JP2000147285A - Optical waveguide module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact optical waveguide module allowed to be stably used over a long period even in an environment of high temperature and high humidity and to be easily assembled at the time of its manufacture by sealing the inside and outside of a package to prevent the generation of dew condensation on an optical waveguide component. SOLUTION: In the optical waveguide module 1, at least a plane type optical waveguide component 2, a temperature sensor 5 for detecting the temperature of the component 2 and a temperature control element 6 for controlling the temperature of the component at a prescribed temperature are stored in a package 10 surrounding these parts. The inside and outside of the package 10 are airtightly sealed by sealing members 15, 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical waveguide module used for an optical communication system, an optical information processing device, and the like.

[0002]

2. Description of the Related Art A planar optical waveguide component has a function of demultiplexing a signal according to the wavelength of an optical signal, but the demultiplexing performance is affected by temperature. For this reason, the optical waveguide component is housed in a package having a cover and a body together with a temperature control element such as a Peltier element in order to keep the temperature constant during use, and is modularized as an optical waveguide module. Here, usually, the temperature of the optical waveguide component is controlled to about 45 ° C. by the temperature control element from the performance of the adhesive used and the like.

Therefore, in the modularized optical waveguide module, for example, when the environmental temperature is higher than 45 ° C., the temperature control element takes heat from the optical waveguide component and releases the heat to the package. On the other hand, when the environmental temperature is lower than 45 ° C., the temperature control element removes heat from the package and gives this heat to the optical waveguide component.

[0004] For this reason, the package needs to efficiently radiate heat to the outside or absorb the heat from the outside. Therefore, fins for heat dissipation and heat absorption may be attached to the package.

[0005]

By the way, the temperature of the optical waveguide component is controlled by the temperature control element as described above.
It is controlled around 5 ° C. For this reason, for example, when the outside air is hot and humid, the air that has entered the package is cooled to about 45 ° C., and condenses on the optical waveguide, which adversely affects temperature control and optical characteristics. May cause.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has been developed for sealing for a long time even in a high-temperature and high-humidity environment by sealing the inside and outside of a package and preventing the occurrence of dew condensation on an optical waveguide component. An object is to provide an optical waveguide module that can be used stably. It is still another object of the present invention to provide an optical waveguide module which is small in size and easy to assemble at the time of manufacturing also as the seal structure.

[0007]

According to the present invention, in order to achieve the above object, at least a planar optical waveguide component,
An optical waveguide module comprising a temperature sensor for detecting the temperature of the planar optical waveguide component and a temperature control element for controlling the temperature of the planar optical waveguide component to a predetermined temperature, in a package surrounding them. Package is
The inside and outside are hermetically sealed by a seal member.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the optical waveguide module according to the present invention will be described below in detail with reference to FIGS. As shown in FIGS. 1 and 2, the optical waveguide module 1 has at least a planar optical waveguide component (hereinafter simply referred to as “optical waveguide component”) 2, a temperature sensor 5 and a temperature control element 6 housed in a package 10. ing.

The optical waveguide component 2 is a planar arrayed optical waveguide component (A) having a waveguide of a desired pattern formed on a substrate.
WG), and is fixed on the heat equalizing plate 7 as shown in FIG. The optical waveguide component 2 has an optical connector 3 on each side.
a and 4a are connected. The optical connectors 3a and 4a
Each is attached to the end of a plurality of input fibers 3 and output fibers 4.

The temperature sensor 5 is a thermistor for detecting the temperature of the optical waveguide component 2, and is positioned and disposed in a storage groove 7 a formed on the upper surface of the heat equalizing plate 7 by a holding plate 8 as shown in FIG. The temperature sensor 5 transmits a temperature signal to an external control device (not shown) via two electric wires 5a.
Here, the heat equalizing plate 7 is for maintaining the temperature of the optical waveguide component 2 uniformly, and for example, a nickel-plated copper plate is used. As shown in FIG. 2, the heat equalizing plate 7 is attached to the metal base 11 with a set screw 7b via a spacer 9 disposed between the heat equalizing plate 7 and a metal base 11 described later.

As the temperature control element 6, for example, a Peltier element is used, and as shown in FIG.
1 is positioned and arranged in a concave portion 11c formed substantially at the center of
It is held between the heat equalizing plate 7 and a metal base 11 described later. As shown in FIG. 1, the temperature control element 6 is supplied with an operating current from two electric wires 6a extending outside the package 10.

The package 10 has a metal base 11 and a cover 12, and FIG. 1 shows a state where the cover 12 is removed. The metal base 11 is formed from a material having excellent thermal conductivity, such as copper or aluminum, and functions as a heat sink. As shown in FIG. 2, the metal base 11 has a peripheral wall 11b formed around the base 11a, and a concave portion 11c for positioning the temperature control element 6 substantially at the center.
Is provided. The metal base 11 is connected to the 3
A mounting hole 11d is formed at a location, and a seal hole 11e communicating from the upper surface of the peripheral wall 11b to the mounting hole 11d is provided.

Here, rubber boots 13 and 14 are attached to the three mounting holes 11d from inside and outside, respectively, in two mounting holes 11d formed in the peripheral wall 11b located on both sides in the longitudinal direction. The rubber boots 13 and 14 are formed in a cylindrical shape from an elastic body such as butyl rubber, and protect the plurality of input fibers 3 and output fibers 4 extending from the package 10 from bending so as not to be disconnected. On the other hand, the remaining one mounting hole 11 d is used to extend the two electric wires 5 a of the temperature sensor 5 and the two electric wires 6 a of the temperature control element 6 out of the package 10.

The cover 12 is a lid plate made of a synthetic resin such as a glass epoxy resin, and has a fitting wall 12a fitted on the inner surface of the peripheral wall 11b on the lower surface. Fitting wall 12a
Has a seal groove 12b formed on the outer periphery thereof,
An O-ring 15 is arranged at the bottom. The cover 12 fits the fitting wall 12a to the inside of the peripheral wall 11b and
2 is applied.

The optical waveguide module 1 is constructed as described above, and the heat equalizing plate 7 to which the optical waveguide component 2 is fixed is attached to the metal base 11 via the spacer 9 by the set screw 7b. At the same time, the plurality of incident fibers 3 and the outgoing fibers 4 are passed through rubber boots 13 and 14, respectively.
The wires 5a and 6c are extended out of the package 10 through the mounting holes 11d. Then, three mounting holes 11
A sealant such as a two-component modified acrylate-based resin is injected and solidified into d to form a seal member 16, and a cover 12 is put on the metal base 11 to assemble the optical waveguide module 1.

Accordingly, the inside and outside of the package 10 of the optical waveguide module 1 are hermetically sealed by the O-ring 15 and the sealing member 16. For this reason, the optical waveguide module 1 does not cause dew condensation on the optical waveguide component 2 due to the intrusion of air into the package 10 and stable temperature control and optical characteristics for a long period of time even in a high-temperature and high-humidity environment. Use is possible. Moreover, since the optical waveguide module 1 has a structure in which the inside and outside of the package 10 are hermetically sealed by the O-ring 15 and the sealing member 16, it is small and easy to assemble during manufacturing.

Next, a second embodiment of the optical waveguide module according to the present invention will be described in detail with reference to FIGS. As shown in FIGS. 4 and 5, the optical waveguide module 20 has at least an optical waveguide component 21, a temperature sensor 25, and a temperature control element 26 housed in a package 30.

The optical waveguide component 21 is a planar arrayed optical waveguide component (AWG) having a waveguide of a desired pattern formed on a substrate, and is fixed on a heat equalizing plate 27 as shown in FIG. . Optical connectors 22a and 23a are connected to both sides of the optical waveguide component 21, respectively. Optical connector 2
2a and 23a are attached to one end of the plurality of input fibers 22 and output fibers 23, respectively. Optical connectors 22b and 23b are attached to the other ends of the plurality of input fibers 22 and output fibers 23.

The temperature sensor 25 is a thermistor for detecting the temperature of the optical waveguide component 21 and, similarly to the temperature sensor 5 of the optical module 1, is positioned and arranged in a storage groove formed on the upper surface of the heat equalizing plate 27 by a pressing plate. I have. Temperature sensor 25
Transmits a temperature signal to an external control device (not shown) via two electric wires 25a. Here, the heat equalizing plate 27 is for maintaining the temperature of the optical waveguide component 21 uniformly, for example,
A nickel-plated copper plate is used. Soaking plate 27
As shown in FIG. 5, is mounted on the metal base 31 with a set screw 27a via a spacer 29 disposed between the metal base 31 and a metal base 31 described later.

As the temperature control element 26, for example, a Peltier element is used. As shown in FIG. 5, the temperature control element 26 is positioned and arranged in a concave portion 31c formed substantially in the center of a metal base 31 described later, and a heat equalizing plate 27 and a metal It is held between the base 31. The temperature control element 26 is, as shown in FIG.
An operating current is supplied from the two electric wires 26a. The package 30 has a metal base 31, an inner case 32, an outer case 33, and a cover 34, and FIG. 4 shows a state where the cover 34 is removed.

The metal base 31 is formed of a material having excellent thermal conductivity, such as copper or aluminum, and functions as a heat sink. As shown in FIG. 5, the metal base 31 has a stepped portion 31a on the outer periphery where the inner case 32 and the outer case 33 are arranged, and a concave portion 31b for positioning the temperature control element 26 is provided substantially at the center. .

The inner case 32 is a cylindrical member fixed to the metal base 31 so as to surround the inner peripheral side of the step portion 31a. As shown in FIG. Are formed. In the inner case 32, two electric wires 25a of the temperature sensor 25 and two electric wires 26 of the temperature control element 26 are provided.
An extension hole (not shown) is provided to extend the hole a to the outside.

The outer case 33 has a step 31a so as to form a seal groove T (see FIG. 4) between the outer case 33 and the inner case 32.
And is fixed to the metal base 31 by a set screw 33a. As shown in FIG. 5, the outer case 33 is formed at a position where two mounting holes 33b for mounting the optical connectors 22b and 23b attached to the other ends of the plurality of input fibers 22 and output fibers 23 face the fiber grooves 32a. Have been. As shown in FIG. 4, a connector hole 33c for attaching the electrical connector 35 is formed in the outer case 33.

The electric connector 35 is connected to two electric wires 25a of the temperature sensor 25 and two electric wires 26a of the temperature control element 26, which are extended from an unillustrated extension hole of the inner case 32, and is connected to an external unillustrated electric wire. Control device and temperature control element 26
Another electrical connector for connecting to a power supply for supplying an operating current to the power supply is connected. The cover 34 is a cover plate made of a synthetic resin such as a glass epoxy resin, and is fixed to the metal base 31 with a set screw 34 a via the inner case 32.

The optical waveguide module 20 is configured as described above, and the heat equalizing plate 27 to which the optical waveguide component 21 is fixed is attached to the metal base 31 via the spacer 29 by the set screw 27a. At the same time, the inner case 32 is arranged on the inner peripheral side of the step 31 a of the metal base 31, and the plurality of input fibers 22 and the output fibers 23 are arranged in the fiber grooves 32 a of the inner case 32.

Then, the optical connectors 22b and 23b of the input fiber 22 and the output fiber 23 are mounted in the mounting holes 33b, and the outer case 33 is fixed to the metal base 31 by set screws 33a. At this time, the temperature sensor 25
And the two wires 2 of the temperature control element 26
6 a is extended from an extension hole (not shown) of the inner case 32 and is connected to the electrical connector 35.

The cover 34 is put on the inner case 32 and is fixed to the metal base 31 together with the inner case 32 by a set screw 34a. Thereafter, a sealant such as a two-component modified acrylate resin is injected into a seal groove T formed between the inner case 32 and the outer case 33 and solidified to form a seal member 36, which is assembled into the optical waveguide module 20. Can be

Accordingly, the inside and outside of the package 30 of the optical waveguide module 20 are hermetically sealed by the seal member 36. For this reason, the optical waveguide module 20 has stable temperature control and optical characteristics for a long time even in a high-temperature and high-humidity environment without air entering the package 30 and dew condensation occurring on the optical waveguide component 21. Use is possible. Moreover, the optical waveguide module 20 includes the sealing member 3
6, the inside and outside of the package 30 are hermetically sealed, so that they are small and easy to assemble during manufacturing.

[0029]

According to the first aspect of the present invention, since the inside and outside of the package are sealed to prevent dew formation on the optical waveguide component, stable use over a long period of time even in a high-temperature and high-humidity environment is achieved. In addition, it is possible to provide an optical waveguide module that is compact and easy to assemble during manufacturing.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first preferred embodiment of an optical waveguide module according to the present invention.

FIG. 2 is a sectional front view of the optical waveguide module of FIG. 1;

FIG. 3 is an enlarged sectional view of a portion A in FIG. 2;

FIG. 4 is a plan view showing a second embodiment of the optical waveguide module of the present invention.

FIG. 5 is a sectional front view of the optical waveguide module of FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical waveguide module 2 Optical waveguide component 3 Incident fiber 4 Output fiber 5 Temperature sensor 6 Temperature control element 7 Heat equalizing plate 8 Holding plate 9 Spacer 10 Package 11 Metal base 12 Covers 13, 14 Rubber boots 15 O ring 16 Seal member 20 Optical waveguide Module 21 Optical waveguide component 22 Incident fiber 23 Outgoing fiber 25 Temperature sensor 26 Temperature control element 27 Heat equalizer 29 Spacer 30 Package 31 Metal base 32 Inner case 33 Outer case 34 Cover 35 Electrical connector 36 Seal member T Seal groove

Claims (1)

[Claims] At least a planar optical waveguide component, a temperature sensor for detecting the temperature of the planar optical waveguide component, and a temperature control element for controlling the temperature of the planar optical waveguide component to a predetermined temperature are surrounded by these components. An optical waveguide module housed in a package, wherein the inside and outside of the package are hermetically sealed by a sealing member.