JP2001038721A - Cutting jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an excellent jig which does not cause clogging of a cutting grind stone and enhances the property of the cutting grind stone to proceed straight without giving rise to chipping when an object intended for is cut out of a substitute such as a wafer or the like by constituting a cutting jig of a specific volume % of heat-curable resin and the rest of a filler of a specific average particle diameter. SOLUTION: A cutting jig 2 is fixed to a movable table 1 and a wafer 3 is bonded to the surface of the jig 2 using a wax or the like. Further, a rotary cutting grind stone 4 is made to cut through the wafer 3 upto the surface layer of the jig 2 by moving the table 1 to the cutting grind stone 4 and thus the wafer 3 is cut separately into individual pieces of a head. The cutting jig 2 is formed of 30-60 vol.% heat-curable resin and the remainder of filler with an average particle dia. of 40 μm or less. The heat-curable resin to be used is a resin such as epoxy, phenol, melamine or polyester and the filler to be used is one or more kinds of ceramic such as alumina, silica and steatite.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting jig for holding a substrate material used for an electronic component or the like when cutting.

[0002]

2. Description of the Related Art In general, substrates constituting electronic parts and the like are:
In order to perform mass production simultaneously, a wafer having a larger area than a predetermined unit body of the circuit board is used, and a plurality of circuits are formed for each unit body on the main surface of the wafer by thin film technology, and then the wafer is formed. Is fixed on a plane of a cutting jig and cut by a grindstone or the like for each circuit.

[0003] With particular illustrate a thin film magnetic head, after elaborate make many thin-film magnetic heads on a wafer comprising a substrate by using a thin-film deposition techniques Al ₂ O ₃ -TiC based sintered body, the rotation at the final stage Each magnetic head is cut by a cutting tool such as a diamond grindstone. Specifically, as shown in FIG. 4, a plate-shaped cutting jig 2 is fixed to a movable table 1 of a cutting device, a wafer 3 is bonded thereon, and the table 1 is moved with respect to a rotating cutting grindstone 4. The wafer 3 is cut into individual heads by cutting the cutting whetstone 4 into the surface layer of the cutting jig 2 through the wafer 3. At that time, it was necessary to sharpen the cutting whetstone 4 with the dressing whetstone 5 placed beside the cutting jig 2.

As a material used for the cutting jig 2, ferrite or alumina-added ferrite (JP-A-6-2780) is used.
No. 08), and materials having easy-to-cut characteristics such as carbon and bakelite are used.

[0005]

However, in general, the cutting jig 2 made of a ferritic material is brittle, and not only breaks or breaks due to mechanical impact from the cutting whetstone 4, but also has a high specific gravity, so that it is heavy. It could not play a sufficient role as a cutting jig, such as being difficult to handle.

The ferrite material has a Vickers hardness of 70.
Since the material is as high as 00 to 7500 MPa, there is a problem that the cutting grindstone 4 is worn or clogged with cutting powder, thereby hindering the straightness of the cutting grindstone 4. Is inhibited, there is an inconvenience that chipping (chip) occurs on the cut surface of the cut piece. Therefore, every time one line is cut, the dressing whetstone 5
Had to be sharpened.

[0007] Further, in a method of producing a ferrite-based material, generally, raw material powders are mixed so as to obtain a predetermined composition.
The ferrite powder obtained by sintering and pulverization is expensive because it follows the steps of molding and sintering.

Further, a cutting jig 2 made of a carbon-based material
Similarly, the strength is brittle, which causes problems such as cracking and chipping during handling.In addition, during handling during processing, the wafers and mechanical equipment after cutting are stained by carbon cutting chips, so cleaning work is required. There were problems such as unfavorable working environment.

Further, in the case of the cutting jig 2 made of bakelite, when the wax is used to fix the wafer, if the warp or the like is deformed by the heat of melting the wax, the straightness of the grindstone at the time of cutting is deteriorated. This causes chipping of the cut wafer.

[0010] The present invention has been made in view of such circumstances, and when cutting an object from a substrate such as a wafer,
It is an object of the present invention to provide an excellent cutting jig that does not cause clogging of a cutting grindstone, further increases the straightness of the cutting grindstone, and does not cause chipping.

[0011]

In order to achieve the above object, the present invention has made various studies. As a result, when cutting wafers for thin-film magnetic heads, piezoelectrics and quartz, ceramic powder or the like is used. The above problem is solved by using a cutting jig made of a thermosetting resin in which a filler is dispersed.

That is, the cutting jig of the present invention is characterized in that the cutting jig is made of a resin composite composed of 30 to 60% by volume of a thermosetting resin and the remainder having a filler having an average particle size of 40 μm or less.

The cutting jig of the present invention is characterized in that the aspect ratio of the filler is 80 or less.

Further, the cutting jig of the present invention is characterized in that the resin composite has a Vickers hardness of 500 MPa or less.

The cutting jig according to the present invention is characterized in that the resin composite has a deflection temperature under load of 200 ° C. or more.

Further, the present invention is characterized in that the cutting jig has pores and the pore occupancy is in the range of 3 to 30%.

The cutting jig of the present invention can be manufactured by a step of press-molding a mixed material of a thermosetting resin and a filler at room temperature, releasing the mold from a mold, and heating and curing. According to the production method of the present invention, the moldability can be improved even when the content of the filler is increased to 70 to 40% by volume.

[0018]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

As shown in FIG. 1, a cutting jig 2 of the present invention is fixed to a movable table 1 of a cutting device, a wafer 3 is bonded thereon by wax or the like, and the table 1 is moved with respect to a rotating cutting grindstone 4. Then, the cutting wheel 4 is cut into the surface layer of the cutting jig 2 through the wafer 3 to cut the wafer 3 into individual heads.

As shown in FIG. 2, the cutting jig 2 according to the present invention fills a wedge 12 with a premixed raw material of a thermosetting resin 16 and a filler 18 by a powder press molding machine, and And after pressurizing at room temperature by the lower punch 13,
The molded body 14 obtained by releasing the mold is manufactured by a process of being heated and cured by the oven 15.

FIG. 3 is a schematic sectional view of the cutting jig 2 thus obtained. As shown in FIG. 3, the filler 18 is dispersed in the matrix of the thermosetting resin 16 and the pores 17 are also dispersed. ing.

The cutting jig 2 of the present invention has a content of 30 to 60% by volume.
Is composed of a resin composite comprising the thermosetting resin 16 and the filler 18 having an average particle diameter of 40 μm or less.

The ratio of the thermosetting resin 16 is 30% by volume.
If it is less than 10, the amount of the filler 18 increases and the cutting resistance increases to increase the abrasion of the grindstone, hindering the straightness of the grindstone and causing chipping on the wafer, and at the same time, powder pressure molding becomes difficult. And 60
If the content is equal to or more than the volume%, the dimensional accuracy cannot be increased due to deformation at the time of heating and curing, and the dressing effect of the grindstone decreases. Therefore, the ratio of the thermosetting resin is specified in the range of 30 to 60 volume%. As the thermosetting resin 16, various types such as an epoxy type, a phenol type, a melamine type, and a polyester type can be used.

In the composite of the thermosetting resin 16 and the filler 18 of the present invention, by increasing the content of the filler 18, the flatness stability after the addition of the thermal cycle can be improved.

The filler 18 is made of aluminum.
Na (Al_TwoO_Three), Silica (SiO_Two), Steatite (MgO ・ Si
O_Two), Forsterite (2MgO ・ SiO)_Two), Mullite (3A
l_TwoO _Three・ 2SiO_Two), Cordierite (3MgO ・ 2Al)_TwoO_Three・ 5SiO
_Two ) Etc., and the average particle size is
It is 40 μm or less. This means that the average particle size exceeds 40 μm
The surface of the heat-cured body becomes rough and the appearance or surface characteristics
This is due to the fact that
You.

When the particle size of the filler 18 is reduced as described above, the dispersibility may be deteriorated when mixed with the thermosetting resin 16. In this case, the coupling agent is added to the surface of the powder constituting the filler 18. Just coat it.

The average particle diameter of the filler 18 is determined by analyzing an arbitrary surface or cross section of a resin composite composed of the thermosetting resin 16 and the filler 18 with an image analyzer, and determining the equivalent circle diameter of the filler 18 particles present on this surface. It is measured by calculating the average value of.

The aspect ratio of the filler is set to 80.
It is preferable to set the following. The aspect ratio is 80
When the size is larger, the dispersibility at the time of mixing with the thermosetting resin 16 is poor, so that the filler 18 is not uniformly present in the inside and the surface layer of the resin composite, so that a sparse part and a dense part are formed, There is a risk that the grindstone and cutting workability will decrease.

The resin composite of the present invention may further comprise
Exist in random directions, and when the aspect ratio is measured from the cutting jig 2, five points on an arbitrary surface or cross section of the cutting jig 2 are conveniently placed on a metal microscope or an electron microscope (SEM). ) Is the aspect ratio obtained by dividing the length of the filler 18 analyzed by the image analyzer with the average particle diameter (fiber diameter) of the known filler 18.

Further, in the resin composite of the thermosetting resin 16 and the filler 18, besides the thermosetting resin 16 and the filler 18, a known filler such as clay, talc, mica, kaolin, silica sand, carbonate There is no problem if calcium or the like is appropriately blended as a bulking agent, and if necessary,
Known additives such as a curing agent, a curing assistant, a lubricant, a plasticizer, a dispersant, a colorant, and a release agent may be added in a small amount to a practically acceptable level. However, the content of carbon (C) generally used as a coloring agent is preferably 0.5% by weight or less, more preferably 0.2% by weight or less. Further, the resin composite of the present invention has an unavoidable impurity.
Cl, P, Na, Al, Si, Sr, Mg, Zr, Fe, Co, Cu, Ta and the like may be contained. Even if these are mixed in about 0.1% by weight in the total amount, there is no problem in characteristics. In addition, a minute amount of another metal element or the like may be mixed for convenience in the manufacturing process. Furthermore, in the present invention, the method of blending various raw materials is not particularly limited, and a known method can be employed. For example, a method in which a compound such as a filler 18 is mixed with the thermosetting resin 16 by a mixer, kneaded by a Brabender, and then pulverized. Alternatively, a method of pulverizing the mixture after melt-kneading with a heating roll and the like may be used. Further, if necessary, the particles may be granulated to a predetermined particle size and used for molding.

In the heat curing step, the mold is released from the mold, and the heat treatment is performed at a temperature in the range of 80 to 250 ° C. in accordance with the properties of the thermosetting resin 16 and the amount of the filler 18 to be mixed.
In the case of heat treatment, a mold jig may be used in some cases.

The thermosetting resin 16 and the filler 18
Jig 2 is made of Vickers hardness of 5
It is preferable that the pressure is not more than 00 MPa.

If the Vickers hardness exceeds 500 MPa, the cutting grindstone 4 may be worn or clogged, thereby hindering the straightness of the cutting grindstone 4. Here, the Vickers hardness is 500 MPa.
In order to make the average particle diameter below, the average particle diameter of the filler 18 can be adjusted by reducing the average particle diameter.

The cutting jig 2 of the present invention preferably has a deflection temperature under load of 200 ° C. or higher. This is to melt the wax when attaching and removing the wafer 3.
In many cases, the cutting jig 2 is heated in the range of 150 ° C. to 170 ° C., and when the deflection temperature under load of the cutting jig 2 is less than 200 ° C., the cutting jig 2 easily warps and deteriorates in the straightness during cutting. This is because there is a risk that influences such as load on the grinding wheel and the grinding wheel may occur. The deflection temperature under load can be adjusted to 200 ° C. or higher by increasing the mixing ratio of the filler 18.

The cutting jig 2 of the present invention preferably has 3 to 30% of pores 17 on the surface and inside. Due to the pores 17 on the surface, the bonding area is increased and the bonding strength is improved. In addition, since the wax thickness is extremely thin, there is almost no entrainment of the wax and the workability is improved. Further, the inside pores 17 improve the area around the cutting water, improve the removal of cutting chips, and reduce the cutting resistance.

Here, a method of measuring the occupancy of the pores will be described. An arbitrary surface or cross section of the resin composite of the thermosetting resin 16 and the filler 18 is analyzed by an image analyzer, and a value obtained by dividing an area of a pore portion present on this surface by a total area of image capturing is defined as a pore occupation ratio. .

Further, since the cutting jig 2 of the present invention has a dressing effect by itself, the cutting grindstone 4 is not clogged. This is because the cutting jig 2 itself has a dressing effect because the filler 18 made of ceramic powder or the like is dispersed in the thermosetting resin 16 to form the cutting jig 2. The prevention of clogging also improves the straightness of the cutting whetstone 4, and allows the dressing whetstone 5 as shown in FIG.
It is not necessary to provide the cutting jig 2 of the present invention on the table 1 as shown in FIG. 1 and further bond the substrate material such as the wafer 3 thereon. Thermosetting resin 1
6, the cutting force is small and the straightness is improved.

As described above, the cutting jig 2 is constituted by using a composite of the thermosetting resin 16 and the filler 18 which has a high load deflection temperature and a high flatness stability after the application of a cooling / heating cycle and has a grinding wheel dressing effect. This can prevent the grinding stone from being clogged without being deformed even at a high temperature. Therefore, the cutting jig 2 of the present invention can be suitably used as a cutting jig 2 for an electronic component substrate such as a substrate for a magnetic head, a crystal oscillator, a crystal oscillator, a single crystal substrate, and a glass substrate.

[0039]

Embodiments of the present invention will be described below.

A phenol resin was used as the thermosetting resin, and alumina (Al ₂ O ₃ ) ceramic was used as the filler. Raw materials were prepared by varying the mixing ratio of phenol resin and alumina, the average particle size of alumina, and the aspect ratio as shown in Table 1. Each material was press-molded at room temperature, and then heat-cured at 80 to 250 ° C. to prepare a test piece for evaluation.

The average particle size of alumina was also evaluated under the conditions shown in Table 2 by preparing test pieces using the same production method while keeping the mixing ratio of phenol resin and alumina constant.

With respect to the occupancy of the pores, the mixture ratio of the phenol resin and alumina was kept constant, and the mixture was molded under pressure at room temperature. went.

In Table 4, test pieces were prepared by changing the filler from alumina to silica and evaluated.

In the evaluations shown in Tables 1 to 4, the moldability was evaluated mainly on the raw strength, and those having sufficient strength were evaluated as ○, those having slightly lower strength but handleable as Δ, and having lower strength and unhandled. Those are indicated by x.

With respect to the shape retention after heat curing, those which can be conformed to the mold shape are represented by ○, those where slight dripping is observed at the ends are represented by △, and those where the mold shape is scarce are represented by ×.

Processability, chipping occurrence rate and dressing
The measurement of the ruggedness was performed as follows. Phenolic resin and aluminum
A magnetic head substrate on a cutting jig made of composite material
Al_TwoO _Three-Attached TiC-based sintered body with adhesive and cut with cutting wheel
Refused. The diameter of the cutting stone is 100 mm and the thickness is 0.1
5 mm. The cutting condition is a rotation speed of 10,000 rpm
m, feed rate 80mm / min, processing length of one line
Was set to 68 mm and 20 lines were processed.

Regarding the workability, the wear amount of the cutting grindstones was compared, and those without wear were evaluated as ○, those with less than 0.5% wear as Δ, and those with 0.5% or more wear as X. Represent.

Regarding the chipping occurrence rate, the occurrence rate was calculated based on the number of chippings of 20 μm or more with respect to all chippings. For dressing properties, use a whetstone with S
Confirmed by EM photograph, those with little clogging are indicated by ○, those slightly observed are indicated by Δ, and those observed many are indicated by ×.

Regarding the straightness, the undulation of the cut surface of the wafer after cutting was measured by a surface roughness meter. When the measurement length was 60 mm, the waviness was 5 μm or less, ○, 6 to 10 μm was Δ, and 11 μm or more was ×.

Regarding the warpage deformation, the undulation before and after the processing was measured by a surface roughness meter, and the difference between the undulation before and after the processing was evaluated as the warpage deformation. Here, the warpage deformation amount is 50μ.
m if within 50 m, Δ if from 51 to 100 μm, 101
If it was more than μm, it was evaluated as ×.

The results are shown in Tables 1 to 4.

From Table 1, it can be seen that the content of the phenol resin is 20%.
When the volume% or less (No. 1), the shape of the heat-cured body after pressure molding at room temperature could not be maintained. On the other hand, when the content of the phenolic resin was 70% by volume or more (Nos. 6 and 7), the shape could not be maintained during heat curing, so that it was not practical.

Further, when a ferrite material, a carbon material, and a bakelite material, which are comparative examples of alumina, are used as the thermosetting resin, the ferrite material has high hardness and good results in workability, chipping occurrence rate and dressing property. No longer. With the carbon material, good results were not obtained in the dressing property of the cutting wheel and carbon contamination. In the case of the bakelite material, good results were not obtained because of the large warp deformation.

On the other hand, when the content of the phenol resin was in the range of 30 to 60% by volume (Nos. 2 to 5), good results were obtained in all the evaluations.

Next, with regard to the deflection temperature under load, those having a phenolic resin content in the range of 30 to 60% by volume all had high values of 200 ° C. or more.

According to Table 2, when the content ratio of phenol resin and alumina was kept constant, the average particle size of alumina exceeded 40 μm (No. 12, 16, 17), and the workability and straightness were poor. Decrease, the surface of the heat-cured body becomes rough,
The appearance or surface properties were found to be poor.

When the aspect ratio is higher than 80 (Nos. 13 to 15), the uniform dispersibility of alumina as a filler is deteriorated, and almost all of the moldability, shape retention after heat treatment, cutting workability, etc. Evaluation dropped.

Further, the Vickers hardness increased with the increase in the average particle size. When the average particle size exceeded 40 μm, the value increased to 610 MPa or more, and the chipping rate increased. On the other hand, Vickers hardness is 5
100 MPa or less (Nos. 8 to 11, 13 to 15)
And excellent workability.

According to Table 3, the occupancy of the pores was 0% (No. 1).
With 5), the workability was reduced. This is because the area around the cutting water became poor and the removal of cutting chips was insufficient. In addition, the occupancy of pores exceeds 30% (No.19)
, Workability was reduced, and the chipping occurrence rate was increased.
This is because the strength of the cutting jig was reduced. Therefore,
It is preferable that the porosity is 3 to 30%. According to Table 4, even when the filler was changed from alumina to silica, the same result as in the case of alumina was obtained.

[0060]

[Table 1]

[0061]

[Table 2]

[0062]

[Table 3]

[0063]

[Table 4]

[0064]

As described above, according to the present invention, 30 to 6
By constituting the cutting jig with a resin composite comprising 0% by volume of a thermosetting resin and a balance of filler having an average particle diameter of 40 μm or less, the cutting jig has a dressing effect on a cutting grindstone,
A cutting jig capable of performing stable cutting without causing clogging of the cutting grindstone can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a cutting method using a cutting jig of the present invention.

FIG. 2 is a schematic view illustrating a method for manufacturing a cutting jig according to the present invention.

FIG. 3 is a schematic sectional view of a resin composite constituting a cutting jig of the present invention.

FIG. 4 is a schematic view showing a conventional wafer substrate cutting method.

[Explanation of symbols]

 1: Table 2: Cutting jig 3: Wafer substrate 4: Cutting whetstone 5: Dressing whetstone 11: Upper punch 12: Us 13: Lower punch 14: Molded body 15: Oven 16: Thermosetting resin 17: Pores 18: Filler

Claims (5)

[Claims] 1. A cutting jig comprising a resin composite comprising 30 to 60% by volume of a thermosetting resin and a balance of filler having an average particle diameter of 40 μm or less. 2. The cutting jig according to claim 1, wherein the filler has an aspect ratio of 80 or less. 3. The resin composite has a Vickers hardness of 500.
The cutting jig according to claim 1, wherein the cutting jig is equal to or less than MPa. 4. The deflection temperature under load of the resin composite is 200.
2. The cutting jig according to claim 1, wherein the temperature is not lower than C. 5. The method according to claim 1, wherein the resin composite has pores.
The cutting jig according to claim 1, wherein the pore occupancy is in a range of 3 to 30%.