JP2000031032A - Device manufacturing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent falling of a cleaning plate during chuck cleaning, by installing a falling preventing mechanism of the held cleaning plate on a holding means which holds the cleaning plate on a chuck. SOLUTION: A current is made to flow in an electromagnet 8, and a chuck cleaning unit 9 is made to descent under the condition where a magnetic field of a permanent magnet 7 is canceled, and pressed against a chuck cleaning plate 5. Then, by cutting off a current flowing in the electromagnet 8, a magnetic material 6 is attracted by a magnetic force due to the permanent magnet 7, and the chuck cleaning plate 5 is attracted and held on the chuck cleaning unit 9. When emergency stop or the like of equipment occurs during cleaning, the chuck cleaning plate 5 is lifted being held with the chuck cleaning unit 9 by the action of the magnetic material 6 and the permanent magnet 7, and the chuck cleaning plate 5 is prevented from falling from a predetermined position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a device manufacturing apparatus such as an exposure apparatus used for manufacturing a semiconductor device or a liquid crystal device, and more particularly to a device manufacturing apparatus having a chuck cleaning function.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor exposure apparatus, with the miniaturization and high integration of semiconductor elements, a high degree of accuracy has been required for alignment and position control of a wafer to be printed with a pattern. In the chuck for holding the wafer, high machining accuracy and wafer holding ability have been required. The chuck maintains the flatness of the wafer to maintain uniform exposure accuracy, and holds the wafer by suction at a constant vacuum. Therefore, if dust is present between the chuck and the wafer, even if the dust is fine, the holding capacity for the wafer is reduced, and the presence of the dust causes the wafer to be partially lifted or warped. This is a major cause of a decrease in exposure accuracy due to defocus or the like during exposure.

In order to prevent such deterioration in exposure accuracy, cleaning of the chuck is performed at regular intervals of operation. This cleaning uses a dedicated cleaning plate and a cleaning unit, and in a state where the normal operation of the exposure apparatus is stopped, the cleaning plate is pressed onto the chuck by the cleaning unit and rocked to rub the chuck surface to remove dust on the surface. It is done by shaving.

[0004]

By the way, in the present chuck cleaning mechanism of the semiconductor exposure apparatus, the cleaning unit and the cleaning plate exist independently, and the cleaning operation is performed by holding the cleaning plate on the chuck (three pins). After cleaning, the cleaning unit presses the chuck against the chuck. At the end of cleaning, the cleaning unit is separated from the cleaning plate, and the cleaning plate is removed from the chuck (three pins). When an emergency stop or the like is performed in this sequence, the conventional cleaning unit and chuck have no mechanism for holding the cleaning plate. Therefore, there is a risk that the cleaning plate may fall down and roll down into the apparatus. There is a problem that the device may be damaged due to interference with other parts. SUMMARY OF THE INVENTION It is an object of the present invention to prevent a cleaning plate from falling during a chuck cleaning operation and to prevent damage inside the apparatus.

[0005]

In order to achieve the above object, according to the present invention, there is provided a holding means for holding a cleaning plate on a chuck, and the cleaning plate is held in contact with the cleaning plate. And means for cleaning the chuck by moving the cleaning plate, and the holding means includes a mechanism for preventing the held cleaning plate from falling.

The holding means may include a permanent magnet and an electromagnet. In this case, the cleaning plate can be held by their magnetic force. Further, the fall prevention mechanism may include a mechanism for canceling the holding force by canceling the magnetic force of the permanent magnet by energizing the electromagnet,
In this case, the cleaning plate can be prevented from dropping by maintaining the holding even when the electromagnet is de-energized. The holding means may have a mechanical hook. In this case, the holding operation can be performed by opening and closing the hook. Further, the holding means may include a means for generating a vacuum, in which case the holding operation can be performed by the vacuum. Further, a sensor for detecting the operation state of the fall prevention mechanism may be provided. In this case, the device can be stopped by the detection of the sensor.

[0007]

According to the above arrangement, at the time of chuck cleaning, the chuck cleaning plate is placed on the chuck, and the chuck cleaning unit presses the chuck cleaning plate to move the chuck cleaning plate and the chuck relatively to perform chuck cleaning. After the completion of the above, in a series of operation sequences for removing the chuck cleaning plate from the chuck by separating the chuck cleaning unit from the chuck cleaning plate, in the case of an emergency stop or the like, the fall prevention mechanism holds the cleaning plate to prevent the chuck from falling. And the other parts in the apparatus can be prevented from being damaged.

Further, during the cleaning operation, the condition of the cleaning plate is monitored by the sensor, and an unexpected operation of the cleaning plate is detected, whereby
Emergency operation measures such as device stoppage can be performed, and secondary troubles are prevented.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In one embodiment of the present invention, the device manufacturing apparatus is a semiconductor exposure apparatus for transferring a mask or reticle pattern onto a semiconductor wafer mounted on an XY stage. It includes a cleaning plate for cleaning and a mechanism for holding the cleaning plate, a cleaning unit for pressing the cleaning plate by a chuck, and one or more sensors for detecting the situation when the cleaning plate cannot be held. It is a device having a configuration having The cleaning plate is held by the cleaning unit during the cleaning operation of the chuck, and in the case of an emergency stop, the cleaning unit lifts up while holding the cleaning plate, so that the cleaning plate may fall into the apparatus or be removed from other parts of the apparatus. To prevent damage due to interference.

The sensor for detecting the holding of the cleaning plate always monitors the state of the cleaning plate during the cleaning operation, and when the cleaning plate performs an unexpected operation, detects the operation immediately and generates a signal.
Upon receiving this signal, the device performs an emergency operation such as stopping the device, thereby preventing a secondary trouble. The sensor also monitors the state of the cleaning plate at the time of startup after an emergency stop, and issues a signal not to start a normal operation when the cleaning plate is not at a predetermined position. By these mechanisms, cleaning of the chuck can be performed safely, and damage to the apparatus can be prevented.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 shows a configuration of a chuck cleaning system of a semiconductor manufacturing apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the semiconductor manufacturing apparatus according to the present embodiment includes a chuck 3 for holding a wafer on which a circuit pattern is to be printed, three pins 4 for a wafer transfer operation, and XY directions ( XY stage 2 that can freely move (in the horizontal direction), stage base 1 serving as a base of the XY stage 2, chuck cleaning plate 5 for cleaning chuck 3, and chuck cleaning plate for holding chuck cleaning plate 5. A magnetic body 6 provided on the chuck 5, a chuck cleaning unit 9 for pressing the cleaning plate 5 against the chuck 3, a permanent magnet 7 built in the chuck cleaning unit 9 for holding the chuck cleaning plate 5, and a permanent magnet 7; Counteract magnetic force, chuck cleaning Electromagnet 8 is built in the chuck cleaning unit 9 to enable attachment and detachment of the plate 5, plate monitor sensor 10 chuck cleaning plate 5 monitors whether a predetermined position
Consists of The electromagnet 8 is mounted so that a magnetic field opposite to that of the permanent magnet 7 is generated when a current is applied.

At the time of the chuck cleaning operation, the chuck cleaning plate 5 is placed on the three pins 4 protruding from the surface of the chuck 3. The three pins 4 have a vacuum mechanism and suck the chuck cleaning plate 5. Next, a current flows through the electromagnet 8, and the chuck cleaning unit 9 descends in a state where the magnetic field of the permanent magnet 7 is canceled, and is pressed against the chuck cleaning plate 5. Here, by cutting off the current of the electromagnet 8, the magnetic body 6 is attracted by the magnetic force of the permanent magnet 7, and the chuck cleaning plate 5 is attracted and held by the chuck cleaning unit 9. Next, the vacuum is cut off by the three pins 4 and the cleaning plate 5 is released from the three pins 4.
Is pulled into the chuck 3, and the cleaning plate 5 is pressed against the surface of the chuck 3. In this state, XY
The chuck 3 is cleaned by swinging the stage 2. After the cleaning is completed, first, the chuck 3 is lowered to collect the cleaning plate 5.
The main pin 4 projects from the surface of the chuck 3 and the chuck cleaning plate 5 rests on the three pins 4.
This pin 4 sucks the chuck cleaning plate 5 by vacuum. Thereafter, the chuck cleaning unit 9 ascends in a state where a current is applied to the electromagnet 8 to cancel the magnetic field of the permanent magnet 7, and further, the vacuum suction of the three pins 4 is cut off to collect the chuck cleaning plate 5. Ends.

If an emergency stop of the apparatus occurs during the cleaning operation, the chuck cleaning plate 5
By the action of the magnetic body 6 and the permanent magnet 7, the ascent is lifted while being held by the chuck cleaning unit 9, and the chuck cleaning plate 5 is prevented from dropping from a predetermined position. If the chuck cleaning plate 5 comes off the chuck cleaning unit 9 during the chuck cleaning operation, the plate monitoring sensor 10 detects this and immediately stops the operation of the apparatus and outputs an error signal. Also, when the apparatus is started up after an emergency stop, the chuck cleaning unit 9
If there is no chuck cleaning plate 5 to be pulled up by the above, the plate monitoring sensor 10 detects an abnormality and outputs an error signal for performing an appropriate measure such as stopping the subsequent operation.

(Second Embodiment) FIG. 2 shows a configuration of a chuck cleaning system according to a second embodiment of the present invention. In FIG. 2, the configuration and operation of each part except for the mechanism for preventing the chuck cleaning plate from falling are the same as in the first embodiment. As the fall prevention mechanism, the first
In contrast to the embodiment, the hook 11 is provided in the chuck cleaning unit 9 for holding the chuck cleaning plate, and the chuck cleaning plate 12 is a dedicated plate having a configuration to be hooked on the hook 11. The hook 11 can be opened and closed. The holding operation with respect to the chuck cleaning plate 12 is performed by lowering the chuck cleaning unit 9 and then opening the plate holding hook 11 with the chuck cleaning plate 12 pressed against the chuck 3. Then, the plate 12 is held while being caught by the chuck cleaning plate 12.

(Third Embodiment) FIG. 3 shows a configuration of a chuck cleaning system according to a third embodiment of the present invention. In FIG. 3, the configuration and operation of each unit other than the mechanism for preventing the chuck cleaning plate from falling are the same as in the first embodiment. As the fall prevention mechanism, the first
In contrast to the embodiment, for the operation of holding the chuck cleaning plate, a dedicated vacuum mechanism 14 incorporated in the chuck cleaning unit 9 and a chuck cleaning plate 13 dedicated to vacuum holding are used.
The vacuum mechanism 14 can control ON / OFF of the vacuum by controlling the electromagnetic valve 15 and the like. The holding operation for the chuck cleaning plate 13 is as follows.
After the chuck cleaning unit 9 is lowered, the vacuum mechanism 14 starts vacuuming, and holds the chuck cleaning plate 13 in a state of sucking the plate.

As described above, according to the above-described embodiment, during a chuck cleaning operation, the cleaning unit presses the chuck, and when the cleaning is completed, the cleaning plate is removed from the chuck. On the occasion,
The risk of the cleaning plate falling into the apparatus can be prevented, and damage due to interference with other parts in the apparatus can be prevented.

A corresponding device can be manufactured by a manufacturing process including a step of preparing an exposure apparatus which is one of the above-described embodiments and a step of performing exposure using the exposure apparatus. is there.

(Embodiment of Device Production Method) Next, an embodiment of a device production method using the above-described exposure apparatus or exposure method will be described. FIG. 4 shows a small device (IC
1 shows a flow of manufacturing semiconductor chips such as LSIs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, and the like. In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. Step 3
In (wafer manufacture), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process and uses the prepared mask and wafer to
An actual circuit is formed on a wafer by a lithography technique. The next step 5 (assembly) is called post-processing,
This is a process of forming a semiconductor chip using the wafer produced in Step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 5 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern on the mask is printed and exposed on the wafer by the semiconductor exposure apparatus having the chuck cleaning system having the alignment apparatus described above. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

By using the production method of this embodiment, it is possible to produce a highly integrated device, which was conventionally difficult to produce, at low cost.

[0021]

It should be noted that the present invention is not limited to the above-described embodiment, but can be implemented with appropriate modifications. For example, in the above description, chuck cleaning mainly applied to a semiconductor exposure apparatus has been described. However, the present invention is not limited to the semiconductor exposure apparatus. The present invention is also applicable to a device manufacturing apparatus other than an exposure apparatus including an inspection apparatus such as a device or a liquid crystal device, and an assembling apparatus.

In the above description, the XY stage and / or the cleaning plate are moved in the X direction and the Y direction.
However, the present invention is not limited to the oscillating motion, and any manner of movement is possible as long as the chuck and the cleaning plate move relatively. For example, if the XY stage or the cleaning plate is driven in a sine wave shape having at least one of a phase and a cycle different in the X direction and the Y direction, the XY stage moves so as to draw a so-called Lissajous figure. By changing the amplitude or changing the phase, cycle or amplitude over time, the trajectory can be moved to draw a more complicated trajectory. One-way or two-way driving may be performed in a wave shape other than a sine wave such as a rectangular wave or a triangular wave. When both the XY stage and the cleaning plate are driven, both are driven two-dimensionally as described above, but the waveform, period, phase, amplitude, and direction may not be the same. By driving the cleaning plate and the cleaning plate one-dimensionally in different directions, they may be relatively two-dimensionally moved.

[0023]

According to the present invention, there is provided a device manufacturing apparatus having a function of cleaning a chuck by relatively moving the cleaning plate and the chuck while the cleaning plate and the chuck are in contact with each other. By providing the mechanism for preventing the cleaning plate from dropping, the cleaning plate can be prevented from dropping during an emergency stop in the chuck cleaning operation sequence, and the device can be damaged due to interference with other parts in the device. Etc. can be prevented beforehand.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a first exemplary embodiment of the present invention.

FIG. 2 is a diagram illustrating a configuration of a second exemplary embodiment of the present invention.

FIG. 3 is a diagram showing a configuration of a third exemplary embodiment of the present invention.

FIG. 4 is a diagram showing a flow of manufacturing a micro device.

FIG. 5 is a diagram showing a detailed flow of a wafer process in FIG. 4;

[Explanation of symbols]

1: stage base, 2: XY stage, 3: chuck,
4: 3 pins, 5: chuck cleaning plate,
6: magnetic material, 7: permanent magnet, 8: electromagnet, 9: chuck cleaning unit, 10: plate monitoring sensor, 1
1: plate holding mechanism (hook), 12: chuck cleaning plate (for mechanical hook), 13: chuck cleaning plate (for vacuum), 14: vacuum mechanism.

Claims (7)

[Claims] 1. A cleaning device comprising: a holding unit for holding a cleaning plate on a chuck; and a unit for cleaning the chuck by relatively moving the cleaning plate and the chuck while the cleaning plate and the chuck are in contact with each other. The device manufacturing apparatus, wherein the holding means includes a mechanism for preventing the held cleaning plate from falling. 2. The device manufacturing apparatus according to claim 1, wherein said holding means includes a permanent magnet and an electromagnet, and holds said cleaning plate by magnetic force. 3. The fall prevention mechanism comprises a mechanism for canceling the holding by canceling the magnetic force of the permanent magnet by energizing the electromagnet, so that the holding is maintained even when the energization of the electromagnet is cut off to prevent the fall. 3. The device manufacturing apparatus according to claim 2, wherein: 4. The holding means has a mechanical hook,
2. The device manufacturing apparatus according to claim 1, wherein the holding operation is performed by opening and closing the hook. 5. The device manufacturing apparatus according to claim 1, wherein said holding means has means for generating a vacuum, and performs a holding operation by said vacuum force. 6. The device manufacturing apparatus according to claim 1, further comprising a sensor for detecting an operation state of the fall prevention mechanism, wherein the device is stopped by the detection of the sensor. . 7. A manufacturing process including a step of preparing an exposure apparatus, which is one of the device manufacturing apparatuses according to claim 1, and a step of performing exposure using the exposure apparatus. A device manufacturing method characterized by manufacturing a device by using the method.