JP2000336242A - Epoxy resin composition, prepreg, metal foil coated with resin, and laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition which can reduce dusting due to resin powder during cutting by using as the constituents an epoxy resin and a phenoxy resin modified with an acid anhydride. SOLUTION: The resin composition contains (A) an epoxy resin, such as a halogenated bisphenol A epoxy resin or a novolak epoxy resin, having an epoxy equivalent of 150 to 1,000, (B) a phenoxy resin modified with an acid anhydride and having a weight-average molecular weight of 1,5 to 40,000, in an amount of 20-50 wt.% based on the total resin, a cure accelerator comprising, e.g. an imidazole or a tertiary amine, and a solvent, such as cyclohexanone, in an amount sufficient to give a resin concentration of 40-80 wt.%. The composition is infiltrated into a base material such as a glass cloth and heated to 140-180 deg.C to cause semi-curing, thus giving a prepreg. The component B comprises a phenoxy resin modified with trimellitic anhydride, maleic anhydride or pyromellitic anhydride and preferably has an acid value of 100-300 mg KOH/g.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition, a prepreg, a metal foil with a resin, and a laminate used for producing a printed wiring board.

[0002]

2. Description of the Related Art A printed wiring board used for electric equipment and electronic equipment is prepared by impregnating a base material such as a glass cloth with a thermosetting resin varnish to prepare a prepreg. A metal foil such as a copper foil is placed on a metal foil-clad laminate by heating and pressurizing and laminating the metal foil to produce a metal foil-clad laminate. I have.

[0003] Here, the prepreg is generally made of a semi-cured state (B-stage) by using an epoxy resin as a thermosetting resin, impregnating a base material such as glass cloth with an epoxy resin varnish, and heating and drying. ) Is used.

In recent years, instead of the above-described prepreg, a thermosetting resin such as an epoxy resin is applied to a metal foil such as a copper foil and dried in a semi-cured state (B-stage). Copper foil with resin is also used. In this case, since there is no base material as in the case of prepreg, it is possible to reduce the weight and size of printed wiring boards and multilayer printed wiring boards, which can contribute to the weight reduction and miniaturization of equipment. is there.

[0005]

The epoxy resin of the above-mentioned prepreg or metal foil with resin is in a semi-cured state.
When a prepreg or a resin-coated metal foil is cut into a predetermined size, powder falling easily occurs. And when handling prepreg or metal foil with resin for lamination, this resin powder that has fallen off from the prepreg or metal foil with resin,
Attached to a metal foil or a metal plate for laminate molding, the molded laminate is dented like a dent by this resin powder,
There is a problem that a so-called dent defect occurs.

Therefore, a method of preventing the powder from falling from the prepreg or the resin-attached metal foil by heating the end face of the cut prepreg or the resin-attached metal foil with an infrared heater or the like has been studied. However, this method has a problem that the number of steps for the heat treatment increases, and a problem arises that the end face of the prepreg or the resin-attached metal foil swells and hinders the laminating operation.

The present invention has been made in view of the above points, and an object of the present invention is to provide an epoxy resin composition, a prepreg, and a resin-attached metal foil which can reduce the occurrence of resin powder falling during cutting. It is an object of the present invention to provide a laminated board with less dent defects.

[0008]

The epoxy resin composition according to claim 1 of the present invention is characterized by comprising an epoxy resin and a phenoxy resin modified with an acid anhydride. .

Further, the invention of claim 2 provides that the phenoxy resin modified with an acid anhydride has an average molecular weight of 15,000 to 400
00.

The invention according to claim 3 is characterized in that the phenoxy resin modified with an acid anhydride is contained in an amount of 20 to 50% by weight based on the total amount of the resin.

According to a fourth aspect of the present invention, the epoxy resin has an epoxy equivalent of 150 to 1,000.

A prepreg according to a fifth aspect of the present invention is characterized in that a substrate is impregnated with the epoxy resin composition according to any one of the first to fourth aspects.

A resin-coated metal foil according to a sixth aspect of the present invention is characterized in that the epoxy resin composition according to any one of the first to fourth aspects is applied to the surface of the metal foil. is there.

A laminate according to a seventh aspect of the present invention is characterized by being formed by laminating at least one of the prepreg of the fifth aspect and the metal foil with resin of the sixth aspect. .

[0015]

Embodiments of the present invention will be described below.

In the present invention, the epoxy resin is not particularly limited, but is a bisphenol A type epoxy resin, a halogenated bisphenol A type epoxy resin having flame retardancy added thereto, a novolak type epoxy resin,
Examples thereof include halogenated novolak type epoxy resins having flame retardancy. In particular, it is preferable to use a mixture of a halogenated bisphenol A type epoxy resin and a novolak type epoxy resin since a laminate having excellent electrical properties, physical properties, flame retardancy, and the like can be obtained.

It is preferable to use an epoxy resin having an epoxy equivalent of 150 to 1000. An epoxy resin having an epoxy equivalent of more than 1000 may lower the glass transition temperature and decrease the heat resistance of the resin, and an epoxy resin having an epoxy equivalent of less than 150 becomes brittle and becomes flexible. May be impaired.

Further, in the present invention, a phenoxy resin which is modified with an acid anhydride is used. As the acid anhydride to be modified, trimellitic anhydride, maleic anhydride, pyromellitic anhydride and the like can be used. The amount of modification with an acid anhydride is 100 in the range of the acid value.
A range of -300 mgKOH / g is preferred.

In the present invention, an epoxy resin and a phenoxy resin are blended as resin components in the epoxy resin composition. By adding a phenoxy resin to the resin component, the flexibility of the resin can be increased. It is possible to reduce the occurrence of resin powder falling during cutting. By using the phenoxy resin modified with an acid anhydride, the functional group of the acid anhydride acts as a curing agent and reacts with the epoxy resin, so that even if the amount of the phenoxy resin is increased, the glass transition of the resin is increased. The temperature can hardly be reduced, and the characteristics such as heat resistance can be prevented from being reduced.

Here, the average molecular weight (weight average molecular weight) of the phenoxy resin modified with an acid anhydride is 15,000 to 4
Desirably, the range is 0000. Average molecular weight is 1
If it is less than 5,000, the effect of increasing the flexibility of the resin is insufficient, and the effect of reducing powder drop during cutting cannot be sufficiently obtained. When the average molecular weight exceeds 40,000, the flow of resin when laminating and molding a prepreg obtained by impregnating and drying an epoxy resin composition on a base material or a resin-coated metal foil obtained by applying and drying an epoxy resin on a metal foil. There is a possibility that the moldability is deteriorated and the moldability is reduced such as generation of bubbles.

The amount of the phenoxy resin modified with an acid anhydride is preferably in the range of 20 to 50% by weight based on the total resin amount of the resin component in the epoxy resin composition. 20 blended amounts
If the amount is less than the percentage by weight, the effect of improving the flexibility of the resin cannot be sufficiently obtained, and it is difficult to sufficiently reduce powder drop during cutting. When the amount exceeds 50% by weight, the prepreg obtained by impregnating and drying the epoxy resin composition on the base material or the resin for laminating and forming the resin-coated metal foil obtained by applying and drying the epoxy resin on the metal foil is dried. May deteriorate, and the moldability may decrease, such as generation of bubbles.

In addition to the epoxy resin and the phenoxy resin modified with an acid anhydride, a curing accelerator and a solvent can be added to the epoxy resin composition of the present invention, if necessary. Examples of the curing accelerator include imidazoles such as 2-ethyl-4-methylimidazole, and tertiary amines such as dimethylbenzylamine. As the solvent, cyclohexanone, methyl ethyl ketone, dimethylformamide, acetone, methyl cellosolve, dioxane or the like can be used alone or in combination. The content of the resin component in the epoxy resin composition when a solvent is added is set to 40 to 80% by weight,
It is preferable from the viewpoint of impregnating the base material.

The prepreg according to the present invention is obtained by impregnating a base material such as a glass cloth with the epoxy resin composition obtained as described above, and then heating it, and evaporating the solvent, if contained, while evaporating the solvent. It is prepared by advancing the reaction of the epoxy resin and semi-curing the epoxy resin in the base material. The temperature at which the resin in the base material is semi-cured is 14
A range from 0 to 180 ° C is preferred. If the temperature is lower than 140 ° C., the time required for semi-curing becomes longer,
On the other hand, when the temperature exceeds 180 ° C., the reaction of the epoxy resin proceeds too much, and the problem that the adhesive strength at the time of laminating the obtained prepregs tends to occur is apt to occur.

The above resin varnish is applied to the surface of a metal foil such as a copper foil, a silver foil, an aluminum foil and a stainless steel foil,
By heating and drying in a dryer at a temperature of about 140 to 180 ° C., a resin-attached metal foil having a resin layer in a semi-cured state (B-stage) provided on the surface can be produced.

Since the prepreg and the metal foil with resin according to the present invention use an epoxy resin composition containing a phenoxy resin modified with an acid anhydride, the flexibility of the resin in the prepreg and the metal foil with resin is used. It is difficult for powder to fall off when cutting prepreg or metal foil with resin.There is no need to heat the end surface of the cut prepreg or metal foil with resin with an infrared heater, etc. There is no problem that the number of steps for the treatment increases or that the end face of the prepreg or the resin-attached metal foil swells to hinder the laminating operation.

In the laminate according to the present invention, one or a plurality of the prepregs obtained as described above are stacked, and a metal foil such as a copper foil is stacked on one or both sides thereof as necessary.
For example, it is manufactured by sandwiching this between metal plates and applying heat and pressure to form a laminate. Also, by laminating a required number of prepregs on one or both sides of an inner circuit board on which an inner layer circuit has been formed in advance, and arranging a metal foil on the outside of the prepreg, heating and pressurizing the laminate to form a multilayer printed wiring board. This makes it possible to produce a multilayer laminate for processing into a multilayer laminate. Heating / pressing conditions in this lamination molding are arbitrarily set as required.

Further, the above-mentioned metal foil with resin is laminated on one side or both sides of the inner circuit board on which the circuit for the inner layer is formed in advance on the resin layer side, and this is sandwiched between, for example, metal plates, and heated and pressed. By lamination molding, a multilayer laminate for processing into a multilayer printed wiring board can be manufactured.

The laminate according to the present invention is manufactured by using a prepreg or a resin-coated metal foil which is unlikely to fall off during cutting as described above, so that the resin powder is applied to the metal foil or the metal plate. It is possible to reduce dent defects generated by the adhesion.

[0029]

The present invention will be described below in detail with reference to examples.

(Example 1) Brominated bisphenol A type epoxy resin (product number YDB-500, manufactured by Toto Kasei Co., Ltd.);
Epoxy equivalent 500g / eq, bromine content 21% by weight)
Resin and 5 parts by weight of a cresol novolak type epoxy resin (“N-690” manufactured by Dainippon Ink & Chemicals, Inc .; epoxy equivalent: 225 g / eq) were mixed with 2 ethyl 4-methyl as a curing accelerator. 0.1 parts by weight of imidazole, acid anhydride-modified phenoxy resin (weight average molecular weight 15500, acid value 125.8 mgKOH /
g, a bromine content of 28.5% by weight, modified with trimellitic anhydride), and a mixture of cyclohexanone and methyl ethyl ketone at a weight ratio of 2: 1 as a solvent. The modified phenoxy resin was blended so that the total content of the phenoxy resin was 45% by weight, and this was mixed to obtain a varnish of the epoxy resin composition.

The obtained epoxy resin varnish was impregnated into a glass substrate having a glass cloth specification of 7628, and
Heat treatment in a dryer at 0 ° C for 5 minutes to obtain a resin content of 4
At 5% by weight, a prepreg cut into a size of 340 mm × 510 mm was obtained. The prepreg was further cut using a cutter and processed into a size of 100 mm × 100 mm.

The thus obtained 100 mm × 10
Twelve prepregs of 0 mm are stacked, and each of the four sides is 5 cm.
Was dropped five times from the height of the prepreg, and the total amount of resin powder dropped from the four sides of the prepreg was measured to determine the amount of powder falling. The results are shown in Table 1.

Eight 340 mm × 510 mm prepregs were stacked, copper foils were placed on both sides of the prepreg, and the outside was sandwiched between metal plates.
By laminating at 0 kg / cm ² for 100 minutes, a double-sided copper-clad laminate was obtained.

The surface of the thus obtained double-sided copper-clad laminate was visually inspected, and the size (diameter) was 0.5 mmφ,
Those having a concave portion having a depth of 50 μm or more were determined as dent defects. Then, about 1000 sheets of double-sided copper-clad laminates, whether or not this dent defect has occurred is inspected.
The rate at which dent defects occurred was determined as the dent defect rate, and the results are shown in Table 1.

Next, a 0.018 mm-thick copper foil on the surface of a double-sided copper-clad laminate (product number R-1766, manufactured by Matsushita Electric Works) is etched to form an inner layer circuit board having conductor circuits formed on both sides. Obtained. Then, one of the above prepregs was disposed on both sides of the inner layer circuit board, and both sides of the prepreg were sandwiched between metal plates, and were laminated and formed under the same conditions as above to obtain a multilayer laminated board.

The copper foil on the surface of the multilayer laminate thus obtained is entirely etched, and in this state, the embedding property of the conductor circuit of the inner circuit board by the resin layer is observed with a microscope of 50 times. In this way, the moldability of the prepreg was evaluated. The case where no air bubbles were observed between the conductor circuit of the inner circuit board and the resin layer was evaluated as “○”, and the case where air bubbles were generated between the conductor circuit of the inner circuit board and the resin layer was evaluated as “×”. The results are shown in Table 1.

The epoxy resin varnish obtained as described above was applied to one side of a copper foil having a thickness of 18 μm,
For 5 minutes to produce a resin-coated metal foil having a thickness of 60 μm. Then, the metal foil with resin was bent, and the amount of resin powder falling (the amount of powder falling per bending length) was measured. The results are shown in Table 1.

Example 2 75 parts by weight of a bisphenol A type epoxy resin (epoxy equivalent: 1000 g / eq) and a cresol novolak type epoxy resin (“N-690” manufactured by Dainippon Ink and Chemicals, Ltd .; epoxy equivalent: 22)
5 g / eq) of an epoxy resin mixed with 5 parts by weight, 0.1 parts by weight of 2-ethyl 4-methylimidazole as a curing accelerator, and an acid anhydride-modified phenoxy resin (weight average molecular weight 3
9800, acid value 270 mgKOH / g, bromine content 2
6.1% by weight, modified with trimellitic anhydride) and 20 parts by weight of cyclohexanone and methyl ethyl ketone mixed at a weight ratio of 2: 1 as a solvent, and the above epoxy resin and acid anhydride-modified phenoxy resin were mixed. They were blended so that the total content was 45% by weight, and mixed to obtain a varnish of the epoxy resin composition.

Using this epoxy resin varnish, a prepreg, a metal foil with resin, a double-sided copper-clad laminate, and a multilayer laminate were produced in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. Are shown in Table 1.

Example 3 60 parts by weight of a bisphenol A type epoxy resin (epoxy equivalent: 1000 g / eq) and a cresol novolak type epoxy resin (“N-690” manufactured by Dainippon Ink and Chemicals, Ltd .; epoxy equivalent: 22)
5 g / eq) and 10 parts by weight of epoxy resin mixed with 0.1% of 2-ethyl 4-methylimidazole as a curing accelerator.
Parts by weight, acid anhydride modified phenoxy resin (weight average molecular weight 22400, acid value 195 mgKOH / g, bromine content 2
6.8% by weight, modified with trimellitic anhydride), and 30 parts by weight of cyclohexanone and methyl ethyl ketone mixed at a weight ratio of 2: 1 as a solvent were mixed with the above epoxy resin and acid anhydride-modified phenoxy resin. They were blended so that the total content was 45% by weight, and mixed to obtain a varnish of the epoxy resin composition.

Using this epoxy resin varnish, a prepreg, a metal foil with resin, a double-sided copper-clad laminate, and a multilayer laminate were produced in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. Are shown in Table 1.

Example 4 Brominated bisphenol A type epoxy resin ("YDB-500" manufactured by Toto Kasei Co., Ltd.);
Epoxy equivalent 500g / eq, bromine content 21% by weight)
And 5 parts by weight of a cresol novolak type epoxy resin (“N-690” manufactured by Dainippon Ink and Chemicals, Inc .; epoxy equivalent: 225 g / eq), and 2 ethyl 4-methyl as a curing accelerator 0.1 parts by weight of imidazole, acid anhydride-modified phenoxy resin (weight average molecular weight 31300, acid value 185.1 mg KOH /
g, bromine content of 26.4% by weight, modified with trimellitic anhydride), and 40 parts by weight of cyclohexanone and methyl ethyl ketone mixed at a weight ratio of 2: 1 as a solvent. The modified phenoxy resin was blended so that the total content of the phenoxy resin was 45% by weight, and this was mixed to obtain a varnish of the epoxy resin composition.

Using this epoxy resin varnish, a prepreg, a metal foil with resin, a double-sided copper-clad laminate, and a multilayer laminate were produced in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. Are shown in Table 1.

(Example 5) Brominated bisphenol A type epoxy resin ("YDB-500" manufactured by Toto Kasei Co., Ltd.);
Epoxy equivalent 500g / eq, bromine content 21% by weight)
And a bisphenol A type epoxy resin ("YD-128" manufactured by Toto Kasei Co., Ltd .; epoxy equivalent: 185)
g / eq) of 5 parts by weight, and a cresol novolak type epoxy resin (manufactured by Dainippon Ink and Chemicals, Inc., product number N-69)
0 "; epoxy resin obtained by mixing 5 parts by weight of epoxy equivalent 225 g / eq), 0.1 part by weight of 2-ethyl 4-methylimidazole as a curing accelerator, acid anhydride-modified phenoxy resin (weight average molecular weight 19,800, acid value 144) 0.7mg
KOH / g, bromine content 25.5% by weight, modified with trimellitic anhydride) in an amount of 50 parts by weight, and cyclohexanone and methyl ethyl ketone as solvents in a weight ratio of 2: 1.
Were mixed so that the total content of the epoxy resin and the acid anhydride-modified phenoxy resin was 45% by weight, and mixed to obtain a varnish of an epoxy resin composition.

Using this epoxy resin varnish, a prepreg, a resin-coated metal foil, a double-sided copper-clad laminate, and a multilayer laminate were produced in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. Are shown in Table 1.

Example 6 Brominated bisphenol A type epoxy resin ("YDB-500" manufactured by Toto Kasei Co., Ltd.);
Epoxy equivalent 500g / eq, bromine content 21% by weight)
40 parts by weight, 20 parts by weight of a bisphenol A type epoxy resin (epoxy equivalent: 1000 g / eq), and a cresol novolak type epoxy resin (“Part No. N-690” manufactured by Dainippon Ink & Chemicals, Inc .; epoxy equivalent: 225 g / e)
q) was mixed with 5 parts by weight of an epoxy resin, 0.1 parts by weight of 2-ethyl-4-methylimidazole as a curing accelerator, and an acid anhydride-modified phenoxy resin (weight average molecular weight of 2470)
0, acid value 195.5 mg KOH / g, bromine content
(4% by weight, modified with trimellitic anhydride), and 35 parts by weight of cyclohexanone and methyl ethyl ketone mixed at a weight ratio of 2: 1 as a solvent were added to the above epoxy resin and acid anhydride-modified phenoxy resin. The varnish of the epoxy resin composition was obtained by mixing the components so that the content ratio became 45% by weight.

Using this epoxy resin varnish, a prepreg, a metal foil with resin, a double-sided copper-clad laminate, and a multilayer laminate were produced in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. Are shown in Table 1.

Example 7 Brominated bisphenol A type epoxy resin ("YDB-500" manufactured by Toto Kasei Co., Ltd.);
Epoxy equivalent 500g / eq, bromine content 21% by weight)
And 4 parts by weight of a cresol novolak type epoxy resin (“N-690” manufactured by Dainippon Ink & Chemicals, Inc .; epoxy equivalent: 225 g / eq), and 2 ethyl 4-methyl as a curing accelerator 0.1 parts by weight of imidazole, acid anhydride-modified phenoxy resin (weight average molecular weight 36200, acid value 104.1 mg KOH /
g, a bromine content of 25.5% by weight, modified with trimellitic anhydride), and a mixture of cyclohexanone and methyl ethyl ketone at a weight ratio of 2: 1 as a solvent. The modified phenoxy resin was blended so that the total content of the phenoxy resin was 45% by weight, and this was mixed to obtain a varnish of the epoxy resin composition.

Using this epoxy resin varnish, a prepreg, a metal foil with resin, a double-sided copper-clad laminate, and a multilayer laminate were produced in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. Are shown in Table 1.

(Comparative Example 1) Brominated bisphenol A-type epoxy resin ("YDB-500" manufactured by Toto Kasei Co., Ltd.);
Epoxy equivalent 500g / eq, bromine content 21% by weight)
And 90 parts by weight of a cresol novolak-type epoxy resin (“Part No. N-690” manufactured by Dainippon Ink and Chemicals, Inc .; epoxy equivalent: 225 g / eq) mixed with 10 parts by weight, and dicyandiamide as a curing agent was mixed with 2.5 parts by weight. % By weight, 0.1 parts by weight of 2-ethyl-4-methylimidazole as a curing accelerator, and a mixture of methyl ethyl ketone and dimethylformamide at a weight ratio of 1: 1 as a solvent were mixed with the epoxy resin having a content of 60% by weight. % And mixed to obtain a varnish of the epoxy resin composition.

Using this epoxy resin varnish, a prepreg, a metal foil with resin, a double-sided copper-clad laminate, and a multilayer laminate were produced in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. Are shown in Table 1.

[0052]

[Table 1]

As can be seen from Table 1, it is confirmed that the addition of the acid anhydride-modified phenoxy resin reduces the amount of powder falling and also reduces the dent defect rate. It is also confirmed that when the amount of the acid anhydride-modified phenoxy resin in the epoxy resin composition exceeds 50% by weight of the total resin amount, the moldability of the prepreg decreases.

[0054]

As described above, the epoxy resin composition according to the first aspect of the present invention contains an epoxy resin and a phenoxy resin modified with an acid anhydride, so that the phenoxy resin modified with an acid anhydride is used. By containing the resin, the flexibility of the resin can be enhanced, and the powder of the resin powder can be reduced when cutting a prepreg or a resin-coated metal foil using the epoxy resin composition. Things.

Further, the invention of claim 2 provides that the phenoxy resin modified with an acid anhydride has an average molecular weight of 15,000 to 400
Since it is 00, it is possible to reduce the drop of resin powder when cutting the prepreg without reducing the moldability when laminating and molding the prepreg produced using the epoxy resin composition. .

According to a third aspect of the present invention, since the phenoxy resin modified with an acid anhydride is contained in an amount of 20 to 50% by weight based on the total amount of the resin, the prepreg prepared by using the epoxy resin composition is laminated and molded. In this case, it is possible to reduce the drop of resin powder when cutting the prepreg without lowering the moldability at the time.

According to the fourth aspect of the present invention, since the epoxy equivalent of the epoxy resin is 150 to 1,000, high heat resistance can be obtained.

The prepreg according to claim 5 of the present invention is prepared by impregnating a base material with the epoxy resin composition according to any one of claims 1 to 4, and thus is modified with an acid anhydride. By containing the phenoxy resin, it is possible to increase the flexibility of the resin and to reduce the drop of resin powder during cutting.

The resin-attached metal foil according to claim 6 of the present invention is prepared by applying the epoxy resin composition according to any one of claims 1 to 4 to the surface of the metal foil. By containing a phenoxy resin modified with an anhydride, the flexibility of the resin can be increased, and powder falling off during cutting can be reduced.

The laminate according to a seventh aspect of the present invention is manufactured by laminating and molding using at least one of the prepreg of the fifth aspect and the metal foil with resin of the sixth aspect. It is possible to obtain a laminated board using a prepreg that does not easily cause powder dropping, and to reduce dent defects caused by powdered resin powder adhering to metal foil or metal plate during lamination molding. Can be done.

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Claims (7)

[Claims] 1. An epoxy resin composition comprising an epoxy resin and a phenoxy resin modified with an acid anhydride. 2. The epoxy resin composition according to claim 1, wherein the phenoxy resin modified with an acid anhydride has an average molecular weight of 15,000 to 40,000. 3. The epoxy resin composition according to claim 1, wherein the phenoxy resin modified with an acid anhydride is contained in an amount of 20 to 50% by weight based on the total amount of the resin. 4. An epoxy resin having an epoxy equivalent of 150 to
The epoxy resin composition according to any one of claims 1 to 3, wherein the number is 1,000. 5. A prepreg comprising a substrate impregnated with the epoxy resin composition according to claim 1. 6. A metal foil with resin, which is obtained by applying the epoxy resin composition according to claim 1 to a surface of the metal foil. 7. A laminate, wherein the laminate is formed by laminating at least one of the prepreg according to claim 5 and the metal foil with resin according to claim 6.