JP2000114009A - Resistor, its mounting method, and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly accurate resistor which is suitable for miniaturization, can be mounted suitably on a printed wiring board, and can be used suitably for detecting current and accurately with less variance, and methods for mounting and manufacturing the resistor. SOLUTION: A resistor is provided with a rolled and heat-treated platy resistance element section, and a plurality of connecting terminal sections composed of a high-conductivity metal which is hot-joined to the resistance element section, in such a way that the metal is rolled and heat-treated together with the section while the metal is laid upon the base material of the section. Since the resistor is kept in such a way that the resistor is stuck to a supporting plate, the resistor can be mounted on a printed wiring board by fixing the supporting plate to the wiring board and connecting the resistor to the wiring board through bonding wires. It is also possible to mount the resistor on the wiring board by aligning the connecting terminal sections with a circuit pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resistor suitable for mounting on a printed circuit board and suitable for detecting a current,
The present invention relates to a mounting method and a manufacturing method.

[0002]

2. Description of the Related Art It is well known to use a resistor (shunt resistor) having a very small resistance value (on the order of milliohms) for detecting a current, particularly for detecting a large current. In this method, a current drop is measured when a current flows through a resistor whose resistance value is stabilized with high precision, and the current value is obtained.

On the other hand, in this type of current detecting resistor, it is necessary to reduce the resistance value of the connection terminal portion of the resistor as much as possible in order to enable highly accurate measurement. It has also been proposed to mount this type of resistor on a printed wiring board. For this purpose, it is necessary to reduce the size of the resistor and make it a structure suitable for high-density mounting.

[0004] Japanese Patent No. 2564410 (Japanese Patent Laid-Open No. 6-22)
4014) includes a resistance alloy (CuMnNi alloy, etc.)
And two copper strips to the welding machine,
A method is disclosed in which a resistor is manufactured by welding the two members and cutting them in a transverse direction to a predetermined length. Here, electron beam welding, roller seam welding, continuous welding, seam welding, and the like have been proposed as welding methods.

It is also known that the surface (including the back surface and the front and back surfaces) of a portion to be a connection terminal of a resistance alloy is electroplated with a high conductivity metal, and this plated portion is used as a connection terminal.

[0006]

2. Description of the Related Art In the former method disclosed in Japanese Patent No. 2,564,410, it is difficult to reduce the size of a resistor because a plurality of metals are welded, and it is difficult to mount the resistor on a printed wiring board at high density. There was a problem of becoming. In addition, since there is a welding step, distortion and deformation due to welding are inevitable, and not only does the accuracy of the resistance value of the product vary greatly, but also it is difficult to obtain many products with stable accuracy.

In the latter method of performing electroplating, it is difficult to control the thickness of electroplating, and it has been difficult to stably produce high-precision resistors with good yield.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and is suitable for mounting on a printed wiring board suitable for miniaturization, and has high accuracy and small variation in accuracy. It is a first object to provide a resistor suitable as a resistor.

It is a second object of the present invention to provide a method of mounting this resistor. A third object is to provide a method for manufacturing this resistor.

[0010]

SUMMARY OF THE INVENTION According to the present invention, a first object is to provide a substantially plate-shaped resistance element portion which has been rolled and heat-treated, and which has been rolled and heat-treated together with the resistance element portion over the material of the resistance element portion. A plurality of connection terminals made of a high conductivity metal hot-bonded to the portion, a resistor,
Is achieved by

Here, the resistance element portion may be formed in a substantially long plate shape, and connection terminal portions may be provided along both end edges of one surface (including the back surface) or both end edges of both surfaces. The two connection terminal portions may be provided separately on both surfaces of different ends of the resistance element portion. The resistance element portion may be substantially U-shaped, and connection terminal portions may be provided along edges of both ends of one surface (including the back surface, the same applies hereinafter). Further, the resistance element portion and the connection terminal portion may be fitted with each other by a ridge and a groove and hot-joined.

The resistance element portion and the connection terminal portion can be bonded and fixed to a support plate having good thermal conductivity and an insulating surface. In this case, the support plate can be bonded and fixed to a printed wiring board or the like, and the circuit pattern on the substrate and the connection terminal can be connected by bonding wires. Here, the connection terminal portion is preferably provided on the surface opposite to the bonding surface of the resistance element portion to the support plate, but may be provided on both surfaces (front surface and back surface). The surface of the connection terminal portion is preferably plated with gold, silver, nickel or the like to improve the connectivity of the wire, the durability and the like.

The connection terminal portions are formed on both sides of the edge of the resistance element portion, and a plating layer is formed so as to cover the connection terminal portions on both surfaces and the end face of the resistance element portion therebetween, and are not covered with this plating layer. If the exposed surface of the resistance element portion is covered with an insulating layer, a resistor suitable for surface mounting can be obtained. In the case where the connection terminal portion is hot-joined by fitting a ridge and a groove to two opposite end surfaces of the resistance element portion, if the connection terminal portion is covered with a plating layer and the other is covered with an insulating layer, it is also used for surface mounting. Is obtained.

[0014] In the case where the resistance element portion has connection terminal portions at both ends, the intermediate portion of the resistance element portion can be bulged upwardly from the lower surfaces of both ends to be curved substantially in an arch shape. In this case, when both ends are mounted on the printed wiring board, an intermediate portion of the resistance element portion is separated from the printed wiring board.

The resistor element of the resistor can be made of a resistance alloy such as a copper / nickel alloy, a copper / manganese alloy, or a nickel / chromium alloy.
Copper, gold, silver, nickel, an alloy containing any one or more of these can be used. For example, a material in which a gold alloy is hot-bonded to the surface of a silver alloy base can be used for the connection terminal.

As a support plate for bonding a resistance element for wire bonding, a metal such as copper, aluminum, nickel or the like having good heat conductivity, or a ceramic such as aluminum nitride or alumina is suitable. When a metal is used as the support plate, an epoxy resin having good thermal conductivity and good insulation and excellent heat resistance on the surface (the surface to which the resistance element portion is bonded) is used.
A film of a polyimide resin is attached or applied to form an insulating layer.

The second object of the present invention can be achieved by adhering a support plate to which a resistance element portion is adhered to a circuit board and connecting them by bonding wires. For the same purpose, the connection terminals are positioned on the circuit pattern of the circuit board, the resistors are temporarily fixed with adhesive or cream solder, and then the board is passed through a molten solder bath for flow soldering, or the board is placed in a reflow oven. Through reflow soldering.

According to the present invention, a third object is a method of manufacturing a resistor in which a plurality of connection terminals made of a highly conductive metal are joined to the surface of a resistance element made of a substantially plate-shaped resistance alloy. (A) forming one or a plurality of substantially parallel grooves on the surface of a resistance material made of a resistance alloy, and (b) connecting a substantially strip-shaped high-conductivity metal having substantially the same cross section as the grooves. A terminal material is fitted into the groove, (c) the resistance material and the connection terminal material are joined by hot joining to form a joined body, and (d)
Rolling the joined body in the longitudinal direction of the groove and performing a heat treatment to form a rolled body, and (e) cutting out a resistor from the rolled body,
And a method for manufacturing a resistor.

Here, the resistor is cut out from the rolled body by cutting along an appropriate number of cutting lines parallel to the length direction (the direction parallel to the groove) and the width direction (the direction perpendicular to the groove) of the rolled body. By doing. When three or more grooves for hot-pressing the connection terminal material passing near the center in the width direction of the rolled connection terminal material are provided in parallel, the connection terminal material is cut along a lengthwise cutting line into a band shape. Can be cut with a cutting line in the width direction (the direction perpendicular to the groove) to produce a large number of resistors with high productivity.

When the resistor is cut out from the rolled body, the connection terminal material rolled on only one side is left, and a slit which penetrates the connection terminal material and enters the resistance material is formed so as to be substantially U-shaped. Resistor can be manufactured.
Moreover, when rolling the joined body in which the resistance material and the connection terminal material are fitted and hot-joined, a process of bending the resistance material into a substantially arch shape can be simultaneously performed. If the rolled body is cut along a cutting line that is substantially perpendicular to the arch, a resistor having an arched central portion can be easily formed.

A third object is also a method of manufacturing a resistor in which a plurality of connection terminals made of a high conductivity metal are connected to two opposing sides of a resistance element made of a substantially plate-shaped resistance alloy. And (a) forming ridges or grooves along two opposite end faces of a resistance material made of a resistance alloy, and (b) forming two connection terminal materials made of a substantially strip-shaped high conductivity metal. A groove or a ridge is fitted into the ridge or groove formed in the resistance material, and (c) the resistance material and the two connection terminal materials are joined to each other by hot joining to form a joined body. Rolling the joined body in the longitudinal direction and performing a heat treatment to form a rolled body, and (e) cutting the rolled body along a cutting line substantially orthogonal to the longitudinal direction to cut out a resistor. It can also be achieved by a method of manufacturing a resistor.

[0022]

FIG. 1 is a view showing one embodiment of a manufacturing process according to the present invention, FIG. 2 is an explanatory view of a joining step, FIG. 3 is an explanatory view of a rolling step, and FIG. 4 is an explanatory view of a cutting step.

As a connection terminal material serving as an electrode material, a gold alloy 10 and a silver alloy 12 are used as starting materials as shown in FIG. These gold alloy 10 and silver alloy 12 are cut into appropriate thicknesses and dimensions (material processing steps 14 and 1).
6). Then, the thinly cut gold alloy 10 is overlapped on the silver alloy 12 and hot-bonded (18). Here, the hot joining (18) is one of the solid-phase welding methods in which joining is performed by pressing at a high temperature in a solid state without melting the joint. The connection terminal material 20 thus joined and formed is processed into a shape having a cross section substantially identical to a groove 26 formed in the resistance material 24 described later (processing step 22).

On the other hand, a plate-shaped resistance material (base material) 24 serving as a resistance material has a thickness of 2 to 3 mm, and a plurality of parallel grooves 26 having a square cross section are formed on the surface thereof (groove processing step 2).
8). As shown in FIG. 2, the connection terminal material 20 described above is fitted and pressed into these grooves 26 (pressing step 30). Then, the connection terminal material 20 is joined to the groove 26 by hot joining to form a joined body 32 (hot joining step 34).

This hot bonding is performed by heating to a temperature of 700 to 800 ° C. in a reducing atmosphere such as hydrogen gas for a predetermined time. During this time, the two types of alloys that adhere to each other in the groove 26 diffuse into each other or from one to the other, so that the two alloys are securely joined. The joined body 32 is then passed between rolling rollers (not shown) of a rolling device and rolled to form a rolled body 36 (rolling process step 38). By this rolling, the temperature of the rolled body 36 becomes high. Therefore, appropriate temperature control is performed, and rolling is repeated while annealing (annealing step 40) (rolling step 42), and the annealing and rolling are repeated an appropriate number of times to achieve a target thickness, for example, 0.05 to 0.05 mm.
1.00 mm. FIG. 3 shows the rolled body 36 rolled to the final thickness.

By subjecting the rolled body 36 to a predetermined heat treatment, the joining between the raw materials 20 and 24 is stabilized, and the temporal change in the properties of the raw materials 20 and 24 after rolling is reduced, as described later. The accuracy and stability of the resistor can be improved (heat treatment step 44). A resistor 46 is cut out from the rolled body 36 of the heat-treated corner (cutting step 4).
8).

FIG. 4 shows an example of this cutting step. Here, five connection terminal materials 20 are joined and rolled to the rolling body 36. The rolled body 36 is first cut into a strip along a cutting line 50 parallel to the connection terminal material 20,
The strip 52 further passes through the vicinity of the center of the rolled connection terminal material 20 in the width direction and is substantially perpendicular to the strip 52.
4 cut. As a result, a large number of resistors 46 are obtained.

This resistor 46 has a substantially plate-shaped rolled resistance element portion 56 and hot-rolled and rolled connection terminal portions 58, 58 along two opposing sides of one surface thereof. . When the resistor 46 is mounted on a circuit board (printed wiring board), it is preferable to use a resistor 60 with a support plate as shown in FIGS.

FIG. 5 is an exploded view of the resistor 60 with a support plate, FIG. 6 is a perspective view of the resistor 60, and FIG. 7 is a sectional view showing an example of mounting the same. In these figures, reference numeral 62 denotes a support plate, which is obtained by cutting a plate having good heat conductivity into a slightly larger size than the resistor 46. As the support plate 62, a metal plate of copper, aluminum, nickel, or the like, or a ceramic plate of aluminum nitride, alumina, or the like is suitable.

The resistor 46 is bonded to the support plate 62 via an insulating film 64. At this time, the connection terminal 58 of the resistor 46 is exposed on the surface. Insulating film 64
Alternatively, a liquid resin may be used together with the insulating film 64. As the insulating film 64 or the liquid resin, those having good heat conductivity and insulation and excellent heat resistance are suitable, and for example, an epoxy-based film or resin, or a polyimide-based film or resin is preferable.

The resistor 60 with the support plate thus manufactured
Is adhered to the circuit board 66 as shown in FIG. The bonding terminal portions 58 are connected to the circuit patterns of the circuit board 66, that is, the pads 68, 68 by the bonding wires 70. Here, the wire 70 is connected to the resistor 6
When 0 is used as a shunt resistor, a large current flows. Therefore, a wire having a diameter as large as possible, for example, a thick aluminum wire or a thick gold wire, or a plurality of these wires is used for connection. The support plate 62 is made of copper foil 7 which is a part of the circuit pattern.
It is desirable to adhere to 2 using a solder 74 or a resin having good heat conductivity in terms of improving heat dissipation.

In the above-described embodiment, the rolled body 36 is cut along the cutting lines 50 and 54 in the cutting step 48. The cutting methods include known die punching, photoetching, electric discharge machining, laser machining, and dicing. A saw or the like can be used. Further, a V-cut groove may be machined along the cutting lines 50 and 54 and cut by bending.

FIG. 8 shows a configuration in which the outer periphery of the resistor 46 is punched out of the rolled body 36 by die punching, while a part of the outer periphery is left, and the connecting portion 76 can be cut by bending. FIG. 9 shows a case where a groove 78 having a depth in the thickness direction is formed along the cutting lines 50 and 54, and the groove 78 is bent and cut along the groove 78.

FIG. 10 is a diagram showing an example of a typical shape of a resistor cut out from a rolled body 36. As shown in FIG. FIG. 10A shows the resistor 46 shown in FIGS. 1 to 8 in which connection terminal portions 58 are formed at both ends of one surface of a long plate-shaped resistance element portion 56. The resistor 80 shown in FIG. 10B has a four-terminal structure. That is, the voltage detecting electrodes 82, 82 are formed integrally with the connection terminal 58 of the resistor 46.

A resistor 84 shown in FIG. 10C is cut out from the rolled body 36 into a substantially U-shape. That is, a strip 90 is cut out from the rolled body 36 so that the connection terminal material 88 remains only along one side edge of the resistance material 86, and a slit that enters the resistance material 86 from the connection terminal material 88 side into the strip 90. After forming the resistor 92, the resistor 84 is separated from the belt 90.

[0036]

Another Embodiment FIGS. 11 to 14 show another embodiment.
FIG. 11 is an exploded view of a joined body used in another embodiment, and FIG.
Is a perspective view of a strip obtained by cutting the rolled body into a strip and pasting an insulating film, FIG. 13 is a view showing an intermediate body of a resistor cut out from the strip, and FIG. 14 is a view showing a completed resistor. .

The joined body used in this embodiment is shown in FIG.
In this embodiment, grooves 26 are formed in parallel on both upper and lower surfaces of a resistance material (base material) 24, and terminal materials (electrode materials) 20 are press-fitted into the grooves 26 and hot-bonded. After rolling this joint, it is cut into a strip as shown in FIG. The band 36 has connection terminal portions 58 at the edges of both upper and lower surfaces along the longitudinal direction.

An insulating film 94 is laminated on the band 36 so as to cover the resistive element portion 56 exposed on both sides. This strip 36 is cut along a cutting line orthogonal to the longitudinal direction to produce a resistor intermediate body 96 shown in FIG. A plating layer 98 made of a conductive material such as copper is formed on both ends of the intermediate body 96 so that the resistor 100 shown in FIG.
Is completed.

FIG. 15 is a sectional view showing a state where the resistor 100 is mounted by a surface mounting method. In FIG. 15, reference numeral 102 denotes a wiring board (printed wiring board), on which a pad 1 for surface-mounting the resistor 100 is provided.
04 (circuit pattern) is formed. Pad 104
Is supplied with cream solder, the plating layer 98 of the resistor 100 is temporarily fixed to the cream solder, and the substrate 102 is put into a reflow furnace (heater). As a result, the cream solder melts and the resistor 100 is soldered to the pad 104. In the drawing, reference numeral 106 denotes solder solidified after melting (reflow) the cream solder once. Temporarily fix the resistor 100 with an adhesive in place of the cream solder.
The substrate may be passed through a molten solder bath with the surface temporarily fixed at the bottom, and flow soldering may be performed.

[0040]

[Other Embodiments] FIGS. 16 and 17 are views showing a mounting state of resistors 108 and 110 showing still another embodiment. These resistors 108 and 110 are obtained by curving the resistance element portion 56 of the resistor 46 and the resistor 100 upward in an arch shape. By changing the shape of the rolling roller used for the final rolling when forming the rolling body 36, these resistors 108 and 110 form convex strips between the connection terminal portions of the rolling body 36 in the rolling process. By leaving
Can be easily made.

According to the resistors 108 and 110, FIG.
As shown in FIGS. 6 and 17, when the surface mounting is performed on the circuit board 102, the resistance element portion 56 does not contact the circuit pattern on the surface of the substrate 102, and the density of the circuit pattern can be increased. Further, the cooling performance of the resistance element portion 56 is improved. Note that the resistor 108
Then, only the lower surface of the resistance element portion 56 or the connection terminal portion 5
It is preferable to coat the insulating resin film 112 on the entire outer surface except 8.

[0042]

FIG. 18 is a view showing a manufacturing process of another embodiment. In this embodiment, a long plate-shaped resistance element portion material (resistance material, base material) 24 and two connection terminal materials (terminal material, electrode material) 20 are fitted by a ridge 120 and a groove 122. It is hot-bonded.

That is, ridges 120, 120 are formed on two end faces along two sides in the longitudinal direction of the resistance material 24, and the terminal materials 20, 20 are formed on the ridges 120, 120, respectively.
The grooves 122, 122 formed in the above are fitted and press-fitted in the fitting direction (the direction of the arrow P shown in FIG. 18A) to perform hot joining. Thus, the joined body 124 shown in FIG. 18B is obtained.

The joined body 124 is rolled in the longitudinal direction to have a predetermined thickness as shown in FIG. This rolling body 126 is cut along a cutting line 1 substantially perpendicular to its longitudinal direction.
By cutting at 28, the resistor 130 shown in FIG. 18D can be obtained. In other words, the resistor 130 is obtained in which the resistor element portion 132 becomes the resistor element portion 132 and the connection terminal portions 134 are hot-joined to both ends thereof.

In this embodiment, the ridge 120 and the groove 122 are provided on the resistance material 24 and the terminal material 20, respectively. However, these may be reversed to form the ridge on the terminal material and the groove on the resistance material. Also, a plurality of ridges or grooves may be formed within the width of the thickness of the raw materials 20 and 24. The end faces of the two materials 20 and 24 may be formed stepwise or stepwise and may be hot-joined to each other, and the present invention includes such a case.

[0046]

According to the first aspect of the present invention, as described above, a substantially plate-shaped resistance element portion which has been rolled and heat-treated, and a plurality of hot-rolled and rolled and heat-treated together with this resistance element portion have been provided. Therefore, it is possible to obtain a resistor which is suitable for miniaturization, suitable for mounting on a printed wiring board, has high accuracy, and is suitable for current detection with small variation in accuracy.

Here, the resistance element portion is formed in a substantially long plate shape, and connection terminal portions are provided along both end edges of one surface thereof (claim 2). By adopting the shape provided with the portion, it can be adapted to the convenience of mounting (claim 3). Further, the connection terminal portion and the resistance element portion may be fitted with the ridge and the groove and hot-joined (claim 4).

In order to facilitate the mounting on the circuit board, it is preferable that the resistor is adhered and fixed to a support plate which also functions as a heat sink. In this case, the support plate may be fixed to the circuit board, and the connection terminals may be connected to the circuit pattern by bonding wires.

A connection terminal portion is provided along two opposing sides on both sides of the resistance element portion, and the end surfaces of these two sides and the connection terminal portion are covered with a plating layer, while the exposed surface of the resistance element portion is covered with an insulating layer. A covered structure is also possible (claim 6). In the case where the connection terminal portion is joined to the end face of the resistance element portion by a ridge and a groove, the connection terminal portion may be covered with plating and the other portions may be covered with an insulating layer. Further, the resistance element portion may be curved in a substantially arch shape. Providing these plating layers and insulating layers or bending them into an arch shape makes them suitable for surface mounting using a reflow method or the like.

An alloy of copper, nickel, manganese, chromium or the like which can provide a stable and minute resistance value can be used for the resistance element portion. Metals that can be combined and have low electrical resistance,
For example, copper, gold, silver, nickel and alloys containing these are suitable (claim 10). The support plate is preferably a metal plate or a ceramic plate having good heat conductivity (claim 11).

According to claim 12, a method of mounting the resistor according to the present invention by a wire bonding method is obtained, and according to claim 13, a surface mounting method is obtained. Claim 14-
According to 19, a method for manufacturing a resistor can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of a manufacturing process of the present invention.

FIG. 2 is an explanatory view of a joining step.

FIG. 3 is an explanatory view of a rolling process.

FIG. 4 is an explanatory view of a cutting step (cut-out step).

FIG. 5 is an exploded view of a resistor with a support plate.

FIG. 6 is a perspective view of a resistor with a support plate.

FIG. 7 is a diagram showing an example of mounting a resistor with a support plate;

FIG. 8 is a view showing another method of the cutting step.

FIG. 9 is a view showing another method of the cutting step.

FIG. 10 shows a differently shaped resistor.

FIG. 11 is an explanatory view of a bonding step in another embodiment.

FIG. 12 is a view showing a band.

FIG. 13 is a diagram showing an intermediate of a resistor.

FIG. 14 is a perspective view of a resistor.

FIG. 15 is a diagram showing a mounting example of surface mounting;

FIG. 16 is a diagram showing an implementation example of another embodiment.

FIG. 17 is a diagram showing an implementation example of another embodiment.

FIG. 18 is a view showing a manufacturing process of another embodiment.

[Explanation of symbols]

 Reference Signs List 20 terminal material (electrode material) 24 resistive material (base material) 26 groove 32, 124 bonded body 36, 126 rolled body 46, 130 resistor 50, 54, 128 cutting line 52, 90 strip 56, 86, 132 resistive element Parts 58, 88, 134 Connection terminal part 60 Resistor with support plate 62 Support plate 64 Insulating layer 66, 102 Wiring board (printed wiring board) 68, 104 Circuit pattern (pad, copper foil) 70 Bonding wire 72 Circuit pattern ( Copper foil) 74 Solder 80 Four-terminal resistor 84 Resistor with slit 92 Slit 94 Insulating layer 98 Plating layer 100, 108, 110 Resistor for surface mounting 106 Solder 120 Protrusion 122 Groove

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E032 AB01 BA21 BB01 CA02 CA11 CC03 CC08 CC11 CC14 CC16 CC18 DA15 5E336 AA04 BB01 CC32 CC52 EE03 GG30

Claims (19)

[Claims] 1. A substantially plate-shaped resistance element portion which has been rolled and heat-treated, and a high-conductivity metal which is rolled and heat-treated together with the resistance element portion on a material of the resistance element portion and hot-bonded to the resistance element portion. And a plurality of connection terminals comprising: 2. The resistor according to claim 1, wherein the resistance element portion is formed in a substantially long plate shape, and connection terminal portions are joined along both end edges of one surface thereof. 3. The resistor according to claim 1, wherein the resistance element portion is formed in a substantially U-shape, and connection terminals are joined along edges of both ends of one surface. 4. The resistance element portion is formed in a substantially elongated plate shape, and end surfaces of two sides parallel to the longitudinal direction thereof and the connection terminal portion are fitted to each other by a ridge and a groove and are joined by hot joining. Claim 1
Resistors. 5. The resistance according to claim 1, wherein the resistance element portion and the connection terminal portion have good thermal conductivity and at least one surface is bonded and fixed to an insulating surface of a supporting plate having an insulating property. vessel. 6. A resistor for surface mounting, comprising: a substantially long plate-shaped resistance element portion which is rolled and heat-treated; and said resistance element which is rolled and heat-treated together with the resistance element portion overlying a material of said resistance element portion. At least four connection terminals made of a high-conductivity metal that are hot-bonded along two opposing sides of both surfaces of the element, and end faces of the opposing two sides of the resistance element section and both surfaces facing these end faces 2. A resistor comprising: a plating layer that covers the bonding terminal portion of claim 1; and an insulating layer that covers an exposed surface of the resistance element portion. 7. A resistor for surface mounting, comprising a substantially long plate-shaped resistance element portion which has been rolled and heat-treated, and ridges and grooves formed on two opposite end faces of a material of the resistance element portion. Two connection terminals made of a high-conductivity metal that are fitted, hot-bonded and rolled and heat-treated together with the resistance element, a plating layer covering the connection terminal, and an insulation covering the exposed surface of the resistance element And a layer. 8. The resistor according to claim 2, wherein the resistor element portion is curved in a substantially arch shape such that an intermediate portion is separated upward from lower surfaces at both ends. 9. The resistance element portion is made of copper / nickel alloy, copper / nickel alloy.
9. The resistor according to claim 1, which is one of a manganese alloy and a nickel-chromium alloy. 10. The resistor according to claim 1, wherein the connection terminal is made of one of copper, gold, silver, nickel, and an alloy containing at least one of these. 11. The resistor according to claim 5, wherein the support plate is made of one of copper, aluminum, nickel, aluminum nitride, and alumina, and has an insulating layer formed on the surface. 12. The method of mounting a resistor according to claim 5 on a circuit board, wherein a support plate to which said resistor is adhered and fixed is fixedly adhered to said circuit board, and a connection terminal portion of said resistor is connected to said circuit board. A method for mounting a resistor, wherein the resistor is connected to a circuit pattern of a circuit board by a bonding wire. 13. A mounting method for surface mounting the resistor according to claim 2, 6, or 8 on a circuit board, wherein a connection terminal portion of the resistor is positioned on a pad of the circuit board to temporarily mount the resistor. The method of mounting a resistor, wherein after the connection is stopped, the connection terminal portion is soldered to the pad. 14. A method of manufacturing a resistor in which a plurality of connection terminals made of a metal having high conductivity are joined to a surface of a resistance element made of a substantially plate-shaped resistance alloy, the method comprising: (a) One or a plurality of substantially parallel grooves are formed on the surface of the resistance material, and (b) a connection terminal material made of a substantially strip-shaped high conductivity metal having a cross section substantially the same shape as the groove is fitted into the groove. , (C)
The resistance material and the connection terminal material are joined by hot joining to form a joined body, (d) the joined body is rolled in the longitudinal direction of the groove and subjected to heat treatment to form a rolled body, (e) A method for manufacturing a resistor, comprising cutting a resistor from a rolled body. 15. The resistor according to claim 14, wherein in step (b), two grooves are formed in parallel, and in step (e), the resistor is formed by cutting the rolled body in a direction parallel to and perpendicular to the groove. Method of manufacturing a resistor to be cut out. 16. The cutting line according to claim 14, wherein in step (b), three grooves are formed in parallel, and in step (e), a cutting line passing near the center in the width direction of the rolled connection terminal material is substantially parallel to the groove. And a method for manufacturing a resistor for cutting a resistor by a cutting line substantially orthogonal to the groove. 17. The method according to claim 14, wherein in the step (e), the connection terminal material rolled on only one side is rolled from the rolled connection terminal material side across the rolled connection terminal material. A method of manufacturing a resistor for cutting out a resistor having a slit that enters a resistance material. 18. A method according to claim 14, wherein in step (a), a plurality of parallel grooves are formed, and in step (d), the joined body is substantially arc-shaped between the grooves when the resistance material is viewed from the longitudinal direction of the joined body. In the step (e), manufacturing a resistor that cuts a resistor through a cutting line parallel to the groove and a cutting line perpendicular to the groove, passing near the center in the width direction of the rolled connection terminal material in step (e). Method. 19. A method for manufacturing a resistor, comprising a plurality of connection terminals made of a high conductivity metal coupled to two opposing sides of a resistance element made of a substantially plate-shaped resistance alloy. (B) forming a groove or a ridge formed on two connection terminal materials made of a substantially strip-shaped high-conductivity metal. (C) joining the resistance material and the two connection terminal materials to each other by hot joining to form a joined body; (d) joining the joined body to each other. Rolling in the longitudinal direction and performing a heat treatment to form a rolled body, (e) cutting the rolled body along a cutting line substantially orthogonal to the longitudinal direction to cut out a resistor, Method.