JP2000154252A - Novel silsequioxane-containing polymer and its production - Google Patents
Novel silsequioxane-containing polymer and its productionInfo
- Publication number
- JP2000154252A JP2000154252A JP10328623A JP32862398A JP2000154252A JP 2000154252 A JP2000154252 A JP 2000154252A JP 10328623 A JP10328623 A JP 10328623A JP 32862398 A JP32862398 A JP 32862398A JP 2000154252 A JP2000154252 A JP 2000154252A
- Authority
- JP
- Japan
- Prior art keywords
- substituent
- silsesquioxane
- represent
- polymer
- containing polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 125000001424 substituent group Chemical group 0.000 claims abstract description 19
- -1 vinylsiloxane Chemical class 0.000 claims abstract description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 11
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 10
- 125000003118 aryl group Chemical group 0.000 claims abstract description 10
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 9
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 6
- 239000003054 catalyst Substances 0.000 claims abstract description 5
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 abstract description 10
- 239000002904 solvent Substances 0.000 abstract description 6
- 238000002844 melting Methods 0.000 abstract description 5
- 230000008018 melting Effects 0.000 abstract description 5
- 238000009835 boiling Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- DSVRVHYFPPQFTI-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane;platinum Chemical compound [Pt].C[Si](C)(C)O[Si](C)(C=C)C=C DSVRVHYFPPQFTI-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- OYEDTTNTNYKSFX-UHFFFAOYSA-N 1,3-bis(2-phenylethynyl)benzene Chemical compound C1=CC=CC=C1C#CC1=CC=CC(C#CC=2C=CC=CC=2)=C1 OYEDTTNTNYKSFX-UHFFFAOYSA-N 0.000 description 1
- TZSNBHPFGNSWPO-UHFFFAOYSA-N 1,5-diphenylpenta-1,4-dien-3-one;platinum Chemical compound [Pt].[Pt].C=1C=CC=CC=1C=CC(=O)C=CC1=CC=CC=C1.C=1C=CC=CC=1C=CC(=O)C=CC1=CC=CC=C1.C=1C=CC=CC=1C=CC(=O)C=CC1=CC=CC=C1 TZSNBHPFGNSWPO-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- DSVGQVZAZSZEEX-UHFFFAOYSA-N [C].[Pt] Chemical compound [C].[Pt] DSVGQVZAZSZEEX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- MFWYAJVOUCTAQI-UHFFFAOYSA-N bis[[ethenyl(dimethyl)silyl]oxy]-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C=C MFWYAJVOUCTAQI-UHFFFAOYSA-N 0.000 description 1
- QCZJJBSPIBMMEF-UHFFFAOYSA-N bis[[ethenyl(diphenyl)silyl]oxy]-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=C)O[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)O[Si](C=C)(C=1C=CC=CC=1)C1=CC=CC=C1 QCZJJBSPIBMMEF-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- TXRFFSSLMRVELK-UHFFFAOYSA-N cycloocta-1,3-diene platinum Chemical compound [Pt].C1CCC=CC=CC1.C1CCC=CC=CC1 TXRFFSSLMRVELK-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- NRKAORXHVBNFQC-UHFFFAOYSA-L dichloroplatinum;dimethyl(phenyl)phosphane Chemical compound Cl[Pt]Cl.CP(C)C1=CC=CC=C1.CP(C)C1=CC=CC=C1 NRKAORXHVBNFQC-UHFFFAOYSA-L 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- MMCLUVJVJHWRRY-UHFFFAOYSA-N ethenyl-[[[ethenyl(dimethyl)silyl]oxy-dimethylsilyl]oxy-dimethylsilyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C=C MMCLUVJVJHWRRY-UHFFFAOYSA-N 0.000 description 1
- LNTHABBIUAVISL-UHFFFAOYSA-N ethenyl-[[[ethenyl(diphenyl)silyl]oxy-diphenylsilyl]oxy-diphenylsilyl]oxy-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=C)O[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)O[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)O[Si](C=C)(C=1C=CC=CC=1)C1=CC=CC=C1 LNTHABBIUAVISL-UHFFFAOYSA-N 0.000 description 1
- HOMYFVKFSFMSFF-UHFFFAOYSA-N ethenyl-[ethenyl(diphenyl)silyl]oxy-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=C)O[Si](C=C)(C=1C=CC=CC=1)C1=CC=CC=C1 HOMYFVKFSFMSFF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 238000002523 gelfiltration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- SYKXNRFLNZUGAJ-UHFFFAOYSA-N platinum;triphenylphosphane Chemical compound [Pt].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 SYKXNRFLNZUGAJ-UHFFFAOYSA-N 0.000 description 1
- 229920003205 poly(diphenylsiloxane) Polymers 0.000 description 1
- 229920003209 poly(hydridosilsesquioxane) Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 201000010065 polycystic ovary syndrome Diseases 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Silicon Polymers (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、耐熱性の含ケイ素
ポリマー、なかでも、ケイ素の関わる結合の多くがSi
−O結合であるシリコーン型の、含ケイ素樹脂となる新
型含シルセスキオキサンポリマー及びその製造方法に関
するものである。耐熱性のシリコーン型の含ケイ素樹脂
は、シリコーンレジンといわれるものがその代表例であ
って、各種の皮膜形成材料や各種粉末のバインダー、封
止材、電気絶縁材等に用いられるものである。BACKGROUND OF THE INVENTION The present invention relates to a heat-resistant silicon-containing polymer, in which most of the bonds involving silicon
The present invention relates to a silicone-type silsesquioxane polymer serving as a silicon-containing resin of a silicone type having an —O bond and a method for producing the same. A typical example of the heat-resistant silicone-type silicon-containing resin is a silicone resin, which is used for various film-forming materials, binders for various powders, sealing materials, electric insulating materials, and the like.
【0002】[0002]
【従来の技術】シリコーンレジンは、3官能性のトリク
ロロシランと4官能性のテトラクロロシランの加水分解
によって得られるもので、反応の進行とともに、不溶性
になるため、その使用には自ずと制限があった。2. Description of the Related Art Silicone resin is obtained by hydrolysis of trifunctional trichlorosilane and tetrafunctional tetrachlorosilane, and becomes insoluble with the progress of the reaction. .
【0003】これに対し、3官能性のモノマーだけから
なるラダーシリコーンは、各種の溶媒に可溶である上、
耐熱性、力学強度等が極めて高く、注目を集めている。
しかしながらこのものは、ケイ素上に残る最後の置換基
を変えることができるのみであり、構造の上では、それ
以上の改良が望めない。On the other hand, a ladder silicone consisting of only a trifunctional monomer is soluble in various solvents and
Heat resistance, mechanical strength, etc. are extremely high and attract attention.
However, it can only change the last substituent remaining on the silicon, and no further improvement in structure can be expected.
【0004】一方、3官能性のモノマーは、特定の条件
の下で立方体型の8量体を形成する。このオクタキス
(シルセスキオキサン)のケイ素上の残りの置換基を官
能性のヒドリド基とすると、さらに反応させることが可
能である。また、4官能性のモノマーや、ケイ酸から
も、ヒドロキシ陰イオンを持つ立方体型の8量体を得る
ことができる。これをクロロシランと反応させたり、ヒ
ドロシロキシ基に変えて、さらに反応させることも可能
である。従来、ジエン等とのヒドロシリル化重合や、ジ
クロロシラン等の2官能性シランとの縮重合で結んだポ
リマーが報告されているが、いずれも不溶不融のポリマ
ーとなっている。On the other hand, trifunctional monomers form cubic octamers under certain conditions. If the remaining substituents on the silicon of this octakis (silsesquioxane) are functionalized hydride groups, further reaction is possible. A cubic octamer having a hydroxy anion can also be obtained from a tetrafunctional monomer or silicic acid. This can be reacted with chlorosilane or converted into a hydrosiloxy group for further reaction. Conventionally, polymers linked by hydrosilylation polymerization with a diene or the like or polycondensation with a bifunctional silane such as dichlorosilane have been reported, but all are insoluble and infusible polymers.
【0005】さらに、縮合が不完全なため立方体が崩れ
た形を有しているシルセスキオキサンのジオールが知ら
れており、ジクロロシランと縮合させることにより可溶
性のポリマーが合成されている。しかしこの系統のシル
セスキオキサンは、ケイ素上の置換基がシクロヘキシル
基及びシクロペンチル基のものに限定されており、耐熱
性の点でも不利な、特殊例にすぎない。Further, a diol of silsesquioxane having a shape in which a cube is broken due to incomplete condensation is known, and a soluble polymer has been synthesized by condensation with dichlorosilane. However, this type of silsesquioxane is only a special example in which the substituents on silicon are limited to those of cyclohexyl group and cyclopentyl group, and are disadvantageous in terms of heat resistance.
【0006】本発明者らはすでに、特開平9−2960
43、及び296044において、置換ジイン類または
末端モノイン類と、とオクタキス(ヒドリドシルセスキ
オキサン)即ちペンタシクロ[9.5.1.13,9.1
5,15.17,13]オクタシロキサン(以下、単にPCOS
Iと略す)とのヒドロシリル化重合体が、極めて熱安定
性の高い含シルセスキオキサンポリマーを与えることを
開示した。しかしながらこれらのポリマーはいずれも融
点を示さず、熱による加工や成形が困難であった。The present inventors have already disclosed Japanese Patent Application Laid-Open No. 9-2960.
43, and 296044, with substituted diynes or terminal monoynes, and octakis (hydridosilsesquioxane), ie, pentacyclo [9.5.1.1 3,9 . 1
5,15 . 1 7,13 ] octasiloxane (hereinafter simply referred to as PCOS
(Abbreviated as I) have been disclosed to provide silsesquioxane-containing polymers with very high thermal stability. However, none of these polymers showed a melting point, and it was difficult to process and mold by heat.
【0007】[0007]
【発明が解決しようとする課題】本発明は、オクタキス
(シルセスキオキサン)の骨格を持ちながら、上述のよ
うなシリコーンレジンや、従来知られているシルセスキ
オキサンポリマーのように不溶不融にはならずに、溶媒
に可溶で、融点を有し、しかも耐熱性、難燃性の高いポ
リマーを提供することをその課題とするものである。DISCLOSURE OF THE INVENTION The present invention has an octakis (silsesquioxane) skeleton and is insoluble and infusible like the above-mentioned silicone resin and conventionally known silsesquioxane polymer. An object of the present invention is to provide a polymer that is soluble in a solvent, has a melting point, and has high heat resistance and flame retardancy.
【0008】[0008]
【課題を解決するための手段】本発明者らは、上記課題
を解決するために、鋭意検討した結果、PCOSIとジ
ビニルシロキサン類をヒドロシリル化重合することによ
り、シルセスキオキサン構造を有しながら、溶媒に可溶
で、融点を有し、耐熱性の高い含ケイ素ポリマーが得ら
れることを見いだした。この事実に基づいて、本発明を
完成するに至った。Means for Solving the Problems The present inventors have conducted intensive studies in order to solve the above-mentioned problems, and as a result, they have obtained a silsesquioxane structure by hydrosilylation polymerization of PCOSI and divinylsiloxanes. It has been found that a silicon-containing polymer that is soluble in a solvent, has a melting point, and high heat resistance can be obtained. Based on this fact, the present invention has been completed.
【0009】即ち、本発明によれば、下記一般式(1)That is, according to the present invention, the following general formula (1)
【化4】 (式中、R及びR’は置換基を有していても良いアルキ
ル基または置換基を有していても良いアリール基を表
示、q及びq’は0または正の整数を示し、mは2、
3、または4を示し、m’は2または4を示し、m”は
2、3または4を示し、n、n’、及びn”は0または
正の整数で、それらのうちの少なくとも一つは2以上の
正数を示す)で表される、PCOSI骨格を有する含シ
ルセスキオキサンポリマーが提供される。また、本発明
によれば、前記一般式(1)の含シルセスキオサンポリ
マーを製造するために、Embedded image (Wherein, R and R ′ represent an alkyl group which may have a substituent or an aryl group which may have a substituent, q and q ′ each represent 0 or a positive integer, and m represents 2,
Represents 3 or 4, m ′ represents 2 or 4, m ″ represents 2, 3 or 4, n, n ′ and n ″ are 0 or positive integers, and at least one of them Represents a positive number of 2 or more), and a silsesquioxane-containing polymer having a PCOSI skeleton is provided. Further, according to the present invention, in order to produce the silsesquiosan-containing polymer of the general formula (1),
【化5】 (式中、R及びR’は置換基を有していても良いアルキ
ル基または置換基を有していても良いアリール基を示
し、q及びq’は0または正の整数を示す)で表される
ジビニルシロキサン類と、PCOSlオクタシロキサン
とを白金含有触媒の存在下、ヒドロシリル化重合するこ
とを特徴とする方法が提供される。Embedded image (Wherein, R and R ′ represent an alkyl group which may have a substituent or an aryl group which may have a substituent, and q and q ′ each represent 0 or a positive integer). Provided by subjecting the divinylsiloxanes to be subjected to hydrosilylation polymerization to PCOSl octasiloxane in the presence of a platinum-containing catalyst.
【0010】なお、前記一般式(1)における下記式
(3)で表される部分は、ジビニルシロキサンのビニル
基が異なるPCOSI内のヒドロシリル基と付加的に結
合していることを示す。The portion represented by the following formula (3) in the general formula (1) indicates that the vinyl group of divinylsiloxane is additionally bonded to a hydrosilyl group in a different PCOSI.
【化6】 また、前記一般式(1)における下記式(4)で表され
る部分は、下記式(5)に示す2通りの状態を包含する
ことを示す。Embedded image In addition, the portion represented by the following formula (4) in the general formula (1) indicates that the two states represented by the following formula (5) are included.
【化7】 Embedded image
【化8】 Embedded image
【0011】[0011]
【発明の実施の形態】前記一般式(1)において、R及
びR’は置換基を有していてもよいアルキル基または置
換基を有していてもよいアリール基を示すが、この場合
のアルキル基の炭素数は1〜20、好ましくは1〜6で
ある。また、アリール基の炭素数は6〜20、好ましく
は6〜10である。前記アルキル基の具体例としては、
メチル基、エチル基、イソプロピル基、三級ブチル基、
ヘキシル基等が挙げられ、アリール基の具体例として
は、フェニル基、アニシル基、ナフチル基等が挙げられ
る。BEST MODE FOR CARRYING OUT THE INVENTION In the general formula (1), R and R ′ represent an alkyl group which may have a substituent or an aryl group which may have a substituent. The alkyl group has 1 to 20, preferably 1 to 6 carbon atoms. The aryl group has 6 to 20 carbon atoms, preferably 6 to 10 carbon atoms. Specific examples of the alkyl group include
Methyl group, ethyl group, isopropyl group, tertiary butyl group,
A hexyl group and the like can be mentioned, and specific examples of the aryl group include a phenyl group, an anisyl group, a naphthyl group and the like.
【0012】本発明において反応原料として用いられる
ジビニルシロキサン類は、前記一般式(2)The divinylsiloxane used as a reaction raw material in the present invention is represented by the general formula (2):
【化9】 (式中、R及びR’は、置換基を有していても良いアル
キル基または、置換基を有していても良いアリール基を
表し、q及びq’は0または正の整数を表す)で表され
る化合物である。これらのジビニルシロキサン類を例示
すれば、1,3−ジビニルテトラメチルジシロキサン、
1,5−ジビニルヘキサメチルトリシロキサン、1,7
−ジビニルオクタメチルテトラシロキサン、α,ω−ジ
ビニルポリ(ジメチルシロキサン)、1,3−ジビニル
テトラフェニルジシロキサン、1,5−ジビニルヘキサ
フェニルトリシロキサン、1,7−ジビニルオクタフェ
ニルテトラシロキサン、α,ω−ジビニルポリ(ジフェ
ニルシロキサン)、ビニル末端ジフェニルシロキサン−
ジメチルシロキサンコポリマー等を挙げることができ
る。Embedded image (In the formula, R and R ′ represent an alkyl group which may have a substituent or an aryl group which may have a substituent, and q and q ′ represent 0 or a positive integer.) It is a compound represented by these. Examples of these divinylsiloxanes include 1,3-divinyltetramethyldisiloxane,
1,5-divinylhexamethyltrisiloxane, 1,7
-Divinyloctamethyltetrasiloxane, α, ω-divinylpoly (dimethylsiloxane), 1,3-divinyltetraphenyldisiloxane, 1,5-divinylhexaphenyltrisiloxane, 1,7-divinyloctaphenyltetrasiloxane, α, ω -Divinyl poly (diphenylsiloxane), vinyl-terminated diphenylsiloxane-
A dimethylsiloxane copolymer and the like can be mentioned.
【0013】本発明においては、これらのジビニルシロ
キサン類を、PCOSIとヒドロシリル化反応させて、
PCOSI骨格を有する含シルセスキオキサンポリマー
を合成する。In the present invention, these divinylsiloxanes are subjected to a hydrosilylation reaction with PCOSI,
A silsesquioxane-containing polymer having a PCOSI skeleton is synthesized.
【0014】ヒドロシリル化反応には、白金含有触媒を
用いる。白金含有触媒としては、従来ヒドロシリル化反
応用に使われているものを用いることができる。これを
例示すれば、白金ジビニルテトラメチルジシロキサン、
白金環状ビニルメチルシロキサン、トリス(ジベンジリ
デンアセトン)二白金、塩化白金酸、ビス(エチレン)
テトラクロロ二白金、シクロオクタジエンジクロロ白
金、ビス(シクロオクタジエン)白金、ビス(ジメチル
フェニルホスフィン)ジクロロ白金、テトラキス(トリ
フェニルホスフィン)白金、白金カーボン等が挙げられ
る。[0014] A platinum-containing catalyst is used in the hydrosilylation reaction. As the platinum-containing catalyst, those conventionally used for hydrosilylation reactions can be used. To illustrate this, platinum divinyltetramethyldisiloxane,
Platinum cyclic vinylmethylsiloxane, tris (dibenzylideneacetone) diplatinum, chloroplatinic acid, bis (ethylene)
Examples thereof include tetrachlorodiplatinum, cyclooctadienedichloroplatinum, bis (cyclooctadiene) platinum, bis (dimethylphenylphosphine) dichloroplatinum, tetrakis (triphenylphosphine) platinum, and platinum carbon.
【0015】ヒドロシリル化反応においては、この反応
に通常用いられる種々の溶媒を用いることができる。こ
れを例示すれば、トルエン、ベンゼン、ヘキサン、エー
テル等を挙げることができる。この反応は、0℃から溶
媒の沸点まで種々の温度で実施できるが、特に加熱また
は冷却することなく、室温で行うことができる。この反
応におけるPCOSIとジビニルシロキサン類との比率
は、収率および溶解性の観点から、モル比で2:1〜
1:4の範囲が望ましい。反応後は、そのまま、ポリマ
ー溶液としてキャスト膜等を作成することができるが、
再沈、ゲル濾過カラム、GPCカラム等によって分取し
て用いることもできる。In the hydrosilylation reaction, various solvents commonly used in this reaction can be used. For example, toluene, benzene, hexane, ether and the like can be mentioned. This reaction can be carried out at various temperatures from 0 ° C. to the boiling point of the solvent, but can be carried out at room temperature without particular heating or cooling. The ratio of PCOSI to divinylsiloxanes in this reaction is from 2: 1 to 2 in terms of molar ratio from the viewpoint of yield and solubility.
A range of 1: 4 is desirable. After the reaction, a cast film or the like can be prepared as a polymer solution as it is,
It can also be used after fractionation using a reprecipitation, gel filtration column, GPC column or the like.
【0016】[0016]
【実施例】以下に実施例を示して、本発明の態様を明ら
かにするが、本発明は、もとより以下の実施例に限定さ
れるものではない。The following examples are provided to clarify aspects of the present invention. However, the present invention is not limited to the following examples.
【0017】実施例1 ペンタシクロ[9.5.1.13,9.15,15.17,13]
オクタシロキサン212mg(0.50mmol)、
1,3−ジビニルテトラメチルジシロキサン93mg
(0.50mmol)をトルエン50mlに溶解し、白
金ジビニルテトラメチルジシロキサンのキシレン溶液
(ヒュルスPC072)を10μl加え、室温で3日間
かくはんした。溶液をGPCカラムで分取すると、Mw
=4,300(Mn=2,900)のポリマー[式
(1)、R=メチル、q=q’=0]が101.6mg
(33.3%)得られた。Example 1 Pentacyclo [9.5.1.1 3,9 . 15.15 . 1 7,13 ]
Octasiloxane 212 mg (0.50 mmol),
93 mg of 1,3-divinyltetramethyldisiloxane
(0.50 mmol) was dissolved in 50 ml of toluene, 10 μl of a xylene solution of platinum divinyltetramethyldisiloxane (Huls PC072) was added, and the mixture was stirred at room temperature for 3 days. When the solution was fractionated on a GPC column, M w
= 4,300 (M n = 2,900) [formula (1), R = methyl, q = q ′ = 0] is 101.6 mg.
(33.3%).
【0018】1H NMR(C6D6):−0.2〜0.
5(m)、0.5〜1.0(m)、1.0〜1.5
(m)、4.2〜4.7(m)ppm.1 H NMRから算出するとペンタシクロ[9.5.
1.13,9.15,15.17, 13]オクタシロキサン:1,
3−ビス(フェニルエチニル)ベンゼン=1:1.62
であった。29 Si NMR(C6D6)−84.5〜−83(m)、
−65.5〜−64(m)、7〜8(m)、8〜10
(m)ppm. mp 85−90℃ 1 H NMR (C 6 D 6 ): -0.2 to 0.
5 (m), 0.5 to 1.0 (m), 1.0 to 1.5
(M), 4.2 to 4.7 (m) ppm. When calculated from 1 H NMR, pentacyclo [9.5.
1.1 3,9 . 15.15 . 1 7, 13 ] octasiloxane: 1,
3-bis (phenylethynyl) benzene = 1: 1.62
Met. 29 Si NMR (C 6 D 6 ) -84.5~-83 (m),
-65.5 to -64 (m), 7 to 8 (m), 8 to 10
(M) ppm. mp 85-90 ° C
【0019】このもののTGAを測定した。窒素雰囲気
下、10℃/minで984℃まで加熱した場合の残さ
量は、89.3%であり、Td5は595℃であった。空
気雰囲気下で同様に加熱した場合にも、983℃で9
2.4%が残存し、Td5は569℃に達した。The TGA of this product was measured. The residual amount when heated to 984 ° C. at 10 ° C./min in a nitrogen atmosphere was 89.3%, and T d5 was 595 ° C. When heated similarly in an air atmosphere, the temperature is 9
2.4% remained and T d5 reached 569 ° C.
【0020】[0020]
【発明の効果】本発明によって、通常の有機溶媒に可溶
で、融点を有し、耐熱性、難燃性が高い新しい含シルセ
スキオキサンポリマーが提供される。According to the present invention, there is provided a novel silsesquioxane-containing polymer which is soluble in ordinary organic solvents, has a melting point, and has high heat resistance and flame retardancy.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 田中 正人 茨城県つくば市東1丁目1番 工業技術院 物質工学工業技術研究所内 Fターム(参考) 4J035 BA14 CA02U CA021 CA14M CA14U CA141 GA01 GB03 GB05 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Masato Tanaka 1-1-1 Higashi, Tsukuba, Ibaraki Pref.
Claims (2)
ル基または置換基を有していても良いアリール基を示
し、q及びq’は0または正の整数を表し、mは2、
3、または4を示し、m’は2または4を示し、m”は
2、3または4を示し、n、n’、及びn”は0または
正の整数で、それらのうちの少なくとも一つは2以上の
正数を示す。)で表される、ペンタシクロ[9.5.
1.13,9.15,15.17,13]オクタシロキサン骨格を
有する含シルセスキオキサンポリマー。[Claim 1] The following general formula (1) (Wherein, R and R ′ represent an alkyl group which may have a substituent or an aryl group which may have a substituent, q and q ′ each represent 0 or a positive integer, and m represents 2,
Represents 3 or 4, m ′ represents 2 or 4, m ″ represents 2, 3 or 4, n, n ′ and n ″ are 0 or positive integers, and at least one of them Represents a positive number of 2 or more. ), Pentacyclo [9.5.
1.1 3,9 . 15.15 . [ 17,13 ] Silsesquioxane-containing polymers having an octasiloxane skeleton.
ル基または置換基を有していても良いアリール基を示
し、q及びq’は0または正の整数を示す)で表される
ジビニルシロキサン類と、ペンタシクロ[9.5.1.
13,9.15,1 5.17,13]オクタシロキサンとを白金含
有触媒の存在下、ヒドロシリル化重合することを特徴と
する下記一般式(1) 【化3】 (式中、R及びR’は置換基を有していても良いアルキ
ル基または置換基を有していても良いアリール基を示
し、q及びq’は0または正の整数を示し、mは2、
3、または4を示し、m’は2または4を示し、m”は
2、3または4を示し、n、n’、及びn”は0または
正の整数で、それらのうちの少なくとも一つは2以上の
正数を示す)で表される、ペンタシクロ[9.5.1.
13,9.15,15.17,13]オクタシロキサン骨格を有す
る含シルセスキオキサンポリマーの製造方法。2. A compound of the general formula (2) (Wherein, R and R ′ represent an alkyl group which may have a substituent or an aryl group which may have a substituent, and q and q ′ each represent 0 or a positive integer). Divinylsiloxanes, and pentacyclo [9.5.1.
13-9 . 1 5,1 5. [ 7,13 ] octasiloxane is subjected to hydrosilylation polymerization in the presence of a platinum-containing catalyst, and is represented by the following general formula (1): (Wherein, R and R ′ represent an alkyl group which may have a substituent or an aryl group which may have a substituent, q and q ′ each represent 0 or a positive integer, and m represents 2,
Represents 3 or 4, m ′ represents 2 or 4, m ″ represents 2, 3 or 4, n, n ′ and n ″ are 0 or positive integers, and at least one of them Represents a positive number of 2 or more), pentacyclo [9.5.1.
13-9 . 15.15 . [ 17,13 ] A method for producing a silsesquioxane-containing polymer having an octasiloxane skeleton.
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