JP2000141670A - Method for forming thick film layer of microinjection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the durability by preventing the generation of separation lines in a thick film layer of a microinjection device, to reduce the manufacturing process time of the thick film layer, and to make the thickness uniform. To improve the overall printing performance of the printhead by preventing impurities from flowing into the thick film layer. SOLUTION: After forming a thin film layer on a substrate and forming a thick film layer on the thin film layer without going through another heat treatment process,
A single thick film layer is completed by heat-treating both the thin film layer and the thick film layer continuously formed on the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method for forming a thick film layer of a microinjection device, and more particularly to a method of forming a thick film layer for forming a chamber region of a microinjection device.

[0002]

2. Description of the Related Art In recent years, microinjection devices have been rapidly developed with the development of technologies in the electric and electronic fields, and the application range has been expanding over the entire range of life. Here, a microinjecting device is a device that supplies a predetermined amount of electric energy or heat energy to a target object such as ink, scanning liquid, or gasoline when supplying a small amount of the target object to, for example, printing paper, a human body, or an automobile. In addition, it is a device that suitably supplies a trace amount of a target object to a desired target object by changing the volume of the target object. An example of such a microinjection device is an ink jet printer.

[0003] Unlike an existing dot printer, this ink jet printer uses, for example, a cartridge, so that it can print in various colors. Further, the ink jet printer has many advantages such as low driving noise and high print quality, and thus the range of use of the ink jet printer is actually expanding.

Incidentally, a printer head having a nozzle having a small diameter is usually mounted on the ink jet printer. This printer head is turned on / off
By changing the state of the ink in the liquid state into a bubble state or expanding the volume of the ink and ejecting the ink to the outside via the electric signal by turning off, printing on the printing paper can be performed smoothly.

[0005] As the prior art, there have been disclosed many techniques such as many configurations or operation methods of an ink jet printer head. For example, U.S. Pat. No. 4,490,728.
No. 4,809,428, “Thin Film Device for Inkjet Printer Head and Process for the Manufacturing Same”, U.S. Pat. No. 5,140,345, “Method of Manufacturing a Substitute Form
A Liquid Jet Recording Head and Substrate Manufactured by the
Methods ", U.S. Pat. No. 5,274,400," Ink Pass Geometry for High-Temperature Paragraph Operation of Inkjet Printer Head ", or U.S. Pat. No. 5,420,627," Inkjet Printer Head ".

Usually, such a conventional ink jet printer head frequently uses a chemical solution such as an ink or a working solution when performing a printing operation. Therefore, the chemical solution is contained in the structure of the printer head. It is necessary to provide a chamber area for stable storage. Therefore, a thick film layer forming a chamber region is laminated on a substrate forming a printer head, and a chemical solution such as ink or a working solution is stored in a stable state in this chamber region.

This thick film layer usually has a thickness of 10 μm or more so as to sufficiently secure the internal space of the chamber region, and maintains the chemical stability with ink and working solution. ， Organic material is adopted.

Conventionally, in order to form a thick film layer having a desired thickness, an organic material layer having a predetermined thickness is spin-coated once on a substrate on which a protective film is formed, and the spin-coated organic material layer is formed. The layer is continuously subjected to a drying treatment and a heat treatment to form a primary thin film layer primarily. By repeating such a thin film layer forming step, a plurality of thin film layers can be continuously formed on the basic thin film layer.

For example, a thick film layer having a thickness of 10 μm is 1 μm thick.
Is formed by repeating a process of forming a thin film layer having a thickness of 10 times. At this time, each time a thin film layer is formed, the drying process and the heat treatment process are repeated the same number of times.
When such a thin film layer forming process is repeated several times, a plurality of thin film layers are stacked in multiple layers to form a thick film layer having a desired thickness, and the completed thick film layer is placed at an appropriate position on the printer head. It is firmly assembled.

[0010]

However, in the conventional method for forming a thick film layer of an ink jet printer head, a clear separation line is generated at each interface between the thin film layers forming the thick film layer. Remain until the thick film layer is assembled into the structure of the printer head. As a result, there is a problem that the overall durability of the printer head is reduced.

Therefore, a first object of the present invention is to improve the durability by removing the separation line of the thick film layer.

Further, since the conventional thick film layer is formed by repeating the drying process and the heat treatment process, there is a problem that the entire time of the manufacturing process increases. Therefore,
A second object of the present invention is to reduce the manufacturing process time of the thick film layer and maintain the thickness uniform.

Further, in order to form a thick film layer, a step of completely forming one thin film layer and then forming a next thin film layer must be repeated. Is difficult to maintain uniformly. In particular, there is a problem that impurities such as dust flow in the process of forming each thin film layer, and the overall performance of the printer head is significantly reduced.

A third object of the present invention is to prevent impurities from flowing into the thick film layer. A fourth object of the present invention is to improve the overall printing performance of a printer head.

[0015]

According to a first aspect of the present invention, there is provided a method for forming a thick film layer for forming a chamber region of a microinjection device, wherein a protective film is formed. A first step of first applying an organic solution on the substrate to form a first organic solution layer while rotating the formed substrate at a first speed for a predetermined time; and rotating the substrate at a second speed. While rotating for a predetermined time,
A second step of secondly applying the organic solution on the first organic solution layer to form a second organic solution layer thicker than the first organic solution layer; and After drying the solution layer at a predetermined temperature for a predetermined time, a third step of forming a single thick film layer comprising a first organic film layer and a second organic film layer by a predetermined heat treatment; A fourth step of forming the chamber region by etching the single thick layer so as to be exposed, and a fifth step of separating the single thick layer from the substrate. A method for forming a thick film layer of a microinjection device is provided.

In the present invention, the single thick film layer is formed by continuously laminating the first organic film layer which is a thin film layer and the second organic film layer which is a thick film layer without passing through another heat treatment step. As a result, a single thick film layer having a final structure is formed, so that no separation line occurs and the overall durability of the printer head can be maintained for a long time. Further, since the separation line can be removed, the inflow of impurities generated during the process can be cut off in advance, and the thickness of the finally formed single thick film layer can be maintained uniform. As a result, the overall performance of the printer head is significantly improved.

According to the second aspect of the present invention, since the organic solution is a polyimide solution, even if a chemical solution such as an ink and a working solution is stored, a chamber formed of an organic material is used. The chemical stability of the region can be maintained. As a result, a chemical solution such as an ink or a working solution is stably stored.

According to the third aspect of the present invention, since the organic solution has a viscosity coefficient of 1.03 cp, a uniform wave is generated inside the polyimide solution due to the viscosity between the solutions. And a first layer of uniform thickness
An organic layer (thin film layer) is formed, and a second organic solution layer (thick film layer) having a uniform thickness can be formed on the first organic solution layer.

In the invention described in claim 4, in the first step, the first speed is from 450 rpm to 5 rpm.
The polyimide solution applied to the upper portion of the substrate from the application device is applied around the substrate by the centrifugal force of the high-speed rotation of the substrate, so that the first organic solution layer having a uniform thickness is formed on the substrate. (Thin film layer) can be formed. Further, as in the invention according to claim 5, the first
In the step, the predetermined time of the first speed is from 35 seconds to
If the time is set to 45 seconds, the first organic solution layer (thin film layer) having a more preferable uniform thickness can be formed on the substrate under a suitable time condition.

Further, in the invention described in claim 6, in the first step, the thickness of the first organic solution layer is set to 0.1.
Since it is configured to be 5 μm to 5 μm, on the substrate,
A first organic solution layer (thin film layer) having a suitable thickness is formed.
In particular, if the thickness of the first organic solution layer is configured to be 1 μm to 2 μm as in the invention according to claim 7,
On the substrate, a first organic solution layer (thin film layer) having the most suitable thickness is formed.

Further, in the invention described in claim 8, in the second step, the application amount of the organic solution and the rotation speed of the substrate are:

[0022]

(Equation 1)

(Where h is the total thickness of the first organic solution layer and the second organic solution layer, h1 is the thickness of the first organic solution layer, and h2 is the thickness of the second organic solution layer to be formed. , Ε is a coefficient by which the first organic solution layer and the second organic solution layer decrease in the heat treatment process, A
Is a constant, v is the solution cohesion coefficient, ω is the secondary rotation speed of the substrate, S is the surface area of the substrate, and V is the secondary coating amount of the solution. By substituting various experimental values into the above equation based on the thickness of the second organic solution layer to be used, the final value such as the suitable amount of the organic material solution to be applied or the secondary rotation speed of the substrate can be accurately determined. Can be calculated.

According to the ninth aspect of the present invention, in the second step, the amount of the organic solution applied is 0.6 cm.
Since the thickness is set to ^{3 to} 0.8 cm ³ , a suitable amount of the organic solution for forming the second organic solution layer (thick film layer) having a suitable thickness on the substrate can be obtained.

Further, in the invention according to claim 10, in the second step, the second speed is in a range of 20 rpm to 4 rpm.
Since the rotation speed of the substrate is set to 0 rpm, the polyimide solution applied from the coating device onto the first organic solution layer by the low-speed rotation of the substrate can be applied around the first organic solution layer by centrifugal force. At this time, a uniform wave is generated inside the polyimide solution due to the viscosity between the solutions, and a second organic solution layer (thick film layer) ′ having a uniform thickness is formed on the first organic solution layer. . Further, in the second step, if the predetermined time of the second speed is configured to be 30 seconds to 40 seconds, the second step
Since a suitable time condition of the speed can be obtained, the second organic solution layer (thick film layer) having a more preferable thickness is formed on the first organic solution layer.
Can be formed.

In the twelfth aspect, in the second step, the thickness of the second organic solution layer may be 1
Since it was configured to be 8 μm to 22 μm, it was formed on the first organic solution layer. A second organic solution layer (thick film layer) having a suitable thickness is formed.

In the thirteenth aspect of the present invention, in the third step, the drying temperature is from 80 ° C. to 90 ° C.
The first organic solution layer and the second organic solution layer can be dried at the same time. Furthermore, in the invention according to claim 14, in the third step, the drying time is configured to be 25 minutes to 35 minutes.
Drying conditions that can form a single thick film layer in a single drying process are obtained, so there is no need to repeat the drying process each time a thin film layer is formed as in the past, and it is unnecessary in the film forming process Since the required time is reduced, the entire manufacturing process time can be significantly reduced.

In the invention according to claim 15, the heat treatment includes a first heat treatment at a temperature of 200 ° C. to 220 ° C. and a second heat treatment at a temperature of 300 ° C. to 330 ° C. Since the first and second organic solution layers are hardened at the same time, suitable temperature conditions for simultaneously curing the first and second organic solution layers can be obtained. In the invention according to claim 16, the first heat treatment time is 25 minutes to 35 minutes and the second heat treatment time is 60 minutes to 70 minutes. Heat treatment conditions that enable a single thick film layer to be formed by heat treatment are obtained, eliminating the need for repeated heat treatments each time a thin film layer is formed as in the past, reducing unnecessary time in the film formation process. Therefore, the entire manufacturing process time can be significantly reduced.

[0029]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
In the following description and the accompanying drawings, components having the same functions and configurations will be denoted by the same reference numerals, and redundant description will be omitted.

In the embodiment of the present invention, the substrate is coated with a solution of an organic material, preferably a polyimide material, on the substrate on which the protective film is formed, while applying the solution at 450 rpm to 550 rpm.
By rotating at a high speed of rpm, 0.5
A thin film layer of about μm to 5 μm is formed. Then, unlike the conventional case, the substrate on which the thin film layer is formed is rotated at a low speed of 20 rpm to 40 rpm while the organic material solution is secondly applied on the thin film layer immediately without going through a heat treatment step to protect the thin film layer. A thick film layer having a thickness of about 18 μm to 22 μm is formed on the film.

Next, the thin film layer and the thick film layer formed continuously on the substrate are simultaneously heat-treated to form a single thick film layer. At this time, unlike the conventional method, the single thick film layer formed does not perform the heat treatment for each thin film layer or thick film formation process, but performs the heat treatment after coating two layers in succession. No separation line is formed for each layer.

(First Embodiment) First, a microinjection device according to a first embodiment will be described with reference to FIGS. FIG. 1 is an explanatory diagram for explaining a step of forming a single thick film in the method for forming a thick film layer of a microinjection device according to the present embodiment.

As shown in FIG. 1, the substrate 1 made of Si, on which the protective film 2 made of SiO 2 is formed, is primarily rotated by driving a rotary stage (not shown). A solution of a material (particularly, polyimide solution) is first applied on the substrate 1 to form a first organic solution layer 31 ′ on the protective film 2 of the substrate 1. The viscosity coefficient of this polyimide solution is 1.03 cp.

The primary rotation speed of the substrate 1 is, for example, 45
0 rpm to 550 rpm, and rotation time is 35 rpm.
Seconds to 45 seconds. When the substrate 1 rotates at a high speed in this manner, the polyimide solution applied on the substrate 1 by the coating apparatus 100 is applied around the substrate 1 by centrifugal force, and as a result, the polyimide solution is uniformly applied on the protective film 2 of the substrate 1. The first organic solution layer 31 'having a large thickness is formed. This first organic solution layer 31 '
Is 0.5 μm to 5 μm (preferably 1 μm to 2 μm).
m).

Next, while the substrate 1 on which the first organic solution layer 31 ′ is formed is secondarily rotated by driving a rotary stage, a solution of an organic material is applied onto the first organic solution layer 31 ′ by the coating apparatus 100. Next, a second organic solution layer 32 ′ is formed. At this time, the secondary application amount of the organic material solution is set to 0.1.
The organic material solution preferably has a viscosity of 6 μm to 0.8 μm and a viscosity coefficient of 1.03 cp.

Here, the secondary rotation speed of the substrate 1 is 20 rpm
It has a low speed of m to 40 rpm and a rotation time of 30 to 40 seconds. When the substrate 1 rotates at a low speed in this manner, the polyimide solution applied on the first organic solution layer 31 'by the application device 100 is applied around the first organic solution layer 31' by centrifugal force. At this time, a uniform wave is generated in the polyimide solution due to the viscosity between the solutions, and the second organic solution layer 32 'having a uniform thickness is formed on the first organic solution layer 31'.
Is formed. The second organic solution layer 32 ′
Preferably, the thickness is 8 μm to 22 μm.

At this time, the “secondary application amount of the organic material solution”, the “secondary rotation speed of the substrate”, and the like are accurately calculated by the following equation.

[0038]

(Equation 2)

Here, h is the total thickness of the first organic solution layer and the second organic solution layer, h1 is the thickness of the first organic solution layer, h2 is the thickness of the second organic solution layer to be formed, ε is a coefficient by which the first organic solution layer and the second organic solution layer decrease in the heat treatment step, A is a constant, v is the viscosity coefficient of the solution, ω is the secondary rotation speed of the substrate, S
Is the surface area of the substrate, and V is the secondary application amount of the solution.

In this case, the operator substitutes various experimental values in the above equation with reference to the thickness of the second organic solution layer 32 'to be finally formed, thereby obtaining "2.
It is possible to calculate the final values of "the next application amount" and "the secondary rotation speed of the substrate".

In the present embodiment, the values of the “second application amount of the organic material solution” and the “secondary rotation speed of the substrate” are based on the thickness (18 μm to 22 μm) of the second organic solution layer 32 ′. By substituting various experimental values that can be selected into the above equation, the final coating amount of organic material solution (0.6%) can be obtained.
μm to 0.8 μm), the secondary rotation speed of the substrate (20 rpm)
４０40 rpm) is calculated. As a result, the first organic solution layer 3 as a thin film layer is formed on the substrate 1 on which the protective film 2 is formed.
1 'and a second organic solution layer 32', which is a thick film layer, are sequentially laminated to form a single organic solution layer 30 'in which two layers are continuously laminated.

Next, the substrate 1 on which the single organic solution layer 30 ′ is formed is carried out of the rotary stage, and
Into a heating tank (not shown) and a single organic solution layer 3
The first organic solution layer 31 'and the second organic solution layer 32' forming 0 'are dried and heat-treated. This drying process is performed at a temperature of 80 ° C to 90 ° C for 25 minutes to 35 minutes,
The heat treatment is performed at a temperature of 200 ° C to 220 ° C for 25 minutes to 35 minutes.
1 minute heat treatment for 6 minutes at a temperature of 300 ° C. to 330 ° C.
It is preferable to continuously perform the second heat treatment for 0 to 70 minutes.

As a result, as shown in FIG. 2, the first organic solution layer 31 'and the second organic solution layer 32' forming the single organic solution layer 30 'are hardened, and the first organic film layer which is a thin film layer is formed. Layer 31
And a second organic film layer 32, which is a thick film layer, is formed as a single thick film layer 30 continuously laminated.

In the present embodiment, unlike the prior art, the first organic solution layer 3 is formed without a separate heat treatment step for each layer.
1 'and the second organic solution layer 32' are formed continuously and are simultaneously thermoset, so that the first organic film layer 31 which is a thin film layer and the second organic film layer 32 which is a thick film layer are continuously formed. A single thick film layer 30 to be laminated is formed. Thus, the separation line conventionally formed between the first organic film layer 31 and the second organic film layer 32 can be removed. As a result, the overall durability of the printhead is not reduced since the single thick layer 30 is assembled within the structure of the printhead.

Further, in the present embodiment, since a single thick film layer is formed by performing a single drying process and a heat treatment process, the overall manufacturing process time can be significantly reduced. Further, in the present embodiment, since one thin film layer and one thick film layer are continuously formed to form the single thick film layer 30, unnecessary time in the film forming process can be reduced. Further, since no impurities are introduced during the process, the thickness of the finally formed single thick film layer can be kept uniform. As a result, the overall performance of the printer head can be significantly improved.

Next, a method of forming a chamber region will be described with reference to FIGS. FIG. 2 is an explanatory diagram for explaining a process of forming a chamber region. FIG.
It is explanatory drawing for demonstrating the isolation | separation process of a single thick film layer.

As shown in FIG. 2, after forming a pattern film (not shown) on the thick film layer 30, it is masked with the pattern film and the thick film layer 30 exposing the protective film 2 is removed by etching. . Thereafter, the remaining pattern film is removed with a chemical solution, thereby completing the single thick film layer 30 having the final structure in which the chamber region 33 is formed.

Next, as shown in FIG. 3, when the step of forming the chamber region 33 is completed, the single thick film layer 30 is
The substrate is separated from the substrate 1 by a chemical solution such as F, and a single thick film layer 30 is finally completed. The single thick film layer 30 is firmly fixed to an appropriate position of the printer head 200, so that the overall printing operation can be improved.

Next, an example of using a single thick film layer according to this embodiment will be described with reference to FIG. FIG. 4 is an explanatory diagram for explaining an example of using a single thick film layer according to the present embodiment.

As shown in FIG. 4, the single thick film layer 30 according to this embodiment is fixed on the substrate 1, for example, to the nozzle plate 8 on which the nozzles 10 are formed. At this time,
An ink supply channel 300 serving as an ink supply path is formed on the side of the chamber region 33, and ink supplied from the outside flows in the direction of the arrow along the ink supply channel 300 to fill the chamber region 33. You. Here, a plurality of nozzles 10 for ejecting ink are formed in the nozzle plate 8, and the nozzles 10 penetrate through the inside of the nozzle plate 8 and are exposed on the outer surface.

Next, an operation method of the microinjection device employing the single thick film layer according to the present embodiment having the above configuration will be described with reference to FIG. FIG.
FIG. 3 is an explanatory diagram for explaining an operation state of the microinjection device employing the single thick film layer according to the embodiment, and is a cross-sectional view taken along line II of FIG. 2.

As shown in FIG. 5, an external power source supplies an electrode layer.
When an electric signal is applied (not shown), the heater 11 in contact with the electrode layer is rapidly heated to a high temperature of 500 ° C. or more by the supply of the electric energy. In this step, the electric energy is converted into heat energy of about 500 ° C. to 550 ° C.

Next, this heat energy is transmitted to the chamber region 33 which comes into contact with the heater 11, and
3 rapidly heats the ink 400 filled therein,
Bubbles are generated.

At this time, the heat energy is transferred to the chamber region 33.
When the ink is continuously transmitted to the inside, the volume of the bubble-shaped ink 400 rapidly expands and is pushed out through the nozzles 10 of the nozzle plate 8 to be in a state immediately before ejection. The ink 400 immediately before the ejection is deformed into an elliptical shape or a circular shape by the weight of the ink, and is ejected to an external print sheet. As a result, quick printing is performed on the printing paper placed outside.

Further, if the electric signal from the external power supply is momentarily cut off during the execution of the ink 400,
Since the heater 11 is rapidly cooled, the chamber region 33 is cooled.
The ink 400 in the bubble state remaining in the inside rapidly shrinks, and a restoring force for returning to the normal state is generated. This restoring force sharply reduces the pressure in the chamber region 33, so that the ink flowing through the ink supply channel 300 is quickly refilled in the chamber region 33.

Hereinafter, the ink jet printer head is
By continuously repeating the above-described ink ejection step and ink refilling step via an electric signal, a quick printing operation is performed on a printing sheet supplied from the outside.

As described above, in the present embodiment, since the single thick film layer 30 is formed by continuously forming the first organic film layer 31 and the second organic film layer 32 without performing heat treatment for each layer. Since no separation line is generated, it is possible to maintain strong durability for a long time. Further, in the present embodiment, the first organic film layer 31 which is a thin film layer and the second organic film layer 32 which is a thick film layer are continuously laminated without going through another heat treatment step, so that the final structure has a single structure. A thick film layer 30 is formed. As a result, the separation line can be removed, and the inflow of impurities generated during the process can be cut off in advance.

Although the preferred embodiment according to the present invention has been described above, the present invention is not limited to such a configuration.
Those skilled in the art can envisage various modified examples and modified examples within the scope of the technical idea described in the claims, and those modified examples and modified examples are also included in the technical scope of the present invention. It is understood to be included in.

For example, in the above embodiment, the ink jet printer head has been described as an example, but the present invention is not limited to this example. For example, the present invention can be applied to all devices to which a microinjection device is applied, such as a micropump of a medical device and a fuel injection device.

Further, in the above-described embodiment, the description has been given by taking as an example a configuration in which a polyimide solution is used as the organic solution for forming the thin film layer and the thick film layer, but any other suitable organic solution may be used. be able to.

[0061]

According to the present invention, a single thick film layer is formed by continuously laminating a first organic film layer as a thin film layer and a second organic film layer as a thick film layer without going through a separate heat treatment step. Since a single thick film layer is formed, no separation line is generated, and the overall durability of the printer head can be maintained for a long time. Further, since the separation line can be removed, the inflow of impurities generated during the process can be cut off in advance, and the thickness of the finally formed single thick film layer can be maintained uniform. As a result, the overall performance of the printer head is significantly improved.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram for explaining a step of forming a single thick film layer in a method of forming a thick film layer of a microinjection device according to an embodiment.

FIG. 2 is an explanatory diagram for explaining a step of forming a chamber region in the method for forming a thick film layer of a microinjection device according to the embodiment.

FIG. 3 is an explanatory diagram for explaining a step of separating a single thick film layer in the method for forming a thick film layer of a microinjection device according to the present embodiment.

FIG. 4 is an explanatory diagram for explaining a usage example of a single thick film layer according to the embodiment.

FIG. 5 is an explanatory diagram for explaining an operation state of the microinjection device employing the single thick film layer according to the embodiment, and is a cross-sectional view taken along line II of FIG. 2;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Protective film 8 Nozzle plate 10 Nozzle 11 Heater 30 Single thick film layer 30 'Single organic solution layer 31' First organic solution layer 31 First organic film layer 32 'Second organic solution layer 32 Second organic film Layer 33 Chamber area 100 Coating device 200 Printer head 300 Ink supply channel 400 Ink

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Zhukov Andrei Alexandrovich Russia 109029 Moscow Nizegorods Kaya Street 9-B Apartment 29

Claims (16)

[Claims] 1. A method for forming a thick film layer for forming a chamber region of a microinjection device, comprising: rotating a substrate on which a protective film is formed at a first speed for a predetermined time while holding an organic solution on the substrate. A first step of forming a first organic solution layer by applying a first solution, and a second application of the organic solution onto the first organic solution layer while rotating the substrate at a second speed for a predetermined time. Forming a second organic solution layer thicker than the first organic solution layer, drying the first organic solution layer and the second organic solution layer at a predetermined temperature for a predetermined time, and then performing a predetermined heat treatment. A third step of forming a single thick film layer comprising a first organic film layer and a second organic film layer, and etching the single thick film layer so that a predetermined portion of the protective film is exposed; A fourth step of forming a region;
A fifth step of separating the single thick layer from the substrate;
A method for forming a thick film layer of a microinjection device, comprising: 2. The method according to claim 1, wherein the organic solution is a polyimide solution. 3. The organic solution has a viscosity coefficient of 1.03 c.
3. The method for forming a thick film layer of a microinjection device according to claim 1, wherein p is p. 4. The microinjection device according to claim 1, wherein, in the first step, the first speed is in a range of 450 rpm to 550 rpm. A method for forming a thick film layer. 5. The method according to claim 1, wherein in the first step, the predetermined time of the first speed is 35 seconds to 45 seconds. A method for forming a thick film layer of the microinjection device according to the above. 6. The method according to claim 1, wherein, in the first step, the thickness of the first organic solution layer is 0.5 μm to 5 μm. The method for forming a thick film layer of a microinjection device according to claim 1. 7. The thickness of the first organic solution layer is 1 μm 2.
7. The method for forming a thick film layer of a microinjection device according to claim 6, wherein the thickness is μm. 8. In the second step, the amount of the organic solution applied and the rotation speed of the substrate are: 4. The method according to claim 1, wherein
8. The method for forming a thick film layer of a microinjection device according to any one of items 5, 6, and 7. (Where h is the total thickness of the first organic solution layer and the second organic solution layer, h1
Is the thickness of the first organic solution layer, and h2 is the second
The thickness of the organic solution layer, ε is a coefficient by which the first organic solution layer and the second organic solution layer are reduced in the heat treatment process, A is a constant, v is the viscosity coefficient of the solution, ω is the secondary rotation speed of the substrate, and S is Substrate surface area, V
Is the secondary coating amount of the organic solution) 9. A second step, claims the coating amount of the organic solution, characterized in that a 0.6cm ³ ~0.8cm ³ 1,2,3,4,5,6,7 9. A method for forming a thick film layer of a microinjection device according to any one of items 8 to 8. 10. The method according to claim 1, wherein in the second step, the second speed is in a range of 20 rpm to 40 rpm. The method for forming a thick film layer of a microinjection device according to claim 1. 11. The method according to claim 1, wherein in the second step, the predetermined time of the second speed is 30 seconds to 40 seconds. 11. The method for forming a thick film layer of a microinjection device according to any one of items 9, 9 and 10. 12. The method according to claim 1, wherein in the second step, the thickness of the second organic solution layer is 18 μm to 22 μm. , 9,
12. The method for forming a thick film layer of a microinjection device according to any one of items 10 and 11. 13. The method according to claim 1, wherein in the third step, the drying temperature is 80 ° C. to 90 ° C. 13. The method for forming a thick film layer of a microinjection device according to any one of items 11, 11 and 12. 14. The method according to claim 1, wherein in the third step, the drying time is 25 minutes to 35 minutes. , 11,1
14. The method for forming a thick film layer of a microinjection device according to any one of 2 and 13. 15. The heat treatment according to claim 1, wherein the first heat treatment at a temperature of 200 ° C. to 220 ° C. and the second heat treatment at a temperature of 300 ° C. to 330 ° C. are sequentially performed. , 2,3,4,5,6,7,8,9,10,11,
15. The method for forming a thick film layer of a microinjection device according to any one of items 12, 13, and 14. 16. The first heat treatment time is from 25 minutes to 35 minutes.
And the second heat treatment time is 60 minutes to 70 minutes.
The method for forming a thick film layer of a micro-injection device according to claim 15, wherein: