JP2001028406A - Semiconductor device, manufacture thereof and manufacturing device thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate taking correspondence of vast data on the conditions of the manufacture by semiconductor device and the like with each semiconductor device and to enable rapid collection of information for quality assurance of each semiconductor device and the enhancement of the quality of each semiconductor device. SOLUTION: Data on a preceding process manufacture data base 102 and a preceding process evaluation data base 103 on a semiconductor chip are written in the surface of the chip by a laser 104, and these data written in the surface of the chip are read by a CCD unit 106 and are preserved in a data- preserving data base 107. The data base 107 and moreover, data on a post- process manufacture data base 109 and a post-process evaluation data base 110 are written in the package of a semiconductor device in the post process by a laser 112. Hereby, the corresponding of the data with the chip or the device can be taken easily and when an analysis of a defective or the like are needed, the data necessary for the analysis can be obtained rapidly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, a method for manufacturing the same, and an apparatus for manufacturing the same, and more particularly, to the recording of data such as manufacturing conditions and evaluation results for quality assurance and failure analysis and the like in a semiconductor manufacturing process. The present invention relates to a semiconductor device for reading, a method of manufacturing the same, and a manufacturing apparatus thereof.

[0002]

2. Description of the Related Art In a process of manufacturing a semiconductor device, an evaluation in a process before packaging a semiconductor chip is performed using a tester. Then, marking is performed on the surface of the defective semiconductor chip with ink in order to discriminate between a non-defective product and a defective product. In this way, a defective semiconductor chip is prevented from proceeding to the next bonding step.

After marking defective products,
Each chip is separated from the wafer, and only good chips are mounted on a lead frame and bonded. The pads on the chip and the inner leads of the lead frame are wire-bonded to perform packaging.

[0004]

However, the conventional semiconductor device manufacturing process has the following problems. As shown in FIG. 8, defective semiconductor chips 2 can be identified by forming ink marks 3 on the surface of the semiconductor chips 2 before cutting from the semiconductor wafer 1.

However, information required for analyzing the cause of a defect, such as a manufacturing apparatus used for manufacturing a defective product, manufacturing conditions, and evaluation results, is stored in a computer database or on recording paper. And the amount of information was enormous.

[0006] Therefore, the work and search time required to match the individual semiconductor device which has become defective with information necessary for failure analysis of the semiconductor device are enormous. Further, in a site where manufacturing and quality control are performed, necessary data cannot be promptly prepared when necessary, and prompt response cannot be performed.

Conventionally, a memory circuit is provided inside a chip, and information such as manufacturing conditions and evaluation results is written therein. However, this technique requires an electrical connection between the memory circuit and an external access device in order to read and write information.

Further, when a memory circuit is provided inside a chip, the chip area increases. Therefore, there is also a problem in such a method of providing a memory circuit inside a chip.

Further, information such as individual manufacturing conditions and evaluation results of a non-defective semiconductor device is extremely enormous, and it is difficult to save all of the information.

As described above, it has been difficult to completely store information such as a large number of manufacturing conditions and evaluation results, and to match individual semiconductor devices with their data.

In particular, in a chip mounting process performed between a stage before packaging and a stage after packaging, when mounting individual chips, the order of each chip and the order of evaluation data become different. It has been very difficult to match the evaluation data with the individual semiconductor devices.

In view of the above circumstances, the present invention makes it easy to match enormous data such as manufacturing conditions for each semiconductor device with each semiconductor device, and quickly collects information for quality assurance and quality improvement. It is an object of the present invention to provide a semiconductor device, a manufacturing method thereof, and a manufacturing device thereof, which can be performed and can contribute to improvement in yield.

[0013]

According to the present invention, there is provided a semiconductor device comprising:
A protective film for protecting the surface of the semiconductor chip, wherein data including at least the manufacturing conditions and the evaluation results of the semiconductor chip are written on the surface portion, the protective film, and an envelope for sealing the semiconductor chip. And the envelope in which data including at least manufacturing conditions and an evaluation result of the semiconductor chip is written on a surface portion.

In the method of manufacturing a semiconductor device according to the present invention, a step of evaluating a plurality of semiconductor chips and writing data including at least manufacturing conditions and evaluation results of each of the semiconductor chips on a surface of the corresponding semiconductor chip. Reading the data written on the surface of each of the semiconductor chips and storing the data in an external storage device; sealing the semiconductor chip with an envelope; Writing the corresponding data stored in the external storage device into the enclosure.

A semiconductor device manufacturing apparatus according to the present invention includes an evaluation apparatus for evaluating a plurality of semiconductor chips, and data including at least manufacturing conditions and evaluation results of each of the semiconductor chips on a surface of the corresponding semiconductor chip. The first to write
A data writing device, a data reading device that reads the data written on the surface of each of the semiconductor chips, an external storage device that receives and stores the data read by the data reading device, and the external storage device And a second data writing device common to or different from the first data writing device for writing the data stored by the first data writing device onto the surface of an envelope that seals the corresponding semiconductor chip.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

A semiconductor device according to an embodiment of the present invention includes a protective film 11 as shown in FIG. 3 and a package 13 as shown in FIG.

In a pre-packaging step, data such as manufacturing conditions and evaluation results of the semiconductor chip 2 described later are written as a bar code 4 on the surface of the protective film 11 for protecting the surface of the semiconductor chip 2. ing.
Further, in a process after the semiconductor chip 2 is mounted on a lead frame and subjected to wire bonding and packaging, a manufacturing condition and an evaluation result of the semiconductor chip 2 are further provided on a surface portion of the package 13. Data including the evaluation result is written in a bar code 14.

The semiconductor device manufacturing apparatus according to the present embodiment for manufacturing such a semiconductor device has a configuration as shown in FIG.

The control device 100 controls each device, which will be described later, included in the manufacturing apparatus.

The evaluation device 101 is used for evaluating the semiconductor chip 2 before performing packaging.

The external storage device 113 is a device for holding a database provided outside the semiconductor chip 2, and includes a pre-process manufacturing database 102, a pre-process evaluation database 103, a data storage database 107, a post-process manufacturing database 109, and a It has a process evaluation database 110.

The pre-process manufacturing database 102 stores data such as manufacturing apparatuses and manufacturing conditions used for manufacturing the semiconductor chips 2 in the pre-process.

The pre-process evaluation database 103 stores test programs and evaluation results necessary for evaluating each semiconductor chip 2 using the evaluation device 101.

The laser device 104 writes data stored in the pre-process evaluation database 103 on the protective film 11 of the semiconductor chip 2 using a laser beam.

The semiconductor element 105 has a semiconductor chip 2 mounted on a lead frame and wire-bonded.
Packaging is not yet done.

The CCD device 106 is a device for reading data written on the protective film 11 of the semiconductor chip 2.
The read data is stored in the data storage database 107.

The evaluation device 108 is used for a test in a post-process after packaging.

The post-process manufacturing database 109 stores data such as manufacturing device names and manufacturing conditions used for manufacturing when the semiconductor chip 2 is packaged.

The post-process evaluation database 110 stores a test program and an evaluation result necessary for evaluating a semiconductor chip in a post-process using the evaluation device 108.

The data storage database 107 includes a CCD
The data read by the device 106, that is, the preprocess manufacturing database 102, the preprocess evaluation database 103, the postprocess manufacturing database 109, and the postprocess evaluation database 11
0 data is given and stored.

The laser device 112 writes data stored in the data storage database 107 on the surface of the package 13 of the semiconductor device 15 using laser light.

Further, in the manufacturing method according to the present embodiment, a semiconductor device is manufactured according to the procedure shown in FIG. 2 using the above-described manufacturing apparatus.

In step S2, a circuit is formed on each semiconductor chip 2 that has not been cut from the semiconductor wafer 1. Here, data such as the names of manufacturing apparatuses and manufacturing conditions used for manufacturing are stored in the pre-process manufacturing database 102.

As step S 6, the evaluation of each semiconductor chip 2 in a stage before being cut from the semiconductor wafer 1 is performed using the evaluation device 101. This evaluation may be performed for each semiconductor chip 2 or may be performed simultaneously for a plurality of semiconductor chips. The evaluation device 101 evaluates the semiconductor chip 2 using a test program included in the pre-process evaluation database 103. The evaluation result is stored in the pre-process evaluation database 103.

Further, the wafer number 7 written on a part of the semiconductor wafer 1 shown in FIG.
Information about the semiconductor wafer coordinate origin 5 shown in
It is stored in the same pre-process evaluation database 103.

The chip position of each semiconductor chip 2 on the semiconductor wafer 1 can be specified from the semiconductor wafer coordinate origin 5 and the size of the semiconductor chip 2. Thereby, the semiconductor chip 2 and the measurement result can be matched.

Further, the information on the manufacturing conditions and the manufacturing apparatus of each semiconductor chip 2 can be specified by the wafer number 7.

The pre-process manufacturing database 10 such as the names of manufacturing apparatuses and manufacturing conditions used in the manufacturing process of step S2.
The data stored in the pre-process evaluation database 103 including the evaluation conditions and the evaluation results obtained in the evaluation process of step S6 and the test program are placed on the protective film of the semiconductor chip 2 using the laser device 104. Write in the form of code 4.

In step S12, the semiconductor chip 2 on which the barcode 4 has been written is placed on the island of the lead frame, and wire bonding is performed.

In step S14, the barcode 4 written on the protective film 11 of the semiconductor chip 2 is read.
As shown in FIG. 5, the semiconductor chip 2 is placed on the lower part 22 of the molding device, and the bar code 4 is read by the CCD device 106. The read data is stored in the data storage database 107.

In step S18, molding is performed using resin or the like so as to cover the surface of the semiconductor chip 2 as shown in FIG.

In step S20, as shown in FIG. 6, the data stored in the data storage database 111 on the surface of the package 13 using the laser device 112 is converted into the barcode 14 using the laser device 112. Write with

Thereafter, in step S22, burn-in processing for evaluating the life is performed, and the burn-in evaluation result 12
Get 1. This burn-in evaluation result 121 is obtained in step S
By the barcode writing process as 26, writing is performed on the surface of the package as in step S20.

In step S28, product evaluation is performed, and a product evaluation result 122 is obtained. This product evaluation result 122
The data is written on the surface of the package 13 by the barcode writing process in step S32.

Here, when the burn-in evaluation result 121 and the product evaluation result 122 are written, step S
Data storage database 107 written in 20
The additional writing is performed after the semiconductor device 15 and the data are matched using the data stored in the.

In step S34, a marking process is performed to complete the product. The product is shipped as step S36.

As described above, according to the semiconductor device, the method for manufacturing the same, and the apparatus for manufacturing the semiconductor device according to the present embodiment, in the step before packaging, the protective film 11 of the semiconductor chip 2 has the manufacturing conditions and the evaluation results. Barcode 4 data
In the post-process, similar data or data including manufacturing conditions and evaluation results in the post-process is recorded as a bar code 14 on the front surface such as the back surface of the package 13.

According to the present embodiment having such a configuration, the following operations and effects can be obtained.

(1) In the pre-packaging process, before the semiconductor chips 2 are cut from the semiconductor wafer 1, data such as manufacturing conditions and evaluation results for each semiconductor chip 2 are formed on the protective film 11 of the semiconductor chip 2. Can be read directly from the semiconductor chip 2 even after the semiconductor chip 2 is cut from the semiconductor wafer 1, so that the semiconductor chip 2 and the data can be extremely easily associated with each other. Therefore, as compared with the case where data is stored in a database or a recording sheet as in the related art, a search time for data is not required. Further, since a database for storing a huge amount of all data is not required, it can contribute to cost reduction.

(2) By recording data such as manufacturing conditions and evaluation results on the surface of the semiconductor chip, there is no need to provide a storage circuit inside the chip and store it. Therefore, electrical connection between the storage circuit and the external access device for search is unnecessary, and an increase in chip area can be prevented.

(3) Since information can be obtained in chip units, data management from lot units to chip units is possible.

(4) Since data such as manufacturing conditions and evaluation results are written on all semiconductor chips 2 including not only defective products but also non-defective products, necessary semiconductor chips 2
It is easy to obtain data in the previous process. That is, the time required to obtain the data necessary for elucidating the cause of the defect is reduced.

(5) By directly writing data to the semiconductor chip 2 in the preceding process and the semiconductor device 15 in the subsequent process, a database for storing evaluation data is not required, or the data capacity is small, so that cost is reduced. Reduced. That is, when a failure occurs in the semiconductor device 15,
Any information necessary for analyzing the cause of the failure of the device can be read from the device itself whenever necessary. Therefore, information collection for quality assurance and quality improvement becomes easy, and the yield improvement work becomes easy.

The above-described embodiment is merely an example, and does not limit the present invention. For example, data to be written on the surface of a semiconductor chip or the package surface of a semiconductor device is written as a bar code in a state where high-priority information such as a chip serial number or a key code is compressed when the data amount is enormous. May be.

Information that cannot be written on the chip surface or the package surface may be stored in a database of a computer in a state where the information is associated with a key code.

The writing device for writing data on the protective film of the semiconductor chip and the writing device for writing data on the package of the semiconductor device may be the same or different. However, when data is written by irradiating the protective film of the semiconductor chip with laser light, it is necessary to set the intensity of the laser light so as not to damage elements covered with the protective film.

Further, the data to be written to the semiconductor chip or the semiconductor device is not limited to a bar code, and a writing device other than a laser device may be used.

[0059]

As described above, according to the semiconductor device, the method of manufacturing the same, and the apparatus of the present invention, data such as manufacturing conditions are written on the surface of the semiconductor chip.
By writing the same data to the envelope that seals the semiconductor chip, the data can be easily associated with the semiconductor chip or the semiconductor device.
It is possible to quickly collect data when necessary, such as when analyzing the cause of a defect, and this can contribute to an improvement in yield.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of an apparatus for manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a flowchart showing a procedure of a process in the method for manufacturing a semiconductor device according to the embodiment;

FIG. 3 is an exemplary perspective view of the semiconductor chip showing a barcode written on the surface of the semiconductor chip according to the embodiment;

FIG. 4 is a perspective view of the semiconductor device showing a bar code written on the surface of the package of the semiconductor device according to the embodiment;

FIG. 5 is a plan view showing a step of reading a barcode on the surface of the protective film of the semiconductor chip using a barcode reader included in the semiconductor device manufacturing apparatus according to the embodiment.

FIG. 6 is a plan view showing a step of writing a barcode on a package surface on the semiconductor device using a laser device included in the semiconductor device manufacturing apparatus according to the embodiment.

FIG. 7 is a longitudinal sectional view showing a configuration of a molding apparatus included in the semiconductor device manufacturing apparatus according to the same embodiment.

FIG. 8 is a plan view showing an ink mark formed on the surface of a semiconductor chip in a conventional manufacturing method.

FIG. 9 is a plan view showing a barcode formed on the surface of a semiconductor chip in a method of manufacturing a semiconductor device according to an embodiment of the present invention, a coordinate origin and a measurement range when reading the barcode.

[Explanation of symbols]

 Reference Signs List 1 semiconductor wafer 2 semiconductor chip 3 ink mark 4, 14 barcode 5 semiconductor wafer coordinate origin 6 simultaneous measurement range 7 wafer number 11 protective film 13 package 15 semiconductor device 22 lower molding device 23 upper molding device 100 control device 101, 108 evaluation device 102 Pre-process manufacturing database 103 Pre-process evaluation database 104, 112 Laser device 105 Semiconductor device 106 CCD device 107 Data storage database 109 Post-process manufacturing database 110 Post-process evaluation database 121 Burn-in evaluation result 122 Product evaluation result

Claims (3)

[Claims] 1. A protective film for protecting a surface of a semiconductor chip, wherein the protective film has data including at least manufacturing conditions and an evaluation result of the semiconductor chip written on a surface portion thereof, and seals the semiconductor chip. A semiconductor device, comprising: an envelope having data including at least manufacturing conditions and an evaluation result of the semiconductor chip written on a surface portion thereof. 2. A step of evaluating a plurality of semiconductor chips; a step of writing data including at least a manufacturing condition and an evaluation result of each of the semiconductor chips on a surface of the corresponding one of the semiconductor chips; Reading the data written on the surface of the semiconductor chip and storing the data in an external storage device; sealing the semiconductor chip with an envelope; and storing the external storage device in the envelope of each of the semiconductor chips. And writing the corresponding data stored in the semiconductor device. 3. An evaluation device for evaluating a plurality of semiconductor chips, a first data writing device for writing data including at least manufacturing conditions and evaluation results of each of the semiconductor chips on a surface of the corresponding semiconductor chip, A data reading device for reading the data written on the surface of each of the semiconductor chips; an external storage device for receiving and storing the data read by the data reading device; and the data stored in the external storage device And a second data writing device common to or different from the first data writing device, which writes the data on the surface of an envelope that seals the corresponding semiconductor chip. .