JP2000274788A - Heating device, cooling device, and air conditioner utilzing the cooling device - Google Patents
Heating device, cooling device, and air conditioner utilzing the cooling deviceInfo
- Publication number
- JP2000274788A JP2000274788A JP11079804A JP7980499A JP2000274788A JP 2000274788 A JP2000274788 A JP 2000274788A JP 11079804 A JP11079804 A JP 11079804A JP 7980499 A JP7980499 A JP 7980499A JP 2000274788 A JP2000274788 A JP 2000274788A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- heat
- air
- cooling
- air conditioner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 69
- 238000010438 heat treatment Methods 0.000 title claims abstract description 21
- 238000004378 air conditioning Methods 0.000 claims abstract description 6
- 238000009423 ventilation Methods 0.000 claims description 32
- 230000005679 Peltier effect Effects 0.000 claims description 23
- 239000002826 coolant Substances 0.000 claims description 15
- 239000000110 cooling liquid Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims 1
- 239000000498 cooling water Substances 0.000 abstract description 28
- 230000001276 controlling effect Effects 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 230000002528 anti-freeze Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
- Air Conditioning Control Device (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、2つの異種導体
(金属または半導体)に電圧を印加したときに生じる、
ペルティエの効果を利用して被加温体を加温する加温装
置、及び被冷却体を冷却する冷却装置、及びこの冷却装
置を使用した空調装置に関する。BACKGROUND OF THE INVENTION The present invention relates to the case where a voltage is applied to two different conductors (metal or semiconductor).
The present invention relates to a heating device that heats a body to be heated using the Peltier effect, a cooling device that cools a body to be cooled, and an air conditioner that uses the cooling device.
【0002】[0002]
【従来の技術】例えば、冷凍機能を有する車両では、冷
凍庫内の温度を低温に維持するために、ペルティエの効
果を利用した冷却装置を使用したものが多く採用されて
いる。周知のように、ペルティエの効果とは、2つの異
種導体(金属または半導体)に直流の電圧を印加する
と、2つの接合点のうち一方が熱を吸収し、他方が熱を
放出する現象のことであり、この原理を使用し冷凍庫の
内側を吸熱側とし、外側を放熱側とすれば冷凍庫の内部
を冷却することができる。2. Description of the Related Art For example, in a vehicle having a refrigerating function, in order to maintain the temperature in a freezer at a low temperature, a vehicle using a cooling device utilizing the Peltier effect is often used. As is well known, the Peltier effect is a phenomenon in which when a DC voltage is applied to two different types of conductors (metal or semiconductor), one of the two junctions absorbs heat and the other releases heat. Using this principle, the inside of the freezer can be cooled if the inside of the freezer is the heat absorbing side and the outside is the heat radiating side.
【0003】このような、ペルティエの効果を利用した
冷却装置では、2種の導体の大きさ、材質等により、吸
熱側と放熱側との温度差が略一定に決定される。例え
ば、温度差46℃といったように決定されるので、放熱
側を約25℃の外気とすれば、吸熱側はそれよりも46
℃低い−21℃となる。つまり、ペルティエ効果を利用
した冷却装置に直流の電圧を印加し続けると、これを搭
載した冷凍庫内の温度は、余儀なく−21℃程度となっ
てしまうので、従来より、この温度を制御するために、
冷凍庫内の温度を測定しこの温度が所望温度となるよう
に直流電源をオン、オフ操作している。In such a cooling device utilizing the Peltier effect, the temperature difference between the heat-absorbing side and the heat-dissipating side is determined to be substantially constant by the size, material, and the like of the two types of conductors. For example, since the temperature difference is determined to be 46 ° C., if the heat radiation side is set to the outside air of about 25 ° C., the heat absorption side becomes 46 ° C.
It will be -21 ° C lower by ° C. That is, if a DC voltage is continuously applied to the cooling device using the Peltier effect, the temperature in the freezer in which the cooling device is mounted is forced to be about −21 ° C. ,
The temperature inside the freezer is measured, and the DC power supply is turned on and off so that the temperature becomes a desired temperature.
【0004】このため、所定の温度を維持するために頻
繁なオン、オフ動作が必要であり、且つ、温度が一定値
で安定しにくいという欠点があるため、冷凍庫のように
多少の温度変化を許容できるものについては採用するこ
とができるが、室内の空調装置のように、常に安定した
温度が望まれる用途としては不向きである。[0004] For this reason, frequent on / off operations are required to maintain a predetermined temperature, and there is a drawback that the temperature is difficult to stabilize at a constant value. Acceptable ones can be employed, but are not suitable for applications where a stable temperature is always desired, such as indoor air conditioners.
【0005】他方において、オフィスや一般の家庭で使
用されるエアコンは、室内及び室外にそれぞれ室内機、
室外機を設置し、例えば室内を25℃に設定したい場合
には、室内温度をこの設定温度とすべくコントロールす
ると共に、室内温度を下げた分の熱を室外機から放出し
ている。通常、外気の温度(室外温度)は極めて気温の
高い真夏であっても35℃程度であり、室外機で放熱す
る温度はこれよりも高いので、放熱が可能でありエアコ
ンを問題なく運転することができる。[0005] On the other hand, air conditioners used in offices and ordinary homes have indoor units and indoor units, respectively.
When an outdoor unit is installed and, for example, it is desired to set the indoor temperature to 25 ° C., the indoor temperature is controlled to this set temperature, and the heat corresponding to the lowered indoor temperature is released from the outdoor unit. Normally, the temperature of the outside air (outdoor temperature) is about 35 ° C even in midsummer, when the temperature is extremely high. Since the temperature radiated by the outdoor unit is higher than this, it is possible to radiate heat and operate the air conditioner without problems. Can be.
【0006】しかし、世界各地の熱帯地域や亜熱帯地域
には、外気温が40℃以上にもなるところがあり、この
ような地域では室外機での放熱の効率が極めて低くな
り、円滑な運転ができないという問題が多々発生する。However, there are places in the tropics and subtropics around the world where the outside air temperature can reach 40 ° C. or higher. In such a territory, the efficiency of heat radiation by the outdoor unit is extremely low, and smooth operation is not possible. Many problems occur.
【0007】[0007]
【発明が解決しようとする課題】上記したように、従来
におけるペルティエの効果を利用した冷却装置では、電
源電圧のオン、オフを切り換えることにより冷却側の温
度を制御しているので、頻繁なオン、オフ切り換えが必
要であり、また、温度を一定値に保持することが困難で
あるという欠点があった。As described above, in the conventional cooling device utilizing the Peltier effect, the temperature on the cooling side is controlled by switching the power supply voltage on and off. In addition, there is a disadvantage that it is necessary to switch off, and it is difficult to maintain the temperature at a constant value.
【0008】一方、従来における室内用のエアコンで
は、外気温度が40℃以上になると、放熱の効率が低下
し、円滑な運転ができなくなるとう問題が発生してい
た。この発明はこのような従来の課題を解決するために
なされたものであり、その目的とするところは、容易且
つ安定的に温度制御が可能な加温装置、冷却装置及びこ
の冷却装置を使用した空調装置を提供することにある。On the other hand, in a conventional indoor air conditioner, when the outside air temperature exceeds 40 ° C., the efficiency of heat radiation is reduced, and a problem arises that smooth operation cannot be performed. The present invention has been made to solve such a conventional problem, and an object thereof is to use a heating device, a cooling device, and a cooling device capable of easily and stably controlling the temperature. An object of the present invention is to provide an air conditioner.
【0009】[0009]
【課題を解決するための手段】上記目的を達成するた
め、本願請求項1に記載した冷却装置は、2つの異種導
体に電圧を印加した際に生じる、ペルティエの効果によ
って吸熱する点に吸熱板を設置し、且つ、放熱する点に
放熱板を設置し、前記吸熱板を被冷却体と接触させるこ
とにより、当該被冷却体を冷却する冷却装置において、
前記放熱板の温度を所定温度に調整する手段を配設し、
該放熱板の温度を調整することにより、前記吸熱板の温
度を制御することを特徴とする。In order to achieve the above object, the cooling device according to the first aspect of the present invention has a heat absorbing plate at a point where heat is absorbed by a Peltier effect which occurs when a voltage is applied to two different types of conductors. In the cooling device that cools the object to be cooled by installing a radiator plate at a point where the heat is radiated, and by bringing the heat absorbing plate into contact with the object to be cooled,
A means for adjusting the temperature of the heat sink to a predetermined temperature is provided,
The temperature of the heat absorbing plate is controlled by adjusting the temperature of the heat radiating plate.
【0010】また、請求項2に記載した加温装置は、2
つの異種導体に電圧を印加した際に生じる、ペルティエ
の効果によって吸熱する点に吸熱板を設置し、且つ、放
熱する点に放熱板を設置し、前記放熱板を被加温体と接
触させることにより、当該被加温体を加温する加温装置
において、前記吸熱板の温度を所定温度に調整する手段
を配設し、該吸熱板の温度を調整することにより、前記
放熱板の温度を制御することを特徴とする。[0010] The heating device according to the second aspect of the present invention is characterized in that:
A heat absorbing plate is installed at a point where heat is absorbed by a Peltier effect, which is generated when a voltage is applied to two different conductors, and a heat sink is installed at a point where heat is released, and the heat sink is brought into contact with the object to be heated. Thus, in the heating device for heating the body to be heated, means for adjusting the temperature of the heat absorbing plate to a predetermined temperature is provided, and by adjusting the temperature of the heat absorbing plate, the temperature of the heat radiating plate is reduced. It is characterized by controlling.
【0011】請求項3に記載した空調装置は、室内温度
を調整する空調装置において、2つの異種導体に電圧を
印加した際に生じる、ペルティエの効果によって吸熱す
る点に吸熱板を設置し、且つ、放熱する点に放熱板を設
置し、前記吸熱板を被冷却空気と接触させることによ
り、当該被冷却空気を冷却する冷却装置と、室内の空気
を吸引し、前記冷却装置の吸熱板と接触して得られる冷
却空気を前記室内に放出する送気手段と、前記冷却装置
の放熱板と接触して、前記放熱板を冷却する冷却媒体
と、前記冷却媒体の温度を所望温度に調整する温度制御
手段と、を具備したことを特徴とする。According to a third aspect of the present invention, in the air conditioner for adjusting the indoor temperature, a heat absorbing plate is provided at a point where heat is absorbed by a Peltier effect, which is generated when a voltage is applied to two different conductors, and A cooling device that cools the air to be cooled by contacting the heat absorbing plate with the air to be cooled by installing a heat radiating plate at a point where the heat is radiated; Air supply means for discharging the cooling air obtained in the room, a cooling medium that contacts the heat sink of the cooling device to cool the heat sink, and a temperature that adjusts the temperature of the cooling medium to a desired temperature. And control means.
【0012】請求項4に記載した空調装置は、室内温度
を略一定に保持する空調装置において、空調用の通風路
と、室内の空気を前記通風路内に循環させる送気手段
と、2つの異種導体に電圧を印加した際に生じる、ペル
ティエの効果によって吸熱する点に吸熱板を設置し、且
つ、放熱する点に放熱板を設置し、前記吸熱板を前記循
環した空気と接触させることにより、当該循環空気を冷
却する冷却装置と、を有し、前記冷却装置は、吸熱板が
通風路内側、放熱板が通風路外側となるように配置さ
れ、更に、冷却液ポンプと、該冷却液ポンプで送り出さ
れた冷却液を循環させて、前記放熱板を冷却する冷却液
配管と、前記冷却液配管の適所に設置され、前記冷却液
の温度を下降させる熱交換手段と、を具備したことを特
徴とする。According to a fourth aspect of the present invention, there is provided an air conditioner for maintaining a room temperature at a substantially constant level, comprising: a ventilation path for air conditioning; and an air supply means for circulating room air through the ventilation path. When a voltage is applied to a different kind of conductor, a heat absorbing plate is installed at a point where heat is absorbed by the Peltier effect, and a heat radiating plate is installed at a point where heat is released, and the heat absorbing plate is brought into contact with the circulated air. A cooling device that cools the circulating air, wherein the cooling device is arranged such that the heat absorbing plate is on the inside of the ventilation path and the heat radiating plate is on the outside of the ventilation path. A cooling liquid pipe that circulates the cooling liquid sent out by the pump and cools the radiator plate; and a heat exchange unit that is installed at an appropriate position of the cooling liquid pipe and lowers the temperature of the cooling liquid. It is characterized by.
【0013】請求項5に記載した空調装置は、前記冷却
液配管は、前記放熱板へ冷却液を送り出すための送り配
管と、前記放熱板を通過した冷却液を前記冷却液ポンプ
側へ戻すための戻り配管とからなり、前記放熱板と接触
した後の冷却液温度を測定する温度検出手段を配設し、
前記送り配管と戻り配管との間には、前記放熱板をバイ
パスするバイパス配管及び、該バイパス配管路上に設置
された開閉弁を備え、前記温度検出手段による検出温度
に応じて前記開閉弁の開度を調節し、前記放熱板の温度
を一定とすべく制御する手段を具備したことを特徴とす
る。According to a fifth aspect of the present invention, in the air conditioner, the cooling liquid pipe includes a feed pipe for sending the cooling liquid to the heat radiating plate, and a cooling liquid passing through the heat radiating plate to return to the cooling liquid pump. A temperature detecting means for measuring a coolant temperature after contact with the heat sink,
A bypass pipe is provided between the feed pipe and the return pipe to bypass the radiator plate, and an open / close valve installed on the bypass pipe path, and the open / close valve is opened according to a temperature detected by the temperature detecting means. Means for adjusting the temperature and controlling the temperature of the heat sink to be constant.
【0014】請求項6に記載した空調装置は、前記放熱
板と接触した後の冷却液温度を測定する温度検出手段を
配設し、該検出温度を所望温度とするべく、前記熱交換
器を制御する手段を具備したことを特徴とする。請求項
7に記載した空調装置は、通風路内側に配置される前記
吸熱板に、通風路内空気の冷却効率を向上させるための
フィンを設置したことを特徴とする。According to a sixth aspect of the present invention, the air conditioner further comprises a temperature detecting means for measuring a temperature of the coolant after contacting the heat radiating plate, and the heat exchanger is operated to set the detected temperature to a desired temperature. It is characterized by having control means. The air conditioner described in claim 7 is characterized in that fins for improving the cooling efficiency of the air in the ventilation path are provided on the heat absorbing plate disposed inside the ventilation path.
【0015】上述の如く構成された本願請求項1、請求
項2に記載された冷却装置、加温装置によれば、ペルテ
ィエの効果により吸熱される吸熱板、及び放熱される放
熱板のうち一方の温度を冷却水、加温水等の媒体を介し
て温度制御し、他方の温度を調整している。例えば、吸
熱板と放熱板の温度差が46℃である場合には、放熱側
の温度を46℃に制御すれば、吸熱側の温度を0℃に設
定することができる。これにより、比較的簡単に且つ安
定した温度制御が可能となる。According to the cooling device and the heating device according to the first and second aspects of the present invention, one of the heat absorbing plate that absorbs heat by the Peltier effect and the heat radiating plate that radiates heat is provided. Is controlled via a medium such as cooling water or heating water, and the other temperature is adjusted. For example, when the temperature difference between the heat absorbing plate and the heat radiating plate is 46 ° C., by controlling the temperature on the heat radiating side to 46 ° C., the temperature on the heat absorbing side can be set to 0 ° C. As a result, relatively simple and stable temperature control becomes possible.
【0016】また、本願請求項3〜7に記載の空調装置
では、ペルティエの効果により吸熱側となる面を吸熱面
とし、放熱側となる面を放熱面とした冷却装置を複数個
通風路内に設置し、且つ、吸熱面が通風路の内面側、放
熱面が通風路の外面側となるように配置する。そして、
冷却装置に直流電圧を印加し、且つ、放熱面の温度を冷
却水を用いて冷却すると、吸熱面の温度が所望温度(例
えば14℃)に冷却されるので、この吸熱面を通過する
空気は熱を放出して冷却されることになる。また、吸熱
面にフィンを設置すれば、熱交換の効率が向上し、効果
的な空調が可能になる。Further, in the air conditioner according to the third to seventh aspects of the present invention, a plurality of cooling devices in the ventilation path having a surface on the heat absorption side as a heat absorption surface and a surface on the heat radiation side as a heat radiation surface due to the effect of Peltier. And the heat absorbing surface is disposed on the inner surface side of the ventilation path, and the heat radiation surface is disposed on the outer surface side of the ventilation path. And
When a DC voltage is applied to the cooling device and the temperature of the heat radiating surface is cooled using cooling water, the temperature of the heat absorbing surface is cooled to a desired temperature (for example, 14 ° C.). The heat will be released and cooled. In addition, if fins are provided on the heat absorbing surface, the efficiency of heat exchange is improved, and effective air conditioning is possible.
【0017】[0017]
【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて説明する。図1は、本発明の一実施形態に係る
冷却装置の構成図であり、同図に示すようにこの冷却装
置1は、P型半導体2とN型半導体3とを具備し、P型
半導体2の一端とN型半導体3の一端との接続点が吸熱
面4とされ、P型半導体2の他端とN型半導体3の他端
はそれぞれ、放熱面5a,5bとされ、このうち放熱面
5aは直流電源6のマイナス側に接続され、放熱面5b
はプラス側にそれぞれ接続されている。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram of a cooling device according to an embodiment of the present invention. As shown in the drawing, the cooling device 1 includes a P-type semiconductor 2 and an N-type semiconductor 3 and a P-type semiconductor 2. Is connected to one end of the N-type semiconductor 3 as a heat-absorbing surface 4, and the other end of the P-type semiconductor 2 and the other end of the N-type semiconductor 3 are formed as heat-radiating surfaces 5a and 5b, respectively. 5a is connected to the negative side of the DC power supply 6 and has a heat radiation surface 5b.
Are connected to the plus side, respectively.
【0018】また、放熱面5a,5bは、冷却用のケー
シング7で覆設され、該ケーシング7には、冷却用配管
8が接続され、送水ポンプ9によって貯水タンク13に
蓄積された冷却水が循環し得るようになっている。更
に、冷却用配管8の経路上には、冷却水の温度をコント
ロールするための熱交換器10が配設され、且つ、ケー
シング7の出口側の冷却用配管8には、冷却水の温度を
測定するための温度計11が設置されている。そして、
この温度計11の測定結果は制御手段12にフィードバ
ックされて、熱交換器10を制御し得るようになってい
る。The heat radiating surfaces 5a and 5b are covered with a casing 7 for cooling, a cooling pipe 8 is connected to the casing 7, and cooling water accumulated in a water storage tank 13 by a water supply pump 9 is provided. It can be circulated. Further, a heat exchanger 10 for controlling the temperature of the cooling water is provided on the path of the cooling pipe 8, and the temperature of the cooling water is supplied to the cooling pipe 8 on the outlet side of the casing 7. A thermometer 11 for measurement is provided. And
The measurement result of the thermometer 11 is fed back to the control means 12 so that the heat exchanger 10 can be controlled.
【0019】次に、上記の如く構成された冷却装置に動
作について説明する。放熱面5a,5bに直流電源6よ
りの電圧を印加すると、ペルティエの効果により、吸熱
面4の温度は時間の経過と共に下降し、これとは反対に
放熱面5a,5bの温度は上昇する。そして、これらの
温度差が例えば46℃と決められている場合には、吸熱
面4と放熱面5a,5bの温度差は略46℃となる。即
ち、送水ポンプ9を停止させた状態(即ち、ケーシング
7内の冷却水が循環しない状態)を維持すると、吸熱面
4側が徐々に外気温に近づくことになり、仮に外気温が
20℃である場合には、放熱面5a,5bの温度は66
℃まで上昇することになる。Next, the operation of the cooling device configured as described above will be described. When a voltage from the DC power supply 6 is applied to the heat radiating surfaces 5a and 5b, the temperature of the heat absorbing surface 4 decreases with time due to the Peltier effect, and conversely, the temperatures of the heat radiating surfaces 5a and 5b increase. If the temperature difference is determined to be, for example, 46 ° C., the temperature difference between the heat absorbing surface 4 and the heat radiating surfaces 5a, 5b is approximately 46 ° C. That is, when the state in which the water pump 9 is stopped (that is, the state in which the cooling water in the casing 7 is not circulated) is maintained, the heat absorbing surface 4 gradually approaches the outside temperature, and the outside temperature is temporarily 20 ° C. In this case, the temperature of the heat radiation surfaces 5a and 5b is 66
° C.
【0020】ここで、送水ポンプ9を駆動させて冷却用
配管8を介しケーシング7内に冷却水を循環させると、
この冷却水はケーシング7を通過することにより放熱面
5a,5bを冷却し、その後、熱交換器10で温度が下
げられ、再度ケーシング7に導入されるという動作を繰
り返すことになる。Here, when the water supply pump 9 is driven to circulate the cooling water in the casing 7 through the cooling pipe 8,
The cooling water cools the heat radiating surfaces 5a and 5b by passing through the casing 7, and thereafter, the operation of reducing the temperature in the heat exchanger 10 and introducing the cooling water into the casing 7 again is repeated.
【0021】また、ケーシング7出口側に設置された温
度計11により、冷却水の温度が測定され、この測定結
果に基づいて制御手段12が熱交換器10に搭載される
ファン10aの運転を制御するので、冷却水の温度を任
意に調整することができ、ひいては放熱面5a,5bの
温度を調整することができる。例えば、冷却水の温度が
60℃となるように調整すれば、放熱面5a,5bの温
度もやはり60℃となり、この放熱面温度と46℃差と
なる吸熱面4の温度は14℃となる。こうして、吸熱面
4の温度を任意に設定することができるのである。The temperature of the cooling water is measured by a thermometer 11 installed on the outlet side of the casing 7, and the control means 12 controls the operation of the fan 10a mounted on the heat exchanger 10 based on the measurement result. Therefore, the temperature of the cooling water can be arbitrarily adjusted, and the temperature of the heat radiating surfaces 5a and 5b can be adjusted. For example, if the temperature of the cooling water is adjusted to be 60 ° C., the temperature of the heat radiating surfaces 5a and 5b is also 60 ° C., and the temperature of the heat absorbing surface 4 which is a difference of 46 ° C. from this heat radiating surface is 14 ° C. . Thus, the temperature of the heat absorbing surface 4 can be set arbitrarily.
【0022】このようにして、本実施形態に係る冷却装
置では、放熱面5a,5bを冷却水と接触させ、更にこ
の冷却水を循環させて温度を制御することにより、放熱
面5a,5bの温度を所定の温度とし、これにより、吸
熱面4の温度を所望の温度に設定しているので、従来の
ように、直流電源6のオン、オフを切り換えることな
く、安定した温度制御が可能となる。As described above, in the cooling device according to the present embodiment, the heat radiating surfaces 5a and 5b are brought into contact with the cooling water, and the cooling water is circulated to control the temperature. Since the temperature is set to a predetermined temperature and the temperature of the heat absorbing surface 4 is set to a desired temperature, stable temperature control can be performed without switching the DC power supply 6 on and off as in the related art. Become.
【0023】また、上記した実施形態では、放熱面5
a,5b側を冷却することにより、吸熱面4の温度を制
御する冷却装置について説明したが、これを反対にする
ことにより、加温装置とすることも可能である。図2
は、このような加温装置の構成を示す説明図であり、該
加温装置21は、P型半導体22と、N型半導体23
と、吸熱面24と、放熱面25a,25bと、直流電源
26と、ケーシング27と、加温用配管28と、送水ポ
ンプ29と、熱交換器30と、温度計31と、制御手段
32と、貯水タンク33と、を具備している。なお、本
実施形態では、送水ポンプ29で循環させる加温水とし
て不凍液を使用する。In the above embodiment, the heat radiation surface 5
Although the cooling device that controls the temperature of the heat absorbing surface 4 by cooling the a and 5b sides has been described, a heating device may be formed by reversing the cooling device. FIG.
FIG. 1 is an explanatory view showing the configuration of such a heating device. The heating device 21 includes a P-type semiconductor 22 and an N-type semiconductor 23.
, Heat absorbing surface 24, heat radiating surfaces 25 a and 25 b, DC power supply 26, casing 27, heating pipe 28, water pump 29, heat exchanger 30, thermometer 31, and control means 32. , A water storage tank 33. In the present embodiment, antifreeze is used as the warming water circulated by the water pump 29.
【0024】次に、本実施形態に係る加温装置の動作に
ついて説明する。送水ポンプ29をオフとした状態で直
流電源26をオンとすると、放熱面5a,5bの温度は
外気温度(仮に、20℃とする)とされるので、46℃
の温度差となる吸熱面24は−26℃となる。ここで、
送水ポンプ29を起動させると、貯水タンク33に蓄積
された加温水が加温用配管28を循環することになり、
ケーシング27内を通過する際に吸熱面24を加温し、
吸熱面24の温度を上昇させる。この温度は、温度計3
1で測定され、制御手段32の制御下で動作する熱交換
器30で調整されるので、吸熱面24の温度を任意に設
定することができる。例えば、吸熱面24の温度が0℃
となるように設定すれば、放熱面25a,25bの温度
は46℃に維持されることになる。これにより、安定し
た温度制御が可能となる。Next, the operation of the heating device according to this embodiment will be described. When the DC power supply 26 is turned on with the water supply pump 29 turned off, the temperature of the heat radiation surfaces 5a and 5b is set to the outside air temperature (temporarily 20 ° C.).
Is −26 ° C. here,
When the water supply pump 29 is started, the heated water accumulated in the water storage tank 33 circulates through the heating pipe 28,
When passing through the casing 27, the heat absorbing surface 24 is heated,
The temperature of the heat absorbing surface 24 is increased. This temperature is measured by thermometer 3.
1 and adjusted by the heat exchanger 30 operating under the control of the control means 32, the temperature of the heat absorbing surface 24 can be set arbitrarily. For example, if the temperature of the heat absorbing surface 24 is 0 ° C.
By setting so that the temperature of the heat radiation surfaces 25a and 25b is maintained at 46 ° C. This enables stable temperature control.
【0025】図3は、本発明の一実施形態に係る空調装
置の構成を模式的に示す側面図、図4は同平面図であ
る。図3,図4に示すようにこの空調装置は、空調する
べき室内より吸引する空気の通路となる通風路41と、
該通風路41の配管路上に設置された複数個の冷却装置
42,42・・と、該冷却装置42,42・・と通風路
41を通過する空気との熱交換効率を向上させるための
熱交換用フィン52と、通風路41内に室内空気を導入
すると共に、冷却装置42,42・・と接触して冷却さ
れた後の空気を室内に放出するための送風機43と、送
風機43の出口側に設置されたHEPAフィルタ44
と、を具備している。また、符号45はドレンパンであ
り、通風路内の結露で発生する水滴を蓄積して排出する
ものである。FIG. 3 is a side view schematically showing the configuration of an air conditioner according to one embodiment of the present invention, and FIG. 4 is a plan view of the same. As shown in FIGS. 3 and 4, the air conditioner includes an air passage 41 serving as a passage of air sucked from a room to be air-conditioned,
A plurality of cooling devices 42, 42,... Installed on the piping of the ventilation passage 41, and heat for improving the heat exchange efficiency between the cooling devices 42, 42, and the air passing through the ventilation passage 41. A blower 43 for introducing room air into the ventilation passage 41, discharging the cooled air into the room while contacting the cooling devices 42, 42,..., And an outlet of the blower 43 HEPA filter 44 installed on the side
And Reference numeral 45 denotes a drain pan that accumulates and discharges water droplets generated by dew condensation in the ventilation path.
【0026】冷却装置42は、図1で示した如くのペル
ティエの効果を利用した冷却装置であり、符号42aで
示す通風路41の内側となる面が吸熱面とされ、符号4
2bで示す通風路41外側の面が放熱面とされている。
なお、図3では図示を省略しているが、この冷却装置4
2,42・・には、図1で示したように直流電源が接続
されており、直流電圧が印加された際に、ペルティエの
効果により吸熱面42a側が冷却されるように動作す
る。The cooling device 42 is a cooling device utilizing the Peltier effect as shown in FIG. 1. The surface inside the ventilation passage 41 indicated by reference numeral 42a is a heat absorbing surface,
The outer surface of the ventilation path 41 shown by 2b is a heat radiation surface.
Although not shown in FIG. 3, the cooling device 4
A DC power supply is connected to 2, 42,... As shown in FIG. 1, and when DC voltage is applied, it operates so that the heat absorbing surface 42a side is cooled by the Peltier effect.
【0027】放熱面42bには、送り配管46及び戻り
配管47が設置されており、放熱面42bと接触する冷
却水が循環できるようになっている。また、図4に示さ
れるように、通風路41の側部には放熱用チャンバー5
7が設置され、送り配管46及び戻り配管47はこの放
熱用チャンバー57内に配置されている。更に、図示省
略の電気配線もこの放熱用チャンバー57内に配置され
ている。また、この放熱用チャンバー57の周囲部は保
温材により保温されている。A feed pipe 46 and a return pipe 47 are provided on the heat radiating surface 42b so that cooling water in contact with the heat radiating surface 42b can circulate. Further, as shown in FIG.
7 is provided, and a feed pipe 46 and a return pipe 47 are disposed in the heat radiation chamber 57. Further, electric wires not shown are also arranged in the heat radiating chamber 57. The surroundings of the heat radiating chamber 57 are kept warm by a heat insulating material.
【0028】戻り配管47は、熱交換器49の入り口側
に連結されており、該熱交換器49の出口側は貯水タン
ク50、及び送水ポンプ51を経て送り配管46に接続
されている。また、送り配管46と戻り配管47との間
には、放熱面42bをバイパスするためのバイパス配管
53が配設され、且つこのバイパス配管53と戻り配管
47とは電磁式の三方弁54を介して連結されている。
更に、戻り配管47には放熱面42bを通過した冷却水
の温度を測定するための温度計55が設置され、前記三
方弁54は温度計55で測定された温度に基づき、制御
手段56の制御下で切換動作するようになっている。The return pipe 47 is connected to the inlet side of the heat exchanger 49, and the outlet side of the heat exchanger 49 is connected to the feed pipe 46 via the water storage tank 50 and the water pump 51. A bypass pipe 53 for bypassing the heat radiation surface 42b is provided between the feed pipe 46 and the return pipe 47, and the bypass pipe 53 and the return pipe 47 are connected via an electromagnetic three-way valve 54. Connected.
Further, the return pipe 47 is provided with a thermometer 55 for measuring the temperature of the cooling water passing through the heat radiating surface 42b, and the three-way valve 54 is controlled by the control means 56 based on the temperature measured by the thermometer 55. The switching operation is performed below.
【0029】図5は、通風路41の内部構成を示す斜視
図であり、同図に示すように、通風路41内の互いに向
かい合う2側面には、それぞれ、冷却装置42の吸熱面
42aが設置され、互いに対向する吸熱面42aの間に
は、略平行に配置された複数枚の熱交換用フィン52が
配置されている。熱交換用フィン52は、吸熱面42a
と通風路41を流れる空気との接触面積を大きくして熱
交換効率を向上させるためのものである。FIG. 5 is a perspective view showing the internal structure of the ventilation passage 41. As shown in FIG. 5, the heat absorbing surfaces 42a of the cooling device 42 are provided on two opposite sides of the ventilation passage 41, respectively. A plurality of heat exchange fins 52 arranged substantially in parallel are arranged between the heat absorbing surfaces 42a facing each other. The heat exchange fin 52 has a heat absorbing surface 42a.
This is for increasing the contact area between the air and the air flowing through the ventilation passage 41 to improve the heat exchange efficiency.
【0030】図6は、本実施形態の空調装置を一つの筐
体58として構成した例を示す説明図であり、該筐体5
8は空調すべき室内の適所に設置される。同図に示すよ
うに筐体58のの下方に形成された空気導入口59から
室内空気が取り込まれ、冷却後に送風機43を介して出
口ダクトへと放出されるようになっている。また、放熱
用チャンバー57の上側には操作盤用のスペース60が
設置されている。FIG. 6 is an explanatory view showing an example in which the air conditioner of the present embodiment is configured as one casing 58.
8 is installed at an appropriate place in the room to be air-conditioned. As shown in the figure, room air is taken in from an air inlet 59 formed below the housing 58, and is discharged to an outlet duct via the blower 43 after cooling. A space 60 for the operation panel is provided above the heat radiating chamber 57.
【0031】次に、上記の如く構成された本実施形態の
動作について説明する。図3に示す送風機43を起動さ
せると、通風路41内には室内からの空気が導入され
る。また、各冷却装置42,42・・に直流電源(不図
示)よりの直流電圧を印加すると、ペルティエの効果に
より、吸熱面42a側の温度が低下し、これとは反対に
放熱面42b側の温度が上昇する。いま、通風路41内
の温度が30℃であり、冷却装置42のペルティエの効
果により生じる温度差が46℃である場合には、放熱面
42bの温度は76℃となる。Next, the operation of the present embodiment configured as described above will be described. When the blower 43 shown in FIG. 3 is started, air from the room is introduced into the ventilation path 41. When a DC voltage from a DC power supply (not shown) is applied to each of the cooling devices 42, 42,..., The temperature of the heat absorbing surface 42a decreases due to the Peltier effect. The temperature rises. Now, when the temperature in the ventilation path 41 is 30 ° C. and the temperature difference caused by the Peltier effect of the cooling device 42 is 46 ° C., the temperature of the heat radiation surface 42b is 76 ° C.
【0032】ここで、送水ポンプ48を起動させ、送り
配管46及び戻り配管47を介して冷却水を循環させる
と、この冷却水は放熱面42bと接触するので(このと
き、三方弁54によりバイパス配管53は閉鎖されてい
る)、放熱面42bの温度が下降し始めると共に、冷却
水の温度が上昇する。そして、温度が上昇した冷却水は
熱交換器49に導入され、温度が下げられた後に再度送
り配管46へと送り出される。When the water pump 48 is started and the cooling water is circulated through the feed pipe 46 and the return pipe 47, the cooling water comes into contact with the heat radiation surface 42b (at this time, the cooling water is bypassed by the three-way valve 54). The pipe 53 is closed), and the temperature of the heat radiation surface 42b starts to decrease, and the temperature of the cooling water increases. Then, the cooling water whose temperature has risen is introduced into the heat exchanger 49, and is sent out again to the feed pipe 46 after the temperature has dropped.
【0033】いま、吸熱面42aの温度を14℃とした
い場合には、放熱面42bの温度が60℃(温度差が4
6℃である)となるように制御すれば良いことになる。
そこで、制御手段56では温度計55で測定される温度
を監視し、この温度が60℃以上である場合には、三方
弁54をそのままの状態とし(バイパス配管53を閉鎖
した状態)、測定された温度が60℃以下となった場合
には、放熱面42bをこれ以上冷却する必要はないの
で、三方弁54を切り換えて、バイパス配管53を開状
態とし、放熱面42b側の配管を閉鎖する。これによ
り、送り配管46を介して送られた冷却水は放熱面42
bと接触することなくそのまま戻り配管47を介して循
環される。また、温度計55で検出される温度が60℃
以上となった場合には、再度三方弁54を元の状態に戻
し、放熱面42bを冷却する。If the temperature of the heat absorbing surface 42a is to be 14 ° C., the temperature of the heat radiating surface 42b is 60 ° C. (the temperature difference is
6 ° C.).
Therefore, the control means 56 monitors the temperature measured by the thermometer 55, and when the temperature is 60 ° C. or more, the three-way valve 54 is kept in the same state (the bypass pipe 53 is closed), and the measurement is performed. When the temperature becomes 60 ° C. or lower, there is no need to further cool the heat radiating surface 42b, so the three-way valve 54 is switched to open the bypass pipe 53 and close the pipe on the heat radiating surface 42b side. . As a result, the cooling water sent through the feed pipe 46 is
It is circulated through the return pipe 47 as it is without contacting the b. The temperature detected by the thermometer 55 is 60 ° C.
In the case described above, the three-way valve 54 is returned to the original state, and the heat radiation surface 42b is cooled.
【0034】こうして、放熱面42bの温度が所望温度
の60℃に保持されるので、吸熱面42aの温度は14
℃となり、通風路41内を通過する空気はこの吸熱面4
2aと接触することにより冷却され、冷却空気を室内に
送り出すことができる。Thus, the temperature of the heat radiation surface 42b is maintained at the desired temperature of 60 ° C.
° C, and the air passing through the ventilation passage 41
The cooling air can be sent out into the room by being cooled by contact with 2a.
【0035】このようにして、本実施形態の空調装置で
は、ペルティエの効果を利用した熱源素子42の吸熱面
42aを通風路41の内側に配置し、放熱面42bを通
風路41の外側に配置し、冷却水を用いて放熱面42b
の温度を所定の温度に調整することにより、吸熱面42
aの温度を所望温度とし、これを利用して室内空気を冷
却しているので、確実且つ安定した温度制御が可能とな
る。また、三方弁54の開、閉の切換により温度を制御
することができるので、制御手段56の設定温度を変更
すれば、適宜吸熱面42aの温度を設定することが可能
となる。例えば、温度設定値を2℃高く設定すれば、放
熱面42bの温度を2℃高くすることができ、その結果
吸熱面42aの温度を2℃高くすることができる。As described above, in the air conditioner of the present embodiment, the heat absorbing surface 42a of the heat source element 42 utilizing the Peltier effect is disposed inside the ventilation passage 41 and the heat radiation surface 42b is disposed outside the ventilation passage 41. And the heat radiating surface 42b using cooling water.
By adjusting the temperature of the heat absorbing surface 42 to a predetermined temperature,
Since the temperature of a is set to the desired temperature and the room air is cooled by using the desired temperature, reliable and stable temperature control can be performed. Further, since the temperature can be controlled by switching between opening and closing of the three-way valve 54, the temperature of the heat absorbing surface 42a can be appropriately set by changing the set temperature of the control means 56. For example, if the temperature set value is set to 2 ° C. higher, the temperature of the heat radiation surface 42b can be raised by 2 ° C., and as a result, the temperature of the heat absorbing surface 42a can be raised by 2 ° C.
【0036】また、本実施形態の空調装置では、一般的
に使用されているエアコンのように、室外機から外気へ
熱を放出する方式ではないので、外気の温度に関わらず
確実な空調が可能となる。このため、熱帯地方や亜熱帯
地方など外気温が極めて上昇する地域においても確実に
動作させることができる。Further, the air conditioner of the present embodiment does not discharge heat from the outdoor unit to the outside air unlike a commonly used air conditioner, so that reliable air conditioning can be performed regardless of the temperature of the outside air. Becomes For this reason, it can be operated reliably even in a region where the outside temperature is extremely high, such as a tropical region or a subtropical region.
【0037】更に、この空調装置では、冷却装置42に
直流電圧を供給する回路、及び三方弁54の制御回路、
熱交換器49の駆動回路等、極めて単純な回路のみで構
成しているから、故障や誤動作の発生が極めて少なく、
メンテナンスの労力を著しく軽減することができる。ま
た、冷却装置42,42・・の吸熱面42aに熱交換用
フィン52を設置しているので、熱交換の効率が向上
し、効率の良い運転が可能となる。Further, in this air conditioner, a circuit for supplying a DC voltage to the cooling device 42, a control circuit for the three-way valve 54,
Since it is composed of only a very simple circuit such as a drive circuit of the heat exchanger 49, the occurrence of failures and malfunctions is extremely small,
Maintenance work can be significantly reduced. Further, since the heat exchange fins 52 are provided on the heat absorbing surfaces 42a of the cooling devices 42, 42,..., The efficiency of heat exchange is improved, and efficient operation becomes possible.
【0038】更に、上記の実施形態では、冷却水温度に
応じて三方弁54の開、閉を切り換えることにより、放
熱面42bの温度を一定に保持する例について説明した
が、三方弁54を使用せず、熱交換器49における冷却
水の冷却効率を調整することにより、冷却水温度を一定
に保持するようにしても良い。Furthermore, in the above-described embodiment, an example has been described in which the three-way valve 54 is switched between open and closed in accordance with the temperature of the cooling water to maintain the temperature of the heat radiation surface 42b constant. Instead, the cooling water temperature may be kept constant by adjusting the cooling efficiency of the cooling water in the heat exchanger 49.
【0039】[0039]
【発明の効果】以上説明したように、本発明の加温装置
及び冷却装置では、ペルティエの効果により放熱する点
に放熱板を設置し、吸熱する点に吸熱板を設置し、この
放熱板または吸熱板のうち一方の温度を調整することに
より、他方の温度が所望温度となるように制御している
ので、安定且つ確実な冷却または加温が可能となる。As described above, in the heating device and the cooling device of the present invention, a radiator plate is provided at a point where heat is radiated by the Peltier effect, and a heat sink plate is provided at a point where heat is absorbed. By adjusting the temperature of one of the heat absorbing plates to control the other temperature to a desired temperature, stable and reliable cooling or heating can be performed.
【0040】また、本発明の空調装置では、ペルティエ
の効果を利用して冷却し得る冷却装置を、空調用の通風
路内側に複数個配置し、この冷却装置の放熱面を冷却水
を用いて一定の温度に保持することにより、吸熱面の温
度を所望温度に安定させ、通風路内空気を冷却している
ので、外気温度に影響されることなく、確実且つ安定し
た温度制御が可能となる。In the air conditioner of the present invention, a plurality of cooling devices capable of cooling by utilizing the Peltier effect are disposed inside the ventilation passage for air conditioning, and the heat radiating surface of the cooling device is cooled by using cooling water. By maintaining a constant temperature, the temperature of the heat absorbing surface is stabilized at a desired temperature and the air in the ventilation passage is cooled, so that reliable and stable temperature control can be performed without being affected by the outside air temperature. .
【図1】本発明に係る冷却装置の一実施形態の構成を示
す説明図である。FIG. 1 is an explanatory diagram showing a configuration of an embodiment of a cooling device according to the present invention.
【図2】本発明に係る加温装置の一実施形態の構成を示
す説明図である。FIG. 2 is an explanatory diagram showing a configuration of an embodiment of a heating device according to the present invention.
【図3】本発明に係る空調装置の一実施形態の構成を示
す側面図である。FIG. 3 is a side view showing a configuration of an embodiment of an air conditioner according to the present invention.
【図4】本発明に係る空調装置の一実施形態の構成を示
す平面図である。FIG. 4 is a plan view showing a configuration of an embodiment of an air conditioner according to the present invention.
【図5】通風路内の詳細な構成を示す斜視図である。FIG. 5 is a perspective view showing a detailed configuration inside a ventilation path.
【図6】本実施形態の空調装置を一つの筐体内に収納し
た例を示す説明図である。FIG. 6 is an explanatory diagram showing an example in which the air conditioner of the present embodiment is housed in one housing.
1 冷却装置 2,22 P型半導体 3,23 N型半導体 4,24 吸熱面 5a,5b,25a,25b 放熱面 6,26 直流電源 7,27 ケーシング 8,28 冷却用配管 9,29 送水ポンプ 10,30 熱交換器 10a ファン 11,31 温度計 12,32 制御手段 13,33 貯水タンク 21 加温装置 41 通風路 42 冷却装置 42a 吸熱面 42b 放熱面 43 送風機 44 HEPAフィルタ 45 ドレンパン 46 送り配管 47 戻り配管 48 送水ポンプ 49 熱交換器 50 貯水タンク 52 熱交換用フィン 53 バイパス配管 54 三方弁 55 温度計 56 制御手段 57 放熱用チャンバー 58 筐体 59 空気導入口 60 操作盤用スペース DESCRIPTION OF SYMBOLS 1 Cooling device 2,22 P-type semiconductor 3,23 N-type semiconductor 4,24 Heat-absorbing surface 5a, 5b, 25a, 25b Heat-radiating surface 6,26 DC power supply 7,27 Casing 8,28 Cooling pipe 9,29 Water pump 10 , 30 Heat exchanger 10a Fan 11, 31 Thermometer 12, 32 Control means 13, 33 Water storage tank 21 Heating device 41 Ventilation path 42 Cooling device 42a Heat absorbing surface 42b Heat radiating surface 43 Blower 44 HEPA filter 45 Drain pan 46 Sending pipe 47 Return Piping 48 Water pump 49 Heat exchanger 50 Water storage tank 52 Heat exchange fin 53 Bypass pipe 54 Three-way valve 55 Thermometer 56 Control means 57 Radiation chamber 58 Housing 59 Air inlet 60 Operation panel space
Claims (7)
じる、ペルティエの効果によって吸熱する点に吸熱板を
設置し、且つ、放熱する点に放熱板を設置し、前記吸熱
板を被冷却体と接触させることにより、当該被冷却体を
冷却する冷却装置において、 前記放熱板の温度を所定温度に調整する手段を配設し、
該放熱板の温度を調整することにより、前記吸熱板の温
度を制御することを特徴とする冷却装置。1. A heat absorbing plate is installed at a point where heat is absorbed by a Peltier effect generated when a voltage is applied to two different types of conductors, and a heat radiating plate is installed at a point where heat is released, and the heat absorbing plate is cooled. In a cooling device that cools the object to be cooled by contacting the body, a means for adjusting the temperature of the heat sink to a predetermined temperature is provided,
A cooling device, wherein the temperature of the heat absorbing plate is controlled by adjusting the temperature of the heat radiating plate.
じる、ペルティエの効果によって吸熱する点に吸熱板を
設置し、且つ、放熱する点に放熱板を設置し、前記放熱
板を被加温体と接触させることにより、当該被加温体を
加温する加温装置において、 前記吸熱板の温度を所定温度に調整する手段を配設し、
該吸熱板の温度を調整することにより、前記放熱板の温
度を制御することを特徴とする加温装置。2. A heat absorbing plate is installed at a point where heat is absorbed by the Peltier effect, which is generated when a voltage is applied to two different types of conductors, and a heat sink is installed at a point where heat is radiated. A heating device that heats the body to be heated by being brought into contact with the heating body, wherein a means for adjusting the temperature of the heat absorbing plate to a predetermined temperature is provided;
A heating device, wherein the temperature of the heat sink is controlled by adjusting the temperature of the heat absorbing plate.
エの効果によって吸熱する点に吸熱板を設置し、且つ、
放熱する点に放熱板を設置し、前記吸熱板を被冷却空気
と接触させることにより、当該被冷却空気を冷却する冷
却装置と、 室内の空気を吸引し、前記冷却装置の吸熱板と接触して
得られる冷却空気を前記室内に放出する送気手段と、 前記冷却装置の放熱板と接触して、前記放熱板を冷却す
る冷却媒体と、 前記冷却媒体の温度を所望温度に調整する温度制御手段
と、 を具備したことを特徴とする空調装置。3. An air conditioner for adjusting an indoor temperature, wherein a heat absorbing plate is provided at a point where heat is absorbed by a Peltier effect when voltage is applied to two different types of conductors, and
A cooling device for cooling the air to be cooled is provided by installing a heat sink at a point where heat is radiated, and bringing the heat absorbing plate into contact with the air to be cooled. Air supply means for discharging cooling air obtained into the room, a cooling medium in contact with a heat sink of the cooling device to cool the heat sink, and temperature control for adjusting the temperature of the cooling medium to a desired temperature. An air conditioner comprising: means.
おいて、 空調用の通風路と、 室内の空気を前記通風路内に循環させる送気手段と、 2つの異種導体に電圧を印加した際に生じる、ペルティ
エの効果によって吸熱する点に吸熱板を設置し、且つ、
放熱する点に放熱板を設置し、前記吸熱板を前記循環し
た空気と接触させることにより、当該循環空気を冷却す
る冷却装置と、を有し、 前記冷却装置は、吸熱板が通風路内側、放熱板が通風路
外側となるように配置され、更に、 冷却液ポンプと、 該冷却液ポンプで送り出された冷却液を循環させて、前
記放熱板を冷却する冷却液配管と、 前記冷却液配管の適所に設置され、前記冷却液の温度を
下降させる熱交換手段と、 を具備したことを特徴とする空調装置。4. An air conditioner for maintaining a room temperature at a substantially constant level, comprising: a ventilation path for air conditioning; an air supply means for circulating indoor air through the ventilation path; A heat absorbing plate is installed at the point where heat is absorbed by Peltier effect, and
A cooling device that cools the circulating air by installing a heat radiating plate at a point where heat is radiated, and bringing the heat absorbing plate into contact with the circulated air, A radiator plate disposed outside the ventilation path, a coolant pump, a coolant pipe for circulating a coolant delivered by the coolant pump to cool the radiator plate, and a coolant pipe An air conditioner, comprising: a heat exchanging means installed at an appropriate place for decreasing the temperature of the coolant.
を送り出すための送り配管と、前記放熱板を通過した冷
却液を前記冷却液ポンプ側へ戻すための戻り配管とから
なり、 前記放熱板と接触した後の冷却液温度を測定する温度検
出手段を配設し、 前記送り配管と戻り配管との間には、前記放熱板をバイ
パスするバイパス配管及び、該バイパス配管路上に設置
された開閉弁を備え、 前記温度検出手段による検出温度に応じて前記開閉弁の
開度を調節し、前記放熱板の温度を一定とすべく制御す
る手段を具備したことを特徴とする請求項4記載の空調
装置。5. The cooling liquid pipe includes a feed pipe for sending the cooling liquid to the radiator plate, and a return pipe for returning the cooling liquid passing through the radiator plate to the coolant pump side. Temperature detecting means for measuring the temperature of the coolant after contacting the heat sink is provided, and a bypass pipe for bypassing the heat sink and the bypass pipe are provided between the feed pipe and the return pipe. 5. An opening / closing valve, comprising: means for adjusting the opening of the on / off valve in accordance with the temperature detected by the temperature detecting means, and controlling the temperature of the heat sink to be constant. An air conditioner as described.
測定する温度検出手段を配設し、該検出温度を所望温度
とするべく、前記熱交換器を制御する手段を具備したこ
とを特徴とする請求項4記載の空調装置。6. A temperature detecting means for measuring a temperature of a coolant after coming into contact with the heat radiating plate, and means for controlling the heat exchanger so as to make the detected temperature a desired temperature. The air conditioner according to claim 4, characterized in that:
通風路内空気の冷却効率を向上させるためのフィンを設
置したことを特徴とする請求項4〜請求項6記載の空調
装置。7. The heat absorbing plate disposed inside the ventilation path,
7. The air conditioner according to claim 4, further comprising fins for improving cooling efficiency of air in the ventilation path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11079804A JP2000274788A (en) | 1999-03-24 | 1999-03-24 | Heating device, cooling device, and air conditioner utilzing the cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11079804A JP2000274788A (en) | 1999-03-24 | 1999-03-24 | Heating device, cooling device, and air conditioner utilzing the cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000274788A true JP2000274788A (en) | 2000-10-06 |
Family
ID=13700418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11079804A Pending JP2000274788A (en) | 1999-03-24 | 1999-03-24 | Heating device, cooling device, and air conditioner utilzing the cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000274788A (en) |
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