending on the intended function of the deposited film, scribing when creating a solar cell in a monolithic manner should be performed parallel or perpendicular to the lengthwise direction of the flexible substrate. Is desirable.

FIG. 3 shows an apparatus in which a substrate position holding means is further provided on the surface of the flexible metal substrate opposite to the processing surface of FIG. In FIG. 3, members having the same reference numerals as those in FIG. 1 are the same as those described in the description of FIG. 1, and thus are omitted, and only the substrate position holding means is described.

The advantage of the apparatus shown in FIG. 3 is that the flexible metal substrate position is in close contact with the substrate position holding means 300 over a wide area when the scribe is performed, so that the substrate is chattered during the substrate transfer. In some cases, scribe processing can be performed under stable conditions with the occurrence of cracks suppressed.

The substrate position holding means 300 is a flexible substrate 10
In order to improve the slip with zero, for example, a metal or resin such as Teflon having a smooth contact surface is preferable. In addition, other than the sliding means, for example, a means such as a caterpillar which can rotate while being in close contact with the flexible substrate may be used. Further, the substrate position holding means 30
0 may be provided with a holding mechanism by magnetic force.

Next, the amount of expansion of the flexible substrate due to back tension will be described.

The amount of elongation when a tensile stress is applied to a material is basically determined by the tensile stress (corresponding to back tension) and the elastic modulus of the material. The elastic modulus of stainless steel, which can be easily used as a flexible metal substrate, has a value that is at least one order of magnitude greater than that of a translucent resin such as polyimide or PET film. That is, the amount of elongation of the substrate when the same back tension is applied is much smaller in the flexible metal substrate than in the resin.

More specifically, for example, the width of the substrate is set to 350
mm, thickness 0.1 mm, and tensile force 10 kgf, the elongation amount of stainless steel is approximately 0.002%, and the elongation amount of polyimide is approximately 0.08% in the case of polyimide. . Here, if the substrate length is 1 m in consideration of a monolithic solar cell having a length of 1 m, the elongation amount is 20 μm for stainless steel and 800 μm for polyimide.

In the case of a monolithic solar cell, the shift amount of the upper scribe position relative to the lower scribe position (for example, the shift amount of the scribe grooves 505 and 506 in FIG. 5) is generally set to the order of 100 μm. Therefore, there is no problem in the case of a stainless steel substrate, but in the case of a resin substrate, the scribe groove extends beyond the shift amount. As a result, in the case of a resin substrate, there arises a problem that the scribe position of the upper layer overlaps the scribe position of the lower layer, or conversely, the scribe positions of both layers are too far apart.

In the present invention, since the metal substrate is used as the substrate on which the deposited film is formed, the accuracy of the scribe position is high, and the processing or the device design can be performed without worrying about the above problems.

[0045]

EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to the examples.

(Experimental Example 1) A flexible metal substrate was set in the deposited film processing apparatus of the present invention shown in FIG. 3, and back tension was applied to measure the elongation of the substrate. Here, the interval between the two magnet supports 130 in FIG. 3 is 1.5 m.

The flexible substrate 100 was a stainless steel substrate having a width of 350 mm and a thickness of 0.125 mm. The flexible substrate 100 wound in the form of a roll is fed to a delivery roller 110.
Attached to. Attach one end of the flexible substrate to the magnet support 1
30 while being passed through the lower portion of the roller 30. Thereafter, the substrate was manually wound around a take-up roller to remove slack in the substrate. In this state, marks were made on portions of the flexible substrate immediately below the two magnet supports.

Next, the tension roller 111 was driven to apply a back tension of 10 kg to the flexible substrate, and the amount of elongation at the marked location was measured. Met.

(Comparative Experimental Example 1) As a flexible substrate, 0.3
The same experiment as in Experimental Example 1 was performed except that a flexible resin substrate made of polyimide having a thickness of 1 mm was used, and the elongation of the substrate was 0.4 mm.

Example 1 The method for processing a deposited film according to the present invention was carried out using the apparatus for processing a deposited film according to the present invention shown in FIG.

As the flexible substrate 100, a stainless substrate having a width of 350 mm and a thickness of 0.125 mm wound in a roll shape was used. On the flexible substrate, 1μ has already been used in the previous process.
m-thick aluminum / silicon (Al: 95%, Si: 5%)
A film has been deposited.

The flexible substrate wound in the form of a roll was attached to the delivery roller 110. The flexible substrate was attached to the take-up roller 120 while passing one end of the flexible substrate under the magnet support 130. Next, the tension roller 111 was driven to apply a back tension of 10 kg to the flexible substrate to eliminate the slack of the flexible substrate.

On the other hand, the laser used was a YAG laser. The laser used a fundamental wave of 1.06 μm in a pulse oscillation operation.

After the above preparation, the winding motor 12
1 and at the same time moving mechanism 15 of the laser irradiation part
1 was driven to start machining. Substrate feed speed is 250mm
Every minute, the moving speed of the laser irradiation unit was 300 mm per second. The laser irradiation part repeated the movement in the substrate width direction.
After the processing for 40 minutes (10 m), the laser oscillation was stopped, and the flexible substrate wound around the winding roller 120 was removed.

One end of the processed flexible substrate was pulled out from the take-up roller, a square sample of 5 cm square was cut out, and the cross-sectional shape of the sample was observed with a microscope. And the underlying stainless steel substrate was exposed. In addition, the interval between adjacent scribe grooves was constant.

(Example 2) A monolithic solar cell was manufactured using the deposited film processing apparatus of the present invention shown in FIG. FIG. 4 shows the flow of all the steps. First, an outline of all the steps will be described with reference to FIG.

In step 1), the flexible metal substrate is washed. In step 2), an insulating layer is formed on the substrate. In step 3), a base electrode for a solar cell is formed.
In step 4), the underlying electrode is scribed by the method for processing a deposited film of the present invention. In step 5), a semiconductor (photovoltaic) layer is formed. In step 6), the semiconductor layer is scribed by the method for processing a deposited film of the present invention. In step 7), an upper (transparent) electrode is formed. In step 8), the upper electrode is scribed by the deposited film processing method of the present invention.

The above steps are all performed by the R to R method. The method of depositing each layer itself is not a specific method of the present invention, and therefore will not be described in detail. However, the method of conforming to US Pat. No. 4,400,409 is used for the semiconductor layer. Similarly, R to
It was created by performing sputtering at R.

The details of the above-described steps will be described below. In addition, as for a flexible substrate, a width of 350 m
A stainless steel substrate having a thickness of 0.125 mm was used.

Step 1) The substrate was washed by the R to R method. The washing solution is Orkite (trade name): (NaOH, KO
After washing, the washing liquid was washed away with pure water. Then, after drying by air blow, it was rolled up again.

Step 2) After cleaning, R is placed on the flexible substrate.
An insulating layer was formed by a toR method. As the insulating layer, a silicon oxide film having a thickness of 3 μm was deposited by using a reactive sputtering method. After the film was deposited, it was rolled up again.

Step 3) A base electrode was further formed on the insulating layer. The base electrode was made of aluminum having a thickness of 3000 mm by sputtering. After forming the base electrode, it is similarly wound up in a roll shape.

Step 4) The underlying electrode was scribed using the deposited film processing apparatus of the present invention shown in FIG. The method of installing the substrate, the method of transporting the substrate, and the like have already been described, and a description thereof will be omitted. The processing pitch was 10 mm. The scribing conditions are as follows.
Was used in the pulse oscillation operation. The substrate feed speed is 2
50 mm / min. As a result, 10 mm
A scribe groove having a width of about 130 μm was formed at a pitch.

Step 5) After scribing the underlying electrode, R
A semiconductor (photovoltaic) layer was deposited by the toR method. The CVD method was used as a method for forming the film itself. In addition, as the layer configuration, an N-type amorphous silicon layer (200 °) and an I-type amorphous silicon layer (32
00) and a P-type amorphous silicon layer (110). After the formation of the semiconductor layer, the flexible substrate was wound up again in a roll shape.

Step 6) The semiconductor layer was scribed in the same manner as in step 4. The scribing conditions are the same as in step 4, except that the second harmonic of the YAG laser is used in the pulse oscillation operation using 0.53 μm and the substrate feeding speed is set to 450 mm per minute. The scribe position of the semiconductor layer was formed at a position shifted by 100 μm from the scribe position of the base electrode. The substrate after scribing the semiconductor layer was wound around a winding roller.

Step 7) An upper (transparent) electrode was further formed on the semiconductor layer in which the scribe grooves were formed. The upper electrode was an ITO film formed by a sputtering method. The thickness of the ITO film was approximately 700 °.

Step 8) The upper electrode was scribed in the same manner as in step 4. 450mm substrate feed speed
Except for every minute, the scribe conditions are the same as in step 4. The scribe position of the upper electrode was formed at a position shifted by 100 μm from the scribe position of the semiconductor layer. After the upper electrode scribe, the flexible substrate was wound around a take-up roller.

As described above, a deposited film constituting a monolithic solar cell as shown in FIG. 5 was formed.

Next, the deposited film formed in the above step was fed out and cut at intervals of about 500 mm. This is the 50 series solar cells monolithic in the above process. A power extraction terminal was attached to the cut substrate, and solar cell characteristics were measured. As a result, good characteristics were obtained.

[0070]

According to the present invention, a specific method and a specific apparatus for implementing the laser scribe method with high scribe position accuracy by the R to R method have been realized. As a result, the yield at the time of monolithic formation of the deposited film, particularly the solar cell, was improved, and the mass productivity of the solar cell was dramatically improved. Furthermore, as a result, the cost of manufacturing solar cells can be significantly reduced.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an example of a deposited film processing apparatus according to the present invention.

FIG. 2 is a diagram illustrating an example of a magnet support.

FIG. 3 is a schematic diagram showing an apparatus in which a substrate position holding means is further provided on the surface of the apparatus shown in FIG.

FIG. 4 is a diagram showing a flow of all steps for producing a monolithic solar cell.

FIG. 5 is a schematic sectional view showing an example of a monolithic solar cell.

FIG. 6 is a schematic view of an apparatus for performing the R to R method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 Flexible metal substrate 110 Sending roller 111 Tension motor 120 Winding roller 121 Winding motor 130 Magnet support 131 Cylindrical member 132 Magnet 133 Axis 134 Bearing 135 Axis fixing member 136 Deposition film processing apparatus wall 140 Rolling prevention roller 141 Suspension device 142 Motor 143 Substrate winding misalignment detection sensor 150 Laser irradiating unit for scribing 151 Moving mechanism of laser irradiating unit 300 Substrate position holding means 500 Substrate 501 Insulating layer 502 Base electrode 503 Semiconductor layer 504 Surface electrode 505 Base electrode opening groove Part 506 Groove part of semiconductor layer 507 Groove part of surface electrode 600 Flexible substrate 610 Feeding roller 611 Tension motor 620 Winding roller 621 Winding Motor 630 holding roller 640 winding displacement prevention roller 641 suspension device 642 motor 643 processing chamber for forming the substrate wind shift detection sensor 650 deposited film

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshifumi Takeyama 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Koichi Shimizu 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon (72) Inventor Koji Tsuzuki 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term (reference) 4E068 AD00 CA14 CE09 DA11 DA14 DB01 5F051 AA05 BA14 BA15 CA12 DA04 EA09 EA10 EA11 EA16 GA02 GA05 GA20

Claims (10)

[Claims] 1. A deposited film processing apparatus having a function of removing at least a part of the deposited film by performing laser scribing while feeding out a flexible metal substrate having a deposited film formed on a surface thereof. . 2. The deposition film processing apparatus according to claim 1, further comprising a support having a magnetic force therein, the support having a function of holding the flexible metal substrate. 3. A substrate scribing means for holding a surface of the flexible metal substrate opposite to a processing surface, wherein laser scribing is performed while holding the flexible metal substrate by the substrate position holding means. 3. The deposited film processing apparatus according to claim 1, wherein the apparatus has a function. 4. The deposited film processing apparatus according to claim 1, wherein said deposited film is at least a part of a film constituting a solar cell. 5. A method for processing a deposited film, wherein at least a part of the deposited film is removed by performing laser scribing while feeding out a flexible metal substrate having a deposited film formed on a surface thereof. 6. The method according to claim 5, wherein the flexible metal substrate is held by a support having a magnetic force therein. 7. The method according to claim 5, wherein the laser scribing is performed while holding the surface of the flexible metal substrate opposite to the processing surface by a substrate position holding unit. 8. The method for processing a deposited film according to claim 5, wherein the deposited film is at least a part of a film constituting a solar cell. 9. A deposited film obtained by removing at least a part of the deposited film by performing laser scribing while feeding out a flexible metal substrate having a deposited film formed on a surface thereof. 10. The deposited film according to claim 9, wherein the deposited film is at least a part of a film constituting a solar cell.