JP2000133901A - Flexible circuit board - Google Patents
Flexible circuit boardInfo
- Publication number
- JP2000133901A JP2000133901A JP32131098A JP32131098A JP2000133901A JP 2000133901 A JP2000133901 A JP 2000133901A JP 32131098 A JP32131098 A JP 32131098A JP 32131098 A JP32131098 A JP 32131098A JP 2000133901 A JP2000133901 A JP 2000133901A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- elastic modulus
- flexible circuit
- base material
- protection layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 28
- 229920001721 polyimide Polymers 0.000 claims abstract description 8
- 239000013039 cover film Substances 0.000 claims abstract description 7
- 239000011241 protective layer Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract 2
- 238000011282 treatment Methods 0.000 description 4
- 238000013007 heat curing Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、所要の配線パタ−
ン上に感光性カバ−材料からなる表面保護層を有する可
撓性回路基板に於いて、カ−ルの発生を防止して良好な
平坦性を具備する可撓性回路基板に関する。The present invention relates to a required wiring pattern.
The present invention relates to a flexible circuit board having a surface protection layer made of a photosensitive cover material on a surface thereof and preventing the occurrence of a curl and having a good flatness.
【０００２】[0002]
【従来の技術】近年、電子機器の高密度化と小型化に応
じて、使用される実装回路基板全体としての高密度化と
小型化の要求があり、これに伴って１つの回路基板に実
装するＬＳＩ、チップ等の電子部品数やコネクタ−部品
数も増大している。2. Description of the Related Art In recent years, there has been a demand for higher density and smaller size of a mounted circuit board to be used in accordance with higher density and smaller size of electronic equipment. The number of electronic components, such as LSIs and chips, and the number of connectors and components are also increasing.
【０００３】この為、実装部品も従来のさし部品からチ
ップ部品に替わる一方、通電部の接続方式もピン差込み
後半田付けで補強する形態から、チップ部品を半田上に
固定した後、加熱して半田を溶融させ通電接続する表面
実装形態に移行している。[0003] For this reason, the mounting component is also replaced with the chip component from the conventional tip component, and the connection method of the current-carrying part is changed from a mode in which the pin component is inserted and reinforced by soldering. It has shifted to a surface mounting mode in which solder is melted and energized and connected.
【０００４】回路基板のなかでも、可撓性回路基板は材
料厚みが他の回路基板と比較すると薄く且つ放熱性も良
好なことから、高密度部品実装時の放熱対策基板として
注目されている。更に、可撓性回路基板はフィルム材料
で構成されているので屈曲状態での使用が可能であり、
折り曲げて筐体に組み込む態様により小型化を図った高
密度実装回路基板或いはケ−ブルと一体化した回路基板
としての展開が実用化されている。[0004] Among circuit boards, a flexible circuit board has been attracting attention as a heat dissipation measure board at the time of high-density component mounting because its material thickness is thinner and its heat dissipation is better than other circuit boards. Further, since the flexible circuit board is made of a film material, it can be used in a bent state,
The development as a high-density mounting circuit board or a circuit board integrated with a cable which is reduced in size by being folded and incorporated in a housing has been put to practical use.
【０００５】この場合、可撓性回路基板表面には表面実
装部品を接続する為に回路基板上の表面保護層に開口部
を形成する必要があり、そこで位置精度や開口面積の小
サイズ化から現在では感光性樹脂を利用し、露光及び現
像処理により開口部を形成した後、硬化処理を加えて表
面保護層を形成するのが一般的である。In this case, it is necessary to form an opening in the surface protection layer on the circuit board in order to connect the surface mount components to the surface of the flexible circuit board. At present, it is common to use a photosensitive resin, form an opening by exposure and development processing, and then apply a curing treatment to form a surface protective layer.
【０００６】[0006]
【発明が解決しようとする課題】しかし、可撓性回路基
板の表面保護層に感光性カバ−材料を使用した場合は、
可撓性べ−ス材と感光性カバ−材料とが同一材料ではな
い為、その物性が異なることから、使用温度範囲、例え
ば感光性カバ−材料の加熱工程終了後、室温までに降温
した際にカ−ルが発生してしまい、製品としての平坦性
を損ない部品実装時に障害となるという問題があった。However, when a photosensitive cover material is used for the surface protective layer of the flexible circuit board,
Since the flexible base material and the photosensitive cover material are not the same material and have different physical properties, when the temperature is lowered to room temperature after use, for example, the heating step of the photosensitive cover material is completed. In addition, there is a problem in that the curl is generated, the flatness of the product is impaired, and a hindrance occurs during component mounting.
【０００７】そこで、本発明は、所要の配線パタ−ン上
に感光性カバ−材料からなる表面保護層を有する可撓性
回路基板に於いて、カ−ルの発生を防止して良好な平坦
性を有する可撓性回路基板を提供するものである。Therefore, the present invention provides a flexible circuit board having a surface protective layer made of a photosensitive cover material on a required wiring pattern, thereby preventing the occurrence of curl and providing a good flat surface. A flexible circuit board having flexibility is provided.
【０００８】[0008]
【課題を解決するための手段】その為に本発明の可撓性
回路基板では、可撓性べ−ス材上に形成した所要の配線
パタ−ンを備え、前記配線パタ−ン上に感光性カバ−材
料からなる表面保護層を設けた可撓性回路基板に於い
て、前記表面保護層は所定の温度範囲内で前記可撓性べ
−ス材の弾性率の変化率と近似する弾性率の変化率を備
えるように構成したものである。For this purpose, the flexible circuit board of the present invention has a required wiring pattern formed on a flexible base material, and a photosensitive pattern is formed on the wiring pattern. In a flexible circuit board provided with a surface protective layer made of a flexible cover material, the surface protective layer has an elasticity that is close to a rate of change in the elastic modulus of the flexible base material within a predetermined temperature range. It is configured to have a rate change rate.
【０００９】ここで、前記可撓性べ−ス材はポリイミド
フィルムで構成し、前記表面保護層は感光性カバ−フィ
ルムで構成することができ、また、前記所定の温度範囲
としては２５℃から８０℃を挙げることができる。Here, the flexible base material may be composed of a polyimide film, the surface protective layer may be composed of a photosensitive cover film, and the predetermined temperature range is from 25 ° C. 80 ° C.
【００１０】[0010]
【発明の実施の形態】以下、図面を参照しながら本発明
を更に詳述する。図１は本発明による可撓性回路基板の
構造を説明する為の概念的な断面構成図であり、１は可
撓性べ−ス材であって、その上面には銅箔等に対するエ
ッチング手段などその他の常法により所要の配線パタ−
ン２を形成してあり、また、これらの配線パタ−ン２上
には、それを保護する為の表面保護層３が形成されてい
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail with reference to the drawings. FIG. 1 is a conceptual cross-sectional view for explaining the structure of a flexible circuit board according to the present invention. Reference numeral 1 denotes a flexible base material, the upper surface of which is an etching means for copper foil or the like. Wiring pattern required by other usual methods such as
In addition, a surface protection layer 3 for protecting the wiring pattern 2 is formed on the wiring pattern 2.
【００１１】可撓性べ−ス材１には一例として厚さ２５
μｍのポリイミドフィルムを使用することができ、ま
た、表面保護層３には、感光性カバ−材料である厚さ６
２．５μｍの感光性カバ−フィルムを用い、これに所定
の開口部等を形成することができるように所要の露光及
び現像処理を加え、更に加熱硬化処理を施してその表面
保護層を形成することができる。The flexible base material 1 has a thickness of 25 as an example.
A polyimide film having a thickness of 6 μm, which is a photosensitive cover material, can be used for the surface protective layer 3.
A photosensitive cover film having a thickness of 2.5 μm is subjected to necessary exposure and development treatments so that predetermined openings and the like can be formed, and further subjected to a heat curing treatment to form a surface protective layer. be able to.
【００１２】ここで、可撓性べ−ス材１に使用するポリ
イミドフィルムの弾性率の変化率は使用環境温度範囲で
ほぼ一定であり、また、表面保護層３としての感光性カ
バ−材料である感光性カバ−フィルムの弾性率の温度依
存性を測定すると、約２５℃から８０℃内での弾性率の
変化率がポリイミドフィルムの弾性率の変化率とほぼ同
等で極めて近似しており、そこで、その加熱硬化工程で
はこの温度範囲内で処理した後、室温に降温して外観を
確認したところ、製品にカ−ルは発生せず良好な平坦性
が得られた。Here, the rate of change of the modulus of elasticity of the polyimide film used for the flexible base material 1 is substantially constant over the operating temperature range, and the photosensitive cover material as the surface protective layer 3 is used. When the temperature dependence of the elastic modulus of a photosensitive cover film is measured, the rate of change of the elastic modulus within a temperature range of about 25 ° C. to 80 ° C. is almost the same as the rate of change of the elastic modulus of the polyimide film, and is very similar. Then, in the heat curing step, after treatment within this temperature range, the temperature was lowered to room temperature and the appearance was confirmed. As a result, no curl was generated on the product, and good flatness was obtained.
【００１３】なお、比較の為に、上記の如く製作した可
撓性回路基板を室温から感光性カバ−フィルムの弾性率
が変化する温度領域の０℃まで冷却して外観を確認した
ところ、カ−ルの発生が認められた。For comparison, the flexible circuit board manufactured as described above was cooled from room temperature to 0 ° C. in a temperature range where the elastic modulus of the photosensitive cover film changes, and the appearance was confirmed. -The occurrence of a crack was observed.
【００１４】[0014]
【発明の効果】本発明の可撓性回路基板によれば、その
回路基板の配線パタ−ンを被覆する為の表面保護層とし
て感光性カバ−材料を使用した場合でも、常温を含め
て、加熱硬化工程などの製造時にカ−ルの発生を防止し
て平坦性の良好な製品が得られるので、小型且つ高密度
実装用可撓性回路基板として歩留の高い優れた製品を提
供することができる。According to the flexible circuit board of the present invention, even when a photosensitive cover material is used as a surface protective layer for covering the wiring pattern of the circuit board, even at room temperature, A product with good flatness can be obtained by preventing the occurrence of curl at the time of manufacturing such as a heat curing process, so that an excellent product with a high yield as a small and flexible circuit board for high-density mounting is provided. Can be.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明の可撓性回路基板を説明する為の概念的
な断面構成図。FIG. 1 is a conceptual cross-sectional configuration diagram for explaining a flexible circuit board of the present invention.
１ 可撓性べ−ス材 ２ 配線パタ−ン ３ 表面保護層 DESCRIPTION OF SYMBOLS 1 Flexible base material 2 Wiring pattern 3 Surface protective layer
Claims (3)
タ−ンを備え、前記配線パタ−ン上に感光性カバ−材料
からなる表面保護層を設けた可撓性回路基板に於いて、
前記表面保護層は所定の温度範囲内で前記可撓性べ−ス
材の弾性率の変化率と近似する弾性率の変化率を備える
ように構成したことを特徴とする可撓性回路基板。1. A flexible circuit board having a required wiring pattern formed on a flexible base material and a surface protective layer made of a photosensitive cover material provided on the wiring pattern. At
The flexible circuit board according to claim 1, wherein the surface protective layer has a change rate of the elastic modulus that is close to a change rate of the elastic modulus of the flexible base material within a predetermined temperature range.
で構成し、前記表面保護層を感光性カバ−フィルムで構
成した請求項１の可撓性回路基板。2. The flexible circuit board according to claim 1, wherein said flexible base material is made of a polyimide film, and said surface protective layer is made of a photosensitive cover film.
ある請求項１又は２の可撓性回路基板。3. The flexible circuit board according to claim 1, wherein said predetermined temperature range is from 25 ° C. to 80 ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32131098A JP2000133901A (en) | 1998-10-26 | 1998-10-26 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32131098A JP2000133901A (en) | 1998-10-26 | 1998-10-26 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000133901A true JP2000133901A (en) | 2000-05-12 |
Family
ID=18131165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32131098A Pending JP2000133901A (en) | 1998-10-26 | 1998-10-26 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000133901A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7851706B2 (en) | 2005-08-01 | 2010-12-14 | Samsung Electronics Co., Ltd. | Flexible printed circuit and manufacturing method thereof |
-
1998
- 1998-10-26 JP JP32131098A patent/JP2000133901A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7851706B2 (en) | 2005-08-01 | 2010-12-14 | Samsung Electronics Co., Ltd. | Flexible printed circuit and manufacturing method thereof |
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Legal Events
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|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050209 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20070501 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
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| A521 | Written amendment |
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| A02 | Decision of refusal |
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