JP2000294703A - Fixing structure of heat generating part to radiation board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the occurrence of cracks in a heat generating part by integrally inserting a thermal shrinkage tube so that it surrounds the heat generating part and the radiation board, heating and shrinking the heat shrinkage tube and fixing the heat radiation part to the radiation board. SOLUTION: A heat generating part 2 and a radiation board are installed closely on a substrate 1. An annular thermal shrinkage tube made of a polyolefin resin or a vinyl chloride resin is integrally inserted so that it surrounds the heat generation part 2 and the radiation board 3. The heat generating part 2 and the radiation board 3 are fixed by heating and shrinking the thermal shrinkage tube 4. At the time of fixing the heat generating part 2 to the radiation board 3, screwing is not required, the occurrence of a crack is prevented in the heat generating part 2 and fixing work can easily be executed with simple structure. Thus, cost can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fixing structure for fixing a heat-generating component to a heat-radiating plate, wherein the heat-generating component provided on a substrate is fixed to a heat-radiating plate provided near the heat-generating member. About.

[0002]

2. Description of the Related Art Heretofore, in order to fix a heat-generating component to a heat sink erected on a substrate, the heat-generating component has been fixed to the heat sink by screwing. However, there is a problem in that when the screws are fixed by the screwing, if the tightening torque of the screws is high, cracks are generated in the heat-generating components, which may result in defective products.

Japanese Patent Application Laid-Open No. 8-8371 discloses a heat sink mounting structure for a semiconductor element. this is,
As shown in FIG. 4, in order to press the semiconductor element 102 mounted on the printed circuit board 101 onto the heat sink 103, the support lead 105 a is formed to have a substantially L-shape and extends at one end, while the other end of the heat sink 103 is provided at the other end. Locking claw 10 for locking to 103b
5b is formed so as to protrude from the heat sink 1
03 is inserted into the mounting hole of the printed circuit board 101 and fixed by soldering, and the support lead 105a of the crimping plate 105 is inserted and fixed into the mounting hole 101a provided on the substrate.
Further, the locking claw 105b is locked to the other side 103b of the heat radiating plate 103, the semiconductor element 102 and the insulator 104 are sandwiched between the pressure bonding plate 105 and the heat radiating plate 103, and between the semiconductor element 102 and the heat radiating plate 103. This is provided with an insulator 104 interposed.
However, in this case, as shown in FIG.
However, there is a problem in that the shape of the crimping plate 05 is complicated, and the work of attaching the crimping plate 105 is troublesome, and the cost is high.

In Japanese Utility Model Laid-Open Publication No. 6-21202,
A heat dissipation device for electrical components is described. This is shown in FIG.
(A) As shown in (b) and (c), the flat portion 215 of the heat sink 202 is attached to the flat portion 215 of the holding plate 203 having a U-shaped cross section.
The elastic piece portion 217 is cut and raised so as to be elastically deformable, and the elongated concave portion and the notched concave portion are cut along the vertical direction in the side plate portion of the holding plate 203 so that the engaging piece portion and the holding piece portion are formed. At the upper edge of the engagement piece, an engagement projection is formed on the upper edge of the engagement piece, which engages with the engagement hole 212 of the groove 211 formed in the flat heat dissipation plate 202 and projects toward the holding piece. The engaging projection is locked in the engaging hole 212, the radiating plate 202 is sandwiched between the engaging piece and the holding piece, and the holding plate 203 is attached to the radiating plate 202, and the electric component 206 is dissipated. Board 2
The elastic piece 217 is inserted and fixed while being elastically deformed so as to push up the elastic piece portion 217 in a gap between the support plate 203 and the holding plate 203. However, in this case, there is a problem that the shape of the holding plate 203 is complicated, and the work of attaching the holding plate 203 is troublesome, and the cost is increased.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and it is not necessary to use a screw when fixing a heat-generating component to a heat sink, and it is possible to prevent a crack from being generated in the heat-generating component. It is an object of the present invention to provide a structure for fixing a heat-generating component to a heat radiating plate, which can be performed, has a very simple structure, can easily perform fixing work, and can reduce cost.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned conventional problems, the invention according to claim 1 is characterized in that a heat-generating component and a heat-radiating plate which are erected close to each other on a substrate are provided with these heat-generating components. A heat-shrinkable tube is integrally inserted so as to surround the heat-dissipating plate, and the heat-shrinkable tube is heated and contracted to fix the heat-generating component to the heat-dissipating plate.

According to a second aspect of the present invention, the heat radiating plate has a tube insertion groove formed at a position located near both ends of the heat-generating component, and the heat-shrinkable tube is inserted into the tube insertion groove. Thus, the heat-shrinkable tube is inserted into the heat-generating component and the heat radiating plate integrally, and the heat-shrinkable tube is heated to fix the heat-generating component to the heat radiating plate. And The invention according to claim 3 is characterized in that the heat-shrinkable tube is formed of a polyolefin resin or a vinyl chloride resin.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a fixing structure of a heat generating component to a heat sink according to the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a fixing structure of a heat generating component to a heat sink according to a first embodiment of the present invention, FIG. 2 is a perspective view showing a fixing structure of a heat generating component to a heat sink according to a second embodiment, and FIG. It is a perspective view showing an example of the heat contraction tube used for each embodiment of the present invention.

The fixing structure of the heat-generating component to the heat-dissipating plate of the first embodiment shown in FIG. 1 includes a heat-generating component 2 and a heat-dissipating plate 3 erected close to each other on a substrate 1. A ring-shaped heat-shrinkable tube 4 surrounding the plate 3 (see FIG. 3)
And the heat-shrinkable tube 4 is heated and shrunk to fix the heat-generating component 2 to the heat-radiating plate 3. The heat-shrinkable tube 4 is preferably formed of a polyolefin resin or a vinyl chloride resin.

According to the fixing structure of the heat-generating component to the heat-radiating plate of the first embodiment, the heat-generating component 2 is fixed to the heat-radiating plate 3 by the heat-shrinkable tube 4. It is not necessary to use screws to fix the heat-generating component 2 when fixing the heat-generating component 2, and the structure is extremely simple and the fixing operation can be easily performed, thereby reducing the cost. it can.

In the heat radiating structure for a heat-generating component according to the second embodiment shown in FIG. 2, tube insertion grooves 31 and 32 are formed in the heat radiating plate 3 at positions near both ends of the heat-generating component 2. By inserting the heat-shrinkable tube 4 into the heat-shrinkable tubes 31 and 32, the heat-shrinkable tube 4 is heated, and the heat-shrinkable tube 4 is heated. Is fixed to the heat sink 3. The heat-shrinkable tube 4 is preferably formed of a polyolefin resin or a vinyl chloride resin.

According to the fixing structure of the heat-generating component to the heat-radiating plate of the second embodiment, the heat-generating component 2 is fixed to the heat-radiating plate 3 by the heat-shrinkable tube 4. It is not necessary to use screws to fix the heat-generating component 2 when fixing the heat-generating component 2, and the structure is extremely simple and the fixing operation can be easily performed, thereby reducing the cost. it can. In addition, tube insertion grooves 31 and 32 are formed on the heat sink 3 at positions near both ends of the heat-generating component 2.
Since the heat-shrinkable tube 4 is inserted into each of the heat-shrinkable tubes 1 and 32, the gap between the heat-shrinkable tube 4 and the heat radiating plate 3 can be reduced, and the heat-generating component 2 can be brought into close contact with the heat radiating plate 3. By heating and shrinking the heat-shrinkable tube 4, the heat-generating component 2 can be securely fixed to the heat sink 3.

[0013]

As described above, according to the first aspect of the present invention, a heat-shrinkable tube is inserted so as to surround a heat-generating component and a heat-dissipating plate, which are erected close to a substrate. By heating and shrinking the heat-shrinkable tube, the heat-generating component is fixed to the heat radiating plate. Therefore, when the heat-generating component is fixed to the heat radiating plate, it is not necessary to fix the heat-generating component to the heat radiating plate. In addition, the structure is extremely simple, the fixing operation can be easily performed, and the cost can be reduced.

According to the second aspect of the present invention, the heat-shrinkable tube is heated by inserting the heat-shrinkable tube into the tube insertion groove provided at the position near both ends of the heat-generating component on the heat sink. Since the heat-generating component is fixed to the heat sink by shrinking, the gap between the heat-shrinkable tube and the heat sink can be reduced, and the heat-generating component can be in close contact with the heat sink, By heating and shrinking the heat-shrinkable tube, the heat-generating component can be reliably fixed to the radiator plate. According to the third aspect of the present invention, since the heat-shrinkable tube is formed of a polyolefin resin or vinyl chloride, these resins have good heat-shrinkability, so that when the heat-shrinkable tube is heated, the heat-shrinkable tube is reliably formed. The heat-generating component can be firmly fixed to the heat sink using the heat-shrinkable tube.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a fixing structure of a heat generating component to a heat sink according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a fixing structure of a heat generating component to a heat sink according to a second embodiment.

FIG. 3 is a perspective view showing an example of a heat-shrinkable tube used in each embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a conventional heat sink mounting structure for a semiconductor element.

5A and 5B show a conventional heat radiating device for an electric component, wherein FIG. 5A is a front view, FIG. 5B is a side view, and FIG. 5C is a plan view of a lower surface with a part thereof cut away.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Heating component 3 Heat sink 31 and 32 Tube insertion groove 4 Heat shrinkable tube

Claims (3)

[Claims] 1. A heat-shrinkable tube is integrally attached to a heat-generating component and a heat-radiating plate which are vertically installed on a substrate so as to surround the heat-generating component and the heat-radiating plate, and the heat-shrinkable tube is heated. The heat-generating component is fixed to the heat-dissipating plate by contracting the heat-generating component. 2. A tube insertion groove is formed in the heat radiating plate at positions near both ends of the heat-generating component, and the heat-shrinkable tube is inserted into the tube-insertion groove so that the heat-shrinkable tube is inserted into the tube. The heat generating component is fixed to the heat radiating plate by integrally inserting the heat generating component and the heat radiating plate, and heating the heat shrinkable tube to fix the heat generating component to the heat radiating plate. Fixing structure of heat generating parts to heat sink. 3. The fixing structure according to claim 1, wherein the heat-shrinkable tube is formed of a polyolefin resin or a vinyl chloride resin.