JP2000129471A - Substrate treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an immersion type substrate treating device capable of well subjecting a substrate surface to treatment over the entire surface. SOLUTION: A lifter 10 receives the plural untreated substrates W on the outside above a treating vessel 5 and descends to hand over the substrates W to an in-vessel holder 14. The portions held in contact with the substrates W are thereby alternated from longitudinally grooves which are the substrate holding part of the lifter 10 to the in-vessel holder 14. The main treatment process by a treating liquid 6 progresses while the substrates W are held by the in-vessel holder 14 and during this time, the substrate holding parts of the lifter 10 are evacuated below the substrates W. The portions held by the substrate holding parts of the lifter 10 among the peripheral edges of the substrates W and the portions W14 held by the in-vessel holder 14 are separate portions. Such substrate portions where the contact with the fresh treating liquid is hindered are, therefore, eliminated over the entire part of a series of the process and the good treatment may be executed over the entire surface of the substrates surfaces.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate such as a semiconductor substrate or a substrate for a liquid crystal display (hereinafter simply referred to as a "substrate").
To a substrate processing solution such as a chemical solution or a cleaning solution (hereinafter simply referred to as “processing solution”).
The present invention relates to an immersion type substrate drying apparatus for immersing the substrate in a surface treatment.

[0002]

BACKGROUND OF THE INVENTION Generally, in the surface treatment process of a substrate for a precision electronic device, it is necessary to perform a substrate treatment such as an etching treatment with a chemical such as hydrofluoric acid or a cleaning treatment with pure water. Various types of substrate processing apparatuses used for such purposes are known, and immersion-type substrate processing apparatuses that perform surface treatment by immersing a substrate in a processing tank storing a processing liquid are also known. One.

Such an immersion type substrate processing apparatus has a substrate elevating mechanism, and the substrate elevating mechanism has, for example, a groove for engaging with a substrate as a substrate holding portion. Then, the substrate holding unit moves between the inside and the outside of the processing liquid as the substrate elevating mechanism moves up and down.

The immersion type substrate processing apparatus is roughly classified into the following two types in relation to the substrate holder and the substrate.

[0005] The first type is an apparatus of a type in which a substrate holding unit is immersed in the same processing liquid together with the substrate for a period from the introduction of the substrate to the processing liquid until the substrate is pulled up. In this specification, this type is referred to as a "submerged-substrate-type substrate processing apparatus".

Another one is that the substrate holding unit exists inside the processing liquid only during a period in which the substrate is charged or pulled up into the processing liquid, and does not need to be inside the processing liquid during the other periods.

[0007] More specifically, the apparatus has a pair of chucks that are opened and closed by a substrate lifting mechanism. The chuck has a groove for engaging with the substrate as a substrate holding portion. Then, after the substrate is gripped by the chuck and put into the processing liquid, the substrate lifting / lowering mechanism once opens the chuck and exits the processing tank once with the substrate remaining in the processing liquid. When the processing of the substrate is completed, the substrate elevating mechanism returns to the processing tank and lifts the substrate from the processing liquid. In this specification, this type is referred to as an “out-of-liquid transfer type substrate processing apparatus”.

[0008] Among them, the out-of-liquid transfer type substrate processing apparatus uses a substrate elevating mechanism that can be used for transporting a substrate in another processing tank while the processing of the substrate is in progress in the processing tank. There is an advantage that the transfer efficiency is good. However, since the chuck after touching a different processing solution or atmosphere returns to the first processing tank, foreign matter easily adheres to the substrate after processing. Countermeasures such as providing a separate tank are required.

On the other hand, in a substrate processing apparatus of a submerged type, the substrate holding portion of the substrate elevating mechanism is always in the same processing liquid accompanying the substrate, so that the processed substrate is contaminated by foreign matter. There is an advantage that there is little.

[0010]

2. Description of the Related Art As a conventionally used substrate processing apparatus of a standby type in a liquid, for example, there is one disclosed in Japanese Patent Application Laid-Open No. Hei 7-161678. In this apparatus, the peripheral edge of each of the plurality of substrates is fitted into a vertical groove (corresponding to a substrate holding portion) formed in a substrate holding member of a substrate lifting / lowering mechanism (lifter). (Vertical attitude toward the horizontal direction). Then, the vertical grooves are immersed together with the substrates over a period from input to the processing tank to pulling up while holding the substrates.

[0011]

However, in this prior art, since the process proceeds while the substrate is fitted and held in the vertical groove formed in the substrate holding member of the lifter, the vertical groove is in contact with the vertical groove. -The fresh processing solution hardly reaches the part of the substrate that is in proximity, and the surface treatment becomes insufficient. As a result, an unfavorable situation arises in this part of the substrate where the processing quality is lower than in other parts.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide an immersion type substrate processing apparatus capable of performing excellent processing over the entire surface of a substrate.

[0013]

According to a first aspect of the present invention, in performing a surface treatment of a substrate by immersing the substrate in a processing solution, the substrate is held in the processing solution. The substrate processing apparatus, wherein the substrate holding unit of the means for moving up and down between the inside and the outside of the substrate is immersed in the processing liquid together with the substrate for a period from the introduction of the substrate to the processing liquid until the substrate is pulled up. (A) a processing tank for storing the processing liquid, (b) an in-tank holding means disposed in the processing tank and holding the substrate at a predetermined position in the processing liquid, (c) A substrate holding unit that holds a part of the substrate that is different from a part held by the in-tank holding unit; delivering and transferring the substrate outside the processing tank; and the in-tank holding unit at the predetermined position. Receiving the substrate between Perform teeth, and during the processing of the substrate at the predetermined position is performed and a, a movable holding mechanism which the substrate holder is retracted away from the substrate in the treatment solution.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the present invention, the holding means in the tank comprises:
-1) a set of holding members that are arranged at an interval from each other and hold both sides of the lower half of the substrate that has been set upright in the processing tank; The lower peripheral portion of the substrate is held at the interval between the sets, and while the processing of the substrate is being performed at the predetermined position, the substrate holding portion of the moving and holding mechanism is at the predetermined position. It is separated from the substrate and evacuated below.

According to a third aspect of the present invention, in the substrate processing apparatus according to the second aspect of the present invention, the set of holding members is a set of plate members provided with a groove for holding a peripheral portion of the substrate. is there.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to the second aspect of the present invention, the set of holding members is a set of bar members provided with a groove for holding a peripheral portion of the substrate. It is.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <Outline of Substrate Processing Unit> FIG.
1 is a schematic configuration diagram illustrating a substrate processing unit U incorporating a substrate processing apparatus 100 according to an embodiment of the present invention. The overall configuration of the substrate processing unit U is an example common to each embodiment described later. I have.

The processing unit U is a unit for immersing a substrate such as a semiconductor wafer in a chemical solution such as hydrofluoric acid or the like and pure water to perform the substrate processing, and then performing a drying process by rotating the substrate.

In the processing unit U, a cassette C containing a plurality of substrates W is loaded into the loading / unloading unit 110, and the cassette C is transferred to the substrate unloading unit 120. The substrate unloading unit 120 pushes up a plurality of unprocessed substrates W from the cassette C and transfers the unprocessed substrates W to the substrate transport robot TR. The substrate transfer robot TR is freely movable in the horizontal direction, and sequentially transfers the substrate W to the three substrate processing apparatuses 100 and the substrate drying unit 130.

Each of the three substrate processing apparatuses 100 is a processing apparatus for performing a chemical solution process or a pure water cleaning process on the substrate W. The details of the substrate processing apparatus 100 will be described later. Then, the substrate W having been subjected to the cleaning process with the pure water is transferred to the substrate drying unit 130 by the substrate transport robot TR, and is subjected to the drying process.

The substrate W for which the drying process has been completed is transported by the substrate transport robot TR to a position above the substrate take-out unit 120 again. Then, the substrate extracting unit 120 receives the processed substrate W from the substrate transport robot TR, and
To be stored. The cassette C accommodating the plurality of processed substrates W is transferred to the loading / unloading unit 110, from which the processing unit U
It is carried out of the outside.

<Main Configuration of Substrate Processing Apparatus 100 of First Embodiment> FIG. 2 is a front view showing the main configuration of the substrate processing apparatus 100 according to the first embodiment of the present invention. FIG. 3 is a side view showing a configuration of a main part of the substrate processing apparatus 100.

The substrate processing apparatus 100 includes a processing tank 5 and a lifter 10 capable of holding a plurality of substrates W in an upright posture at a predetermined interval from each other.

The processing tank 5 has a width slightly larger than the diameter of the substrate W, and has a tapered shape that expands outward above the processing tank 5, and stores a processing liquid 6. In addition, the bottom of the processing tank 5 has a valley-shaped cross section in which the center is slightly lower.

The processing tank 5 has an opening 9 at an upper portion, and a processing liquid supplied from a processing liquid supply pipe 7 described later overflows from the opening 9. By doing so, the processing liquid that is not fresh can overflow out of the processing tank 5 through the opening 9, so that the processing liquid can be continuously supplied to the substrate. Further, even if a contaminant is suspended in the processing liquid, the contaminant is discharged from the opening 9, so that a clean processing liquid can be supplied to the substrate. In this embodiment, the processing tank 5 has a tapered upper portion, but may be a processing tank having no taper.

At the two corners at the bottom of the processing tank 5, two processing liquid supply pipes 7 are welded with their longitudinal directions arranged in a direction perpendicular to the paper surface of FIG. ing. Note that these processing liquid supply pipes 7 are arranged substantially in parallel at regular intervals. Processing liquid supply pipe 7
In FIG. 2, a plurality of slit-shaped ejection holes 8 are provided in parallel with a longitudinal direction of the processing liquid supply pipe 7 (a direction perpendicular to the plane of FIG. 2).

The lifter 10 is provided with a suspension member 11 and a substrate holding frame 12 integrally connected to a lower portion of the suspension member 11. Three substrate holding members 13 extend horizontally from the substrate holding frame 12 (see FIG. 3).

The substrate holding member 13 has a VI (described later) of FIG.
As shown in FIG. 7 corresponding to the I-VII sectional view, substantially Y
A vertical groove 13G is formed at a predetermined interval, and a plurality of substrates W (indicated by phantom lines) have lower ends formed by vertical grooves 13G.
By fitting into G, it is maintained in a standing posture.
This vertical groove 13 </ b> G corresponds to the substrate holding part of the lifter 10.

Further, four plate-like in-tank holders 14 extending from the inner wall of the processing tank 5 toward the center and capable of holding the substrate W in the processing tank 5 are fixedly provided at intervals. V-shaped vertical grooves 14G as shown in FIG. 6 corresponding to the sectional view taken along the line VI-VI of FIG. 2 are also formed at predetermined intervals in the in-tank holder 14, and both sides of the lower half of the substrate W are erected. It can be held in a posture. The vertical groove 14 </ b> G corresponds to the substrate holding part of the in-tank holder 14. However, the peripheral surface portion W14 of the substrate W held by the in-tank holder 14 (see FIG. 2) is different from the peripheral surface portion W13 of the substrate W held by the lifter 10 (see FIG. 4). The holder 14 is arranged.

In FIG. 3, an elevating drive mechanism 20 for raising and lowering the lifter 10 is provided outside the processing tank 5. The lifting drive mechanism 20 includes a motor 21, and a drive pulley 22 that is driven to rotate by the motor 21 is provided. A belt 24 is stretched between the driving pulley 22 and the driven pulley 23. A lower end of a drive rod 25 is fixed to the belt 24, and an upper end of the drive rod 25 is connected to the lifter 10.

The forward or reverse rotation of the motor 21 causes the drive pulley 22 to rotate. The rotation of the driving pulley 22 is the belt 2
4, the drive rod 25 having a lower end fixed to the belt 24 moves in the vertical direction. The lifter 1 connected to the drive rod 25 is moved up and down by the drive rod 25.
0 goes up and down. With such a configuration, the lifter 10
The substrate transfer position (position in FIG. 5) for transferring the substrate W to and from the substrate transfer robot TR, the substrate transfer position (virtual line position in FIG. 2) for transferring the in-tank holder 14 and the substrate W, and the processing tank 5 Is moved up and down by the elevating mechanism 20 to and from the substrate processing position (solid line position in FIG. 2).

The in-tank holder 14 is arranged so as to avoid the moving path of the lifter 10 (in this embodiment, the vertical moving path in FIG. 2). Thereby, the lifter 10
When the is moved up and down, the in-tank holder 14 does not interfere with the lifter 10. The mechanism for driving the lifter 10 to move up and down is not limited to the above-described embodiment, and may be a lift drive mechanism using an air cylinder, an actuator, or the like.

<Operation of Substrate Processing Apparatus 100> The operation of the substrate processing apparatus 100 having such a configuration is as follows.

First, a plurality of unprocessed substrates W are transported above the substrate processing apparatus 100 by the substrate transport robot TR of FIG. Then, the lifter 10 is raised by the lifting mechanism 20 to the substrate delivery position (see FIG. 5), and receives a plurality of unprocessed substrates W from the substrate transport robot TR. At this time, the peripheral edges of the substrates W fit into the vertical grooves 13G (see FIG. 7) formed in the three substrate holding members 13 of the lifter 10, and the plurality of substrates W stand up at a predetermined interval from each other. Supported by

Next, the elevating mechanism 20 lowers the lifter 10 toward the inside of the processing tank 5. FIG. 4 shows the state of the substrate W in this lowering process. In this lowering process, each substrate W
Surface treatment proceeds. However, since the peripheral portion surface portion W13 of the substrate W is in contact with the vertical groove 13G of the lifter 10, the peripheral portion W13 rarely touches the fresh processing liquid supplied from the ejection hole 8 of the processing liquid supply pipe 7. The progress of the surface treatment of this portion W13 is slower than other surface portions.
The lowering of the lifter 10 may be temporarily stopped at the position shown in FIG. 4 during the lowering process, and may be left for a predetermined period of time before restarting the lowering of the lifter 10.

Then, the lifter 10 descends to a substrate transfer position indicated by a virtual line in FIG. The plurality of substrates W supported by the three substrate holding members 13 of the lifter 10 are
The peripheral edges of the four in-tank holders 14 are fitted into the vertical grooves 14 </ b> G (see FIG. 6), and are replaced with the supports of the in-tank holders 14.

When the lifter 10 is further lowered, a peripheral surface W14 of the substrate W different from the peripheral surface W13 of the substrate W comes into contact with and holds the vertical groove 14G of the in-tank holder 14. When the lifter 10 further descends from this position, the substrate W
The means for holding the substrate W by contacting with the substrate is changed from the lifter 10 to the in-tank holder 14.

In this state, that is, in a state where the substrate W is at the position shown in FIG. 2 and the vertical groove 13G of the lifter 10 is separated from the substrate W and retracted below the substrate W, the substrate W is left for a predetermined time. (Main processing). Thereby, the surface treatment of the substrate W with the treatment liquid 6 is continuously performed.

When the main processing of the substrate W is completed, the processed substrate W is taken out of the substrate processing apparatus 100 in a procedure reverse to that described above. That is, the lifter 10 is lifted up from the processing tank 5 together with the plurality of substrates W by the lifting mechanism 20. Then, when reaching the substrate transfer position, the substrate W is transferred to the substrate transfer robot TR. Thereafter, the substrate transport robot TR transports the substrate W after the substrate processing to the drying unit 130.

In the above, the apparatus 100 of this embodiment
Then, since the progress of the surface treatment in the descending process as shown in FIG. 4 is slower than the other portion, the peripheral surface portion W13 is not in contact with any of the lifter 10 and the in-tank holder 14 in the main process. In addition, a sufficient surface treatment is performed by touching the fresh treatment liquid supplied from the ejection hole 8 of the treatment liquid supply pipe 7.

In this main processing step, the surface treatment of the peripheral surface portion W14 of the substrate W which is in contact with the vertical groove 14G of the in-tank holder 14 progresses slowly. Since the processing is already in contact with the fresh processing liquid in the descending process, and also in the process of lifting the substrate W from the processing tank 5 as described above, the substrate W comes into contact with the fresh processing liquid.
After a series of processes of descending process, main processing process, and ascending process, necessary processes are completed.

By the way, compared with the central portion of the substrate W, the time during which the peripheral surface portions W13 and W14 are in contact with the processing liquid 6 is shorter. However, the central portion of the substrate W is a region for forming a semiconductor device and requires a sufficient and sufficient surface treatment, whereas the peripheral surface portions W13 and W1 are required.
Reference numeral 4 denotes an area where no device is formed, so that a relatively short processing time has substantially no effect.

On the other hand, if the peripheral surface portion W13 always keeps in contact with the vertical groove 13G of the lifter 10 as in the prior art, there is no chance that this portion W13 comes into contact with fresh processing liquid. However, this part W13 does not reach the point where a substantial effect of the surface treatment is obtained. In such a case, for example, the etching residue etc.
In the case where it remains in 3 and later diffuses into the central portion of the substrate W, the device formation region is re-contaminated. On the other hand, in the apparatus 100 of this embodiment, although the substantial surface treatment time of the peripheral surface portions W13 and W14 is shorter than that of the central portion of the substrate W, there is an opportunity for these to come into contact with a fresh treatment liquid. Such a problem does not arise because of such recontamination.

In particular, by temporarily stopping the lifter 10 in at least one of the descending process and the ascending process, or by lowering the lift speed of the lifter 10 in at least one of the descending process and the ascending process, the peripheral surface portion W14 is also reduced. Sufficient surface treatment can be ensured.
However, if the processing liquid 6 is not a pure water but a reaction-promoting processing liquid such as an etching liquid, only a part of the substrate W is used in order to ensure the uniformity of processing at the central portion of the substrate W. It is preferable to avoid a temporary stop or a decrease in the elevating speed in a state where is exposed on the processing liquid 6. Therefore, when the vehicle is temporarily stopped or the speed is reduced as described above, FIG.
It is preferable to perform them at the stage where the entire substrate W is immersed in the processing liquid 6 as described above.

In this way, at the holding portion of the substrate W,
An unfavorable situation in which the processing quality is greatly reduced as compared with other substrate surface portions does not occur. As a result, the processing can be favorably performed over the entire surface of the substrate.

The substrate may be processed from the beginning to the end with the lifter 10 holding the substrate, or the substrate may be processed from the beginning to the end with the substrate held in the tank guide 14. Good.

<Main Configuration of Substrate Processing Apparatus 100 of Second Embodiment> FIG. 8 is a diagram showing the main configuration of a substrate processing apparatus 100A according to a second embodiment of the present invention. In the substrate processing apparatus 100A, a rod-shaped in-tank holder 14A is provided as a member corresponding to the in-tank holder 14 of the substrate processing apparatus 100 (FIG. 2) of the first embodiment. The in-tank holder 14A is a rod-shaped member that is not connected to the inner wall of the processing tank 5 in a direction perpendicular to the paper surface of FIG. 8, and has a groove for holding the peripheral edge of the substrate W. However, similarly to the first embodiment, the surface portion of the substrate W held by the in-tank holder 13A is different from the surface portion W13 of the substrate W held by the lifter 10 (see FIG. 4).
Place.

As a result, the substrate surface portion W13 held by the lifter 10 and unable to come into contact with the fresh processing liquid and having insufficient surface treatment is transferred from the lifter 10 to the in-tank holder 14A. It will be treated with fresh treatment liquid. As a result, similarly to the first embodiment, an unfavorable situation in which the processing quality is reduced in the holding portion of the substrate W as compared with the other substrate surface portions does not occur, and the processing can be favorably performed over the entire surface of the substrate. it can.

Since the in-tank holder 14A is provided so as not to be connected to the inner wall of the processing tank 5 in the direction perpendicular to the paper of FIG. 8, a space is formed between the inner wall and the in-tank holder 14A. . For this reason, since the processing liquid can flow through the space, the portion where the processing liquid stays in the processing tank 5 is reduced. Therefore, it is possible to prevent contaminants in the processing liquid from staying and adhering to the substrate, and it is possible to easily supply a fresh processing liquid to the substrate, thereby improving the processing quality of the substrate.

Other configurations and operations are the same as those of the device 100 of the first embodiment.

<Modifications> In the above embodiment, fresh processing liquid is supplied from the ejection hole 8 of the processing liquid supply pipe 7 in the processing tank 5 so that the flowing processing liquid comes into contact with the surface of the substrate W. However, the present invention can be applied to a substrate processing apparatus in which the processing liquid supply pipe 7 and the ejection hole 8 are not provided in the processing tank 5 and the processing liquid does not flow.

In the above-described embodiment, the substrate processing apparatus performs surface treatment by bringing a processing liquid such as a chemical solution or a cleaning liquid into contact with the substrate. However, the cleaning liquid in the processing tank is subjected to ultrasonic vibration to perform the cleaning processing on the substrate. Can also be applied to the substrate processing apparatus 100B that performs the above.

FIG. 9 is a diagram showing a main configuration of the substrate processing apparatus 100B. The substrate processing apparatus 100B has a configuration in which an outer tub 30 and an ultrasonic vibrator 32 provided at the bottom thereof are added to a substrate processing section 90 having the same configuration as the substrate processing apparatus 100 of the first embodiment (see FIG. 2). Has become. Propagation water 31 is stored inside the outer tank 30,
The bottom and the lower side of the processing tank 5 are arranged so as to come into contact with each other. Further, the ultrasonic oscillator 32 includes an oscillator 3
3 are electrically connected.

In the substrate processing apparatus 100B, the ultrasonic oscillator 32 receives an oscillating voltage from the oscillator 33 and vibrates at a high frequency. This vibration is transmitted through the propagation water 31 to the treatment tank 5.
The substrate W is transmitted to the internal cleaning liquid and is cleaned.

In the substrate processing apparatus 100B as described above, the same structure as the substrate processing apparatus 100 of the first embodiment is adopted for the inside of the substrate processing section 90 disposed in the outer tank 30, so that the substrate surface Can be satisfactorily applied to the entire surface of the substrate.

In holding the substrate W in the above embodiment, the four points of the four in-tank holders 14 in the processing tank 5 are used, but the peripheral surface portion W13 of the substrate W held by the lifter 10 is used. If the arrangement of the in-tank holder 14 can hold the surface portion of the substrate W different from the
It can be supported at a plurality of positions such as three points.

When the in-tank holder 14 is provided so as to be able to advance and retreat inside the processing tank 5, the elevating path of the lifter 10 may partially overlap the in-tank holder 14. In this case, when raising and lowering the substrate W, the in-tank holder 14 is retracted. Such a modification is effective when a part of the in-tank holder 14 is provided above the center of the substrate W in the standing posture. When the in-tank holder is provided below the center of the substrate W in the upright posture as in the above-described embodiment, the in-tank holder 14 can be fixedly arranged avoiding the vertical path as in the embodiment. , Which is structurally simpler.

[0058]

As described above, according to the first aspect of the present invention, two different means for holding a substrate, namely, the holding means in the tank and the moving holding means, are used to separate different substrates during the substrate processing. Alter to keep the periphery.

As a result, the surface portion of the substrate, which has not been able to come into contact with the fresh processing solution and has been insufficiently surface-treated, is replaced by a different substrate surface portion due to the change of the means for holding the substrate. The substrate surface portion, which has been used, is treated with the fresh processing solution. Therefore, the situation in which the processing quality is reduced in the substrate holding portion as compared with other substrate surface portions does not occur. As a result, the processing can be favorably performed over the entire surface of the substrate.

According to the second aspect of the present invention, the set of holding members, which are holding means in the tank, hold the lower half of the substrate and are spaced apart from each other. Holds the lower peripheral portion of the substrate. As a result, the moving and holding means can smoothly transfer the substrate between the inside and the outside of the processing tank without interfering with the moving path of the in-tank holding means, and the structure of the in-tank holding means can be simplified.

According to the third aspect of the present invention, since the holding member set is a plate material in which a groove for holding the peripheral portion of the substrate is formed, the manufacturing of the member is relatively simple. In addition, the substrate can be reliably held.

Further, according to the invention of claim 4, according to claim 3,
Similarly to the invention of the above, the set of holding members is a bar material in which a groove for holding the peripheral portion of the substrate is engraved, so that the production of this member is relatively simple, and the substrate is securely held. be able to.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a substrate processing unit incorporating a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a front view illustrating a main configuration of the substrate processing apparatus of FIG. 1;

FIG. 3 is a side view illustrating a main configuration of the substrate processing apparatus of FIG. 1;

FIG. 4 is a diagram illustrating a position of a moving holding unit during substrate processing different from the positional relationship of FIG. 2;

FIG. 5 is a diagram showing a state when a substrate is transferred to and from the outside of a processing tank.

FIG. 6 is an enlarged sectional view as viewed from a position VI-VI in FIG. 2;

FIG. 7 is an enlarged sectional view as viewed from a position VII-VII in FIG. 4;

FIG. 8 is a front view illustrating a main configuration of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 9 is a front view showing a main configuration of a substrate processing apparatus according to a modification of the present invention.

[Explanation of symbols]

 Reference Signs List 5 processing tank 6 processing liquid 10 lifter 11 hanging member 12 substrate holding frame 13 substrate holding member 13G groove 14 tank holder 14G groove 20 lifting mechanism W substrate

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Koji Hasegawa 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori-Teranouchi, Kamigyo-ku, Kyoto F-term (reference) in Dainippon Screen Mfg. Co., Ltd. 3B201 AA03 AB24 AB44 BB04 BB85 BB93 BB96 CB15 CC13 4K057 WA11 WB06 WE07 WM02 WM03 WM11 WM18 WN01 5F043 AA01 EE02 EE35 EE36

Claims (4)

[Claims] In performing a surface treatment of the substrate by immersing the substrate in a processing liquid, a substrate holding unit of means for holding the substrate and moving up and down between the inside and the outside of the processing liquid includes: A substrate processing apparatus in a state where the substrate is immersed in the processing liquid together with the substrate over a period from the introduction of the substrate to the processing liquid until the substrate is pulled up, wherein: (a) a processing tank that stores the processing liquid; b) an in-tank holding unit that is disposed in the processing tank and holds the substrate at a predetermined position in the processing liquid; and (c) a portion of the substrate that is different from a portion held by the in-tank holding unit. Having a substrate holding portion for holding the substrate, transferring the substrate outside the processing tank, transferring the substrate between the holding means in the tank at the predetermined position, and the substrate at the predetermined position Is being processed A moving and holding mechanism for moving the substrate holding unit away from the substrate in the processing liquid during the processing. 2. The substrate processing apparatus according to claim 1, wherein the in-tank holding means comprises: (b-1) a lower half of the substrate which is arranged at an interval from each other and is in an upright posture in the processing tank. A pair of holding members for holding both sides of the portion, wherein the moving and holding mechanism holds the lower peripheral portion of the substrate at the interval between the sets of the holding members, and at the predetermined position, The substrate processing apparatus is characterized in that, while the substrate is being processed, the substrate holding portion of the moving and holding mechanism is separated from the substrate and evacuated below the predetermined position. 3. The substrate processing apparatus according to claim 2, wherein the set of holding members is a set of plate members provided with a groove for holding a peripheral portion of the substrate. . 4. The substrate processing apparatus according to claim 2, wherein the set of holding members is a set of bar members provided with a groove for holding a peripheral edge of the substrate. apparatus.