JP2000061935A - Cutting method of quartz element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve cut surface properties and obtain a high dimensional accuracy by a method wherein a quartz is cut by means of a mechanical cobbing. SOLUTION: The front and rear surfaces of a quartz 2 are simultaneously cut off by rotating an outer peripheral blade 7 at a high speed and moving the quartz 2 towards a direction indicated by the arrow D. Since a cobbing work is performed through the high speed rotation of the blade 7 having the blade, the cut surface of the quartz is made of the accumulation of minute cracks, so that the roughness of the cut surface can be finished to a 0.065 μm Rmax or less, resulting in improving the surface shape and obtaining a high dimensional accuracy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal element cutting method in a crystal resonator manufacturing process.

[0002]

2. Description of the Related Art Currently, in the manufacturing process of a crystal unit,
When the crystal is cut into chips, it is processed using a thin steel strip blade. In this method, as shown in FIG. 8, a working fluid 3 in which an abrasive and a lubricating oil are mixed is continuously supplied from above a steel strip blade 1, and a quartz crystal 2 as a workpiece is constantly pressurized in a direction of an arrow B. The steel strip blade 1 is pressed against the steel strip blade 1 to reciprocate in the direction of arrow A. At this time, the abrasive 6 interposed between the crystal 2 and the steel strip blade 1 finely crushes the crystal 2 and cuts it.

[0003]

When the thin steel strip blade 1 is used to divide the crystal into chips, the steel strip blade 1 comes into contact with the crystal 2 and reciprocates in the initial stage. As shown in FIG. 9, chipping (cracking, cracking, cracking) 5 occurs at the edge portion of the chip that becomes the element, and streak-like marks 8 remain in the reciprocating movement direction on the cutting surface 4, 4 deteriorates the surface texture.

When a relatively thick crystal is cut into small pieces with a steel strip blade, the thickness at the start and the end of the cutting are different. Therefore, as shown in FIG. A dimensional difference of b (a <b) occurs. Along with this, the cut surface is perpendicular to the upper and lower surfaces (α, β, γ, δ ≠ 90
However, the accuracy of the shape decreases.

[0005] In the small division using the above steel strip blade, since a working fluid in which an abrasive and a lubricating oil are mixed is used, the abrasive grains are likely to remain in the finely crushed portion of the cut surface, and a cleaning process of several steps is required. . If the abrasive grains remain, it also affects the function of the crystal vibrating element.

The present invention has been made in view of the above-mentioned problems of the prior art, and an object thereof is to provide a quartz crystal resonator in which a mechanical property is improved in cut surface property and high dimensional accuracy is obtained. To provide a cutting method.

[0007]

The crystal element cutting method of the present invention is to rotate an outer peripheral blade such as one formed of abrasive grains or a dicing saw at a high speed, and move the crystal or the outer peripheral blade to move the outer periphery of the crystal. Cut at once with a blade.

Alternatively, the outer peripheral blade formed of abrasive grains is rotated at a high speed to move the crystal or the outer peripheral blade so that half of the thickness of the crystal is first cut, and then the crystal is turned upside down to make the crystal or outer peripheral. The blade blade is moved to cut the remaining portion of the crystal due to the cutting.

Alternatively, the first and second outer peripheral blades made of abrasive grains are provided on the upper side and the lower side of the crystal, respectively, and the first or second peripheral blade is rotated at a high speed to move the crystal. Half of the thickness of the crystal is cut from the upper side and the lower side of the crystal by the first and second peripheral blades.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIGS. 1 to 7, 2 is a crystal to be broken into small pieces, and 7 is a disk-shaped bond with abrasive grains equivalent to the abrasive used in the conventional crystal breaking with a steel strip blade. The outer peripheral blade formed in FIG.

The basic processing in the crystal slicing method of the present invention is, as shown in FIG. 1, an outer peripheral blade (diameter 52 mm, thickness 0.05 to 0.1 mm) blade 300 in the direction of arrow C.
Rotate the crystal 2 at a high speed of 00 rpm or more to process the crystal 2
It is fixed by using an adhesive tape 11 on the upper surface of the sheet and is moved together with the processing table 10 in the direction of the arrow D at a speed in the range of 0.3 to 100 mm / sec.

Embodiment 1 (One-pass cutting method) Referring to FIG. 2, the outer peripheral blade 7 is installed at a height where its lower end is slightly above the lower surface of the crystal 2 and is rotated at a high speed to produce the crystal 2
The rear end of the crystal is fixed to the processing table 10 with the adhesive tape 11 and is moved in the direction of the arrow D together with the processing table to simultaneously cut the front and back surfaces of the crystal. It is also possible to move and cut the outer peripheral blade 7.

Second Embodiment (Reverse Cutting Method) Referring to FIGS. 3 to 5, the outer peripheral blade 7 is installed so that its lower end is a little more than half the thickness of the crystal 2, and is rotated at high speed. Adhesive tape 1 with crystal 2 on top of worktable 10
1 and then moved horizontally along with the processing table 11 to process to half the thickness of the crystal 2 as shown in FIG. 3, and then as shown in FIG. 4, the crystal is turned upside down and shown in FIG. As described above, the crystal 2 is moved in the horizontal direction, and the other half is processed and cut. It is also possible to move the outer peripheral blade 7 for processing.

[0014] Embodiment 3 (upper and lower cutting method) embodiment 6, for 7, prepared upper peripheral cutting edge blade 7 _A and the lower peripheral cutting edge blade 7 _B, first, as shown in FIG. 6,
Both sides of the crystal 2 are fixed to the side surface of the processing table 10 with the adhesive tape 11, and the upper peripheral blade 7A is provided so that the lower end thereof is at a height position of about 1/2 of the thickness of the crystal 2 and is rotated at high speed to be horizontal. To a depth of about 1/2 of the thickness of the crystal 2. Thereafter, as shown in FIG. 7, the upper outer peripheral blade 7A is raised, and the lower outer peripheral blade 7B is provided at a height position where the upper end thereof is a little more than 1/2 of the thickness of the crystal 2 and is rotated at high speed to move horizontally. The upper outer peripheral blade 7A of the crystal 2
Process and cut the other half processed in. It should be noted that it is also possible to move the crystal for processing.

According to the first to third embodiments described above, since the abrasive grains of the outer peripheral blade are brought into contact with the quartz at a high speed for processing, chipping of the element edge portion can be suppressed to several μm or less. Further, since the cut surface is formed by accumulating fine crushed particles by the abrasive grains, the roughness of the cut surface is 0.065 μmRma.
It can be finished to x or less, the shape of the cut surface is improved,
High dimensional accuracy was obtained. Since the outer peripheral blade was rotated at a high speed, the cut surface did not incline due to the thickness of the crystal.

[0016]

Since the present invention is configured as described above, it has the following effects.

(1) Chipping at the element edge is several μm
It can be suppressed to the following.

(2) The surface quality of the crystal cut surface is improved.

(3) The dimensional accuracy and shape accuracy of the element are maintained.

(4) Since no loose abrasive or lubricating oil is used, it is possible to simplify the step of cleaning the quartz crystal with little residual abrasive grains.

[Brief description of drawings]

FIG. 1 is a front view showing a basic cutting process according to the present invention.

FIG. 2 is a front view for explaining the one-pass cutting method according to the first embodiment and a bottom view for omitting the processing table.

3A and 3B are a front view and a side view showing a processed state of one surface of a crystal according to a reverse cutting method according to a second embodiment.

FIG. 4 is a front view and a side view showing a processed state of the other surface.

FIG. 5 is a front view and a side view showing a state just before the completion of processing.

FIG. 6 is a front view and a side view showing a top surface processing state of a method of cutting from both sides according to a third embodiment.

FIG. 7 is a front view showing a lower surface processing state and a side view with the processing table omitted.

FIG. 8 is a top view, a front view, and a side view showing a small-sized cutting state according to a conventional example.

FIG. 9 is a perspective view showing a cross section of a crystal obtained by a conventional slicing process.

FIG. 10 is a perspective view showing the shape of a quartz crystal obtained by conventional small split processing.

[Explanation of symbols]

1 ... Steel strip blade 2 ... Crystal 4 ... Crystal plane 5… Chipping on the edge of the crystal 6 ... Abrasive material 7 ... Peripheral blade 8 ... streak marks 10 ... Processing table 11 ... Adhesive tape.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hirofumi Sudo             1-31-Torimachi, Yonezawa, Yamagata Prefecture Meidentsu             Shin Kogyo Co., Ltd. F term (reference) 3C069 AA01 BA04 BB04 BC06 CA02                       CB01 CB04 EA02 EA05                 5J041 AA08

Claims (5)

[Claims] 1. A method for cutting a crystal element, comprising rotating a peripheral blade at a high speed and moving the crystal or the peripheral blade to simultaneously cut the crystal between the front and back surfaces of the crystal by the peripheral blade. 2. A peripheral blade is rotated at a high speed to move the crystal or the peripheral blade to cut half of the thickness of the crystal, and then the crystal is turned upside down to move the crystal or the peripheral blade. A method for cutting a crystal element, which comprises cutting the remaining part of the crystal after the cutting. 3. The first and second outer peripheral blades are provided on the upper side and the lower side of the crystal, respectively, and the first or second outer peripheral blade is rotated at high speed to move the crystal to move the first and second peripheral blades. A method of cutting a crystal element, characterized in that half of the thickness of the crystal is cut from the upper side and the lower side of the crystal with a peripheral blade. 4. The crystal element cutting method according to claim 1, wherein the outer peripheral blade is formed of abrasive grains. 5. The crystal element cutting method according to claim 1, wherein the outer peripheral blade is a dicing saw.