JP2000036117A - Method for adjusting optical flux and axis of semiconductor laser in optical pickup, housing for semiconductor laser, cell for detector of light from light source, and optical pickup - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable adjustment of optical axis of optical flux emitted from semiconductor laser in an optical pickup, without moving a coupling lens in the direction orthogonally crossing the optical axis. SOLUTION: The optical pickup writes, reproduces or erases information by taking in with a coupling lens 12 an optical flux emitted from a semiconductor laser 1, and converging with an objective lens 14 the optical flux so taken in as an optical spot on the recording surface 20A of an optical recording medium 20. In this case, the housing holding the semiconductor laser 1 is equipped with a housing body 5A for storing the semiconductor laser 1 and a holder 6 that can hold the semiconductor laser while being combined with the housing body 5A; the housing body 5A and the holder 6 are provided with a cylindrical surface CY that can fit snugly with each other; by bringing their cylindrical surface into slidable contact with each other, the holder 6 can rotate around the center axis of the cylindrical surface; and the holder 6 fixedly holds the semiconductor laser 1 so that the axis going through the light- emitting point q and crossing the active layer at right angles coincides with the center axis of the cylindrical surface CY.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a "method of adjusting the optical axis of a semiconductor laser in an optical pickup", a "housing for a semiconductor laser", a "light source photodetector cell" and an "optical pickup".

[0002]

2. Description of the Related Art A light beam emitted from a semiconductor laser is captured by a coupling lens, and the captured light beam is
An optical pickup that focuses as a light spot on a recording surface of an optical recording medium by an objective lens and performs writing, reproducing, and erasing of information is a compact disk (CD).
And optical recording media such as digital video disks (DVDs). In such an optical pickup, a light beam emitted from a semiconductor laser used as a light source is a divergent light beam, and its far field pattern (FFP) has an elliptical shape as is well known. The major axis direction of the FFP is a direction orthogonal to the active layer in the semiconductor laser chip, and the minor axis direction is a direction parallel to the active layer. The direction in which the light intensity peaks in the divergent light beam is referred to as “light beam optical axis”. A semiconductor laser is formed by integrating a semiconductor laser chip and its drive circuit system with a package. The semiconductor laser chip is mounted on the package such that the light beam optical axis is orthogonal to the front surface of the package. Assuming that the direction of the light beam optical axis when the light beam ideally exits is perpendicular to the package front surface,
The luminous flux from the semiconductor laser chip is "ideally that the luminous flux optical axis coincides with the above-mentioned reference axis". However, in actuality, the luminous flux optical axis of the emitted luminous flux is Has errors. Assuming that this error is “θ (P)” in the major axis direction of the FFP and “θ (V)” in the minor axis direction, θ (P) is about ± 2 degrees and θ (V) is about ± 3 degrees. .

[0003] The semiconductor laser is provided with the reference axis of the package (the light emitting portion of the semiconductor laser chip is located on the reference axis) aligned with the optical axis of the objective lens. If there is, the optical axis of the light beam does not match the optical axis of the objective lens, which causes a loss of light amount and deterioration of rim intensity. Loss of light amount and deterioration of rim intensity are serious problems in an optical pickup that performs optical writing, and optical axis adjustment is generally performed in an optical pickup that performs optical writing. Needless to say, it is preferable that the optical axis can be adjusted even in an optical pickup in which optical writing is not performed. The optical axis adjustment is generally performed in the short axis direction of the FFP. As a specific method, only the semiconductor laser (package) is translated in the short axis direction of the FFP, and the semiconductor laser and the coupling lens are paired and translated in the short axis direction. A method is conceivable. Of these optical axis adjustment methods, the former has a large parallel movement amount of the semiconductor laser, and therefore requires a coupling lens having a large aperture,
There is a problem that the light beam optical axis of the light beam incident on the objective lens is inclined, and the light-collecting performance of the objective lens is deteriorated. In the latter method, such a problem is avoided, but the coupling lens is provided with a function of collimating a divergent light beam emitted from the semiconductor laser to convert it into a parallel light beam. Coordination is essential. Therefore, in order to displace the coupling lens in the FFP short axis direction (the direction orthogonal to the optical axis) in addition to the optical axis direction, a two-way position adjustment mechanism for the coupling lens is required. This complicates the structure of the optical pickup structurally, and is not suitable for making the optical pickup smaller and thinner.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to make it possible to adjust the optical axis of a light beam emitted from a semiconductor laser without moving a coupling lens in a direction orthogonal to the optical axis in an optical pickup. Make it an issue.

[0005]

SUMMARY OF THE INVENTION A method of adjusting a light beam optical axis of a semiconductor laser according to the present invention is as follows. The light beam emitted from the semiconductor laser is captured by a coupling lens, and the captured light beam is recorded by an objective lens on a recording surface of an optical recording medium. In an optical pickup that converges a light spot on it and performs any of writing, reproducing, and erasing of information, the optical axis direction of a light beam emitted from a semiconductor laser as a light source is adjusted in a direction parallel to the active layer. How to do ". The optical pickup "performs any of writing, reproducing and erasing information"
This means that one or more of the three operations of writing, reproducing, and erasing information can be performed. This method has the following features. That is, "Semiconductor laser,
By rotating about an axis passing through the light emitting point and orthogonal to the active layer, the optical axis of the luminous flux coincides with the optical axis of the objective lens in a direction parallel to the active layer. " The rotation of the semiconductor laser is performed with respect to the package of the semiconductor laser. At this time, the rotation axis is the emission point of the semiconductor laser,
That is, since the light-emitting portion includes the light-emitting point of the semiconductor laser chip, the position of the light-emitting portion does not change by rotation, and the light beam optical axis rotates only in a plane parallel to the short axis direction of the FFP. The light emitting section of the semiconductor laser is located on the reference axis, and the reference axis is made to coincide with the optical axis of the coupling lens or the objective lens. Optical axis adjustment can be realized without adjusting displacement.

The semiconductor laser housing according to the present invention is characterized in that a light beam emitted from a semiconductor laser is captured by a coupling lens, and the captured light beam is condensed as a light spot on a recording surface of an optical recording medium by an objective lens. An optical pickup for performing any one of writing, reproducing, and erasing of information, wherein the method for adjusting the optical axis of a semiconductor laser according to claim 1 is realized. (Claim 2). The “housing body” houses the semiconductor laser. The "holder" holds the semiconductor laser and is combined with the housing body. The housing body and the holder have a cylindrical surface that fits tightly with each other, and the holder is rotatable about a central axis of the cylindrical surface by slidingly contacting the cylindrical surfaces. Further, the holder holds the semiconductor laser fixedly such that "an axis passing through the light emitting point and orthogonal to the active layer coincides with the central axis of the cylindrical surface". In the semiconductor laser housing according to the second aspect, the holder may have an engagement portion for engaging with a "rotation jig for rotationally adjusting the holder with respect to the housing body" (claim 3). ), The engagement portion with the rotating jig may be a “groove, hole or projection” (claim 4). In the semiconductor laser housing according to the second aspect, the rotation adjustment of the holder with respect to the housing main body can be performed by "using an eccentric pin". Can be formed (claim 5).
The “eccentric pin” is for adjusting the rotation of the holder with respect to the housing body. The light source photodetector cell of the present invention may be configured such that in the optical pickup as described above, a semiconductor laser, a light receiving element for detecting a return light beam from an optical recording medium, a hologram element for diffracting the return light beam, a hologram A light source photodetector cell comprising a mirror member for reflecting a light beam diffracted by an element toward a light receiving element, and a light receiving element provided on the housing body of the semiconductor laser housing according to claim 2 or 3 or 4 or 5. , The hologram element and the mirror member are fixedly provided in a predetermined positional relationship. Further, the optical pickup of the present invention is characterized in that the light beam emitted from the semiconductor laser is captured by a coupling lens, and the captured light beam is condensed as a light spot on a recording surface of an optical recording medium by an objective lens, thereby obtaining information. An optical pickup for performing any one of writing, reproduction, and erasing ", wherein a seventh aspect of the present invention includes the semiconductor laser housing according to any one of the second to fifth aspects. Item 8 is characterized in that it has the light source photodetector cell according to claim 6.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, reference numeral 1 denotes a "light source".
Reference numeral 5 denotes a “holding tool” that holds the semiconductor laser 1. Further, a portion indicated by reference numeral 10 is “a main body side portion of the optical pickup”, a reference numeral 20 is an optical recording medium, and a reference numeral 20A.
Indicates a “recording surface”. The main body-side portion 10 includes a coupling lens 12 and an objective lens 14, between which an “appropriate optical system”, for example, a light flux from a light source side according to a layout of an optical pickup is recorded on an optical recording medium. A deflecting prism for deflecting the light toward the optical recording medium 20; an optical path separating means for separating the optical path of the returning light flux from the optical recording medium from the optical path of the light flux traveling from the light source to the optical recording medium, and directing the light to the light detecting unit (the polarization beam splitter and Focus error signal (FE) by detecting return light flux
A servo mechanism for performing focusing and tracking is appropriately provided by a light detection unit that generates a track error signal (TE) and a reproduction signal (RF), and FE and TE generated by the light detection unit. As described above, the function of the coupling lens is a “collimating function” for converting the light beam from the light source into a parallel light beam. That is, the optical pickup shown in FIG. 1 captures a light beam emitted from the semiconductor laser 1 by the coupling lens 12 and condenses the captured light beam as a light spot on the recording surface 20A of the optical recording medium 20 by the objective lens 14. The optical pickup performs any of writing, reproducing, and erasing of information.

In this embodiment, the "optical axis adjusting method" according to the first aspect is implemented as follows. In holding the semiconductor laser 1 on the holder 5, the semiconductor laser 1
Is held by a jig (not shown) for adjusting the optical axis. The jig moves the held semiconductor laser 1 to its emission point q.
It is possible to adjust the rotation about an axis (the direction orthogonal to the figure) passing through the (fixed to the optical axis of the objective lens at the stage of being held by the jig) and orthogonal to the active layer. The optical axis of the objective lens 14 (coupling lens 1) in the direction parallel to the active layer
2). In this state, the semiconductor laser 1 is attached to the holder 5 using the adhesive 3.
Fixed to. In this way, the optical axis of the light beam emitted from the semiconductor laser 1 held by the holder 5 coincides with the optical axis of the objective lens 14 (in a direction parallel to the active layer).

FIG. 2 is a view for explaining one embodiment of the "semiconductor laser housing" according to the second aspect. The semiconductor laser housing captures a light beam emitted from the semiconductor laser 1 by the coupling lens 12, and condenses the captured light beam as a light spot on the recording surface 20 </ b> A of the optical recording medium 20 by the objective lens 14. This is a housing that holds the semiconductor laser 1 in an optical pickup that performs any of writing, reproduction, and erasing. The semiconductor laser housing shown in FIG. 2 includes a housing main body 5A that houses the semiconductor laser 1, and a holder 6 that holds the semiconductor laser 1 and is combined with the housing main body 5A. The housing body 5A and the holder 6 both have a cylindrical surface CY, and as shown in the figure, the cylindrical surfaces CY are slid in contact with each other (sliding in a state where they are perfectly fitted to each other). The holder 6
Are rotatable about the central axis of the cylindrical surface (in a direction perpendicular to the drawing). The holder 6 holds the semiconductor laser 1 in such a manner that the axis passing through the emission point q and orthogonal to the active layer is a cylindrical surface C
Fixedly so as to “coincide with the central axis of Y”. The holding of the semiconductor laser 1 by the holder 6 can be performed by press-fitting or bonding. When the housing body 5A holds the holder 6, the center axis of the cylindrical surface of the holder 6 is aligned with the objective lens 14A.
Is previously aligned with the main body side portion 10 of the optical pickup so as to be orthogonal to the optical axis of the optical pickup. Therefore, when the holder 6 holding the semiconductor laser 1 is combined with the housing main body 5A as shown in the figure, the holder 6 has only the freedom to rotate around the central axis of the cylindrical surface CY. Since the cylindrical surface of the holder 6 and the cylindrical surface of the housing body 5A "fit closely and slidably contact", even if the holder 6 rotates, the central axis of the cylindrical surface does not change with respect to the apparatus space. By rotating the semiconductor laser 1 about the axis passing through the light emitting point q and orthogonal to the active layer, the objective lens 1 is rotated in the direction parallel to the active layer.
4 optical axis ".

In the embodiment shown in FIG. 2, the cylindrical surfaces CY of the housing body 5A and the holder 6 are formed as "parts necessary for sliding contact with each other", that is, as partial cylindrical surfaces. Is not limited to this. FIG.
In the embodiment shown in (1), the holder 6B has a cylindrical shape, and the cylindrical surface CY1 is formed all around. The semiconductor laser 1 is inserted through a mounting hole formed in the peripheral surface of the holder 6B, and is fixedly held by the holder 6B by press-fitting or bonding. As shown in the drawing, the housing body 5B has a cylindrical surface CY2 that fits with the holder 6B at the center of the groove 50.
When the holder 6B is fitted into the housing body 5B, it cannot move in the direction of the groove 50. Further, since the housing body 5B also receives the bottom surface of the holder 6B, the position of the semiconductor laser 1 is secured only by dropping the holder 6B into the housing body 5B. Axis AX is cylindrical surface CY1
And passes through the light emitting portion of the semiconductor laser 1 and is orthogonal to the active layer. In the embodiment shown in FIG.
Is formed as a "peripheral surface portion of a disk-shaped flange portion having a small axial width" to reduce the size of the portion 60 holding the semiconductor laser 1. Accordingly, on the side of the housing body 5C, the cylindrical surface CY4 that is in sliding contact with the cylindrical surface of the holder 6C is thinned in the axial direction. Cylindrical surfaces CY3, CY
The semiconductor laser 1 fixed to the holder 6C rotates around the axis AX when the holder 6C is rotated by sliding contact with the holder 4. However, since the light emitting portion is located on the axis AX, the position is unchanged, and the light flux The optical axis rotates in a plane parallel to the active layer.

FIG. 5 shows three embodiments of the semiconductor laser housing according to the third and fourth aspects. In these embodiments, the holder of the semiconductor laser housing has an engaging portion for engaging with a “rotation jig for rotationally adjusting the holder with respect to the housing body”. In FIG. 5A, the “engagement portion with the rotating jig” of the holder 6a is a long groove 63, and the projections 71 and 72 of the rotating jig 7a are engaged with the long groove 63.
The holder 6a is fixed to the center axis A of the cylindrical surface by the rotation jig 7a.
Adjust rotation around X. In FIG. 5 (b), the “engagement portion with the rotating jig” of the holder 6b is a long hole 64,6.
The projections 73 and 74 of the rotating jig 7b are respectively engaged with the long holes 64 and 65, and the holder 6b is rotated and adjusted around the central axis AX of the cylindrical surface by the rotating jig 7b. . In FIG. 5C, the “engagement portion with the rotation jig” of the holder 6c is the projections 66 and 67. These projections 66 and 67 are engaged with the long groove 73 of the rotation jig 7c. The rotation jig 7c rotates the holder 6c around the central axis AX of the cylindrical surface.

FIGS. 6 and 7 show two embodiments of the semiconductor laser housing according to the fifth aspect of the present invention. In the semiconductor laser housing according to the fifth aspect, the rotation of the holder with respect to the housing body is adjusted by the “eccentric pin”. For this purpose, an engaging portion for the eccentric pin is formed in the housing body and the holder. The embodiment shown in FIG. 6 is based on the embodiment shown in FIG.
Reference numeral 70 indicates an “eccentric pin”. A hole 503 for fitting the eccentric pin 70 is formed as an “engaging portion” in the housing body 5B ′, and the eccentric pin 70 is formed in the holder 6B ′.
An elongated hole 601 in the axial direction of the cylindrical surface of the holder, into which the eccentric pin 71 is loosely fitted, is formed as an “engaging portion”. The eccentric pin 70 is inserted through the hole 503 of the housing main body 5B ′, and the pin 71 at the tip is inserted into the holder 6.
Insert into the slot of B '. In this state, the eccentric pin 7
0 “fits snugly” into hole 503. Eccentric pin 70
Is rotated, the pin 71 circularly moves in accordance with the eccentricity, and the holder 6B 'swings around the axis AX of the cylindrical surface following the circular motion. Adjustment of the light beam optical axis of the light beam from the laser 1 can be realized. After the adjustment, the eccentric pin 70 is removed. The embodiment shown in FIG. 7 is based on the embodiment shown in FIG.
Reference numeral 70 indicates an eccentric pin. Housing body 5
C ′ has an eccentric pin 71 at the tip of the eccentric pin 70.
Are formed as “engaging portions”, and a notch 505 for allowing rotation of the eccentric pin 70 is formed as an “engaging portion”. The holder 6C ′ has a cylindrical surface. A notch 602 that engages with the eccentric pin 70 is formed in a part of the flange-shaped portion as an “engaging portion”.
The eccentric pin 70 is inserted into the notch 602 of the flange portion of the holder 6C ', and the pin 71 at the tip is inserted into the fitting hole 504 of the housing body 5C'. In this state, the pin 71 “fits tightly” into the fitting hole 504. When the eccentric pin 70 is rotated, the eccentric pin 70 makes a circular motion according to the eccentricity around the pin 71, and the holder 6C 'follows the circular motion and swings around the axis AX of the cylindrical surface. Rotate. Using this, the optical axis of the light beam from the semiconductor laser 1 is adjusted. Eccentric pin 70 after adjustment
Remove. FIG. 8 shows an embodiment of the “light source photodetector cell” according to claim 6. The light source photodetector cell includes a semiconductor laser, a light receiving element for detecting a return light beam from the optical recording medium, a hologram element for diffracting the return light beam, and a mirror member for reflecting the light beam diffracted by the hologram element toward the light receiving element. Are integrated cells. FIG.
As shown in the upper part of FIG.
Is held. The housing body 7 includes a light receiving element 10
0, a hologram element 110 and a mirror member 120 are fixedly provided in a predetermined positional relationship. Holder 6D
In combination with the housing body 7, the optical axis of the light beam is adjusted by rotation adjustment in which the cylindrical surfaces are slid in contact with each other. The rotation adjustment at this time is performed by the “adjustment method using the eccentric pin” described with reference to FIG. 7, but may be performed by the “method using a rotation jig” as shown in FIG.

FIG. 9 shows only an essential part of an embodiment of the "optical pickup" according to the eighth aspect. The optical axes of the coupling lens 12 and the objective lens 14 are aligned. The light source photodetector cell 200 is the one according to the sixth embodiment described in the first embodiment with reference to FIG. The light beam from the light emitting point q of the semiconductor laser 1 (the mounting position of the cell is determined so as to be located on the optical axis of the objective lens) passes through the light transmitting portion of the mirror member 120 and passes through the hologram element 110. To Penetrate. The hologram element 110 is a “polarization hologram element” having a different hologram effect depending on the polarization state of the transmitted light beam, and transmits the light beam as it is without exerting a hologram effect on the light beam from the semiconductor laser 1. The light beam transmitted through the hologram element 110 is converted into a parallel light beam by the coupling lens 12, converted into a focused light beam by the objective lens 14, focused toward the optical recording medium 20, transmitted through the substrate of the optical recording medium 20, and recorded on the recording surface. The light is focused on 20A as a light spot. Recording surface 20A
Immediately reflected light becomes “return light flux”, and the objective lens 1
4, the light passes through the coupling lens 12, and then enters the hologram element 110 while being collected. On the optical path between the coupling lens 12 and the objective lens 14,
A quarter wave plate is provided. Since the light beam is transmitted through the quarter-wave plate twice back and forth, the return light beam is in a state where the polarization plane is rotated by 90 degrees from the initial state, and the hologram element 110 is returned.
Incident on. Therefore, hologram element 110 exerts a diffractive effect on the returning light beam. The return light beam diffracted by this diffraction action is reflected by the “reflection surface formed by making the side end surface portion forming the thickness into a slope” of the mirror member 120, condensed and incident on the light receiving element 100, and is subjected to FE and TE. Alternatively, RF is generated together with these. The optical axis of the light beam of the semiconductor laser 1 is adjusted by rotating the holder 6D so that the semiconductor laser 1 is "rotated around an axis passing through the light emitting point q and orthogonal to the active layer". The hologram element 110 does not necessarily need to be a polarization hologram, but may be a normal hologram. In that case, of the light flux from the light source, the 0th-order light that is transmitted straight through the hologram element 110 is applied to the optical recording medium, and the first-order diffracted light component of the return light flux that is diffracted by the hologram element 110 is: The light is received by the light receiving element 100. In this case, of course, it is not necessary to provide a quarter-wave plate in the optical path. The light source photodetector cell in FIG. 8 may be replaced with a “semiconductor laser housing” according to any one of claims 2 to 5, for example, as shown in FIGS.
Needless to say, it can be replaced with any of those shown in FIG. 7 (claim 7). In this case, however, it is necessary to provide a means for detecting the return light beam, separately from the semiconductor laser housing. As the return light beam detecting means, a conventionally known appropriate means can be used.

[0014]

As described above, according to the present invention, a novel method for adjusting the optical axis of a semiconductor laser in an optical pickup, a novel semiconductor laser housing, a novel light source photodetector cell, and a novel light Pickup can be realized. According to the “optical axis adjustment method of the semiconductor laser” of the present invention, the semiconductor laser itself is rotated without moving the coupling lens in the direction orthogonal to the optical axis,
The optical axis of the light beam can be easily and reliably matched to the optical axis of the objective lens in a direction parallel to the active layer. That is, the error of the light beam optical axis: θ (P) can be made substantially zero. According to the “semiconductor laser housing” of the present invention, the holder holding the semiconductor laser is combined with the housing body,
By adjusting the rotation of the holder, the above-described optical axis adjustment method can be easily performed. According to the "light source photodetector unit" of the present invention, the above-described optical axis adjustment method can be performed by combining the holder holding the semiconductor laser with the housing body and adjusting the rotation of the holder by using the objective lens or the coupling lens. Not only for the hologram element but also for the mirror member. According to the optical pickup of the present invention, by adjusting the rotation of the holder holding the semiconductor laser with respect to the housing body of the semiconductor laser housing, the error of the optical axis of the luminous flux: θ ( P) is substantially 0
Therefore, good optical pickup operation is possible, and particularly, good information writing becomes possible.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a method of adjusting an optical axis of a semiconductor laser according to the present invention.

FIG. 2 is a view for explaining an embodiment of a semiconductor laser housing according to the present invention;

FIG. 3 is a view for explaining another embodiment of the semiconductor laser housing of the present invention.

FIG. 4 is a view for explaining another embodiment of the semiconductor laser housing of the present invention.

FIG. 5 is a view showing three examples of a semiconductor laser housing according to the third and fourth embodiments.

FIG. 6 is a view for explaining an embodiment of a semiconductor laser housing according to claim 5;

FIG. 7 is a view for explaining another embodiment of the semiconductor laser housing according to claim 5;

FIG. 8 is a view for explaining an embodiment of the light source photodetector cell according to claim 6;

FIG. 9 is a view for explaining one embodiment of the optical pickup according to claim 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor laser 5A Housing main body 6 Holder 10 Main body side of optical pickup 12 Coupling lens 14 Objective lens 20 Optical recording medium 20A Recording surface

Claims (8)

[Claims] A light beam emitted from a semiconductor laser is captured by a coupling lens, and the captured light beam is condensed as a light spot on a recording surface of an optical recording medium by an objective lens to write, reproduce, and erase information. A method of adjusting an optical axis direction of a light beam emitted from a semiconductor laser as a light source in a direction parallel to an active layer, wherein the semiconductor laser is activated through its emission point. A method of adjusting a light beam optical axis of a semiconductor laser in an optical pickup, wherein the light beam optical axis is made to coincide with the optical axis of an objective lens in a direction parallel to the active layer by rotating about an axis perpendicular to the layer. 2. A light beam emitted from a semiconductor laser is captured by a coupling lens, and the captured light beam is condensed as a light spot on a recording surface of an optical recording medium by an objective lens to write, reproduce, and erase information. An optical pickup for performing any one of the above, comprising: a housing for holding a semiconductor laser, comprising: a housing body for housing the semiconductor laser; and a holder for holding the semiconductor laser and being combined with the housing body. The holder has a cylindrical surface that fits tightly with each other, and the holder is rotatable around a central axis of the cylindrical surface by slidingly contacting the cylindrical surfaces with each other. Is fixedly held so that an axis passing through the light emitting point and orthogonal to the active layer coincides with the central axis of the cylindrical surface. A housing for a semiconductor laser, characterized in that: 3. The semiconductor laser housing according to claim 2, wherein the holder has an engagement portion for engaging with a rotation jig for adjusting the rotation of the holder with respect to the housing main body. Laser housing. 4. The semiconductor laser housing according to claim 3, wherein the engagement portion of the holder with the rotation jig is a groove, a hole, or a projection. 5. The semiconductor laser housing according to claim 2, wherein the housing main body and the holder are formed with an engaging portion for the eccentric pin so that the holder can be rotated and adjusted by the eccentric pin with respect to the housing main body. A housing for a semiconductor laser. 6. A light beam emitted from a semiconductor laser is captured by a coupling lens, and the captured light beam is condensed as a light spot on a recording surface of an optical recording medium by an objective lens to write, reproduce, and erase information. A semiconductor laser, a light receiving element for detecting a returning light beam from the optical recording medium, a hologram element for diffracting the returning light beam, and a light beam diffracted by the hologram element directed to the light receiving element. A light source photodetector cell in which a mirror member to be reflected is integrated, wherein the light receiving element, the hologram element, and the mirror member are located at predetermined positions on a housing body of the semiconductor laser housing according to claim 2. A light source photodetector cell fixedly provided in a relationship. 7. A light beam emitted from a semiconductor laser is captured by a coupling lens, and the captured light beam is condensed as a light spot on a recording surface of an optical recording medium by an objective lens to write, reproduce, and erase information. An optical pickup comprising: the semiconductor laser housing according to any one of claims 2 to 5; 8. A light beam emitted from a semiconductor laser is captured by a coupling lens, and the captured light beam is condensed as a light spot on a recording surface of an optical recording medium by an objective lens to write, reproduce, and erase information. An optical pickup, comprising: the light source photodetector cell according to claim 6.