JP2000340616A - ACF sticking device - Google Patents

Abstract

(57) [Problem] To enable an ACF to be reliably separated from a mounting tape when the ACF tape is peeled off after attaching the ACF tape to a transparent substrate with a simple configuration. SOLUTION: A traveling block 30 provided with a peeling / guide roller 35 together with a tape feed chuck 34 and an attaching roller 37 and the like, and a peeling holding chuck 27 arranged in front of the traveling block 30 are provided. The holding chuck 27 is capable of reciprocating a predetermined stroke. After the ACF tape 12 is attached to the lower substrate 2, the portion where the ACF 10 is removed from the backing tape 11 is chucked and moved backward to move the ACF 10. When the mounting tape 11 is loosened from the position of the end of application to the lower substrate 2 to the position of the chuck by the holding chuck 27 during peeling, and when the peeling / guide roller 35 retreats to some extent, the ACF tape 12 is applied to the lower substrate 2. Mount from the attachment end position to the holding position by the holding chuck 27 during peeling via the peeling and guide roller 35 The tape 11 takes a substantially Z-shaped path.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for manufacturing a liquid crystal panel, which comprises the steps of:
(Tape Carrier Package) integrated circuit elements mounted on a flexible substrate
ng) ACF (Anisotropi) on a transparent substrate
c Conductive Film).

[0002]

2. Description of the Related Art An integrated circuit element mounted on a flexible substrate is TAB mounted on at least two sides of a transparent substrate constituting a liquid crystal panel. Here, in the following description, a flexible board on which an integrated circuit element is mounted is referred to as a TAB. An apparatus for mounting a TAB on a transparent substrate is a TAB mounting machine.
Before mounting on a transparent substrate, place AC
F is pasted. The ACF is obtained by dispersing conductive particles in a binder resin made of a sticky electric insulating material, and bonding the TAB to the transparent substrate on which the ACF is adhered, and pressurizing under heating during the bonding. Thus, the electrode on the TAB side and the electrode on the transparent substrate side are electrically connected via the conductive particles.

[0003] In general, ACF is laminated on a backing tape having a release layer formed on one side so as to have a predetermined thickness on the release layer.
An F tape is formed, and the ACF tape is wound around a reel by a predetermined length. To attach the ACF to the transparent substrate, draw out the ACF tape from the reel, cut only the ACF portion at predetermined lengths, perform a so-called half-cut, attach the ACF tape to the transparent substrate, and attach the roller to the backing tape. The ACF is pressed against the transparent substrate by rolling over the substrate, and then the mounting tape is peeled off.

A machine for automating the above-mentioned ACF attaching process is disclosed, for example, in Japanese Patent Application Laid-Open No. 9-25047. This known ACF adhering device is arranged at a position facing a transparent substrate and is capable of reciprocating in a tape traveling direction by at least a stroke corresponding to an ACF adhering length, and is attached to the traveling unit. The configuration includes a roller and a guide roller. The ACF tape fed from the supply reel is cut in half before the transparent substrate by the amount of the pasting length,
The portion between the two half-cut positions of the ACF tape faces the transparent substrate, and in this state, the attaching roller is pressed with a predetermined pressing force from above the mounting tape of the ACF tape with a predetermined pressure. By rolling up, the adhesive surface of the ACF is attached to a predetermined position on the transparent substrate, and then the mounting tape is separated from the ACF.

[0005] In order to separate the mounting tape from the ACF, a peeling pin which can be moved up and down by a predetermined stroke from the position of the attaching roller at a position forward of the ACF tape in the running direction is provided, and the ACF tape is attached to the transparent substrate. At the time of attachment, the peeling pin is lowered to keep it in a non-contact state with the ACF.
When the application of the ACF tape is completed, the release pin is raised, and the ACF of the mount tape is released and is brought into contact with the exposed surface of the release layer. In this state, by moving the peeling pin together with the sticking roller in the direction opposite to the running direction at the time of sticking the ACF tape, the holding tape is pressed by the sticking roller, and the peeling pin removes the mount tape from the transparent substrate. The mounting tape is separated from the ACF adhered to the transparent substrate so that the mounting tape is peeled off, and only the mounting tape is collected.

[0006]

In the above-mentioned prior art, when the application roller advances in the feed direction at the time of application of the ACF tape, the ACF tape is applied to the transparent substrate and returns to the original position. Since the mounting tape can be peeled off at this time, there is an advantage that the process from the attachment of the ACF tape to the peeling of the mounting tape can be performed quickly and efficiently, but there is no problem with this conventional technique. Not in translation.

That is, the peeling pin must be located ahead of the position of the application roller in the running direction, so that the lifting angle of the mounting tape by the peeling pin does not exceed 90 °. In addition, when the ACF tape is attached, the peeling pin is kept in non-contact with the ACF tape, and the lifting and lowering means of the peeling pin is incorporated in the transporting means. For this reason, the mounting tape lifting angle cannot be so large. Therefore, the backing tape should be ACF
When separating from the ACF, a force acts in a direction of lifting the entire ACF tape from the transparent substrate, rather than peeling the mount tape from the ACF. For this reason, depending on the degree of adhesive force between the ACF and the transparent substrate, such as when the pressing force of the ACF tape by the application roller is not sufficient, the ACF may rise from the transparent substrate while adhering to the mounting tape. There is a problem. That is, since the peeling pin lifts the mount tape at a shallow angle upstream of the position of the application roller, it is not always satisfactory as an operation for peeling the mount tape from the ACF.

The present invention has been made in view of the above points, and an object of the present invention is to attach an ACF tape to a transparent substrate and then remove the ACF tape from the ACF tape. Is to be able to be reliably separated.

[0009]

In order to achieve the above-mentioned object, the present invention relates to a traveling means for reciprocating at least a distance corresponding to the length of ACF adhered to a substrate.
F Attach the tape feed chuck, peeling / guide roller and sticking roller from the front side in the running direction when sticking,
An elevating means is provided in the traveling means, and the elevating means moves the adhering roller to an operating position where the ACF tape rolls while pressing the substrate surface with a predetermined load, and a retracted position separated by a predetermined distance from the substrate surface. The holding chuck for peeling is disposed at a position on the front side in the running direction at the time of ACF sticking from the end position of sticking to the substrate by the sticking roller. Is provided in connection with a tape slack generating means for reciprocating a predetermined stroke in the traveling direction of the ACF tape. It is characterized in that it is configured to cause slack for the length to move to the rear position in the running direction. That.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, FIG. 1 shows an appearance of a main part of a liquid crystal panel, FIG. 2 shows a cross section of a TAB mounting portion, and FIG. 3 shows a cross-sectional structure of an ACF tape.

First, in FIG. 1, a liquid crystal panel 1 is formed by laminating two transparent substrates made of glass or the like, forming a cell gap therebetween, and liquid crystal is sealed in the cell gap. The two transparent substrates 2 and 3 constituting the liquid crystal panel 1 are called a lower substrate 2 and an upper substrate 3, respectively. A predetermined lead pattern is formed on the surface of the lower substrate 2 facing the upper substrate 3 by printing means or the like, and the lead patterns are grouped into groups of a predetermined number to form a lead group 4. Then, a plurality of lead groups 4 are formed on the lower substrate 2 on at least two sides. Flexible substrate 5
A TAB 9 on which an integrated circuit element 6 is mounted and a predetermined number of lead groups 7 and 8 are provided on both sides of the integrated circuit element 6, respectively.
Are mounted such that the lead group 7 is securely electrically connected to each lead constituting the lead group 4 of the lower substrate 2.

The ACF 10 is used to mount the TAB 9 on the lower substrate 2 with the lead group 7 electrically connected to the lead group 4. The ACF 10 is shown in FIGS.
As is clear from FIG. 3, the conductive particles 10b are formed by uniformly dispersing conductive particles 10b in a binder resin 10a having electric insulation and adhesive strength. ACF made of particles sufficiently smaller than the lead-to-lead spacing,
10, the binder resin 10a of the ACF 10
When a predetermined pressing force is applied between the lower substrate 2 and the TAB 9 in a state in which the conductive particles 10b are softened, the conductive particles 10b are compressed to a state substantially matching the particle size of the conductive particles 10b. Abut on each of the leads 4a and 7a,
Electrical connection is made between them. When the binder resin is cured, the TAB 9 is fixed to the lower substrate 2.

The ACF 10 is, as apparent from FIG.
The ACF tape 12 is laminated on the backing tape 11. Here, the laminated surface of the ACF 10 in the mounting tape 11 is a release layer. When the mounting tape 11 is separated from the lower substrate 2 in a state where the ACF 10 is attached to the lower substrate 2, the ACF 10 is moved to the lower substrate 2 side. They are bound and peeled off from the backing tape 11. Thus, AC
The ACF 10 is attached to the lower substrate 2 from the state of the F tape 12, but the ACF tape 12 is wound around a reel.
The ACF tape 12 is paid out from the reel and is attached to the lower substrate 2. Therefore, the liquid crystal panel 1 is mounted on the transport base with the positioning mechanism, and is carried into the ACF attaching section.

FIG. 4 shows a schematic configuration of an apparatus for attaching the ACF 10 to the lower substrate 2. In FIG.
This is a supply reel around which the F tape 12 is wound by a predetermined length, and the ACF tape 12 fed from the supply reel 20 of the ACF tape 12 is wound around so as to be guided by the guide rollers 21 and 22. The fixed blade 23 and the movable blade 24 are located between the guide rollers 21 and 22.
The ACF 10 is cut and removed only by a predetermined length by the half-cutting means 25 consisting of: and the mount tape 11 is exposed.

Further, in the figure, 26 is a sticking unit, 27 is a holding chuck at the time of peeling, 28 is a collecting means of the mount tape 11, and the collecting means 28 is a box-shaped one having a negative pressure applied inside. Be composed. Therefore,
ACF tape 1 from guide roller 22 to collection means 28
2, a liquid crystal panel 1 is disposed at a lower position of the traveling area, and an ACF 10 to which an ACF 10 is attached is attached to the liquid crystal panel 1.
This is a sticking area, and the sticking unit 26 is configured to reciprocate in the sticking area between a position shown by a solid line and a position shown by a virtual line in the figure. The traveling stroke of the attaching unit 26 has at least a distance corresponding to the attaching length of the ACF 10 on the lower substrate 2. And, in the following, in the running direction of the ACF tape 12, the collection means 28 side is forward,
The guide roller 22 side is set to the rear, and as the moving direction of the sticking unit 26, the direction approaching the collecting means 28, that is, the direction of traveling when ACF is stuck is set to the forward direction, and the opposite direction is set to the backward direction.

The sticking unit 26 has a traveling block 30 as shown in FIG. 5, and the traveling block 30 is disposed along the guide rail 31 at a lower position of the sticking area. The traveling block 30 is driven by a motor 3
2 is driven by a feed screw 33 that is driven to rotate. The traveling block 30 is provided with a tape feed chuck 34, a peeling / guide roller 35, a front side guide roller 36, a sticking roller 37, and a rear side guide roller 38 in this order from the front side.

The tape feed chuck 34 comprises a pair of upper and lower expandable chuck pieces 34a, 34a, and an actuator 34b for driving the chuck pieces 34a, 34a in a direction to approach and separate from each other. The actuator 34b is configured by, for example, an air cylinder, a motor, or the like. Then, when the chuck pieces 34a, 34a are brought close to each other, the ACF tape 12 is chucked therebetween. Here, the chuck position of the ACF tape 12 is a portion where the ACF 12 has been cut and removed by the half cut means 25.

Further, of the four rollers 35 to 38 mounted on the traveling block 30, except for the pasting roller 37, the front and rear flanges are provided. The pasting roller 37 is a cylindrical core material. It is composed of a rubber roller with rubber laminated on the outer peripheral surface. And the peeling and guide roller 3
5 and the front side guide roller 36 are fixed to the traveling block 30, while the sticking roller 37 and the rear side guide roller 38 are mounted on the lifting block 39,
The lifting block 39 moves up and down along a guide rail 40 provided on the traveling block 30 in the vertical direction. An air cylinder 41 is provided to raise and lower the lifting block 39.

As described above, the traveling unit 30 is constituted by the traveling block 30 and the motor 32 and the feed screw 33 as its driving means, and the elevation block 39 and the air cylinder 41 for its elevation driving are constituted by the elevation block 39. Elevating means is configured. The reciprocating stroke of the traveling block 30 constituting the traveling means is A
The distance is equivalent to the total length of the length of the CF 10 attached and the length of the ACF 12 cut and removed by the half-cutting means 25.
With the F tape 12 chucked, the traveling block 30
The ACF tape 12 is pitch-fed every time. The ACF tape 12 faces the rear guide roller 38, the sticking roller 37, and the front guide roller 36 on the back side, that is, the mount tape 11 side, and the peeling / guide roller 35 faces the front side.
That is, the wire is routed such that the ACF 10 faces each other. The adhering roller 37 and the rear guide roller 38 are driven to move up and down by the elevating means. In the elevating stroke, the ascending position is substantially the same height as the front guide roller 36 at the ascending position, and the ACF tape is at the descending position. 1
2 is a height position where the lower substrate 2 can be pressed against the lower substrate 2 with a predetermined pressing force. Therefore, the attaching roller 37 is a retracted position that can be held at a predetermined distance from the lower substrate 2 at the ascending position, and presses the lower substrate 2 against the ACF tape 12 with a predetermined force at the descending position. By rolling, it becomes the operating position for sticking.

The holding chuck 27 at the time of peeling is provided at a position a predetermined distance ahead of the most advanced position of the sticking unit 26 by the traveling means. After the ACF tape 12 is attached to the lower substrate 2,
This is for holding the backing tape 11 when the backing tape 11 is peeled off, and its chuck mechanism has a pair of upper and lower chucking pieces 27a, 27a, and these chucking pieces 27a, 27a, similar to the tape feed chuck 34. 27a
And an actuator 27b for driving the actuators in directions approaching and moving away from each other. And the actuator 27
b is attached to a reciprocating block 42 mounted on the guide rail 31, and the reciprocating block 42 can reciprocate along the guide rail 31 by a predetermined stroke by an air cylinder 43. In a state where the attaching unit 26 is held at the most advanced position, the mounting tape 11 is chucked by the holding chuck 27 at the time of peeling, and the holding chuck 27 at the time of peeling is removed by the front collecting means 28
Is moved backward from the position close to the tape feed chuck 34, that is, in the direction close to the tape feed chuck 34, a predetermined slack is generated from the chuck position of the mount tape 11 to the attachment end position of the ACF 10 on the rear side. Will occur. Therefore, the reciprocating block 42 and the air cylinder 43 as its driving means function as slack generating means.

The ACF attaching apparatus according to the present embodiment is configured as described above.
The steps from the attachment of the ACF 10 to the lower substrate 2 to the separation of the mounting tape 11 will be described with reference to FIGS. In the ACF tape 12 shown in these figures, the portion indicated by the reference numeral 12 has the ACF 10 laminated thereon, and the portion indicated by the reference numeral 11 has the ACF 1
0 indicates a separated portion.

First, FIG. 6 shows a state where the ACF 10 has been attached to the lower substrate 2 of the liquid crystal panel 1. At this time, the mount tape 11 is chucked by the holding chuck 27 during peeling and is located at the rear position. Further, the sticking unit 26 is located at the rearmost position, the tape feed chuck 34 is in the chuck release state, and the sticking roller 37 and the rear guide roller 38 are held at the retracted position.

Liquid crystal panel 1 on which ACF 10 has been pasted
7 is carried out until the new liquid crystal panel 1 is carried into a predetermined position, as shown in FIG. 7, the ACF tape 12 is chucked by the tape feed chuck 34,
Next, the chuck by the holding chuck 27 at the time of peeling is released. Then, by operating the air cylinder 43, the reciprocating block 42 provided with the holding chuck 27 during peeling is displaced to the front position. Here, the chuck position of the tape feed chuck 34 is desirably a portion of the ACF tape 12 from which the ACF 10 has been cut and removed by the half-cutting means 25.

In this state, the motor 32 of the sticking unit 26 is operated to move the traveling block 30 forward as indicated by the arrow F in FIG. by this,
The mounting tape 11 from which the ACF 10 has been peeled out of the ACF tape 12 chucked by the tape feed chuck 34 is collected by the collecting means 28, and the portion where the ACF 10 is laminated is sent out to a position facing the liquid crystal panel 1. Thereafter, the sticking unit 26 is retracted, and then the elevating block 39 is lowered, so that the sticking rollers 37 are moved.
As a result, the ACF tape 12 is pressed against the lower substrate 2, and at the same time, the rear guide roller 38 descends.
A predetermined length of the CF tape 12 on the rear side of the contact position of the adhering roller 37 is applied to the adhering roller 3.
It is pushed down to almost the same position as 7. This is the state shown in FIG. 8, and the sticking roller 37
Rolls along the back surface of the ACF tape 12 while pressing the ACF tape 12 against the lower substrate 2 with a predetermined load. As a result, when the attaching unit 26 is displaced to the most advanced position, the ACF tape 12 is attached to a predetermined position on the lower substrate 2.

Next, after the ACF tape 12 is attached to the lower substrate 2 in this manner, the mounting tape 11 is peeled off from the ACF 10. For this reason, the chuck of the ACF tape 12 by the tape feed chuck 34 is released while the attaching unit 26 is held at the most advanced position,
At the time of peeling, the portion of the ACF tape 12 where the ACF 10 is peeled is chucked by the holding chuck 27. Thereafter, the elevating block 39 is raised to displace the attaching roller 37 and the rear guide roller 38 to the retreat position. This is the state shown in FIG.

From the state shown in FIG. 9, the air cylinder 43 is operated to displace the reciprocating block 42 backward. As a result, as shown in FIG. 10, an extra length is generated in the mount tape 11 between the end position of the ACF tape 12 to which the ACF 10 is attached to the lower substrate 2 and the chuck position of the holding chuck 27 during peeling. It becomes slack for the extra length. From this state shown in FIG. 10, the traveling block 30 in the attaching unit 26 is retracted. Mount tape 11
As shown in FIG. 11, when the peeling / guide roller 35 is retracted to some extent, the backing tape 11 has no slack and is in a state of being tight. As a result, the mounting tape 11 takes a roughly Z-shaped path from the end position of the ACF tape 12 to be attached to the lower substrate 2 to the holding position of the holding chuck 27 at the time of separation via the separation and guide roller 35. The angle of the paper tape 11 from the attachment end position is 90 ° or more. Here, the angle of the mounting tape 11 depends on the movement stroke of the reciprocating block 42, and it is desirable to set the movement stroke so that the angle is about 130 °.

When the attaching unit 26 is retracted while maintaining the state shown in FIG. 11, the backing tape 11 wound around the peeling / guide roller 35 is pulled backward from the attaching end position. A force in the direction of peeling off the ACF 10 adhered to the lower substrate 2 effectively acts on the mounting tape 11.
In other words, no force acts in the direction of lifting the ACF 10 from the lower substrate 2 together with the backing tape 11, and
F10 is stably held in a state of being adhered to the lower substrate 2. Since the ACF tape 12 is half-cut, the ACF 10 is mounted on the backing tape 11 until the peeling / guide roller 35 is displaced near the position of the half-cut.
The ACF 10 is completely separated from the backing tape 11 while the ACF 10 is completely adhered to the lower substrate 2. Pasting unit 26 moves to a position where it is slightly retracted from this position and stops. This results in the state shown in FIG.

By sequentially repeating the above operation,
ACF 10 is attached to lower substrate 2 of liquid crystal panel 1.
The ACF 10 adhered to the lower substrate 2 is held in an extremely stable state, and it is possible to reliably prevent a decrease in adhesive force due to lifting or the like at the time of peeling of the mounting tape 11 and entrapment of air bubbles.

[0029]

Since the present invention is constructed as described above, the ACF tape is attached to the transparent substrate with a simple structure, and when the mount tape is peeled off, A
This has the effect that the CF can be reliably separated.

[Brief description of the drawings]

FIG. 1 is an external view of a main part showing an example of a liquid crystal panel to which an ACF attaching device of the present invention is applied.

FIG. 2 is a sectional view of a TAB mounting portion in the liquid crystal panel.

FIG. 3 is a sectional view of an ACF tape.

FIG. 4 is a schematic configuration diagram of an ACF attaching device according to the present invention.

FIG. 5 is a perspective view illustrating a configuration of a sticking unit and a holding chuck during peeling.

FIG. 6 is an operation explanatory view showing a state immediately after the ACF is attached to the liquid crystal panel.

FIG. 7 is an operation explanatory view showing a state where the feeding of the ACF tape is completed.

FIG. 8 is an operation explanatory view showing an ACF tape attaching start state.

FIG. 9 is an operation explanatory view showing a state in which ACF tape attachment is completed.

FIG. 10 is an operation explanatory view showing a state in which the mounting tape is slackened.

FIG. 11 is an operation explanatory view showing a peeling start state of the mounting tape.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Liquid crystal panel 2 Lower substrate 3 Upper substrate 9 TAB 10 ACF 11 Mount tape 12 ACF tape 20 Supply reel 25 Half cut means 26 Pasting unit 27 Holding chuck at the time of peeling 28 Collection means 30 Travel block 32 Motor 33 Feed screw 34 Tape feed chuck 35 Peeling and Guide Roller 36 Front Guide Roller 37 Sticking Roller 38 Rear Guide Roller 39 Elevating Block 41 Air Cylinder 42 Reciprocating Block 43 Air Cylinder

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Noriyuki Iwasaki, Inventor 3-16-3 Higashi, Shibuya-ku, Tokyo F-term in Hitachi Electronics Engineering Co., Ltd. 3F108 GA09 GB01 HA04 HA12 JA03 5E319 BB16 CD26 CD35 5F044 NN19 PP11 PP15

Claims (1)

[Claims] 1. An ACF tape having an ACF stuck on one side of a mounting tape is fed out from a supply reel, and a predetermined length is stuck on a substrate surface by a sticking roller. Then, the mounting tape is peeled off the ACF and collected. A traveling means for reciprocating at least a distance corresponding to an ACF adhering length to the substrate, a tape feed chuck, a peeling / guide roller and the adhering roller from a front side in a traveling direction at the time of ACF adhering. An operating position in which an attaching roller is mounted, and an elevating means is provided in the traveling means, and the attaching roller is rolled by the elevating means while the ACF tape is pressed against the surface of the substrate with a predetermined load; It can be displaced to a retracted position separated from the substrate surface by a predetermined distance, and furthermore, it is attached to the substrate by the attaching roller. A tape slack generating means for disposing a peeling holding chuck at a position on the front side in the running direction at the time of attaching the ACF from the attachment end position, and reciprocating a predetermined stroke in the running direction of the running means. The tape loosening generating means connects the peeling / guide roller to the AC by the sticking roller.
An ACF adhering device characterized in that the A tape adhering device is configured to cause a slack corresponding to a length moving from a terminal end position of adhering the F tape to the substrate to a rear position in the traveling direction at the time of the ACF adhering.