JP2000090226A - Production of ic module and ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the production of IC module and ZC card with which an anisotropic conductive film is transferred on the surface of various materials in satisfactory state in high yield and productivity and yield can be improved. SOLUTION: An antenna coil 2 having a terminal 2a is formed on a module substrate 1, and the simplified transfer processing of the anisotropic conductive film is applied to the surface, where the antenna coil 2 is formed, of the module substrate 1 at least. Next, an anisotropic conductive film 4 is transferred on the terminal 2a at least, an IC chip 3 having a bump 3a is placed on the anisotropic conductive film 4 while aligning the bump 3a and terminal 2a, and the IC chip 3 is press-contacted so as to electrically connect the bump 3a and terminal 2a through the anisotropic conductive film 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device (IC)
IC module incorporating a chip) and a method of manufacturing an IC card using the IC module.

[0002]

2. Description of the Related Art In recent years, IC cards equipped with semiconductor elements (IC chips) for recording and processing data have become widespread from the viewpoint of efficiency of information processing and security. Such an IC card includes a contact type that electrically connects an external terminal of the card and a terminal of an external processing device to transmit and receive data, an antenna coil that transmits and receives data by electromagnetic waves, and an IC card for data processing. A non-contact type that incorporates a semiconductor element for reading and writing to and from an external processing device in a so-called wireless manner, in which the driving power of an IC circuit is supplied by electromagnetic induction, and does not incorporate a battery, has been developed. I have.

The above-mentioned IC card or IC card I
The C module tends to become thinner and thinner. As a method for mounting an IC chip on an IC card or an IC card IC module, the bump side of the IC chip is mounted on a module substrate to make the IC card and the IC module thinner. It is indispensable to adopt a flip-chip mounting mode for mounting in the direction. As a method of realizing this flip-chip mounting mode, a method of mounting an IC chip using an anisotropic conductive film in a portable device such as a mobile phone has been mainly adopted. Anisotropic conductive films are mainly used for packaging.

[0004] An IC chip mounted on a non-contact type IC card mounted with an IC chip using the anisotropic conductive film described above.
An example of the C module will be described. FIG.
FIG. 4B is a plan view of the C module, and FIG.
It is sectional drawing in XX 'of a middle. Module board 1
An antenna chip 2 having a terminal 2a formed thereon, and an IC chip 3 having a bump 3a on a terminal 2a region
Are bonded by an anisotropic conductive film 4 formed by dispersing conductive particles 4a in a binder 4c. Here, the bumps 3 a are formed of the conductive particles 4 in the anisotropic conductive film 4.
This is a flip-chip mounting mode in which the bump side 3a of the IC chip 3 is electrically connected to the terminal 2a of the antenna coil 2 via the "a" and is directed toward the module substrate 1.

[0005] A method of manufacturing the above IC module will be described. First, as shown in FIG. 5 (a), a metal such as aluminum is vapor-deposited on a module substrate 1 such as PET (polyethylene terephthalate), or a metal foil is attached to the module substrate 1 to etch the antenna coil into a pattern. The antenna coil 2 having the terminal 2a is formed by, for example, printing an antenna coil pattern using conductive ink.

Next, as shown in FIG. 5B, after the anisotropic conductive film 4 containing the conductive particles 4a is cut into a desired length, a heater tool is cut from the upper surface of the anisotropic conductive film 4. After being depressurized while being heated by (not shown), the anisotropic conductive film 4 is transferred from the release paper 4b onto the terminal 2a region of the antenna coil 2 (temporary pressure bonding). next,
As shown in FIG. 5C, the IC chip 3 is placed on the anisotropic conductive film 4 so that the bump 3a of the IC chip 3 and the terminal 2a of the antenna coil 2 are aligned, and the heater tool 5 And press while heating, and crush the anisotropic conductive film 4 by sandwiching it between the bump 3a and the terminal 2a.
The bumps 3a are electrically connected to the terminals 2a via the conductive particles 4a in the anisotropic conductive film 4, and the thermosetting resin, which is a binder of the anisotropic conductive film 4, is cured. The IC chip 3 is fixed (completely press-bonded).

[0007] The anisotropic conductive film 4 is bumped 3a.
The step of squeezing the terminal 3a between the bump 3a and the terminal 2a via the conductive particles 4a in the anisotropic conductive film 4 will be described. As shown in FIG. 6A, the antenna coil terminals 2a are mounted on the module substrate 1.
Are formed. An anisotropic conductive film 4 formed by dispersing conductive particles 4a in a binder 4c is formed so as to cover the terminals 2a. The IC chip 3 is placed on the device. The binder 4c is an adhesive, a thermosetting resin,
It is made of a thermoplastic resin or a mixture thereof.
As shown in FIG. 6B, the IC chip 3 is pressed by a heater tool (not shown) or the like, and the anisotropic conductive film 4 is pressed.
Is sandwiched between the bumps 3a and the terminals 2a and crushed, the conductive particles 4a come into contact with the bumps 3a and the terminals 2a, respectively, and the bumps 3a and the terminals 2a can be conducted through the conductive particles 4a.

[0008] The above anisotropic conductive film 4 is separated from release paper 4b.
In the step of transferring from the wire to the terminal 2a area of the antenna coil 2, the anisotropic conductive film 4 in the form of a tape of a reel together with the release paper 4b is cut into a desired length L, The image is transferred onto the terminal 2a area of the coil 2. Here, as a method of cutting the anisotropic conductive film 4 into a desired length L, as shown in FIG.
In the release paper 4b, a half-cut method in which only the anisotropic conductive film is transferred onto the module substrate, and the anisotropic conductive film 4 having a length L as shown in FIG. Minute, the anisotropic conductive film 4 and the release paper 4b are cut together at the position FC.
There is a full cut method in which the anisotropic conductive film 4 is attached to the module substrate together with the b, and the release paper 4b is finally peeled in a later step.

[0009]

However, in the above-mentioned conventional method of manufacturing an IC card IC module, the plastic material of the module substrate is, for example, AB.
S (acrylonitrile-butadiene-styrene copolymer), PET, PVC (polyvinyl chloride), PE (polyethylene), and so on. On the other hand, as a material for the antenna coil, silver or copper based conductive ink, copper, etc. Many materials are used, such as coiled wires and etched foils such as aluminum, and their surface contamination is also different. Therefore, when transferring an anisotropic conductive film, both the antenna coil and the module substrate are anisotropic. Although it is necessary to bond the conductive film, there is a problem that it is difficult to transfer the conductive film to various material surfaces in a good state. COG for anisotropic conductive film
(Chip on grass) is widely used for mounting ICs in portable devices and the like, but its transferability is not sufficient for flip chip mounting of IC modules for IC cards.

In order to transfer the anisotropic conductive film onto various material surfaces in good condition with good yield, it is necessary to lengthen the pressure bonding time of the transfer, which causes a decrease in productivity. For some materials, it is difficult to make the yield close to 100% only by increasing the pressing time.

The present invention has been made in view of the above circumstances, and accordingly, the present invention is to improve the productivity and the yield by transferring an anisotropic conductive film to various material surfaces in good condition with good yield. It is an object of the present invention to provide a method for manufacturing an IC module and a method for manufacturing an IC card, which can perform the following.

[0012]

In order to achieve the above object, a method of manufacturing an IC module according to the present invention comprises the steps of: forming an antenna coil having terminals on a module substrate; A step of easily transferring an anisotropic conductive film to a forming surface, a step of transferring the anisotropic conductive film to at least the terminals, and a step of forming an IC chip having a bump on the anisotropic conductive film by using the bump on the anisotropic conductive film. A step of placing the terminals so as to be aligned, and a step of crimping the IC chip so that the bumps and the terminals are electrically connected via the anisotropic conductive film.

In the above-described method of manufacturing an IC module according to the present invention, an antenna coil having terminals is formed on a module substrate, and at least the surface of the module substrate on which the antenna coil is formed is subjected to easy transfer of an anisotropic conductive film. next,
At least transfer the anisotropic conductive film on the terminal, place the IC chip having the bump on the anisotropic conductive film with the position of the bump and the terminal aligned, and connect the bump and the terminal via the anisotropic conductive film. The IC chip is crimped so as to be electrically connected.

According to the method for manufacturing an IC module of the present invention described above, before the transfer of the anisotropic conductive film, the surface of the module substrate on which the antenna coil is formed is subjected to easy transfer of the anisotropic conductive film. The anisotropic conductive film can be transferred onto various material surfaces in good condition with good yield, and productivity and yield can be improved.

In the method of manufacturing an IC module according to the present invention, preferably, the easy transfer treatment of the anisotropic conductive film is a corona discharge treatment or an ultraviolet irradiation treatment. Thereby, an effective easy transfer process can be performed.

In the method of manufacturing an IC module according to the present invention, preferably, in the step of transferring the anisotropic conductive film, the anisotropic conductive film is formed on the terminal and on the module substrate near the terminal. Transfer the film. Since the easy transfer processing of the anisotropic conductive film is performed on the antenna coil forming surface of the module substrate, the anisotropic conductive film can be satisfactorily transferred to both the terminal and the module substrate near the terminal.

According to another aspect of the present invention, there is provided a method for manufacturing an IC card, comprising the steps of: forming an antenna coil having terminals on a module substrate; Performing an easy transfer treatment of an anisotropic conductive film, transferring an anisotropic conductive film onto at least the terminals, and positioning an IC chip having bumps on the anisotropic conductive film by positioning the bumps and the terminals. Together with the process of placing
A step of crimping the IC chip so that the bumps and the terminals are electrically connected via the anisotropic conductive film; and an IC chip on at least the IC chip mounting surface side of the module substrate to which the IC chip is crimped. Laminating a card base material.

The method of manufacturing an IC card according to the present invention is as follows.
An antenna coil having terminals is formed on a module substrate, and at least an antenna coil forming surface of the module substrate is subjected to easy transfer processing of an anisotropic conductive film. Next, the anisotropic conductive film is transferred onto at least the terminals, and the IC chip having the bumps is placed on the anisotropic conductive film with the positions of the bumps and the terminals aligned. The IC chip is crimped so that the terminals and the terminals are electrically connected, and the IC card base material is laminated on at least the IC chip mounting surface side of the module substrate to which the IC chip is crimped.

According to the method of manufacturing an IC card of the present invention described above, the surface of the module substrate on which the antenna coil is formed is subjected to easy transfer of the anisotropic conductive film before transferring the anisotropic conductive film. The anisotropic conductive film can be transferred onto various material surfaces in good condition with good yield, and productivity and yield can be improved.

The method of manufacturing an IC card according to the present invention is as follows.
Preferably, the easy transfer treatment of the anisotropic conductive film is a corona discharge treatment or an ultraviolet irradiation treatment. Thereby, an effective easy transfer process can be performed.

The method of manufacturing an IC card according to the present invention is as follows.
Preferably, in the step of transferring the anisotropic conductive film, the anisotropic conductive film is transferred onto the terminal and onto the module substrate in the vicinity of the terminal.
Since the easy transfer processing of the anisotropic conductive film is performed on the antenna coil forming surface of the module substrate, the anisotropic conductive film can be satisfactorily transferred to both the terminal and the module substrate near the terminal.

The method of manufacturing an IC card according to the present invention is as follows.
Preferably, in the step of laminating the IC card base material, lamination is performed from both sides of the module substrate to which the IC chip is pressed. Thereby, an IC card in which both surfaces of the IC module are laminated with the IC card base material can be formed.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1A is a plan view of the IC module, and FIG. 1B is a sectional view taken along line XX ′ in FIG. 1A. An antenna coil 2 having a terminal 2a is formed on a module substrate 1, and an IC chip 3 having a bump 3a on a terminal 2a region is formed by dispersing conductive particles 4a in a binder 4c. It is adhered by the film 4. Here, the bump 3a is connected to the antenna coil 2 via the conductive particles 4a in the anisotropic conductive film 4.
This is a flip-chip mounting mode in which the bump side 3a of the IC chip 3 is mounted facing the module substrate 1 electrically.

A method for manufacturing the above IC module will be described. First, as shown in FIG.
S (acrylonitrile-butadiene-styrene copolymer), PET (polyethylene terephthalate), PVC
(Vinyl chloride), PE (polyethylene), etc., a method of vapor-depositing a metal such as aluminum or bonding a metal foil on a module substrate 1 made of PE (polyethylene) and etching the antenna coil into a pattern of silver or copper. The antenna coil 2 having the terminal 2a is formed by a method of printing a pattern of the antenna coil using conductive ink or a method of attaching a coil of copper or the like.

Next, as shown in FIG. 2B, the surface of the module substrate 1 on which the antenna coil 2 is formed is subjected to an easy transfer process of an anisotropic conductive film. Here, as the easy transfer process of the anisotropic conductive film, for example, (oscillator output: 1.0 k
W, irradiation distance (distance from irradiation rod to irradiated surface): 1.
0 mm, processing speed: 0.76 m / min), or using, for example, an excimer laser (output: 20 W (irradiation area: 5 mW / cm ² )).
(Irradiation distance: 1.0 mm, irradiation time: 0.5 second).

Next, as shown in FIG. 3C, after the anisotropic conductive film 4 containing the conductive particles 4a is cut into a desired length, a heater tool is cut from the upper surface of the anisotropic conductive film 4. (Not shown) press while heating, after depressurizing,
The anisotropic conductive film 4 is transferred from the release paper 4b onto the terminal 2a region of the antenna coil 2 (temporary pressure bonding). Here, the anisotropic conductive film 4 is formed, for example, by forming conductive particles 4a, which are particles in which a conductive film such as silver is formed on the surface of a resin ball, into a binder 4c made of a thermosetting resin, a thermoplastic resin, or a mixture thereof. It is a film dispersed and formed inside.

In the step of transferring the anisotropic conductive film 4 onto the terminal 2a area of the antenna coil 2 as described above, the tape-shaped anisotropic conductive film 4 together with the release paper 4b is used. After being cut into a desired length L, the image is transferred onto the terminal 2 a region of the antenna coil 2. Here, as a method of cutting the anisotropic conductive film 4 into a desired length L, the anisotropic conductive film 4 is automatically fed by the length L, and cut at a position HC to an intermediate depth of the release paper 4b. Then, the half-cut method in which only the anisotropic conductive film is transferred onto the module substrate, and the anisotropic conductive film 4 is automatically fed by a length L, and the anisotropic conductive film 4 and the release paper 4b are moved at the position FC. There is a full cut method in which the sheet is cut together, the anisotropic conductive film 4 is attached to the module substrate together with the release paper 4b, and the release paper 4b is finally released in a later step.

Next, as shown in FIG. 3D, the IC chip 3 is mounted on the anisotropic conductive film 4 so that the bump 3a of the IC chip 3 and the terminal 2a of the antenna coil 2 are aligned. The anisotropic conductive film 4 is pressed while being heated by the heater tool 5 to crush the anisotropic conductive film 4 between the bumps 3a and the terminals 2a. And the resin (adhesive) such as a thermosetting resin serving as a binder for the anisotropic conductive film 4 is cured, and the IC chip 3 is fixed on the anisotropic conductive film 4 (final pressure bonding). Above,
An IC module as shown in FIG. 1 can be manufactured.

According to the method for manufacturing an IC module of the present embodiment, since the surface of the module substrate on which the antenna coil is formed is subjected to easy transfer of the anisotropic conductive film before transferring the anisotropic conductive film. , Transfer the anisotropic conductive film to various material surfaces in good condition with good yield,
Productivity and yield can be improved.

Example 1 An anisotropic conductive film (50 μm thick, in which conductive particles are dispersed in a thermosetting resin) was coated on a PET film (100 μm
Thickness) is pressed while heating with a heater tool, and the anisotropic conductive film is transferred onto the PET film (temporary pressure bonding)
A test was conducted. Here, the conditions for the transfer (temporary pressure bonding) were (temperature: 100 ° C., pressing thrust: 1.5 kg, anisotropic conductive film size: width 2 mm, length 10 mm). Also, as an easy transfer process before transferring the anisotropic conductive film, an ultraviolet irradiation process using an excimer laser (output:
20W (irradiation area: 5mW / cm ^2), irradiation distance:
1.0 mm, irradiation time: 0.5 second) or corona discharge treatment (oscillator output: 1.0 kW, irradiation distance (distance from irradiation rod to irradiated surface): 1.0 mm, processing speed:
(0.76 m / min) or a sample not subjected to the easy transfer treatment was prepared, and the transfer pressure bonding time was set to 0.3, 0.5, 0.7 and 1.0 seconds for each sample. The sticking property of the anisotropic conductive film was measured as a yield. Table 1 shows the results. In the table, fractions in parentheses indicate the total number of samples in the denominator and the number of samples in which the numerator was satisfactorily transferred, and indicate the yield in percentage.

[0032]

[Table 1]

As shown in Table 1, the sample which was not subjected to the easy transfer treatment (untreated) had 5 times even when the pressing time was extended to 1.0 second.
Although only a yield of 9.3% can be obtained, the yield can be improved to 100% by performing an ultraviolet irradiation treatment using an excimer laser, and the pressing time can be reduced to 0% by performing a corona discharge treatment. Even if the time is reduced to 3 seconds, the yield can be improved to 100%.

Example 2 Aluminum foil (30 μm thick) on an IC card base material for IC card made of PET film (100 μm thick)
To form an antenna coil and terminals by etching, and press the anisotropic conductive film (50 μm thick) on the aluminum foil by heating it with a heater tool. A test for transfer (temporary pressure bonding) was performed. Here, the transfer (temporary pressure bonding) conditions were the same as in Example 1.

[0035]

[Table 2]

As shown in Table 2, for the sample not subjected to the easy transfer treatment (untreated), if the pressing time is reduced to 0.3 seconds, the sticking property is reduced and a 100% yield cannot be obtained.
By applying an ultraviolet irradiation treatment or a corona discharge treatment using an excimer laser, the bonding time is from 0.3 seconds to 100 seconds.
% Yields can be obtained.

Example 3 A silver conductive ink used as an antenna coil was screen-printed to a thickness of 10 μm on an IC card base material for an IC card made of a PET film (100 μm thick), and the conductive ink printed surface was formed. A test was conducted in which the anisotropic conductive film was pressed while being heated by a heater tool, and the anisotropic conductive film was transferred (temporarily pressed) onto a silver-based conductive ink. Here, the transfer (temporary pressure bonding) conditions were the same as in Example 1, and for the sample not subjected to the easy transfer treatment and the sample subjected to the corona discharge treatment (the same conditions as in Example 1) as the easy transfer treatment. The test was performed.

[0038]

[Table 3]

As shown in Table 3, the sample which was not subjected to the easy transfer treatment (untreated) had a thickness of 8 even when the pressing time was extended to 1.0 second.
Although only a yield of 3.3% can be obtained, it is possible to improve the yield to 100% even if the pressing time is reduced to 0.3 seconds by performing corona discharge treatment.

The present invention is not limited to the above embodiment.
For example, in the embodiment, the IC module for an IC card is described. However, it is possible to form an IC card by incorporating the above-described IC module into a card base material, and further, the IC chip is pressed. It is also possible to make an IC card by laminating an IC card base material on at least the IC chip mounting surface side of the module substrate or both surface sides of the module substrate. The module substrate and the card substrate may have a single-layer configuration or a multilayer configuration. Further, the IC card may be a hybrid IC card incorporating both a contact IC module and a non-contact IC module. In addition, various changes can be made without departing from the spirit of the present invention.

[0041]

According to the method for manufacturing an IC module or the method for manufacturing an IC card of the present invention, the anisotropic conductive film can be easily transferred to the antenna coil forming surface of the module substrate before the anisotropic conductive film is transferred. By performing the treatment, the anisotropic conductive film can be transferred onto various material surfaces in good condition with good yield, and productivity and yield can be improved.

[Brief description of the drawings]

FIG. 1A is an IC according to an embodiment of the present invention.
FIG. 1B is a plan view of the module, and FIG. 1B is a cross-sectional view taken along line XX ′ in FIG.

FIG. 2 is a cross-sectional view showing a manufacturing process in a method for manufacturing an IC module according to an embodiment of the present invention, and FIG.
Shows the steps up to the step of forming the antenna coil, and (b) shows the steps up to the step of performing the easy transfer process.

FIG. 3 is a sectional view showing a step subsequent to that of FIG. 2;
(C) shows up to the transfer (temporary pressure bonding) step of the anisotropic conductive film, and (d) shows up to the final pressure bonding step of the IC chip.

FIG. 4 (a) is a plan view of an IC module according to a conventional example, and FIG. 4 (b) is XX ′ in FIG. 4 (a).
FIG.

5A and 5B are cross-sectional views showing a manufacturing process in a method of manufacturing an IC module according to a conventional example, in which FIG. 5A shows a process up to forming an antenna coil, and FIG. 5B shows an anisotropic conductive film. Until the transfer (temporary pressure bonding) step, (c) shows up to the final pressure bonding step of the IC chip.

FIGS. 6A and 6B are cross-sectional views for explaining the structure and function of the anisotropic conductive film. FIG. 6A shows up to the step of mounting an IC chip in the manufacturing process, and FIG. The process up to the final pressure bonding step of the IC chip is shown.

FIGS. 7A and 7B are schematic diagrams showing a method of cutting an anisotropic conductive film into a desired length, wherein FIG. 7A shows a half-cut method and FIG. 7B shows a full-cut method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Module board, 2 ... Antenna coil, 2a ... Terminal, 3 ... IC chip, 3a ... Bump, 4 ... Anisotropic conductive film, 4a ... Conductive particles, 4b ... Release paper, 4c ... Binder, 5 ... Heater tool, 40: resin ball, 41: conductive film, 42: insulating film.

Claims (9)

[Claims] A step of forming an antenna coil having terminals on a module substrate; a step of easily transferring an anisotropic conductive film to at least the antenna coil forming surface of the module substrate; Transferring an anisotropic conductive film, placing an IC chip having a bump on the anisotropic conductive film with the positions of the bumps and the terminals aligned, and via the anisotropic conductive film A method of crimping the IC chip so that the bumps and the terminals are electrically connected to each other. 2. An easy transfer treatment of the anisotropic conductive film,
2. The IC for an IC card according to claim 1, which is a corona discharge treatment.
Module manufacturing method. 3. An easy transfer treatment of the anisotropic conductive film,
2. The IC for an IC card according to claim 1, which is an ultraviolet irradiation treatment.
Module manufacturing method. 4. The method according to claim 1, wherein, in the step of transferring the anisotropic conductive film, the anisotropic conductive film is transferred onto the terminal and onto the module substrate in the vicinity of the terminal. Of manufacturing an IC module for an IC card. 5. A step of forming an antenna coil having terminals on a module substrate; a step of easily transferring an anisotropic conductive film to at least the antenna coil forming surface of the module substrate; Transferring an anisotropic conductive film, placing an IC chip having a bump on the anisotropic conductive film with the positions of the bumps and the terminals aligned, and via the anisotropic conductive film A step of crimping the IC chip so that the bumps and the terminals are electrically connected; and a step of laminating an IC card substrate on at least the IC chip mounting surface side of the module substrate to which the IC chip is crimped. Of manufacturing an IC card having the same. 6. An easy transfer treatment of the anisotropic conductive film,
The method for manufacturing an IC card according to claim 5, wherein the method is a corona discharge treatment. 7. An easy transfer treatment of the anisotropic conductive film,
6. The method for manufacturing an IC card according to claim 5, wherein the method is an ultraviolet irradiation treatment. 8. The method according to claim 5, wherein in the step of transferring the anisotropic conductive film, the anisotropic conductive film is transferred onto the terminal and onto the module substrate in the vicinity of the terminal. Method for manufacturing an IC card. 9. The method for manufacturing an IC card according to claim 5, wherein, in the step of laminating the IC card base material, the IC chip is laminated from both sides of the module substrate to which the IC chip is crimped.