JP2000155129A - Inspecting device for electronic component and contact probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower cost, increase positioning accuracy, and to enable adaptation to narrow-pitch and many-pin constitution. SOLUTION: This electronic component inspecting device is equipped with a contact probe 1, having contact pins 2a which are brought into contact with electrode terminals P of an electronic component C to perform electric inspection, probe support mechanisms (3 and 4) which position and support the contact probe 1, and a component holding mechanism 5, which positions the electronic component C and hold the contact pins 2a and electrode terminal P in contact. The contact probe 1 comprises a tape-like film 7 and pattern wires 2 formed on the surface of the film 7, device holes 7a which are separated from one another along the length of the film 7 are formed on the film 7, and the pattern wires 2 are arranged having their tips projected into the device holes 7a to form contact pins 7a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus for an electronic component having fine electrodes, for example, an electronic component inspection device for performing a test such as an electrical circuit test by contacting each electrode terminal of a semiconductor IC chip or a liquid crystal device. The present invention relates to a contact probe used for this.

[0002]

2. Description of the Related Art In general, a contact pin is used to conduct an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). As an electrical inspection of an IC chip or the like, there are a case where a wafer is inspected, a case where an IC chip is diced from a wafer, and an inspection after resin molding. Conventionally, an inspection apparatus used after dicing holds an IC chip with a chip carrier provided with a contact probe, sets this chip carrier in a connection box, and performs inspection.

[0003]

In the conventional inspection means,
The following issues remain. That is, when the chip carrier is expensive and a large number of inspections are performed, a plurality of chip carriers are required, resulting in a high cost. Also, IC
It takes time and effort to position and set the chip on the chip carrier, and then set it on the device.
Since the pitch of contact pads, which are electrodes, has been reduced with the increase in the degree of integration and miniaturization of IC chips and the like, a narrower stylus interval has been demanded.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has as its object to provide an electronic component inspection apparatus and a contact probe which are inexpensive, have high positioning accuracy, and can cope with the increase in the number of pins with a narrow pitch. And

[0005]

The present invention has the following features to attain the object mentioned above. That is, in the electronic component inspection apparatus according to claim 1, a contact probe having a contact pin for performing an electrical inspection by contacting an electrode terminal of the electronic component, a probe support mechanism that positions and supports the contact probe, An inspection device for an electronic component, comprising: a component holding mechanism that positions the electronic component to hold the contact pins and the electrode terminals in contact with each other, wherein the contact probe includes a tape-shaped film, The film comprises a plurality of pattern wirings formed on the surface, and the film has a plurality of device holes arranged in a state of being separated from each other in a length direction thereof. A technique is employed in which the contact pins are formed so as to protrude toward the inside of the hole.

In this electronic component inspection apparatus, the contact probe comprises a tape-like film and a plurality of pattern wirings formed on the surface of the film. A plurality of device holes are formed, and a plurality of pattern wirings are formed so that the tips thereof are arranged in a protruding state toward the inside of the device holes to form contact pins. Similarly, it can be manufactured, high positional accuracy can be obtained, and multi-pin narrow pitch can be easily and inexpensively realized. Also, even if the contact pins of one device hole deteriorate due to long-term use, etc., by sequentially using the contact pins of the other device holes,
It can handle a large number of inspections.

According to the electronic component inspection apparatus of the second aspect,
The technology for inspecting an electronic component according to claim 1, wherein a technology is provided that includes a probe moving mechanism that moves the contact probe in a length direction.

[0008] In this electronic component inspection apparatus, the probe moving mechanism for moving the contact probe in the length direction is provided. Therefore, it is easy to move the contact probe by the probe moving mechanism and perform inspection at an arbitrary device hole. Becomes

According to the third aspect of the present invention, there is provided an electronic component inspection apparatus.
3. The electronic component inspection device according to claim 2, wherein the contact probe is formed with a plurality of sprocket holes arranged at predetermined intervals in a length direction on at least one side of the film, and the probe moving mechanism includes: A technique is employed that includes a claw portion that can be fitted into the sprocket hole, and a claw portion moving unit that moves the claw portion in the moving direction of the contact probe while being fitted into the sprocket hole.

In this electronic component inspection apparatus, a plurality of sprocket holes are formed at predetermined intervals in the length direction on at least one side of the film, and the probe moving mechanism operates the claw which can be fitted into the sprocket hole. And a claw moving means for moving the claw in the direction of movement of the contact probe with the claw fitted in the sprocket hole, so that the claw fitted in the sprocket hole is moved by the claw moving means. This makes it possible to easily and reliably move any device hole to the position of the electronic component to be inspected.

[0011] According to the electronic component inspection apparatus of the fourth aspect,
4. The electronic component inspection apparatus according to claim 3, further comprising a sprocket provided with a plurality of claw portions on an outer periphery, the sprocket being rotatable about an axis, and the claw moving means being a roller driving means for rotating and driving the sprocket. A technique is employed.

In this electronic component inspection apparatus, a plurality of pawls are provided on the outer periphery, and the sprocket is rotatable about an axis. The pawl moving means is a roller driving means for rotating and driving the sprocket. The movement amount of the device hole can be adjusted by the rotation amount of the sprocket by the driving means.

According to the electronic component inspection apparatus of the fifth aspect,
5. The electronic component inspection device according to claim 1, wherein the pattern wiring of the contact probe includes:
A technique in which different types of patterns are formed for each device hole is employed.

In this electronic component inspection apparatus, the pattern wiring of the contact probe is formed in a pattern corresponding to a different type of electronic component for each device hole, so that the device hole corresponding to the type of the electronic component to be inspected is provided. Can be appropriately selected.

In the contact probe according to the sixth aspect,
A contact probe having a contact pin for performing an electrical test by being brought into contact with an electrode terminal of an electronic component, wherein the film is formed in a tape shape and a plurality of device holes are formed in a state of being separated from each other in a longitudinal direction; It comprises a plurality of pattern wirings formed on the surface of the film, and the plurality of pattern wirings are arranged such that the tips protrude inward of the device hole to form the contact pins, and form the contact pins. In this case, a technology in which a notch is formed outward from the device hole is employed.

In this contact probe, since the cut portion is formed in the film outward from the device hole, the film around the device hole becomes more flexible, and the contact pin is brought into contact with the electrode terminal of the electronic component at the time of inspection. In this case, by pressing the periphery of the device hole toward the electronic component, the contact pin can be easily projected toward the electrode terminal and can be inclined.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of an electronic component inspection apparatus according to the present invention will be described below with reference to FIGS. In these figures, reference numeral 1 denotes a contact probe, 2 denotes a pattern wiring, 3 denotes an upper die, 4 denotes a lower die, and 5 denotes a chip holder.

The inspection apparatus of the present embodiment is shown in FIGS.
As shown in (1), the electrical characteristics of an electrical circuit and the like formed on the IC chip C after scribing are inspected.
A contact probe 1 having a contact pin 2a for contacting the electrode terminal P of the C chip C and performing an electrical test, and an upper die 3 and a lower die 4 (positioning and supporting the contact probe 1 in a sandwiched state during the test) A probe support mechanism), a chip holder (component holding mechanism) 5 for positioning and holding the IC chip C, and a probe moving mechanism 6 for moving the contact probe 1 in the length direction.

As shown in FIG. 3, the contact probe 1 has a tape-shaped polyimide resin film 7 and a plurality of pattern wirings 2 formed on the surface of the resin film 7.
The resin film 7 has a plurality of rectangular device holes 7 arranged apart from each other in the longitudinal direction.
a is formed. Further, the plurality of pattern wirings 2
The tip is arranged so as to protrude inward of the device hole 7a to form a contact pin 2a. Also,
A rectangular connection pad 2b is formed at the rear end of the pattern wiring 2. And the pattern wiring 2 is N
The contact pin 2a is formed of an i-alloy and has a surface coated with Au.

Further, the contact probe 1 has a plurality of sprocket holes 7b arranged at predetermined intervals in the length direction on both sides of the resin film 7. And
Cut portions 7c are formed in the resin film 7 outward from the four corners of the device hole 7a. Also,
A pattern frame 8 is formed of the same metal as the pattern wiring 2 at the inside of both sides where the sprocket holes 7b are formed and at an intermediate portion of the adjacent device hole 7a.
A rectangular area is divided and formed by the pattern frame portion 8 for each device hole 7a. Reference numeral 7d indicates a positioning hole.

The upper die 3 has a rectangular upper die through window 3a formed at the center thereof, and a projection 3b projecting downward is formed around the lower side of the upper die through window 3a. ing. The lower surface of the protrusion 3b is inclined toward the center, and the contact hole 1 is taught by the upper mold 3 and the lower mold 4, and the device hole 7 is formed by the protrusion 3b.
The periphery of a is pushed downward, and the contact pin 2a projects downward in an inclined state. Further, a plurality of upper die through holes 3 d for alignment with the lower die 4 are formed in the peripheral portion of the upper die 3.

The lower die 4 has a rectangular lower die through window 4a formed in the center, and is set so that the chip holder 5 can be inserted. Further, a lower die through-hole 4b for alignment with the upper die 3 is formed in a peripheral portion of the lower die 4, and a positioning pin 9 is provided in each of the lower die through-hole 4b and the upper die through-hole 3d. The upper die 3 and the lower die 4 are positioned by being penetrated and inserted.

In the lower mold 4, through holes 4c for pogo pins are formed at positions corresponding to the respective connection pads 2b while the contact probe 1 is taught between the lower mold 4 and the upper mold 3. Pogo pins 10 are inserted into the holes 4c to make electrical contact by bringing the tips into contact with the connection pads 2b in a pressed state. In addition, each pogo pin 10
Are electrically connected to a tester (not shown). A pair of guide members 11 arranged along the side surface and guiding both side portions of the contact probe 1 are provided near the side of the upper mold 3 and the lower mold 4.

The chip holder 5 is provided so as to be vertically movable, horizontally moved, rotated and tilted by a cam, a drive motor, etc., not shown, and has a rectangular shape on which an IC chip C is fitted. The concave portion 5a is formed, and a suction hole 5b for vacuum-sucking the IC chip C is formed at the bottom of the concave portion 5a. The suction hole 5b is connected to a vacuum pump (not shown).

The probe moving mechanism 6 includes a pair of sprocket rollers (sprockets) 12A and 12B provided on the outer periphery thereof and having a plurality of claws 12a which can be fitted into the sprocket holes 7b and rotatable about an axis. A roller driving means (claw moving means) 13 such as a driving motor (not shown) for rotating the sprocket roller 12B while the sprocket hole 12a is fitted in the sprocket hole 7b is provided. Reference numeral 14 denotes a feed amount adjusting roller for the resin film 7 having a claw portion 14a fitted into the sprocket hole 7b.

When a probe test or the like of the IC chip C is performed using the inspection device configured as described above, first, the sprocket roller 12 is driven by the roller driving means 13.
By rotating B, the contact probe 1 is pulled out, and a predetermined device hole 7a is moved to the position of the upper die through window 3a. Then, the upper die 3 and the lower die 4 are brought close to each other to hold the contact probe 1 therebetween. At this time, a positioning pin (not shown) provided on the upper die 3 or the lower die 4 is inserted into the positioning hole 4d, and the contact probe 1 is fixed.

On the other hand, the IC chip C to be inspected is fitted into the concave portion 5a of the chip holding table 5, and is held in a suction state by the suction hole 5b. A camera (not shown) recognizes the IC pattern of the IC chip C, and another camera (not shown) recognizes a needle position or a mark (not shown) formed at two or more points on a part of the contact probe 1. Then, the chip holder 5 is moved to perform positioning. After the alignment, the chip holder 5 is moved to the device hole 7a, and each electrode terminal P is brought into contact with the tip of the corresponding contact pin 2a in a pressed state as shown in FIG.

Then, a predetermined electric signal is output from the tester,
By sending from the contact pins 3a of the pattern wiring 3 to the IC chip C via the pogo pins 10, an output signal from the IC chip C is transmitted from the contact pins 2a to the tester, and the electrical characteristics of the IC chip C are measured. .

In this inspection apparatus, the contact probe 1
However, the tape-shaped resin film 7 is formed with a plurality of device holes 7a spaced apart from each other in the longitudinal direction, and the plurality of pattern wirings 2 have their tips directed inward of the device holes 7a. The contact pins 2a are formed in a protruding state.
Can be manufactured in the same manner as the TAB carrier tape, high positional accuracy can be obtained, and the multi-pin with narrow pitch can be easily and inexpensively realized. And even when inspecting IC chips C of different types, that is, those having different arrangements of the electrode terminals P,
It is only necessary to replace the contact probe 1 and the lower mold 4, and various tests can be performed at low cost.

When the contact pins 2a of one device hole 7a are deteriorated by a plurality of long-term use, the contact pins 2a of the other device holes 7a are sequentially used instead of the contact pins 2a. Can also respond. Further, even if the bumps in the electrode terminals of the IC chip C adhere to the contact pins 2a, there is no need to perform cleaning, and the contact pins 2a of the other device holes 7a are provided in the same manner as described above.
Can be replaced.

Further, since the probe moving mechanism 6 for moving the contact probe 1 in the length direction is provided, it is easy to move the contact probe 1 by the probe moving mechanism 6 and perform an inspection at an arbitrary device hole 7a. Become. Further, a plurality of sprocket holes 7b are formed on both sides of the resin film 7 at predetermined intervals in the length direction.
b includes a plurality of sprocket rollers 12A and 12B having a plurality of claw portions 12a that can be fitted to b, and a roller driving unit 13 that rotationally drives the sprocket roller 12B.
Any device hole 7a can be easily and reliably moved to the position of the IC chip C, and the amount of movement of the device hole 7a can be adjusted by the amount of rotation of the sprocket roller 12B. be able to.

Since the notch 7c is formed in the resin film 7 outward from the device hole 7a, the contact pin 2a is connected to the IC chip C during the inspection.
Contact with the electrode terminal P of the device hole 7a.
By pressing the periphery toward the IC chip C, the contact pins 2a can be easily inclined toward the electrode terminals P, and overdrive is easily performed.

Next, a method of manufacturing the contact probe 1 according to the present embodiment will be described in the order of steps with reference to FIGS.

[Base Metal Layer Forming Step] First, as shown in FIG. 4A, a base metal layer 17 is formed on a stainless support metal plate 16 by Cu (copper) plating.

[Pattern Forming Step] After a photoresist layer 18 is formed on the base metal layer 17, as shown in FIG. 4B, a predetermined pattern is formed on the photoresist layer 18 by photolithography. A photomask M is applied and exposed, and as shown in FIG. 4C, the photoresist layer 18 is developed to remove the portions that will become the pattern wiring 2 and the pattern frame portion 8, and the remaining photoresist layer (mask) An opening 18a is formed in 18). At this time, as shown in FIG. 5A, a portion serving as a plating connection portion 2c for electrically connecting the pattern wiring 2 and the pattern frame portion 8 in a later-described plating process is also removed. Opening 1
8b is formed in advance.

In the present embodiment, the photoresist layer 18 is formed of a negative photoresist, but the desired opening 1 is formed by employing a positive photoresist.
8a and 18b may be formed. In the present embodiment, the photoresist layer 18 functions as a “mask”. However, the “mask” is not limited to the one in which the openings 18a and 18b are formed through the exposure and development steps using the photomask M, like the photoresist layer 18 of the present embodiment. . For example, a film or the like in which a hole is formed in advance in a portion to be plated (that is, the film is formed in advance in a state indicated by reference numeral 18 in FIG. 4C) may be used. In the present invention, when such a film or the like is used as a “mask”, the pattern forming step in the present embodiment is unnecessary.

[Plating Step] Then, FIG.
As shown in the figure, the pattern wiring 1 is formed in the openings 18a and 18b.
2. N serving as the pattern frame portion 8 and the plating connection portion 2c
An i-alloy layer N is formed by electrolytic plating. After the plating process, the photoresist layer 18 is removed as shown in FIG.

[Film Adhering Step] Next, FIG.
As shown in FIG. 3, a tape-shaped resin film 7 is adhered to the Ni alloy layer N with an adhesive 19 at a portion other than the portion serving as the contact pin 2a (that is, the tip portion of the pattern wiring 2) shown in FIG. . In addition, the resin film 7 includes
A plurality of device holes 7a and sprocket holes 7
b, a cut 7c and a positioning hole 7d are formed. In addition, these are after a film deposition process,
It may be removed by laser light irradiation or the like.

This resin film 7 is made of polyimide resin P
I is a two-layer tape in which a metal film (copper foil) 500 is integrally provided. Before this film attaching step, the metal film 500 of the two-layer tape is subjected to copper etching using a photoengraving technique to form a ground plane. The polyimide resin PI of the tape is adhered to the Ni alloy layer N via the adhesive 19. The metal film 500 may be made of Ni, Ni alloy or the like in addition to the copper foil.

[Separation Step] Then, as shown in FIG. 4 (g), the portion composed of the resin film 7, the pattern wiring 2, the pattern frame 8 and the base metal layer 17 was separated from the supporting metal plate 16. Thereafter, only the pattern wiring 2 and the pattern frame 8 are bonded to the resin film 7 via Cu etching.

[Gold Coating Step] Then, as shown in FIG.
Plating is applied to form an Au layer AU on the surface. At this time, the Au layer AU is formed on the entire surface of the contact pins 2a protruding from the resin film 7 over the entire circumference. After that, as shown in FIG. 5B, the plating connection portion 2c that electrically connects the pattern wiring 2 and the pattern frame portion 8 is cut at an intermediate portion thereof.

Through the above steps, as shown in FIG. 3, the contact probe 1 for the above-described inspection apparatus in which the contact pins 2a are arranged in the device holes 7a is manufactured. As described above, the pattern wiring 2 including the contact pins 2a can be formed with high precision by patterning using a mask, and the arrangement of the pattern wiring 2 and the contact pins 2a can be changed only by changing the mask. Furthermore, these can be set for each device hole 7a, and various contact probes 1 can be easily and inexpensively formed.

The present invention also includes the following embodiments. (1) As another embodiment, as shown in FIG.
May be extended to the vicinity of the tip of the contact pin 2a. In this embodiment, the contact pin 2a can be more reliably pressed by the tip of the protruding portion 3b at the time of inspection. In this case, the upper die 3 that contacts the contact pin 2a is formed of an insulating material.

(2) As another embodiment, as shown in FIG. 7, a holding member 14 is provided so as to be inserted into the upper die through window 3a and presses the contact pin 2a downward. In addition, a spring member 15 for urging the holding member 14 downward may be provided above the holding member 14. This embodiment is particularly effective when only the protrusion 3b of the upper mold 3 does not sufficiently press the contact pin 2a.
Presses the contact pin 2a downward by the urging force of the spring member 15, so that reliable electrical contact can be made. In this case, the holding member 14 that comes into contact with the contact pin 2a is formed of an insulating material.

(3) The inspection apparatus according to the above-described embodiment uses TAB
The inspection target is the IC chip C for testing, but it may be an inspection target for other electronic components. For example, a device for inspecting another semiconductor chip, a liquid crystal device, or the like may be used.

(4) In the above embodiment, the pattern wiring 2 of the contact probe 1 has the same pattern in each device hole 7a. However, the pattern wiring 2 may be formed in a pattern corresponding to different types of electronic components for each device hole. . In this case, a variety of electronic components can be inspected with one contact probe by appropriately selecting a device hole corresponding to the type of electronic component to be inspected.

[0047]

According to the present invention, the following effects can be obtained. (1) According to the electronic component inspection apparatus of the first aspect, the contact probe includes a tape-shaped film and a plurality of pattern wirings formed on the surface of the film.
A plurality of device holes are formed on the film and are spaced apart from each other in the longitudinal direction. Because it is formed, TA
As with the B carrier tape, a contact probe can be easily manufactured, and a contact can be easily performed with high positional accuracy. In addition, it is possible to easily and inexpensively realize narrow-pitch multi-pins, and the device configuration is simpler than that using a chip carrier. It is also easy to manufacture the inspection device of the invention. Further, the contact pins of a plurality of device holes can be sequentially used, the contact pins can be easily replaced, and a single contact probe can cope with a large number of inspections, and maintenance is not required. In the case of testing a TAB IC chip or the like, a contact probe makes contact like a TAB carrier tape, so that it is possible to perform a test in a state close to actual wiring before assembly.

(2) According to the electronic component inspection apparatus of the second aspect, since the probe moving mechanism for moving the contact probe in the longitudinal direction is provided, the contact probe is moved to an arbitrary position by the probe moving mechanism. It is possible to appropriately select a device hole and easily replace a contact pin.

(3) According to the electronic component inspection apparatus according to the third aspect, a plurality of sprocket holes arranged at predetermined intervals in the length direction are formed on at least one side of the film, and the probe moving mechanism is provided. A claw fitted to the sprocket hole, and a claw moving means for moving the claw in the direction of movement of the contact probe with the claw fitted to the sprocket hole. By moving the portion with the claw moving means, any device hole can be easily and reliably moved to the position of the electronic component to be inspected.

(4) According to the electronic component inspection apparatus of the fourth aspect, a sprocket provided with a plurality of claws on the outer periphery and rotatable about an axis is provided, and the claw moving means rotationally drives the sprocket. Since the roller driving unit is a roller driving unit, the movement amount of the device hole can be adjusted by the rotation amount of the sprocket by the roller driving unit, and the movement can be performed with a relatively simple configuration.

(5) According to the electronic component inspection apparatus of the fifth aspect, since the pattern wiring of the contact probe is formed in a pattern corresponding to a different type of electronic component for each device hole, the inspection is performed. By appropriately selecting a device hole corresponding to the type of electronic component, it is possible to inspect a wide variety of electronic components with one contact probe.

(6) According to the contact probe of the sixth aspect, since the cut portion is formed in the film outward from the device hole, when the periphery of the device hole is pressed toward the electronic component, The contact pins can be easily inclined toward the electrode terminals, so that overdrive can be easily applied and reliable electrical contact can be achieved.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram showing an embodiment of an electronic component inspection apparatus according to the present invention.

FIG. 2 is a cross-sectional view showing one embodiment of an electronic component inspection apparatus according to the present invention.

FIG. 3 is a plan view showing a contact probe in one embodiment of the electronic component inspection apparatus according to the present invention.

FIG. 4 is a fragmentary cross-sectional view showing a contact probe manufacturing method in an embodiment of the electronic component inspection apparatus according to the present invention in the order of steps.

FIG. 5 is a plan view showing an opening serving as a plating connection portion and a cut plating connection portion in a contact probe manufacturing process in one embodiment of the electronic component inspection apparatus according to the present invention.

FIG. 6 is a sectional view showing another embodiment of the electronic component inspection apparatus according to the present invention.

FIG. 7 is a sectional view showing another embodiment of the electronic component inspection apparatus according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 contact probe 2 pattern wiring 2 a contact pin 3 upper die (probe support mechanism) 4 lower die (probe support mechanism) 5 chip holder (component holding mechanism) 6 probe moving mechanism 7 resin film (film) 7 a device hole 7 b sprocket hole 7c Notch 12A, 12B Sprocket roller (sprocket) 12a Claw 13 Roller driving means (claw moving means) C IC chip (electronic component) P electrode terminal

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 2G003 AA07 AA10 AB01 AG03 AG08 AG11 AG16 AG20 AH05 2G011 AA01 AA15 AB07 AC05 AC06 AC21 AE22 AF06 4M106 AA02 BA01 BA14 DD03 DD04 DD10 DD12 DD13 DJ02 DJ04 DJ05 DJ07

Claims (6)

[Claims] 1. A contact probe having a contact pin for performing an electrical test by making contact with an electrode terminal of an electronic component, a probe support mechanism for positioning and supporting the contact probe, and a contact for positioning the electronic component. An electronic component inspection device comprising: a component holding mechanism that holds a pin and the electrode terminal in contact with each other; wherein the contact probe includes a tape-shaped film and a plurality of pattern wirings formed on a surface of the film. A plurality of device holes arranged in the film in a state of being spaced apart from each other in a length direction thereof, and the plurality of pattern wirings are arranged such that tips thereof project inwardly of the device holes. An electronic component inspection device, wherein the contact pins are formed on the electronic component. 2. The electronic component inspection apparatus according to claim 1, further comprising a probe moving mechanism configured to move the contact probe in a length direction. 3. The electronic component inspection device according to claim 2, wherein the contact probe has a plurality of sprocket holes formed at predetermined intervals in a length direction on at least one side of the film. The probe moving mechanism includes: a claw portion that can be fitted into the sprocket hole; and a claw moving device that moves the claw portion in the moving direction of the contact probe in a state of being fitted into the sprocket hole. Characteristic electronic component inspection equipment. 4. The electronic component inspection apparatus according to claim 3, further comprising a sprocket provided with a plurality of claw portions on an outer periphery and rotatable about an axis, wherein the claw portion moving means rotationally drives the sprocket. An electronic component inspection device, which is a roller driving unit. 5. The electronic component inspection device according to claim 1, wherein the pattern wiring of the contact probe is formed in a pattern corresponding to the electronic component of a different type for each of the device holes. Inspection device for electronic components. 6. A contact probe having a contact pin for performing an electrical test by being brought into contact with an electrode terminal of an electronic component, wherein a plurality of device holes are formed in a tape shape and are spaced apart from each other in a longitudinal direction. And a plurality of pattern wirings formed on the surface of the film, wherein the plurality of pattern wirings are arranged so that their tips protrude inward into the device holes to form the contact pins. A contact probe, wherein a cut portion is formed in the film outward from the device hole.