JP2000218535A - Polishing agent supply device for polishing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To permit speedy changeover between a rough polishing process and a finishing polishing process by supplying a polishing agent to a polishing part of a polishing machine, supplying washing water to the polishing part, selectively supplying a rough polishing agent and a finishing polishing agent to a polishing agent supply path, and simulataneously supplying washing water to a washing water supply path. SOLUTION: In roughly polishing a glass substrate W, a roughly polishing agent is fed to a polishing machine 1 via a polishing agent supply pipe 2, a rough polishing process is changed over to a finishing polishing, and a pump 5C is started to communicate a port (a) of a solenoid changeover valve 4B with a port (c) thereof and communicate a port (a) of a solenoid changeover valve 4A with a port (b) thereof to supply washing water to a polishing agent supply pipe 2 for washing the pipe 2 and the machine 1. Then, a pump 5b is started to communicate the ports (a), (c) of the valve 4A with each other to supply a finishing agent to the machine 1 through the pipe 2 for finishing polishing, and pure water is supplied directly to the machine 1 and the substrate W through a washing water supply pipe 3 to wash the substrate W.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an abrasive supply device for supplying an abrasive to a polishing machine.

[0002]

2. Description of the Related Art When polishing a glass substrate or the like,
The polishing is performed by supplying an abrasive containing abrasive grains to a polishing machine pad in contact with the substrate surface. Polishing of a glass substrate or the like is roughly classified into rough polishing for the purpose of removing cracks and undulation components, and finish polishing for the purpose of removing fine surface flaws generated by the coarse polishing. Conventionally, the abrasive tank is washed and the abrasive is replaced between the rough polishing and the finish polishing, and the abrasive supply pipe is cleaned.

[0003]

However, the conventional structure described above has a problem in that the transition from the rough polishing to the finish polishing takes time and the production efficiency of the glass substrate is low. Although it is conceivable to provide a plurality of coarse polishing machines and finish polishing machines,
An increase in installation space and cost is inevitable.

Accordingly, an object of the present invention is to solve such a problem, and an object of the present invention is to provide an abrasive supply apparatus for a polishing machine which can easily and quickly switch between rough polishing and finish polishing.

[0005]

In order to achieve the above object, according to the first aspect of the present invention, a polishing agent supply path (2) for supplying a polishing agent to a polishing section of a polishing machine (1); Cleaning water supply path (3) for supplying cleaning water to the polishing section of (1)
And abrasive delivery means (4A, 5A, 5B) for selectively delivering coarse abrasive and finish abrasive to the abrasive supply path (2).
And washing water sending means (4B, 5C) for sending washing water to the washing water supply path (3).

In the first aspect of the present invention, at the time of rough polishing, the coarse abrasive is sent to the abrasive supply passage by the abrasive sending means, and the rough polishing is performed by the polishing machine. Also, at the time of finish polishing, the finish polishing agent is sent to the abrasive supply passage by the abrasive sending means, and the finish polishing is performed by the polishing machine. After the polishing is completed, the cleaning water is supplied to the cleaning water supply path by the cleaning water supply means, and the polishing machine and the work mounted on the polishing machine are cleaned.

According to the second aspect of the present invention, the cleaning water delivery means (4B, 5C) according to the first aspect is capable of delivering the cleaning water also to the abrasive supply path (2).

According to the second aspect of the present invention, at the end of the rough polishing, the cleaning water is sent out to the abrasive supply path by the washing water sending means, and the remaining coarse abrasive is washed away. This makes it easy to control the polishing times of the rough polishing and the finish polishing.

Note that the reference numerals in parentheses indicate the correspondence with specific means described in the embodiments described later.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an overall configuration of an abrasive supply apparatus for a single wafer polishing machine. In the figure, a single-wafer polishing machine 1 is a known type, and is adhered to opposing surfaces of the surface plates 11 and 12 with a substantially upper half of a glass substrate W interposed between the surface plates 11 and 12 rotating opposite to each other. Glass pad W by the pad (not shown)
Polish. A polishing agent supply pipe 2 and a washing water supply pipe 3 are provided, and their ends extend through a surface plate 11 between surfaces facing the surface plate 12 and open there.

The base of the abrasive supply pipe 2 is connected to the port a of the electromagnetic switching valve 4A, while the base of the cleaning water supply pipe 3 is connected to the port b of the electromagnetic switching valve 4B. An abrasive delivery pipe 61 interposed with a pump 5A is connected to the d port of the electromagnetic switching valve 4A, and this abrasive delivery pipe 61 reaches the coarse abrasive tank 6. Further, an abrasive delivery pipe 71 provided with a pump 5B is connected to the port c of the electromagnetic switching valve 4A, and this abrasive delivery pipe 71 reaches the finished abrasive tank 7. A washing water delivery pipe 81 provided with a pump 5C is connected to the port a of the electromagnetic switching valve 4B.
The washing water delivery pipe 81 reaches the washing water tank 8 storing pure water as washing water. The b port of the electromagnetic switching valve 4A and the c port of the electromagnetic switching valve 4B are connected to each other.

When the glass substrate W is roughly polished, as shown in FIG.
Make communication between the port and the d port. Thereby, the coarse abrasive is supplied to the polishing machine 1 through the abrasive supply pipe 2. In FIG. 2, ○ indicates communication between the ports of the electromagnetic switching valves 4A and 4B and the operation of the pumps 5A to 5C, and X indicates shutoff between the ports of the electromagnetic switching valves 4A and 4B and the pump 5A.
停止 5C stop.

When shifting from rough polishing to finish polishing, the pump 5C is started to communicate between the ports a and c of the electromagnetic switching valve 4B and between the ports a and b of the electromagnetic switching valve 4A (FIG. 2). ). Thereby, the abrasive supply pipe 2
The cleaning water is supplied to the polishing agent supply pipe 2 and the polishing machine 1 are cleaned. After that, the pump 5B is started and the electromagnetic switching valve 4A is started.
When the port a and the port c are communicated with each other, the finished abrasive is supplied to the polishing machine 1 through the abrasive supply pipe 2. When the substrate is to be washed after the final polishing, the pump 5C is started again to connect the ports a and b of the electromagnetic switching valve 4B. As a result, pure water is directly supplied to the polishing machine 1 and the glass substrate W sandwiched by the polishing machine 1 via the cleaning water supply pipe 3.

As described above, according to the polishing agent supply apparatus of the present embodiment, rough polishing and finish polishing can be continuously and automatically performed.

[0015]

As described above, according to the polishing agent supply device of the polishing machine of the present invention, switching between rough polishing and finish polishing can be performed easily and quickly.

[Brief description of the drawings]

FIG. 1 is a piping system diagram of an abrasive supply device.

FIG. 2 is a diagram showing operating states of a solenoid valve and a pump.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Polishing machine, 2 ... Abrasive supply pipe, 3 ... Cleaning water supply pipe, 4
A, 4B: electromagnetic switching valve, 5A, 5B, 5C: pump.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/304 648 H01L 21/304 648G

Claims (2)

[Claims] 1. A polishing agent supply path for supplying a polishing agent to a polishing section of a polishing machine, a cleaning water supply path for supplying cleaning water to a polishing section of the polishing machine, and a coarse polishing agent in the polishing agent supply path. An abrasive feeder for a polishing machine, comprising: an abrasive feeder for selectively feeding a finished abrasive; and a wash water feeder for sending wash water to the wash water supply path. 2. A polishing agent supply device for a polishing machine according to claim 1, wherein said cleaning water sending means is capable of sending cleaning water also to said polishing agent supply passage.