JP2000117898A - Heat-conductive sheet - Google Patents
Heat-conductive sheetInfo
- Publication number
- JP2000117898A JP2000117898A JP10288605A JP28860598A JP2000117898A JP 2000117898 A JP2000117898 A JP 2000117898A JP 10288605 A JP10288605 A JP 10288605A JP 28860598 A JP28860598 A JP 28860598A JP 2000117898 A JP2000117898 A JP 2000117898A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- silicone rubber
- rubber layer
- conductive filler
- base fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000835 fiber Substances 0.000 claims abstract description 53
- 239000004744 fabric Substances 0.000 claims abstract description 37
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 37
- 239000004945 silicone rubber Substances 0.000 claims abstract description 37
- 239000011231 conductive filler Substances 0.000 claims abstract description 32
- 238000010030 laminating Methods 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract description 9
- 239000002759 woven fabric Substances 0.000 abstract description 5
- 229920001296 polysiloxane Polymers 0.000 description 24
- 238000000034 method Methods 0.000 description 20
- 239000012779 reinforcing material Substances 0.000 description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- 238000012937 correction Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000003014 reinforcing effect Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000007606 doctor blade method Methods 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 239000004745 nonwoven fabric Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920002577 polybenzoxazole Polymers 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器から発生
する熱を放散させる熱伝導性シートに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat conductive sheet for dissipating heat generated from electronic equipment.
【０００２】[0002]
【従来の技術】最近、電子機器の高性能化、小型化にと
もなう高密度実装やＬＳＩの高集積化、高速化などによ
って、電子機器から発生する熱対策が非常に重要な課題
になっている。通常、発熱する素子の熱拡散用として、
熱源と放熱器の間や熱源と金属製伝熱板の間に、熱伝導
率の大きなシリコーングリスや柔軟性のある熱伝導性シ
リコーンゴム材料を接触熱抵抗を下げる目的で介在させ
ている。2. Description of the Related Art In recent years, measures against heat generated from electronic devices have become a very important issue due to high-density mounting and high integration and high speed of LSI accompanying high performance and miniaturization of electronic devices. . Normally, for heat diffusion of elements that generate heat,
Between the heat source and the radiator or between the heat source and the metal heat transfer plate, silicone grease having a high thermal conductivity or a flexible heat conductive silicone rubber material is interposed for the purpose of lowering the contact thermal resistance.
【０００３】また、大きさ、高さがそれぞれ異なる発熱
する素子が高密度で実装されるので、その様々な間隙を
埋めることが可能な熱伝導性材料が要求され、柔軟で形
状追随性のある熱伝導性シリコーンゴムシートが使用さ
れている。しかし、このような柔軟な熱伝導性シート
は、非常に柔らかく粘着性が著しくて取り扱いにくく、
また、強度が不十分なため被着する時に破れてしまうな
どの問題があった。Further, since heat-generating elements having different sizes and heights are mounted at a high density, a heat-conductive material capable of filling various gaps between them is required. A thermally conductive silicone rubber sheet is used. However, such a flexible heat conductive sheet is extremely soft and extremely sticky, and is difficult to handle.
In addition, there is a problem that the strength is insufficient and the film is broken at the time of application.
【０００４】従来、この熱伝導性シートの取り扱い性を
改良したシートおよびその製造法が提唱されている。特
開平６−１５５５１７号公報では、網目状補強材で補強
した熱伝導性シリコーンゴムの硬化物シートと、特定の
低硬度の熱伝導性シリコーンゴムシートを一体成形して
複合化する製造法が開示されている。一方、特開平７-
１４９５０号公報には、ガラス製、金属製、樹脂製の網
目状物、樹脂製フィルムおよび不織布から選ばれた１種
または２種以上の補強材で補強した特定硬度のシリコー
ン系放熱シートが開示されており、樹脂製の補強材とし
てポリイミドやポリエチレンテレフタレート等の耐熱性
樹脂製の網目状物、ポリイミドやポリエチレンテレフタ
レート等の耐熱性樹脂製フィルムおよびアラミド、ポリ
エステル等の不織布が好適とされている。さらに、特開
平７−２６６３５６号公報には、補強材として直径０．
３ｍｍ以上の孔を有する多孔性材に限定している。多孔
性補強材として、通常のガラスクロス、ポリエステル、
耐熱ナイロン、アクリル樹脂等からなる多孔性の樹脂フ
ィルム、ネット状フィルム、メッシュクロス等を挙げて
いる。Heretofore, there have been proposed sheets having improved heat handling properties and a method for producing the sheets. JP-A-6-155517 discloses a production method in which a cured sheet of a thermally conductive silicone rubber reinforced with a network reinforcing material and a specific low-hardness thermally conductive silicone rubber sheet are integrally molded to form a composite. Have been. On the other hand,
Japanese Patent No. 14950 discloses a silicone-based heat radiation sheet of a specific hardness reinforced with one or two or more types of reinforcing materials selected from glass, metal, resin meshes, resin films, and nonwoven fabrics. As the resin-made reinforcing material, a mesh made of a heat-resistant resin such as polyimide or polyethylene terephthalate, a film made of a heat-resistant resin such as polyimide or polyethylene terephthalate, and a nonwoven fabric such as aramid or polyester are considered to be suitable. Further, Japanese Patent Application Laid-Open No. 7-266356 discloses that a reinforcing material having a diameter of 0.
It is limited to a porous material having a hole of 3 mm or more. As a porous reinforcing material, ordinary glass cloth, polyester,
Examples include porous resin films made of heat-resistant nylon and acrylic resin, net-like films, mesh cloths, and the like.
【０００５】[0005]
【発明が解決しようとする課題】ところが、特開平６−
１５５５１７号の網目状補強材で補強した熱伝導性シリ
コーンゴムの硬化物シートと、特定の低硬度の熱伝導性
シリコーンゴムシートを一体成形して複合化する製造法
は、発熱する素子と放熱器の隙間への追従性が良く、網
目状補強材によって補強された層を含む取り扱いやすい
熱伝導性シートを得ることができるが、網目状補強材と
して従来から使用されているガラスクロスやセラミック
クロスあるいはナイロン、ポリエステル等の有機繊維の
布を使用するため補強効果はあるが、逆に熱伝導性と難
燃性に関しては低下させてしまう。また、あらかじめ補
強シートを準備してから低硬度の熱伝導性シリコーンゴ
ムシートを一体成形して複合化する製法は生産性が悪
い。SUMMARY OF THE INVENTION However, Japanese Patent Laid-Open No.
No. 155517, a method of integrally forming a cured sheet of a thermally conductive silicone rubber reinforced with a mesh-like reinforcing material and a specific low-hardness thermally conductive silicone rubber sheet to form a composite, comprises a heat-generating element and a radiator. Good followability to the gap of the, it is possible to obtain an easy-to-handle heat conductive sheet including a layer reinforced by a mesh reinforcing material, but glass cloth or ceramic cloth conventionally used as the mesh reinforcing material or The use of a cloth made of an organic fiber such as nylon or polyester has a reinforcing effect, but on the contrary, the thermal conductivity and the flame retardancy are reduced. Further, a method of preparing a reinforcing sheet in advance and then integrally molding a low-hardness thermally conductive silicone rubber sheet to form a composite has a low productivity.
【０００６】また、特開平７−１４９５０号の樹脂製の
網目状物やフィルム、不織布で補強した放熱シートは、
補強効果は認められるが、樹脂製補強材を複合化するこ
とにより熱伝導性と難燃性を低下させてしまう。同じ
く、特開平７−２６６３５６号の構成によっても、補強
効果は認められるが、熱伝導性と難燃性をやはり低下さ
せてしまう。したがって、これら従来の発明は、いずれ
も補強性の点に付いては改善されるが、熱伝導性および
難燃性を低下させてしまう。Further, a heat-dissipating sheet reinforced with a resin mesh or film or a non-woven fabric disclosed in Japanese Patent Application Laid-Open No.
Although a reinforcing effect is recognized, the heat conductivity and the flame retardancy are reduced by compounding the resin reinforcing material. Similarly, the structure disclosed in Japanese Patent Application Laid-Open No. Hei 7-266356 has a reinforcing effect, but also reduces the thermal conductivity and the flame retardancy. Therefore, all of these conventional inventions are improved in the point of reinforcement, but reduce heat conductivity and flame retardancy.
【０００７】[0007]
【課題を解決するための手段】そこで本発明は、高度の
熱伝導性と難燃性を有し、取り扱い性が良く発熱する素
子への形状追随性に優れる熱伝導性シートを提供するも
のである。そのために本発明は、耐熱性、強度、さらに
難燃性と熱伝導性に優れるポリベンザゾール繊維性の基
布を選択し、熱伝導性充填剤を含有するシリコーンゴム
層と組み合せて熱伝導性シートとした。SUMMARY OF THE INVENTION Accordingly, the present invention is to provide a heat conductive sheet having a high degree of heat conductivity and flame retardancy, good handleability, and excellent shape followability to a heat-generating element. is there. For this purpose, the present invention selects a polybenzazole fibrous base fabric excellent in heat resistance, strength, flame retardancy and heat conductivity, and combines it with a silicone rubber layer containing a heat conductive filler. Sheet.
【０００８】本発明で使用する熱伝導性充填剤として
は、熱伝導性が良い酸化アルミニウム、窒化ホウ素、窒
化アルミニウム、酸化亜鉛、炭化ケイ素、石英、水酸化
アルミニウムなどの金属酸化物、金属窒化物、金属炭化
物、金属水酸化物や、銀、銅、金、錫、鉄、アルミニウ
ム、マグネシウムなどの金属や合金から選ばれる少なく
とも１種の球状、粉状、繊維状、針状、鱗片状の熱伝導
性充填剤が挙げられる。なかでも、酸化アルミニウム、
窒化ホウ素、窒化アルミニウム、炭化ケイ素、水酸化ア
ルミニウムから選ばれる少なくとも１種の熱伝導性充填
剤が電気絶縁性に優れるので好ましい。The heat conductive filler used in the present invention includes metal oxides such as aluminum oxide, boron nitride, aluminum nitride, zinc oxide, silicon carbide, quartz, and aluminum hydroxide, and metal nitrides having good heat conductivity. At least one kind of spherical, powdery, fibrous, needle-like, or scaly heat selected from metals, metal carbides, metal hydroxides, and metals and alloys such as silver, copper, gold, tin, iron, aluminum, and magnesium. Conductive fillers. Among them, aluminum oxide,
At least one kind of thermally conductive filler selected from boron nitride, aluminum nitride, silicon carbide, and aluminum hydroxide is preferable because of its excellent electrical insulation.
【０００９】熱伝導性充填剤の配合量としては、熱伝導
性充填剤およびオルガノポリシロキサンの種類によって
も異なるけれども、オルガノポリシロキサン１００重量
部に対して、１００〜１０００重量部が好ましい。１０
０重量部より少ないと熱伝導率が小さく、１０００重量
部よりも多いとオルガノポリシロキサンへの充填性が劣
り、粘度が上昇して加工性が悪化するので不適である。
なお、熱伝導性充填剤の表面を公知のカップリング剤で
処理することによって分散性を向上することが可能であ
る。The amount of the heat conductive filler to be compounded varies depending on the type of the heat conductive filler and the organopolysiloxane, but is preferably 100 to 1000 parts by weight based on 100 parts by weight of the organopolysiloxane. 10
When the amount is less than 0 part by weight, the thermal conductivity is low, and when the amount is more than 1000 parts by weight, the filling property to the organopolysiloxane is inferior, the viscosity is increased, and the processability is deteriorated.
The dispersibility can be improved by treating the surface of the thermally conductive filler with a known coupling agent.
【００１０】本発明のベース材として使用するシリコー
ンゴムは、公知のオルガノポリシロキサンを硬化するこ
とによって得られる。硬化方法については限定するもの
ではなく、ビニル基を含むオルガノポリシロキサンとケ
イ素原子にハイドロジェン基を含むオルガノポリシロキ
サンと白金系触媒からなる付加反応タイプ、有機過酸化
物によるラジカル反応タイプ、縮合反応タイプ、紫外線
や電子線による硬化タイプなどが挙げられる。なかで
も、熱伝導性充填剤を充填しやすい液状の付加反応タイ
プのオルガノポリシロキサンを用いることが好ましい。
また、公知の補強用のシリカや難燃剤、着色剤、耐熱性
向上剤、接着助剤、粘着剤などを適宜配合することがで
きる。The silicone rubber used as the base material of the present invention can be obtained by curing a known organopolysiloxane. There is no limitation on the curing method, and an addition reaction type comprising an organopolysiloxane containing a vinyl group, an organopolysiloxane containing a hydrogen group on a silicon atom and a platinum catalyst, a radical reaction type using an organic peroxide, and a condensation reaction And a curing type using ultraviolet rays or electron beams. Among them, it is preferable to use a liquid addition reaction type organopolysiloxane that is easy to fill with a thermally conductive filler.
In addition, known reinforcing silica, a flame retardant, a coloring agent, a heat resistance improving agent, an adhesion aid, a pressure-sensitive adhesive, and the like can be appropriately compounded.
【００１１】本発明で使用するポリベンザゾール繊維製
の基布とは、ポリベンザゾール繊維で構成される織布や
不織布、クロス、抄紙、フェルト、ペ一パー、スクリム
等と称されるシート状物を意味するものである。また、
本発明のポリベンザゾール繊維とは、ポリベンザゾール
ポリマーより構成される繊維であり、ポリベンザゾール
（ＰＢＺ）とは、ポリベンゾオキサゾールホモポリマー
（ＰＢＯ）、ポリベンゾチアゾールホモポリマー（ＰＢ
Ｔ）およびそれらＰＢＯ、ＰＢＴのランダムコポリマ
ー、シーケンシャルコポリマー、ブロックコポリマーあ
るいはグラフトコポリマーを意味するものである。ポリ
ベンザゾール繊維の直径、断面形状、長さ、クロスの種
類、ヤーン数、織物を構成するフィラメント数および構
造や種類、スパンの構造および種類、開口率、不織布や
フェルトあるいは抄紙やペーパーの密度や厚み等ついて
は特定するものではない。The base fabric made of polybenzazole fiber used in the present invention is a woven or nonwoven fabric made of polybenzazole fiber, cloth, papermaking, felt, paper, scrim, etc. It means something. Also,
The polybenzazole fiber of the present invention is a fiber composed of a polybenzazole polymer, and the polybenzazole (PBZ) is a polybenzoxazole homopolymer (PBO), a polybenzothiazole homopolymer (PB
T) and their random copolymers, random copolymers, sequential copolymers, block copolymers or graft copolymers of PBO and PBT. Polybenzazole fiber diameter, cross-sectional shape, length, type of cloth, number of yarns, number and structure and type of filaments constituting woven fabric, structure and type of span, opening ratio, density of nonwoven fabric and felt or papermaking and paper The thickness and the like are not specified.
【００１２】しかし、ポリベンザゾール繊維としては引
張強度が４ＧＰａ以上でかつ初期引張弾性率が１４０Ｇ
Ｐａ以上を有することが好ましい。引張強度、初期引張
弾性率がこの範囲であるポリベンザゾール繊維を使用す
ることによって本発明の熱伝導性シートはよリ高い熱伝
導性を発現することができる。However, the polybenzazole fiber has a tensile strength of 4 GPa or more and an initial tensile modulus of 140 G
It is preferable to have Pa or more. By using a polybenzazole fiber having a tensile strength and an initial tensile modulus in this range, the heat conductive sheet of the present invention can exhibit higher heat conductivity.
【００１３】ポリベンザゾール繊維製の基布の厚みは、
０．０２〜８ｍｍのものが好ましい。０．０２ｍｍより
も薄いと十分な補強効果と熱伝導率が発現せす、８ｍｍ
よりも厚くなると剛性が増して素子への追随性が劣り、
かつ高価格になるので好ましくない。なお、ポリベンザ
ゾール繊維のほかの繊維として、少量の炭素繊維や金属
繊維、アラミド繊維やポリエステル繊維などの有機繊
維、天然繊維を混ぜた複合繊維ならぴにその基布を使用
しても差し支えない。The thickness of the base fabric made of polybenzazole fiber is
Those having a thickness of 0.02 to 8 mm are preferable. If it is thinner than 0.02 mm, a sufficient reinforcing effect and thermal conductivity are exhibited, 8 mm
If it is thicker, the rigidity will increase and the ability to follow the element will be poor,
In addition, it is not preferable because it is expensive. In addition, as a fiber other than the polybenzazole fiber, if a small amount of carbon fiber, metal fiber, organic fiber such as aramid fiber or polyester fiber, or a composite fiber obtained by mixing natural fibers, the base fabric can be used. .
【００１４】硬化後のシリコーンゴム層の硬度について
は特定するものではないけれども、アスカーＣ硬度で３
０以下の場合が柔軟性に優れ、高さが異なる発熱素子と
放熱器や筐体の隙間に対応しやすい。熱伝導性シートの
厚みは用途によって決定すれば良いけれども、通常は
０．２ｍｍ〜１０ｍｍの範囲が実用的である。Although the hardness of the cured silicone rubber layer is not specified, it may be 3 in Asker C hardness.
When the value is 0 or less, flexibility is excellent, and it is easy to cope with gaps between the heat generating elements having different heights, the radiator and the housing. The thickness of the heat conductive sheet may be determined depending on the use, but usually, the range of 0.2 mm to 10 mm is practical.
【００１５】[0015]
【発明の実施の形態】本発明の熱伝導性シートは、熱伝
導性充填剤を含有するシリコーンゴム層と、ポリベンザ
ゾール繊維製の基布からなることを特徴とし、熱伝導性
充填剤を含有するシリコーンゴム層とポリベンザゾール
繊維製の基布を複合化する構成で得られる。複合化する
構成としては、熱伝導性充填剤を含有するシリコーンゴ
ム層の少なくとも片面にポリベンザゾール繊維製の基布
を積層してなる構成、熱伝導性充填剤を含有するシリコ
ーンゴム層中にポリベンザゾール繊維製の基布を配置す
る構成が挙げられる。BEST MODE FOR CARRYING OUT THE INVENTION The heat conductive sheet of the present invention is characterized by comprising a silicone rubber layer containing a heat conductive filler and a base fabric made of polybenzazole fiber. It is obtained by a configuration in which the contained silicone rubber layer and the base fabric made of polybenzazole fiber are compounded. As a configuration to be complexed, a configuration in which a base fabric made of a polybenzazole fiber is laminated on at least one surface of a silicone rubber layer containing a thermally conductive filler, in the silicone rubber layer containing the thermally conductive filler A configuration in which a base fabric made of polybenzazole fiber is disposed is exemplified.
【００１６】シリコーンゴム層の少なくとも片面にポリ
ベンザゾール繊維製の基布を積層する方法としては、ポ
リベンザゾール繊維製の基布上に未硬化のシリコーンゴ
ム層を一定膜厚で積層してから硬化一体化する方法、硬
化後のシリコーンゴム層にポリベンザゾール繊維製の基
布を重ね合せる方法あるいは接着させる方法などが挙げ
られる。As a method of laminating a base fabric made of polybenzazole fiber on at least one side of the silicone rubber layer, a method of laminating an uncured silicone rubber layer with a certain film thickness on a base fabric made of polybenzazole fiber is used. Examples include a method of curing and integrating, a method of laminating a base fabric made of polybenzazole fiber on the silicone rubber layer after curing, and a method of bonding.
【００１７】ポリべンザゾール繊維製の基布をゴム層中
に配置する方法としては、熱伝導性充填剤を含有するシ
リコーンゴム層をバーコータ法やドクターブレード法、
Ｔダイによる押出成形法、カレンダー成形法などで製膜
した後に、ポリベンザゾール繊維製の基布を載せ、さら
にその積層シート上に再度、一定厚さの熱伝導性充填剤
を含有するシリコーンゴム層を製膜することによって製
造することができる。その際のシリコーンゴム層の加熱
条件や積層品の加圧条件については特定するものではな
く、片側の熱伝導性充填剤を含有するシリコーンゴム層
が末硬化であっても、途中まで硬化させてからでも完全
に硬化させてからでもかまわない。また、上下の熱伝導
性充填剤を含有するシリコーンゴム層は、同一の配合組
成でも異なる配合組成でも差し支えない。As a method for arranging a base fabric made of polybenzazole fiber in a rubber layer, a silicone rubber layer containing a thermally conductive filler is coated with a bar coater method, a doctor blade method, or the like.
After forming a film by an extrusion molding method or a calendar molding method using a T-die, a base fabric made of polybenzazole fiber is placed, and a silicone rubber containing a thermally conductive filler having a constant thickness is again placed on the laminated sheet. It can be manufactured by forming a layer. The heating conditions of the silicone rubber layer and the pressing conditions of the laminated product at that time are not specified, and even if the silicone rubber layer containing the heat conductive filler on one side is hard-cured, It does not matter if it is completely cured. The upper and lower silicone rubber layers containing the thermally conductive filler may have the same composition or different compositions.
【００１８】なお、ポリベンザゾール繊維製の基布とシ
リコーンゴム層との接着性を向上させるために、ポリベ
ンザゾール繊維の表面をあらかじめ脱脂や洗浄したり、
紫外線処理、コロナ放電処理、プラズマ処理、火炎処
理、カップリング剤処理などの方法で表面改質する方が
好ましい。In order to improve the adhesion between the base fabric made of polybenzazole fiber and the silicone rubber layer, the surface of the polybenzazole fiber is previously degreased or washed,
It is preferable that the surface is modified by a method such as ultraviolet treatment, corona discharge treatment, plasma treatment, flame treatment, and coupling agent treatment.
【００１９】[0019]
【実施例１】以下、実施例を挙げて本発明をさらに詳し
く説明する。本発明の熱伝導性シートの断面を図１に示
す。図１は、ポリベンザゾール繊維製のフィラメント織
布２を、熱伝導性充填剤として酸化アルミニウムを含有
するシリコーンゴム層１の片面に積層させた熱伝導性シ
ートの断面図である。[Embodiment 1] Hereinafter, the present invention will be described in more detail with reference to embodiments. FIG. 1 shows a cross section of the heat conductive sheet of the present invention. FIG. 1 is a cross-sectional view of a heat conductive sheet in which a filament woven fabric 2 made of polybenzazole fiber is laminated on one surface of a silicone rubber layer 1 containing aluminum oxide as a heat conductive filler.
【００２０】付加型の難燃性液状シリコーン１００重量
部（東レ・ダウコーニング・シリコーン株式会社製）に
対して、熱伝導性充填剤として、シランカップリング剤
（東芝シリコーン株式会社製ＴＳＬ−８１１２）で表面
処理した酸化アルミニウム粉末（昭和電工株式会社製ア
ルミナＡＳ−２０）４００重量部を充填して熱伝導性シ
リコーンコンパウンドを調製し、ドクターブレード法で
厚さ２．４ｍｍ、アスカーＣ硬度１７の熱伝導性シート
を作製した。その片面に、イソプロピルアルコールと純
水で脱脂洗浄して表面をコロナ放電処理した厚さ０．２
ｍｍのポリベンザゾールフィラメント織布（東洋紡績株
式会社製ザイロンＡＳ５３Ｃ 繊維の引張強度＝５．８
ＧＰａ、初期弾性率＝１８０ＧＰａ）２を積層して加圧
し加熱硬化して熱伝導性シートを作製した。A silane coupling agent (TSL-8112 manufactured by Toshiba Silicone Co., Ltd.) was used as a thermally conductive filler with respect to 100 parts by weight of an addition type flame retardant liquid silicone (manufactured by Dow Corning Toray Silicone Co., Ltd.). 400 parts by weight of aluminum oxide powder (Alumina AS-20, manufactured by Showa Denko KK) surface-treated to prepare a thermally conductive silicone compound, which is heated to 2.4 mm thick and Asker C hardness 17 by a doctor blade method. A conductive sheet was produced. One side is degreased and washed with isopropyl alcohol and pure water and the surface is subjected to corona discharge treatment.
mm polybenzazole filament woven cloth (Zylon AS53C fiber manufactured by Toyobo Co., Ltd .; tensile strength = 5.8)
GPa, initial elastic modulus = 180 GPa) 2 were laminated, pressurized and heat-cured to prepare a heat conductive sheet.
【００２１】[0021]
【実施例２】ポリペンザゾール繊維製の基布として、厚
さ０．５ｍｍのポリペンザゾール紡績糸織布（東洋紡績
株式会社製ザイロンＳＨＤ９６９７−２ 繊維の引張強
度＝５．８ＧＰａ、初期弾性率＝１８０ＧＰａ）を使用
した他は実施例１と同様に熱伝導性シートを作製した。Example 2 As a base cloth made of polypenzasol fiber, a 0.5 mm thick polypenzazol spun yarn woven cloth (Zylon SHD9697-2 fiber manufactured by Toyobo Co., Ltd., tensile strength = 5.8 GPa, initial elastic modulus = 180 GPa) was used. A heat conductive sheet was produced in the same manner as in Example 1 except that the heat conductive sheet was used.
【００２２】[0022]
【実施例３】熱伝導性充填剤として酸化アルミニウム粉
末を含有する付加型の熱伝導性液状シリコーンコンパウ
ンド（東芝シリコーン株式会社製）を使用し、ドクター
ブレード法によってシート状に展開して加熱硬化させ、
厚さ１．２ｍｍ、アスカーＣ硬度２７の熱伝導性シート
を作製した。その片面に、イソプロピルアルコールと純
水で脱脂洗浄してから表面を紫外線照射処理した実施例
１と同様の厚さ０．２ｍｍのポリベンザゾールフィラメ
ント織布を積層し加圧し、さらに難燃性熱伝導性液状シ
リコーンコンパウンド（東芝シリコーン株式会社製）を
厚さ１．２ｍｍで積層し加圧後、加熱硬化させて熱伝導
性シート(図２)を作製した。Example 3 An additional type heat-conductive liquid silicone compound (made by Toshiba Silicone Co., Ltd.) containing aluminum oxide powder was used as a heat-conductive filler, developed into a sheet by a doctor blade method, and heated and cured. ,
A heat conductive sheet having a thickness of 1.2 mm and an Asker C hardness of 27 was produced. On one surface thereof, a 0.2 mm-thick polybenzazole filament woven fabric similar to that of Example 1 in which the surface was degreased and washed with isopropyl alcohol and pure water and then subjected to ultraviolet irradiation treatment was laminated, pressed, and further subjected to flame-retardant heat. A conductive liquid silicone compound (manufactured by Toshiba Silicone Co., Ltd.) was laminated at a thickness of 1.2 mm, pressurized, and heated and cured to produce a heat conductive sheet (FIG. 2).
【００２３】[0023]
【実施例４】イソプロピルアルコー ルと純水で脱脂洗
浄してから表面を紫外線照射処理したポリベンザゾール
繊維からなる厚さ０．１ｍｍのぺ一パー状のシート（東
洋紡績株式会社製ザイロン耐熱ペーパー 繊維の引張強
度＝５．８ＧＰａ、初期弾性率＝１８０ＧＰａ）２の上
に、実施例１で調製した末硬化の熱伝導性シリコーンコ
ンパウンド１を、ドクターブレード法によって厚さ２．
４ｍｍで積層して加圧し、加熱硬化させることによって
熱伝導性シート(図３)を作製した。Example 4 A 0.1 mm thick sheet of paper made of polybenzazole fiber whose surface was subjected to ultraviolet light irradiation after degreased and washed with isopropyl alcohol and pure water (Zylon heat-resistant paper manufactured by Toyobo Co., Ltd.) The fiber-cured thermally conductive silicone compound 1 prepared in Example 1 was applied to a fiber having a tensile strength of 5.8 GPa and an initial elastic modulus of 180 GPa) 2 by a doctor blade method.
A heat conductive sheet (FIG. 3) was produced by laminating at 4 mm, pressing, and heat-curing.
【００２４】[0024]
【比較例１】実施例１と同様に熱伝導性充填剤として酸
化アルミニウム粉末を含有する付加型の難燃性熱伝導性
液状シリコーンコンパウンド（東芝シリコーン株式会社
製）をドクターブレード法によってシート状に展開して
加熱し硬化させ、厚さ２．４ｍｍ、アスカーＣ硬度２７
の熱伝導性シートを作製した。Comparative Example 1 In the same manner as in Example 1, an addition-type flame-retardant thermally conductive liquid silicone compound (manufactured by Toshiba Silicone Co., Ltd.) containing aluminum oxide powder as a thermally conductive filler was formed into a sheet by a doctor blade method. Expand, heat and cure, thickness 2.4mm, Asker C hardness 27
Was produced.
【００２５】[0025]
【比較例２】実施例１と同様に熱伝導性充填剤として酸
化アルミニウム粉末を含有する付加型の難燃性熱伝導性
液状シリコーンコンパウンド（東芝シリコーン株式会社
製）をドクターブレード法によってシート状に展開して
加熱硬化させ、厚さ１．２ｍｍ、アスカーＣ硬度２７の
熱伝導性シートを作製した。その片面に、補強材として
目開き１．５ｍｍのからみ織りの厚さ０．２ｍｍのポリ
エステルクロスを積層し、さらに難燃性熱伝導性液状シ
リコーンコンパウンド（東芝シリコーン株式会社製）を
厚さ１．２ｍｍで積層し、加熱硬化して熱伝導性電磁波
シールドシートを作製した。Comparative Example 2 An addition type flame-retardant thermally conductive liquid silicone compound (manufactured by Toshiba Silicone Co., Ltd.) containing aluminum oxide powder as a thermally conductive filler was formed into a sheet by a doctor blade method in the same manner as in Example 1. It was developed and heated and cured to produce a heat conductive sheet having a thickness of 1.2 mm and an Asker C hardness of 27. A polyester cloth having a mesh size of 1.5 mm and a thickness of 0.2 mm as a reinforcing material is laminated on one surface thereof, and a flame-retardant heat-conductive liquid silicone compound (manufactured by Toshiba Silicone Co., Ltd.) having a thickness of 1. The laminate was laminated at 2 mm and cured by heating to produce a heat conductive electromagnetic wave shielding sheet.
【００２６】[0026]
【比較例３】補強材として厚さ０．０７５ｍｍのポリイ
ミドフィルム（デュポンジャパン株式会社製カプトン）
を使用した他は比較例２と同様に熱伝導性シートを作製
した。Comparative Example 3 A polyimide film having a thickness of 0.075 mm (Kapton manufactured by DuPont Japan) as a reinforcing material
A heat conductive sheet was produced in the same manner as in Comparative Example 2 except that the above was used.
【００２７】得られた熱伝導性シートの熱伝導率は、迅
速熱伝導率計（京都電子工業株式会社製ＱＴＭ一５０
０）で測定した。難燃性はＵＬ９４の燃焼試験法で評価
した。取り扱い性と形状追随性は、高さが異なる半導体
素子を実装した基板の上部に得られた熱伝導性シートを
配置して放熱器と接触させ、取り扱い性が良好なものを
○、取り扱いにくいものを×、形状追随性が良好なもの
を○、追随性が劣るものを×とした。結果を表１（図
６）に記した。The thermal conductivity of the obtained thermal conductive sheet was measured with a rapid thermal conductivity meter (QTM-150 manufactured by Kyoto Electronics Industry Co., Ltd.).
0). Flame retardancy was evaluated by the UL94 combustion test method. The handleability and shape followability are as follows: Place the obtained heat conductive sheet on the top of the substrate on which the semiconductor elements with different heights are mounted and contact it with the radiator. Was rated as x, good shape followability was rated as good, and poor shape followability was rated as poor. The results are shown in Table 1 (FIG. 6).
【００２８】表１によれば、比較例１は、形状追随性は
良好であるけれども補強層がないので取り扱い性が悪
い。従来の改良技術である補強材を含む比較例２、比較
例３は、形状追随性にくわえて取り扱い性が良好である
けれども、熱伝導率と難燃性が劣っている。一方、本発
明の熱伝導性充填剤を含有するシリコーンゴム層とポリ
ベンザゾール繊維製の基布からなることを特徴とする実
施例１〜実施例４の熱伝導性シートは、使用時の取り扱
い性と形状追随性が優れ、かつ高い熱伝導率と難燃性を
有していることがわかる。According to Table 1, Comparative Example 1 has good shape followability, but has poor handling because of no reinforcing layer. In Comparative Examples 2 and 3 including a reinforcing material, which is a conventional improvement technique, although the handleability is good in addition to the shape following property, the thermal conductivity and the flame retardancy are inferior. On the other hand, the heat conductive sheets of Examples 1 to 4 characterized by comprising a silicone rubber layer containing the heat conductive filler of the present invention and a base fabric made of polybenzazole fiber, It can be seen that they have excellent properties and shape following properties, and have high thermal conductivity and flame retardancy.
【００２９】[0029]
【発明の効果】以上のように、本発明の熱伝導性シート
は、熱伝導性および難燃性が優れ、使用時の取り扱い
性、形状追随性も良好である。したがって、高密度実装
された高さが異なる電子機器と放熱器との間隙に被着で
きる形状追従性を兼ね備え、高度の放熱性および難燃性
を要求される熱伝導性シートとして非常に有用である。
また、本発明の熱伝導性シートを応用して、チューブ状
やキャップ状の成形品を提供することも可能である。As described above, the heat conductive sheet of the present invention has excellent heat conductivity and flame retardancy, and also has good handleability during use and conformability to shape. Therefore, it has a shape-following property that can be attached to the gap between the electronic device and the radiator, which are mounted at high density and have different heights, and is very useful as a heat conductive sheet that requires high heat dissipation and flame retardancy. is there.
Further, it is also possible to provide a tube-shaped or cap-shaped molded product by applying the heat conductive sheet of the present invention.
【図１】本発明の熱伝導性シートの例の断面を示すFIG. 1 shows a cross section of an example of a thermally conductive sheet of the present invention.
【図２】本発明の熱伝導性シートの例の断面を示すFIG. 2 shows a cross section of an example of the heat conductive sheet of the present invention.
【図３】本発明の熱伝導性シートの例の断面を示すFIG. 3 shows a cross section of an example of the heat conductive sheet of the present invention.
【図４】本発明の熱伝導性シートの例の断面を示すFIG. 4 shows a cross section of an example of the heat conductive sheet of the present invention.
【図５】発熱する素子と筐体の間隙に本発明の熱伝導性
シートを被着した例FIG. 5 shows an example in which the heat conductive sheet of the present invention is attached to the gap between the element that generates heat and the housing.
【図６】熱伝導率、取り扱い性、形状追随性の評価結果
を示す表FIG. 6 is a table showing evaluation results of thermal conductivity, handleability, and shape followability.
【符号の説明】 １ 熱伝導性充填剤として酸化アルミニウム粉末を含有
するシリコーンゴム層 ２ ポリベンザゾール繊維製の基布 ３ 本発明の熱伝導性シート ４ 放熱器 ５ プリント基板 ６ 発熱する素子[Description of Signs] 1 Silicone rubber layer containing aluminum oxide powder as thermal conductive filler 2 Base fabric made of polybenzazole fiber 3 Thermal conductive sheet of the present invention 4 Heat radiator 5 Printed circuit board 6 Element generating heat
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１０年１０月２７日（１９９８．１０．
２７）[Submission date] October 27, 1998 (1998.10.
27)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００７[Correction target item name] 0007
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００７】[0007]
【課題を解決するための手段】そこで本発明は、高度の
熱伝導性と難燃性を有し、取り扱い性が良く発熱する素
子への形状追随性に優れる熱伝導性シートを提供するも
のである。そのために本発明は、耐熱性、強度、さらに
難燃性と熱伝導性に優れるポリベンザゾール繊維製の基
布を選択し、熱伝導性充填剤を含有するシリコーンゴム
層と組み合せて熱伝導性シートとした。SUMMARY OF THE INVENTION Accordingly, the present invention is to provide a heat conductive sheet having a high degree of heat conductivity and flame retardancy, good handleability, and excellent shape followability to a heat-generating element. is there. For this purpose, the present invention selects a base fabric made of polybenzazole fiber which is excellent in heat resistance, strength, flame retardancy and heat conductivity, and combines it with a silicone rubber layer containing a heat conductive filler to achieve heat conductivity. Sheet.
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１３[Correction target item name] 0013
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１３】ポリベンザゾール繊維製の基布の厚みは、
０．０２〜８ｍｍのものが好ましい。０．０２ｍｍより
も薄いと十分な補強効果と熱伝導率が発現せず、８ｍｍ
よりも厚くなると剛性が増して素子への追随性が劣り、
かつ高価格になるので好ましくない。なお、ポリベンザ
ゾール繊維のほかの繊維として、少量の炭素繊維や金属
繊維、アラミド繊維やポリエステル繊維などの有機繊
維、天然繊維を混ぜた複合繊維ならびにその基布を使用
しても差し支えない。The thickness of the base fabric made of polybenzazole fiber is
Those having a thickness of 0.02 to 8 mm are preferable. If it is thinner than 0.02 mm, a sufficient reinforcing effect and thermal conductivity are not exhibited , and 8 mm
If it is thicker, the rigidity will increase and the ability to follow the element will be poor,
In addition, it is not preferable because it is expensive. As other fibers polybenzazole fibers, also be used a small amount of carbon fibers and metal fibers, organic fibers such as aramid fibers or polyester fibers, the base fabric fiber composite sequence obtained by mixing natural fibers no problem.
【手続補正３】[Procedure amendment 3]
【補正対象書類名】図面[Document name to be amended] Drawing
【補正対象項目名】図６[Correction target item name] Fig. 6
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【図６】 FIG. 6
フロントページの続き Ｆターム(参考） 4F100 AA19H AK52A AK80A AK80B AN02A BA02 CA23 CA23A DG11A DG11B EJ55 EJ67H GB41 GB43 JJ01A JJ10 JK12A YY00A 5F036 AA01 BB21 BD21 Continued on the front page F term (reference) 4F100 AA19H AK52A AK80A AK80B AN02A BA02 CA23 CA23A DG11A DG11B EJ55 EJ67H GB41 GB43 JJ01A JJ10 JK12A YY00A 5F036 AA01 BB21 BD21
Claims (4)
ム層とポリベンザゾール繊維製の基布からなる熱伝導性
シート。1. A heat conductive sheet comprising a silicone rubber layer containing a heat conductive filler and a base fabric made of polybenzazole fiber.
ム層の少なくともその片面に、ポリベンザゾール繊維製
の基布を積層してなる熱伝導性シート。2. A heat conductive sheet obtained by laminating a base fabric made of polybenzazole fiber on at least one surface of a silicone rubber layer containing a heat conductive filler.
ム層中に、ポリベンザゾール繊維製の基布を配置させた
ことを特徴とする熱伝導性シート。3. A heat conductive sheet, wherein a base fabric made of polybenzazole fiber is disposed in a silicone rubber layer containing a heat conductive filler.
硬度が３０以下である請求項１、２あるいは３に記載の
熱伝導性シート。4. Asker C of a cured silicone rubber layer
The heat conductive sheet according to claim 1, 2 or 3, having a hardness of 30 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10288605A JP2000117898A (en) | 1998-10-12 | 1998-10-12 | Heat-conductive sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10288605A JP2000117898A (en) | 1998-10-12 | 1998-10-12 | Heat-conductive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000117898A true JP2000117898A (en) | 2000-04-25 |
Family
ID=17732398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10288605A Pending JP2000117898A (en) | 1998-10-12 | 1998-10-12 | Heat-conductive sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000117898A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001081435A (en) * | 1999-09-09 | 2001-03-27 | Polymatech Co Ltd | Heat conducting adhesive and its production and electronic part |
| WO2010098028A1 (en) * | 2009-02-26 | 2010-09-02 | 日本電気株式会社 | Heat generation element cooling structure, heat generation element cooling device, electronic device provided with cooling device, and cooling device producing method |
| JP2010258008A (en) * | 2009-04-21 | 2010-11-11 | Sharp Corp | Electronic component module and manufacturing method of the same |
| JP2020157554A (en) * | 2019-03-26 | 2020-10-01 | 三菱電線工業株式会社 | Thermally conductive laminated structure and heat-dissipation structure using the same |
| CN111739856A (en) * | 2014-10-31 | 2020-10-02 | 迪睿合株式会社 | Thermally conductive sheet, manufacturing method of thermally conductive sheet, heat radiating member, and semiconductor device |
| CN112837842A (en) * | 2021-01-05 | 2021-05-25 | 商都中建金马冶金化工有限公司 | Electrode paste and preparation method thereof |
-
1998
- 1998-10-12 JP JP10288605A patent/JP2000117898A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001081435A (en) * | 1999-09-09 | 2001-03-27 | Polymatech Co Ltd | Heat conducting adhesive and its production and electronic part |
| WO2010098028A1 (en) * | 2009-02-26 | 2010-09-02 | 日本電気株式会社 | Heat generation element cooling structure, heat generation element cooling device, electronic device provided with cooling device, and cooling device producing method |
| JP5605355B2 (en) * | 2009-02-26 | 2014-10-15 | 日本電気株式会社 | Heating element cooling structure |
| JP2010258008A (en) * | 2009-04-21 | 2010-11-11 | Sharp Corp | Electronic component module and manufacturing method of the same |
| US8179678B2 (en) | 2009-04-21 | 2012-05-15 | Sharp Kabushiki Kaisha | Electronic component module |
| CN111739856A (en) * | 2014-10-31 | 2020-10-02 | 迪睿合株式会社 | Thermally conductive sheet, manufacturing method of thermally conductive sheet, heat radiating member, and semiconductor device |
| CN111739856B (en) * | 2014-10-31 | 2025-01-07 | 迪睿合株式会社 | Thermally conductive sheet, method for manufacturing thermally conductive sheet, heat dissipating component and semiconductor device |
| JP2020157554A (en) * | 2019-03-26 | 2020-10-01 | 三菱電線工業株式会社 | Thermally conductive laminated structure and heat-dissipation structure using the same |
| JP7282558B2 (en) | 2019-03-26 | 2023-05-29 | 三菱電線工業株式会社 | Thermally conductive laminated structure and heat dissipation structure using the same |
| CN112837842A (en) * | 2021-01-05 | 2021-05-25 | 商都中建金马冶金化工有限公司 | Electrode paste and preparation method thereof |
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