JP2000320036A - Ceiling part heat insulation structure of building of frame wall method - Google Patents
Ceiling part heat insulation structure of building of frame wall methodInfo
- Publication number
- JP2000320036A JP2000320036A JP11131356A JP13135699A JP2000320036A JP 2000320036 A JP2000320036 A JP 2000320036A JP 11131356 A JP11131356 A JP 11131356A JP 13135699 A JP13135699 A JP 13135699A JP 2000320036 A JP2000320036 A JP 2000320036A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- ceiling
- heat insulating
- rafter
- ceiling joist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 title abstract description 21
- 238000000034 method Methods 0.000 title description 4
- 239000000463 material Substances 0.000 claims abstract description 58
- 239000002245 particle Substances 0.000 claims abstract description 8
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 8
- 239000000057 synthetic resin Substances 0.000 claims abstract description 8
- 238000012856 packing Methods 0.000 claims abstract description 7
- 239000011120 plywood Substances 0.000 claims abstract description 7
- 239000011810 insulating material Substances 0.000 claims description 34
- 238000010276 construction Methods 0.000 claims description 18
- 239000011094 fiberboard Substances 0.000 claims description 2
- 239000012774 insulation material Substances 0.000 abstract description 4
- 238000005187 foaming Methods 0.000 abstract 2
- 239000006260 foam Substances 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011491 glass wool Substances 0.000 description 5
- -1 polypropylene Polymers 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920006327 polystyrene foam Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Building Environments (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は枠組壁工法建築物の
天井部断熱構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat insulation structure for a ceiling of a framed wall construction building.
【0002】[0002]
【従来の技術】木造住宅の枠組壁工法は、通常、断面2
inch×4inchの材を用いて柱や間柱等を構成す
るためツーバイフォー工法と称されている。このような
工法では、構造材を構成する木材の断面寸法の種類がわ
ずかで良いので結果的にコストが安くなるという利点が
ある。2. Description of the Related Art A framed wall method for a wooden house usually has a section
It is referred to as a two-by-four construction method for forming pillars, studs, and the like using a material of inch × 4 inch. In such a construction method, there is an advantage that the cost is reduced as a result, since the kind of the cross-sectional dimension of the wood constituting the structural material is slightly small.
【0003】図3は、従来の寒冷地向けの枠組壁工法建
築物の天井部断熱構造を示したものである。この建築物
では、枠材により所定厚さの壁体1が構成されている。
また、壁体1内にはグラスウール8が装填され、外壁下
張材9により覆われている。すなわちこの建築物では、
壁体1内に内断熱構造が構成されている。一方、頭つな
ぎ2により、垂木3が支持されている。また、所定間隔
おきに配置された天井根太7間に、グラスウール5が側
方から転び止め6に当接するように装填されている。尚
室内の湿気がグラスウールに到達し、結露の発生を防止
するために符号4、10として示される防湿材が張り巡
らされている。FIG. 3 shows a conventional heat insulating structure for a ceiling of a framed wall construction building for a cold region. In this building, a wall 1 having a predetermined thickness is formed by a frame material.
Further, glass wool 8 is loaded in the wall body 1 and is covered with an outer wall subbing material 9. That is, in this building,
An inner heat insulating structure is formed in the wall 1. On the other hand, the rafter 3 is supported by the head joint 2. Glass wool 5 is mounted between the ceiling joists 7 arranged at predetermined intervals so as to abut against the anti-fall 6 from the side. In addition, in order to prevent the moisture in the room from reaching the glass wool, and to prevent the occurrence of dew condensation, moisture-proof materials indicated by reference numerals 4 and 10 are laid.
【0004】[0004]
【発明が解決しようとする課題】ところで、このような
従来の枠組壁工法建築物では、小屋裏空間において、天
井根太がむきだしに配置されることになる。すると、グ
ラスウールで室内と小屋裏空間を断熱しようとするに拘
わらず天井根太の部分に熱橋が生じてしまい、所期の断
熱効果が得られなくなる。これを避けるために、グラス
ウールの代わりに天井根太の上に板状断熱材などを敷設
して断熱性を向上させることもできるが、垂木3が邪魔
になって板状断熱材を屋根側に密着させることができ
ず、単に天井根太の上に板状断熱材を敷設しただけで
は、熱橋を防ぐことができないばかりか、隙間が生じる
という問題があった。However, in such a conventional framed wall construction building, the ceiling joists are disposed in the back space of the hut. Then, despite the fact that the interior of the cabin and the back of the cabin are to be insulated with glass wool, a thermal bridge is formed at the portion of the ceiling joist, and the desired heat insulating effect cannot be obtained. In order to avoid this, it is possible to improve the heat insulation by laying a plate-like heat insulator etc. on the ceiling joist instead of the glass wool, but the rafter 3 is in the way and the plate heat-insulation material adheres to the roof side However, simply laying a plate-like heat insulating material on a ceiling joist cannot prevent a thermal bridge but also has a problem that a gap is generated.
【0005】更にこの問題を解決しようとすると、所定
間隔で設置されている根太3に嵌合するような切り欠き
を板状断熱材に設ければよいのだが、隙間を生じさせな
いで密着するように切り欠きを作ることは精度が必要で
あり且つ根太3の間隔は厳密には一定ではない事情等も
あることからすれば、切り欠きを作ることは困難で且つ
現場作業を繁雑にするものであった。In order to further solve this problem, a notch may be provided in the plate-like heat insulating material so as to fit into the joist 3 provided at a predetermined interval. Making a notch in a hole requires precision and the interval between joists 3 is not strictly constant, so that it is difficult to make a notch and it complicates on-site work. there were.
【0006】本発明はこのような実情に鑑み、枠組壁工
法建築物の天井部の熱橋を効果的に防ぐことができ且つ
施工が容易な枠組壁工法建築物の天井部断熱構造を提供
することを目的としている。[0006] In view of such circumstances, the present invention provides a ceiling heat insulating structure of a framed wall construction building that can effectively prevent a thermal bridge on the ceiling of the framed wall construction building and is easy to construct. It is intended to be.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
の本発明に係る枠組壁工法建築物の天井部断熱構造は、
頭つなぎの上面に天井根太を配置し、その天井根太上
に所定高さの垂木受け材を天井根太の縁部即ち壁体に沿
って取り囲むように立設し、次いで天井根太で垂木を支
えるようにした後、天井根太の上面に板状断熱材を敷設
したことを特徴としている。Means for Solving the Problems To achieve the above object, a ceiling insulation structure of a framed wall construction according to the present invention comprises:
A ceiling joist is arranged on the upper surface of the head tie, and a rafter receiving material of a predetermined height is erected on the ceiling joist so as to surround the edge of the ceiling joist, that is, along the wall, and then the rafter is supported by the ceiling joist. After that, a plate-like heat insulating material is laid on the upper surface of the ceiling joist.
【0008】このような構成によれば、垂木受け材を立
設することにより、天井根太と垂木の間に所定高さの空
間を確保できるから、この空間に板状断熱材を切り欠く
ことなく、垂木受け材の側面と天井根太の上面と接する
ように容易に設置することができる。即ち、天井根太間
に断熱材を挿入する断熱構造ではなく、又板状断熱材を
精度高く切り欠きする必要もないことから、天井部での
熱橋を極力減らすことができるのであり、室内と小屋裏
空間との断熱性を大幅に向上させることが出来る。[0008] According to such a configuration, a space of a predetermined height can be secured between the ceiling joist and the rafter by erecting the rafter receiving material, so that the plate-like heat insulating material is not cut out in this space. It can be easily installed so as to be in contact with the side surface of the rafter receiving material and the upper surface of the ceiling joist. That is, it is not a heat insulating structure in which a heat insulating material is inserted between the ceiling joists, and since it is not necessary to cut out the plate heat insulating material with high precision, the number of thermal bridges at the ceiling can be reduced as much as possible. The heat insulation with the space behind the hut can be greatly improved.
【0009】ここで板状断熱材は1枚であってもよい
が、2枚重ねるものであってもよい。2枚重ねる場合の
利点としては、薄い板状断熱材であっても厚みを持たせ
ることが出来るし、又板状断熱材をレンガ積み状にする
ことによって板状断熱材の突き当たり部分の隙間を他の
板状断熱材で塞ぐことが出来るから、板状断熱材1枚を
敷き並べるよりも断熱欠損を少なくすることができる。Here, the number of the plate-shaped heat insulating materials may be one, or two or more. As an advantage of stacking two sheets, even a thin plate-shaped heat insulating material can be made thicker, and by making the plate-shaped heat insulating material into a brick-stacked shape, the gap at the end of the plate-shaped heat insulating material can be reduced. Since it can be closed with another plate-like heat insulating material, the heat insulation loss can be reduced as compared with the case where one plate-like heat insulating material is laid.
【0010】また、前記天井根太と前記板状断熱材との
間に、単板、合板、繊維板、パーティクルボードなどの
乾燥面材を介在させることができる。板状断熱材単独で
敷設した場合は、上から荷重がかかった時など割れた
り、垂れ下がったりして不都合が生じる場合も多々有る
のだが、乾燥面材を介在させることにより面強度を向上
させることになり、上記のような不都合を除くことが出
来る。[0010] Further, a dry face material such as a veneer, a plywood, a fiberboard, a particle board or the like can be interposed between the ceiling joist and the plate-shaped heat insulating material. In the case of laying with a plate-shaped heat insulator alone, there are many cases where it will break or hang down when a load is applied from above, but inconveniences will occur.However, it is necessary to improve the surface strength by interposing a dry surface material And the above inconvenience can be eliminated.
【0011】この乾燥面材は単に天井根太上に敷設する
だけでもよいが、釘などで天井根太に固定してもかまわ
ない。又乾燥面材は前記板状断熱材の上に敷設すること
もできる。The dry surface material may be simply laid on the ceiling joist, but may be fixed to the ceiling joist with nails or the like. Further, the dry surface material can be laid on the plate-like heat insulating material.
【0012】更には、前記垂木受け材の上面に当接し、
且つ一つの垂木と、隣接する垂木との間に当接してなる
発泡合成樹脂からなるパッキン材を配設したことを特徴
とする。これにより垂木間及び又は垂木受け材と屋根間
の断熱欠損を無くすことができるので、家全体としての
断熱性向上に役に立つ。Further, the abutment comes into contact with the upper surface of the rafter receiving material,
Further, a packing material made of a foamed synthetic resin is provided so as to abut between one rafter and an adjacent rafter. This makes it possible to eliminate insulation defects between the rafters and / or the rafter receiving material and the roof, which is useful for improving the heat insulation of the entire house.
【0013】[0013]
【発明の実施の形態】以下、図面に示した実施例を参照
しながら本発明を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to embodiments shown in the drawings.
【0014】図1は本発明の一実施例による天井部断熱
構造を備えた木造二階建ての枠組壁工法建築物の壁断面
を示したものである。この建築物では、基礎20の上に
土台21が据えられ、土台21の上に、端根太または側
根太50,51が立設されている。さらに、根太50,
51の上面に板材24が敷設されて1階の床を構成して
いる。FIG. 1 shows a cross section of a wall of a wooden two-story framed wall construction structure having a ceiling heat insulating structure according to an embodiment of the present invention. In this building, a base 21 is placed on a foundation 20, and end joists or side joists 50, 51 are erected on the base 21. In addition, joist 50,
A plate member 24 is laid on the upper surface of 51 to form the first floor.
【0015】一方2階の床面は根太25の上に配設され
ている板材26であり、1階の場合と同じくパーティク
ルボード、構造用合板などの板材26が敷き並べられて
いる。これらの板材24、26は、構造用合板あるいは
パーティクルボードなどの木質系材料によって形成され
ているがこれに限定されるものではない。On the other hand, the floor surface of the second floor is a plate member 26 arranged on a joist 25, and plate members 26 such as particle board and structural plywood are laid out in the same manner as in the case of the first floor. These plate members 24 and 26 are formed of a woody material such as structural plywood or particle board, but are not limited thereto.
【0016】さらに、1階、2階の壁面には所定間隔お
きに縦枠28が立設され、これらは頭つなぎ29で連結
されている。縦枠28の外側には、同じく、構造用合
板、パーティクルボードなどの板材30が面方向に張り
巡らされている。なお、この板材30の外側目地部、土
台21と基礎20との間などには、図示していないが気
密テープを介在させることが好ましい。この気密テープ
は、適宜なクッション性と粘着性を備えた、いわゆる発
泡合成樹脂からなるシール材である。また、これらの板
材30の外側には、発泡合成樹脂からなる板状断熱材3
1が張り巡らされ、すなわち、外断熱構造が構成されて
いる。Further, vertical frames 28 are erected at predetermined intervals on the walls on the first and second floors, and these are connected by a head link 29. Outside the vertical frame 28, similarly, a plate material 30 such as a structural plywood or a particle board is stretched in a plane direction. Although not shown, an airtight tape is preferably interposed between the outer joint portion of the plate member 30 and the base 21 and the foundation 20. This airtight tape is a sealing material made of a so-called foamed synthetic resin having appropriate cushioning properties and adhesiveness. Outside these plate members 30, a plate-like heat insulating material 3 made of a foamed synthetic resin is provided.
1 are stretched around, that is, an external heat insulating structure is configured.
【0017】この板状断熱材31は1枚でも2枚重ねで
あっても良い。この板状断熱材の外側には、図示しない
が外装材が取り付けられることは当然である。This plate-shaped heat insulating material 31 may be one sheet or two sheets. Although not shown, an exterior material is naturally attached to the outside of the plate-shaped heat insulating material.
【0018】前記板状断熱材31及び天井に敷設される
板状断熱材37,38はどのような発泡体から構成して
も良いが、例えば、ポリスチレンフォーム、ポリプロピ
レンフォーム、ポリエチレンフォーム、ポリウレタンフ
ォーム、フェノールフォーム、アクリルフォーム、炭酸
塩系無機質発泡体、水酸化物系無機質発泡体、炭酸塩系
無機質発泡体、珪酸塩系無機質発泡体などが例示され
る。軽量性に基づく作業性を高めようとする場合はポリ
スチレンフォーム、ポリプロピレンフォームなどの有機
系発泡体が好ましく、不燃性が重視される場合には無機
質系発泡体が好適である。またこれらの発泡体は有機系
発泡体では押出法、ビーズ法など、無機質系発泡体では
バッチ法などで製造することができる。発泡倍率は任意
であるが、例えば、20〜60倍とするのが望ましい。The plate-like heat insulating material 31 and the plate-like heat insulating materials 37 and 38 laid on the ceiling may be made of any foam. For example, polystyrene foam, polypropylene foam, polyethylene foam, polyurethane foam, Examples thereof include a phenol foam, an acrylic foam, a carbonate-based inorganic foam, a hydroxide-based inorganic foam, a carbonate-based inorganic foam, and a silicate-based inorganic foam. Organic foams such as polystyrene foam and polypropylene foam are preferred when workability based on lightness is to be enhanced, and inorganic foams are preferred when nonflammability is important. These foams can be produced by an extrusion method or a bead method for an organic foam, or a batch method for an inorganic foam. Although the expansion ratio is arbitrary, it is preferably, for example, 20 to 60 times.
【0019】壁の面方向に広がる板材30と板状断熱材
31とを接合するには、例えば、接着剤が用いられる。
接着剤の種類としては、酢酸ビニル樹脂エマルジョン系
接着剤、エポキシ系接着剤、ウレタン系接着剤などが例
示される。また、板状断熱材31と板材30とは釘やス
テープラーなどの針材で連結しても良いが、針のような
金属の貫通は断熱欠損となるので、貫通しないようにす
る必要がある。このような断熱材を配設することによ
り、この建築物では、縦枠28の外側に外断熱構造が構
成されることになる。An adhesive is used to join the plate member 30 and the plate-like heat insulating member 31 extending in the plane direction of the wall, for example.
Examples of the type of the adhesive include a vinyl acetate resin emulsion-based adhesive, an epoxy-based adhesive, and a urethane-based adhesive. Further, the plate-shaped heat insulating material 31 and the plate material 30 may be connected by a needle material such as a nail or a stapler, but since penetration of a metal such as a needle causes insulation loss, it is necessary to prevent penetration. By arranging such a heat insulating material, an external heat insulating structure is formed outside the vertical frame 28 in this building.
【0020】一方、2階の天井部には、図2に拡大して
示したように、頭つなぎ29の上面に天井根太35を配
置し、その天井根太35の上面にはパーティクルボー
ド、構造用合板などの板材40が平面状に敷設されてい
る。実施例では、パーティクルボードが採用されてい
る。さらに、その板材40の上面に枠材を三段重ねにし
た垂木受け材33が立設されている。なお、これらの垂
木受け材33は家の外周に沿って、水平方向に延びる長
尺物である。このような垂木受け材41が立設された
ら、発泡合成樹脂からなる第1の板状断熱材37が敷設
されるとともに、その上方に第2の板状断熱材38が敷
設されている。したがって、天井部では、二重の断熱材
37,38により、断熱層の厚さが十分確保されてい
る。On the other hand, on the ceiling of the second floor, as shown in FIG. 2, a ceiling joist 35 is disposed on the upper surface of the head joint 29, and a particle board and a structural board are provided on the upper surface of the ceiling joist 35. A plate material 40 such as plywood is laid flat. In the embodiment, a particle board is employed. Further, on the upper surface of the plate material 40, there is provided a rafter receiving material 33 having a frame material stacked in three steps. Note that these rafter receiving members 33 are long objects extending in the horizontal direction along the outer periphery of the house. When such a rafter receiving material 41 is erected, a first plate-shaped heat insulating material 37 made of a foamed synthetic resin is laid, and a second plate-shaped heat insulating material 38 is laid above the first plate-shaped heat insulating material 37. Therefore, in the ceiling, the thickness of the heat insulating layer is sufficiently ensured by the double heat insulating materials 37 and 38.
【0021】垂木39は、垂木受け材33に支持されて
いる。また、一つの垂木39と隣接する垂木39との間
には、それぞれ板状発泡合成樹脂からなるパッキン材4
5が水平方向を囲繞するように配置されている。パッキ
ン材45は、板状断熱材31、37、38などと同様の
材質から形成されていても良いが、適宜なクッション性
と柔軟性を備えていることが好ましい。このようなパッ
キン材45を配置することにより、垂木39間の断熱欠
損を無くすことができる。なお、図2において、符号4
1、46は気密テープを示したものである。このような
気密テープ41、46を貼着することにより、板材30
と垂木受け材33との接合部の気密性ならびに、板材4
0と垂木受け材33の間、さらに板材30と板材40の
気密性を向上させることができる。The rafter 39 is supported by a rafter receiving member 33. Further, between one rafter 39 and an adjacent rafter 39, a packing material 4 made of a plate-like foam synthetic resin is provided.
5 are arranged so as to surround the horizontal direction. The packing material 45 may be made of the same material as the plate-like heat insulating materials 31, 37, 38, etc., but preferably has appropriate cushioning properties and flexibility. By arranging such a packing material 45, it is possible to eliminate the heat insulation loss between the rafters 39. In addition, in FIG.
Reference numerals 1 and 46 denote airtight tapes. By adhering such airtight tapes 41 and 46, the plate 30
The airtightness of the joint between the rafter receiving material 33 and the plate material 4
Between 0 and the rafter receiving member 33, the airtightness of the plate member 30 and the plate member 40 can be further improved.
【0022】このように垂木受け材33を設けた天井部
断熱構造が設置された建築物では、天井部を断熱してい
る板状断熱材37、38を部分的に切り欠く必要がな
く、垂木受け部の側面に当接し天井根太の上面に敷設す
るだけであるから施工が容易であり、作業時間も短くて
済み、しかも、板状断熱材37,38を二重に敷設でき
るので、薄い断熱材を使用する場合であっても、断熱性
能を十分向上させることができる。以上、本発明の一実
施例について説明したが、本発明は上記実施例に何ら限
定されない。例えば、上記実施例では、垂木受け材33
は、枠材の三段重ねであるが、一つの大きな枠材であっ
ても良い。また、板状断熱材37、38の総厚みに合わ
せて、所定高さに調整してもよい。In a building in which the ceiling heat insulating structure provided with the rafter receiving material 33 is installed, it is not necessary to partially cut out the plate-like heat insulating materials 37 and 38 that insulate the ceiling. Since it is only necessary to abut on the side surface of the receiving portion and lay it on the upper surface of the ceiling joist, construction is easy, the working time is short, and the plate-like heat insulating materials 37 and 38 can be laid in double, so that thin heat insulation is provided. Even when a material is used, the heat insulation performance can be sufficiently improved. As mentioned above, although one Example of this invention was described, this invention is not limited to the said Example at all. For example, in the above embodiment, the rafter receiving material 33
Is a three-tiered frame material, but may be a single large frame material. Further, the height may be adjusted to a predetermined height in accordance with the total thickness of the plate-shaped heat insulating materials 37 and 38.
【0023】さらには、上記実施例では、壁および床を
構築するにあたり、現場で、縦枠28および板材30を
取り付けていく工法で説明したが、パネル工法にも適用
可能である。Further, in the above-described embodiment, the construction method in which the vertical frame 28 and the plate member 30 are mounted on the site when constructing the wall and the floor has been described. However, the construction method can be applied to a panel construction method.
【0024】本発明によれば、今まで、一階の床、ある
いは2階の床に構成されていた構造をそのまま天井部に
採用しているので、余分な寸法の部材を新たに設ける必
要がなく、部品の共用化を図ることができる。したがっ
て、コスト的にも安価に構成できる。また、寒冷地にお
いても、十分な断熱性能を発現させることができる。According to the present invention, since the structure previously constituted on the floor of the first floor or the floor of the second floor is employed as it is on the ceiling, it is necessary to newly provide members having extra dimensions. Components can be shared. Therefore, it can be constructed inexpensively. Further, even in cold regions, sufficient heat insulation performance can be exhibited.
【0025】このような構造を採用することにより、い
わゆるツーバイフォー工法の建築物であっても天井部の
断熱性能を向上させることができる。By adopting such a structure, it is possible to improve the heat insulating performance of the ceiling even in a building of the so-called two-by-four construction method.
【0026】[0026]
【発明の効果】以上、説明したように、本発明に係る枠
組壁工法建築物の天井部断熱構造によれば、枠組により
壁を構成した建築物の頭つなぎの上面に天井根太を配置
し、その天井根太上に所定高さの垂木受け材を立設した
ことにより、天井根太の上方に空間を確保でき、この空
間を利用して板状断熱材を切り欠くことなく敷設するこ
とができる。したがって、天井根太間に断熱材を挿入す
る断熱構造ではないことから、板状断熱材を切り欠き下
降するという煩雑な作業をする必要がなく、天井部での
熱橋が少なくなり、断熱性が向上する。これにより、十
分な断熱性能を発揮させることができ、寒冷地の断熱構
造として最適な断熱構造を提供できる。As described above, according to the thermal insulation structure of the ceiling of the framed wall construction according to the present invention, the ceiling joists are arranged on the upper surface of the head joint of the building whose wall is formed by the framework. Since the rafter receiving material having a predetermined height is erected on the ceiling joist, a space can be secured above the ceiling joist, and this space can be used to lay a plate-like heat insulating material without being cut out. Therefore, since it is not an insulation structure that inserts insulation between the ceiling joists, there is no need to perform the complicated work of notching and lowering the plate-like insulation, and the number of thermal bridges at the ceiling is reduced, and the insulation properties are reduced. improves. Thereby, sufficient heat insulating performance can be exhibited, and an optimum heat insulating structure can be provided as a heat insulating structure in a cold region.
【0027】また、外断熱を構成した建築物に有効であ
る。The present invention is also effective for buildings having external heat insulation.
【0028】[0028]
【図1】図1は本発明の一実施例による断熱構造が設置
された枠組壁工法建築物の要部断面図である。FIG. 1 is a sectional view of a main part of a framed wall construction building provided with a heat insulating structure according to an embodiment of the present invention.
【図2】図2はその一部を拡大して示した断面図であ
る。FIG. 2 is a cross-sectional view showing an enlarged part of FIG.
【図3】図3は従来の桁上断熱構造が設置された屋根部
の断面図である。FIG. 3 is a cross-sectional view of a roof on which a conventional girder heat insulation structure is installed.
33 垂木受け材 35 天井根太 37 第1の板状断熱材 38 第2の板状断熱材 39 垂木 40 板材 45 パッキン材 33 rafter receiving material 35 ceiling joist 37 first plate-shaped heat insulating material 38 second plate-shaped heat insulating material 39 rafter 40 plate material 45 packing material
Claims (4)
って、頭つなぎの上面に天井根太を配置し、その天井根
太上に所定高さの垂木受け材を立設し、該垂木受け材の
側面と該天井根太の上面に接するように板状断熱材を敷
設したことを特徴とする天井部断熱構造。1. A ceiling heat insulating structure for a framed wall construction building, wherein a ceiling joist is disposed on an upper surface of a head joint, and a rafter receiving material having a predetermined height is erected on the ceiling joist. A heat insulating structure for a ceiling, wherein a plate-like heat insulating material is laid so as to be in contact with a side surface of the material and an upper surface of the ceiling joist.
乾燥面材が介在されていることを特徴とする請求項1記
載の天井部断熱構造。2. Between the ceiling joist and the plate-like heat insulating material,
The heat insulating structure for a ceiling part according to claim 1, wherein a dry surface material is interposed.
パーティクルボードの少なくとも1種以上から選ばれる
ことを特徴とする請求項2に記載の枠組壁工法建築物の
天井部断熱構造。3. The dry panel according to claim 1, wherein the veneer is a veneer, a plywood, a fiberboard,
The ceiling heat-insulating structure of a framed wall construction building according to claim 2, wherein at least one kind of particle board is selected.
つの垂木と、隣接する垂木との間に当接してなる発泡合
成樹脂からなるパッキン材を配設したことを特徴とする
請求項1から3のいずれかに記載の天井部断熱構造。4. A packing material made of a foamed synthetic resin which is in contact with an upper surface of the rafter receiving material and is in contact with one rafter and an adjacent rafter is provided. The ceiling heat-insulating structure according to any one of 1 to 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11131356A JP2000320036A (en) | 1999-05-12 | 1999-05-12 | Ceiling part heat insulation structure of building of frame wall method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11131356A JP2000320036A (en) | 1999-05-12 | 1999-05-12 | Ceiling part heat insulation structure of building of frame wall method |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000320036A true JP2000320036A (en) | 2000-11-21 |
Family
ID=15056019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11131356A Pending JP2000320036A (en) | 1999-05-12 | 1999-05-12 | Ceiling part heat insulation structure of building of frame wall method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000320036A (en) |
-
1999
- 1999-05-12 JP JP11131356A patent/JP2000320036A/en active Pending
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