JP2001035906A - Apparatus and method for holding substrate and aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an apparatus and a method for holding a substrate which has a simple structure and needs no complicated control for eliminating the warp of a photosensitive substrate. SOLUTION: A substrate holding apparatus for holding a photosensitive substrate P at a specified position on a substrate holding surface F comprises a first evacuating part 20 composed of a bellows 22 movable in the surface direction of the substrate holding surface F. The photosensitive substrate P is evacuated by the first evacuating part 20 and left for a time in this condition and as the result the warp of the substrate P is eliminated, without releasing the substrate P from the substrate holding surface F.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a projection exposure apparatus for transferring and exposing a pattern image of a mask onto a photosensitive substrate, and more particularly to a substrate holding apparatus for holding a photosensitive substrate, a substrate holding method, and an exposure apparatus. is there.

[0002]

2. Description of the Related Art As display elements for personal computers and televisions,
2. Description of the Related Art Liquid crystal display substrates that can be made thinner have been frequently used. The liquid crystal display substrate is manufactured by patterning a transparent thin-film electrode into a desired shape by a photolithography method on a photosensitive substrate such as a glass plate having a rectangular shape in a plan view. As an apparatus for performing the photolithography, a projection exposure apparatus that transfers and exposes an exposure pattern formed on a mask to a photoresist layer on a photosensitive substrate via a projection optical system is used.

[0003] In the above-described exposure apparatus, a substrate holding device for fixing a photosensitive substrate during exposure processing is employed. FIG. 10 shows the structure of a conventional substrate holding device. This substrate holding apparatus is used in an exposure apparatus that performs an exposure process in a state in which a photosensitive substrate P is vertically arranged in order to prevent a problem caused by an increase in the size of the substrate, for example, bending or warping of the photosensitive substrate due to its own weight. The substrate holding surface F for holding the photosensitive substrate P is formed vertically.

The substrate holding surface F is provided with a plurality of suction portions 1 for sucking the photosensitive substrate P. The suction unit 1 includes an opening 2 provided on the substrate holding surface F, an opening 2 and a pipe 3.
A vacuum source 4 connected through the pipe 3, a pressure sensor 5 provided in the middle of the pipe 3 and detecting the pressure in the pipe 3 leading to the opening 1, and an opening 2 also provided in the middle of the pipe 3 and the vacuum source. And a solenoid valve 6 for interrupting the communication with the electromagnetic valve 4.

In the above-described substrate holding apparatus, when the photosensitive substrate P is carried into the exposure apparatus by a robot arm (not shown), the electromagnetic valve 6 is opened, vacuum suction is started from the opening 1, and the substrate holding surface F The photosensitive substrate P is adsorbed thereon.

Incidentally, the photosensitive substrate attracted to the substrate holding surface as described above often undergoes deformation such as expansion and contraction and warpage in the surface direction due to a temperature difference between the inside and outside of the exposure apparatus. Precisely, when the photosensitive substrate is carried into the exposure apparatus, it deforms in the process of shifting the temperature of the photosensitive substrate to the temperature inside the exposure apparatus, but the substrate is held before the temperature of the photosensitive substrate becomes uniform throughout. If it is sucked on the surface, it is fixed to the substrate holding surface in a state where the deformation is not eliminated.

[0007] In order to prevent such deformation of the photosensitive substrate, it is desirable to allow a sufficient time from the loading of the photosensitive substrate to the suction thereof. However, in an exposure apparatus that requires an improvement in processing speed, such a measure must be taken. It is almost impossible to take. Therefore, conventionally, the deformation is corrected by controlling the mask driving system and the substrate driving system so that the mask is adjusted to the deformation of the photosensitive substrate.

However, depending on how the photosensitive substrate is deformed, it may not be possible to correct the deformation by controlling the mask driving system or the substrate driving system as described above. Therefore, when the adsorbed photosensitive substrate is deformed as described above, a process is performed in which the adsorption by the adsorbing section is temporarily released and the process waits until the temperature of the photosensitive substrate becomes uniform throughout.

In this process, a replacement robot arm is provided separately from the loading robot arm, and only when the deformation of the photosensitive substrate is detected, the replacement robot arm is operated to hold the photosensitive substrate. The photosensitive substrate is once detached from the surface, and is re-mounted on the substrate holding surface after the deformation of the photosensitive substrate is eliminated.

[0010]

When the replacement robot arm is provided as described above, the replacement of the robot arm with that for carrying in the robot arm is required.
One robot arm must be controlled, and the control circuit is inevitably complicated. It is very necessary to control the removal of the photosensitive substrate from the original position exactly to the original position, which requires a very high level of control. Because.

Further, since an extra robot arm for replacement is required, there arise problems such as an increase in the size of the apparatus, an increase in manufacturing cost, and a complicated maintenance.

The present invention has been made in view of the above circumstances, and a substrate holding apparatus, a substrate holding method, and an exposure apparatus which have a simple structure and do not require complicated control in eliminating deformation of a photosensitive substrate. It is intended to provide.

[0013]

The structure of a substrate holding device employed as a means for solving the above problems will be described with reference to FIG. 2. The substrate holding device according to the present invention comprises a substrate (P). A substrate holding device for holding a substrate at a predetermined position on a substrate holding surface (F), wherein the substrate is moved in the surface direction of the substrate holding surface (F) while the substrate (P) is attracted to a predetermined position on the substrate holding surface (F). A possible suction part (20).

In this substrate holding device, the substrate (P)
Since the suction unit (20) can move even in a state in which is sucked,
After a while in a state where the substrate (P) is adsorbed, the deformation is eliminated without separating the substrate (P) from the substrate holding surface (F). Accordingly, it is not necessary to provide a replacement robot arm that requires complicated control, and the configuration of the apparatus can be simplified.

Further, the substrate holding method adopted as a means for solving the above-mentioned problem is a method for holding the first suction portion (20) movable in the surface direction of the substrate (P) while holding the substrate (P). ) And a second suction part (30) for sucking the substrate (P) at a fixed position, wherein the second suction part (30) sucks the substrate (P) only by the first suction part (20). One step and a second step of adsorbing the substrate (P) again by the second adsorption section (30) after a predetermined time has elapsed from the adsorption of the substrate by the first adsorption section (20). It is.

In this substrate holding method, the substrate (P)
Is absorbed by only the first suction unit (20) to eliminate the deformation, and after the deformation is eliminated, is sucked onto the substrate holding surface (F) by the second suction unit (30), whereby complicated control is performed. , And the substrate (P) can be deformed and fixed at a predetermined position.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a substrate holding apparatus, a substrate holding method and an exposure apparatus according to the present invention will be described with reference to FIGS. FIG. 1 shows a multi-lens type scanning exposure apparatus provided with a substrate holding apparatus according to the present invention. The scanning type exposure apparatus includes a plurality of illumination optical systems 11A to 11E for illuminating a pattern formed on a mask M in illumination regions m1 to m5 having a predetermined shape, a mask stage 12 on which the mask M is mounted, and an illumination optical system. 11A ~
A plurality of projection optical systems 13A to 13E for irradiating each of the light beams emitted from 11E and passing through the mask M to the projection areas p1 to p5 on the photosensitive substrate P to form a pattern image of the illumination areas m1 to m5; It mainly includes a substrate stage 14 on which the photosensitive substrate P is mounted, and positioning systems (position detection systems) 15A and 15B for performing positioning between the mask M and the photosensitive substrate P.

Illumination optical systems 11A to 11E, projection optical system 1
3A to 13E and the reflecting mirrors 16A to 16E for refracting the light beams emitted from the illumination optical systems 11A to 11E are all fixed to a stand (not shown). The mask stage 12 and the substrate stage 14 are fixed to a carriage 17 supported reciprocally in the scanning direction with respect to the gantry, and the driving device (not shown) drives the carriage 17 in the scanning direction, so that the mask The pattern image of M is transferred and exposed on the photosensitive substrate P.

The mask stage 12 has a function of displacing the mounted mask M around the X, Y and Z axes. Further, the substrate stage 14 has a function of displacing the photosensitive substrate P in the Z direction and around the X and Y axes in order to correct the deformation of the photosensitive substrate P and make the pattern image of the mask M coincide with the image forming plane. I have.

A reflecting mirror 12a is provided on an edge of the mask stage 12 in the Y direction, and a laser interferometer 18a is disposed at a position facing the reflecting mirror 12a. A polarization beam splitter 12b, a λ / 4 plate 12c for changing the wavelength of the laser beam passing through the polarization beam splitter 12b, and a reference mirror 1
2d and a corner cube 12e are installed, a laser interferometer 18b is arranged at a position facing the reference mirror 12d, and a long mirror 18c is arranged at a position facing the corner cube 12e. And each laser interferometer 1
The movement distance of the mask stage 12 in the X direction and the displacement of the mask stage 12 in the Y direction during scanning are detected by 8a and 18b. The laser interferometers 18a and 18b and the long mirror 18c are all fixed to a mount.

A reflecting mirror 14a is provided on the edge of the substrate stage 14 in the Y direction, and a laser interferometer 19a is disposed at a position facing the reflecting mirror 14a. Further, a polarization beam splitter 14b, a λ / 4 plate 14c for changing the wavelength of the laser beam passing through the polarization beam splitter 14b, and a reference mirror 14d are provided on the edge of the substrate stage 14 in the X direction.
And a corner cube 14e, a laser interferometer 19b is arranged at a position facing the reference mirror 14d, and a long mirror 1 is located at a position facing the corner cube 14e.
9c is arranged. And each laser interferometer 19
The movement distance of the substrate stage 14 in the X direction and the displacement of the substrate stage 14 in the Y direction during scanning are detected by a and 19b. The laser interferometer 19
a, 19b and the long mirror 19c are all fixed to the gantry.

The alignment systems 15A and 15B are provided with a mask M
The first alignment mark R1 formed in
The second alignment mark R2 formed on the photosensitive substrate P corresponding to the alignment mark R1 is photographed and image-processed to align the mask M with the photosensitive substrate P. Further, in the alignment systems 15A and 15B, the deformation state of the photosensitive substrate P can be detected from the deviation between the first alignment mark R1 and the second alignment mark R2 at the stage of image processing.

As shown in FIG. 2, a first suction portion 20 and a second suction portion 3 for sucking the photosensitive substrate P are provided on the substrate holding surface F on the substrate stage 14 for holding the photosensitive substrate P.
A plurality of reference numerals 0 are arranged in accordance with the shape of the photosensitive substrate P to constitute a substrate holding device.

The first suction portion 20 is provided with a play inside a large-diameter circular opening 21 provided at a fixed position on the substrate holding surface F, and is provided with a suction at the tip from the substrate holding surface F. A bellows (cylindrical body) 22 having a hole 22a protruding therefrom is connected to a vacuum source 24 through a pipe 23. Further, in the middle of the pipe 23, a pipe 2 leading to the bellows 22 is provided.
3, a pressure sensor 25 for detecting the pressure in the
And a solenoid valve 26 for intermittently communicating with the vacuum source 24.

The bellows 22 is a bellows-like and elastic rubber tubular body.
Is bent freely in the surface direction of the substrate holding surface F inside the circular opening 21 and the bellows 22 expands and contracts in the length direction, so that the photosensitive substrate P sucked by the suction holes 22a is moved to the substrate holding surface F. And the thickness of the photosensitive substrate P in such a manner as to be movable.

The second suction section 30 comprises an opening 31 provided at a fixed position on the substrate holding surface F, and is connected to a vacuum source 24 through a pipe 33. Further, in the middle of the pipe 33, a pressure sensor 35 for detecting a pressure in the pipe 33 communicating with the opening 31 and an electromagnetic valve 36 for interrupting the communication between the vacuum source 24 and the opening 31 are provided. P is attracted to the opening 31 and held at a fixed position on the substrate holding surface F.

Below the substrate holding surface F, a plurality of support pins 40 for supporting the vertically arranged photosensitive substrate P below are provided on the substrate holding surface F at a distance from each other. Further, the exposure apparatus is provided with a contour inspection apparatus for measuring the shape of the photosensitive substrate P sucked on the substrate holding surface F.

In the substrate holding apparatus configured as described above, the sequence of attracting the photosensitive substrate P to the substrate holding surface F,
A re-suction sequence performed when the photosensitive substrate P is deformed will be described with reference to FIGS. [Suction sequence] Loading robot arm (not shown)
The photosensitive substrate P carried into the exposure apparatus is placed at a predetermined position on the substrate holding surface F. Subsequently, as shown in FIG. 3, the electromagnetic valve 36 is opened to open the opening 31 and the vacuum source 2.
4 communicate with each other, a negative pressure is generated in the opening 31 and the photosensitive substrate P is sucked. When the photosensitive substrate P is adsorbed to the opening 31 without causing leakage and the detection value of the pressure sensor 35 decreases, and the pressure inside the opening 31 reaches a pressure sufficient to maintain the suction state, the second suction unit 30 It is confirmed that the photosensitive substrate P has been sufficiently absorbed.

At this time, the bellows 22 is attached to the suction hole 2 at the tip.
The photosensitive substrate 2a is pressed against the photosensitive substrate 2a and pushed into the circular opening 21. During this time, the solenoid valve 26 is closed and the first suction unit 20 is not operated at all.

[Re-adsorption sequence] Thereafter, the marks provided on the photosensitive substrate P by using the alignment systems 15A and 15B for the photosensitive substrate P sucked on the substrate holding surface F by the second suction portion 30. And the position of the circuit pattern are measured at a plurality of points to detect the presence or absence of deformation based on the amount of deviation of the mark or circuit pattern from the ideal position (determination step). Then, when deformation such as expansion and contraction or warpage that cannot be corrected even by the displacement function of the mask stage 12 or the substrate stage 14 is detected, first, as shown in FIG. The vacuum source 24 is in communication with the vacuum source 24, and a negative pressure is generated in the bellows 22, so that the photosensitive substrate P is attracted. When the photosensitive substrate P is adsorbed to the bellows 22 without causing leakage, the detection value of the pressure sensor 25 decreases, and when the pressure inside the bellows 22 reaches a pressure sufficient to maintain the adsorbed state, the photosensitive element P It is confirmed that the substrate P has been sufficiently absorbed.

When the suction by the first suction unit 20 is confirmed, the solenoid valve 36 is closed and the opening 3 is closed as shown in FIG.
1 is opened to the atmosphere, and the adsorption state of the photosensitive substrate P by the second adsorption section 30 is released (first step). As a result, the photosensitive substrate P is in a state of being sucked on the substrate holding surface F by only the first suction unit 20. In this state, the photosensitive substrate P is allowed to be bent by the bellows 22 and can be freely deformed in the surface direction of the substrate holding surface F (actually, the deformation is canceled and returns to the original shape). In FIG. 5, the photosensitive substrate P is illustrated as being separated from the substrate holding surface F. However, the photosensitive substrate P is not actually separated from the substrate holding surface F in order to easily understand the attracted state of the photosensitive substrate P. .

After the predetermined time has elapsed and the deformation of the photosensitive substrate P has been eliminated, the solenoid valve 36 is opened and the opening is opened as shown in FIG. 5 while the suction state of the first suction section 20 is maintained. The photosensitive substrate P is adsorbed to the second suction portion 31 again.
Then, the photosensitive substrate P is adsorbed by 0 (second step).

When the photosensitive substrate P is attracted to the second attracting portion 30, the solenoid valve 26 is closed and the bellows 22 is opened to the atmosphere as shown in FIG. The adsorption state of P is released. As a result, the photosensitive substrate P returns to the initial state in which the photosensitive substrate P is attracted to the substrate holding surface F by only the second suction unit 30.

According to the substrate holding device configured as described above, the first suction portion 20 that can move in the surface direction of the substrate holding surface F while the photosensitive substrate P is suctioned is provided.
After a while in the state where the photosensitive substrate P is sucked, the deformation can be eliminated without separating from the substrate holding surface F. Further, a second suction unit 30 for sucking the photosensitive substrate P at a fixed position is provided, and the first suction unit 20 and the second suction unit 30 are operated in cooperation with each other, so that the photosensitive substrate P
Can be eliminated and fixed at a predetermined position. Thus, it is possible to simplify the configuration of the apparatus and solve problems such as an increase in the size of the apparatus, a rise in manufacturing costs, and a complicated maintenance.

In addition, since the bellows-like and expandable bellows 22 is used for the first suction portion 20, even if the photosensitive substrate P is warped due to the warp and a gap is formed between the photosensitive substrate P and the substrate holding surface F, the bellows 22 is provided. Therefore, the photosensitive substrate P can be held movably in the surface direction and in the thickness direction of the photosensitive substrate P without being separated from the substrate holding surface F.

Further, the first suction unit 20 is connected to the photosensitive substrate P
Of the photosensitive substrate P
Can be held more reliably and the deformation can be sufficiently eliminated.

In addition, after the end of the suction sequence, the deformation of the photosensitive substrate P is detected, and it is determined whether or not the re-adsorption sequence is performed based on the detection result. Alternatively, when a deformation that can be corrected occurs in a later step, the productivity of the exposure processing can be improved by not having to perform the re-adsorption sequence.

It should be noted that the first suction section 20 is provided with a bellows 22
The present invention is not limited to this, and may be a simple elastically deformable cylindrical body (rubber tube or the like) or a structure as shown in FIG. The first suction portion 20 ′ shown in the figure is a cylindrical member having one end exposed from the opening 41 by being inserted into the opening 41 provided on the substrate holding surface F with play, instead of the bellows. 42 are provided. The tubular member 42 is integrally provided with a guide portion 43 projecting in the surface direction of the substrate holding surface F. The guide member 43 guides the cylindrical member 42 freely in the surface direction of the substrate holding surface F. It has become so.
The first suction unit 20 ′ having such a structure allows the photosensitive substrate P to be deformed in the surface direction, so that the photosensitive substrate P is movably held in the surface direction without being separated from the substrate holding surface F. It will be possible to keep.

In the present embodiment, the substrate holding apparatus employed in the exposure apparatus for performing the exposure processing with the photosensitive substrate P arranged vertically is described as an example, but the substrate holding apparatus according to the present invention is described. The substrate holding method can be applied to an exposure apparatus that performs exposure processing by arranging a photosensitive substrate horizontally regardless of how the photosensitive substrate is arranged.

Next, a second embodiment of the substrate holding apparatus and the substrate holding method according to the present invention will be described with reference to FIG. Note that components already described in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the substrate holding device shown in FIG. 9, the first suction unit 20a is connected to the common vacuum source 24.
To 20c are connected via individually provided electromagnetic valves 26a to 26c, and the second suction portions 30a to 30d are connected via individually provided electromagnetic valves 36a to 36d. Thus, the first suction units 20a to 20c and the second suction units 30a to 30d provided on the substrate holding surface F can be operated individually and independently.

In the substrate holding apparatus configured as described above, the sequence of attracting the photosensitive substrate P to the substrate holding surface F,
A re-suction sequence executed when the photosensitive substrate P is warped will be described. [Suction sequence] When the photosensitive substrate P carried into the exposure apparatus is placed at a predetermined position on the substrate holding surface F, the electromagnetic valves 36a to 36d are opened at the same time, and the photosensitive substrate P is The photosensitive substrate P is attracted by the second attracting portions 30a to 30d. At this time, the first suction units 20a to 20c are not operated at all.

[Re-adsorption sequence] Thereafter, the photosensitive substrate P is adsorbed on the substrate holding surface F by the second adsorption units 30a to 30d, and the positioning system 1 is used as described above.
The presence or absence of deformation of the photosensitive substrate P is detected by measuring the positions of marks and circuit patterns provided on the photosensitive substrate P using 5A and 15B. Then, when deformation such as warpage is detected in the photosensitive substrate P, first, the alignment system 15
From the detection results of A and 15B, for example, the electromagnetic valve 26 of the first suction unit 20b located at the position where the photosensitive substrate P is least deformed.
b is opened, the photosensitive substrate P is sucked by the first suction unit 20b, and then the electromagnetic valve 26a of the first suction unit 20a, which is located at the second least deformed position of the photosensitive substrate P, is opened to open the second position. The photosensitive substrate P is suctioned by the first suction portion 20a. As described above, the photosensitive substrates P are suctioned by the first suction units 20a to 20c by sequentially operating the suction units with a time lag from the position where the deformation of the photosensitive substrate P is small. Note that when the first suction units 20a and 20b are sucked, the photosensitive substrate P is already held on the substrate holding surface F, so that the suction may be performed simultaneously.

When the photosensitive substrate P is sucked by the first suction portions 20a to 20c, the solenoid valves 36a to 36d are closed, the openings 31 are opened to the atmosphere, and the second suction portion 3 is opened.
The adsorption state of the photosensitive substrate P by 0a to 30d is released. As a result, the photosensitive substrate P is held in the first suction portions 20a to 20a.
Only the pressure 0c causes the substrate to be attracted to the substrate holding surface F, and can be freely moved in the surface direction of the substrate holding surface F and the thickness direction of the photosensitive substrate P, so that the warpage is eliminated and the shape returns to its original shape.

After the predetermined time has elapsed and the warpage of the photosensitive substrate P has been eliminated, the solenoid valves 36a to 36d are opened and the opening portions 31 are opened while the suction state of the first suction portions 20a to 20c is maintained. The photosensitive substrate P is sucked. At this time, as for the second suction units 30a to 30d, the electromagnetic valves 36 of the second suction units 30b and 30c located at the center of the photosensitive substrate P are used.
b, 36c are opened, the photosensitive substrate P is attracted by the second attracting portions 30b, 30c, and subsequently, the electromagnetic valves 36a, 36d of the second attracting portions 30a, 30d located at the peripheral edge of the photosensitive substrate.
36d is opened, and the photosensitive substrate P is suctioned by the second suction portions 30a, 30d. As described above, from the second suction portions 30b and 30c located at the center of the photosensitive substrate P to the second suction portions 30a and 30d located at the peripheral edge of the photosensitive substrate P, the suction portions sequentially operate with a time lag. Thus, the photosensitive substrate P is suctioned by the second suction portions 30a to 30d.

When the photosensitive substrate P is adsorbed by the second adsorbing portions 30a to 30d, the solenoid valves 26a to 26c are closed all at once and the inside of the bellows 22 is opened to the atmosphere. The adsorption state of the photosensitive substrate P is released. As a result, the photosensitive substrate P is moved to the second suction portion 30a.
It returns to the initial state where it is attracted to the substrate holding surface F by only 〜30d.

According to the substrate holding device configured as described above, the plurality of first suction portions 20a to 20c are individually operated with a time lag according to the deformation state of the photosensitive substrate P, thereby enabling the deformation. Can be held in a state with a high degree of freedom so that the deformation of the photosensitive substrate P can be performed more reliably and sufficiently.

Further, a plurality of suction portions (20a to 20c, 3
0a to 30d) can operate independently of each other, so that there is no decrease in the attraction force to another attraction portion due to leakage at one attraction portion, and the leakage occurs as the photosensitive substrate P moves along the substrate holding surface F. It becomes possible to adsorb even in the adsorbing section that is in the state, and the entire surface can be brought into a state of being adsorbed.

In the suction sequence, the suction section may be sequentially operated from a predetermined portion of the photosensitive substrate P. For example, the suction operation may be performed from the suction portion at the center of the substrate to the suction portion around the substrate, or the suction operation may be sequentially performed from the lower suction portion to the upper suction portion near the support pin 40. At this time, one of the second suction portions 30a to 30d (for example, 30d) may be determined as a reference, and the deformation of the substrate may be eliminated based on this.

In the suction sequence of the present embodiment, the electromagnetic valves 26 and 36 of FIG. 2 are opened and the first suction unit is opened in order to suction the photosensitive substrate P arranged on the substrate holding surface F by the loading robot arm. After the photosensitive substrate P is sucked by the second suction unit 20 and the second suction unit 30, the electromagnetic valve 26 is closed after reaching a pressure sufficient for the suction from the detection value of the pressure sensor 35, and the light is exposed only by the second suction units 20 a to 20 c. The substrate P may be held. Similarly, in the case of FIG.
-20c, 30a-30d), the electromagnetic valves 26a-26c are closed, and the second suction unit 30 is closed.
a to 30d. Also, the first suction unit 20
a to 20c, the second suction units 30a to 30d
May be operated to stop the operation of the first suction units 20a to 20c after the suction operation by these is completed. Thus, the first suction unit 20a in the suction sequence
~ 20c can be used as an auxiliary.

The arrangement and the number of the first and second suction portions shown in the present embodiment are simplified for easy understanding of the description.
Needless to say, the arrangement and the number thereof are changed depending on the size and the like.

In the first and second embodiments, the deformation of the photosensitive substrate P is detected by the positioning systems 15A and 15B. However, the deformation may be detected by, for example, a contour inspection device. Further, although FIG. 1 shows the mask stage 12 and the substrate stage 14 fixed to the carriage 17, the present invention is not limited to this, and the mask stage 12 and the substrate stage 14 may be driven by independent driving units.

[0052]

As described above, according to the substrate holding apparatus of the first aspect of the present invention, the suction portion can be moved even in the state of sucking the substrate, so that it takes a while for a while in the state of sucking the substrate. For example, the deformation is eliminated without separating the substrate from the substrate holding surface. Accordingly, it is not necessary to provide a replacement robot arm that requires complicated control, and problems such as an increase in the size of the apparatus, an increase in manufacturing cost, and a complicated maintenance can be solved at once.

According to the second aspect of the present invention, since the suction portion is made of a cylindrical body that can be elastically deformed, the movement of the substrate is absorbed by the bending of the cylindrical body, so that the suction state is ensured. In addition, the substrate can be held so as to be movable in the surface direction without being separated from the substrate holding surface.

According to the third aspect of the present invention, since the bellows is employed as the elastically deformable cylindrical body, a gap is formed between the substrate and the substrate holding surface as in the case where the substrate is warped. Even if it is open, the suction state is ensured by the expansion and contraction of the bellows, so that the substrate can be movably held in the surface direction and the thickness direction of the substrate without being detached from the substrate holding surface.

According to the fourth aspect of the present invention, since the movement of the substrate is absorbed by the movement of the tubular member and the suction state is secured, the substrate is moved in the plane direction without detaching from the substrate holding surface. It is possible to keep it as possible.

According to the substrate holding apparatus of the fifth aspect, the second suction section for sucking the photosensitive substrate at the fixed position is provided,
By operating the suction unit and the second suction unit in cooperation with each other, it is possible to eliminate the deformation of the photosensitive substrate and fix the substrate at a predetermined position.

According to the substrate holding device of the present invention, a plurality of suction portions are arranged corresponding to the shape of the substrate.
The substrate can be held in a state with a high degree of freedom so that the deformation can be sufficiently eliminated and the deformation can be sufficiently eliminated.

According to the substrate holding method of the present invention, the substrate is sucked only by the first suction portion to eliminate the deformation, and after the deformation is eliminated, the substrate is held on the substrate holding surface by the second suction portion. Thus, the deformation of the photosensitive substrate and the fixing to the predetermined position can be performed without requiring complicated control.

According to the substrate holding method of the present invention, when the substrate is not deformed or when a deformation that can be corrected is caused in a later step, the substrate does not need to be deformed. Thereby, the productivity of the exposure processing can be improved.

According to the substrate holding method of the ninth aspect, the plurality of first suction portions are individually operated with a time difference according to the deformation state of the substrate, so that the deformed substrate can be more easily removed. It is possible to keep the state with a high degree of freedom so that the deformation can be sufficiently eliminated without fail.

According to the exposure apparatus of the tenth aspect, the deformation of the substrate adsorbed on the substrate holding device is measured, and even if there is a deformation, the adsorbing portion can be moved, so that the deformation is eliminated without detaching the substrate. Exposure can be performed after confirming that the substrate is not deformed.

[Brief description of the drawings]

FIG. 1 is a view showing a first embodiment of a substrate holding device according to the present invention, and is a perspective view of a scanning type exposure apparatus including the substrate holding device.

FIG. 2 is a schematic configuration diagram of a substrate holding device provided on the substrate stage shown in FIG.

FIG. 3 is a state explanatory diagram for explaining a suction sequence of a photosensitive substrate by the substrate holding device shown in FIG. 2;

FIG. 4 is a state explanatory diagram for explaining a sequence of reattaching the photosensitive substrate by the substrate holding device shown in FIG. 1;

FIG. 5 is also a state explanatory diagram for explaining a sequence of re-adsorbing the photosensitive substrate by the substrate holding device.

FIG. 6 is also a state explanatory diagram for explaining a sequence of re-adsorbing the photosensitive substrate by the substrate holding device.

FIG. 7 is also a state explanatory diagram for explaining a sequence of re-adsorbing the photosensitive substrate by the substrate holding device.

FIG. 8 is a sectional view showing an example of the structure of the first suction unit other than that shown in FIG.

FIG. 9 is a schematic configuration diagram showing a second embodiment of the substrate holding device according to the present invention.

FIG. 10 is a schematic configuration diagram illustrating an example of a conventional substrate holding device.

[Explanation of symbols]

 Reference Signs List 20 first suction unit 22 bellows (cylindrical body) 24 vacuum source 25 pressure sensor 26 solenoid valve 30 second suction unit 31 opening 35 pressure sensor 36 solenoid valve P photosensitive substrate F substrate holding surface

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H097 BA03 DB07 DB14 KA03 KA28 LA12 5F031 CA02 CA05 CA07 GA24 MA27 5F046 AA05 BA03 CD01 CD04 CD07

Claims (10)

[Claims] 1. A substrate holding device for holding a substrate at a predetermined position on a substrate holding surface, comprising: a suction portion movable in a surface direction of the substrate holding surface in a state where the substrate is sucked. Substrate holding device. 2. The substrate holding device according to claim 1, wherein the suction portion is a cylindrical body that can be elastically deformed. 3. The substrate holding device according to claim 2, wherein said tubular body is a bellows. 4. A cylindrical member for allowing the suction portion to be inserted into the opening provided on the substrate holding surface with play, exposing one end from the opening, and adsorbing the substrate to the one end. 2. The substrate holding device according to claim 1, further comprising: a guide portion projecting from the cylindrical member in a surface direction of the substrate holding surface to guide the cylindrical member. 5. The substrate holding apparatus according to claim 1, further comprising a second suction unit that sucks the substrate at a fixed position, different from the suction unit. 6. The substrate holding device according to claim 5, wherein a plurality of said suction portions are arranged corresponding to said substrate shape. 7. A substrate holding method using a first suction part movable in a surface direction of the substrate while holding the substrate, and a second suction part holding the substrate at a fixed position. A first step of adsorbing the substrate by at least the first adsorption section, and a step of adsorbing the substrate again by the second adsorption section after a lapse of a predetermined time from the adsorption of the substrate by the first adsorption section. A substrate holding method, comprising: two steps. 8. Before the first step, a deformation of the substrate is detected, and the first step and the second step are performed based on the detection result.
8. The substrate holding method according to claim 7, further comprising a determining step of determining whether to perform the step. 9. The method according to claim 7, wherein in the first step, a plurality of the first suction portions are individually operated with a time difference according to a deformation state of the substrate.
Or the substrate holding method according to 8. 10. The substrate holding apparatus according to claim 1, 2, 3, 4, 5, or 6, an exposure section for exposing a substrate mounted on the substrate holding apparatus, and the substrate on the substrate holding apparatus. An exposure apparatus comprising: a position detection system that measures the position of the exposure light.