JP2000056321A - Production of transparent electroconductive laminate for liquid crystal display - Google Patents
Production of transparent electroconductive laminate for liquid crystal displayInfo
- Publication number
- JP2000056321A JP2000056321A JP22413898A JP22413898A JP2000056321A JP 2000056321 A JP2000056321 A JP 2000056321A JP 22413898 A JP22413898 A JP 22413898A JP 22413898 A JP22413898 A JP 22413898A JP 2000056321 A JP2000056321 A JP 2000056321A
- Authority
- JP
- Japan
- Prior art keywords
- film
- transparent conductive
- liquid crystal
- crystal display
- metal oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000010408 film Substances 0.000 claims abstract description 76
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 32
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 32
- 239000003513 alkali Substances 0.000 claims abstract description 31
- 239000010409 thin film Substances 0.000 claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920006254 polymer film Polymers 0.000 claims abstract description 18
- 239000012298 atmosphere Substances 0.000 claims abstract description 15
- 238000004544 sputter deposition Methods 0.000 claims abstract description 15
- 229920000642 polymer Polymers 0.000 claims description 21
- 230000015572 biosynthetic process Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- 229910003437 indium oxide Inorganic materials 0.000 claims description 10
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 239000007789 gas Substances 0.000 description 17
- 239000000758 substrate Substances 0.000 description 12
- 238000001755 magnetron sputter deposition Methods 0.000 description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920006289 polycarbonate film Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910020923 Sn-O Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000001941 electron spectroscopy Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001634 microspectroscopy Methods 0.000 description 1
- HYIMSNHJOBLJNT-UHFFFAOYSA-N nifedipine Chemical compound COC(=O)C1=C(C)NC(C)=C(C(=O)OC)C1C1=CC=CC=C1[N+]([O-])=O HYIMSNHJOBLJNT-UHFFFAOYSA-N 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- -1 polyol acrylate Chemical class 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005001 rutherford backscattering spectroscopy Methods 0.000 description 1
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Landscapes
- Manufacturing Of Electric Cables (AREA)
- Liquid Crystal (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、液晶表示用透明導
電積層体の製造方法に関し、さらに詳しくは高分子フィ
ルムの両面に硬化樹脂層が設けられ硬化樹脂層の少なく
とも片面に金属酸化物層が設けられている高分子積層フ
ィルムの金属酸化物層上に、主としてインジウム酸化物
からなる透明導電薄膜を特定の条件で形成する液晶用導
電性積層体の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a transparent conductive laminate for a liquid crystal display, and more particularly, to a polymer film in which a cured resin layer is provided on both sides and a metal oxide layer is provided on at least one side of the cured resin layer. The present invention relates to a method for producing a conductive laminate for liquid crystal, in which a transparent conductive thin film mainly composed of indium oxide is formed under specific conditions on a metal oxide layer of a provided polymer laminated film.
【0002】[0002]
【従来の技術】近年、ペイジャー、携帯電話、電子手
帳、携帯情報端末等の携帯して移動できる情報機器が普
及し始めている。これらの情報機器の携帯性を向上する
ため、より一層の薄型化、軽量化、耐破損性が求められ
ている。従来、LCD、タッチパネルの透明電極用基板と
して、重く、厚く、割れやすいガラス基板が用いられて
きたが、これに代わる材料として、透明樹脂基板が提案
されている。しかし、透明樹脂基板は耐久性、耐溶剤
性、ガスバリアー性等の基本特性がガラス基板よりも劣
っている。例えば透明樹脂基板をLCD用電極基板として
利用した場合、金属酸化物層を設けることにより、ガス
バリアー性を付与することができる。また、液晶配向膜
形成過程で、液晶配向膜の前駆材料をN-メチルピロリド
ン等の溶剤に溶解した塗工液をコーテイングする際に、
上記溶剤により透明樹脂基板が、白化、膨潤等の損傷を
受ける問題があった。この様な問題を解決するために、
本発明者等は高分子フィルムの両面に硬化樹脂層を設
け、その少なくとも片面に金属酸化物層が設けられてい
る高分子積層フィルムの該金属酸化物層上に、主として
インジウム酸化物からなる透明導電薄膜を形成し、液晶
表示用透明導電積層体を作製し検討してきた。2. Description of the Related Art In recent years, portable and portable information devices such as pagers, mobile phones, electronic organizers, and personal digital assistants have begun to spread. In order to improve the portability of these information devices, further reduction in thickness, weight, and breakage resistance are required. Conventionally, a heavy, thick, and fragile glass substrate has been used as a transparent electrode substrate for LCDs and touch panels, but a transparent resin substrate has been proposed as an alternative material. However, the transparent resin substrate is inferior to the glass substrate in basic characteristics such as durability, solvent resistance, and gas barrier properties. For example, when a transparent resin substrate is used as an electrode substrate for LCD, a gas barrier property can be imparted by providing a metal oxide layer. Also, in the process of forming the liquid crystal alignment film, when coating a coating solution in which a precursor material of the liquid crystal alignment film is dissolved in a solvent such as N-methylpyrrolidone,
There was a problem that the transparent resin substrate was damaged by whitening, swelling, and the like due to the solvent. To solve such a problem,
The present inventors have provided a cured resin layer on both surfaces of a polymer film, and provided a metal oxide layer on at least one surface of the polymer laminated film. A conductive thin film was formed, and a transparent conductive laminate for liquid crystal display was fabricated and studied.
【0003】透明導電薄膜は、一般にはITO(In-Sn-O)
膜がその高導電性、高透明性の特性を活かし液晶ディス
プレイ、タッチパネル等の電極材料として広く用いられ
ている。このITO膜の成膜方法としては近年、成膜速度
の制御性、形成された薄膜の均一性等の点からDC マグ
ネトロンスパッタリング法が一般的となっている。特に
最近の薄膜形成技術の進歩は目覚しく、耐熱性のあまり
ない高分子フィルム基板上に透明導電薄膜を形成できる
ようになった。中でもスパッタリング法は、長時間にわ
たって成膜が可能、長時間膜形成を行っても組成がずれ
ない、広幅化が容易などの特徴を有し、最も利用されて
いる技術の一つである。A transparent conductive thin film is generally made of ITO (In-Sn-O)
Films are widely used as electrode materials for liquid crystal displays, touch panels, etc., taking advantage of their high conductivity and high transparency characteristics. In recent years, a DC magnetron sputtering method has been generally used as a method for forming the ITO film from the viewpoints of controllability of a film forming rate, uniformity of a formed thin film, and the like. In particular, recent advances in thin film formation technology have been remarkable, and it has become possible to form a transparent conductive thin film on a polymer film substrate having little heat resistance. Above all, the sputtering method is one of the most utilized techniques because it has features such as being capable of forming a film for a long time, maintaining the composition even after the film is formed for a long time, and being easy to widen.
【0004】本発明者等は、このスパッタリング法を用
いて上記高分子積層フィルム上にITO膜を形成しその実
用性を評価した。液晶表示素子を製造する工程において
液晶表示用透明導電積層体の必要な性質として、一般的
に接着性、耐熱性、耐薬品性が要求されている。ところ
がITM(In-SnMetal)またはITOターゲットを使用してDC
マグネトロンスパッタリング法により高分子積層フィル
ムの金属酸化物上に成膜した場合には、成膜条件によっ
てはITO薄膜の耐アルカリ性が劣る場合があった。[0004] The present inventors formed an ITO film on the above-mentioned polymer laminated film by using this sputtering method and evaluated its practicality. In the process of manufacturing a liquid crystal display element, adhesiveness, heat resistance, and chemical resistance are generally required as necessary properties of a transparent conductive laminate for liquid crystal display. However, DC using ITM (In-SnMetal) or ITO target
When a film was formed on the metal oxide of the polymer laminated film by the magnetron sputtering method, the alkali resistance of the ITO thin film was sometimes poor depending on the film forming conditions.
【0005】[0005]
【発明が解決しようとする課題】本発明の目的は、 ITM
(In-SnMetal)またはITOターゲットを使用してマグネ
トロンスパッタリング法により高分子積層フィルムの金
属酸化物層上に連続成膜した場合、耐アルカリ性が良好
な液晶表示用透明導電積層体を与える製造方法を提供す
ることにある。The object of the present invention is to provide an ITM
(In-SnMetal) or an ITO target using a magnetron sputtering method to provide a transparent conductive laminate for liquid crystal displays with good alkali resistance when continuously deposited on the metal oxide layer of a polymer laminate film. To provide.
【0006】[0006]
【課題を解決するための手段】本発明は、高分子フィル
ムの両面に硬化樹脂層が設けられており、該硬化樹脂層
の少なくとも一方の面上に金属酸化物層が設けられてい
る高分子積層フィルムの該金属酸化物層上に、スパッタ
リング法により透明導電薄膜を形成した液晶表示用透明
導電積層体の製造方法において、成膜雰囲気中に存在す
る水の分圧が2.0x10-5Torrから3x10-6T
orrの範囲内にあるように水を導入しながら透明導電
薄膜を成膜することを特徴とする、耐アルカリ性が良好
で液晶表示用基板として好適な透明導電積層体の製造方
法である。According to the present invention, there is provided a polymer having a cured resin layer provided on both surfaces of a polymer film, and a metal oxide layer provided on at least one surface of the cured resin layer. In the method for producing a transparent conductive laminate for a liquid crystal display in which a transparent conductive thin film is formed on the metal oxide layer of a laminated film by a sputtering method, the partial pressure of water present in a film formation atmosphere is 2.0 × 10 −5 Torr. From 3 × 10 -6 T
A method for producing a transparent conductive laminate having good alkali resistance and suitable as a substrate for a liquid crystal display, comprising forming a transparent conductive thin film while introducing water so as to fall within the range of orr.
【0007】[0007]
【発明の実施の形態】以下、本発明について詳細に説明
する。本発明における透明導電薄膜を形成する方法に
は、スパッタリング法が使用される。主としてインジウ
ム酸化物を含む層を形成するスパッタリング法には、イ
ンジウムを主成分とする合金、または酸化インジウムを
主成分とする焼結体をターゲットとして用いることがで
きる。前者はアルゴンなどの不活性ガスおよび酸素ガス
などの反応性ガスを真空槽内に導入して、反応性スパッ
タリングを行う。後者においては、アルゴンなどの不活
性ガス単独かあるいはアルゴンなどの不活性ガスに微意
量の酸素ガスなどの反応性ガスを混合したものを用いて
スパッタリングを行う。スパッタリングの方式は、直流
または高周波二極スパッタリング、直流または高周波マ
グネトロンスパッタリング、イオンビームスパッタなど
公知の方式が適用できる。中でもマグネトロン方式は基
板へのプラズマ衝撃が少なく、高速成膜が可能で好まし
い。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. The method for forming the transparent conductive thin film in the present invention uses a sputtering method. In a sputtering method for forming a layer mainly containing indium oxide, an alloy mainly containing indium or a sintered body mainly containing indium oxide can be used as a target. In the former, an inert gas such as argon and a reactive gas such as oxygen gas are introduced into a vacuum chamber to perform reactive sputtering. In the latter case, sputtering is performed using an inert gas such as argon alone or a mixture of an inert gas such as argon and a reactive gas such as a slight amount of oxygen gas. Known methods such as direct current or high frequency bipolar sputtering, direct current or high frequency magnetron sputtering, and ion beam sputtering can be applied to the sputtering method. Among them, the magnetron method is preferable because the plasma impact on the substrate is small and high-speed film formation is possible.
【0008】また、スパッタリング装置としてバッチ
式、ロールツーロール方式の両者に適用できる。その生
産性を考慮すると特にロールツーロール方式の方が好ま
しい。Further, the present invention can be applied to both a batch type and a roll-to-roll type as a sputtering apparatus. Considering the productivity, the roll-to-roll system is particularly preferable.
【0009】本発明者等は、先の高分子積層フィルムの
金属酸化物層上にITO薄膜を形成してなる液晶表示用透
明導電積層体の検討を重ねてきたが、要求される特性の
中で特に耐アルカリ性を満足することが困難であった。
本発明者等は鋭意検討の末、液晶表示用透明導電積層体
の耐アルカリ性は、高分子積層フィルムの金属酸化物層
上にITO薄膜を形成する際の成膜雰囲気中の水分圧によ
って決定されることを突き止めた。この水分は主に高分
子フィルムや硬化樹脂層から放出されるものであった。
そこで高分子積層フィルムを搬送し、主としてインジウ
ム酸化物からなる透明導電薄膜を形成してなる液晶表示
用透明導電積層体を連続的に製造するに当たり、従来用
いられている導入ガスである不活性ガス(主にアルゴ
ン)と酸素に加えて成膜雰囲気中の水分量を四重極型質
量分析計でモニターし、水分圧が2.0x10-5〜3.0x10-6To
rrの範囲に一定に保つように、水分を系外から追加しな
がらスパッタリングを行うことにより、アルカリ試験後
のITO薄膜にクラックや剥離が見られず耐アルカリ性の
良好な液晶表示用透明導電性積層体が得られることを見
い出した。成膜雰囲気中に存在する水分(massnumber1
8)が3.0x10-6Torr未満の場合、アルカリ試験後のITO薄
膜に目視で確認できるほどのクラックが発生し、液晶表
示用透明導電積層体としたときの耐アルカリ性は不良と
なった。成膜雰囲気中に存在する水分(massnumber18)
が2x10-5Torrを超えるとアルカリ試験後のITO薄膜に目
視で確認できるほどのクラックが発生し、剥離してしま
った部分も見られ、液晶表示用透明導電積層体としたと
きの耐アルカリ性が不良となった。成膜雰囲気中に存在
する水分(massnumber18)が3.0x10-6Torrから2x10-5To
rrの範囲の場合、アルカリ試験後のITO薄膜にクラック
や剥離が見られず液晶表示用透明導電積層体としたとき
の耐アルカリ性が良好となった。この様に成膜中に存在
する水分圧が液晶表示用透明導電積層体とした時の耐ア
ルカリ性に大きな影響を与えることが分かった。適度な
水を成膜雰囲気内に添加し、水の存在量を上記範囲内と
してITOをSiOx等の金属酸化物層上に成膜すると、かか
る水の導入はITOとSiOxの界面におけるストレスを緩和
する効果があり、その結果SiOx上のITOの接着性が向上
し、耐アルカリ性が良好となるものと考えられる。上記
範囲以下の分圧になるとITO薄膜自体の膜応力が非常に
高い膜質となるのでSiOxとの界面での接着性が悪くなる
ためクラックが発生すると考えられる。また上記範囲以
上の分圧になるとITO薄膜自体がアルカリに弱い膜質と
なるためITO薄膜にクラックが発生し、剥離が生じると
考えられる。The present inventors have repeatedly studied a transparent conductive laminate for a liquid crystal display in which an ITO thin film is formed on a metal oxide layer of a polymer laminated film described above. In particular, it was difficult to satisfy the alkali resistance.
The present inventors have made intensive studies, and the alkali resistance of the transparent conductive laminate for liquid crystal display is determined by the water pressure in the film formation atmosphere when forming the ITO thin film on the metal oxide layer of the polymer laminated film. I figured out. This water was mainly released from the polymer film and the cured resin layer.
In order to continuously produce a transparent conductive laminate for liquid crystal display formed by transporting a polymer laminated film and forming a transparent conductive thin film mainly composed of indium oxide, an inert gas which is a conventionally used gas is used. In addition to (mainly argon) and oxygen, the water content in the film formation atmosphere was monitored by a quadrupole mass spectrometer, and the water pressure was 2.0x10 -5 to 3.0x10 -6 To
Sputtering while adding moisture from outside the system to keep it constant within the range of rr, no cracking or peeling is seen in the ITO thin film after alkali test, and a transparent conductive laminate for liquid crystal display with good alkali resistance. I found that I could get my body. The moisture (massnumber1
When 8) was less than 3.0 × 10 −6 Torr, cracks were observed in the ITO thin film after the alkali test so as to be visually confirmed, and the alkali resistance of the transparent conductive laminate for liquid crystal display was poor. Moisture in the film formation atmosphere (massnumber18)
Exceeds 2 × 10 -5 Torr, cracks are visible in the ITO thin film after the alkali test and some of the peeled-off parts are seen, and the alkali resistance of the transparent conductive laminate for liquid crystal display is poor. It became bad. The moisture (massnumber18) existing in the film formation atmosphere changes from 3.0x10 -6 Torr to 2x10 -5 To
In the case of the range of rr, no crack or peeling was observed in the ITO thin film after the alkali test, and the alkali resistance of the transparent conductive laminate for liquid crystal display was good. As described above, it was found that the water pressure existing during the film formation had a great effect on the alkali resistance of the transparent conductive laminate for liquid crystal display. When a suitable amount of water is added to the film formation atmosphere and the amount of water is within the above range, ITO is formed on a metal oxide layer such as SiOx, and such introduction of water reduces stress at the interface between ITO and SiOx. It is thought that as a result, the adhesion of ITO on SiOx is improved and the alkali resistance is improved. If the partial pressure is lower than the above range, the film stress of the ITO thin film itself becomes very high, so that the adhesiveness at the interface with SiOx is deteriorated, and it is considered that cracks occur. If the partial pressure is higher than the above range, the ITO thin film itself has a film quality weak to alkali, and it is considered that cracks occur in the ITO thin film and peeling occurs.
【0010】本発明に用いられる透明導電薄膜は、主と
してインジウム酸化物を含むものである。インジウム酸
化物は本来透明な電気絶縁体であるが、(1)微量の不
純物を含有する場合、(2)わずかに酸素不足になって
いる場合などに半導体になる。好ましい半導体金属酸化
物としては、例えば不純物としてスズまたはフッ素を含
む酸化インジウムを挙げることができる。特に好ましく
は、酸化スズを2〜20重量%含むインジウム酸化物の薄膜
である。本発明に用いられる主としてインジウム酸化物
を含む透明導電薄膜の膜厚は充分な導電性を得るために
は100Å以上であることが好ましい。上限は特に制限は
ないが、3000Å程度である。[0010] The transparent conductive thin film used in the present invention mainly contains indium oxide. Indium oxide is a transparent electrical insulator by nature, but becomes a semiconductor when (1) it contains a small amount of impurities or (2) it is slightly lacking oxygen. Preferred semiconductor metal oxides include, for example, indium oxide containing tin or fluorine as impurities. Particularly preferred is a thin film of indium oxide containing 2 to 20% by weight of tin oxide. The thickness of the transparent conductive thin film mainly containing indium oxide used in the present invention is preferably 100 ° or more in order to obtain sufficient conductivity. The upper limit is not particularly limited, but is about 3000 °.
【0011】本発明における高分子フィルムとしては、
耐熱性を有する透明な有機高分子化合物であれば特に限
定しないが、通常耐熱性としては、100℃以上、好まし
くは130℃以上であって、例えばポリエーテルスルホ
ン、ポリカーボネート、ポリスルホン、ポリアリレー
ト、ポリエステル、ポリアミド、ポリイミド、ポリオレ
フィンなどが挙げられる。もちろんこれらはホモポリマ
ー、コポリマーとして、また単独またはブレンドとして
も使用できる。As the polymer film in the present invention,
Although it is not particularly limited as long as it is a transparent organic polymer compound having heat resistance, the heat resistance is usually 100 ° C. or higher, preferably 130 ° C. or higher, such as polyether sulfone, polycarbonate, polysulfone, polyarylate, and polyester. , Polyamide, polyimide, polyolefin and the like. Of course, they can be used as homopolymers, copolymers, alone or as blends.
【0012】かかる高分子フィルムは、フィルム状のも
のも含まれる。かかる高分子フィルムの厚さは通常10
〜1000μmである。Such a polymer film includes a film-like film. The thickness of such a polymer film is usually 10
10001000 μm.
【0013】本発明における金属酸化物層としては、珪
素、アルミニウム、マグネシウム等の群から選ばれる1
種または2種以上の金属を主成分とする金属酸化物が挙
げられ、ガスバリア性に優れている材料として知られて
いる。これら酸化物層はスパッタ法、イオンプレーテイ
ング法、プラズマCVD法等により作製される。In the present invention, the metal oxide layer is selected from the group consisting of silicon, aluminum, magnesium and the like.
A metal oxide mainly composed of one or more kinds of metals is mentioned, and is known as a material having excellent gas barrier properties. These oxide layers are formed by a sputtering method, an ion plating method, a plasma CVD method, or the like.
【0014】この中でも、ガスバリア性、透明性、表面
平滑性、屈曲性等の点から珪素原子数に対する酸素原子
数の割合が1.5〜2.0の珪素酸化物を主成分とするこ金属
酸化物が良好である。珪素酸化物に対する酸素原子数の
割合は、X線電子分光法、X線マイクロ分光法、オージェ
電子分光法、ラザホード後方散乱法などにより分析、決
定される。この割合が1.5よりも小さくなると透明性が
悪くなることから、1.5〜2.0が好ましい。Among them, a metal oxide containing silicon oxide having a ratio of the number of oxygen atoms to the number of silicon atoms of 1.5 to 2.0 as a main component is preferable in terms of gas barrier properties, transparency, surface smoothness, flexibility and the like. It is. The ratio of the number of oxygen atoms to silicon oxide is analyzed and determined by X-ray electron spectroscopy, X-ray microspectroscopy, Auger electron spectroscopy, Rutherford backscattering, or the like. If this ratio is smaller than 1.5, the transparency becomes poor, so that 1.5 to 2.0 is preferable.
【0015】該金属酸化物層の厚さとしては、5nm〜200
nmの範囲が好ましい。5nmよりも薄くなると均一に膜を
形成することは困難であり、膜が形成されない部分が発
生し、この部分からガスが浸透し、ガスバリアー性が悪
くなる。また、200nmよりも厚くなると透明性を欠くだ
けでなく、屈曲性が悪く、クラックが発生してガスバリ
ー性が損なわれる。The metal oxide layer has a thickness of 5 nm to 200 nm.
The range of nm is preferred. If the thickness is less than 5 nm, it is difficult to form a uniform film, and a portion where the film is not formed occurs, and gas penetrates from this portion, resulting in poor gas barrier properties. On the other hand, if the thickness is more than 200 nm, not only the transparency is lost but also the flexibility is poor, cracks are generated and the gas barrier property is impaired.
【0016】更に高い透明性の要求に対してはフッ化マ
グネシウムを全体の重量に対して5〜30重量%含有されて
いる、上記の珪素酸化物SiOx(xは1〜2)が好ま
しい。For higher transparency requirements, the above silicon oxide SiOx (x is 1 to 2) containing magnesium fluoride in an amount of 5 to 30% by weight based on the total weight is preferred.
【0017】本発明における硬化樹脂層は高分子フィル
ム、金属酸化物層と接着性が良好なもので、耐薬品性、
耐屈曲性を有するものが良い。硬化樹脂層は本発明に使
用する高分子積層フィルムのカール変形を少なくするた
めに、高分子フィルムの両面に、同じ樹脂層を、膜厚を
ほぼ等しく塗布することが好ましい。The cured resin layer of the present invention has good adhesion to a polymer film and a metal oxide layer, and has high chemical resistance,
Those having bending resistance are good. In order to reduce the curl deformation of the polymer laminated film used in the present invention, it is preferable that the same resin layer is applied to both surfaces of the polymer film with substantially the same thickness.
【0018】この様な硬化樹脂層の具体的な例としては
熱硬化性樹脂としてエポキシ樹脂、アクリル樹脂、アク
リルエポキシ樹脂、メラミン樹脂、フェノール樹脂また
はウレタン樹脂などがある。光重合性ポリマーとしては
ポリエステルアクリレート、ポリエステルウレタンアク
リレート、ポリオールアクリレートなどがある。これら
は2種類以上混合して用いてもよい。Specific examples of such a cured resin layer include a thermosetting resin such as an epoxy resin, an acrylic resin, an acrylic epoxy resin, a melamine resin, a phenol resin or a urethane resin. Examples of the photopolymerizable polymer include polyester acrylate, polyester urethane acrylate, and polyol acrylate. These may be used as a mixture of two or more.
【0019】なお、本発明における高分子積層フィルム
の層構成としては、例えば、硬化樹脂層/高分子フィル
ム/硬化樹脂層/金属酸化物層/ITO層を挙げること
ができる。硬化樹脂層と高分子フィルムとの間、あるい
は硬化樹脂層と金属酸化物層との間には、密着性等を高
めるために、アンカーコート層を介在させることができ
る。The layer structure of the polymer laminated film in the present invention may be, for example, cured resin layer / polymer film / cured resin layer / metal oxide layer / ITO layer. An anchor coat layer can be interposed between the cured resin layer and the polymer film or between the cured resin layer and the metal oxide layer in order to increase the adhesion and the like.
【0020】[0020]
【実施例】以下、実施例を挙げて本発明をさらに具体的
に説明する。The present invention will now be described more specifically with reference to examples.
【0021】(1)四重極型質量分析計 本発明において使用した四重極型質量分析計は主に真空
槽内に存在する元素の種類およびその存在量を評価する
装置である。本発明では特にこの四重極型質量分析計を
分圧計として使用した。今回使用した装置はエムシーエ
レクトロニクス社製のMicropoleAnalyzer超小型分圧真
空計システムMPAである。MPAセンサとして今回は最大動
作圧力が5mTorr、分析質量範囲が2〜100AMUである型式
番号MPA-CF-215を使用した。(1) Quadrupole mass spectrometer The quadrupole mass spectrometer used in the present invention is an apparatus for mainly evaluating the types of elements present in the vacuum chamber and the amounts of the elements. In the present invention, this quadrupole mass spectrometer is particularly used as a partial pressure gauge. The equipment used this time is a MicropoleAnalyzer ultra-compact partial pressure gauge system MPA manufactured by MC Electronics. This time, the model number MPA-CF-215, which has a maximum operating pressure of 5 mTorr and an analytical mass range of 2 to 100 AMU, was used as the MPA sensor.
【0022】(2)耐アルカリ性評価 耐アルカリ性は、3.5wt%NaOH水溶液にサンプルを30℃で
10分間浸漬し、その後流水にて充分に洗浄を行った後に
乾燥させ、外観を目視にて観察することによって行い、
変化が確認されない場合に耐アルカリ性を有すると評価
した。(2) Evaluation of Alkali Resistance Alkali resistance was determined by placing a sample at 30 ° C. in a 3.5 wt% NaOH aqueous solution.
Dipped for 10 minutes, and then dried after thoroughly washing with running water, and visually observing the appearance,
When no change was observed, it was evaluated as having alkali resistance.
【0023】(3)ITOの成膜方法 図1は、本発明の成膜方法を実施するための装置の構成
図である。各種の高分子積層フィルムのロールを基板フ
ィルムとして巻き出し軸4にセットし、フィルムを巻き
出して図示の成膜経路を沿って巻き取り軸7にセットさ
れた巻き芯に巻き取りできるようにセットする。(3) ITO Film Forming Method FIG. 1 is a configuration diagram of an apparatus for performing the film forming method of the present invention. A roll of various polymer laminated films is set on the unwinding shaft 4 as a substrate film, and the film is unwound and set so that it can be wound on the winding core set on the winding shaft 7 along the illustrated film forming path. I do.
【0024】[実施例1]高分子フィルムとしては、厚
みが100μmで、DSCで測定したTgが150℃であるポリカ
ーボネートフィルムを用いた。このポリカーボネートフ
ィルムの両面に膜厚5μmの放射線硬化樹脂層を設け
た。放射線硬化樹脂層としては東亜合成化学社製のアロ
ニックスM400とM8030を1:1の割合で、光硬化剤とし
てチバガイギー社製のイガルキュア184を7phr、レベリ
ング剤としてSH28PAを0.1phrを混合した溶液をロールバ
ーRDS10を使用してコーテイングし、160W/cmの高圧水銀
灯を用いて約700mJ/cm2の積算光量にて紫外線硬化し
た。こうして得られた硬化樹脂層を積層した高分子フィ
ルムを巻き取り式マグネトロンスパッタリング装置内に
設置して2x10-5Torrまで排気した。その後、O2/Ar混合
ガス(O2/Ar=30%)を槽内に100sccm導入し、圧力を2.0x
10-3mTorrに保った後、ターゲットにはSi(Bドープ)タ
ーゲットを用い、メインロールの温度を室温、フィルム
速度をVf=1.0m/min、投入電力密度を1W/cm2に設定して
連続成膜することにより硬化樹脂層の上に、ケイ素酸化
物からなる金属酸化物層を形成した高分子積層フィルム
を得た。Example 1 As a polymer film, a polycarbonate film having a thickness of 100 μm and a Tg measured by DSC of 150 ° C. was used. A radiation-curable resin layer having a thickness of 5 μm was provided on both surfaces of the polycarbonate film. As the radiation-curable resin layer, roll a solution prepared by mixing Alonix M400 and M8030 manufactured by Toa Gosei Chemical Co., Ltd. in a ratio of 1: 1, 7 phr of Igarcure 184 manufactured by Ciba Geigy as a photo-curing agent, and 0.1 phr of SH28PA as a leveling agent. Coating was performed using a bar RDS10, and ultraviolet curing was performed using a high-pressure mercury lamp of 160 W / cm at an integrated light amount of about 700 mJ / cm 2 . The polymer film obtained by laminating the cured resin layers thus obtained was set in a take-up type magnetron sputtering apparatus and evacuated to 2 × 10 −5 Torr. Thereafter, an O 2 / Ar mixed gas (O 2 / Ar = 30%) was introduced into the tank at 100 sccm, and the pressure was increased to 2.0 ×
After maintaining at 10 -3 mTorr, the target was a Si (B-doped) target, the main roll temperature was set to room temperature, the film speed was set to Vf = 1.0 m / min, and the input power density was set to 1 W / cm 2 A polymer laminated film in which a metal oxide layer made of silicon oxide was formed on the cured resin layer by continuous film formation was obtained.
【0025】その後、SiターゲットをITOターゲットに
交換し排気した。成膜前の到達真空度は3x10-6Torrであ
った。その後、O2/Ar混合ガス(O2/Ar=1.2%)を槽内に1
50sccm導入し、圧力を3.0x10-3Torrに保った後、メイン
ロールの温度を室温、フィルム速度をVf=0.1m/min、投
入電力密度を1W/cm2に設定した。その時の成膜雰囲気中
に存在する水分(massnumber18)を四重極型質量分析計
(MPA)で観察し、水分圧が9x10-6Torrとなるように水
分を導入しながら、ケイ素酸化物からなる金属酸化物層
上にITO層を連続成膜することにより透明導電性積層
体を得た。得られた透明導電性積層体の評価結果を表1
に示す。耐アルカリ性の優れた透明導電性積層体であっ
た。After that, the Si target was replaced with an ITO target and exhausted. The ultimate vacuum before film formation was 3 × 10 −6 Torr. Then, an O 2 / Ar mixed gas (O 2 /Ar=1.2%)
After introducing 50 sccm and maintaining the pressure at 3.0 × 10 −3 Torr, the temperature of the main roll was set to room temperature, the film speed was set to Vf = 0.1 m / min, and the input power density was set to 1 W / cm 2 . The water (mass number 18) present in the film formation atmosphere at that time is observed with a quadrupole mass spectrometer (MPA), and the silicon oxide is formed while introducing water so that the water pressure becomes 9 × 10 −6 Torr. A transparent conductive laminate was obtained by continuously forming an ITO layer on the metal oxide layer. Table 1 shows the evaluation results of the obtained transparent conductive laminate.
Shown in It was a transparent conductive laminate having excellent alkali resistance.
【0026】[実施例2]実施例1に示した硬化樹脂層
及び金属酸化物層を設けた高分子積層フィルムを巻き取
り式マグネトロンスパッタリング装置内に設置して3x10
-6Torrまで排気した。その後、O2/Ar混合ガス(O2/Ar=
1.2%)を槽内に150sccm導入し、圧力を3.0x10-3Torrに
保った後、メインロールの温度を室温、フィルム速度を
Vf=0.1m/min、投入電力密度を1W/cm2に設定して連続成
膜した。その時の成膜雰囲気中に存在する水分(massnu
mber18)の四重極型質量分析計(MPA)による分圧が1.2
x10-5Torrとなるように水分を導入しながら連続成膜す
ることにより透明導電性積層体を得た。得られた透明導
電性積層体の評価結果を表1に示す。耐アルカリ性の優
れた透明導電性積層体であった。Example 2 The polymer laminated film provided with the cured resin layer and the metal oxide layer shown in Example 1 was set in a take-up type magnetron sputtering apparatus and set to 3 × 10
Evacuated to -6 Torr. Then, an O 2 / Ar mixed gas (O 2 / Ar =
1.2%) into the tank, keep the pressure at 3.0x10 -3 Torr, then set the main roll temperature to room temperature and the film speed
Vf was set to 0.1 m / min and the input power density was set to 1 W / cm 2 to form a continuous film. The moisture (massnu) existing in the film formation atmosphere at that time
mber18) with a partial pressure of 1.2 using a quadrupole mass spectrometer (MPA).
A transparent conductive laminate was obtained by continuously forming a film while introducing moisture so as to be at x10 -5 Torr. Table 1 shows the evaluation results of the obtained transparent conductive laminate. It was a transparent conductive laminate having excellent alkali resistance.
【0027】[実施例3]実施例1に示した硬化樹脂層
及び金属酸化物層を設けた高分子積層フィルムを巻き取
り式マグネトロンスパッタリング装置内に設置して3x10
-6Torrまで排気した。その後、O2/Ar混合ガス(O2/Ar=
1.2%)を槽内に150sccm導入し、圧力を3.0x10-3Torrに
保った後、メインロールの温度を室温、フィルム速度を
Vf=0.1m/min、投入電力密度を1W/cm2に設定して連続成
膜した。その時の成膜雰囲気中に存在する水分(massnu
mber18)の四重極型質量分析計(MPA)による分圧が2.0
x10-5Torrとなるように水分を導入しながら連続成膜す
ることにより透明導電性積層体を得た。得られた透明導
電性積層体の評価結果を表1に示す。耐アルカリ性の優
れた透明導電性積層体であった。Example 3 The polymer laminated film provided with the cured resin layer and the metal oxide layer shown in Example 1 was set in a take-up type magnetron sputtering apparatus and set to 3 × 10
Pumped down to -6 Torr. Then, an O 2 / Ar mixed gas (O 2 / Ar =
1.2%) was introduced into the tank at 150 sccm, the pressure was maintained at 3.0x10-3 Torr, the main roll temperature was set to room temperature, and the film speed was set to
Vf was set to 0.1 m / min and the input power density was set to 1 W / cm 2 to form a continuous film. The moisture (massnu) existing in the film formation atmosphere at that time
mber18) with a quadrupole mass spectrometer (MPA) with a partial pressure of 2.0
A transparent conductive laminate was obtained by continuously forming a film while introducing moisture so as to be at x10 -5 Torr. Table 1 shows the evaluation results of the obtained transparent conductive laminate. It was a transparent conductive laminate having excellent alkali resistance.
【0028】[比較例1]実施例1に示した硬化樹脂層
及び金属酸化物層を設けた高分子積層フィルムを巻き取
り式マグネトロンスパッタリング装置内に設置して3x10
-6Torrまで排気した。その後、O2/Ar混合ガス(O2/Ar=
1.2%)を槽内に150sccm導入し、圧力を3.0x10-3Torrに
保った後、メインロールの温度を室温、フィルム速度を
Vf=0.1m/min、投入電力密度を1W/cm2に設定して連続成
膜した。その時の成膜雰囲気中に存在する水分(massnu
mber18)の四重極型質量分析計(MPA)による分圧が2.9
x10-5Torrとなるように水分を導入しながら連続成膜す
ることにより積層体を得た。得られた積層体の評価結果
を表1に併記した。アルカリ試験後のITO薄膜に目視で
確認できるほどのクラックが発生し、剥離してしまった
部分も見られ耐アルカリ性が悪かった。Comparative Example 1 The polymer laminated film provided with the cured resin layer and the metal oxide layer shown in Example 1 was set in a take-up type magnetron sputtering apparatus and set to 3 × 10
Pumped down to -6 Torr. Then, an O 2 / Ar mixed gas (O 2 / Ar =
1.2%) into the tank, keep the pressure at 3.0x10 -3 Torr, then set the main roll temperature to room temperature and the film speed
Vf was set to 0.1 m / min and the input power density was set to 1 W / cm 2 to form a continuous film. The moisture (massnu) existing in the film formation atmosphere at that time
mber18) has a partial pressure of 2.9 with a quadrupole mass spectrometer (MPA).
A layered product was obtained by continuously forming a film while introducing water so as to be at x10 -5 Torr. Table 1 also shows the evaluation results of the obtained laminate. Cracks were observed in the ITO thin film after the alkali test so as to be visually confirmed, and some of the peeled portions were observed, and the alkali resistance was poor.
【0029】[比較例2]実施例1に示した硬化樹脂層
及び金属酸化物層を設けた高分子積層フィルムを巻き取
り式マグネトロンスパッタリング装置内に設置して1x10
-6Torrまで排気した。その後、O2/Ar混合ガス(O2/Ar=
1.2%)を槽内に150sccm導入し、圧力を3.0x10-3Torrに
保った後、メインロールの温度を室温、フィルム速度を
Vf=0.1m/min、投入電力密度を1W/cm2に設定して連続成
膜した。その時の成膜雰囲気中に存在する水分(massnu
mber18)の四重極型質量分析計(MPA)による分圧が2x1
0-6Torrとなるように水分を導入しながら連続成膜する
ことにより透明導電性積層体を得た。得られた積層体の
評価結果を表1に併記した。アルカリ試験後のITO薄膜
に目視で確認できるほどのクラックが発生し耐アルカリ
性が悪かった。Comparative Example 2 The polymer laminated film provided with the cured resin layer and the metal oxide layer shown in Example 1 was placed in a take-up type magnetron sputtering apparatus and set to 1 × 10
Pumped down to -6 Torr. Then, an O 2 / Ar mixed gas (O 2 / Ar =
1.2%) into the tank, keep the pressure at 3.0x10 -3 Torr, then set the main roll temperature to room temperature and the film speed
Vf was set to 0.1 m / min and the input power density was set to 1 W / cm 2 to form a continuous film. The moisture (massnu) existing in the film formation atmosphere at that time
mber18) quadrupole mass spectrometer (MPA) partial pressure 2x1
A transparent conductive laminate was obtained by continuously forming a film while introducing water so that the pressure became 0 -6 Torr. Table 1 also shows the evaluation results of the obtained laminate. Cracks were observed in the ITO thin film after the alkali test so as to be visually confirmed, and the alkali resistance was poor.
【0030】[比較例3]実施例1に示した硬化樹脂層
及び金属酸化物層を設けた高分子積層フィルムを巻き取
り式マグネトロンスパッタリング装置内に設置して1x10
-6Torrまで排気した。その後、O2/Ar混合ガス(O2/Ar=
1.2%)を槽内に150sccm導入し、圧力を3.0x10-3Torrに
保った後、メインロールの温度を室温、フィルム速度を
Vf=0.1m/min、投入電力密度を1W/cm2に設定して連続成
膜した。その時の成膜雰囲気中に存在する水分(massnu
mber18)の四重極型質量分析計(MPA)による分圧が1x1
0-6Torrとなるように水分を導入しながら連続成膜する
ことにより積層体を得た。得られた積層体の評価結果を
表1に併記した。アルカリ試験後のITO薄膜に目視で確
認できるほどのクラックが発生し耐アルカリ性が悪かっ
た。Comparative Example 3 The polymer laminated film provided with the cured resin layer and the metal oxide layer shown in Example 1 was placed in a take-up type magnetron sputtering apparatus and set to 1 × 10
Pumped down to -6 Torr. Then, an O 2 / Ar mixed gas (O 2 / Ar =
1.2%) into the tank, keep the pressure at 3.0x10 -3 Torr, then set the main roll temperature to room temperature and the film speed
Vf was set to 0.1 m / min and the input power density was set to 1 W / cm 2 to form a continuous film. The moisture (massnu) existing in the film formation atmosphere at that time
mber18) 1x1 by quadrupole mass spectrometer (MPA)
A layered product was obtained by continuously forming a film while introducing water so as to obtain 0 -6 Torr. Table 1 also shows the evaluation results of the obtained laminate. Cracks were observed in the ITO thin film after the alkali test so as to be visually confirmed, and the alkali resistance was poor.
【0031】[0031]
【表1】 [Table 1]
【0032】[0032]
【発明の効果】本発明により、バッチ式、ロールツーロ
ール方式を問わず、スパッタリング法を用いて高分子フ
ィルムの両面に硬化樹脂層が設けられており、該硬化樹
脂層の少なくとも一方の面上に金属酸化物層が設けられ
ている高分子積層フィルムの該金属酸化物層上にスパッ
タリング法によって透明導電薄膜を形成するにあたり、
成膜雰囲気中に存在する水分が常に2.0x10-5Torrから7x
10-6Torrであるように水分を導入しながら成膜すること
によって耐アルカリ性の良好な液晶表示用透明導電積層
体を得ることができた。According to the present invention, a cured resin layer is provided on both sides of a polymer film by a sputtering method regardless of a batch method or a roll-to-roll method, and the cured resin layer is formed on at least one surface of the cured resin layer. In forming a transparent conductive thin film by a sputtering method on the metal oxide layer of the polymer laminated film provided with a metal oxide layer,
Moisture present in the deposition atmosphere is always 2.0x10 -5 Torr to 7x
A transparent conductive laminate for liquid crystal display having good alkali resistance was obtained by forming a film while introducing moisture so as to have a pressure of 10 -6 Torr.
【図1】本発明の成膜方法を実施するための装置の構成
図である。FIG. 1 is a configuration diagram of an apparatus for performing a film forming method of the present invention.
1. 真空チャンバー 2. 長尺ロール状ポリマーフィルム 3. ターゲット 4. 巻きだし軸 5. メインロール 6. サブロール 7. 巻き取り軸 1. Vacuum chamber 2. Long roll polymer film 3. Target 4. Unwinding shaft 5. Main roll 6. Sub-roll 7. Winding shaft
Claims (3)
けられており、該硬化樹脂層の少なくとも一方の面上に
金属酸化物層が設けられている高分子積層フィルムの該
金属酸化物層上に、スパッタリング法により透明導電薄
膜を形成した液晶表示用透明導電積層体の製造方法にお
いて、成膜雰囲気中の水の分圧が2.0x10-5Tor
rから3x10-6Torrの範囲内となるように水を導
入しながら透明導電薄膜を成膜することを特徴とする耐
アルカリ性の良好な液晶表示用透明導電積層体の製造方
法。1. A polymer laminated film in which a cured resin layer is provided on both surfaces of a polymer film, and a metal oxide layer is provided on at least one surface of the cured resin layer. In the method for manufacturing a transparent conductive laminate for a liquid crystal display having a transparent conductive thin film formed thereon by a sputtering method, the partial pressure of water in a film formation atmosphere is 2.0 × 10 −5 Torr.
A method for producing a transparent conductive laminate for liquid crystal display having good alkali resistance, wherein a transparent conductive thin film is formed while introducing water so as to fall within a range of from 3 to 10 -6 Torr.
成分とし、錫、亜鉛およびガリウムから選ばれた1種類
以上の酸化物を含むことを特徴とする請求項1に記載の
液晶表示用透明導電積層体の製造方法。2. The transparent liquid crystal display according to claim 1, wherein the transparent conductive thin film contains indium oxide as a main component and at least one oxide selected from tin, zinc and gallium. A method for manufacturing a conductive laminate.
であり、かつ珪素原子数に対する酸素原子数の割合が
1.5〜2.0の珪素酸化物を主成分とすることを特徴
とする請求項1または2に記載の液晶表示用透明導電積
層体の製造方法。3. The metal oxide layer has a thickness of 5 to 200 nm.
3. The transparent conductive laminate for a liquid crystal display according to claim 1, wherein a silicon oxide having a ratio of the number of oxygen atoms to the number of silicon atoms of 1.5 to 2.0 is a main component. 4. Manufacturing method.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006344584A (en) * | 2005-05-13 | 2006-12-21 | Semiconductor Energy Lab Co Ltd | Display device, and fabricating method of display device |
JP5236942B2 (en) * | 2005-03-09 | 2013-07-17 | 出光興産株式会社 | Amorphous transparent conductive film, target, and method for producing amorphous transparent conductive film |
JP2013140684A (en) * | 2011-12-28 | 2013-07-18 | Dainippon Printing Co Ltd | Annealing method, film production method, annealing device and film production device |
US8999836B2 (en) | 2005-05-13 | 2015-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
-
1998
- 1998-08-07 JP JP22413898A patent/JP4187315B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5236942B2 (en) * | 2005-03-09 | 2013-07-17 | 出光興産株式会社 | Amorphous transparent conductive film, target, and method for producing amorphous transparent conductive film |
JP2006344584A (en) * | 2005-05-13 | 2006-12-21 | Semiconductor Energy Lab Co Ltd | Display device, and fabricating method of display device |
US8999836B2 (en) | 2005-05-13 | 2015-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
US9419064B2 (en) | 2005-05-13 | 2016-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
JP2013140684A (en) * | 2011-12-28 | 2013-07-18 | Dainippon Printing Co Ltd | Annealing method, film production method, annealing device and film production device |
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