JP2000049074A - Stage control method, stage device and aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the time for determining total position for both stages for rough movements and fine movements, and to determine the position of the stage for fine movements with stability, in a method for controlling stages, stage devices and an aligner. SOLUTION: A step for driving and controlling a stage 11 for fine movement up to a target position is performed by switching between a step for controlling, on the basis of the distance of transfer from the start position to the actual position of a stage 10 for rough movements according to the transfer distance from the start position to the target position of the stage 10 for rough movements and a step for controlling on the basis of the transfer time from the start time of the stage for fine movements and the actual time. In this way, when the transfer distance of the stage for rough movements is small, the position of the stage for small movements is determined through control based on the transfer time separately from the stage for rough movements, even if they start to move at the same time. Accordingly, a stable positioning can be performed with an acceleration under a limit, without dependence on a large acceleration.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coarse-movement stage and a fine-movement stage which are employed as stages on the reticle side in a scanning projection exposure apparatus for sequentially transferring and exposing a mask pattern onto a wafer by a slit scan exposure method. The present invention relates to a stage control method, a stage apparatus, and an exposure apparatus.

[0002]

2. Description of the Related Art A photomask or a reticle (hereinafter, collectively referred to as a "reticle") is used when a semiconductor element, a liquid crystal display element, a thin film magnetic head, or the like is manufactured by a photographic process.
A projection exposure apparatus that transfers the above pattern onto a wafer (or a glass plate or the like) coated with a photosensitive material is used.

In recent years, one chip pattern such as a semiconductor element has been increasing in size.
There is a demand for a larger area for exposing a pattern having a larger area on a reticle onto a wafer. In addition, as the pattern of semiconductor elements and the like becomes finer, it is also required to improve the resolution of the projection optical system.However, the resolution of the projection optical system is improved, and the exposure field of the projection optical system is increased. Is difficult to design and manufacture.

In order to increase the area of the pattern to be transferred and to limit the exposure field of the projection optical system, a reticle is scanned with respect to a slit-shaped illumination area, and the reticle is scanned with respect to an exposure area conjugate to the illumination area. Attention has been focused on a so-called slit scan exposure type projection exposure apparatus that successively exposes a pattern image on a reticle onto a wafer by scanning the wafer in synchronization with the scanning.

[0005] When performing exposure by a slit scan exposure method, it is necessary to perform accurate positioning of a reticle and a wafer and to perform synchronous scanning, and high precision and quick positioning on a stage on which these are mounted is demanded. I have.
Conventionally, as a stage for scanning a reticle or the like, a stage having a coarse moving stage for scanning and a fine moving stage for positioning independently driven with respect to the coarse moving stage has been developed. This stage performs high-precision scanning and positioning by finely adjusting the fine movement stage in relative scanning and positioning.

When positioning is performed on the above stage, first, the coarse moving stage is moved while the fine moving stage follows the coarse moving stage, and is positioned at a predetermined position. After the positioning of the coarse moving stage is completed, the fine moving stage is subsequently moved and positioned at a predetermined position, and finally the positioning of the reticle or the like placed thereon is completed.

[0007]

However, the following problems remain in the conventional stage control means. In other words, since the positioning of the fine movement stage must wait for the positioning of the coarse movement stage to be completed,
There has been a disadvantage that the total positioning time of both the coarse and fine movement stages is longer than in the case of performing the positioning simultaneously. When both coarse and fine movement stages are positioned at the same time, the movement distance of the coarse movement stage is short, and the maximum movement distance of the fine movement stage with respect to the coarse movement stage (hereinafter referred to as “the long distance corresponding to the maximum stroke”). ")
When the fine movement stage is controlled based on the movement distance of the coarse movement stage when the movement must be performed and the coarse movement stage must be simultaneously positioned, the time for simultaneous positioning is also reduced because the movement distance of the coarse movement stage is short. Therefore, a large acceleration (thrust) must be applied to the fine movement stage. However, since there is a limit to the acceleration applied to the fine movement stage, sufficient acceleration is not applied to the fine movement stage to perform simultaneous positioning, and the fine movement stage cannot follow the input profile. As a result, acceleration and deceleration may be repeated, resulting in an oscillating response.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and provides a stage control method and a stage control method capable of reducing the total positioning time of both coarse and fine movement stages and stably positioning the fine movement stage. It is an object to provide an apparatus and an exposure apparatus.

[0009]

The present invention has the following features to attain the object mentioned above. That is to say, referring to FIGS. 1 to 3, in the stage control method according to the first aspect, the coarse movement stage (10) is moved in a predetermined direction, and the fine movement stage ( 11) is a stage control method for performing a control for relatively moving the fine movement stage with respect to the coarse movement stage and positioning the coarse movement stage and the fine movement stage at target positions. A step of controlling based on a movement distance from the movement start position of the coarse movement stage to a current position according to a movement distance from the movement start position of the coarse movement stage to the target position, and a time from the start of movement of the fine movement stage to the current time. The technique of switching and controlling the process based on the moving time of the vehicle is adopted.

In the control of the fine movement stage simply based on the positional relationship with the coarse movement stage, the movement distance of the coarse movement stage is short, and at the same time, the moved fine movement stage is simultaneously positioned in a short time. On the other hand, in the stage control method according to the present invention, the step of driving and controlling the fine movement stage (11) to the target position includes
Controlling the coarse movement stage (10) from the movement start position to the target position according to the movement distance from the movement start position to the target position based on the movement distance from the movement start position to the current position of the coarse movement stage; When the coarse moving stage is short in moving distance, it is positioned separately from the coarse moving stage even if the movement is started simultaneously by controlling the fine moving stage when the moving distance of the coarse moving stage is short. Therefore, stable positioning can be performed at an acceleration equal to or less than the limit without relying on a large acceleration.

According to a second aspect of the present invention, a coarse movement stage (10) movable in a predetermined direction and a fine movement stage (11) provided on the coarse movement stage and movable relatively to the coarse movement stage. And stage control means (22A) for calculating target positions of the coarse movement stage and the fine movement stage in accordance with the current position of the coarse movement stage, and performing control for positioning them at these target positions. Defines at least the time required to avoid vibration when positioning the fine movement stage by T
c, and the distance that the coarse movement stage can move over the time Tc is Lc, and when the movement distance from the movement start position of the coarse movement stage to the target position is shorter than the distance Lc, the fine movement stage A technique is adopted in which the time for positioning is set to time Tc.

In this stage apparatus, the stage control means (22A) sets at least a time Tc required to prevent vibration when positioning the fine movement stage (11), and a coarse movement taking the time Tc. When the movement distance of the coarse movement stage from the movement start position to the target position is shorter than the distance Lc, the time for positioning the fine movement stage is set to time Tc, where Lc is the distance that the stage can move. Therefore, even if the distance is as long as the maximum stroke, the fine movement stage is positioned over a period of time in which vibration does not occur, and stable and quick positioning can be performed.

In the exposure apparatus according to the fifth aspect, the mask (1)
2) an illumination optical system for illuminating the upper illumination area (32), a mask stage (10, 11) for scanning the mask in a predetermined direction with respect to the illumination area, and an exposure area conjugate to the illumination area. A substrate stage (2) for scanning the substrate (5) in a predetermined direction, and scanning the substrate for the exposure area in synchronization with scanning of the mask for the illumination area. Thereby, in a scanning type exposure apparatus that sequentially projects the pattern on the mask onto the substrate, the exposure apparatus includes the stage device according to any one of claims 2 to 4, wherein at least one of the mask stage and the substrate stage is The technique of the stage device including a coarse movement stage and a fine movement stage is employed.

In this exposure apparatus, the stage device is provided, and at least one of the mask stage (10, 11) and the substrate stage (2) is composed of a coarse movement stage and a fine movement stage of the stage device. The stage or the substrate stage can be positioned stably and quickly.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a stage control method and a scanning exposure apparatus using a stage apparatus according to the present invention will be described below with reference to FIGS.

FIGS. 1 and 3 show a projection exposure apparatus of a slit scan exposure type according to the present embodiment. In these figures, a reticle (a reticle) is formed by a slit-shaped illumination area by exposure light EL from an illumination optical system (not shown). Mask) 12
The upper pattern is illuminated, and an image of the pattern is projected and exposed on the wafer 5 via the projection optical system 8. At this time,
In synchronization with the reticle 12 being scanned at a constant speed VR in the negative Y-axis direction with respect to the slit-shaped illumination area of the exposure light EL, the wafer 5 is moved at a constant speed β · in the positive Y-axis direction. V
Scanning is performed at R (β is the projection magnification of the projection optical system 8).

A reticle Y-axis drive stage (coarse movement stage) 10 that can be driven in the Y-axis direction is mounted on a reticle support 9 as a drive system for the reticle 12 and the wafer 5.
A reticle minute drive stage (fine movement stage) 11 is mounted on the reticle Y-axis drive stage 10, and a reticle 12 is held on the reticle minute drive stage 11 by a vacuum chuck or the like.

The reticle minute drive stage 11 controls the position of the reticle 12 with a very small amount and high precision in the X direction, the Y direction and the rotation direction (θ direction) in a plane perpendicular to the optical axis of the projection optical system 8. Do. A movable mirror 21 is disposed on the reticle micro-drive stage 11, and the reticle-side interferometer 14 disposed on the reticle support 9 constantly operates the reticle micro-drive stage 11 in the X and Y directions and θ.
The position of the direction is monitored. The position information S1 obtained by the interferometer 14 is supplied to the main control system 22A. The position of the reticle Y-axis drive stage 10 in the Y direction (scanning direction) is also constantly measured by an interferometer described later.

On the other hand, a wafer Y-axis drive stage 2 that can be driven in the Y-axis direction is mounted on the wafer support table 1, and a wafer X-axis drive stage 3 that can be driven in the X-axis direction is mounted thereon. And a Zθ-axis driving stage 4 is provided thereon.
The wafer 5 is held on the Zθ axis drive stage 4 by vacuum suction. The movable mirror 7 is also fixed on the Zθ-axis drive stage 4, and the wafer-side interferometer 1
3, the position of the Zθ axis drive stage 4 in the X, Y and θ directions is monitored, and the position information obtained by the interferometer 13 is also supplied to the main control system 22A. The main control system 22A controls the positioning operation of the wafer Y-axis driving stage 2 to the Zθ-axis driving stage 4 via the wafer driving device 22B and the like, and also controls the operation of the entire apparatus.

In order to establish a correspondence between a wafer coordinate system defined by coordinates measured by the interferometer 13 on the wafer side and a reticle coordinate system defined by coordinates measured by the interferometer 14 on the reticle side, A reference mark plate 6 is fixed near the wafer 5 on the Zθ axis drive stage 4. Various reference marks for alignment are formed on the reference mark plate 6.

Above the reticle 12, the reference mark plate 6
Reticle alignment microscopes 19 and 2 for simultaneously observing the upper reference mark and the mark on reticle 12
0 is equipped. In this case, deflecting mirrors 15 and 16 for guiding the detection light from the reticle 12 to the reticle alignment microscopes 19 and 20, respectively, are movably arranged, and when the exposure sequence is started, a designation from the main control system 22A is performed. Then, the deflection mirrors 15 and 16 are retracted by the mirror driving devices 17 and 18, respectively. Further, an off-axis type alignment device 34 for observing alignment marks (wafer marks) on the wafer 5 is arranged on a side surface of the projection optical system 8 in the Y direction.

Further, regarding the stage on the reticle side,
This will be described in detail with reference to FIG. FIG. 2 is a plan view of the reticle stage. In FIG. 2, a reticle minute drive stage 11 is mounted on a reticle Y-axis drive stage 10, and a reticle 12 is held thereon. The reticle minute drive stage 11 has a movable mirror 21x for the X axis.
And two movable mirrors 21y1 and 21y2 for the Y axis are fixed, and the movable mirror 21x has the laser beam LR parallel to the X axis.
x is illuminated. In addition, moving mirrors 21y1 and 21y from interferometers 14y1 and 14y2 for the Y axis, respectively.
2 are irradiated with laser beams LRy1 and LRy2 in parallel with the Y axis.

The moving mirror 21y1 in the Y direction, which is the scanning direction,
A corner cube type reflecting element is used as 21y2, and the laser beams LRy1 and LRy2 reflected by the moving mirrors 21y1 and 21y2 are reflected by the reflecting mirror 3 respectively.
It is reflected back at 9, 38. That is, the reticle interferometers 14y1 and 14y2 are double-pass interferometers, so that the laser beam does not shift due to the rotation of the reticle minute drive stage 11. Further, the slit-shaped illumination area 32 on the reticle 12 is illuminated by the exposure light with uniform illuminance.

The reticle Y-axis drive stage 10 has a Y
The corner cube type movable mirror 24 is also fixed to the end in the direction, and the laser beam from the third interferometer 23 for the reticle is reflected by the movable mirror 24 to the reflection mirror 25, and the laser beam from the reflection mirror 25. The beam is returned to the interferometer 23 via the moving mirror 24. The interferometer 23 constantly monitors the coordinates of the reticle Y-axis drive stage 10 in the Y direction by a double-pass method. The reticle minute drive stage 11 is moved relative to the reticle Y-axis drive stage 10 by an actuator (not shown).
It is supported so that it can be displaced within a predetermined range in the direction, the Y direction, and the rotation direction.

As shown in FIG. 3, the reticle Y-axis driving stage 10 is
The reticle minute drive stage 11 is supported so as to be scanned in the Y direction by the reticle Y-axis drive stage 10.
Are supported by the drive motor 30 so as to be finely movable in the Y direction. Further, the interferometers 14y1 and 14y
Y of the reticle micro-drive stage 11 measured by 2
The coordinates are supplied to the main control system 22A, and the Y coordinate of the reticle Y-axis drive stage 10 measured by the interferometer 23 is also supplied to the main control system 22A.

Similarly, the wafer Y-axis drive stage 2 on the wafer 5 side is supported by the linear motor 1a on the wafer support table 1 so as to be scanned in the Y direction.
The Y coordinate of the wafer Y-axis drive stage 2 measured by 1 and 13y2 is supplied to the main control system 22A.

Next, the positioning control (Y direction) of the reticle minute drive stage 11 will be described with reference to FIG.

In this exposure apparatus, in the main control system 22A, the reticle Y-axis drive stage 10 and the reticle minute drive stage are controlled in accordance with the current position (Y coordinate) of the reticle Y-axis drive stage 10 supplied by the interferometers 14y1 and 14y2. Eleven target positions are calculated, and control is performed to position these target positions. In particular, the step of controlling the drive of the reticle micro-drive stage 11 to the target position is performed based on the movement distance from the movement start position of the reticle Y-axis drive stage 10 to the target position from the movement start position of the reticle Y-axis drive stage 10 to the current position. The step of controlling based on the movement distance to the position and the step of controlling based on the movement time from the start of movement of the reticle minute drive stage 11 to the current time are switched and performed.

That is, the reticle minute drive stage 11
The movement start of the reticle Y-axis drive stage 10 is defined as Tc, which is at least the time required to prevent vibration when positioning the reticle, and Lc, the distance over which the reticle Y-axis drive stage 10 can move over the time Tc. When the movement distance from the position to the target position is shorter than the distance Lc, the control process is switched so that the time for positioning the reticle minute drive stage 11 becomes the time Tc.

More specifically, the current position of the reticle Y-axis driving stage 10 is Pc, the relative distance between the reticle Y-axis driving stage 10 and the reticle minute driving stage 11 at the start of movement is Li, and the reticle Y-axis driving stage 10
The moving rate, which is a value obtained by dividing the moving distance from the moving start position to the current position of the reticle by the moving distance from the moving start position of the reticle Y-axis driving stage 10 to the target position, is Rc, and the moving ratio from the current position of the reticle minute driving stage 11 to the target is When the moving distance to the position is L and the value of a function having the moving time t from the start of movement of the reticle minute drive stage 11 to the current time as a variable is Tr, the target of the reticle minute drive stage 11 at the current position is Tr. When the movement distance from the movement start position of the reticle Y-axis drive stage 10 to the target position is equal to or longer than the distance Lc, the position P is calculated by the following relational expression (1): P = Pc + Li + Rc × L.

The target position P of the reticle minute drive stage 11 at the current position is determined as follows when the movement distance from the movement start position of the reticle Y-axis drive stage 10 to the target position is shorter than the distance Lc. Equation (2): P = Pc + Li + Tr × L In other words, control is performed by switching the input profile for the reticle minute drive stage 11 to the above-mentioned relational expression (1) or (2) according to the moving distance of the reticle Y-axis drive stage 10.

As shown in FIG. 4, the value Tr of the function is obtained by the following relational expression (3), which gives a gentle curve immediately before positioning: Tr = (1−cos (πt / Tc)) / 2 It is calculated.

In the present embodiment, the time Tc is set to 0.3 s
And the distance Lc is set to 60 mm.

In the positioning control of the reticle minute drive stage 11 in this exposure apparatus, if the movement distance of the reticle Y axis drive stage 10 is short, even if the reticle minute drive stage 11 starts moving at the same time by the movement time control, the reticle Y axis moves. Since the positioning is performed separately from the drive stage 10, stable speed control and positioning can be performed at an acceleration equal to or less than the limit without depending on a large acceleration.

When the movement distance from the movement start position of the reticle Y-axis drive stage 10 to the target position is shorter than the distance Lc, the time required for positioning the reticle minute drive stage 11 is determined by the main control system 22A. Since it is set to be the time Tc, even if the distance is as long as the maximum stroke, the reticle minute drive stage 1
1 is positioned over a period of time in which vibration does not occur, thereby enabling stable and quick positioning.

Further, the target position P of the reticle minute drive stage 11 at the current position is set to the movement rate Rc when the movement distance from the movement start position of the reticle Y-axis drive stage 10 to the target position is greater than the distance Lc. When the movement distance from the movement start position of the coarse movement stage to the target position is shorter than the distance Lc, the calculation is performed using the relation expression based on the function value Tr with the movement time t as a variable. Therefore, the total positioning time can be shortened by starting the positioning at the same time, and the vibrational positioning of the reticle minute drive stage 11 can be prevented by switching the input profile. Further, since the value Tr of the function is calculated by the above-mentioned relational expression (3),
As shown in FIG. 4, since a gentle input profile is obtained immediately before positioning and an excessive thrust is not applied, smooth positioning is possible.

The present invention also includes the following embodiments. (1) The function Tr is calculated by the above relational expression (3), but may be obtained by another relational expression. For example, even if the function Tr changes linearly with the time t as a variable, it is possible to suppress the positioning from becoming oscillatory. (2) The stage control means of the present invention is applied to the reticle minute drive stage 11, but the reticle Y on which the wafer is placed
It may be applied to a shaft drive stage or the like.

(3) The exposure apparatus of this embodiment can be applied to a proximity exposure apparatus that exposes a mask pattern by bringing a mask and a substrate into close contact without using a projection optical system. (4) The application of the exposure apparatus is not limited to an exposure apparatus for manufacturing a semiconductor. For example, an exposure apparatus for a liquid crystal for exposing a liquid crystal display element pattern on a square glass plate and a thin film magnetic head are manufactured. Can be widely applied to an exposure apparatus for the purpose.

(5) The light source of the exposure apparatus of this embodiment is g
Line (436 nm), i-line (365 nm), KrF excimer laser (248 nm), ArF excimer laser (19
3 nm), not only the F ₂ laser (157 nm) only, it is possible to use a charged particle beam such as X-ray or electron beam. For example, when an electron beam is used, thermionic emission type lanthanum hexaborite (LaB ₆ ), tantalum (Ta)
Can be used. (6) The magnification of the projection optical system may be not only a reduction system but also an equal magnification and an enlargement system.

(7) When far infrared rays such as an excimer laser are used as the projection optical system, a material that transmits far ultraviolet rays such as quartz or fluorite is used as a glass material, and an F ₂ laser or X
When a line is used, a catadioptric or refractive optical system is used (a reticle of a reflective type is used). When an electron beam is used, an electron optical system including an electron lens and a deflector is used as the optical system. You can use it. It goes without saying that the optical path through which the electron beam passes is in a vacuum state.

(8) When a linear motor (see US Pat. No. 5,623,853 or US Pat. No. 5,528,118) is used for a wafer stage or a reticle stage, an air levitation type using an air bearing and a magnetic levitation type using Lorentz force or reactance force are used. Either may be used. Also, the stage
A type that moves along a guide or a guideless type that does not have a guide may be used.

(9) The reaction force generated by the movement of the wafer stage is (as described in US Pat. No. 5,528,118)
You may mechanically escape to the floor (ground) using a frame member. (10) The reaction force generated by the movement of the reticle stage is (as described in US S / N 416558)
You may mechanically escape to the floor (ground) using a frame member.

(11) An illumination optical system and a projection optical system composed of a plurality of lenses are incorporated in the exposure apparatus main body to perform optical adjustment, and a reticle stage and a wafer stage composed of many mechanical parts are mounted on the exposure apparatus main body. The exposure apparatus of the present embodiment can be manufactured by connecting wirings and pipes and performing overall adjustment (electrical adjustment, operation confirmation, and the like). It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature, cleanliness, and the like are controlled.

(12) For a semiconductor device, a step of designing the function and performance of the device, a step of manufacturing a reticle based on this design step, a step of manufacturing a wafer from a silicon material, and a reticle by the exposure apparatus of the above-described embodiment. The device is manufactured through a step of exposing the pattern to a wafer, a device assembling step (including a dicing step, a bonding step, and a package step), an inspection step, and the like.

[0045]

According to the present invention, the following effects can be obtained. (1) According to the stage control method of the first aspect, the step of controlling the drive of the fine movement stage to the target position is performed by moving the coarse movement stage according to the movement distance from the movement start position of the coarse movement stage to the target position. Since the step of controlling based on the movement distance from the start position to the current position and the step of controlling based on the movement time from the start of movement of the fine movement stage to the current time are switched, the movement distance of the coarse movement stage is short. In this case, even if the movement is started simultaneously by the control of the movement time of the fine movement stage, the positioning is performed separately from the coarse movement stage. Following the vibration response can be prevented.

(2) According to the stage device of the second aspect, the stage control means takes at least a time Tc required to prevent vibration when positioning the fine movement stage, and multiplies the time Tc by the time. When the movement distance of the coarse movement stage from the movement start position to the target position is shorter than the distance Lc, the time for positioning the fine movement stage becomes time Tc, where Lc is the distance that the coarse movement stage can move. So that the fine movement stage is positioned over a period of time in which vibration does not occur,
Stable and quick positioning becomes possible.

(3) According to the stage device of the third aspect, the stage control means sets the target position P of the fine movement stage at the current position to the distance Lc from the movement start position of the coarse movement stage to the target position. In the case of the above distance,
It is calculated by a relational expression based on the movement rate Rc, and the movement distance from the movement start position of the coarse movement stage to the target position is the distance L.
When the distance is shorter than c, the distance is calculated by a relational expression based on the value Tr of the function with the moving time t as a variable. Therefore, the total positioning time is shortened by starting the positioning at the same time, and the fine movement stage is switched by switching the input profile. Vibrational positioning can be prevented.

(4) According to the stage apparatus, the value Tr of the function is calculated and set by the following relational expression: Tr = (1−cos (πt / Tc)) / 2 Since a gentle input profile is obtained immediately before positioning, smoother and more stable positioning can be performed.

(5) According to the exposure apparatus of the fifth aspect,
With the above stage device, at least one of the mask stage and the substrate stage is composed of a coarse movement stage and a fine movement stage of the stage device, so that the mask stage or the substrate stage can be positioned stably and quickly, Throughput can be improved.

[Brief description of the drawings]

FIG. 1 shows an embodiment of an exposure apparatus according to the present invention.
It is the whole block diagram seen from the direction.

FIG. 2 is a front view showing a configuration of a stage on a reticle side in FIG. 1;

FIG. 3 is a diagram illustrating an exposure apparatus according to an embodiment of the present invention;
It is the whole block diagram seen from the direction.

FIG. 4 is a graph showing a function Tr in an embodiment of the exposure apparatus according to the present invention.

[Explanation of symbols]

2 Wafer Y-axis drive stage 5 Wafer 8 Projection optical system 9 Reticle support 10 Reticle Y-axis drive stage 11 Reticle minute drive stage 12 Reticles 14y1, 14y2 Interferometer for reticle minute drive stage 22A Main control system 23 Reticle Y-axis drive stage Interferometer for

Claims (5)

[Claims] 1. A coarse movement stage is moved in a predetermined direction, and a fine movement stage provided on the coarse movement stage is relatively moved with respect to the coarse movement stage to be positioned at target positions of the coarse movement stage and the fine movement stage. A stage control method for controlling the fine movement stage, the step of driving and controlling the fine movement stage to a target position,
A step of controlling based on a movement distance from the movement start position of the coarse movement stage to a current position according to a movement distance from the movement start position of the coarse movement stage to the target position, and a time from the start of movement of the fine movement stage to the current time. And a step of performing control based on the movement time of the stage. 2. A coarse movement stage movable in a predetermined direction, a fine movement stage provided on the coarse movement stage and movable relative to the coarse movement stage, and a coarse movement stage according to a current position of the coarse movement stage. Stage control means for calculating target positions of the moving stage and the fine moving stage, and performing control for positioning the fine moving stage at the target positions. The stage control means is configured to prevent vibration when the fine moving stage is positioned. At least the required time is Tc, and the distance over which the coarse movement stage can move over the time Tc is Lc, and the movement distance from the movement start position of the coarse movement stage to the target position is shorter than the distance Lc. Wherein the time for positioning the fine movement stage is set to time Tc. 3. The stage control means includes: a current position of the coarse movement stage Pc; a relative distance Li between the coarse movement stage and the fine movement stage at the start of movement; and a distance from the movement start position of the coarse movement stage to the current position. The moving rate, which is a value obtained by dividing the moving distance by the moving distance from the movement start position of the coarse movement stage to the target position, is Rc, the movement distance from the current position of the fine movement stage to the target position is L, and the movement of the fine movement stage is started. Where Tr is the value of a function having a variable moving time t from the current time to the current time, the target position P of the fine moving stage at the current position is defined as the moving distance from the moving start position of the coarse moving stage to the target position is the distance When the distance is equal to or longer than Lc, the distance is calculated by the following relational expression: P = Pc + Li + Rc × L. In the case of shorter than away Lc distance, the following equation; P = Pc + Li + Tr × stage apparatus according to claim 2, wherein the set is calculated by L. 4. The stage apparatus according to claim 3, wherein the value Tr of the function is calculated and set according to the following relational expression: Tr = (1−cos (πt / Tc)) / 2. 5. An illumination optical system for illuminating an illumination area on a mask, a mask stage for scanning the mask in a predetermined direction with respect to the illumination area, and a predetermined for an exposure area conjugate to the illumination area. A substrate stage that scans the substrate in the direction, and scanning the substrate on the exposure region in synchronization with scanning the mask on the illumination region, thereby sequentially patterning the mask. A scanning type exposure apparatus that projects onto the substrate, comprising: the stage device according to claim 2, wherein at least one of the mask stage and the substrate stage includes a coarse movement stage and a fine movement of the stage device. An exposure apparatus, comprising: a stage.