JP2000058382A - Chip type CR parts - Google Patents

Abstract

[PROBLEMS] To easily and independently adjust a resistance value and a capacitance value. SOLUTION: An input electrode 3a, an output electrode 3b, and a ground electrode 4 are provided on an outer surface of a multilayer body 1 including a plurality of dielectric layers.
a is provided. One dielectric layer has a resistor 2 connected between input and output electrodes, and another plurality of dielectric layers have a separated one part connected to an input electrode and the other part connected to an output electrode. One conductor electrode 5 is formed, and a second conductor electrode 6 connected to a ground electrode is formed on the other plurality of dielectric layers, and a capacitance is generated between the first and second conductor electrodes. . The resistor is formed by printing a resistor paste containing a dielectric powder, and has a compounding ratio (about 20 to 30) at the time of manufacture.
By adjusting the (weight% range), the resistance value can be adjusted. Since the resistor and the capacitance are manufactured independently during manufacturing, the resistance value and the capacitance value can be adjusted independently.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type CR component, and more particularly to a chip type CR component by adopting a lumped constant type laminated structure.
The present invention relates to a chip CR component in which a capacitance value C and a resistance value R can be individually adjusted at the time of manufacturing.

[0002]

2. Description of the Related Art In recent years, with the increase in the frequency of electronic equipment, electromagnetic interference noise mixed into the electronic equipment has become a serious problem. In particular, a digital circuit has a steeper noise attenuation characteristic in order to remove noise and suppress signal waveform distortion because the effective signal frequency region for driving the circuit is approaching the noise band. Need a filter. Also, as represented by mobile communication and portable information terminals, there is a demand for downsizing of electronic devices,
There is a demand for further miniaturization of filters incorporated in the electronic devices.

In response to such demands, chip-type CR components having a single-plate structure as shown in FIG. 4 have already been marketed. FIG. 4A is a perspective view of the component, 1 is a substrate (dielectric substrate) made of dielectric ceramic having a single-plate structure, 2 is a resistor layer formed on the upper surface of the substrate 1, 3
Reference numerals a and 3b denote input electrodes and output electrodes formed at both ends of the dielectric substrate, and reference numerals 4 denote ground electrodes formed on the side surfaces of the dielectric substrate 1. In such a chip-type CR component having a single-plate structure, a capacitance is formed between the resistor layer 2 and the ground electrode 4, and an equivalent circuit thereof is formed as shown in FIG. A T-type filter composed of a capacitance C composed of a capacitance and a resistance R formed by the resistor layer 2 is configured. In the above-described chip-type CR component having a single-plate structure,
The resistor layer 2 also serves as one electrode of the capacitance. Therefore, when trying to modify the resistance value R of the resistor layer 2 during manufacturing, the capacitance value C also changes undesirably, and the resistance value and the capacitance value cannot be adjusted separately. Furthermore, in order to obtain various combinations of the capacitance value C and the resistance value R, it is necessary to prepare a large number of starting raw materials and select appropriate raw materials based on empirical rules and the like.

Further, a chip-type resistor component having a laminated structure has already been proposed. In this component, a conductor electrode is formed between two dielectric layers. Then, a desired resistance value is obtained by providing a narrow width portion in the conductor electrode pattern. However, in such a method of adjusting the resistance value, the range of the obtained resistance value is limited, and a desired resistance value cannot always be obtained. Further, since the high-resistance portion is locally formed by providing the narrow width portion, a problem such as heat generation from the high-resistance portion occurs when driving with a large current. Therefore, it cannot be applied as a circuit driven by a large current.

In addition, instead of providing a narrow portion in the conductor electrode, it is conceivable to form a resistor layer using a resistor material such as ruthenium oxide. In this case, too, a dielectric ceramic and a resistor are used. At the same time, the following problems occur, and it has been difficult to put them into practical use. (1) The sintering temperature of the dielectric ceramic is 900 ° C. or higher, while the sintering temperature of the resistor is about 850 ° C.
Due to these sintering temperature differences, pores are generated due to the diffusion of glass components. For this reason, the variation in the resistance value becomes extremely large, and the product yield decreases. (2) Shrinkage occurs during firing of the dielectric ceramic and the resistor, which causes delamination, that is, separation between the dielectric ceramic and the resistor. Further, even if an attempt is made to deform the chip-type resistor component having such a laminated structure so that a capacitance is formed, as long as the resistor is used as one of the electrodes for generating the capacitance, the above-described unitary resistor is used. The same problem as in the case of a CR component having a plate structure occurs.

In view of the above-mentioned problems of the conventional example, an object of the present invention is to provide a desired damping characteristic even with a small amount of raw materials, and to enable a large current drive as compared with the conventional example. It is an object of the present invention to provide an inexpensive and high-yield chip type CR component.

[0007]

In order to achieve the above-mentioned object, a chip according to the present invention in which an input electrode, an output electrode and a ground electrode are provided on the outer surface of a laminate comprising a plurality of dielectric layers. In the type CR component, a resistor connected between an input electrode and an output electrode and a first, second, third,..., N (n: an integer of 2 or more) dielectric layers sequentially stacked The first, second, third,..., N conductor electrodes are arranged, and either one of the odd-numbered or even-numbered conductor electrodes is separated into two parts, and each part is an input electrode and an output electrode. , And the other conductive electrode is connected to the ground electrode, and forms a capacitance between the input electrode and the ground electrode and between the output electrode and the ground electrode. A first set of conductive electrodes comprising conductive electrodes It is characterized by a door. According to another aspect of the present invention, there is provided a chip-type CR component in which an input electrode, an output electrode, and a ground electrode are provided on an external surface of a laminate including a plurality of dielectric layers, between the input electrode and the output electrode. And the first, second, and second layers sequentially stacked.
The first, second, third,..., N conductor electrodes disposed on the 3,..., N (n: an integer of 2 or more) dielectric layers, and the odd-numbered conductor electrodes are input electrodes or output electrodes. Are connected to any one of the first, second and third conductor electrodes, and the even-numbered conductor electrodes are connected to the ground electrode to form a capacitance between one of the input electrode or the output electrode and the ground electrode. , N conductor electrodes of the first set.

In a preferred embodiment of the present invention, the component further comprises a second set of conductive electrodes having the same or substantially the same configuration as the first set of conductive electrodes, wherein the resistor comprises the first set of conductive electrodes. It is laminated and arranged between the set of conductor electrodes and the second set of conductor electrodes. The second set of conductor electrodes having substantially the same configuration is the case where the number n is different from that of the first set. The resistor is formed of a resistance paste mixed with a dielectric powder, and the dielectric powder has the same main component as the dielectric layer, and the compounding ratio of the dielectric powder to the resistance paste is 20 to 20. 30 weight percent. The compounding ratio is set according to the resistance value required by the resistor.

[0009]

FIG. 1 shows a chip type CR component according to an embodiment of the present invention. In FIG. 1, (A) is a perspective view of the chip type CR component, and (B) is a perspective view of the component. Plan view of a resistor pattern (pattern 1) provided inside, (C)
(D) is a plan view of a conductor pattern (patterns 2 and 3) provided inside the component, and (E) is a pattern 1 to
3 is an explanatory view showing the order of lamination of sheets (that is, dielectric layers) made of a dielectric ceramic material provided with No. 3 respectively. In (B) to (D), the dotted lines indicate the size of the bottom surface of the final product.
The figure shows a pattern formed on the dielectric substrate by printing or the like at the time of manufacturing, instead of a pattern after manufacturing the component. In FIG. 1, 1 is a laminate of a plurality of dielectric layers made of a dielectric ceramic material, 2 is a resistor formed by pattern 1, 3a and 3b are input electrodes formed on both ends of a chip type CR component, and Output electrodes (ie, external electrodes), 4
Reference numerals a and 4b denote ground electrodes (that is, side electrodes) formed on both side surfaces of the chip-type CR component (the ground electrode 4b is not shown). Reference numerals 5 and 6 denote first and second conductor electrodes constituted by patterns 2 and 3, respectively.

The pattern 1 includes the resistor 2 as described above.
(R), and has a rectangular shape. The length in the horizontal direction (longitudinal direction) is slightly longer than that of the final product. In the final product, both ends are appropriately cut in accordance with the product size, and both ends after the cutting are the input electrode 3a of the filter and the output. It is electrically connected to the electrode 3b. The pattern 2 is formed in the same rectangular shape as the pattern 1, but is provided with a void at the center in the lateral direction, whereby the pattern 2 is formed as two separate parts. In the final product, both ends of the pattern 2 are cut in accordance with the product size, and both ends after cutting are electrically connected to the input electrode 3a and the output electrode 3b.

The pattern 3 has a horizontal length of the pattern 1.
2, a laterally central portion of the pattern 3 is formed with outwardly extending ears on each side. The distance between the outer ends of these two ears is formed larger than the width of the final product, and the ears are cut to fit the product size in the final product and the ground electrode 4
a, 4b. Pattern 3 except ear
Is formed slightly smaller than the width of the final product. The patterns 2 and 3 serving as the first and second conductor electrodes will be apparent from the following description. However, since a dielectric layer made of a dielectric ceramic material is interposed, a capacitance is formed between them. Is done. However, pattern 2 is 2 in the horizontal direction.
The two capacitances C1 and C2
Is formed. In the chip type CR component of the present invention shown in FIG. 1, a resistor R is formed between an input electrode 3a and an output electrode 3b as shown in the equivalent circuit of FIG.
a between the ground electrode 4a and the ground electrode 4a (and 4b)
1 is formed, and constitutes a π-type filter in which the capacitance C2 is formed between the output electrode 3b and the ground electrode 4a (and 4b).

By explaining the method of manufacturing the chip type CR component shown in FIG. 1, the configuration of the component will be described in more detail. It should be noted that the materials, parts and product sizes, and the pattern forming methods and the like employed in the following description are merely given for describing the preferred embodiment, and in the present invention, various other elements are used. It goes without saying that it can be adopted. First, a binder, a dispersant, and an organic solvent are added to a dielectric ceramic material of a Ba-Nd-Ti-based oxide, and the slurry is formed in a ball mill. This was molded by a doctor blade method to obtain a sheet having a thickness of about 70 microns, and this sheet was cut into a size of 145 x 127 mm to form a chip-type CR filter.
Six green sheets or dielectric layers are obtained.

Next, the Ba-Nd-Ti-based dielectric ceramic material is mesh-passed after removing water to make a powder, and the powdered dielectric paste is added to a resistance paste containing Ag-Pd-Ru as a main component. Mix the ceramic material and stir in the agate bowl. This is defoamed in an acrylic desiccator to produce a smooth resistance paste. Then, the obtained resistance paste is printed by a screen printing method so as to form a pattern 1 on one green sheet, and then dried in a constant temperature bath at an ambient temperature of 100 ° C. This allows
A green sheet on which the pattern 1 shown in FIG. 1B is formed is manufactured. It is preferable to print on the green sheet after adjusting the viscosity by mixing butyl carbitol with the resistance paste so that the printed film thickness of the dried resistance paste is about 10 microns.

At the same time, a conductive paste containing Ag-Pd as a main component is prepared, and similarly to the case of Pattern 1, the conductive paste is printed on a green sheet by a screen printing method and dried in a thermostat. , FIG.
A green sheet on which patterns 2 and 3 shown in (C) and (D) are formed is manufactured. At this time, pattern 2
6 green sheets and four green sheets of pattern 3 are prepared.

The green sheet on which three types of patterns are formed and the green sheet on which no pattern is formed (no pattern) are prepared as shown in FIG.
As shown in (E), no pattern-no pattern-pattern 2-pattern 3-pattern 2-pattern 3-pattern 2-no pattern-pattern 1-pattern 2-pattern 3
-Pattern 2-Pattern 3-Pattern 2-No pattern-
Lamination is performed in the order of no pattern. Then, the laminate is pressed and heated at 120 ° C., and then cut in accordance with the external dimensions of the product chip to form a laminate 1 including a plurality of dielectric layers.
Is prepared. Therefore, a green sheet, that is, a dielectric layer is necessarily interposed between the patterns 2 and 3, and a capacitance is formed between them.

Thereafter, an Ag-Pd-based conductive paste is applied to both ends and both side surfaces of the laminated body 1 cut in accordance with the product size, so that the input electrode 3a and the output electrode 3a shown in FIG. An electrode 3b and a ground electrode 4a,
4b is formed and fired at 900 ° C. Thereby, the input electrode 3a is electrically connected to one end of the pattern 1 and the end of one part of the pattern 2, and the output electrode 3b is connected to the other end of the pattern 1 and the other of the pattern 2. Is electrically connected to the end of the portion. The ground electrodes 4 a and 4 b are electrically connected to ears provided on both sides of the pattern 3. Thus, a chip type CR component which is a π-type filter is obtained, and its equivalent circuit is as shown in FIG.

As described above, in the production of the chip CR component of the present invention, the formation of the capacitances C1 and C2 and the formation of the resistor R are realized by separate processes. That is, the resistor R is formed by blending a powdery dielectric ceramic material with the resistor paste and forming the pattern 1 with the obtained resistor paste. On the other hand, the capacitances C1 and C2 are formed by forming the patterns 2 and 3. Therefore, since these steps are independent, the adjustment of the resistance value and the capacitance value can be performed independently.

Next, adjustment of the resistance value of the resistor R will be described. Table 1 below shows the resistance value and the capacitance value when a large number of chip-type CR components are experimentally manufactured using the above-described manufacturing method. In this experiment, a resistor paste having a resistance value of 4 Ω / square was adopted, and the compounding ratio of the dielectric powder to the resistor paste (dielectric powder compounding ratio (weight percent)) was 20%. , 30%, 40
Set to%. Also, for comparison with the present invention, a dielectric compounding ratio of 0%, that is, one in which dielectric powder was not mixed into the resistor paste was experimentally produced and shown in Table 1.

Table 1 Table 1 Dielectric powder compounding ratio (%) 0 20 30 40 Capacitance value (pF) D 105.08 107.73 104.58 Average resistance value (Ω) D 38.20 92.65 2x10 ⁵ Maximum resistance value (Ω) D 63.7 142.8 1.1 x10 ⁶ Minimum resistance value (Ω) D 30.4 77.1 226.3 (D: occurrence of delamination)

From Table 1, it can be seen that the compounding ratio of the dielectric powder is 20, 30.
And the example of 40%, it can be seen that the resistance value R changes depending on the change of the mixing ratio, but the capacitance value C hardly changes. Therefore, it has been proved that the resistance value can be adjusted by changing the compounding ratio of the dielectric powder, and that the resistance value can be adjusted independently without affecting the capacitance value. However, when the mixing ratio of the dielectric powder is set to 40% or more, the dispersion of the resistance value becomes large. Therefore, it is preferable to set the mixing ratio of the dielectric powder to about 20 to 30%. Also, from Table 1, it is clear that delamination occurs unless the dielectric powder is blended. As in the present invention, it is necessary to form a resistor pattern using a resistor paste mixed with a dielectric powder. Thus, it can be seen that lamination can be performed reliably by preventing the occurrence of delamination.

The capacitance value C can be adjusted by adjusting the shapes and sizes of the patterns 2 and 3 and the number of stacked dielectric layers on which those patterns are formed. In the above embodiment, the pattern 2 is divided into two parts. However, the pattern 2 is not divided, and only one end is electrically connected to either the input electrode 3a or the output electrode 3b. May be. When connected to the input electrode 3a, its equivalent circuit is as shown in FIG. 3A, and when it is connected to the output electrode 3b, its equivalent circuit is as shown in FIG. 3B. Further, the pattern 1 does not necessarily need to be arranged at the center of the laminate 1, and further, does not need to be arranged inside the laminate 1, and can be arranged on the top surface of the laminate 1.
It may be arranged directly below the top surface. In addition, various changes are possible. For example, in FIG.
And pattern 3 may be reversed.
The set of the patterns 2 and 3 stacked on the upper part of the pattern and the set of the patterns 2 and 3 stacked on the lower part may have different configurations such as different numbers of layers or reversal of the patterns 2 and 3.

As described above, in the present invention, the resistance component (pattern 1) is formed inside the laminate using the resistance paste containing the dielectric powder, and the formation of the resistance component and the capacitance component The resistance value can be varied without affecting the capacitance value, and the resistance value can be varied according to the compounding ratio of the dielectric powder, so that the resistance value can be easily adjusted. Also, by changing the size of the capacitance electrodes (patterns 2 and 3), the capacitance value can also be adjusted, and in this case also, the capacitance value can be adjusted independently without affecting the resistance value. . Therefore, according to the present invention, the resistance value and the capacitance value of the chip-type CR filter can be independently adjusted, so that a filter having a desired attenuation characteristic can be easily and inexpensively manufactured, which is extremely practical. Furthermore, by blending the dielectric powder with the resistor paste, separation during firing of the dielectric layer and the resistor pattern is prevented, and thus the occurrence of delamination is suppressed, thereby improving the product yield.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a configuration of a chip type CR component according to an embodiment of the present invention, where (A) is an external perspective view and (B) to (B).
(D) is an explanatory view showing a resistor pattern (pattern 1), a first conductor pattern (pattern 2) forming one capacitor electrode, and a second conductor pattern (pattern 3) forming another capacitor electrode; (E) shows each of patterns 1 to 3
FIG. 4 is an explanatory diagram showing a laminated state of a dielectric layer on which is formed and a non-patterned dielectric layer.

FIG. 2 is a circuit diagram showing an equivalent circuit of the chip CR filter of FIG.

FIGS. 3A and 3B are circuit diagrams each showing an equivalent circuit of a modified example of the chip CR component of FIG. 1;

FIG. 4 is an explanatory view of a conventional chip type CR component.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E082 AA01 AB03 BB02 BC38 DD02 EE04 EE17 EE23 EE35 FF05 FG06 FG26 FG46 FG54 GG10 GG28 PP03 5J024 AA01 BA01 BA05 DA00 DA05 DA35 EA08

Claims (5)

[Claims] 1. A chip type CR component in which an input electrode, an output electrode, and a ground electrode are provided on an outer surface of a multilayer body composed of a plurality of dielectric layers, wherein a resistor connected between the input electrode and the output electrode is provided. ., N (n: an integer of 2 or more) dielectric layers that are sequentially stacked and disposed on the first, second, third,... One of the odd-numbered or even-numbered conductor electrodes is separated into two parts, each part is connected to the input electrode and the output electrode, the other conductor electrode is connected to the ground electrode, and the input electrode and the ground And a first set of conductor electrodes comprising first, second, third,..., N conductor electrodes forming capacitance between the electrodes and between the output electrode and the ground electrode. Chip type CR parts. 2. A chip type CR component in which an input electrode, an output electrode, and a ground electrode are provided on an outer surface of a multilayer body including a plurality of dielectric layers, wherein a resistor connected between the input electrode and the output electrode is provided. ., N (n: an integer of 2 or more) dielectric layers that are sequentially stacked and disposed on the first, second, third,... The odd-numbered conductor electrode is connected to one of the input electrode and the output electrode, the even-numbered conductor electrode is connected to the ground electrode, and the electrostatic force is applied between either the input electrode or the output electrode and the ground electrode. And a first set of conductor electrodes comprising first, second, third,..., N conductor electrodes forming a capacitor.
parts. 3. The chip type CR component according to claim 1, further comprising a second set of conductive electrodes having the same configuration or substantially the same configuration as the first set of conductive electrodes, Are stacked and arranged between a first set of conductor electrodes and a second set of conductor electrodes.
R parts. 4. The chip type CR according to claim 1, 2 or 3.
A chip type CR component, wherein the resistor is formed of a resistor paste mixed with a dielectric powder. 5. The chip-type CR component according to claim 4, wherein the dielectric powder has the same main component as the dielectric layer, and the compounding ratio of the dielectric powder to the resistance paste is 20 to 30% by weight. A chip type CR component characterized in that it is a percentage.