JP2000500564A5 - - Google Patents
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- Publication number
- JP2000500564A5 JP2000500564A5 JP1997515236A JP51523697A JP2000500564A5 JP 2000500564 A5 JP2000500564 A5 JP 2000500564A5 JP 1997515236 A JP1997515236 A JP 1997515236A JP 51523697 A JP51523697 A JP 51523697A JP 2000500564 A5 JP2000500564 A5 JP 2000500564A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/543,113 | 1995-10-13 | ||
| US08/543,113 US5818224A (en) | 1995-10-13 | 1995-10-13 | Encapsulated transducer with an integrally formed full length sleeve and a component alignment preform and method of manufacture |
| PCT/US1996/016336 WO1997014022A1 (en) | 1995-10-13 | 1996-10-10 | Encapsulated transducer with sleeve and component alignment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000500564A JP2000500564A (en) | 2000-01-18 |
| JP2000500564A5 true JP2000500564A5 (en) | 2004-10-07 |
| JP3727350B2 JP3727350B2 (en) | 2005-12-14 |
Family
ID=24166626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51523697A Expired - Fee Related JP3727350B2 (en) | 1995-10-13 | 1996-10-10 | Encapsulated transducer having integrally formed full length sleeve and component pre-moulded body |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US5818224A (en) |
| EP (1) | EP0882215B1 (en) |
| JP (1) | JP3727350B2 (en) |
| AT (1) | ATE392604T1 (en) |
| AU (1) | AU7440896A (en) |
| DE (1) | DE69637503T2 (en) |
| DK (1) | DK0882215T3 (en) |
| WO (1) | WO1997014022A1 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5876528A (en) * | 1995-02-17 | 1999-03-02 | Bently Nevada Corporation | Apparatus and method for precluding fluid wicking |
| DE19629963A1 (en) * | 1996-07-25 | 1998-01-29 | Mannesmann Vdo Ag | Sensor, in particular temperature sensor, and injection molding tool for producing the sensor |
| US6071446A (en) * | 1997-08-29 | 2000-06-06 | Lear Automotive Dearborn, Inc | Method for centering wire harness in mold |
| US6643909B2 (en) | 2001-04-10 | 2003-11-11 | Bently Nevada Llc | Method of making a proximity probe |
| DE10359975A1 (en) * | 2003-12-18 | 2005-07-14 | Priamus System Technologies Ag | Method for operating a work equipment |
| US7120994B2 (en) * | 2004-03-18 | 2006-10-17 | General Electric Company | Apparatus for the automated manufacture of a probe tip |
| DE102004018869B4 (en) * | 2004-04-19 | 2008-05-08 | Siemens Ag | Device for detecting the movement of a movable component |
| US7375406B2 (en) * | 2005-12-20 | 2008-05-20 | Honeywell International Inc. | Thermoplastic overmolding for small package turbocharger speed sensor |
| DE102009008457A1 (en) * | 2009-02-11 | 2010-08-12 | Continental Automotive Gmbh | Method for producing a sensor with seamless encapsulation of a sensor element |
| US8328578B2 (en) | 2010-08-13 | 2012-12-11 | Lex Products Corp | Electrical connector and a method for manufacturing same |
| US8152563B1 (en) | 2010-12-28 | 2012-04-10 | Lex Products Corporation | Electrical connector having a spin ring, a pre-mold and an over-mold |
| US9190763B2 (en) | 2012-03-14 | 2015-11-17 | Lex Products Corporation | Electrical connector having a pre-molded and an over-molded material |
| WO2015052016A1 (en) | 2013-10-11 | 2015-04-16 | Mecos Ag | Contactless sensor for determining rotor displacements |
| US10416025B1 (en) * | 2013-10-28 | 2019-09-17 | Amphenol (Maryland), Inc. | Electrically isolated vibration sensor |
| DE102016207664A1 (en) * | 2016-05-03 | 2017-11-09 | Continental Teves Ag & Co. Ohg | SENSOR ELEMENT FOR A MOTOR VEHICLE |
| CN110253803A (en) * | 2019-07-08 | 2019-09-20 | 科耐特输变电科技股份有限公司 | A kind of outdoor terminal mold without longitudinal molding seam |
| US11725966B2 (en) | 2020-09-18 | 2023-08-15 | Rosemount Inc. | Multi-stage irreversible sensor coupling |
| CN113021716B (en) * | 2021-03-11 | 2022-08-30 | 长沙金信诺防务技术有限公司 | Hydrophone vulcanization mold and hydrophone vulcanization method |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2361348A (en) * | 1939-10-12 | 1944-10-24 | Spalding A G & Bros Inc | Process and apparatus for making balls |
| US2890505A (en) * | 1956-10-18 | 1959-06-16 | R And Metal Products Inc | Permanent mold with insert locating means |
| GB1313748A (en) * | 1969-09-18 | 1973-04-18 | Dunlop Holdings Ltd | Moulding |
| GB1353603A (en) * | 1970-05-05 | 1974-05-22 | Gkn Sankey Ltd | Plastic moulding |
| US3932828A (en) * | 1973-10-23 | 1976-01-13 | Coils, Inc. | Encapsulated coil and method of making the same |
| GB1442069A (en) * | 1974-04-25 | 1976-07-07 | Worldwide Plastics Dev | Moulding |
| JPS5364279A (en) * | 1976-11-20 | 1978-06-08 | Kojima Press Kogyo Kk | Producing method and apparatus for pour molded article having insert within interior of said article |
| US4162138A (en) * | 1977-12-27 | 1979-07-24 | Will Ross Inc. | Floating insert injection mold |
| DE2951968C2 (en) * | 1979-12-22 | 1984-03-29 | Eduard 7303 Neuhausen Hermle | Electrical proximity switch |
| US4408159A (en) * | 1981-04-02 | 1983-10-04 | Abex Corporation | Proximity sensing head |
| US4470786A (en) * | 1981-07-28 | 1984-09-11 | Omron Tateisi Electronics Co. | Molding apparatus with retractable preform support pins |
| US4377548A (en) * | 1981-11-27 | 1983-03-22 | Sprague Electric Company | Method for encapsulating a radial leaded electrical component |
| US5036285A (en) * | 1982-05-06 | 1991-07-30 | The United States Of America As Represented By The Secretary Of The Navy | Resonant probe and radio frequency coupler |
| FR2543356B1 (en) * | 1983-03-25 | 1986-01-10 | Ceraver | METHOD AND DEVICE FOR MOLDING THE INSULATING COATING OF A LARGE ORGANIC INSULATOR |
| FR2576245B1 (en) * | 1985-01-23 | 1987-04-30 | Jaeger | METHOD OF COATING AN ELONGATED SENSOR, MOLDING DEVICE FOR IMPLEMENTING THE PROCESS, SENSOR OBTAINED AND REINFORCEMENT INVOLVED IN THE MANUFACTURE OF THE SENSOR |
| FR2578018B1 (en) * | 1985-02-26 | 1990-04-27 | Electricfil | IMPROVEMENTS ON ELECTROMAGNETIC SENSORS |
| DE3642770C2 (en) * | 1986-12-15 | 1997-01-09 | Teves Gmbh Alfred | Inductive encoder |
| FR2608770B1 (en) * | 1986-12-23 | 1989-04-28 | Bendix Electronics Sa | ELECTROMAGNETIC SENSOR WITH VARIABLE RELUCTANCE AND MOUNTING METHOD THEREOF |
| DE3706168A1 (en) * | 1987-02-26 | 1988-09-08 | Bosch Gmbh Robert | SENSOR |
| US5049055A (en) * | 1987-12-31 | 1991-09-17 | Sanken Electric Co., Ltd. | Mold assembly |
| JPH01179332A (en) * | 1987-12-31 | 1989-07-17 | Sanken Electric Co Ltd | Manufacture of plastic-sealed electronic device |
| US5133921A (en) * | 1987-12-31 | 1992-07-28 | Sanken Electric Co., Ltd. | Method for manufacturing plastic encapsulated electronic semiconductor devices |
| DE3818499A1 (en) * | 1988-05-31 | 1989-12-07 | Ifm Electronic Gmbh | ELECTRONIC SWITCHGEAR, IN PARTICULAR PROXIMITY SWITCH |
| US5021737A (en) * | 1989-03-02 | 1991-06-04 | Bently Nevada Corporation | Proximity sensor resistant to axial and torsional forces |
| US5016343A (en) * | 1989-03-02 | 1991-05-21 | Bently Nevada Corp. | Method of making a proximity sensor |
| JPH0364279A (en) * | 1989-08-02 | 1991-03-19 | Sharp Corp | Image blurring detecting device |
| US4959000A (en) * | 1989-10-31 | 1990-09-25 | Acushnet Company | Retractable pin mold |
| US5147657A (en) * | 1989-10-31 | 1992-09-15 | John Giza | Retractable pin for an injection mold |
| DE9003343U1 (en) * | 1990-03-21 | 1990-05-23 | Herion-Werke GmbH & Co. KG, 70736 Fellbach | Encapsulated device |
| KR940006682Y1 (en) * | 1990-06-26 | 1994-09-28 | 스폴딩 앤드 이본플로 캄파니 인코포레이티드 | Golf ball injection mold |
| US5182032A (en) * | 1990-07-09 | 1993-01-26 | Paige Manufacturing Company Incorporated | Apparatus for plastic injection overmolding |
| JP2547894B2 (en) * | 1990-07-27 | 1996-10-23 | 株式会社東芝 | Mold mechanism for semiconductor resin encapsulation |
| US5226221A (en) * | 1990-11-15 | 1993-07-13 | Siemens Automotive L.P. | Method of making a hermetically sealed overmolded free-standing solenoid coil |
| US5151277A (en) * | 1991-03-27 | 1992-09-29 | The Charles Stark Draper Lab., Inc. | Reconfigurable fiber-forming resin transfer system |
| US5240397A (en) * | 1991-10-01 | 1993-08-31 | Biomedical Polymers, Inc. | Injection molding mechanism for forming a monolithic tubular pipette |
| JP2829174B2 (en) * | 1992-01-08 | 1998-11-25 | 三菱電機株式会社 | Magnetic pickup sensor |
| US5351388A (en) * | 1992-05-21 | 1994-10-04 | Bently Nevada Corporation | Cable locking and sealing process for sensor |
| US5278496A (en) * | 1992-05-22 | 1994-01-11 | Component Sales & Consultants, Inc. | High output and environmentally impervious variable reluctance sensor |
| JPH0637130A (en) * | 1992-07-16 | 1994-02-10 | Nippon Steel Corp | Manufacture of semiconductor device |
| US5278469A (en) * | 1992-12-15 | 1994-01-11 | Emerson Electric Co. | Endshield cover assembly for a motor |
| US5376325A (en) * | 1993-03-30 | 1994-12-27 | Ormson; Timothy J. | Kitchen tools and method of preparation |
-
1995
- 1995-10-13 US US08/543,113 patent/US5818224A/en not_active Expired - Lifetime
-
1996
- 1996-10-10 EP EP96936395A patent/EP0882215B1/en not_active Expired - Lifetime
- 1996-10-10 JP JP51523697A patent/JP3727350B2/en not_active Expired - Fee Related
- 1996-10-10 DK DK96936395T patent/DK0882215T3/en active
- 1996-10-10 WO PCT/US1996/016336 patent/WO1997014022A1/en active Application Filing
- 1996-10-10 DE DE69637503T patent/DE69637503T2/en not_active Expired - Lifetime
- 1996-10-10 AU AU74408/96A patent/AU7440896A/en not_active Abandoned
- 1996-10-10 AT AT96936395T patent/ATE392604T1/en not_active IP Right Cessation
-
1998
- 1998-10-05 US US09/166,331 patent/US6131270A/en not_active Expired - Lifetime