JP2000133977A - Radiator for electronic equipment - Google Patents

Abstract

(57) [Problem] To sufficiently radiate heat generated from an electronic component in a housing to the outside of the housing. Improve heat dissipation performance. Reduce the number of parts and reduce manufacturing costs. The heat dissipating device (heat sink) and the heat-generating electronic components such as the MPU are very easily and firmly connected by so-called clipping. A heat radiating device to be attached to one side of a heat conductive metal plate constituting one side wall of an electronic component storage case disposed in a housing is provided.
And a clip (mounting member) 8 having mounting hooks 9, 9 inserted into the insertion holes 10, 10 of the heat conductive metal plate 3. A concave groove 13 for fitting a part of the clip 8 is provided.
Radiation fins 6 are provided on the other surface of 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating device for use in an electronic device, particularly preferably a desktop electronic device, which radiates heat generated from an electronic component disposed in a housing of the electronic device to the outside of the housing. .

[0002]

2. Description of the Related Art Generally, in an electronic device such as a desktop personal computer, it is necessary to radiate heat generated from an electronic component such as an MPU (microprocessor unit), which is a constituent element, to the outside of a housing. In particular, in the field of electronic devices of this type, recently, multifunctionality and processing speed have been remarkably increased.
The output of heat-generating electronic components such as PUs has increased, and the amount of heat generated has significantly increased.

A conventional heat sink is one in which active fins are attached to a heat dissipation board made of an extruded material, a heat dissipation board made of die casting, or a heat dissipation board made by forging. Screws and rivets were the mainstream for connection with the case.

[0004]

However, such a conventional heat radiator requires a large number of assembling steps, requires torque control, and has problems in cost and quality.

Recently, a heat sink and an MPU
The so-called clipping is also increasing as a means of coupling with the case where heat-generating electronic components are stored.However, in the case of fan cooling, when connecting the ventilation duct, heat sink, and electronic component storage case, the cooling air from the duct is cooled. If there is leakage, it is not possible to send a specified amount of cooling air to the heat sink, causing a problem of insufficient performance.Therefore, conventionally, it is necessary to separately connect the ventilation duct and heat sink, and the electronic component storage case and heat sink separately. Or, in anticipation of cooling air leakage to some extent, the three members were joined together.

As a method of connecting the heat sink and the electronic component storage case by such clipping, for example, a combination of a heat sink and a mounting member described in JP-A-7-153879, and an electric method described in JP-A-7-183679. A clamp assembly having an insulating fastener and a heat sink assembly described in Japanese Patent Application Laid-Open No. H8-204078 are known. In each case, the heat sink is stopped using a clip attached from the side of the heat radiation fin. In addition, there has been a problem that the joining operation using the clip is not one-touch and is relatively troublesome.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and to sufficiently radiate heat generated from electronic components in a housing to the outside of the housing.
To provide a heat radiating device for electronic equipment, which has excellent heat radiation performance and requires a small number of parts, so that the manufacturing cost is very low.Also, it is possible to minimize the leakage of cooling air from the ventilation duct, It is an object of the present invention to provide a heat radiating device for electronic equipment which can very easily and firmly connect a heat radiation electronic unit (heat sink) and a heat generating electronic component storage case such as an MPU by so-called clipping with one touch.

[0008]

According to a first aspect of the present invention, there is provided a heat radiating device provided in an electronic device and emitted from an electronic component disposed in a housing of the electronic device. A heat dissipating device for dissipating heat to the outside of the housing, a heat dissipating substrate to be attached to one side of a heat conductive metal plate forming one side wall of the electronic component storage case disposed in the housing, and a heat conductive metal. A clip (attachment member) having an attachment hook inserted into the insertion hole of the plate, wherein a concave groove for fitting a part of the clip is provided on a surface of the heat dissipation substrate on the side of the heat conductive metal plate; Is characterized in that a radiation fin is provided on the other surface.

In the heat radiating device according to the first aspect, the heat radiating substrate is made of an extruded shape, and a concave groove for fitting a part of the clip into the heat conductive metal plate side surface of the heat radiating substrate is formed by extruding the heat radiating substrate. It is preferable that the radiating fins provided on the other side of the radiating substrate are formed of parallel skive fins cut and raised in a direction orthogonal to the extrusion direction of the radiating substrate.

Further, in the heat radiating device according to the first aspect, the heat radiating substrate is formed of an extruded member, and a concave groove for fitting a part of the clip into the heat conductive metal plate side surface of the heat radiating substrate is formed on the heat radiating substrate. The heat radiation fins provided in the pushing direction and provided on the other surface of the heat radiation substrate may be composed of a large number of pin-shaped fins.

According to a fourth aspect of the present invention, there is provided a heat radiating device provided in an electronic device and configured to radiate heat generated from an electronic component disposed in a housing of the electronic device to the outside of the housing. A duct-type heat radiating unit (heat sink) with a built-in radiating fin is attached to one surface of a heat conductive metal plate constituting one side wall of the electronic component storage case disposed in the housing. , A radiating board having radiating fins on one side, a fin cover for forming a substantially inverted U-shape as viewed from the front combined with the radiating board so as to surround the radiating fin, and a hook for attaching to the electronic component storage case. Further, it is characterized in that it is composed of a clip (attachment member) for holding the heat dissipating substrate and the fin / cover in a combined state.

According to a fifth aspect of the present invention, there is provided a heat radiating device provided in an electronic device and configured to radiate heat generated from an electronic component disposed in a housing of the electronic device to the outside of the housing. A duct-type heat radiating unit (heat sink) with a built-in radiating fin is attached to one surface of a heat conductive metal plate constituting one side wall of the electronic component storage case disposed in the housing. A radiating board having a radiating fin on one side, a fin cover for forming a duct having a substantially inverted U shape viewed from the front combined with the radiating fin so as to surround the radiating fin, and mounting hooks for an electronic component storage case at both ends. It has an inverted U-shaped clip (mounting member) when viewed from the front,
Concave grooves are provided horizontally on both left and right end surfaces of the heat dissipation board, and engagement protrusions to be fitted into the same groove on the same side of the heat dissipation board are respectively provided at ends of left and right side walls of the duct forming fin cover. It is characterized by being provided in a protruding shape.

The heat dissipating device according to claim 5, wherein the heat dissipating substrate is provided on the surface on the heat conductive metal plate side with an internal enlarged groove for fitting an inverted U-shaped clip, and the end portions of the left and right side walls of the fin cover. It is preferable that cover fixing protrusions to be inserted into both end portions of the internal enlarged groove are provided in an inwardly projecting shape.

According to a seventh aspect of the present invention, there is provided a heat radiating device provided in an electronic device and configured to radiate heat generated from an electronic component disposed in a housing of the electronic device to outside the housing. On one side of a heat conductive metal plate forming one side wall of an electronic component storage case arranged in the housing, a duct-type heat radiating unit (heat sink) having a built-in radiating fin is attached, and the duct type heat radiating unit is provided on one side. A fin cover for forming a duct having a substantially inverted U shape as viewed from the front, which is combined with the radiator board so as to surround the radiator fin, and a hook for attaching to an electronic component storage case at both ends. And a substantially inverted U-shaped clip (attachment member) for coupling the radiating board and the fin / cover to each other in a combined state. Gaps for inserting the inverted U-shaped clip are horizontally provided between the rows of the fin covers, and a pair of through holes are provided in a heat dissipation board portion corresponding to the gaps. Notches are provided at the ends of the parts at levels corresponding to the gaps between the rows of the parallel radiating fins, and inwardly bent parts are provided near the left and right ends of the substantially inverted U-shaped clip, respectively. The fin cover is combined with the heat dissipation board, and the inverted U-shaped clip is fitted over the fin cover, and the inwardly bent portions of the fin cover near the left and right ends are formed on the left and right sides of the duct forming fin cover. The notches in the wall and the gaps between the rows of parallel radiating fins on the radiating board are fitted respectively, and the mounting hooks at both ends of the substantially inverted U-shaped clip are inserted through the through holes of the radiating board. La It is characterized in that.

According to another aspect of the present invention, there is provided a heat radiating device provided in an electronic device and configured to radiate heat generated from an electronic component disposed in a housing of the electronic device to the outside of the housing. A duct-type heat radiating unit (heat sink) with a built-in radiating fin is attached to one surface of a heat conductive metal plate constituting one side wall of the electronic component storage case disposed in the housing. , A radiating board having radiating fins on one side, a fin cover for forming a substantially inverted U-shape duct as viewed from the front combined with the radiating board so as to surround the radiating fin, and hooks for attaching to the electronic component storage case at both ends. And an inverted U-shaped clip (mounting member) when viewed from the front, and a space for inserting the inverted U-shaped clip between the rows of the parallel radiating fins of the radiating board. Together parts are provided horizontally,
A pair of through holes are provided in the heat dissipation board portion corresponding to the gap, and concave grooves are horizontally provided on both left and right end surfaces of the heat dissipation board, respectively. Engagement protrusions to be fitted into the concave grooves on the same side of the substrate are provided in an inwardly projecting shape, and a gap between the rows of the parallel radiating fins is provided at the ends of the left and right side walls of the fin cover. Cover fixing projections are provided inwardly protruding at both ends of the cover, and inverted U-shaped clips are fitted into gaps between the parallel radiating fins of the radiating board, and both ends of the lip are attached. Hook is inserted into the through hole of the heat sink, the fin and the cover are combined with the heat sink, and the cover fixing protrusion is fitted into the gap between the parallel heat sinks of the heat sink, Contact the top surface of the heat dissipation board It is characterized in that.

Further, a heat radiating device according to a ninth aspect of the present invention is a heat radiating device provided in an electronic device and configured to radiate heat generated from an electronic component disposed in a housing of the electronic device to outside the housing. A duct-type heat radiating unit (heat sink) with a built-in radiating fin is attached to one surface of a heat conductive metal plate constituting one side wall of the electronic component storage case disposed in the housing. A heat dissipation substrate having a heat dissipation fin on one side,
A substantially U-shaped duct forming fin cover as viewed from the front, which is combined with the heat dissipation board so as to surround the heat dissipation fins;
A pin-shaped clip (mounting member) having a leg with a detent protrusion for attachment to the electronic component storage case, and a gap for fitting the pin-shaped clip between the rows of the parallel radiation fins of the radiation board. The portion is provided horizontally, a pair of through holes are provided in a heat dissipation board portion corresponding to the gap, and a concave groove is horizontally provided on each of the left and right end faces of the heat dissipation board,
At the ends of the left and right side walls of the duct-forming fin cover, engaging projections to be fitted into the concave grooves on the same side of the heat dissipation board are provided inwardly protruding respectively, and the left and right side walls of the same fin cover are provided. At the end, cover fixing protrusions inserted into both end portions of the gap between the rows of the parallel radiating fins are respectively provided in an inwardly projecting shape, and the space between the rows of the parallel radiating fins of the heat radiating board is provided. A pin-shaped clip is fitted into the gap,
The tips with the detents of the plurality of legs are inserted through the through holes of the heat dissipation board in a penetrating manner, and the fins are inserted into the heat dissipation board.
It is characterized in that the cover is combined, and the cover fixing projection is fitted into the gap between the parallel heat-dissipating fins of the heat-dissipating board and is brought into contact with the upper surface of the heat-dissipating board.

In the radiating device according to the present invention, the radiating substrate is made of an extruded member, and the radiating fins provided on one surface of the radiating substrate are perpendicular to the direction in which the radiating substrate is pushed out. Preferably, it is made up of parallel skive fins that are cut and raised in the direction.

Further, in the heat radiating device according to claims 7, 8 and 9, the heat radiating substrate is made of an extruded member,
The heat dissipating fins provided on one side of the heat dissipating substrate may be composed of a large number of pin fins.

[0019]

Embodiments of the present invention will now be described with reference to the drawings.

In this specification, front and rear, left and right refer to FIG. 1, the front means the left side of FIG. 1, the rear means the same right side, and the left and right refer to the rear. Further, in the following description of this specification, the term “aluminum” includes an aluminum alloy in addition to pure aluminum.

FIG. 1 is a schematic overall view of a desktop personal computer (electronic device) provided with a heat radiating device according to the present invention.

In the figure, a heat radiating device according to the present invention is an MPU (electronic component) storage case disposed in a housing (1) of a desktop personal computer.
(2) Heat generated from MPU (not shown) in housing
(1) Dissipates heat to the outside.

The MPU storage case (2) is a box-type cartridge type, and has a radiation fin (6) built into one surface of a heat conductive aluminum plate (3) constituting one side wall of the MPU storage case (2). A duct-type heat radiating unit (heat sink) (4) is attached.

A connection terminal (not shown) is provided on the right side edge of the MPU storage case (2), and the terminal is provided on a motherboard disposed on the same side in the housing (1).
(34).

The duct type heat radiating unit (4) is connected to the rear end (30a) of the main duct (30) provided in the housing (1) and communicates with the front end (30a) of the main duct (30). 30b) into the housing opening (33) on the housing side wall (1a).
(1) Pass the air inside through the radiation fins (6)
One fan (31) to send out of the housing (1) from (33)
Is provided. At the lower part of the rear wall of the housing (1), a ventilation port (32) for taking in cooling air is provided.

FIGS. 2 to 4 show the first embodiment of the present invention in detail. In the figure, a duct-type heat dissipation unit (4) is a heat dissipation board (5)
And a concave arcuate parallel skive fin (radiation fin) as viewed from the front, which is cut and raised on the upper surface of this (6)
And a U-shaped aluminum duct fin cover (7) that is combined with a heat dissipation board (5) so as to surround the skive fin (6) and the heat of the MPU storage case (2) Insertion holes (10) (1
The U-shaped spring steel, which has mounting hooks (9) and (9) to be inserted into the (0) and holds the combined radiator board (5) and fin cover (7) from the outside when viewed from the front. (Mounting member) (8).

A pair of concave grooves (13) (13) for fitting the lower horizontal portion (8a) of the clip (8) is formed on the lower surface of the extruded aluminum-made radiator board (5). It is provided in the extrusion direction. These concave grooves (13) and (13) are for preventing displacement (lateral displacement) of the clips (8) and (8).

The skive fin (6) is
On the upper surface of (5), the cutout is provided in a direction perpendicular to the grooves (13), in other words, in a direction perpendicular to the direction in which the heat radiating substrate (5) is pushed out. According to such a skive fin (6), the fin pitch can be freely set, the fins (6) can be arranged at a narrow interval, and the heat radiation efficiency is excellent. Also, the heat dissipation board
There is an advantage that the direction of the fin (6) can be freely set regardless of the pushing direction of (5).

On the other hand, when the fins of the heat radiating substrate (5) are formed in the same direction as the extrusion direction of the heat radiating substrate (5) at the time of extrusion molding, for example, the fin interval cannot be reduced. Therefore, the heat radiation efficiency is not good, and when forming the concave groove in the direction perpendicular to the fin in the extrusion direction, there is a trouble that a cutting process is required.

Further, the fin cover (7) has a flat left side wall (7a) and an upper side wall (7b) connected at right angles to each other.
And a right-side wall (7c) formed in a concave shape when viewed from the front, similar to the skive fins (radiation fins) (6) to prevent so-called air paths in the duct. At the tip of the wall (7c), there is formed a thin band-shaped connection edge (7d) which is brought into contact with the left side surface of the heat dissipation board (5).

The clip (8) is made of a spring steel plate by integral molding, and has a substantially U shape when viewed from the front as a whole. Then, the clip base portion (8a) on the heat dissipation board (5) side and the arm portions (8b) (8b) on both left and right sides of the clip base portion (8) have a cross section having reinforcing wall portions (11) (11) on both front and rear sides. U-shaped.

The depth of the concave groove (13) opened downward on the lower surface of the heat radiating substrate (5) is determined by the depth of the base portion (8a) including the front and rear reinforcing wall portions (11) and (11) of the clip (8). Has a depth that is greater than its height so that it can penetrate. Thus, the clip
The base part (8a) including the front and rear reinforcing wall parts (11) and (11) of (8) is
As a result of entering the concave groove (13) on the lower surface of the heat dissipation board (5), the heat dissipation board
(5) It comes into close contact with the lower surface.

The left and right arms (8b) of the clip (8)
Presser section (8c) (8c) that extends inward from the tip of (8b)
Are plate-shaped, but are provided with a step at the center of each of them.The upper side wall (7b) of the fin cover (7) and the skive are provided by these tip holding parts (8c) (8c). -Fins (radiating fins) (6) The end of the group is pressed firmly.

On both left and right sides of the clip base (8a), mounting hooks (9) (9) cut and raised from the bottom wall of the base (8a) are provided. Each mounting hook (9) has a rising base (9a) and a bent end (9b), and has a so-called spring property. In addition, the distal bent portions (9b) and (9b) are bent outward, so-called outward opening is tightened, and two notch holes (12) are formed in the bottom wall of the base portion (8a).
(12) are formed respectively. In addition, each mounting hook
The height of the rising base (9a) (9a) of (9) should be slightly shorter than the height from the surface of the clip base (8a) to the inner surface of the heat conductive aluminum plate (3) on the MPU storage case (2) side. Keep it.

In the above, the duct type heat radiating unit (4)
A fin cover (7) made of aluminum, which is substantially inverted U-shaped when viewed from the front, and a group of skive fins (6) After assembling so as to surround the mounting hook
(9) A pair of clips (8) and (8) having (9) are put on the combined heat dissipation board (5) and fin cover (7), and these are held from outside. At this time, each clip (8)
The base portion (8a) fits into the concave groove (13) on the lower surface of the heat radiating board (5), and the displacement (lateral displacement) of the clip (8) with respect to the heat radiating board (5) is prevented. The left and right side walls (8a) and (8a) of the fin cover (7) can be sandwiched and pressed by the left and right arms (8b) and (8b) of each clip (8). The upper end wall (7b) of the fin cover (7) and thus the end of the skive fins (radiation fins) (6) can be pressed by the front end holding portions (8c) and (8c). At this time, the holding angle of the tip holding portions (8c) (8c) of the clip (8) is sufficiently set so that the tip of the group of skive fins (radiation fins) (6) is firmly pressed.

The left side wall (7a) of the fin cover (7)
Of the fin cover (7) and the concave right-side wall (7c) of the fin cover (7).
Since the strip-shaped connection edge (7d) at the tip is brought into contact with the left side surface of the heat dissipation board (5), air leakage can be prevented,
The right side wall (7c) formed in a concave arc shape when viewed from the front of the fin cover (7) allows a skive fin (6) between the right side wall (7c) and the adjacent skive fin (6). fin
(6) A gap having the same width as the gap between (6) can be formed, and an air path can be prevented.

Further, since the clip (8) is formed by integral molding, the labor for processing can be saved and the number of parts can be reduced.

In the first embodiment, the clip
The base portion (8a) of (8) has reinforcing wall portions (11) and (11) on both front and rear sides, and has a high strength.
Right and left arm portions (8b) of the clip (8) (8b)
c) The (8c) is formed in a plate shape and has relatively low strength so that deformation on the base portion (8a) side is prevented.

The duct type heat radiating unit (4) having the above structure is
To attach to one side of the heat conductive aluminum plate (3) constituting one side wall of the MPU storage case (2), insert the clips (8) into the insertion holes (10) (10) of the heat conductive aluminum plate (3). The mounting hooks (9) and (9) of the base (8a) may be inserted.

Then, the rising bases (9a) and (9a) and the bent portions (9b) and (9b) of the mounting hooks (9) are once pushed inward against the elasticity of the material, and are raised. Base (9a) (9
When (a) swings inward and passes through the insertion hole (10) of the heat conductive aluminum plate (3), the base (9a) rises by elastic force.
(9a) and the bent end portion (9b) (9b) return to the original state,
The bent end portions (9b) and (9b) are hooked around the insertion hole (10) of the heat conductive aluminum plate (3) inside the MPU storage case (2), and the duct heat dissipation unit (4) is connected to the MPU storage case ( It is attached to the heat conductive aluminum plate (3) of 2).

The height of the rising bases (9a) and (9a) of the mounting hooks (9) of the base portion (8a) of the clip (8) is set so that the MPU storage case (2) extends from the surface of the clip base portion (8a). ) Side is slightly shorter than the height to the inner surface of the heat conductive aluminum plate (3), and the tip bent part (9b) (9b) of the mounting hook (9)
The heat conductive aluminum plate (3) of the MPU storage case (2)
When it enters through the insertion hole (10) of
(10) Firmly hang on one side of the rim to prevent poor contact between the heat conductive aluminum plate (3) on the MPU storage case (2) side and the heat dissipation board (5) of the duct heat dissipation unit (4). It is desirable to prevent this (see FIG. 3).

In the above, when the fan (31) provided in the radiation opening (33) of the side wall (1a) of the housing (1) of the desktop personal computer is operated, the low-temperature air outside the housing (1) is activated. Is sucked through the ventilation opening (32). This low-temperature air is led to the skive fins (6) in the duct-type heat radiation unit (4),
The heat generated from (2) is released through the skive fins (6) to heat the air. This heated air is quickly discharged out of the housing (3) from the radiation opening (33) of the housing side wall (1a). Therefore, the heat radiation performance through the skive fins (6) is excellent.

The skive fin (6) is
On the upper surface of (5), the cutout is provided in a direction perpendicular to the grooves (13), in other words, in a direction perpendicular to the direction in which the heat radiating substrate (5) is pushed out. Therefore, the wind flows in the duct type heat radiating unit (4) along the skive fins (6), that is, in the direction perpendicular to the direction in which the heat radiating substrate (5) is pushed out.

The heat radiation unit of the duct type according to the first embodiment.
According to (4), a clip having mounting hooks (9) (9)
According to (8), the duct-type heat radiating unit (4) can be attached or detached with one touch very easily and firmly on one side of the heat conductive aluminum plate (3) constituting one side wall of the MPU storage case (2). Can be very convenient. In addition, we can prevent leakage of cooling wind and path,
In addition to excellent cooling performance, the heat dissipation board (5) with skive fins (6) and the fin cover (7) for forming the duct, which constitute the heat dissipation unit (4), can be firmly combined with each other.

The above-mentioned fin cover for forming the duct
(7) is made of aluminum, but may be made of resin. The clip (8) is made of spring steel,
This may be made of a resin, a resin-coated metal plate, or the like.

FIGS. 5 and 6 show a second embodiment of the present invention.

Here, the difference from the first embodiment is that the distal end bent portions (9b) of the mounting hooks (9) and (9) of the substantially U-shaped spring (mounting member) (17) made of spring steel. (9b) The point is that it is bent in the shape of a jig and inverted, and, contrary to the case of the second embodiment, it is bent inward, so-called inward opening tightening.

Since the other points of the second embodiment are the same as those of the first embodiment, the same parts are denoted by the same reference numerals in the drawings.

FIGS. 7 and 8 show a third embodiment of the present invention.

Here, the difference from the first embodiment is that the heat dissipation board (5) having the skive fins (6) of the duct type heat dissipation unit (heat sink) (4) is substantially inverted U when viewed from the front. Duct-forming fin cover (7) and M
It has a hook (9) for attaching the PU storage case (2) to the heat-conducting aluminum plate (3). .

That is, a dovetail groove (internally enlarged concave groove) (18) is horizontally formed by extrusion on the outer surface of the heat-radiating substrate (5) made of extruded aluminum material on the side opposite to the skive fin (6). Narrow grooves (14) and (14) are horizontally provided by cutting on both left and right end surfaces of the heat radiation substrate (5).

The hooks (9) and (9) for mounting the inverted U-shaped clip (17) shown in the figure have bent front ends (9b) and (9b) bent outward, so-called outward opening. It has been closed. The front and rear side edges of the base (17a) of the inverted U-shaped clip (17) are provided with overhanging portions (19) and (19) which engage with the opening side edges of the dovetail groove (internally enlarged groove) (18). ) Are provided.

The duct forming fin cover (7) is fitted into the groove (14) (14) on the same side of the heat dissipation board (5) at the end of the left and right side walls (7a) (7c). The engaging protrusions (15) and (15) are provided inwardly, respectively, and the engaging protrusions (15) and (15)
Longer position deviation preventing protrusions (16) (16) are provided in an inwardly projecting shape, respectively.

In the dovetail groove (18) of the heat dissipation board (5), a base (17a) having front and rear overhang portions (19) and (19) of the inverted U-shaped clip (17) is fitted. , The front and rear bulges (19) (1
9) is hooked on both side edges of the dovetail (18) before and after the opening. Then, the fin cover (7) is combined with the radiator board (5) to surround the radiator fin (6),
The engaging projections (15) (15) of the left and right side walls (7a) (7c) of (7) are fitted into the grooves (14) (14) on the same side of the heat dissipation board (5), and The protrusions (16) and (16) for preventing slippage are dovetail grooves on the outer surface
It is inserted into the left and right ends of (18).

The duct type heat radiating unit (4) having the above structure is
To attach to one side of the heat conductive aluminum plate (3) which constitutes one side wall of the MPU storage case (2), insert each inverted U-shaped into the insertion hole (10) (10) of the heat conductive aluminum plate (3). It is only necessary to insert the mounting hooks (9) and (9) of the clip (17), and both mounting hooks (9) and (9) have a so-called spring property, which can be easily attached or removed with one touch. it can.

According to the third embodiment, the heat dissipation board (5)
The inverted U-shaped clip (17) can be easily fixed by the dovetail groove (18) of the fin cover (7). By inserting the inverted U-shaped clip (17) into the left and right end portions of the dovetail groove (18), the escape of the inverted U-shaped clip (17) is prevented. At the same time, the displacement of the fin cover (7) can be prevented.

The left and right side walls (7) of the fin cover (7)
a) The fin cover (7) is lifted by fitting the engaging projections (15) (15) of (7c) into the concave grooves (14) (14) on the same side of the heat sink board (5). Can be prevented,
Air leakage can be prevented.

The means for fixing the inverted U-shaped clip (17) to the heat radiating substrate (5) is not limited to the above, but may be other methods such as caulking or bonding.

Since the other points of the third embodiment are the same as those of the first embodiment, the same parts are denoted by the same reference numerals in the drawings.

FIGS. 9 and 10 show a fourth embodiment of the present invention. Here, the difference from the third embodiment is that the distal bent portions (9b) and (9b) of the mounting hooks (9) and (9) of the inverted U-shaped clip (mounting member) (17) are different from the third embodiment. Contrary to the case of the third embodiment, it is bent inward,
The point is that the so-called inner opening is tightened.

Also, parallel concave skive fins (radiation fins) (6) are provided on the upper surface of the heat radiation substrate (5) and have a concave arc shape when viewed from the front. Are provided in five rows, and among the parallel rows of fins (6) in the adjacent row, the parallel row fins (6) in the other row are provided in the gap between the parallel row fins (6) in one row. The fin pitch of the adjacent rows is set so that the fins (6) are located in a zigzag arrangement when viewed from the front, and sufficient wind is supplied to all the fins (6). The heat exchange performance is improved.

Since the other points of the fourth embodiment are the same as those of the third embodiment, the same parts are denoted by the same reference numerals in the drawings.

Next, FIGS. 11 and 12 show a fifth embodiment of the present invention.

The difference from the first embodiment is that the radiation fins (6A) provided on one side of the radiation substrate (5)
Is composed of a large number of pin-shaped fins.
The heat radiating board (5) of the heat radiating unit (heat sink) (4) is made of extruded material. For example, first, a parallel plate-shaped projection on the upper surface of this heat radiating board (5) is integrated with the heat radiating board (5). Extrusion molding, then heat dissipation board (5)
A number of cuts are provided in a direction orthogonal to the extrusion direction of
This allows the radiation fins (6
A) is formed.

Next, FIGS. 13 and 14 show a sixth embodiment of the present invention.

Here, the difference from the first embodiment is that the heat dissipation board (5) having the skive fins (6) of the duct-type heat dissipation unit (heat sink) (4) is substantially inverted U when viewed from the front. Duct-forming fin cover (7) and M
A substantially inverted U-shaped spring steel clip (attachment member) (21) having hooks (9) (9) at both ends for attaching the PU storage case (2) to the heat conductive aluminum plate (3). In the joining method.

That is, a substantially inverted U-shaped clip insertion gap portion (22) is horizontally provided between rows of the parallel-shaped skive fins (6) of the extruded aluminum material heat dissipation substrate (5). A pair of through-holes (23) (23) are provided in a heat-radiating substrate portion corresponding to the gap (22). The radiating fins (6), which consist of parallel-shaped skive fins provided on one side of the extruded-shaped radiating substrate (5), are cut and raised in the direction perpendicular to the extrusion direction of the radiating substrate (5). It is. Therefore, in order to form a gap (22) between the rows of the parallel-shaped skive fins (6) of the heat dissipation board (5), the heat dissipation board made of extruded material is required.
It is good if the thick part for fin standing is not provided in the corresponding part of the fin standing surface of (5).

On the other hand, notches (24) and (25) are provided at the ends of the left and right side walls (7a) and (7c) of the duct forming fin cover (7), and the rows of the parallel radiating fins (6) are connected to each other. Are provided at the levels corresponding to the gaps (22).

Inwardly bent portions (21a) and (21a) are provided near the left and right ends of the substantially inverted U-shaped clip (21), respectively, so that the electronic device is connected to the tip of the innerly bent portions (21a) and (21a). Hooks (9) and (9) for attachment to the component storage case (2) are provided respectively.

Each mounting hook (9) has a rising base (9a) and a bent end (9b) and has a so-called spring property. Further, the distal bent portions (9b) (9b) are bent outward, so-called outer opening fastening. In addition,
The height of the rising base (9a) (9a) of each mounting hook (9) is
It should be slightly shorter than the height from the upper surface of the heat dissipation board (5) to the inner surface of the heat conductive aluminum plate (3) on the MPU storage case (2) side. Fins are formed by the left and right sides (21b) and (21b) and the upper side (21c) of the substantially inverted U-shaped clip (21).
The cover (7) is held from the outside.

The fin cover (7) is combined with the radiating board (5), and the fin cover (7) is substantially inverted U-shaped clip.
(21) is fitted over and the left and right ends of the inwardly bent portions (21a) and (21a) near the left and right ends thereof are attached to the left and right side walls (7a) and (7c) of the duct forming fin cover (7). ) Notch (24) (2
5) and the gaps (22) between the rows of the parallel radiating fins (6) of the radiating board (5). The mounting hooks (9) (9) at both ends of the substantially inverted U-shaped clip (21) are inserted through the through holes (23) (23) of the heat dissipation board (5).
When the substantially inverted U-shaped clip (21) is fitted over the duct forming fin cover (7), the inwardly folded portion (2
1a) The left and right ends of (21a) are fitted into the notches (24) and (25) of the fin cover (7), preventing the fin cover (7) from being displaced with respect to the heat dissipation board (5). Can be fixed.

The duct type heat radiating unit (4) having the above structure is
To attach to one side of the heat conductive aluminum plate (3) that constitutes one side wall of the MPU storage case (2), insert each of the substantially inverted U-shaped holes into the insertion holes (10) (10) of the heat conductive aluminum plate (3). The mounting hooks (9) and (9) of the clip (21) only need to be inserted, and both mounting hooks (9) and (9) have spring properties, which can be easily attached or removed with one touch. .

According to the heat radiating device of the sixth embodiment of the present invention, the heat radiating fins (6) of the heat radiating substrate (5) are not
Since it is made of fins, it is very easy to form a gap (22) between rows of parallel skive fins (6).

FIGS. 15 and 16 show a seventh embodiment of the present invention.

Here, the difference from the first embodiment is that the heat dissipation board (5) having the skive fins (6) of the duct-type heat dissipation unit (heat sink) (4) is substantially inverted U when viewed from the front. Duct-forming fin cover (7) and M
A U-shaped clip (mounting member) (26) viewed from the front and made of a spring steel having hooks (9) and (9) at both ends for mounting the PU storage case (2) to the heat conductive aluminum plate (3). In the joining method.

That is, a space (22) for inserting an inverted U-shaped clip is horizontally provided between the rows of the parallel-shaped skive fins (6) of the heat dissipation board (5) made of an extruded aluminum material. A pair of through-holes (23) (23) are provided in a heat-radiating substrate portion corresponding to the gap (22). The radiating fins (6), which consist of parallel-shaped skive fins provided on one side of the extruded-shaped radiating substrate (5), are cut and raised in the direction perpendicular to the extrusion direction of the radiating substrate (5). It is.

The grooves (14) (1) are formed on both right and left end surfaces of the heat radiation board (5).
4) are provided horizontally, and the heat dissipation board (5) is attached to the end of the left and right side walls (7a) (7c) of the duct forming fin cover (7).
The engaging projections (15) (1) fitted in the concave grooves (14) (14) on the same side of
5) are provided in an inwardly projecting shape, respectively. At the ends of the left and right side walls (7a) and (7c) of the fin cover (7), covers for inserting into both ends of the gap (22) between rows of the parallel radiating fins (6) are provided. The convex portions (27) and (27) are provided in an inwardly projecting shape, respectively.

An inverted U-shaped clip (26) is fitted into a gap (22) between rows of the parallel radiating fins (6) of the radiating board (5), and mounting hooks (9) at both ends thereof are fitted. ) (9) is the heat dissipation board
It is inserted through the through holes (23) and (23) of (5). In addition,
The attachment of the inverted U-shaped clip (26) to the heat dissipation board (5)
For example, it is performed by bonding with an adhesive or by fixing with screws.

Then, a fin cover is provided on the heat radiation board (5).
(7), and the engaging projections (15) and (15) of the left and right side walls (7a) and (7c) of the fin cover (7) are aligned with the concave grooves (14) on the same side of the heat dissipation board (5). (14), it is possible to prevent the fin cover (7) from floating and to prevent air leakage. At the same time, the cover fixing projections (27) and (27) are fitted into the gaps (22) between the rows of the parallel heat dissipating fins (6) of the heat dissipating board (5), and the cover fixing The protrusions (27) and (27) are pressed against the upper surface of the heat dissipation board (5), so that the fin cover (7) is firmly attached to the heat dissipation board (5).

The duct-type heat radiating unit having the above configuration
To attach (4) to one side of the heat conductive aluminum plate (3) that constitutes one side wall of the MPU storage case (2), insert it into the insertion holes (10) (10) of the heat conductive aluminum plate (3). Just insert the mounting hooks (9) and (9) of each inverted U-shaped clip (26),
Both mounting hooks (9) (9) have a spring property and can be easily attached or detached with one touch.

FIG. 17 shows an eighth embodiment of the present invention.

Here, the difference from the seventh embodiment is that the clip (mounting member) (28) is of the so-called open leg pin type with a detent projection.

Here, a pin type clip (mounting member) (28)
Is a synthetic resin, for example, which has a circular head (28a),
It is provided integrally with the lower surface of this and has a detent at the tip (29)
And a plurality of legs (28b) having a cross section having an approximately arrow-shaped cross section, and the outer surface of the detent projection (29) is tapered. A gap is provided between the legs (28b) so that the legs (28b) can swing inward.

On the other hand, a heat dissipation board made of extruded aluminum material
Between rows of parallel skive fins (6) in (5),
A pin-shaped clip fitting cavity (22) is provided horizontally,
A pair of through holes (23) (23) provided in the heat dissipation board portion corresponding to the gap (22) are formed by a plurality of legs of the pin-shaped clip (28).
(28b).

Pin-shaped clip (28) for heat dissipation board (5)
After fixing the leg (28b) with multiple detents (29) of the pin-shaped clip (28) through the through holes (23) and (23) on the heatsink board (5) side, This is performed by joining the lower surface of the head (28a) of (28) to the upper surface of the heat dissipation board (5) using, for example, an adhesive.

Then, the duct type heat radiating unit (4) is
To attach to one side of the heat conductive aluminum plate (3) constituting one side wall of the PU storage case (2), it protruded from the heat dissipation board (5) into the insertion hole (10) of the heat conductive aluminum plate (3). Detent projections on the legs (28b) of the pin clip (28)
(29) It is sufficient to insert the tip.

Then, due to the tapered outer surface of the detent projection (29), the tip of the leg (28b) is once pushed inward against the elastic force of the synthetic resin material, and the detent projection (29). 29) The leg (28b) swings inward, and when it passes through the insertion hole (10) of the heat conductive aluminum plate (3), the leg (28b)
Is returned to the original state, and the detent projection (29) engages with the insertion hole (10) of the heat conductive aluminum plate (3) inside the MPU storage case (2), and the duct heat dissipation unit
(4) The thermal conductive aluminum plate of the MPU storage case (2)
(3) It can be easily attached with one touch.

The pin-shaped clip can be easily attached to the heat dissipation board (5), and can be obtained at very low cost because the pin-shaped clip is usually made of synthetic resin.

Since the other points of the eighth embodiment are the same as those of the above-described seventh embodiment, the same components are denoted by the same reference numerals in the drawings.

In the sixth to eighth embodiments,
On one surface of the heat radiation board (5) of the heat radiation unit (heat sink) (4), a heat radiation fin (6) composed of a skive fin is provided. In these embodiments, for example, FIGS. A radiation fin (6A) composed of a number of pin-shaped fins as shown may be provided.

[0091]

According to the present invention, as described above, the heat radiating device according to the first aspect of the present invention provides heat generated from electronic components provided in an electronic device and disposed in a housing of the electronic device. A heat dissipating device for dissipating heat to the outside, wherein a heat dissipating substrate to be attached to one side of a heat conductive metal plate forming one side wall of an electronic component storage case disposed in a housing, and an insertion hole for the heat conductive metal plate And a clip (attachment member) having an attachment hook to be inserted into the heat dissipation metal plate, and a concave groove for fitting a part of the clip is provided on a surface of the heat dissipation board on the side of the heat conductive metal plate. According to the present invention, the heat radiation fin is provided on the surface of the heat radiation substrate opposite to the surface on which the clip-fitting concave groove is provided. Radiating fins Can be formed in a large number, there is an effect that the heat generated by the electronic components in the housing can be sufficiently dissipated to the outside of the housing, heat radiation performance is excellent.

According to a second aspect of the present invention, there is provided the heat radiating device according to the first aspect, wherein the heat radiating substrate is made of an extruded member, and the heat radiating substrate has a surface on a heat conductive metal plate side. A concave groove for fitting a part of the clip is provided in the extrusion direction of the heat dissipation board, and the heat dissipation fins provided on the other surface of the heat dissipation board are cut and raised in a direction perpendicular to the extrusion direction of the heat dissipation board. According to the present invention, since the concave groove for partially fitting the clip is formed simultaneously with the extrusion molding, according to the present invention, the manufacturing is easy, and the skive fin is provided on the upper surface of the heat dissipation board. It is provided in a cut-and-raised shape at right angles to the extrusion direction of the heat dissipation board. According to such a skive fin, the fin
The pitch can be freely set, the fins can be arranged at narrow intervals, and the heat radiation efficiency is excellent. Further, there is an effect that the direction of the fin can be freely set regardless of the extrusion direction of the heat radiation substrate.

Further, in the heat radiating device according to the first aspect, the heat radiating substrate is made of an extruded material, and a concave groove for fitting a part of the clip into the heat conductive metal plate side surface of the heat radiating substrate is provided. The heat dissipating fins provided in the extrusion direction and provided on the other surface of the heat dissipating substrate are composed of a large number of pin-shaped fins. Since it is formed, it is easy to manufacture, and the pin-shaped fins are provided with parallel plate-shaped protrusions on the upper surface of the heat dissipation board. It is formed by providing a number of cuts in the orthogonal direction. According to such a pin-shaped fin, the fin pitch can be set freely, and the fins can be arranged at narrow intervals. With excellent heat dissipation efficiency An effect that becomes.

Next, a heat radiating device according to a fourth aspect of the present invention is provided for an electronic device, and radiates heat generated from an electronic component disposed in a housing of the electronic device to the outside of the housing. A duct-type heat-dissipating unit (heat-sink) having heat-dissipating fins is attached to one side of a heat-conducting metal plate constituting one side wall of an electronic component storage case disposed in the housing; But a heat dissipation board having a heat dissipation fin on one side,
A substantially U-shaped duct forming fin cover as viewed from the front, which is combined with the heat dissipation board so as to surround the heat dissipation fins;
According to the present invention, a duct-type heat-dissipating unit (a heat sink) is provided, which has a hook for attaching to an electronic component storage case and includes a heat-dissipating board and a clip (attachment member) for holding the fin / cover together. ) Can be attached to one side of the heat conductive aluminum plate which constitutes one side wall of the electronic component storage case, by inserting the mounting hooks of each inverted U-shaped clip into the insertion hole of the heat conductive aluminum plate. The hook has a spring property and can be easily attached or detached with one touch.

Further, the heat generated from the electronic components in the housing can be sufficiently radiated to the outside of the housing, and the heat radiation performance is excellent. In addition, since the number of parts is small, the manufacturing cost is very low. In addition, while minimizing the leakage of cooling air from the ventilation duct, the heat dissipation device and the heat generating electronic component storage case such as the MPU can be very easily and firmly connected by so-called clipping. .

According to a fifth aspect of the present invention, there is provided a heat radiating device for radiating heat generated from an electronic component provided in an electronic device and disposed in a housing of the electronic device to the outside of the housing. A heat dissipation device, wherein a duct-type heat dissipation unit (heat sink) having a built-in heat dissipation fin is attached to one surface of a heat conductive metal plate forming one side wall portion of an electronic component storage case disposed in a housing, and the duct shape is provided. The heat dissipation unit includes a heat dissipation board having a heat dissipation fin on one side, a substantially inverted U-shaped duct forming fin cover viewed from the front combined with the heat dissipation board so as to surround the heat dissipation fin, and a mounting hook for an electronic component storage case. A U-shaped clip (attachment member) as viewed from the front, which is provided at both ends; At the ends of the left and right side wall portions of the forming fin cover, engaging projections to be fitted into the concave grooves on the same side of the heat dissipation board are provided in an inwardly projecting shape, respectively. The fin cover is combined with the radiator board, and the engaging protrusions on the left and right side walls of the fin cover are fitted into the concave grooves on the same side of the radiator board to prevent the fin cover from rising. It is possible to prevent air leakage.

In the heat radiating device according to the fifth aspect of the present invention, the heat-radiating substrate is provided with an internal enlarged groove for fitting the inverted U-shaped clip on the surface of the heat radiating substrate on the heat conductive metal plate side. Since the cover fixing protrusions inserted into both ends of the internal enlarged groove are provided in the end portions in an inwardly projecting shape, the inverted U is formed by the internal enlarged groove of the heat dissipation board.
The U-shaped clip can be easily fixed, and the U-shaped clip is prevented from coming out by inserting the protrusions on the fin and cover to prevent misalignment on both the left and right sides of the internal enlarged groove of the heat sink. And the displacement of the fin cover can be prevented.

In the heat radiating device according to the seventh aspect of the present invention, as described above, the heat radiating fins are incorporated on one surface of the heat conductive metal plate constituting one side wall of the electronic component storage case disposed in the housing. A duct-type heat-dissipating unit (heat sink) is attached. The duct-type heat-dissipating unit is used to form a substantially inverted U-shaped duct when viewed from the front, which is combined with the heat-dissipating substrate so as to surround the heat-dissipating fins on one side. The fin cover has a hook for attachment to an electronic component storage case at both ends, and a heat dissipation board in a combined state and a substantially inverted U-shaped clip (attachment member) for connecting the fin covers to each other. A space for inserting the inverted U-shaped clip is horizontally provided between the rows of the parallel radiating fins of the substrate, and a pair of through holes are formed in the heat radiating substrate corresponding to the space. Are provided, and cutouts are provided at ends of left and right side walls of the duct forming fin cover at levels corresponding to gaps between the rows of the parallel radiating fins, respectively, and a substantially inverted U-shaped clip is provided. Inwardly bent portions are respectively provided near the left and right end portions, and a fin cover is combined with the heat dissipation board, and a substantially inverted U-shaped clip is fitted over the fin cover, so that The folded portions are respectively fitted into the cutout portions on the left and right side walls of the duct forming fin cover and the gap between the rows of the parallel radiating fins of the radiating board, and both ends of the substantially inverted U-shaped clip are provided. Since the mounting hooks of the parts are inserted through the through holes of the heat dissipation board, it is very easy and reliable to fix the fin and the cover with respect to the heat dissipation board by preventing their displacement. It can be. Further, according to the present invention, in order to attach the duct-type heat radiating unit (heat sink) to one surface of the heat conductive metal plate forming one side wall of the electronic component storage case, each of the inverted U is inserted into the insertion hole of the heat conductive metal plate. It is sufficient to insert the hook for attaching the shape clip, and the attaching hook has a spring property, so that there is an effect that the hook can be easily attached or detached with one touch.

In the heat radiating device according to the seventh aspect,
When the heat dissipation fins of the heat dissipation board are formed of parallel skive fins, it is very easy to form a gap between the rows of parallel skive fins,
There is an advantage that fin cutting is not required.

As described above, the heat radiating device according to claim 8 of the present invention has a space for inserting an inverted U-shaped clip between rows of parallel radiating fins of a radiating substrate of a duct-type radiating unit (heat sink). Are provided horizontally, and a pair of through holes are provided in a heat dissipation board portion corresponding to the gap, and concave grooves are respectively provided horizontally on both right and left end surfaces of the heat dissipation board, and left and right side walls of a duct forming fin cover are provided. At the ends of the fin cover, engagement protrusions to be fitted into the concave grooves on the same side of the heat dissipation board are respectively provided in an inwardly projecting shape, and at the ends of the left and right side walls of the fin cover, parallel heat dissipation fins are provided. Cover fixing protrusions are provided in both ends of the gaps between the rows so as to protrude inwardly, and inverted U-shaped clips are fitted into the gaps between the rows of the parallel radiating fins of the heat dissipation board. Put in, both ends of this The attachment hook is inserted through the through hole of the heat dissipation board, the fin and the cover are combined with the heat dissipation board, and the cover fixing protrusion is inserted into the gap between the rows of parallel heat dissipation fins on the heat dissipation board. In addition, since the inverted U-shaped clip is held down by the tip of the holding projection, according to the present invention, the duct-type heat radiating unit (heat sink) is connected to one side wall of the electronic component storage case. To attach to one side of the heat conductive metal plate to configure,
The mounting hook of each inverted U-shaped clip may be inserted into the insertion hole of the heat conductive metal plate, and the mounting hook has a spring property and can be easily attached or detached with one touch. As described above, since the holding projections of the fin cover are fitted into the gaps between the rows of the parallel radiating fins of the radiating board and are brought into contact with the upper surface of the radiating board, the fins with respect to the radiating board are formed. -The cover can be securely fixed by preventing the cover from shifting.

Further, since the engaging projections on the left and right side walls of the fin cover are fitted into the concave grooves on the same side of the radiating board, it is possible to prevent the fin cover from floating and to prevent air leakage. This has the effect that it can be prevented.

Further, in the heat radiating device according to the ninth aspect of the present invention, instead of the inverted U-shaped clip (mounting member) having mounting hooks at both ends according to the eighth aspect of the present invention, a detent convex portion is provided. According to the present invention, a pin-type clip (attachment member) having a leg is used, and a duct-type heat radiation unit (heat sink) is attached to one side of a heat conductive metal plate constituting one side wall of an electronic component storage case. In this case, the tip of the leg with the detent protrusion of each pin-shaped clip attached to the heat dissipation board may be inserted into the insertion hole of the heat conductive metal plate, and the leg with the detent protrusion has spring properties. It can be easily attached with one touch. Pin-shaped clips are available at low cost,
As a result, there is an effect that the manufacturing cost of the heat dissipation device can be reduced.

Further, in the heat radiating device for an electronic device according to the seventh, eighth or ninth aspect, the heat radiating substrate is made of an extruded member, and the heat radiating fins provided on one surface of the heat radiating substrate are formed by pushing out the heat radiating substrate. According to the present invention, the skive fins are formed on one surface of the heat dissipating substrate in a direction perpendicular to the extrusion direction of the heat dissipating substrate. According to such a skive fin, the fin
The pitch can be freely set, the fins can be arranged at narrow intervals, and the heat radiation efficiency is excellent. Further, there is an effect that the direction of the fin can be freely set regardless of the extrusion direction of the heat radiation substrate.

When the heat radiating fins provided on one side of the heat radiating board are composed of a large number of pin fins, the pin fins may be provided with, for example, parallel plate-like convex portions on one side of the heat radiating board. Then, since a large number of cuts are formed in the parallel plate-shaped projections in a direction orthogonal to the extrusion direction of the heat radiating board, the pin-shaped fins have a fin pitch. The fins can be freely set, the fins can be arranged at a small interval, and the effect of excellent heat dissipation efficiency can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a schematic overall view of a desktop personal computer (electronic device) provided with a heat dissipation device according to the present invention.

FIG. 2 is a perspective view showing a state before the combination of the heat dissipation device and the electronic component storage case according to the first embodiment of the present invention.

FIG. 3 is an enlarged horizontal sectional view of the heat radiating device of FIG. 2;

FIG. 4 is an exploded perspective view of the heat dissipation device of FIG.

FIG. 5 is an enlarged horizontal sectional view of a heat dissipation device according to a second embodiment of the present invention.

FIG. 6 is an exploded perspective view of the heat dissipation device of FIG.

FIG. 7 is an enlarged horizontal sectional view of a heat dissipation device according to a third embodiment of the present invention.

FIG. 8 is an exploded perspective view of the heat dissipation device of FIG.

FIG. 9 is an enlarged horizontal sectional view of a heat dissipation device according to a fourth embodiment of the present invention.

FIG. 10 is an exploded perspective view of the heat dissipation device of FIG.

FIG. 11 is an enlarged horizontal sectional view of a heat dissipation device according to a fifth embodiment of the present invention.

FIG. 12 is an exploded perspective view of the heat dissipation device of FIG.

FIG. 13 is an enlarged horizontal sectional view of a heat dissipation device according to a sixth embodiment of the present invention.

FIG. 14 is an exploded perspective view of the heat dissipation device of FIG.

FIG. 15 is an enlarged horizontal sectional view of a heat dissipation device according to a seventh embodiment of the present invention.

FIG. 16 is an exploded perspective view of the heat dissipation device of FIG.

FIG. 17 is an enlarged horizontal sectional view of a heat dissipation device according to an eighth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 MPU (electronic component) storage case 3 Thermal conductive aluminum plate (thermal conductive metal plate) 4 Duct type heat radiating unit (heat sink) 5 Heat radiating board 6 Skive fin (radiating fin) 6A Pin type fin (radiating fin) 7 Duct Forming fin cover 7a Left side wall 7c Right side wall 8 Clip (mounting member) 9 Mounting hook 13 Depressed groove 14 Depressed groove 15 Engagement convex portion 16 Cover fixing convex portion 17 Reverse U-shaped clip (mounting member) 18 Dovetail groove (internally enlarged concave groove) 21 Substantially inverted U-shaped clip (mounting member) 21a Inwardly bent portion 22 Vent portion for inserting inverted U-shaped clip 23 Through hole 24 Notch portion 25 Notch portion 26 Inverted U-shaped clip ( (Mounting member) 27 Projection for fixing cover 28 Pin-type clip (Mounting member)

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masaaki Munekawa 6,224 Kaiyamacho, Sakai City Showa Aluminum Co., Ltd. (72) Inventor Masaharu Tochigi 6,224 Kaiyamacho Sakai City, Showa Aluminum Co., Ltd. 72) Inventor Yuichi Furukawa, 6224, Kaiyama-cho, Sakai City Showa Aluminum Co., Ltd. (72) Inventor Keiichiro Ota 6, 224, Kaiyamacho, Sakai City, Showa Aluminum Co., Ltd.

Claims (11)

[Claims] 1. A radiator for radiating heat generated from an electronic component provided in an electronic device and disposed in a housing (1) of the electronic device to outside the housing (1),
A heat dissipating board (5) to be attached to one side of a heat conductive metal plate (3) constituting one side wall of an electronic component storage case (2) arranged in a housing (1), and a heat conductive metal plate (3) Clips (8) and (17) having mounting hooks (9) and (9) to be inserted into the insertion holes (10) and (10) of the heat radiation board (5) on the side of the heat conductive metal plate (3). On the surface of the electronic device, there are provided concave grooves (13) and (18) for fitting a part of the clips (8) and (17), and heat radiation fins (6) on the other surface of the heat radiation substrate (5). Radiator for equipment. The heat dissipating board (5) is made of extruded material, and a clip (8) is attached to a surface of the heat dissipating board (5) on the side of the heat conductive metal plate (3).
Grooves (13) and (18) for fitting a part of (17) are provided in the pushing direction of the radiating board (5), and the radiating fins (6) provided on the other surface of the radiating board (5) are 2. The heat radiating device for an electronic device according to claim 1, wherein the heat radiating device is composed of parallel skive fins cut and raised in a direction perpendicular to a direction in which the heat radiating board (5) is pushed out. The heat dissipating substrate (5) is made of extruded material, and a clip (8) is attached to a surface of the heat dissipating substrate (5) on the side of the heat conductive metal plate (3).
Recessed grooves (13) and (18) for fitting a part of (17) are provided in the extrusion direction of the heat dissipation board (5), and the heat dissipation fins (6A) provided on the other surface of the heat dissipation board (5) are 2. The heat radiating device for an electronic device according to claim 1, wherein the heat radiating device comprises a plurality of pin fins. 4. A radiator for radiating heat generated from an electronic component provided in an electronic device and disposed inside a housing (1) of the electronic device to outside the housing (1),
A duct-type heat radiating unit (4) with built-in heat radiating fins (6) on one side of a heat conductive metal plate (3) that constitutes one side wall of the electronic component storage case (2) arranged in the housing (1) The duct-type heat radiating unit (4) has a heat radiating fin (6) on one side and a heat radiating board (5). Heat dissipation board (5) and fin cover in combination with inverted U-shaped duct forming fin cover (7) and hooks (9) (9) for attachment to electronic component storage case (2) (7) A clip (8) for holding each other,
Heat dissipation device for electronic equipment. 5. A heat radiating device for radiating heat generated from electronic components provided in an electronic device and disposed inside a housing (1) of the electronic device to outside the housing (1),
A duct-type heat radiating unit (4) with built-in heat radiating fins (6) on one side of a heat conductive metal plate (3) that constitutes one side wall of the electronic component storage case (2) arranged in the housing (1) The duct-type heat radiating unit (4) has a heat radiating fin (6) on one side and a heat radiating board (5). It has an inverted U-shaped duct forming fin cover (7), and an inverted U-shaped clip (17) as viewed from the front, having mounting hooks (9) (9) at both ends for mounting the electronic component storage case (2). Grooves (14) and (14) are provided horizontally on the left and right end surfaces of the heat dissipation board (5), respectively, and the left and right side walls (7a) and (7c) of the duct forming fin cover (7) The groove (14) on the same side of the heat sink (5)
A heat dissipation device for electronic equipment, wherein engagement projections (15) and (15) to be fitted into (14) are provided in an inwardly projecting shape, respectively. 6. An internal enlarged groove (18) for fitting an inverted U-shaped clip (17) on a surface of the heat dissipation board (5) on the side of the heat conductive metal plate (3).
And the left and right side walls (7a) (7c) of the fin cover (7)
6. The heat radiation for an electronic device according to claim 5, wherein cover fixing protrusions (16) (16) inserted into both end portions of the internal enlarged concave groove (18) are provided in an inwardly protruding shape, respectively, at an end of the electronic device. apparatus. 7. A heat radiating device for radiating heat generated from an electronic component provided in an electronic device and disposed in a housing (1) of the electronic device to outside the housing (1),
A duct-type heat radiating unit (4) with built-in heat radiating fins (6) on one side of a heat conductive metal plate (3) that constitutes one side wall of the electronic component storage case (2) arranged in the housing (1) The duct-type heat radiating unit (4) has a heat radiating fin (6) on one side and a heat radiating board (5). A fin cover (7) for forming an inverted U-shaped duct and hooks (9) (9) for attaching to the electronic component storage case (2) at both ends ·cover
(7) A substantially inverted U-shaped clip (21) for connecting the two to each other, and a space for inserting the inverted U-shaped mounting member between the rows of the parallel radiating fins (6) of the heat radiating board (5). (22) is provided horizontally, and a pair of through holes (23) and (23) are provided in a heat dissipation board portion corresponding to the gap portion (22).
Notches (2) are provided at the ends of the left and right side walls (7a) (7c) of the cover (7).
4) (25) is the gap between the rows of parallel radiating fins (6).
(22) are provided at the level corresponding to (22), and inwardly bent portions (21a) are provided near the left and right ends of the substantially inverted U-shaped clip (21).
(21a) are provided, the fin cover (7) is combined with the heat dissipation board (5), and the fin cover
A substantially inverted U-shaped clip (21) is fitted over (7), and the inwardly bent portions (21a) and (21a) of the left and right end portions thereof are attached to the left and right side walls of the duct forming fin cover (7). Notches (24) and (25) of the parts (7a) and (7c) and the parallel radiating fins of the radiating board (5)
(6) are respectively fitted into the gaps (22) between the rows, and substantially inverted U-shaped clips (21) mounting hooks at both ends (9) (9)
Is inserted through the through holes (23) of the heat radiating board (5). 8. A heat radiating device for radiating heat generated from an electronic component provided in an electronic device and disposed in a housing (1) of the electronic device to outside the housing (1),
A duct-type heat radiating unit (4) with built-in heat radiating fins (6) on one side of a heat conductive metal plate (3) that constitutes one side wall of the electronic component storage case (2) arranged in the housing (1) The duct-type heat radiating unit (4) has a heat radiating fin (6) on one side and a heat radiating board (5). An inverted U-shaped duct forming fin cover (7) and an inverted U-shaped clip (26) viewed from the front having hooks (9) (9) at both ends for attachment to the electronic component storage case (2). Equipped,
A space (22) for inserting an inverted U-shaped clip is horizontally provided between rows of the parallel heat-dissipating fins (6) of the heat-dissipating board (5), and a heat-dissipating board portion corresponding to the gap (22) is provided. Are provided with a pair of through holes (23) and (23), concave grooves (14) and (14) are provided horizontally on both left and right end surfaces of the heat radiation board (5), respectively, and the duct forming fin cover (7) is At the ends of the left and right side walls (7a) (7c),
Engagement protrusions (15) and (15) fitted into the concave grooves (14) and (14) on the same side of the heat dissipation board (5) are provided inwardly protruding, respectively, and the left and right sides of the fin cover (7) are provided. At the ends of the side walls (7a) and (7c), cover fixing protrusions (27) and (27) inserted into both ends of the gap (22) between the rows of the parallel radiating fins (6) are provided, respectively. Inwardly protruding, parallel radiating fins on the radiating board (5)
An inverted U-shaped clip (26) is fitted into the gap (22) between the rows of (6), and the mounting hooks (9) (9) at both ends of the inverted U-shaped clip (26) are inserted into the through holes of the heat dissipation board (5). (23) (23), the fins and the cover (7) are combined with the radiator board (5), and the cover fixing projections (27) and (27) form the parallel radiator of the radiator board (5). A heat dissipating device for electronic equipment, which is fitted into a gap (22) between fins (6) and abuts on the upper surface of a heat dissipating substrate (5). 9. A heat radiating device for radiating heat generated from electronic components provided in an electronic device and disposed inside a housing (1) of the electronic device to outside the housing (1),
A duct-type heat radiating unit (4) with built-in heat radiating fins (6) on one side of a heat conductive metal plate (3) that constitutes one side wall of the electronic component storage case (2) arranged in the housing (1) The duct-type heat radiating unit (4) has a heat radiating fin (6) on one side and a heat radiating board (5). Inverted U-shaped fin cover for duct formation (7) and legs (2) with detent projections (29) for attachment to electronic component storage case (2)
8b), and a pin-shaped clip insertion gap (22) is provided horizontally between rows of the parallel radiating fins (6) of the radiating board (5). In addition, a pair of through holes (23) and (23) are provided in the heat dissipation board portion corresponding to the gap portion (22), and concave grooves (14) and (14) are provided on both left and right end surfaces of the heat dissipation board (5), respectively. It is installed horizontally and fits into the concave grooves (14) (14) on the same side of the heat dissipation board (5) at the ends of the left and right side walls (7a) (7c) of the duct forming fin cover (7) Engagement projections (15) and (15) are provided inwardly protruding, respectively, and the ends of the left and right side walls (7a) and (7c) of the fin cover (7) are Cover fixing projections (27) (27) inserted into both ends of the gap (22) between the rows are provided in an inwardly projecting shape, respectively, and the parallel radiation fins (6) of the radiation substrate (5) are provided.
A pin-shaped clip (28) is fitted into the gap (22) between the rows of the plurality of rows, and the detent projections (29) of the plurality of legs (28b) are fitted.
The radiating end is inserted through the through hole (23) of the heat dissipation board (5), and the heat dissipation board (5) is combined with the fin cover (7). ) Is the heat dissipation board
A heat radiating device for electronic equipment, which is fitted into a gap (22) between the parallel radiating fins (6) of (5) and is brought into contact with the upper surface of the heat radiating board (5). 10. The heat dissipating substrate (5) is made of extruded profile,
The heat radiation fin (6) provided on one side of the heat radiation substrate (5) is a parallel skive fin cut and raised in a direction orthogonal to the extrusion direction of the heat radiation substrate (5). 10. The heat radiating device for an electronic device according to claim 8, 8 or 9. 11. The heat dissipating substrate (5) is made of extruded profile,
The heat radiating device for an electronic device according to claim 7, 8 or 9, wherein the heat radiating fin (6A) provided on one surface of the heat radiating substrate (5) comprises a large number of pin-shaped fins.