JP2000323812A - Part mounting substrate, production thereof and inspection apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent erroneous mounting by providing a part mounting substrate being subdivided into a plurality of sections with electrical conducting parts for breaking the substrate, detecting a breakage and judging presence of a broken part. SOLUTION: Slightly wide electrical conducting parts, i.e., conductive foils 2, 3, are formed on the surface and rear of a printed board 1 and subdivided into conductive foils 2a, 2b, 3a, 3b before V-grooves 4, 5 are made of such depth as the substrate 1 is not separated. Subsequently, the printed board 1 is mounted on the probes, i.e., conduction check pins 12, 13, 15, 16, being connected with an inspection equipment 10 and conduction of the conductive foils 2a, 2b, 3a, 3b is checked by clamping the printed board 1 vertically by means of the conduction check pins 12, 1, 15, 16. A decision is made that the V-grooves 4, 5 are made if the conductive foils are not conducting otherwise a decision is made that the V-grooves 4, 5 are not yet made.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting board, a method of manufacturing the same, and an inspection apparatus therefor, and more particularly, to the presence or absence of a V-groove portion, which is a breakable portion provided on a board surface so as to enable division. This is related to technology that can be used.

[0002]

2. Description of the Related Art Heretofore, in order to enable mounting of electric and electronic circuit components on a plurality of substrates, a V-groove is formed at the boundary of the substrate and divided along the V-groove. Getting it done is done. Referring to the drawings, the conventional substrate manufacturing process will be described with reference to FIGS.
(C) is a front view showing a conventional manufacturing process of a substrate to be divided.

First, a printed circuit board 101 provided with a circuit pattern (not shown) and through holes for mounting components is prepared as shown in FIG. 4A, and V and V are formed on the front and back surfaces as shown in FIG. The grooves 4 and 5 are formed by machining or laser processing, and a bending moment is applied along the V-grooves to divide and mount the electric and electronic circuit components, which are completed by a flow soldering method or a reflow soldering method. Was like that.

Alternatively, before dividing, electric and electronic circuit components of a plurality of substrates are simultaneously mounted, fixed by a flow soldering method or a reflow soldering method, and then divided along the V-grooves 4 and 5 in the order given. I was going.

[0005]

However, in the former case, if the printed circuit board is to be cracked even though the V-groove is not dug in the printed circuit board, it will not be easily broken. In addition, if it is forcibly attempted to break, a situation occurs in which a portion other than the V-groove portion is broken.

[0006] In the latter case, when a V-groove is formed in a printed circuit board, an electric component is mounted on the printed circuit board, and the printed circuit board is split along the V-groove. If it is found that the V-groove has not been dug since the component has already been mounted, the cost of the already mounted component and the cost of the component mounting process are wasted.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above-mentioned problems, and is divided into a plurality of portions along a V-shaped groove portion, which is a broken shape portion, in order to mount electric and electronic circuit components for a plurality of substrates. It is an object of the present invention to provide a component mounting board, a method of manufacturing the same, and an inspection device therefor, which can electrically detect the presence or absence of a broken shape portion of the board to prevent erroneous mounting.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems and to achieve the objects, according to the present invention, in order to mount electric and electronic circuit components for a plurality of substrates, it is necessary to follow a broken shape portion. A component mounting board that is divided into a plurality of parts, wherein when processing the breakable shape portion, an electrical conduction portion to be broken is provided on the substrate, and the presence or absence of the breakage shape portion is detected by detecting the presence or absence of the breakage. It is characterized in that the state can be determined.

Further, the electric conduction portion is provided on a front surface, a back surface, or a front and back surface of the substrate.

[0010] Further, the substrate is a laminated substrate in which the electrical conduction portion electrically connected to terminals provided on the front surface, the back surface, or the front and back surfaces of the substrate is provided.

Further, the break shape portion is a V-groove portion having a depth for cutting the electric conduction portion.

A method of manufacturing a component mounting board for dividing electrical and electronic circuit components for a plurality of boards into a plurality of pieces along the broken shape after the mounting, wherein the broken shape is processed. Sometimes, an electrically conductive portion to be broken is provided on the substrate, and by detecting the presence or absence of the break, the presence or absence of the broken shape portion can be determined, thereby preventing erroneous mounting. .

[0013] The present invention is characterized in that the electrical conduction portion is provided on the front surface, the back surface, or the front and back surfaces of the substrate.

Further, the substrate is a laminated substrate in which the electrical conduction portion electrically connected to terminals provided on the front surface, the back surface, or the front and back surfaces of the substrate is provided.

Further, the broken shape portion is a V-groove portion having a depth for cutting the electric conduction portion.

In addition, in order to mount electrical and electronic circuit components for a plurality of substrates, there is provided an inspection device for a component mounting board which is divided into a plurality of pieces along the broken shape portion after the mounting, wherein the broken shape portion is processed. And a continuity detecting means for detecting the presence / absence state of the rupture-shaped portion by detecting the presence / absence state of the continuity state of the electrical conduction portion provided on the substrate so as to be broken; And a control means for controlling the mounting to be stopped when the fractured shape portion is in a non-state.

Further, the electric conduction portion is provided on the front surface, the back surface, or the front and back surfaces of the substrate, and the conduction detection means has a probe that contacts the electric conduction portion on the front surface, the back surface, or the front and back surfaces of the substrate. It is characterized by:

[0018] The substrate is a laminated substrate provided with the electrical conduction portion electrically connected to terminals provided on the front surface, the back surface, or the front and back surfaces of the substrate, and the probe is provided so as to be able to contact the terminals. It is characterized by:

[0019]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIGS. 1A to 1C are printed circuit boards for detecting a V-groove according to the first embodiment.
FIG. 1C illustrates a procedure up to detection of the presence or absence of a V-groove by the V-groove detector 10 of FIG. 1C, and omits steps of a flow soldering method and a reflow soldering method for mounting an electronic / electric component. is there. That is, there are a case where components are mounted after the substrate is divided, and a case where components are mounted for a plurality of portions before the substrate is divided.

As shown in FIG. 1A, the printed circuit board 1
The conductive foil 23, which is an electrically conductive portion, is formed on the front and back surfaces of the substrate so as to be slightly wider along a boundary for dividing the substrate. Alternatively, although not shown, a conductive foil is formed on one side.

Thereafter, as shown in FIG. 1B, the conductive foils 2 and 3 are divided into 2a, 2b, 3a and 3b.
Are formed with a cutter device or the like to a depth that does not separate the V grooves.

Thereafter, the inspection apparatus 1 shown in FIG.
Continuity check pin 121 which is a probe connected to
3 stands and its continuity check pins 12, 13, 1
The printed circuit board 1 is placed on the printed circuit board 5 and 16, and the conductive foils 2a, 2b, 3a and 3b are sandwiched between the conduction check pins 12, 13, 15, and 16 from above and below.
Is configured to check for continuity.

These continuity check pins 12, 13, 1
5 and 16 are provided at positions where the conduction check pins are in contact with the conductive foil when the printed circuit board 1 is placed, and the pins 12, 13, 15, and 16 are connected to the conductive foils 2a, 2b, 3a, 3
b, and a continuity check is performed. If the result of this check is non-conductivity, the V-groove 4
It is determined that 5 is dug, and if it is conductive, it is determined that the V-groove is not formed.

FIG. 2 is a flowchart for component mounting. In step S1, after inspection is performed by the inspection apparatus 10 as shown in FIG. 1C, the process proceeds to step S2. In step S4, a command is sent to a chip mounter, which is a component mounter, to mount electric components on the printed circuit board 1. If it is determined in step S2 that there is electrical continuity, the process proceeds to step S3, where control is performed so that the printed circuit board 1 is not mounted. Thereafter, in step S5, the printed circuit board 1 on which the components are mounted is divided by dividing, and the process ends in step S6.

As described above, if the printed circuit board is divided after detecting that the V-groove portion is dug, no situation occurs in which the printed circuit board is not broken or a part other than the part to be broken is broken.

Also, by detecting that the V-groove is dug, the electric component is mounted on the printed circuit board and completed by the flow soldering method or the reflow soldering method, so that the mounted component is not wasted. In short, unnecessary and wasteful work can be eliminated.

Next, FIGS. 3A to 3C are sectional views showing the inspection process of the printed circuit board for detecting the V-groove portion according to the second embodiment, in which only the substrate 1 is cut away.

In FIG. 3A, a substrate 1 has terminals 20a, 20b, 30a, 30b provided on the front and back surfaces of the substrate.
This is a laminated substrate provided by laminating the internal patterns 20 and 30 which are the electrically conductive portions that are electrically connected to the substrate.

For this purpose, as shown in FIG. 3B, V-groove portions 4 and 5 having a depth reaching the internal patterns 20 and 30 are formed by a cutter or the like, and as shown in FIG. The continuity of the internal pattern 2030 is checked by the continuity check pins 12, 13, 15, and 16. For this purpose, the continuity check pins 12, 13, 15, 16
The internal pattern is provided at a position on the surface of the printed circuit board 1 such that the internal pattern is in contact with any one of the patterns exposed on the surface. If the V-groove portion is detected by effectively using the internal pattern of the laminated substrate, the conductive foil as described above does not need to be provided on the substrate surface.

As described above, if the printed circuit board is divided after detecting that the V-groove portion 45 is dug, the printed circuit board will not be broken, or a portion other than the portion to be broken will not be broken. Only

Further, if the electric component is mounted on the printed circuit board after detecting that the V-groove portion is dug, the electric component is not wasted, and unnecessary and unnecessary work is not required. Will be.

[0033]

As described above, according to the present invention,
In order to mount electric and electronic circuit components for a plurality of substrates, it is possible to electrically detect the presence / absence state of the broken shape portion of the substrate divided into a plurality along the V-groove portion which is the broken shape portion,
It is possible to provide a component mounting board capable of preventing erroneous mounting beforehand, a method of manufacturing the same, and an inspection device therefor.

[Brief description of the drawings]

FIGS. 1A to 1C are diagrams illustrating a process of inspecting a printed circuit board according to a first embodiment;

FIG. 2 is a flowchart of a component mounting process.

FIGS. 3A to 3C are diagrams illustrating a process of inspecting a printed circuit board according to a second embodiment;

FIG. 4 is a manufacturing process diagram of a conventional printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 23 Conductive foil (electric conduction part) 45 V groove part (break shape part) 10 Inspection apparatus 12, 13 Continuity check pin (probe) 20, 30 Internal pattern

Claims (11)

[Claims] 1. A component mounting board which is divided into a plurality of pieces along a broken shape portion for mounting electric and electronic circuit components for a plurality of substrates, wherein the component mounting board is broken when processing the broken shape portion. A component mounting board, wherein an electrical conduction portion is provided on the board, and the presence or absence of the breakable portion can be determined by detecting the presence or absence of the break. 2. The component mounting board according to claim 1, wherein the electric conduction portion is provided on a front surface, a back surface, or a front and back surface of the substrate. 3. The component according to claim 1, wherein the substrate is a laminated substrate provided with the electrical conduction portion that is electrically connected to terminals provided on the front surface, the back surface, and the front and back surfaces of the substrate. Mounting board. 4. The component mounting board according to claim 1, wherein the broken shape portion is a V-groove portion having a depth to cut the electric conduction portion. 5. A method for manufacturing a component mounting board, comprising: mounting the electric and electronic circuit components for a plurality of substrates, the mounting being divided into a plurality of parts along the broken shape after the mounting, wherein the broken shape is processed. Sometimes, an electrically conductive portion to be broken is provided on the substrate, and by detecting the presence or absence of the break, the presence or absence of the broken shape portion can be determined, thereby preventing erroneous mounting. Manufacturing method of component mounting board. 6. The component mounting board according to claim 5, wherein the electrical conduction portion is provided on a front surface, a back surface, or a front and back surface of the substrate. 7. The component according to claim 5, wherein the substrate is a laminated substrate in which the electrical conduction portion that is electrically connected to terminals provided on the front surface, the back surface, or the front and rear surfaces of the substrate is provided. Manufacturing method of mounting board. 8. The method for manufacturing a component mounting board according to claim 5, wherein the broken shape portion is a V-groove portion having a depth that cuts the electrical conduction portion. 9. An inspection device for a component mounting board, which is divided into a plurality of pieces along a broken shape portion after the mounting for mounting electric and electronic circuit components for a plurality of boards, wherein the broken shape portion is processed. When detecting, the conduction detecting means for determining the presence or absence of the conduction state of the electrical conduction portion provided on the substrate so as to be broken, thereby making it possible to determine the presence or absence of the fractured shape portion, and the conduction detection Control means for controlling so as to stop the mounting when the breakable shape part is in an inactive state. 10. The electric conduction portion is provided on the front surface, the back surface, or the front and back surfaces of the substrate, and the conduction detection means has a probe that contacts the electric conduction portion on the front surface, the back surface, or the front and back surfaces of the substrate. The device for inspecting a component mounting board according to claim 9, wherein: 11. The substrate is a laminated substrate in which the electrical conduction portion electrically connected to terminals provided on the front surface, the back surface, or the front and back surfaces of the substrate is provided, and the probe is provided so as to be able to contact the terminals. 10. The method according to claim 9, wherein
A device for inspecting a component mounting board according to claim 1.