JP2000074739A - Manufacturing method of electronic components - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To facilitate the mounting of fragile members, improve the efficiency of processes, and contribute to the reduction in size and cost of components, particularly for a pyroelectric infrared sensor. SOLUTION: An element member row 12 is formed by arranging a plurality of elements close to each other on a substrate 11 and temporarily bonded to a jig 13, and then the substrate 11 is removed by etching. Thereafter, they are superimposed on the mounting substrate, and are bonded in half at one place in the vertical and horizontal directions, separated from the jig and mounted, and the other half is similarly performed later. Since there is no need to cut off on the substrate, material costs and man-hours can be reduced, and after mounting, if the elements are cut diagonally, the elements can be divided with almost no damage. By this method, a thin-film pyroelectric infrared sensor can be easily assembled, which contributes to downsizing and cost reduction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to sensors, oscillators, etc.
The present invention relates to a method for manufacturing a small electronic component.

[0002]

2. Description of the Related Art Various methods for mounting components on a substrate have been devised and widely used.

FIG. 7 is a perspective view showing an example of a method called a face-down method. 7, reference numeral 71 denotes a member, 72 denotes a member electrode, 73 denotes a bump, 74 denotes a substrate, 75
Is a wiring pattern. The member 71 has an IC or the like mounted therein and is electrically connected to the outside by the member electrode 72. The bump 73 is formed on the member 71 using a capillary or the like. Thereafter, the bump 73 is leveled by a method such as pressing against a flat plate to form a flat portion. Thereafter, a conductive paste is applied to the bump 73 and the wiring pattern 75 on the substrate 74 is mounted by a mounting machine such as a flip chip bonder.
After being heated by a curing furnace, it is mounted on the substrate 74. Thereafter, a resin material for sealing is applied to the electrode portions joined in some cases. In addition to this method, it is also possible to form bumps on the electrodes on the substrate side.

FIG. 8 is a perspective view showing an example of a mounting method called a face-up method. 8, 81 is a substrate, 82 is a land, 83 is a wiring pattern, 84 is a member, and 85 is a member electrode. Land 8 on substrate 81
2. A wiring pattern 83 is provided, and a place for attaching a member 84 is provided. The member 84 is placed on the substrate 81 by the die bonder with the member electrode 85 on the opposite side of the substrate 81, and is joined by an adhesive or the like. Thereafter, the land 82 and the member electrode 85 are connected by a wire bonder using a wire 86 which is a thin metal wire.
3 and the member 84 are electrically connected.

[0005] As described above, bumps are formed on the electrodes by a bump bonder or plating, and the members are sequentially placed on a substrate by a mounting machine, and the entire body is heated, or the members are placed on the mounting machine and heated at the same time. And the member are completely joined. In addition, in order to make the member electrodes and the substrate conductive, they are generally connected by a gold wire or the like. There are many other concrete methods, and they are used as needed.

As an example of these applications, an example of a pyroelectric infrared sensor having a thin film material in an element portion will be described. FIG. 9 is a perspective view showing a part of a mounting form of a conventional pyroelectric infrared sensor.

In FIG. 9, reference numeral 91 denotes an element portion, 92a, 9
2b is a wire, 93 is a stem. The element section 91 is mounted on the center of the stem 93 by a die bonder. The electrode part of the rear element part 91 and the foot for taking out output to the outside provided on the stem 93 are connected by wires 92a and 92b by a wire bonder.

FIG. 10 is a perspective view showing the details of the element portion of the pyroelectric infrared sensor. 10, 101 is a substrate, 102a and 102b are electrode portions, 103 is a light receiving portion,
104 is an etching hole, 105 is a cavity part.
The element portion is formed on the substrate 101 by using a thin film forming method such as sputtering, and a patterning technique such as photolithography and etching. The light receiving section 103 has a pyroelectric element section mainly made of PLT or the like, and a three-layer structure in which the electrode sections 102a and 102b vertically sandwich the pyroelectric element section. The entire surface is covered with a thin resin such as polyimide, and an etching hole 104 is provided in a part. Etching hole 1
The substrate 101 is brought into contact with the etching solution only at the portion 04,
The substrate 101 immediately below the light receiving unit 103 is removed to form a cavity 105. When infrared light enters the light receiving section, the temperature of the pyroelectric element section rises, and charges are generated by the pyroelectric effect.
This electric charge is taken out by the upper and lower electrodes and used as an output signal. At this time, if the substrate exists immediately below the light receiving unit, the escape of heat to the substrate will hinder the temperature rise of the pyroelectric element unit, and the output signal level will be greatly reduced. Therefore, the sensitivity of the sensor can be improved by hollowing the area directly below the light receiving section.

A plurality of pyroelectric infrared sensor elements are simultaneously formed on one substrate and are divided into individual pieces by dicing or the like. FIG. 11 shows a perspective view of a substrate on which elements are formed.

In FIG. 11, reference numeral 111 denotes a substrate, and 112 denotes a row of element members. Each element member in the element member row 112 is arranged with a space required for cutting each other. For example, when a dicing blade of 100 microns is used, a distance of about 200 microns is provided. After division into individual pieces, they are mounted on the stem as described above.

[0011]

In recent years, members such as a vibrator and a sensor element have become lighter and thinner and smaller. Electrode formation and the like are required. If the member is fragile, problems such as breakage during transportation, deformation due to pressure during mounting, and the like become problems. In particular, when the member is a foil, it is difficult to accurately position the member due to deformation due to contact with the jig or warping of the member itself. In addition, the components are attracted to the mounting tool or jig by static electricity, etc.,
Problems such as the inability to carry and mount efficiently occur. In addition, in order to accurately position the fine and fragile member and securely join it to the substrate, careful work is required, and the cost increases due to a decrease in work efficiency and a decrease in yield. In addition, when joining the members, if the positioning and pressurization are left by the tool mounting, the machine is restrained for a long time, and the operating rate is reduced. In the case where there is no positioning and pressurization, a displacement occurs due to the flow of the bonding paste or the like, and high-precision mounting cannot be performed. In addition, in many cases, the characteristics of the vibrator or the like are deteriorated by contact with other components, and it becomes more difficult to mount the vibrator when it is necessary to hold the vibrator in a hollow state.

In the case of a pyroelectric infrared sensor, since a cavity is provided immediately below a thin film element, it is damaged by a slight external force, and handling during mounting is difficult. Also, since it is necessary to accurately place the element on the optical path of the incident infrared light,
Accurate positioning is required. When a die bonder or the like is used for this mounting, the elements are transported, positioned, and mounted by a tool. However, the time at this time is directly reflected in the production capacity, and the number of manufactured elements is limited. In addition, man-hours such as providing wiring with a wire or the like are required, and the volume of the wire portion and the substrate portion is required, so that it is difficult to reduce the size of the product.

In addition, according to the conventional method, after a plurality of members are formed on a substrate, they are often divided and mounted by a method such as dicing. In this case, an interval for cutting is provided between the members. It is necessary to provide. For example, if there is a gap of 0.2 mm for a member with a size of about 1 mm,
About 20% of the entire substrate is consumed in one direction, and about 40% of the total length and width is consumed irrespective of the formation of the member. For this reason, the number of pieces per substrate is limited, which increases the cost. Even if the members are reduced in size to reduce the material cost, the effect is greatly reduced. The MgO substrate or the like used in the pyroelectric infrared sensor according to this conventional example is relatively expensive, and the price is greatly affected by the number of substrates per substrate.

The present invention provides a method for more efficiently and accurately mounting fragile and short members, and a method and an electronic component that contributes to a reduction in the number of steps and material costs by increasing the number of pieces per board. The purpose is to do.

[0015]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention provides a jig having a flat plate shape, a member to be mounted is temporarily fixed together with a substrate with a resin, and then the substrate is removed. After positioning, pressurize,
The member and the member mounting substrate are joined by heating or the like. After that, the resin that temporarily fixes the jig and the member is removed, so that the member is completely transferred onto the member mounting substrate. The members on the substrate are formed in advance in a separated state. Further, in the dividing method after mounting, the members are mounted on a member mounting board at intervals, the members after mounting are spaced apart, and the members are divided along a portion where there is no member. In this case, the transfer from the jig to the member mounting substrate is performed twice or more per substrate on which one part is formed, and is performed on each of the different member mounting substrates. Implement. As a dividing method, a groove is formed in the member mounting substrate in advance along the dividing direction, and a stress is applied after the member is mounted and the member is divided along the groove. Alternatively, a member mounting substrate which is divided in advance and arranged in alignment is used.

In the production of the pyroelectric infrared sensor, the element portion is mounted by the above-described method, a cavity is provided in advance in a portion immediately below the element portion on the member mounting substrate, and the member has conductivity and is melted and solidified. A possible electrode and a hole for conducting the electrode on the back side are provided, and the electrode of the element portion and the electrode of the member mounting substrate are joined to perform mounting.

[0017]

The invention according to claim 1 of the present invention comprises a step of forming a plurality of members on a substrate, a step of bonding the substrate to a jig with the component side interposed between the jig and the jig, A method of manufacturing an electronic component, comprising: a step of removing a substrate portion while leaving only the member; a step of joining the member to a member mounting substrate having electrodes formed thereon; and a step of separating the jig and the member. It is easy to handle short and small fragile members,
It has the effect that it can be implemented.

According to a second aspect of the present invention, there is provided the electronic component manufacturing method according to the first aspect, wherein the members formed on the substrate are formed in a state separated from each other. In addition, since the members are arranged in good alignment, there is an effect that the number of man-hours for dividing the members and positioning the members on the jig are reduced.

According to a third aspect of the present invention, a plurality of members are
The method for manufacturing an electronic component according to claim 2, wherein a plurality of members are simultaneously bonded to the member mounting substrate and the jig and the member are separated in a state where a plurality of or more intervals are provided. After the members in the dense state are mounted on the member mounting board, it can be kept at a certain interval, and if the same is done for the remaining members, all the members can be mounted with an interval, and then Is easy to divide and handle. In addition, when creating members on a substrate, there is no need to leave a space necessary for cutting to divide the members, etc., and the space can be minimized, so the number of pieces per substrate increases. Thus, the number of steps and material costs can be reduced, and this effect becomes more remarkable as the members become smaller.

According to a fourth aspect of the present invention, a member is formed which is densely aligned and arranged vertically and horizontally on a substrate, and each of the members is divided and adhered to a jig. Open and mount about half of the components on the component mounting board first,
The electronic component manufacturing method according to claim 3, wherein the remaining approximately half of the members are mounted on another member mounting substrate, and the division of the member mounting substrate is performed diagonally along a portion where the members are not mounted. Yes, the mounting of the member on the member mounting board can be efficiently completed in almost the minimum number of times of two times, and the division is the same as usual, only breaking the very small part near the corner of the mounted member It has an effect that it can be easily performed.

According to a fifth aspect of the present invention, the substrate is provided with a groove along the dividing direction, and after the members are joined, the groove is divided by applying stress. The method for manufacturing an electronic component according to the item (1), which has an effect that the member mounting board after the member mounting can be divided efficiently in a short time.

According to a sixth aspect of the present invention, there is provided a method for manufacturing a component or an apparatus according to any one of the second to fourth aspects, wherein the member or the substrate is divided and the member may be damaged after mounting. And has the effect that safer products can be produced.

According to a seventh aspect of the present invention, a resin for dissolving with a solvent is used as a resin for bonding a jig and a member, and a through hole is provided in a jig portion immediately below a member to be transferred first.
4. The method for manufacturing an electronic component according to claim 3, wherein the member and the jig are separated by immersing in a solvent after joining the member and the member mounting board, and the jig and the member can be easily separated from each other. The solvent penetrates through the holes to allow the members to be selectively peeled off, and has an effect that only the member at the portion to be mounted can be peeled off.

According to an eighth aspect of the present invention, as the adhesive material for the jig and the member, a material having a property that the adhesive force is reduced by light such as ultraviolet rays is used, and the material of the jig is capable of transmitting the light. 4. The method for manufacturing an electronic component according to claim 3, wherein the member to be mounted later is shielded from light, and only the part to be mounted first is irradiated with light, and then the member and the jig are separated. In addition, only the member to be mounted can be easily peeled off with good selectivity.

According to a ninth aspect of the present invention, there is provided an electrode made of a material having conductivity and capable of melting and coagulating a member mounting substrate, a hole for conducting the electrode to the back surface of the substrate, and a pyroelectric infrared ray. 4. The method for manufacturing an electronic component according to claim 3, wherein a cavity or a through hole is provided immediately below the light receiving portion of the sensor element, wherein the member can be easily mounted by melting and solidifying the electrode of the member mounting substrate. The cavity directly below prevents the pyroelectric infrared sensor from deteriorating its characteristics, and has the effect of facilitating conduction to the outside by conducting through the through hole to the back surface.

According to a tenth aspect of the present invention, the element member of the pyroelectric infrared sensor having the shape of a foil or a flat plate has an output detection electrode on one side, and the element member is pressed against the substrate to be electrically conductive. The substrate is joined at the electrode portion by a conductive material, a through hole is provided in a portion immediately below the joint portion of the substrate, and a conductive material is applied in the through hole to allow conduction with the back surface of the substrate, and the element 10. The method for manufacturing an electronic component according to claim 9, wherein a cavity is provided in a substrate portion immediately below the light receiving portion of the member, and the hollow portion immediately below the light receiving portion receives light even when the pyroelectric infrared sensor element is pressed against the member mounting substrate. Since the part is held in the air, high sensitivity is maintained without hindering the temperature rise at the time of light reception,
In addition, since it can be bonded firmly to crimping, a more reliable product can be manufactured. In addition, since the back surface is electrically connected by a through hole, sensor output can be easily performed only by surface mounting on another substrate. Since there is no need for a configuration and operation such as taking out the device outside and further conducting a wire with a wire as in the related art, it has an effect that the size can be significantly reduced along with the thinning of the element and the number of steps can be reduced. .

FIG. 1 is a perspective view showing members formed on a substrate and a jig for bonding the members. In FIG. 1, 11
Denotes a substrate, 12 denotes an element member row, and 13 denotes a jig. Here, a pyroelectric infrared sensor element will be described as an example of the element member. The substrate 11 has a flat plate shape using MgO as a material. The element member row 12 includes thin film formation and photolithography,
It is formed by precision technology such as etching. The element member row 12 is composed of a plurality of pyroelectric infrared sensor elements arranged in rows and columns with good alignment. Each is divided at a minute interval.

A single pyroelectric infrared sensor element is mainly composed of a PLT thin film having pyroelectric characteristics, Pt electrodes provided above and below the PLT thin film for taking out a sensor output to the outside, and a polyimide film for reinforcing the strength. The element central portion has a structure in which an electrode, a PLT, an electrode, and a polyimide film are sequentially stacked from the substrate 11 side. As a process of mounting the pyroelectric infrared sensor element, first, a jig 13 on a flat plate and the substrate 11 are bonded while sandwiching and positioning the element member row 12.

As the adhesive material, a material which dissolves in a solvent such as acetone or a material whose viscosity is reduced by irradiation with ultraviolet rays so that it can be peeled later is used. Jig 1
3 is made of a material such as glass so as to match the coefficient of thermal expansion with the substrate 11 or to transmit ultraviolet rays. After gluing,
The substrate 11 is immersed in a phosphoric acid aqueous solution or the like.
Is completely removed. At this time, a foil-like element member row with the electrodes facing upward is formed on the jig 13.

FIG. 2 is a perspective view showing a state in which a foil-like element member row is formed on a jig.
Is a jig.

FIG. 3 is a perspective view showing a member mounting board. In FIG. 3, 31 is a mounting substrate, 32a and 32b are convex electrodes, and 33 is a cavity. Convex electrodes 32a, 32
b is made of a solder material, has a height of about 0.1 mm, and corresponds to one pyroelectric infrared sensor element as a pair, and is joined to the electrode of the pyroelectric infrared sensor element. Gain continuity. Although not shown, the convex electrode 32
A through-hole is provided directly below a and 32b, and the through-hole is also filled with a solder material, so that conduction with the back side of the mounting board 31 is possible.

A hollow portion 3 is provided between the convex electrodes 32a and 32b immediately below the light receiving portion of the pyroelectric infrared sensor element.
3 is provided, and after the pyroelectric infrared sensor element is mounted, the light receiving section is held hollow. The convex electrodes 32a and 32b and the cavity 33 are integrally formed and correspond to one pyroelectric infrared sensor element, and a plurality of the electrodes are located on the entire surface of the mounting substrate 31. At this time, all the electrodes and the cavities are arranged so as to correspond to the positions of the above-mentioned element member rows, and to provide one space in each of the vertical and horizontal directions of the member element rows.

When the member mounting substrate and the jig having the element member row are positioned and overlapped, and heated while applying pressure, the solder melts, the convex electrodes are crushed, and after cooling, the pyroelectric infrared The sensor electrode is joined to the member mounting substrate. After this, the bonding force of the adhesive between the jig and the pyroelectric infrared sensor element is reduced by a method such as solvent immersion, and only the pyroelectric infrared sensor element bonded to the electrode when the jig and the mounting substrate are peeled off, It is transferred to a mounting substrate and mounted.

FIG. 4A is a perspective view showing a jig after the above-described element mounting step, and FIG. 4B is a perspective view showing a mounting substrate.

4 (a) and 4 (b), reference numeral 41 denotes an element member row a, 42 denotes a jig, and 43 denotes an element member row b, 44.
Denotes a mounting board. An element member row b43 mounted on the mounting substrate 44 is provided on the surface, and the element member row b43 is formed by pyroelectric infrared sensor elements arranged at intervals of one row and one row. On the surface of the jig 42, an element member row a41 composed of the remaining pyroelectric infrared sensor elements not mounted is formed.

With respect to the element member row a41 left on the jig 42, another new mounting board is prepared, and it is relatively inverted from the previous step by 180 degrees for positioning, and the same steps are followed. And mounting is completed for all pyroelectric infrared sensor elements. Thereafter, the mounting substrate is divided into individual pieces. At this time, the dicing is performed diagonally along a portion where the pyroelectric infrared sensor element is not mounted.

FIG. 5 is a perspective view showing a method of cutting the mounting substrate. In FIG. 5, reference numeral 51 denotes a mounting board, 52 denotes an element member row, and 53 denotes a cutting line group. The cutting line group 53 is formed along the unmounted portion in the element member row 52, and is formed by wrapping around a very small portion of the corner of the pyroelectric infrared sensor element forming the element member row 52. When dividing by a method such as dicing or the like, cutting is performed while shaving a portion of a dicing blade width of about 100 microns along a cutting line group. At this time, the cutting is performed while cutting the corners of the pyroelectric infrared sensor element with a small area. The pyroelectric infrared sensor elements mounted in this way are each divided into individual pieces, and are then mounted on another substrate and then incorporated into the sensor system.

FIG. 6A is a perspective view showing the structure of a pyroelectric infrared sensor formed in the present embodiment.
(B) is a sectional view of the same.

6A and 6B, reference numeral 61 denotes a mounting board, 62 denotes a light receiving section, 63 denotes a lower electrode section, 64 denotes an upper electrode section, 65 denotes a mounting board, 66 denotes an element section, and 67 denotes a mounting section. Is a hollow portion, and 68a and 68b are through-hole electrode portions. The element portion 66 has a light receiving portion 62 at the center, the light receiving portion 62 has an electrode leading to the lower electrode portion 63, a PLT thin film which is a pyroelectric material,
It has a laminated structure of the upper electrode portion 64, and the entire surface is covered with a polyimide film and reinforced in strength. The element section 66 is press-fitted to the mounting board 61 or 65, and the through-hole electrode sections 68a and 68b are filled with a solder material, and are joined to the lower electrode section 63 and the upper electrode section 64, thereby joining the element section 66 to the mounting board 61. And 65.

Further, a cavity 67 is provided in the mounting boards 61 and 65 immediately below the light receiving section, so that the escape of heat when infrared rays enter the light receiving section can be suppressed, and the output as a sensor can be increased. Since it is composed of a thin film, its volume is small, and in the case of the same incident infrared ray, sensitivity can be made larger than that of a light-receiving portion having a large thickness. In addition, according to this configuration, the height of the sensor element is substantially due to the thickness of the mounting substrate and the thickness of the sensor element member, and mounting on another substrate can be easily performed by surface mounting, so that it is easy to handle and no wires are required. The height can be reduced in addition to other factors. In addition, since the mounting substrate is provided around the sensor element member, positioning, transport, and the like are easier and workability is better than when only a small sensor element member is handled.

As described above, according to the present manufacturing method, a small and fragile member can be handled easily and safely.
It is possible to simultaneously mount a plurality of members precisely.
Further, since the members can be arranged closer to each other on the substrate, the number of steps can be reduced and the material of the substrate can be reduced. This effect becomes more remarkable as the members become smaller. In addition, by arranging the arranged members several by one and mounting them sequentially, the subsequent cutting process is easy and there is almost no damage to the members, and mounting, transportation after cutting, positioning and the like are easy.

In order to make the work easier, fine holes can be provided in the jig every other vertical and horizontal positions at positions corresponding to the element member rows. According to this, by immersion in the solvent at the time of peeling, the solvent penetrates also from the above-mentioned fine holes, and the element member in the fine hole portion is quickly separated, so that only the element member portion mounted first is selectively peeled. In addition, it is possible to prevent another element member from falling off, and to prevent a problem that the solvent is partially spread due to the invasion of air bubbles and separation cannot be performed. Alternatively, the same effect can be obtained by using a resin having a property of decreasing the viscosity by light such as ultraviolet light. In this case, using a mask such that portions other than the element members to be mounted first are shielded from light,
Selectivity is given to a portion where viscosity is reduced by irradiating light to the whole.

In the case where it is not desirable that the corners of the element members are damaged when the mounting substrate is cut, there is a method of applying a stress instead of cutting the mounting substrate to divide it. In this case, since the mounting substrate is only broken, it is possible to prevent the element members from being damaged. Further, if grooves are provided in advance on the mounting substrate along the dividing direction, or if grooves are provided and divided after mounting the element members, division can be performed with higher accuracy. Alternatively, it is also possible to divide the mounting substrate in advance, align the divided mounting substrate on another member and paste it, and remove each after mounting the element members. In this case, the possibility of damaging the element members is further increased. Low.

[0044]

As described above, according to the present invention, a fragile member such as a foil can be easily handled, and damage to the member can be prevented. Further, since mounting of a plurality of members can be collectively performed with high accuracy, productivity is improved. By forming members densely on a substrate, the number of pieces per operation increases and productivity is improved. In addition, the cost of the substrate is reduced by reducing the material cost, and the size of the members can be reduced. In addition, a greater effect can be obtained. In addition, mounting is performed sequentially at intervals in the vertical and horizontal directions of the element member row, and the mounted board is divided along a portion where the member is not mounted, so that a space for division can be secured. Since there is a substrate around, positioning, transportation, etc. are easy, and workability in the post-process is good.

In the manufacture of a pyroelectric infrared sensor, the present invention is provided by providing an electrode for fixing an element member on a member mounting substrate, a through-hole immediately below the electrode filled with an electrode material, and a cavity immediately below a light-receiving portion. In addition to obtaining the above-mentioned effects, the process described in (1) can reduce the height of the pyroelectric infrared sensor element portion, and can omit the wire process for securing conduction, thereby reducing the size and cost. To contribute.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a mounting method according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a mounting method according to the embodiment.

FIG. 3 is a perspective view showing a mounting board in the embodiment.

FIG. 4A is a perspective view showing a mounting method according to the embodiment. FIG. 4B is a perspective view showing a state after mounting according to the embodiment.

FIG. 5 is a perspective view showing a cutting method in the embodiment.

FIG. 6A is a perspective view illustrating a configuration of a pyroelectric infrared sensor according to the embodiment. FIG. 6B is a cross-sectional view illustrating a configuration of the pyroelectric infrared sensor according to the embodiment.

FIG. 7 is a manufacturing process diagram showing a conventional mounting method.

FIG. 8 is a manufacturing process diagram showing a conventional mounting method.

FIG. 9 is a perspective view showing a configuration of a conventional pyroelectric infrared sensor.

FIG. 10 is a perspective view showing a configuration of an element section of a conventional pyroelectric infrared sensor.

FIG. 11 is a perspective view showing a substrate after a conventional pyroelectric infrared sensor is formed.

[Explanation of symbols]

 11, 81, 101, 111 substrate 12, 21, 41, 43, 52, 112 element member row 13, 22, 42 jig 31, 44, 51, 61, 65 mounting substrate 32a, 32b convex electrode 33, 67 cavity Unit 62, 103 Light receiving unit 66, 91 Element unit 68a, 68b Through-hole electrode unit

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G065 BA13 BA14 DA20 5F088 AA11 AB01 BA15 BA18 CB05 CB14 CB17 FA05 GA02 HA12 LA01

Claims (10)

[Claims] A step of forming a plurality of members on a substrate, a step of bonding the substrate to a jig with the component side interposed between the jigs, and a step of removing a substrate portion while leaving only the members.
A method for manufacturing an electronic component, comprising: a step of joining the member to a member mounting substrate having electrodes formed thereon; and a step of separating the jig and the member. 2. The method according to claim 1, wherein the members formed on the substrate are formed separately from each other. 3. The manufacturing of an electronic component according to claim 2, wherein a plurality of members are simultaneously bonded to a member mounting board and a jig is separated from the members in a state where one or more intervals are provided. Method. 4. A member which is vertically and horizontally aligned and densely formed on a substrate, and each of which is divided into pieces, is adhered to a jig and removed from the substrate. First, the component is mounted on the component mounting board, and then the remaining half of the component is mounted on another component mounting board, and the division of the component mounting board is performed diagonally along the portion where the component is not mounted. Item 4. A method for manufacturing an electronic component according to Item 3. 5. The manufacturing of an electronic component according to claim 2, wherein a groove is provided along the dividing direction, and the groove is divided by applying stress to the groove after joining the members. Method. 6. The method for manufacturing an electronic component according to claim 2, wherein a divided substrate for mounting members is used. 7. A resin for dissolving with a solvent is used as a resin for bonding the jig and the member, and a through hole is provided in a jig portion immediately below the member to be transferred first, so that the member and the member mounting board can be connected to each other. 4. The method for manufacturing an electronic component according to claim 3, wherein the member and the jig are separated by dipping in a solvent after the joining. 8. An adhesive material between the jig and the member, which has a property that the adhesive force is reduced by light such as ultraviolet rays, and the material of the jig is capable of transmitting the light, and is mounted later. The method for manufacturing an electronic component according to claim 3, wherein the member portion at which the mounting is performed is light-shielded, and only the portion to be mounted first is irradiated with light, and then the member and the jig are separated. 9. An electrode made of a material having conductivity and capable of being melted and solidified on a member mounting substrate, a hole for conducting the electrode to the back surface of the substrate, and a portion immediately below a light receiving portion of the pyroelectric infrared sensor element. 4. The method for manufacturing an electronic component according to claim 3, wherein a cavity or a through hole is provided in the electronic component. 10. An element member of a pyroelectric infrared sensor having a foil or flat plate shape has an electrode for output detection on one side, and said element member is press-bonded to a substrate and joined at an electrode portion by a conductive material. A through-hole is provided in a portion of the substrate immediately below a bonding portion, and a conductive material is applied to the inside of the through-hole so that conduction with the back surface of the substrate is possible, and the substrate directly below a light-receiving portion of the element member is provided. The method according to claim 9, wherein the portion is provided with a cavity.