JP2000124644A - Card type circuit module device and mounting board used therefor - Google Patents
Card type circuit module device and mounting board used thereforInfo
- Publication number
- JP2000124644A JP2000124644A JP10288962A JP28896298A JP2000124644A JP 2000124644 A JP2000124644 A JP 2000124644A JP 10288962 A JP10288962 A JP 10288962A JP 28896298 A JP28896298 A JP 28896298A JP 2000124644 A JP2000124644 A JP 2000124644A
- Authority
- JP
- Japan
- Prior art keywords
- conductive frame
- mounting board
- circuit module
- heat transfer
- module device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】
【課題】放熱効率の高いカード型回路モジュール装置、
およびこれに使用する実装基板の提供を目的とする。
【解決手段】発熱素子１を含む回路素子が実装され、所
定の回路モジュールを構成する実装基板２を、該実装基
板２を囲繞する導電性フレーム３に止着してなるカード
型回路モジュール装置であって、前記実装基板２の導電
性フレーム３との接触部には、実装基板２の導電性フレ
ーム３への止着子挿通部４の内壁に形成される導電層５
を経由して内層グランド層６に接続されるグランドラン
ド７が形成され、内層グランド層６を経由して導電性フ
レーム３に伝熱する伝熱パスを形成する。
(57) [Abstract] [Problem] A card type circuit module device having high heat radiation efficiency,
And a mounting board used for the same. A card-type circuit module device in which a circuit element including a heating element is mounted and a mounting substrate constituting a predetermined circuit module is fixed to a conductive frame surrounding the mounting substrate. A conductive layer 5 formed on the inner wall of the fastener insertion portion 4 of the mounting substrate 2 to the conductive frame 3 is provided at a contact portion of the mounting substrate 2 with the conductive frame 3.
, A ground land 7 connected to the inner ground layer 6 is formed, and a heat transfer path for transferring heat to the conductive frame 3 via the inner ground layer 6 is formed.
Description
【０００１】[0001]
【発明の属する技術分野】本発明はカード型回路モジュ
ール装置、およびこれに使用する実装基板に関するもの
である。[0001] 1. Field of the Invention [0002] The present invention relates to a card type circuit module device and a mounting board used for the same.
【０００２】[0002]
【従来の技術】近年、ＣＰＵを使用した各種制御機器を
製造するに当たり、ＣＰＵ回りの基本回路を予め組み込
んだカード型回路モジュール装置が多用される。このカ
ード型回路モジュール装置は、ＣＰＵ等の高発熱素子を
搭載した実装基板を導電性フレームに固定してカード形
状に形成されるもので、ユーザシステム側のメインボー
ドに搭載されたコネクタにプラグインして使用される。2. Description of the Related Art In recent years, in manufacturing various control devices using a CPU, a card-type circuit module device in which a basic circuit around the CPU is preliminarily incorporated is often used. This card-type circuit module device is formed in a card shape by fixing a mounting board on which a high heat-generating element such as a CPU is mounted to a conductive frame, and is plugged into a connector mounted on a main board on a user system side. Used as
【０００３】図５は例えばカードＣＰＵ、あるいはカー
ドプロセッサと呼ばれるこのようなカード型回路モジュ
ール装置の従来例を示すもので、ＣＰＵ等の発熱素子１
を搭載した実装基板２を導電性フレーム３に固定して形
成される。発熱素子１には導電性フレーム３から突設さ
れるカバー片３ａが接触しており、発熱素子１からの発
熱はカバー片３ａに伝熱された後、該導電性フレーム３
から放熱される。なお、図５において１２はメインボー
ド（図示せず）接続用のコネクタを示す。FIG. 5 shows a conventional example of such a card-type circuit module device called, for example, a card CPU or a card processor.
Is mounted on the conductive frame 3 to fix the mounting substrate 2 on which is mounted. The heating element 1 is in contact with a cover piece 3a projecting from the conductive frame 3, and the heat generated from the heating element 1 is transferred to the cover piece 3a, and then the conductive frame 3
The heat is dissipated from In FIG. 5, reference numeral 12 denotes a connector for connecting a main board (not shown).
【０００４】[0004]
【発明が解決しようとする課題】しかし、上記従来例
は、発熱素子１からの伝熱パスがカバー片３ａを経由す
るものだけであるために、放熱効率が低いという欠点が
ある。However, the above-mentioned prior art has a drawback that the heat radiation efficiency is low because the heat transfer path from the heating element 1 passes only through the cover piece 3a.
【０００５】本発明は、以上の欠点を解消すべくなされ
たものであって、放熱効率の高いカード型回路モジュー
ル装置、およびこれに使用する実装基板の提供を目的と
する。An object of the present invention is to solve the above-mentioned drawbacks, and an object of the present invention is to provide a card-type circuit module device having high heat radiation efficiency and a mounting board used for the same.
【０００６】[0006]
【課題を解決するための手段】本発明によれば上記目的
は、発熱素子１を含む回路素子が実装され、所定の回路
モジュールを構成する実装基板２を、該実装基板２を囲
繞する導電性フレーム３に止着してなるカード型回路モ
ジュール装置であって、前記実装基板２の導電性フレー
ム３との接触部には、実装基板２の導電性フレーム３へ
の止着子挿通部４の内壁に形成される導電層５を経由し
て内層グランド層６に接続されるグランドランド７が形
成され、内層グランド層６を経由して導電性フレーム３
に伝熱する伝熱パスを形成したカード型回路モジュール
装置を提供することにより達成される。According to the present invention, an object of the present invention is to provide a circuit board including a heating element 1 mounted thereon and forming a mounting board 2 constituting a predetermined circuit module by a conductive board surrounding the mounting board 2. A card type circuit module device fixed to a frame 3, wherein a contact portion of the mounting substrate 2 with the conductive frame 3 is provided with a fastener insertion portion 4 of the mounting substrate 2 to the conductive frame 3. A ground land 7 connected to the inner layer ground layer 6 via the conductive layer 5 formed on the inner wall is formed, and the conductive frame 3 is connected via the inner layer ground layer 6.
This is achieved by providing a card-type circuit module device having a heat transfer path for transferring heat to the card.
【０００７】ＣＰＵ等の発熱素子１が実装された実装基
板２は内層グランド層６を有する多層基板で、止着子挿
通部４を挿通する止着子１０を使用して導電性フレーム
３に固定される。止着子挿通部４は実装基板２の表裏に
貫通する小孔でも、また、実装基板２の辺縁に形成され
る切欠でもよく、内層グランド層６は上記止着子挿通部
４の内壁面に形成される導電層５を経由して実装基板２
の表層に引き出され、グランドランド７に接続される。
グランドランド７は実装基板２を導電性フレーム３に止
着した状態で導電性フレーム３に接触する。The mounting substrate 2 on which the heating element 1 such as a CPU is mounted is a multi-layer substrate having an inner ground layer 6 and is fixed to the conductive frame 3 by using a fastener 10 for inserting the fastener insertion portion 4. Is done. The stationary member insertion portion 4 may be a small hole penetrating through the front and back of the mounting substrate 2 or a notch formed at an edge of the mounting substrate 2. The inner layer ground layer 6 is formed on the inner wall surface of the stationary member insertion portion 4. Mounting board 2 via conductive layer 5 formed on
And is connected to the ground land 7.
The ground land 7 contacts the conductive frame 3 with the mounting substrate 2 fixed to the conductive frame 3.
【０００８】本発明によれば、内層グランド層６を経由
してグランドランド７−導電性フレーム３に至る新たな
導電パスが形成されるために、放熱効率が向上する。ま
た、グランドランド７と内層グランド層６との連結に止
着子挿通部４の内壁面を利用するために、一般のスルー
ビアに比して断面積が大きく、伝熱性が良好な上に、実
装基板２の実装面にスルービアを設ける必要がなくな
り、実装効率を向上させることができる。さらに、実装
基板２は内層グランド層６を有するために電波ノイズに
対する耐性が向上する。According to the present invention, a new conductive path extending from the inner ground layer 6 to the ground land 7 and the conductive frame 3 is formed, so that the heat radiation efficiency is improved. Further, since the inner wall surface of the fastener insertion portion 4 is used to connect the ground land 7 and the inner-layer ground layer 6, the cross-sectional area is larger than that of a general through via, the heat conductivity is good, and the mounting is performed. There is no need to provide through vias on the mounting surface of the substrate 2, and mounting efficiency can be improved. Furthermore, since the mounting substrate 2 has the inner ground layer 6, the resistance to radio noise is improved.
【０００９】請求項２に係る発明において、グランドラ
ンド７には金属製の膨隆部８が形成され、導電性フレー
ム３と実装基板２は膨隆部８を介して接触する。膨隆部
８を設けることにより、例えば実装基板２に反りが生じ
ていてもグランドランド７と導電性フレーム３を確実に
接触させることが可能となるために、伝熱性が向上し、
かつ、回路の信頼性も向上する。According to the second aspect of the present invention, a metal bulge 8 is formed on the ground land 7, and the conductive frame 3 and the mounting board 2 are in contact with each other via the bulge 8. By providing the bulging portion 8, for example, even if the mounting substrate 2 is warped, the ground land 7 and the conductive frame 3 can be surely brought into contact with each other.
In addition, the reliability of the circuit is improved.
【００１０】請求項３に係る発明において、カード型回
路モジュール装置は発熱素子１の実装面に対して反対面
を覆う伝熱カバー９を有し、伝熱カバー９は実装基板２
を導電性フレーム３に固定する止着子１０により導電性
フレーム３に共締めされる。According to the third aspect of the present invention, the card type circuit module device has a heat transfer cover 9 for covering the surface opposite to the mounting surface of the heating element 1, and the heat transfer cover 9 is mounted on the mounting board 2.
Are fixed together to the conductive frame 3 by a fixing member 10 for fixing the same to the conductive frame 3.
【００１１】本発明によれば、導電性フレーム３に伝熱
カバー９が熱的に連結されるために、放熱面がより大き
くなり、放熱効率が向上する。According to the present invention, since the heat transfer cover 9 is thermally connected to the conductive frame 3, the heat dissipation surface becomes larger and the heat dissipation efficiency is improved.
【００１２】また、請求項４に係る発明のように、実装
基板２の伝熱カバー９により覆われる面に発熱素子１を
実装し、該発熱素子１の放熱面を伝熱体１１を介して伝
熱カバー９に接触させるように構成すると、実装基板２
の表裏に発熱素子１を実装することができるために、実
装効率が向上する。Further, as in the invention according to claim 4, the heating element 1 is mounted on the surface of the mounting substrate 2 covered by the heat transfer cover 9, and the heat radiating surface of the heating element 1 is interposed via the heat transfer body 11. When configured to contact the heat transfer cover 9, the mounting substrate 2
The mounting efficiency can be improved because the heating element 1 can be mounted on both sides.
【００１３】請求項５に係る発明は、発熱素子１を含む
回路素子が実装され、止着子挿通部４を挿通する止着子
１０により導電性フレーム３に固定されるカード型回路
モジュール装置に使用する実装基板２であって、前記止
着子挿通部４の周縁には該止着子挿通部４の内壁に形成
された導電層５を介して内層グランド層６に接続される
グランドランド７が表裏面に形成され、かつ、グランド
ランド７には、金属製の膨隆部８が形成されるカード型
回路モジュール装置に使用する実装基板である。According to a fifth aspect of the present invention, there is provided a card type circuit module device on which a circuit element including the heating element 1 is mounted and which is fixed to the conductive frame 3 by a fastener 10 inserted through the fastener insertion portion 4. A mounting substrate 2 to be used, and a ground land 7 connected to an inner-layer ground layer 6 via a conductive layer 5 formed on an inner wall of the fastener insertion portion 4 on a periphery of the fastener insertion portion 4. Is a mounting substrate used for a card type circuit module device in which metal bulges 8 are formed on the ground lands 7 on the front and back surfaces.
【００１４】本発明に係る実装基板２を導電性フレーム
３に固定すると、実装基板２上の発熱素子１の放熱ルー
トが増加するために、発熱素子１の冷却効率が向上す
る。When the mounting board 2 according to the present invention is fixed to the conductive frame 3, the heat dissipation route of the heating element 1 on the mounting board 2 is increased, so that the cooling efficiency of the heating element 1 is improved.
【００１５】[0015]
【発明の実施の形態】図１〜３に本発明の実施の形態を
示す。図示のカード型半導体装置は、ＰＣＭＣＩＡカー
ドとほぼ同一、あるいはそれよりやや大きなカードＣＰ
Ｕ、あるいはカードプロセッサであり、ＣＰＵ、および
その周辺回路部品を実装した実装基板２と、実装基板２
を固定するための導電性フレーム３と伝熱カバー９とか
ら構成される。1 to 3 show an embodiment of the present invention. The illustrated card type semiconductor device has a card CP substantially the same as or slightly larger than a PCMCIA card.
U or a card processor, a mounting board 2 on which a CPU and its peripheral circuit parts are mounted, and a mounting board 2
And a heat transfer cover 9 for fixing the conductive frame 3.
【００１６】導電性フレーム３はアルミニウム等の伝熱
性を有し、かつ、導電性を有する材料により形成され、
矩形枠部３ｂに形成した段部３ｃで実装基板２を保持す
る。また、導電性フレーム３には実装基板２上のＣＰＵ
（発熱素子１）の天井面に伝熱体１１を介して接触する
カバー片３ａが設けられ、さらにカバー片３ａの基端部
には複数の放熱フィン３ｄ、３ｄ・・が形成されて放熱
性能を向上させている。The conductive frame 3 is formed of a material having heat conductivity such as aluminum and having conductivity.
The mounting board 2 is held by the step 3c formed in the rectangular frame 3b. The conductive frame 3 has a CPU on the mounting board 2.
A cover piece 3a that is in contact with the ceiling surface of the (heating element 1) via the heat transfer body 11 is provided, and a plurality of radiating fins 3d, 3d,. Has been improved.
【００１７】図３に示すように、実装基板２は内層グラ
ンド層６、および必要に応じて内層配線パターン層を有
する多層両面基板であり、実装面にはＣＰＵ１、画像処
理チップ（発熱素子１’）、およびその周辺回路（図示
せず）が実装される。実装基板２のＣＰＵ実装面（以
下、便宜上ＣＰＵ実装面を「表面」、その反対面を「裏
面」という）には内部コネクタ２ａが搭載されるととも
に、対向する辺縁にはメインボード（図示せず）への接
続用のコネクタ１２が固定され、各々実装基板２上に構
成される回路網に接続される。内部コネクタ２ａにはサ
ブ基板１３が接続され、該サブ基板１３に固定されたサ
ブコネクタ１３ａに例えばメモリカード１４等をプラグ
インすることにより回路の拡張を行うことができる。As shown in FIG. 3, the mounting substrate 2 is a multilayer double-sided substrate having an inner ground layer 6 and, if necessary, an inner wiring pattern layer. The mounting surface includes a CPU 1 and an image processing chip (heating element 1 ′). ) And its peripheral circuits (not shown). The internal connector 2a is mounted on the CPU mounting surface of the mounting substrate 2 (hereinafter, for convenience, the CPU mounting surface is referred to as “front surface” and the opposite surface is referred to as “back surface”), and a main board (shown in FIG. 2) are fixed and connected to a circuit network formed on the mounting board 2, respectively. A sub-board 13 is connected to the internal connector 2a, and the circuit can be expanded by plugging, for example, a memory card 14 or the like into the sub-connector 13a fixed to the sub-board 13.
【００１８】図１に示すように、実装基板２の辺縁には
切欠状の止着子挿通部４が形成される。また、実装基板
２の表裏面には止着子挿通部４を囲むようにグランドラ
ンド７がパターン形成され、切欠の内壁に形成された導
電層５を介して内層グランド層６に接続される（図３
（ｂ）参照）。上記グランドランド７には止着子挿通部
４を囲むように馬蹄形の膨隆部８が形成される。膨隆部
８はソルダレジストを削除し、はんだを盛ることにより
簡単に形成することができる。As shown in FIG. 1, a notch-shaped fastener insertion portion 4 is formed on the periphery of the mounting substrate 2. Ground lands 7 are patterned on the front and back surfaces of the mounting substrate 2 so as to surround the fastener insertion portions 4, and are connected to the inner ground layer 6 via the conductive layers 5 formed on the inner walls of the cutouts ( FIG.
(B)). A horseshoe-shaped bulging portion 8 is formed in the ground land 7 so as to surround the fastener insertion portion 4. The bulge 8 can be easily formed by removing the solder resist and laying solder.
【００１９】伝熱カバー９はステンレス薄板等の伝熱性
を有する材料により形成され、辺縁部に形成された固定
部９ａにおいて導電性フレーム３に固定されて実装基板
２の裏面全面を覆う。固定部９ａは実装基板２のグラン
ドランド７に対応する凹み部９ｂの辺縁を切り欠いて形
成され、後述するように止着子１０を使用して導電性フ
レーム３に固定した際に止着子１０の頭部１０ａは凹み
部９ｂに収容され、表面からの突出が防止される（図３
（ｂ）参照）。この伝熱カバー９には伝熱シート（伝熱
体１１）が貼り付けられ、実装基板２の裏面に実装され
る発熱素子１’である画像処理チップの表面に接触す
る。The heat transfer cover 9 is formed of a heat conductive material such as a stainless steel thin plate, and is fixed to the conductive frame 3 at a fixing portion 9a formed at the peripheral portion to cover the entire back surface of the mounting substrate 2. The fixing portion 9a is formed by cutting out the edge of the concave portion 9b corresponding to the ground land 7 of the mounting board 2, and is fixed when the fixing portion 9a is fixed to the conductive frame 3 using the fixing member 10 as described later. The head 10a of the child 10 is housed in the recess 9b, and is prevented from protruding from the surface (FIG. 3).
(B)). A heat transfer sheet (heat transfer body 11) is attached to the heat transfer cover 9, and comes into contact with the surface of an image processing chip which is a heating element 1 ′ mounted on the back surface of the mounting board 2.
【００２０】カード型回路モジュール装置の組み立てに
際し、まず、実装基板２の辺縁部を導電性フレーム３の
矩形枠部３ｂの段部３ｃに載置した後、伝熱カバー９を
積層し、止着子１０を伝熱カバー９の固定部９ａ、およ
び実装基板２の止着子挿通部４に挿通させて導電性フレ
ーム３の段部３ｃに形成したねじ孔３ｅにねじ込む。図
３（ｂ）に示すように、実装基板２および伝熱カバー９
を導電性フレーム３に固定した状態で実装基板２の表裏
面に形成された膨隆部８は伝熱カバー９と導電性フレー
ム３に接触する。In assembling the card type circuit module device, first, the edge of the mounting substrate 2 is placed on the step 3c of the rectangular frame portion 3b of the conductive frame 3, and then the heat transfer cover 9 is laminated and stopped. The armature 10 is inserted into the fixing portion 9 a of the heat transfer cover 9 and the fixing member insertion portion 4 of the mounting board 2 and screwed into the screw hole 3 e formed in the step 3 c of the conductive frame 3. As shown in FIG. 3B, the mounting substrate 2 and the heat transfer cover 9
The bulges 8 formed on the front and back surfaces of the mounting board 2 are in contact with the heat transfer cover 9 and the conductive frame 3 in a state where is fixed to the conductive frame 3.
【００２１】回路の作動状態で実装基板２の表面側に実
装されるＣＰＵ１が発熱すると、該ＣＰＵ１での発熱の
一部は表面に接触する伝熱体１１を経由して導電性フレ
ーム３のカバー片３ａに伝えられるとともに、一部はＣ
ＰＵ１を実装基板２に接続するためのリード、あるいは
バンプを経由して内層グランド層６に伝達された後、導
電性フレーム３に伝達され、その後、導電性フレーム
３、および伝熱カバー９から放熱される。When the CPU 1 mounted on the front side of the mounting board 2 generates heat in the operation state of the circuit, a part of the heat generated by the CPU 1 is transferred to the cover of the conductive frame 3 via the heat transfer body 11 contacting the surface. It is transmitted to the piece 3a, and a part is C
After being transmitted to the inner ground layer 6 via a lead or a bump for connecting the PU 1 to the mounting board 2, the PU 1 is transmitted to the conductive frame 3, and then radiated from the conductive frame 3 and the heat transfer cover 9. Is done.
【００２２】一方、実装基板２の裏面に実装される画像
処理チップ１’での発熱の一部は内層グランド層６を経
由して導電性フレーム３に伝達されるとともに、一部は
伝熱体１１を経由して伝熱カバー９に伝達され、導電性
フレーム３、および伝熱カバー９から放熱される。On the other hand, part of the heat generated by the image processing chip 1 ′ mounted on the back surface of the mounting substrate 2 is transmitted to the conductive frame 3 via the inner ground layer 6, and part of the heat is Heat is transmitted to the heat transfer cover 9 via the heat transfer cover 11 and is radiated from the conductive frame 3 and the heat transfer cover 9.
【００２３】したがってこの実施によれば、発熱素子
１、１’の伝熱パスが増加するために、冷却効率が向上
する。また、裏面に伝導性フレーム、および実装基板２
の内層グランド層６に熱的に連結される伝熱カバー９を
配置したので、実装基板２の裏面にも発熱素子１を実装
することができるために、実装効率が向上する。Therefore, according to this embodiment, since the number of heat transfer paths of the heating elements 1 and 1 'is increased, the cooling efficiency is improved. Also, a conductive frame and a mounting board 2
Since the heat transfer cover 9 that is thermally connected to the inner ground layer 6 is disposed, the heating element 1 can be mounted also on the back surface of the mounting board 2, thereby improving the mounting efficiency.
【００２４】[0024]
【発明の効果】以上の説明から明らかなように、本発明
によれば、内層グランド層を伝熱パスとして利用できる
ために、放熱効率が向上する。As is apparent from the above description, according to the present invention, since the inner ground layer can be used as a heat transfer path, the heat radiation efficiency is improved.
【図１】本発明の要部を示す図で、（ａ）は分解斜視
図、（ｂ）は実装基板の斜視図である。FIGS. 1A and 1B are views showing main parts of the present invention, wherein FIG. 1A is an exploded perspective view and FIG. 1B is a perspective view of a mounting board.
【図２】本発明によるカード型回路モジュール装置を表
面から見た斜視図、（ｂ）は裏面斜視図である。FIG. 2 is a perspective view of the card-type circuit module device according to the present invention as viewed from the front, and FIG.
【図３】図２の断面図で、（ａ）は図２（ａ）の３Ａ−
３Ａ線断面図、（ｂ）は図２（ｂ）の３Ｂ−３Ｂ線断面
図である。3A is a cross-sectional view of FIG. 2, where FIG.
FIG. 3B is a sectional view taken along line 3A, and FIG. 2B is a sectional view taken along line 3B-3B in FIG.
【図４】伝熱カバーの斜視図である。FIG. 4 is a perspective view of a heat transfer cover.
【図５】従来例を示す断面図である。FIG. 5 is a sectional view showing a conventional example.
１、１’ 発熱素子 ２ 実装基板 ３ 導電性フレーム ４ 止着子挿通部 ５ 導電層 ６ 内層グランド層 ７ グランドランド ８ 膨隆部 ９ 伝熱カバー １０ 止着子 １１ 伝熱体 DESCRIPTION OF SYMBOLS 1, 1 'Heating element 2 Mounting board 3 Conductive frame 4 Fixture insertion part 5 Conductive layer 6 Inner ground layer 7 Ground land 8 Rising part 9 Heat transfer cover 10 Fixture 11 Heat transfer body
Claims (5)
の回路モジュールを構成する実装基板を、該実装基板を
囲繞する導電性フレームに止着してなるカード型回路モ
ジュール装置であって、 前記実装基板の導電性フレームとの接触部には、実装基
板の導電性フレームへの止着子挿通部の内壁に形成され
る導電層を経由して内層グランド層に接続されるグラン
ドランドが形成され、 内層グランド層を経由して導電性フレームに伝熱する伝
熱パスを形成したカード型回路モジュール装置。1. A card type circuit module device comprising a circuit board including a heating element mounted thereon and a mounting board constituting a predetermined circuit module fixed to a conductive frame surrounding the mounting board. At a contact portion of the mounting board with the conductive frame, a ground land connected to an inner ground layer via a conductive layer formed on an inner wall of the fastener insertion portion to the conductive frame of the mounting board is formed. And a heat transfer path for transferring heat to the conductive frame via the inner ground layer.
形成され、導電性フレームと実装基板は膨隆部を介して
接触する請求項１記載のカード型回路モジュール装置。2. The card type circuit module device according to claim 1, wherein a metal bulge is formed on the ground land, and the conductive frame and the mounting board are in contact with each other via the bulge.
う伝熱カバーを有し、 前記伝熱カバーは前記実装基板を導電性フレームに固定
する止着子により導電性フレームに共締めされる請求項
１または２記載のカード型回路モジュール装置。3. A heat transfer cover for covering a surface opposite to a mounting surface of the heating element, wherein the heat transfer cover is fastened to the conductive frame together with a fastener for fixing the mounting board to the conductive frame. 3. The card-type circuit module device according to claim 1, wherein
面に発熱素子が実装され、該発熱素子の放熱面を伝熱体
を介して伝熱カバーに接触させる請求項３記載のカード
型回路モジュール装置。4. The card type circuit according to claim 3, wherein a heat generating element is mounted on a surface of the mounting board covered by the heat transfer cover, and a heat radiating surface of the heat generation element is brought into contact with the heat transfer cover via a heat transfer body. Module device.
子挿通部を挿通する止着子により導電性フレームに固定
されるカード型回路モジュール装置に使用する実装基板
であって、 前記止着子挿通部の周縁には該止着子挿通部の内壁に形
成された導電層を介して内層グランド層に接続されるグ
ランドランドが表裏面に形成され、 かつ、グランドランドには、金属製の膨隆部が形成され
るカード型回路モジュール装置に使用する実装基板。5. A mounting board for use in a card-type circuit module device on which a circuit element including a heating element is mounted and which is fixed to a conductive frame by a fastener inserted through a fastener insertion portion, Ground lands connected to the inner-layer ground layer via conductive layers formed on the inner wall of the stationary member insertion portion are formed on the front and back surfaces of the periphery of the armature insertion portion. A mounting substrate used in a card type circuit module device in which a bulge is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10288962A JP2000124644A (en) | 1998-10-12 | 1998-10-12 | Card type circuit module device and mounting board used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10288962A JP2000124644A (en) | 1998-10-12 | 1998-10-12 | Card type circuit module device and mounting board used therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000124644A true JP2000124644A (en) | 2000-04-28 |
Family
ID=17737062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10288962A Pending JP2000124644A (en) | 1998-10-12 | 1998-10-12 | Card type circuit module device and mounting board used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000124644A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100964055B1 (en) * | 2003-12-29 | 2010-06-16 | 두산인프라코어 주식회사 | Power terminal device of the switching module for current supply |
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| JPS59145045U (en) * | 1983-03-18 | 1984-09-28 | 三菱電機株式会社 | Transistor fixing device |
| JPS61188375U (en) * | 1985-05-15 | 1986-11-25 | ||
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100964055B1 (en) * | 2003-12-29 | 2010-06-16 | 두산인프라코어 주식회사 | Power terminal device of the switching module for current supply |
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