JP2000100535A - Electronic part connecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part connecting device having a simple structure and a low manufacturing cost and capable of making a high-reliability connection without causing erroneous measurement based on the defective operation of components when an electronic part is connected to an electric characteristic measuring device. SOLUTION: Stress is applied to lower a moving section 31 against the energization of a coil spring 22, the tip section 13e of a socket pin 13 fixed to a fixing section 11 is moved to a noncontact position from a contact position with the lead L of a semiconductor device D, the stress is released after the semiconductor device D is fitted, then the tip section 13e of the socket pin 13 is returned to the contact position and crimped to the lead L of the semiconductor device D. After measurement is completed, stress is again applied to lower the moving sectional, and the semiconductor device D is released.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component connecting device for connecting an electronic component such as a semiconductor device to an electrical characteristic measuring device. More specifically, the present invention relates to an electronic component connecting device having a low manufacturing cost and high reliability. The present invention relates to an electronic component connection device capable of high connection.

[0002]

2. Description of the Related Art FIG. 1 is a perspective view showing a solid-state imaging device D (hereinafter, referred to as a semiconductor device D) as an example of an electronic component for measuring electrical characteristics. , Seven leads L are drawn out to both sides from the main body B. And this semiconductor device D
In order to measure electrical characteristics such as photoelectric conversion characteristics, various electronic component connecting devices for connecting to an electrical characteristic measuring device have been proposed and used.

(Conventional Example 1) FIG. 10 is a schematic side view showing an electronic component connecting apparatus 70 of Conventional Example 1. The pins of the set table 72 are inserted into the terminals 5t of the substrate 5 connected to the test board 3 of the electrical characteristic measuring device, and D
An IP (dual in-line package) type semiconductor device D is set. Then, on both sides of the lead L of the semiconductor device D, the mounting members 7 at the distal end of the rod 74 of the pneumatic cylinder 73 fixed to a support (not shown).
6 is provided with a contact pin 77 so as to be reciprocable as indicated by an arrow, and the mounting member 76 is connected to a terminal 5t of the substrate 5 by a lead wire 78. As shown in FIG. 12, a coil spring 79 is provided inside the contact pin 77, but the coil spring 79 is deteriorated by repeated use, causing the contact pin 77 to malfunction and the lead wire 78 to be disconnected. In some cases, the semiconductor device D is determined to be defective although the semiconductor device D is good.
Further, the attachment of the pneumatic cylinder 73 and the contact pins 77 complicates the structure and increases the manufacturing cost.

(Conventional Example 2) FIG. 11 is a schematic side view showing an electronic component connecting apparatus 80 of Conventional Example 2, in which lead wires 78 of Conventional Example 1 are replaced with contact pins 88. That is, the terminal 5t of the substrate 5 is changed to one that is compatible with the contact pin 88, and the lead L of the semiconductor device D set on the set base 82 is brought into contact with the mounting member 86 at the tip of the rod 84 of the pneumatic cylinder 83. Pin 8
7, 88 are attached. Accordingly, when the mounting member 86 is reciprocated by the pneumatic cylinder 83 as shown by the arrow, the lead L of the semiconductor device D and the terminal 5t of the substrate 5
Can be simultaneously connected and the connection can be released, and the breakage of the lead wire 78 as in the conventional example 1 is eliminated, but the manufacturing cost is also high, and the contact pins 87 and 88 are the same as in the conventional example 1. When used repeatedly, malfunctions occurred.

(Conventional Example 3) FIG. 13 is a schematic side view showing an electronic component connecting device 90 of Conventional Example 3, in which pins 94 of a socket 92 are inserted into a substrate 5 and a semiconductor device D of the semiconductor device D is inserted into the socket 92. The lead L is inserted from above,
FIG. 14 is a perspective view of the socket 92. That is, by connecting the lead L of the semiconductor device D into the hole 93 formed on the upper surface of the socket 92, the connection with the electrical characteristic measuring device is achieved. In the electronic component connection device 90 of the third conventional example, the lead L is inserted by pressing the sealing glass plate attached to the upper surface of the semiconductor device D which is a solid-state imaging device, so that the glass plate is contaminated. In addition, there is a fear of causing damage such as damage.

Japanese Patent Application Laid-Open No. 61-773 discloses an IC socket for inserting a pin of an IC (integrated circuit) into contact therewith.
As shown in FIG. 15A, the "no-pressure insertion / pull-out type IC socket" disclosed in
01 and a fixed portion 102, a contact portion 103 having a spring characteristic is attached to the fixed portion 102,
After the pins 104 of the IC are inserted into the contact portions 103, the movable portion 101 is moved down to
As shown in FIG.
3 is disclosed that acts to close the pin 3 and pinches the pin 104 of the IC.

Japanese Patent Application Laid-Open No. 61-77348 discloses a "simple insertion / removal type IC socket" which discloses an IC socket as shown in FIG. That is, the IC socket is divided into the movable part 111 and the fixed part 112, and the contact 123 having the spring characteristic is attached to the fixed part 112 as in Japanese Patent Application Laid-Open No. 61-77348. After inserting the pin 127 of the IC 126 into the contact 123, the movable part 111 is lowered, so that the protrusion 114 of the movable part 111
3 to close the pin 127 of the IC 126. A stopper 11 is provided at the end of the movable portion 111.
3 is rotatably mounted around the insertion pin 118, and the stopper 113 is urged counterclockwise around the insertion pin 118 by a spring (not shown) between the stopper 113 and the movable part 111. I have. Then, the lower end of the stopper 113 locked to the protrusion 121 of the fixed portion 112 slides on the side surface 122 by lowering the movable portion 111,
It is locked by the lower recess 124 so that the lowered state is maintained.

Japanese Patent Application Laid-Open Nos. 61-77348 and 61-77348 each disclose a pin 1
Since the measuring terminal comes into contact with the lower end of the pin 04 or the pin 127, the measured electrical characteristics include the pin. Also, it can be used only when the pin 104 or the pin 127 is facing downward, and when the pin is
It cannot be used for C. Further, the structure does not allow a robot to stably and easily insert and withdraw an IC having a large number of pins (leads).

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has a simple structure, a low manufacturing cost, and a low cost for connecting an electronic component such as a semiconductor device to an electric characteristic measuring apparatus. It is an object of the present invention to provide an electronic component connection device which has high reliability, and further allows easy attachment and detachment of electronic components and enables unmanned measurement.

[0010]

According to the present invention, there is provided a method comprising:
This problem can be solved by a configuration according to the present invention. In order to solve the problem, the electrical characteristic measuring socket according to the present invention is characterized in that terminals for a plurality of leads of the mounted electronic component are connected to terminals. The electronic component is connected to the electrical characteristic measuring device by contacting the electronic component with the mounting portion. A socket pin as a terminal contacting the lead from the outer peripheral side of the
It is formed in a frame shape that allows electronic components to pass when mounting and removing,
Preferably, the movable part is slid in the up-down direction and includes a movable part that is close to or separated from the fixed part, and a spring that connects the fixed part and the movable part. The tip of the socket pin is moved from the contact position with the lead of the electric component to the non-contact position when the movable portion is separated from the fixed portion or close to the fixed portion. The part is moved from the non-contact position to the contact position with the lead, and the spring connecting the fixed part and the movable part urges the movable part in the direction to bring the tip of the socket pin into contact with the lead of the electric part and attaches it. It is what is being done.

By applying a stress and moving the movable portion close to or away from the fixed portion against the urging of the spring, the tip of the socket pin moves from the contact position to the non-contact position. When the lead does not get entangled with the socket pin during mounting and the stress is released after mounting, the movable part is separated or approached by the bias of the spring,
Since the tip of the socket pin is moved from the non-contact position to the contact position and comes into contact with the lead of the electronic component, the connection to the electrical characteristic measuring device is extremely easily performed. In addition, even after the measurement is completed, the tip of the socket pin moves from the contact position to the non-contact position by applying stress to move the movable part close to or away from the fixed part, so that the electronic component can be detached. Is performed very easily.

According to a second aspect of the present invention, in the electronic component connecting device, the movable portion is moved from the contact position to the non-contact position by moving the movable portion close to or away from the fixed portion against the bias of the spring. Has one end locked to the socket pin so that the socket pin can be pulled, the other end slidably locked to the lower surface side of the movable portion, and a pivotally supported portion near the one end. This is performed by rotating the member by approaching or separating the movable portion. Since the lever member is used, the movement of the socket pin from the contact position to the non-contact position is greatly facilitated.

In the electronic component connecting device according to a third aspect of the present invention, the socket pin is formed in a long curved shape from the mounting portion to the distal end, and the socket pin moves from the contact position to the non-contact position at the distal end portion. Is performed with a small stress within the elastic limit of the socket pin.

According to the electronic component connecting device of the present invention, when the tip of the socket pin is in the contact position, the tip is protruded from a slit formed in the fixing portion, and the socket pin is in non-contact. When in the position, the tip is formed so as to be drawn into the slit. Therefore, at the time of mounting or detaching the electronic component, the movable portion is moved closer to or away from the fixed portion,
By retracting the tip of the socket pin into the slit, it is possible to prevent a trouble that the lead of the electronic component and the tip of the socket pin are entangled.

According to a fifth aspect of the present invention, there is provided the electronic component connecting device, wherein when the distal end portion of the socket pin is at the contact position and protrudes from the slit, a branch portion still remaining in the opening is formed at the distal end portion. The branch portion serves as a guide when the tip of the socket pin is drawn into the slit.

According to the electronic component connecting device of the present invention, a guide surface inclined downward from an upper peripheral portion toward a mounting table provided at a central portion of the fixed portion is formed, and is dropped through the movable portion. And facilitate the mounting of electronic components.

According to a seventh aspect of the present invention, there is provided an electronic component connection device, wherein the robot moves the movable part close to or away from the fixed part and mounts the electronic component, and when the robot separates, the movable part is separated by the bias of the spring. The proximity causes the socket pin to move from the non-contact position to the contact position with the lead, and the tip of the socket pin to be pressed against the lead of the electronic component to measure the electrical characteristics.After the measurement, the proximity or separation of the movable part and the electronic By allowing the robot to perform attachment and detachment of components, the measurement of the electrical characteristics of the electronic components can be performed unattended, and the measurement cost is greatly reduced.

The electronic component connection device according to the present invention is applied to measurement of electrical characteristics such as photoelectric conversion characteristics of a solid-state imaging device having a sealing glass plate provided on an upper surface as an electronic component. At the time of mounting, the glass plate is not pressed, so that the glass plate is not contaminated and damaged.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION A socket for measuring the electrical characteristics of an electronic component according to the present invention connects the electronic component to an electrical characteristic measuring device by bringing socket pins into contact with a plurality of leads of the mounted electronic component. In such a configuration, when the movable part is brought close to the fixed part, or when the movable part is separated from the fixed part, the tip of the socket pin is moved from the contact position with the lead of the electric component to the non-contact position. The tip of the socket pin is moved from the non-contact position with the lead of the electrical component to the contact position when the movable portion is separated from or close to the fixed portion. The direction of movement of the movable portion when the tip portion is brought into contact with the lead of the electric component may be any direction of approaching or separating. The spring connecting the movable part and the fixed part urges the movable part in a direction in which the tip of the socket pin comes into contact with the lead of the electric component. The spring may be a coil spring, or a leaf spring. It may be.

Further, when the movable portion is brought close to the fixed portion or when the movable portion is separated from the fixed portion, the movement of the tip of the socket pin from the contact position with the lead of the electric component to the non-contact position is provided with a spring. It is preferable to use a lever because it moves against the force, so long as the tip of the socket pin is moved from the contact position to the non-contact position by the proximity or separation of the movable part. The mounting location is not particularly limited.

In order to stably move the tip of the socket pin from the contact position with the lead of the electric component to the non-contact position for a long period of time as the movable portion approaches or separates from the movable portion, the socket pin is fixed. It is preferable that a long curve is formed between the portion attached to the portion and the tip portion so that the above-described movement is performed with a small stress within the elastic limit of the socket pin. Although the curved shape may be any shape, for example, an S-shaped shape, a J-shaped shape, or a combination thereof is a preferable shape.

Further, the socket pin is moved from the contact position to the non-contact position so that the lead of the electronic component does not become entangled with the socket pin at the time of mounting. However, even in the non-contact position, the tip of the socket pin does not hinder. It is desirable to accommodate the tip of the socket pin in, for example, a slit.

Further, by moving the leading end of the socket pin from the contact position to the non-contact position, the robot moves the movable part close to or away from the fixed part, and attaches and detaches the electronic part. It is possible to automate the measurement of the electrical characteristics of the robot, but in addition to these functions, the robot used transports the unmeasured electronic components at the predetermined location, transports them to the socket for connection, It is desirable that components can be distributed to locations according to classes determined by measurement results.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component connection device according to an embodiment of the present invention will be specifically described with reference to the drawings.

FIG. 2 is a perspective view conceptually showing an electric characteristic measuring device 1 for measuring electric characteristics such as photoelectric conversion characteristics of the semiconductor device D shown in FIG. A light source 2 for irradiating the semiconductor device D with light during measurement;
A measuring unit 4 is provided adjacent to this. That is,
The semiconductor device D is mounted on the electronic component connection device 6 mounted on the substrate 5 of the measuring section 4, and the leads L of the semiconductor device D and the electrical characteristic measuring device 1 are connected. Furthermore, the preheater 7 for preheating the semiconductor device D, the tray ₈₁ for supplying the semiconductor device D unmeasured is accommodated, the semiconductor device D _1, which is selected in the class (1) with the measured is full to measure Tray 8 ₂ , tray 8 ₃ , which is full of semiconductor devices D ₂ which have been measured and selected in class (2), empty tray 8 ₄ , and semiconductor devices D ₁ immediately after measurement
8 ₅ , the semiconductor device D ₂ immediately after the measurement
8 ₆ , the semiconductor device D ₃ which is defective
There tray 8 ₇ are arranged in a row to be received. Tray 8 ₁ to tray 8 ₄ Among these are staked as required. Also depicted at the end opposite to the light source 2 is a handler 9 which is a transfer robot for transferring the semiconductor device D, which has two grip portions and has an x-axis direction and a y-axis direction. It is possible to move two-dimensionally with the direction.

(Embodiment) FIG. 3 shows an electronic component connecting device 10 (hereinafter referred to as a socket 10) of the present invention corresponding to the electronic component connecting device 6 of the electrical characteristic measuring device 1 of FIG. FIG. 4 is a plan view of FIG.
FIG. 5 is a side view taken along the line [5]-[5] in FIG. 4, and FIG. 6 is a partial sectional view taken along the line [6]-[6] in FIG. That is, with reference to FIG. 3, the socket 10 is generally made of a plastic fixing part 11 and a plastic movable part which is slidable up and down along a slide shaft 21 which also serves as an upward stopper. Part 3
A total of 14 socket pins 13 on one side, which are in contact with the leads L of the semiconductor device D, are mounted on the fixing portion 11 at the base portion by insert molding as described later. Further, coil springs 22 are attached to the four corners between the movable part 31 and the fixed part 11, and the movable part 31 is urged upward by the coil springs 22.

FIG. 4 is a view showing a state in which the semiconductor device D is not mounted and the tip of the socket pin 13 is in the contact position together with FIG. 6, but in FIG. 4, the semiconductor device D is shown by a dashed line. Mounted in position. The movable portion 31 is formed in a frame shape having an opening 32 in the center portion, and the mounting portion 12 is formed in the center portion of the fixed portion 11 so that the upper half portion has a rectangular cylindrical shape and the semiconductor device D is straddled. I have. The width between the opposing leads L of the semiconductor device D is 10.16 mm, while the width of the space around the corresponding mounting table 12 is 11.08 mm.
While the dimension of the side without
The width of the space around the corresponding mounting table 12 is 10.16.
mm, and the semiconductor device D is mounted on the mounting table 12 with the lead L
The socket pins 13 are mounted without causing a positional shift.

Referring to FIG. 6, a guide surface inclined downward toward the mounting table 12 is provided on the inner edge of the opening 32 of the movable portion on the lead L side of the semiconductor device D to assist the mounting. 35 are formed facing each other, and in a direction intersecting with them, a guide curved surface 16 inclined downward from the upper surface 15 of the fixing portion 11 toward the mounting table 12 is formed, and the lead L is dropped downward. The semiconductor device D to be inserted is guided to the mounting table 12. An edge of the upper surface of the mounting table 12 on the side of the lead L of the semiconductor device D is formed with a beveled slope 18 so as to facilitate insertion of the lead L into an insertion space 19 below. ing. In addition, the Phillips screw 28 is a screw for assembling the constituent members of the fixing part 11 and is located below the mounting table 12.

Referring to FIG. 6 showing the socket pins 13,
The root portions 13a and 13b of the socket pins 13 are fixed to the lower half of the mounting table 12 of the fixing portion 11, and the insertion pin portion 13p extending downward is a portion to be inserted into the substrate 5. The socket pin 13 extends upward in an inverted S-shape, and its tip 13 e is pressed against the lead L of the semiconductor device D mounted on the upper surface of the mounting table 12. In addition, as described above,
4 and 6 show a state where the tip 13e of the socket pin 13 is in a contact position where the tip 13e of the socket pin 13 contacts the upper end of the lead L of the semiconductor device D when the semiconductor device D is not mounted on the mounting table 12. At this time, the socket pins 13
Is exposed to the internal space of the socket 10 from the slit 14 formed in the fixing portion 11, and
The projection 13f formed near the portion 3e is left in the slit 14. Also, socket pin 1
3 is provided with a locking portion 13d, and one end 23a of the lever member 23 is locked. Referring also to FIG. 5, on both end surfaces of the lever member 23, a disk-shaped protrusion 24 is formed at a position close to the end 23 a, and a shaft support portion formed integrally with the fixed portion 11. 25.
Further, the other end 23 b of the lever member 23, which is farther from the disc-shaped protrusion 24, is provided with an uneven surface 33 formed on the lower surface of the movable portion 31.
Slidably in contact with That is, the lever member 23 is configured to be rotated about the disk-shaped projection 24 as an axis.

FIG. 7 is a sectional view when the movable portion 31 of FIG. 6 is lowered. That is, by applying a stress to the movable portion 31 of FIG. 6 from above and lowering it against the bias of the coil spring 22, the end 23 b of the lever member 23 is rotated downward about the disk-shaped projection 24 as an axis, At the same time, the end portion 23a of the socket pin 13 locked by the locking portion 13d is also rotated, so that the upper half of the socket pin 13 is tilted rightward in FIG. 13 e is a non-contact position with the lead L of the semiconductor device D and is accommodated in the slit 14. Then, in this state, the direction of the lead L facing the semiconductor device D is determined from above, and the semiconductor device D is dropped into the mounting table 12 from the opening 32 of the movable portion 31 with the lead L down, and mounted.

Thereafter, when the stress on the movable portion 31 is released, the movable portion 31 is slid by the bias of the coil spring 22 and rises. At the same time, the tip portion 13e of the socket pin 13 at the non-contact position is moved to the position shown in FIG. It returns to the indicated contact position. The position of the tip portion 13e of the socket pin 13 at this contact position is the position of the lead L of the mounted semiconductor device D.
Is slightly closer to the mounting table 12 than the position of the upper end of the semiconductor device D, so that the distal end 13e of the socket pin 13 is connected to the upper end of the lead L of the semiconductor device D by crimping. That is, the semiconductor device D is securely connected to the electric characteristic measuring device 1 shown in FIG. 2, and electric characteristics such as photoelectric conversion characteristics are measured.

When the predetermined measurement is completed, the movable section 31
Is lowered to the state shown in FIG.
Is tilted, the tip 13e of the socket pin 13 is retracted into the slit 14, and then the semiconductor device D, for which measurement has been completed, is detached from the mounting table 12 and taken out of the socket 10. By being distributed and accommodated accordingly, a series of measurement operations on the semiconductor device D is completed. Then, the measurement of the electrical characteristics of the subsequent semiconductor device D is similarly repeated.

The electronic component connecting apparatus according to the embodiment of the present invention, that is, the socket 10 is constructed and operates as described above. Of course, the present invention is not limited to this, but variously based on the technical idea of the present invention. Is possible.

For example, in the present embodiment, the tip 13e of the socket pin 13 is moved from the contact position (FIG. 6) with the lead L of the semiconductor device D to the non-contact position (FIG. 7). Although the lever member 23 is interposed between the lever member 23 and the part 31, the lever member 23 may not be used. For example, FIG. 8 is a diagram illustrating a structure and an operation of a main part of the electronic component connection device 40 of the first modification. FIG. 8A illustrates a state in which the socket pin 43 is in a non-contact position, and FIG. Socket pin 4
Reference numeral 3 denotes a state at the contact position, which is pressed against the lead L of the semiconductor device D. That is, FIG. 8A shows an S-shape in which the movable part 51 is pushed down against the bias of the coil spring 42 by applying a stress, and one end 43 a is locked at the lower end of the movable part 51 and the fulcrum 44 is provided at the center. The socket pin 43, which is a spring, is accommodated in a recess 53 formed in the movable portion 51 together with the convex guide portion 52 to be in a non-contact position, and the other end 43b of the socket pin 43 is connected to the lead L of the semiconductor device D. Is not connected. When the stress is released in the state shown in FIG. 8A, the movable portion 51 is raised by the bias of the coil spring 42, and the upper half of the socket pin 43 is moved along the convex guide portion 52 of the movable portion 51. 8B, the socket pin 43 is turned around the fulcrum 44 to the contact position, and the other end 43b of the socket pin 43 is connected to the lead L of the semiconductor device D, as shown in FIG. Is what is done.

FIG. 9 is a view showing the structure and operation of the main part of the electronic component connection device 60 of the second modification. FIG. 9A shows a state where the socket pin 63 is at the non-contact position. 9
7B is a diagram showing a state in which the socket pin 63 is at the contact position and is pressed against the lead L of the semiconductor device D.
9A shows a state in which the movable portion 65 is pulled up against the bias of the coil spring 62 by applying a stress.
3a is fixed to the fixed portion 61, and the other end portion slides along the lower inclined surface 66 of the movable portion 65. The socket pin 63, which is an inverted J-shaped spring, is set to the non-contact position, and the semiconductor device D
Is not connected to the lead L. And FIG.
In the state A, when the stress is released, the movable portion 65 is lowered by the urging of the coil spring 62, and accordingly, the socket pin 63 is pushed down to the contact position, and the other end 63b of the socket pin 63 is It is connected to the lead L of the semiconductor device D. Thus, unlike the case of the first embodiment and the first modification, the socket pin 63 may be configured to move from the non-contact position to the contact position in the process of lowering the movable portion 65.

Further, in this embodiment, in all the electronic component connection devices, the case where the movable portion and the fixed portion are slid vertically is shown. However, the sliding direction is not limited. You may make it slide. Normally, the electronic component in this case is mounted sideways in the fixed portion to measure the electrical characteristics.

In this embodiment, a DIP type semiconductor device has been described as an example of an electronic component for measuring electrical characteristics. However, the socket pin of the present invention is to contact a lead of an electronic component from the side. From DIP to SOP (Single Outline Package) and QFP
The present invention can also be applied to a semiconductor device such as a (quad flat package) in which the tips of the leads are drawn out in the horizontal direction. Further, in this embodiment, a solid-state imaging device having a sealing glass plate on its surface has been exemplified as an electronic component for measuring electric characteristics. And rewritable ROM), electrical characteristics can be measured without causing window contamination or damage.

In this embodiment, the semiconductor device D which is a solid-state image sensor is illustrated as an electronic component to be connected. However, the electronic component connecting device of the present invention is a discrete device other than the semiconductor device, for example, a laminated chip. The present invention is also applied to a case where electric characteristics of a capacitor, a laminated chip coil, and the like are measured.

[0039]

The present invention is embodied in the form described above, and has the following effects.

According to the electronic component connection device of the first aspect, by applying a stress to move the movable portion close to or away from the fixed portion, the tip of the socket pin is moved from the contact position to the non-contact position. Therefore, the lead does not become entangled with the socket pin when the electronic component is mounted, and by releasing the stress, the movable part approaches or separates due to the bias of the spring, the socket pin is moved to the contact position, and the tip of the socket pin is moved. The part is crimped to the lead, and a highly reliable connection is obtained. Also, the attachment and detachment of the electronic parts are similarly easy. Furthermore, since the air cylinder and the contact pins are not used for the components, the structure is simple and the manufacturing cost is low, and erroneous measurement due to the malfunction of the components does not occur. Further, since the sealing glass plate is not pressed at the time of mounting, the glass plate is not damaged. Furthermore, since it can be attached to the electrical characteristic measuring device simply by inserting the socket pin into the board,
Its replacement is very easy.

According to the electronic component connection device of the second aspect, since the lever member is used to move the socket pin from the contact position to the non-contact position, the movable member approaches or separates against the bias of the spring. Is possible with small stress,
Facilitates desorption.

According to the electronic component connection device of the third aspect, since the socket pin formed to be long in a curved shape is used, the movement of the tip of the socket pin from the contact position to the non-contact position is within the elastic limit of the socket pin. Therefore, the connection can be made with high reliability without deformation of the socket pin or a decrease in the crimping force of the tip of the socket pin against the lead of the electronic component even when used for a long time.

According to the electronic component connecting device of the present invention, when the electronic component is mounted, the tip of the socket pin is completely drawn into the slit. Does not occur.
According to the electronic component connection device of the fifth aspect, since the projection that remains in the slit is formed at the tip even when the tip of the socket pin projects from the slit, the tip of the socket pin is When it is drawn into the slit, it serves as a guide, and the drawing into the slit is performed smoothly.

According to the electronic component connecting device of the sixth aspect, since the guide surface is formed so as to be inclined downward from the upper peripheral portion to the mounting base at the center of the fixing portion, the mounting operation of the electronic component is easy. And enable automation of measurement. Further, according to the electronic component connection device of the seventh aspect, the mounting and demounting of the electronic component can be performed by the robot by the robot, and the measurement can be performed unattended.

According to the electronic component connection device of the eighth aspect, when the solid-state image pickup device as the electronic component is mounted, the sealing glass plate on the upper surface is not pressed to cause scratches or breakage.

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor device as an example of an electronic component to be measured.

FIG. 2 is a perspective view of an electrical characteristic measuring device in which the electronic component connection device is used.

FIG. 3 is a perspective view of the electronic component connection device according to the first embodiment.

FIG. 4 is a plan view of the same device.

FIG. 5 is a side view taken along the line [5]-[5] in FIG.

FIG. 6 is a partial cross-sectional view taken along a line [6]-[6] in FIG.

FIG. 7 is a partial cross-sectional view in which the movable section of FIG. 6 is lowered.

FIG. 8 is a cross-sectional view illustrating a main part of an electronic component connection device according to Modification Example 1, wherein A indicates a non-contact position of a socket pin, and B indicates a contact position.

FIG. 9 is a cross-sectional view illustrating a main part of an electronic component connection device according to Modification Example 2, wherein A indicates a non-contact position of a socket pin, and B indicates a contact position.

FIG. 10 is a front view of an electronic component connection device of Conventional Example 1.

FIG. 11 is a front view of an electronic component connection device of Conventional Example 2.

FIG. 12 is a sectional view of a contact pin used in Conventional Example 1 and Conventional Example 2.

FIG. 13 is a front view of an electronic component connection device of Conventional Example 3.

FIG. 14 is a perspective view of a socket portion of the device.

FIG. 15 is a sectional view of a prior art IC socket;
Indicates the time when the IC is pulled out, and B indicates the time when the IC is inserted and used.

FIG. 16 is a cross-sectional view of another prior art IC socket, wherein A shows a state where the IC is mounted, and B shows a state where the IC is completely contacted.

[Description of Signs] 10 ... Socket (electronic component connection device), 11 ... Fixed part, 12 ... Mounting stand, 13 ... Socket pin, 14 ...
Slit, 21 ... Slide shaft, 22 ... Coil spring,
24 ... lever member, 31 ... movable part, 32 ... opening.

Claims (8)

[Claims] 1. An electronic component connection device for connecting terminals to a plurality of leads of the mounted electronic component to connect the electronic component to an electrical characteristic measuring device, wherein the electronic component connection device is a central device. A fixed part provided with a mounting base for the electronic component in a portion, and a socket as the terminal which is attached to the fixed part and is on the side of the electrical characteristic measuring device and comes into contact with a lead of the electronic component from an outer peripheral side of the mounting base. A pin, formed in a frame shape through which the electronic component passes when being mounted and detached, and preferably slid in the up-down direction to connect the fixed part and the movable part with the movable part which is close to and separated from the fixed part. When the movable portion is brought close to the fixed portion, or when the movable portion is separated from the fixed portion, the tip of the socket pin is brought into contact with the lead. Is moved from the position to the non-contact position, when moved away the movable part from the fixed part,
Alternatively, when approaching the fixed portion, the socket pin is moved from the non-contact position to the contact position, and the spring connecting the fixed portion and the movable portion contacts the distal end of the socket pin with the lead. An electronic component connection device, wherein the movable part is attached by urging the movable part in a direction in which the movable part is moved. 2. The method according to claim 1, wherein the movable portion is moved closer to or away from the fixed portion against the bias of the spring, so that the tip of the socket pin moves from the contact position to the non-contact position. In the movement, one end is locked to the center of the socket pin so that the socket pin can be pulled, the other end is slidably locked to the lower surface of the movable part, and the one end is fixed to the one end. 2. The electronic component connection device according to claim 1, wherein the rotation is performed by rotating a lever member pivotally supported at a close portion by approaching or separating the movable portion. 3. 3. The socket pin is formed in a long curved shape from a portion attached to the fixing portion to a tip portion,
2. The electronic component connection device according to claim 1, wherein the tip of the socket pin moves from the contact position to the non-contact position with a small stress within an elastic limit of the socket pin. 3. 4. When the socket pin is at the contact position, a tip end of the socket pin protrudes from a slit formed in the fixing portion, and when the socket pin is at the non-contact position, the socket pin The electronic component connection device according to claim 1, wherein a tip portion of the electronic component is formed so as to be drawn into the slit. 5. A branch portion which is still formed in the slit when the distal end portion of the socket pin is protruded from the slit, is formed at the distal end portion, and the leading end portion is drawn into the slit. The electronic component connection device according to claim 4, wherein the connection is performed by being guided by the branch portion. 6. A guide surface which is inclined downward from an upper peripheral portion toward the mounting table provided at a central portion of the fixed portion, and mounts the electronic component dropped through the movable portion. The electronic component connection device according to claim 1, wherein the electronic component connection is assisted. 7. A robot for moving the socket pin from the contact position to the non-contact position, in which the movable part approaches or separates from the fixed part and the electronic component is mounted. When the socket is separated, the socket pin is moved from the non-contact position to the contact position by the separation or proximity of the movable portion by the bias of the spring, so that the tip of the socket pin is pressed against the lead of the electronic component. Electrical properties are measured
Thereafter, again, for moving the socket pin from the contact position to the non-contact position, the proximity or separation of the movable portion from the fixed portion, and the detachment of the electronic component is performed by the robot, The electronic component connection device according to claim 1, wherein the measurement of the electrical characteristics of the electronic component is automatically performed. 8. The electronic component connection device according to claim 1, wherein the electronic component is a solid-state imaging device having a sealing glass plate provided on an upper surface.