JP2000297386A - Plating method of magnesium alloy member, magnesium alloy plated member, and plating stripping method of the member - Google Patents
Plating method of magnesium alloy member, magnesium alloy plated member, and plating stripping method of the memberInfo
- Publication number
- JP2000297386A JP2000297386A JP11004538A JP453899A JP2000297386A JP 2000297386 A JP2000297386 A JP 2000297386A JP 11004538 A JP11004538 A JP 11004538A JP 453899 A JP453899 A JP 453899A JP 2000297386 A JP2000297386 A JP 2000297386A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- magnesium alloy
- layer
- copper
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 84
- 229910000861 Mg alloy Inorganic materials 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000010410 layer Substances 0.000 claims abstract description 40
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 15
- 239000011651 chromium Substances 0.000 claims abstract description 15
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 11
- 239000011701 zinc Substances 0.000 claims abstract description 11
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000006467 substitution reaction Methods 0.000 claims abstract description 9
- 239000012670 alkaline solution Substances 0.000 claims abstract description 8
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims abstract description 8
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000002344 surface layer Substances 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 238000005868 electrolysis reaction Methods 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 15
- 230000007797 corrosion Effects 0.000 abstract description 15
- 239000000243 solution Substances 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 24
- 238000005238 degreasing Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 230000004913 activation Effects 0.000 description 6
- 238000004064 recycling Methods 0.000 description 6
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 3
- 235000011180 diphosphates Nutrition 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 102220411551 c.74G>T Human genes 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007333 cyanation reaction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- -1 fluorine ions Chemical class 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 238000010119 thixomolding Methods 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
(57)【要約】
【課題】 リサイクルが容易なマグネシウム合金め
っき部材を提供し、さらに該部材からめっき被膜を確実
に剥離できる方法を提供する。
【解決手段】 マグネシウム合金からなる被メッキ物に
亜鉛置換を施した後、シアン化浴銅めっき、ピロリン酸
銅めっきを順次行い、その上層にクロムめっきを行う。
このマグネシウム合金めっき部材をアルカリ液中で電解
して該部材表層部からめっき被膜を剥離させる。
【効果】 クロムめっき層が下層に確実に密着形成
され、耐食性および耐久性に優れためっき被膜が形成さ
れる。この被膜は、マグネシウム合金部材の腐食を効果
的に防止しており、リサイクル性を向上させる。
PROBLEM TO BE SOLVED: To provide a magnesium alloy plated member which is easy to recycle, and to provide a method capable of reliably peeling a plating film from the member. SOLUTION: After an object to be plated made of a magnesium alloy is subjected to zinc substitution, copper cyanide plating and copper pyrophosphate plating are sequentially performed, and chromium plating is performed thereon.
The magnesium alloy plated member is electrolyzed in an alkaline solution to peel off a plating film from a surface layer of the member. [Effect] The chromium plating layer is securely formed in close contact with the lower layer, and a plating film having excellent corrosion resistance and durability is formed. This coating effectively prevents corrosion of the magnesium alloy member and improves recyclability.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、マグネシウム合金
部材のめっき方法、該方法により得られるめっき部材お
よび該めっき部材からめっき被膜を剥離させる剥離方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for plating a magnesium alloy member, a plated member obtained by the method, and a method for removing a plating film from the plated member.
【0002】[0002]
【従来の技術】マグネシウム合金は比重が約1.8Mg
/m3と、実用金属中もっとも小さく、唯一プラスチッ
クに匹敵しうる軽量金属材料である。そのため、ポータ
ブル電子機器や輸送機器部材には最適の材料であり、近
年特に注目されている。またリサイクルの点で、プラス
チックに比べて地球環境に対する負荷が小さいという特
徴を有しており、家電製品を中心として実用化が進行し
ている。このマグネシウム合金を量産する工法には、ダ
イカスト法とチクソモールディング法とがあるが、作業
者の安全性と対環境性という観点から後者が急速に普及
してきている。これらマグネシウム合金の表面処理に関
しては、耐食性という観点から化成処理や陽極酸化など
が一般的に行われているが、導電性や熱伝導性および耐
摩耗性を付与するためには金属めっきが必要となる。従
来のマグネシウム合金への金属めっき方法は、所定の前
処理後、亜鉛置換、シアン化浴銅めっき、無電解ニッケ
ルめっきを行うのが基本であり、さらに銀や金めっき、
あるいは蒸着、スパッタリング、イオンプレーティング
などの乾式めっきによりアルミニウムなどを形成する方
法も知られている。2. Description of the Related Art Magnesium alloy has a specific gravity of about 1.8 Mg.
And / m 3, utility metals in most small, lightweight metallic material capable of comparable only plastic. Therefore, it is the most suitable material for portable electronic devices and transportation equipment members, and has been particularly noted in recent years. In addition, in terms of recycling, it has a feature that the burden on the global environment is smaller than that of plastic, and its practical application is progressing mainly in home electric appliances. Methods for mass-producing this magnesium alloy include a die casting method and a thixomolding method. The latter method is rapidly spreading from the viewpoint of worker safety and environmental friendliness. Regarding the surface treatment of these magnesium alloys, chemical conversion treatment and anodic oxidation are generally performed from the viewpoint of corrosion resistance, but metal plating is required to impart conductivity, thermal conductivity and wear resistance. Become. A conventional metal plating method for a magnesium alloy is basically to perform zinc substitution, copper plating of a cyanide bath, and electroless nickel plating after a predetermined pretreatment, and further, silver or gold plating,
Alternatively, a method of forming aluminum or the like by dry plating such as evaporation, sputtering, or ion plating is also known.
【0003】[0003]
【発明が解決しようとする課題】しかし、従来のめっき
方法によって最表面に形成されるニッケル被覆は、耐食
性が十分ではなく、マグネシウム合金素材の耐食性を劣
化させるため、マグネシウム合金のリサイクルが難しく
なるという問題がある。また、その他のめっき材料であ
る金や銀はめっき液原料として高価であり、乾式めっき
は膜厚が数ミクロン程度で耐摩耗性に劣る上、工程が複
雑となり、また設備が高価になるという問題がある。本
発明はこれらの問題点を解決して、比較的安価で、かつ
リサイクル性に優れた金属めっきが得られるめっき方法
および該めっき被膜を有するめっき部材ならびに該めっ
き被膜の剥離方法を提供するためになされたものであ
る。However, the nickel coating formed on the outermost surface by the conventional plating method does not have sufficient corrosion resistance and deteriorates the corrosion resistance of the magnesium alloy material, making it difficult to recycle the magnesium alloy. There's a problem. In addition, other plating materials such as gold and silver are expensive as raw materials for a plating solution, and dry plating has a thickness of several microns, is inferior in abrasion resistance, requires a complicated process, and is expensive. There is. The present invention has been made to solve these problems, and to provide a relatively inexpensive plating method capable of obtaining metal plating with excellent recyclability, a plating member having the plating film, and a method of peeling the plating film. It was done.
【0004】[0004]
【課題を解決するための手段】上記課題を解決するため
本発明のマグネシウム合金部材のめっき方法は、マグネ
シウム合金からなる被めっき物に亜鉛置換を施した後、
シアン化浴銅めっき、ピロリン酸銅めっきを順次行い、
その上層にクロムめっきを行うことを特徴とする。In order to solve the above-mentioned problems, a method for plating a magnesium alloy member according to the present invention comprises the steps of:
Copper cyanide bath plating and copper pyrophosphate plating are sequentially performed,
The chromium plating is performed on the upper layer.
【0005】また、本発明のマグネシウム合金めっき部
材は、合金部材表面に亜鉛置換層、ストライク銅めっき
層、電解めっき層および硬質クロムめっき層が順次形成
されていることを特徴とする。[0005] A magnesium alloy plated member of the present invention is characterized in that a zinc substitution layer, a strike copper plated layer, an electrolytic plated layer and a hard chromium plated layer are sequentially formed on the surface of the alloy member.
【0006】さらに、本発明のマグネシウム合金めっき
部材のめっき剥離方法のうち第1の発明は、上記発明の
マグネシウム合金めっき部材をアルカリ液中で電解して
該部材表層部からめっき被膜を剥離させることを特徴と
する。第2の発明のマグネシウム合金めっき部材のめっ
き剥離方法は、第1の発明のめっき剥離方法において、
電解の前処理として機械的な研磨工程を含むことを特徴
とする。Further, a first aspect of the method of stripping a magnesium alloy plated member of the present invention is to electrolyze a magnesium alloy plated member of the above invention in an alkaline solution to strip a plating film from a surface layer of the member. It is characterized by. The plating stripping method for a magnesium alloy plated member according to a second invention is the plating stripping method according to the first invention,
It is characterized in that a mechanical polishing step is included as a pretreatment for electrolysis.
【0007】[0007]
【発明の実施の形態】本発明では、各種のマグネシウム
合金部材を被めっき物として使用することができ、その
組成や形状、用途等については特に限定されるものでは
ない。上記マグネシウム合金部材にめっきを施すに当た
っては、通常は前処理が行われる。この前処理として
は、図1、2に示すように、機械研磨、脱脂、酸洗い、
エッチング、活性化処理が挙げられる。上記機械研磨と
しては、バフ研磨、バレル研磨等を挙げることができ
る。この機械研磨は、前処理としては特に必須というも
のではないが、汚染物質を効果的に除去できるため、図
1に示すように、後の脱脂処理等の負担を軽減すること
ができる。次に行われる脱脂では、合金部材表面の酸化
物やよごれ等が除去される。この脱脂では、図1、2に
示されるように、有機溶剤やアルカリ液等が用いられ
る。これらの脱脂では合金部材を浸漬したり、ブラシ等
に溶液をつけて部材をこする等の方法が採られる。ま
た、図2に示すように、アルカリ液等によって電解脱脂
を行うことも可能である。上記の脱脂は、一つの方法で
も良く、また複数の方法を組み合わせて複数工程により
脱脂を行うものであってもよい。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, various magnesium alloy members can be used as an object to be plated, and their compositions, shapes, uses, and the like are not particularly limited. When plating the magnesium alloy member, a pretreatment is usually performed. As this pretreatment, as shown in FIGS. 1 and 2, mechanical polishing, degreasing, pickling,
Etching and activation processing are mentioned. Examples of the mechanical polishing include buff polishing and barrel polishing. This mechanical polishing is not particularly essential as a pretreatment, but it can effectively remove contaminants, so that the burden of subsequent degreasing treatment can be reduced as shown in FIG. In the subsequent degreasing, oxides and dirt on the surface of the alloy member are removed. In this degreasing, as shown in FIGS. 1 and 2, an organic solvent, an alkaline solution, or the like is used. In such degreasing, a method of immersing the alloy member or rubbing the member by applying a solution to a brush or the like is employed. In addition, as shown in FIG. 2, electrolytic degreasing can be performed using an alkaline solution or the like. The above-described degreasing may be performed by one method, or may be performed by combining a plurality of methods and performing degreasing in a plurality of steps.
【0008】上記脱脂後は、図1に示すように、所望に
より酸洗い(酸処理)を行うことができ、酸洗い後は、
中性化するためにアルカリ洗い(アルカリ処理)を行う
こともできる。なお、上記した機械研磨を施したもので
は、汚れの除去が十分になされているため、この酸洗い
(およびアルカリ洗い)を省略することも可能である。
上記処理後には、酸性浴を用いたエッチング処理を行う
が、電解脱脂を行ったものでは、電解作用によってこの
エッチング処理を省略することもできる(図2)。After the degreasing, as shown in FIG. 1, pickling (acid treatment) can be performed if desired.
Alkali washing (alkali treatment) can also be performed for neutralization. In the case of the above-mentioned mechanical polishing, dirt is sufficiently removed, so that the acid washing (and the alkali washing) can be omitted.
After the above treatment, an etching treatment using an acidic bath is performed. However, in the case where electrolytic degreasing is performed, this etching treatment can be omitted by an electrolytic action (FIG. 2).
【0009】その後、酸化物の除去等を目的にフッ素イ
オンを含む酸性溶液等によって活性化処理がなされる。
活性化処理後は、亜鉛置換処理がなされる。この処理で
は硫酸亜鉛やピロリン酸塩等を含む浴を用いて合金部材
の表面に亜鉛めっき層を形成する。該浴には一般にアル
カリ性浴が用いられる。この処理においては亜鉛めっき
層が合金部材の表面に強固に密着して形成される。Thereafter, activation treatment is performed with an acidic solution containing fluorine ions for the purpose of removing oxides and the like.
After the activation treatment, a zinc substitution treatment is performed. In this treatment, a zinc plating layer is formed on the surface of the alloy member using a bath containing zinc sulfate, pyrophosphate or the like. Generally, an alkaline bath is used for the bath. In this process, the galvanized layer is formed in tight contact with the surface of the alloy member.
【0010】上記亜鉛置換の後は、その上層にシアン化
浴銅めっきを施す。このめっきでは、公知のシアン化浴
を用いて電解めっきを施すことができ、例えばシアン化
銅、シアン化ナトリウムを含む浴等を用いてめっきを行
う。めっきの際の電解条件は本発明としては特に限定さ
れないが、電流密度4〜6A/dm2の範囲を例示でき
る。この際に形成する銅めっき層の厚さは、2〜6μm
とするのが望ましい。さらに、この上層にはピロリン酸
銅めっきを施す。このピロリン酸めっきでは、ピロリン
酸銅やピロリン酸カリを含む電解液等を用いて電解メッ
キを行う。上記の電解条件は上記シアン化浴銅めっきと
同様にこの発明としては特に限定されるものではない
が、電流密度2〜6A/dm2の範囲を例示できる。ま
た、この浴を用いた電解により形成される銅めっき層の
厚さは、6〜13μm厚とするのが望ましい。このピロ
リン酸銅メッキによれば、ピンホールのない緻密で密着
性の優れたメッキ層が得られる。After the zinc substitution, the upper layer is subjected to copper plating in a cyanating bath. In this plating, electrolytic plating can be performed using a known cyanation bath. For example, plating is performed using a bath containing copper cyanide or sodium cyanide. The electrolysis conditions at the time of plating are not particularly limited as the present invention, and examples thereof include a current density of 4 to 6 A / dm 2 . The thickness of the copper plating layer formed at this time is 2 to 6 μm.
It is desirable that Further, this upper layer is plated with copper pyrophosphate. In this pyrophosphate plating, electrolytic plating is performed using an electrolytic solution or the like containing copper pyrophosphate or potassium pyrophosphate. Although the above-mentioned electrolysis conditions are not particularly limited as the present invention like the above-mentioned copper plating of the cyanide bath, a current density in the range of 2 to 6 A / dm 2 can be exemplified. The thickness of the copper plating layer formed by electrolysis using this bath is desirably 6 to 13 μm. According to this copper pyrophosphate plating, a plated layer having no pinholes and having excellent adhesion can be obtained.
【0011】これらの2層の銅めっき層を形成すること
により、上層に直接にクロムめっきを施すことができ
る。クロムめっき層は優れた耐食性を有しており、マグ
ネシウム合金の腐食を防止してリサイクルを容易にす
る。このクロムめっき層にはさらにバフ研磨等により研
磨を行うことにより、導電性や耐摩耗性のみならず、光
沢のある装飾メッキとしての用途が可能となる。上記に
よりめっきが施されたマグネシウム合金部材は、優れた
耐食性に加えて、良好な導電性や耐摩耗性、熱伝導性を
有しており、優れた表面性状を有している。By forming these two copper plating layers, chrome plating can be applied directly to the upper layer. The chromium plating layer has excellent corrosion resistance, prevents corrosion of the magnesium alloy, and facilitates recycling. By polishing the chromium plating layer by buffing or the like, not only conductivity and abrasion resistance but also glossy decorative plating can be used. The magnesium alloy member plated according to the above has excellent conductivity, abrasion resistance, and thermal conductivity in addition to excellent corrosion resistance, and has excellent surface properties.
【0012】本発明のめっき方法により得られるマグネ
シウム合金部材は、使用後、リサイクルを目的として、
所望によりバフ研磨等の研磨により汚れを除去した後、
アルカリ液中で電解処理される。アルカリ液としては炭
酸ソーダー等を用いることができ、このときの電解条件
としては2〜8Vの電解電圧を示すことができる。この
電解により、銅およびクロムめっきがマグネシウム合金
から確実に剥離され、該マグネシウム合金を再利用する
ことが可能になる。なお、電解に先立って上記した研磨
を行うことにより電解によるめっき層の剥離が一層確実
になされる。[0012] The magnesium alloy member obtained by the plating method of the present invention is used for recycling after use.
After removing dirt by polishing such as buffing if desired,
It is electrolyzed in an alkaline solution. Sodium carbonate or the like can be used as the alkaline liquid, and the electrolysis conditions at this time can be an electrolysis voltage of 2 to 8 V. This electrolysis reliably removes the copper and chromium plating from the magnesium alloy, making it possible to reuse the magnesium alloy. By performing the above-described polishing prior to the electrolysis, the plating layer can be more reliably separated by the electrolysis.
【0013】[0013]
【実施例】以下、本発明の一実施例を説明する。まずA
l、Zn、Mnを含有し、残部マグネシウムからなる合
金素材を、トルエン含有からなる有機溶剤に2〜8分浸
漬して溶剤脱脂し、さらに炭酸ソーダーからなるアルカ
リ性浴中に4〜10分浸漬して脱脂した。その後、リン
酸からなる酸性浴中にて酸処理した後、水酸化ナトリウ
ム浴中にてアルカリ処理した。次に無水クロム酸系の液
を用いて酸化膜を除去(エッチング)し、リン酸系の液
を用いて素材の表面を活性化した。An embodiment of the present invention will be described below. First A
The alloy material containing l, Zn, Mn and the balance magnesium is immersed in an organic solvent containing toluene for 2 to 8 minutes to degrease the solvent, and further immersed in an alkaline bath composed of sodium carbonate for 4 to 10 minutes. Degreased. Then, after performing an acid treatment in an acidic bath composed of phosphoric acid, an alkali treatment was performed in a sodium hydroxide bath. Next, the oxide film was removed (etched) using a chromic anhydride-based solution, and the surface of the material was activated using a phosphoric acid-based solution.
【0014】また、他の供試材として、上記と同じ合金
素材を用いて、バフ研磨を行った後、上記と同様のアル
カリ性浴で脱脂を行い、上記と同じ、エッチング、活性
化を行った。この工程では、機械研磨によって前記供試
材に比べて活性化前の工程が簡略化され、全体の作業時
間が約半分となった。なお、その表面性状は前記供試材
と異なるところはなかった。As another test material, buffing was performed using the same alloy material as above, followed by degreasing in the same alkaline bath as above, and etching and activation as above. . In this step, the step before activation was simplified by mechanical polishing compared to the test material, and the entire work time was reduced by about half. The surface properties were not different from those of the test materials.
【0015】次いで、両供試材を水酸化ナトリウムから
なるアルカリ性浴中で亜鉛置換し、青化第一銅含有から
なるシアン浴中で4〜6A/dm2の電解条件でシアン
化浴銅めっき層を約4μm厚に形成した。さらにその上
層には、ピロリン酸銅含有からなるピロリン酸浴中で、
2〜6A/dm2の電解条件で厚付銅めっき層を約6μ
m厚に形成した。この上層には、さらに無水クロム酸含
有からなる酸性浴中で、電解条件10〜40A/dm2
で電解クロムめっきを行い、その表面をバフ研磨して光
沢仕上げした。Next, both test materials were zinc-substituted in an alkaline bath composed of sodium hydroxide, and copper plating was carried out in a cyanide bath containing cuprous cyanide under electrolysis conditions of 4 to 6 A / dm 2. The layer was formed to a thickness of about 4 μm. Further, in the upper layer, in a pyrophosphate bath containing copper pyrophosphate,
Under electrolytic conditions of 2 to 6 A / dm 2 , the thick copper plating layer
m thickness. This upper layer was further subjected to electrolytic conditions of 10 to 40 A / dm 2 in an acidic bath containing chromic anhydride.
And electrochromic plating was performed, and the surface was buffed and polished.
【0016】一方、従来法として、上記活性化処理を施
した供試材に対し、上記と同じシアン化浴を用いて、電
解条件4〜6A/dm2で4μm厚のストライク銅めっ
きを施し、その上層に、8〜14μm厚の電解ニッケル
めっきを行った。また、比較例として、上記ストライク
銅めっき上に、1〜3μm厚の電解クロムめっきを施し
た。しかし、この比較例ではピット、ピンホールが生
じ、素材表面の腐食の不具合があった。On the other hand, as a conventional method, a 4 μm-thick strike copper plating is applied to the test material which has been subjected to the above-mentioned activation treatment under electrolytic conditions of 4 to 6 A / dm 2 using the same cyanation bath as above. The upper layer was subjected to electrolytic nickel plating having a thickness of 8 to 14 μm. As a comparative example, electrolytic chrome plating having a thickness of 1 to 3 μm was performed on the strike copper plating. However, in this comparative example, pits and pinholes were generated, and there was a problem of corrosion of the material surface.
【0017】上記した発明材と従来材について、JIS
H 8502からなる耐食性試験を行ったところ、発
明材では、以下に示すように優れた耐食性を示したのに
対し、従来材では耐食性に劣っていた。 (耐食性試験結果) JIS H 8502 中性塩水噴霧試験による 24時間の発明材 レイティングNo.9.5以上 従来材 レイティングNo.7.5以上The above-mentioned invention material and conventional material are described in JIS.
When a corrosion resistance test comprising H8502 was performed, the inventive material showed excellent corrosion resistance as shown below, whereas the conventional material was inferior in corrosion resistance. (Results of Corrosion Resistance Test) JIS H8502 Inventive material for 24 hours by neutral salt spray test. 9.5 or more Conventional material Rating No. 7.5 or more
【0018】次いで、上記発明材および従来材につい
て、バフ研磨した後、シアンおよびキレート剤を含む炭
酸ソーダーからなるアルカリ液中で、電解条件2〜8V
で電解を行い、銅めっき層およびクロムめっき層を剥離
した。めっき被膜剥離後の供試材表面を電子線マイクロ
アナライザーとオージェ電子分光分析により分析したと
ころ、発明材ではクロム、銅はともに検出されなかっ
た。一方、従来材では、ニッケル、銅共に検出され素材
も腐食が有り、スマット(酸化物)が除去出来ていなか
った。従って、発明材では、めっき被膜剥離後の素材表
面には、めっき成分が残留しておらず、リサイクル時に
も不純物の混入がほとんど無く、リサイクルを容易に行
うことができる。一方、従来材では、酸化物等の混入が
あるため、リサイクルが容易でないことが明らかであ
る。Next, after buffing the above-mentioned invention material and the conventional material, they are subjected to electrolysis conditions of 2 to 8 V in an alkaline solution comprising sodium carbonate containing cyan and a chelating agent.
And the copper plating layer and the chromium plating layer were peeled off. When the surface of the test material after the plating film was removed was analyzed by an electron beam microanalyzer and Auger electron spectroscopy, neither chromium nor copper was detected in the invention material. On the other hand, in the conventional material, both nickel and copper were detected, and the material was corroded, and smut (oxide) could not be removed. Therefore, in the material of the present invention, no plating component remains on the material surface after the plating film is peeled off, and almost no impurities are mixed during recycling, and recycling can be performed easily. On the other hand, in the conventional material, it is apparent that recycling is not easy because of mixing of oxides and the like.
【0019】[0019]
【発明の効果】以上説明したように、本発明のマグネシ
ウム合金部材のめっき方法によれば、マグネシウム合金
からなる被めっき物に亜鉛置換を施した後、シアン化浴
銅めっき、ピロリン酸銅めっきを順次行い、その上層に
クロムめっきを行うので、表層のクロムめっき層が下層
に確実に密着して形成され、耐食性および耐久性に優れ
ためっき被膜が形成される。As described above, according to the method of plating a magnesium alloy member of the present invention, after subjecting a plating object made of a magnesium alloy to zinc substitution, copper plating of a cyanide bath and copper pyrophosphate plating are performed. Since the chromium plating is performed successively and the chromium plating is performed on the upper layer, the chromium plating layer on the surface layer is formed in close contact with the lower layer without fail, and a plating film having excellent corrosion resistance and durability is formed.
【0020】また、本発明のマグネシウム合金めっき部
材によれば、合金部材表面に亜鉛置換層、ストライク銅
めっき層、電解めっき層および硬質クロムめっき層が順
次形成されているので、そのめっき層により優れた耐食
性が得られるとともに被膜の耐久性にも優れている。ま
た、本発明のマグネシウム合金めっき部材のめっき剥離
方法によれば、このめっき部材をアルカリ液中で電解し
て該部材表層部からめっき被膜を剥離させるので、めっ
き層が確実に部材表面から剥離され、しかも得られた部
材の腐食が抑えられているので、容易にリサイクル化す
ることができる。Further, according to the magnesium alloy plated member of the present invention, since a zinc substitution layer, a strike copper plated layer, an electrolytic plated layer and a hard chromium plated layer are sequentially formed on the surface of the alloy member, the plated layer is more excellent. Corrosion resistance and excellent coating durability. According to the method for stripping a magnesium alloy plated member of the present invention, the plated member is electrolyzed in an alkaline solution to peel a plating film from a surface layer of the member, so that the plated layer is reliably separated from the member surface. In addition, since the obtained members are suppressed from being corroded, they can be easily recycled.
【図1】 本発明の実施形態を示す工程図である。FIG. 1 is a process chart showing an embodiment of the present invention.
【図2】 同じく他の実施形態を示す工程図である。FIG. 2 is a process chart showing another embodiment.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C25F 1/00 C25F 1/00 (72)発明者 中津川 勲 広島県広島市安芸区船越南1丁目6番1号 株式会社日本製鋼所内 (72)発明者 高安 秀徳 広島県広島市安芸区船越南1丁目6番1号 株式会社日本製鋼所内 (72)発明者 八木 英紀 山口県防府市浜方古浜62−1 中国電化工 業株式会社内 Fターム(参考) 4K023 AA11 AA15 AA19 BA01 BA06 BA11 BA12 DA04 EA01 4K024 AA02 AA05 AA09 AB04 BA05 BB02 BB18 DA02 DA03 DA04 DA05 DA06 DA07 DA08 DA09 GA04 GA16 4K044 AA06 BA02 BA06 BA10 BB05 BC02 CA04 CA15 CA18 CA67──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI theme coat ゛ (Reference) C25F 1/00 C25F 1/00 (72) Inventor Isao Nakatsugawa 1-6, Funakoshiminami, Aki-ku, Hiroshima-shi, Hiroshima No. 1 Inside Japan Steel Works Co., Ltd. (72) Inventor Hidenori Takayasu 1-6-1, Funakoshi Minami, Aki-ku, Hiroshima City, Hiroshima Prefecture Inside Japan Steel Works Co., Ltd. (72) Inventor Hideki Yagi 62-1 Hamakata Furama, Hofu City Yamaguchi Prefecture China F-term (reference) in Eka Kogyo Co., Ltd.
Claims (4)
亜鉛置換を施した後、シアン化浴銅めっき、ピロリン酸
銅めっきを順次行い、その上層にクロムめっきを行うこ
とを特徴とするマグネシウム合金部材のめっき方法1. A magnesium alloy member, comprising: subjecting an object to be plated made of a magnesium alloy to zinc substitution; sequentially performing copper cyanide plating and copper pyrophosphate plating; and performing chromium plating on an upper layer thereof. Plating method
銅めっき層、電解めっき層および硬質クロムめっき層が
順次形成されていることを特徴とするマグネシウム合金
めっき部材2. A magnesium alloy plating member, wherein a zinc substitution layer, a strike copper plating layer, an electrolytic plating layer and a hard chromium plating layer are sequentially formed on the surface of the alloy member.
部材をアルカリ液中で電解して該部材表層部からめっき
被膜を剥離させることを特徴とするマグネシウム合金め
っき部材のめっき剥離方法3. A method for removing a plating of a magnesium alloy plating member, comprising: electrolyzing the magnesium alloy plating member according to claim 2 in an alkaline solution to remove a plating film from a surface layer of the member.
含むことを特徴とする請求項3記載のマグネシウム合金
めっき部材のめっき剥離方法4. The method of claim 3, further comprising a mechanical polishing step as a pretreatment for the electrolysis.
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JP00453899A JP3604572B2 (en) | 1999-01-11 | 1999-01-11 | Plating method of magnesium alloy member, magnesium alloy plated member, and plating stripping method of the member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP00453899A JP3604572B2 (en) | 1999-01-11 | 1999-01-11 | Plating method of magnesium alloy member, magnesium alloy plated member, and plating stripping method of the member |
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JP2000297386A true JP2000297386A (en) | 2000-10-24 |
JP3604572B2 JP3604572B2 (en) | 2004-12-22 |
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Cited By (7)
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---|---|---|---|---|
JP2007227906A (en) * | 2006-01-25 | 2007-09-06 | Toray Ind Inc | Conductive substrate and its manufacturing method |
KR100872113B1 (en) | 2008-03-21 | 2008-12-05 | 주식회사 창성에이스산업 | Surface treatment method of magnesium plate |
JP2009504923A (en) * | 2005-08-17 | 2009-02-05 | マクダーミッド インコーポレーテッド | Pretreatment of magnesium substrate for electroplating |
JP2009120869A (en) * | 2007-11-12 | 2009-06-04 | Ast:Kk | Magnesium alloy material plating method and plated product |
JP2010285660A (en) * | 2009-06-12 | 2010-12-24 | Taiho Kogyo Co Ltd | Method for tin plating on magnesium alloy and etching solution for magnesium alloy |
CN105040046A (en) * | 2015-07-24 | 2015-11-11 | 苏州华冲精密机械有限公司 | Electroplate liquid for electroplating copper film |
US11890831B2 (en) | 2019-04-02 | 2024-02-06 | Sumitomo Electric Industries, Ltd. | Composite member and heat radiation member |
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1999
- 1999-01-11 JP JP00453899A patent/JP3604572B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009504923A (en) * | 2005-08-17 | 2009-02-05 | マクダーミッド インコーポレーテッド | Pretreatment of magnesium substrate for electroplating |
JP2007227906A (en) * | 2006-01-25 | 2007-09-06 | Toray Ind Inc | Conductive substrate and its manufacturing method |
JP2009120869A (en) * | 2007-11-12 | 2009-06-04 | Ast:Kk | Magnesium alloy material plating method and plated product |
KR100872113B1 (en) | 2008-03-21 | 2008-12-05 | 주식회사 창성에이스산업 | Surface treatment method of magnesium plate |
JP2010285660A (en) * | 2009-06-12 | 2010-12-24 | Taiho Kogyo Co Ltd | Method for tin plating on magnesium alloy and etching solution for magnesium alloy |
CN105040046A (en) * | 2015-07-24 | 2015-11-11 | 苏州华冲精密机械有限公司 | Electroplate liquid for electroplating copper film |
US11890831B2 (en) | 2019-04-02 | 2024-02-06 | Sumitomo Electric Industries, Ltd. | Composite member and heat radiation member |
Also Published As
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