JP2000021956A - Notch aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the time required for a notch alignment. SOLUTION: A notch aligner 100 is provided by a rotating stage 1 and a fixed stage 2, comprising a drop type stage supporting up a circumference section 200a of a wafer 200. The rotating stage 1 is configured so as to start its rotation from a predetermined fixed rotational position to detect a notch position of the wafer 200 supported, and the fixed stage 2, unless the notch position is detected during the rotation of the rotating stage 1, is configured to receive the wafer 200 from the rotating stage 1, rotate it the predetermined angle, and transfer the wafer 200 rotated to the stage 1. The rotating stage 1 receiving the wafer 200 restarts its rotation from the fixed rotation position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a notch aligner suitable for a large wafer having a diameter of 300 mm or the like.

[0002]

2. Description of the Related Art As is well known, a silicon wafer has a notch in a chord shape or a V-shaped or U-shaped notch as a mark for indicating a reference rotational position in a circumferential direction of the wafer. Notch (usually about 1 mm deep)
Are formed on the outer periphery. When performing processing such as semiconductor gate formation on a wafer, it is required that each wafer be set on the processing stage in a state where the position of the orientation flat or the notch always coincides with the reference rotation position. Is done.

A cassette usually contains a plurality of wafers in a random state. Therefore, if the wafer is taken out of the cassette by the transfer robot and directly set on the processing stage, the wafer is set on the processing stage in a state where the position of the orientation flat or the notch does not match the reference rotation position, and the wafer is set on the processing stage. On the other hand, desired processing cannot be performed.

Therefore, the wafer taken out of the cassette is carried into an orientation flat aligner or notch aligner, and the position of the orientation flat or notch is adjusted to a reference rotation position by the orientation flat aligner or notch aligner. A method of setting the processing stage is adopted.

[0005] The conventional notch aligner employs a vacuum suction system, and has a holding means for holding the wafer by vacuum-sucking an area up to 5 mm from the outer periphery of the wafer, and holding means for holding the wafer. The device is configured to rotationally drive and detect the position of the notch during the rotation, and to match the position of the notch with the reference rotational position.

[0006]

However, according to the conventional notch aligner, if the notch space of the notch is located in the vacuum hole opened in the wafer holding surface of the holding means, the attraction force of the holding means is reduced. It is difficult to rotate the means at a high speed, so that it is necessary to rotate the holding means at a low speed, which increases the time required for notch alignment.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and has as its main object to reduce the time required for notch alignment.

[0008]

SUMMARY OF THE INVENTION A notch aligner according to the present invention includes holding means for holding a wafer having a notch formed thereon. The holding means holding the wafer is rotated and the notch is rotated during the rotation. In a notch aligner that detects a position and matches a notch position with a reference rotation position, the holding means is configured by a drop-down stage that supports an outer peripheral portion of the wafer from below.

Here, if the outer peripheral portion of the wafer supported by the stage is configured as a non-device forming area (an annular region having a width of, for example, 3 mm from the outer peripheral end), the stage comes into contact with the device forming area of the wafer. Therefore, it is possible to prevent a problem that the device formation area is damaged.

Specifically, the stage has three receiving portions for supporting the outer peripheral portion of the wafer from below, and the receiving portions are arranged at equal angular intervals with respect to the rotation center position of the stage. And each receiving portion is formed at the end of a narrow arm which is an L-shaped arm and extends linearly toward the center of rotation when viewed in a plan view. A space is formed to allow the transfer robot's hand for exchanging wafers with the transfer robot to move forward, descend, move up, and move back.

Further, since the receiving portion is made of a transparent material, the notch can be detected by a light transmitting or light reflecting sensor even when the notch is located on the receiving portion. Retry (re-detection of notch position) when not detected
Time can be reduced.

Another notch aligner of the present invention includes holding means for holding a wafer having a notch formed thereon, and rotationally drives the holding means for holding the wafer and detects a notch position during the rotation. In a notch aligning machine that matches a notch position with a reference rotation position, the holding unit includes:
The lower stage is configured to support the outer peripheral portion of the wafer from below, and the stage includes a rotating stage and a fixed stage, each rotating shaft being arranged on the same axis, and the fixed stage is a hand of a transfer robot. The rotary stage receives the wafer from the fixed stage, and starts rotating from a preset fixed rotational position for detecting the notch position of the wafer. When the notch position cannot be detected during the rotation, the wafer is transferred to the fixed stage at the fixed rotation position, and the fixed stage rotates by a predetermined angle when receiving the wafer from the rotation stage. The rotation stage is configured to correct the notch position of the wafer, Receiving the wafer after the notch position correction from the stage, starting rotation from the fixed rotation position again for notch position detection, and transferring the wafer whose notch position is detected and notch alignment is completed to the fixed stage. It is characterized by that.

Here, if the outer peripheral portion of the wafer supported by the stage is configured to be a non-device forming area, the stage does not contact the device forming area of the wafer, thereby preventing the device forming area from being damaged. can do.

Specifically, the rotary stage has three first receiving portions for supporting the outer peripheral portion of the wafer from below, and each of the first receiving portions is based on the rotation center position of the rotary stage. Are arranged at equal angular intervals, and each first receiving portion is
The fixed stage is formed at the end of a narrow arm that extends linearly toward the center of rotation when viewed in a plane, and the fixed stage includes three second supports that support the outer peripheral portion of the wafer from below.
Receiving portions, each second receiving portion is disposed at equal angular intervals with respect to the rotation center position of the fixed stage, and
The receiving part is formed at the end of a narrow arm that is an L-shaped arm and extends linearly toward the center of rotation when viewed in a plan view. Advancement of the hand for exchanging wafers with
A space that allows each of the descending, ascent, and retreat operations is formed,
Each arm of the rotary stage is positioned between each arm of the fixed stage and can be moved up and down. When the rotary stage is raised, each first receiving portion of the rotary stage is connected to the second receiving portion of the fixed stage. And when the wafer supported by the second receiving portion of the fixed stage is moved up to the height position of the second receiving portion, the wafer is supported by the first stage of the rotating stage.
When the rotary stage is lowered, the first receiving portions of the rotary stage are located between the second receiving portions of the fixed stage and lowered to the height position of the second receiving portion. Then, the wafer supported by the first receiving portion of the rotary stage is transferred to the second receiving portion of the fixed stage, and when the rotary stage is lowered, each of the first receiving portions of the rotary stage is moved. When the portion is in a positional relationship to interfere with the second receiving portion of the fixed stage, the fixed stage rotates so as to avoid this interference. With such a configuration, the notch of the wafer is located on the first receiving portion of the rotary stage, and the notch is detected by an optical sensor such as a light transmission type or a light reflection type which is usually used for notch detection. Even if it is not possible, the notch is transferred to the fixed stage from the rotary stage, the rotation angle position of the wafer is changed by the fixed stage, and the wafer is transferred to the rotary stage again, so that the notch is set in the first receiving portion of the rotary stage And the notch can be detected. In addition, by moving the rotary stage up and down, the wafer can be easily exchanged between the fixed stage and the rotary stage.

In this case, the hand of the transfer robot does not hinder the lifting and lowering of the arm of the rotary stage from the time when the wafer is transferred to the fixed stage to the time when the notched wafer is received. When the device is configured to stand by in the position where it has entered the notch, the notch alignment can be started earlier and the notched wafer can be notched as compared with the case where the hand stands by outside the notch alignment machine during the notch alignment. The wafer can be unloaded from the aligner at an early stage, and the total time required for loading and unloading the wafer from the notch aligner can be reduced.

Further, another notch aligner according to the present invention includes holding means for holding a wafer having a notch formed thereon, and rotationally drives the holding means for holding the wafer, and sets the notch position during the rotation. In a notch aligning machine that detects and matches a notch position with a reference rotation position, the holding unit is configured by a drop-in type stage that supports an outer peripheral portion of the wafer from below, and the rotation axes of the stages are on the same axis. The fixed stage has three second receiving portions that support the outer peripheral portion of the wafer from below, and exchanges a wafer with a hand of a transfer robot. And the second receiving portions are arranged at equal angular intervals with respect to the rotation center position of the fixed stage. The part is formed at the end of a narrow arm that is an L-shaped arm and extends linearly toward the center of rotation when viewed in a plan view. A space is formed to allow forward, downward, upward, and backward movements of the hand for exchanging wafers, and the rotary stage includes three first transparent bodies that support an outer peripheral portion of the wafer from below.
Receiving a wafer from the fixed stage, sequentially performing a rotation operation for notch position detection and a rotation operation for notch alignment based on the detected notch position, and transfers the wafer after the notch alignment to the fixed stage. The first receiving portions are arranged at equal angular intervals with respect to the rotation center position of the rotary stage, and each first receiving portion is located at the rotation center position when viewed in plan. The arm of the rotary stage is formed at the end of a narrow arm that extends linearly toward the center, and each arm of the rotary stage is positioned between each arm of the fixed stage and can be moved up and down. When each of the first receiving portions of the rotary stage is located between the second receiving portions of the fixed stage and rises to the height position of the second receiving portion, the first receiving portions are supported by the second receiving portions of the fixed stage. Is transferred to the first receiving portion of the rotary stage, and when the rotating stage is lowered, each first receiving portion of the rotary stage is located between the second receiving portions of the fixed stage. When the wafer is lowered to the height position of the second receiving portion, the wafer supported by the first receiving portion of the rotary stage is transferred to the second receiving portion of the fixed stage, and further, When each of the first receiving portions of the rotary stage is in a positional relationship of interfering with the second receiving portion of the fixed stage during lowering, the fixed stage rotates so as to avoid this interference.

Here, since the first receiving portion is formed of a transparent body, even if the notch is located on the receiving portion, light passes through the first receiving portion of the transparent body, so that light is transmitted. The notch can be detected by an optical or light reflective sensor.
On the other hand, when the first receiving portion is formed of a non-transparent body, when the notch is located at the first receiving portion, the first receiving portion blocks light and the notch cannot be detected. It is necessary to remove from one receiving portion and perform an operation (retry) of detecting the notch position again. Therefore, when the first receiving portion is made of a transparent body, retry is not required and time can be reduced.

Further, when the outer peripheral portion of the wafer supported by the stage is a non-device forming area, the stage does not contact the device forming area of the wafer, so that the problem of damaging the device forming area can be prevented.

The hand of the transfer robot may be located at a position where the tip of the hand does not hinder the lifting and lowering of the arm of the rotary stage from the time when the wafer is transferred to the fixed stage to the time when the notched wafer is received. When notch alignment is performed, the notch alignment can be started earlier and the notch alignment completed wafer can be compared with the case where the hand stands outside the notch alignment machine during notch alignment. The wafer can be unloaded early from the machine, and the total time required from wafer loading to unloading of the notch aligner can be reduced.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 are a plan view and a front sectional view, respectively, of a main part of a notch matching machine according to an embodiment.

In FIGS. 1 and 2, notch aligning machine 1
00 denotes a wafer 2 having a notch formed in the outer peripheral portion 200a.
00, for example, includes drop-down stages 1 and 2 as holding means for supporting a silicon wafer having a diameter of 300 mm from below.

The two stages 1 and 2 may be composed of a single stage, however, the certainty of notch detection,
In order to simplify the notch detecting means 50 and the like, it is preferable to configure the notch detecting means 50 by two stages including the rotating stage 1 and the fixed stage 2 as in the present embodiment.

The rotary stage 1 is used to detect a notch.
While the wafer 200 is supported from below, the wafer 200 makes one rotation from a predetermined fixed rotation position (corresponding to the rotation position shown in FIG. 1).

The rotary stage 1 has a plurality (three in this embodiment) of first receiving portions 3 for supporting the outer peripheral portion 200a (preferably, the non-device forming area) of the wafer 200 from below.
Having. Each first receiving portion 3 is equiangularly spaced (120 ° in the present embodiment) based on the rotation center position of the rotary stage 1.
At intervals). Each first receiving part 3 is preferably
As shown in FIG. 1, it is formed at the end of a narrow band-shaped first arm 4 that extends linearly toward the center of rotation when viewed in plan.

Below the rotary stage 1, a first driving means 5 for rotating the rotary stage 1 is provided. The first driving unit 5 includes a rotating shaft 6 extending from the lower surface of the rotating stage 1, and the rotating shaft 6 passes through the vertical through hole 2 a of the fixed stage 2 in a non-contact state. The lower end of the rotating shaft 6 is connected to an output shaft of a motor 9 via power transmission means such as gears 7 and 8. As described above, the rotary stage 1 is rotatable by the first driving means 5 using the motor 9 or the like as a power source.

The rotating shaft 6 is fixed to a lifting member 11 on which a bearing 10 for the rotating shaft 6 is disposed. The elevating member 11 can be moved up and down by driving means (not shown). As described above, the rotating stage 1 can be moved up and down integrally with the elevating member 11 by the driving means. Note that, in the case of the present embodiment, the rotary stage 1
As shown in the figure, the robot moves up and down between three height positions of an upper position U, an intermediate position M, and a lower position L, and makes one rotation when it is located at the upper position U.

A bracket 13 is mounted on the machine base 12. An optical sensor (notch detecting means) of a light transmission type or a light reflection type for detecting a notch of the wafer 200 during one rotation of the rotary stage 1 is provided on the bracket 13.
50 are provided.

The fixed stage 2 receives the wafer 200 to be notch-aligned from the hand 300 of the transfer robot, and thereafter, the wafer 20 after the notch alignment is completed.
The wafer 200 is placed when handing 0 to the hand 300. Further, when the notch position cannot be detected during one rotation of the rotary stage 1, the fixed stage 2 receives the wafer 200 from the rotary stage 1 and raises the wafer 200 by a predetermined angle, for example, 10 degrees so that the notch can be detected.
°, and the rotated wafer 200 is
Configured to pass to.

Similar to the rotary stage 1, the fixed stage 2 supports a plurality (three in this embodiment) of supporting the outer peripheral portion 200a (non-device formation area) of the wafer 200 from below.
The second receiving portions 14 are arranged at equal angular intervals (120 ° with respect to the rotation center position of the fixed stage 2).
First) adjacent to the rotary stage 1
It is arranged to be located between the receiving parts 3 (preferably in the middle). Like the first receiving portion 3, each of the second receiving portions 14 is preferably a narrow band-shaped and L-shaped linearly extending toward the center of rotation when viewed in a plan view, as shown in FIG. Second
It is formed at the end of the arm 15.

Below the fixed stage 2, a second driving means 16 for rotating and driving the fixed stage 2 is provided.
The second driving unit 16 includes a rotating shaft 17 that forms the upper and lower through holes 2a through which the rotating shaft 6 of the rotating stage 1 passes. The lower end of the rotating shaft 17 is connected to an output shaft of a motor 20 via power transmission means such as gears 18 and 19. Therefore, the fixed stage 2 is rotatable by the second driving means 16 using the motor 20 or the like as a power source.

The fixed stage 2 forms a space 21 in which the rotary stage 1 is housed so as to be able to move up and down. The space 21 is formed by the second arm 15 of the fixed stage 2, and the second receiving portion 14 is formed at the upper end of the vertical frame portion 15 a of the L-shaped second arm 15.

When the rotating stage 1 is lifted, the rotating stage 1
When the first receiving portion 3 of the fixed stage 2 has risen to the height position of the second receiving portion 14 of the fixed stage 2, the second receiving portion 1 of the fixed stage 2
The wafer 200 supported by 4 is transferred to the first receiving portion 3 of the rotary stage 1.

When the rotary stage 1 is lowered, when the first receiving portion 3 of the rotary stage 1 is lowered to the level of the second receiving portion 14 of the fixed stage 2, the first receiving portion 3 of the rotary stage 1 is moved downward.
The wafer 200 supported by the receiving part 3 is transferred to the second receiving part 14 of the fixed stage 2.

The loading and unloading of the wafer 200 to and from the notch aligner 100 is performed by the hand 300 of the transfer robot.
Done by

The hand 300 of the transfer robot enters the position W which does not hinder the elevating operation of the rotary stage 1, in other words, the elevating operation of the first arm 4, while the carried wafer 200 is being notched. Wait in state.

Next, the operation of the notch matching machine 100 configured as described above will be described in order with reference to FIG.

Initial State of Notch Matching Machine 100 Wafer 2 to Notch Matching Machine 100 by Transfer Robot
Before carrying in 00, the rotary stage 1 is maintained at the lower position L.

Wafer 20 to notch aligner 100
The carry-in transfer robot advances the hand 300 supporting the wafer 200 to a position above the second receiving portion 14 of the fixed stage 2 (S1), and then lowers the hand 300 (S2). When the hand 300 descends to the height position of the second receiving portion 14 when the hand 300 descends, the outer peripheral portion 200a of the wafer 200 supported by the hand 300 comes into contact with the second receiving portion 14, and the wafer 300 200 is fixed stage 2 from hand 300
Will be transferred to Thereafter, the hand 300 stops descending at the height position shown in FIG. 2, and moves to the tip position W shown in FIG.
Stage 1 without interference between the hand and the hand 300
Retreats to a position W that does not hinder the rise of the vehicle and waits (S
3). When the hand 300 descends, the hand 300
The fixed stage 2 can be lowered without interfering with the fixed stage 2 due to the relative positional relationship with the second receiving portion 14.

The transfer of the wafer 200 from the fixed stage 2 to the rotating stage 1 The notch aligner 100 raises the elevating member 11 by driving means (not shown), and moves the rotating stage 1 at the lower position L
Is raised to the upper position U (S4). When the rotary stage 1 is raised, when the first receiving portion 3 of the rotary stage 1 is raised to the height position of the second receiving portion 14 of the fixed stage 2,
The outer peripheral portion 200a of the wafer 200 supported by the second receiving portion 14 comes into contact with the first receiving portion 3, and the wafer 200 is transferred from the fixed stage 2 to the rotary stage 1. afterwards,
The rotation stage 1 stops rising at the upper position U. When the rotary stage 1 is raised, the hand 300 is in the standby state as described above, and the rotary stage 1 is housed in the space 21 opened above the fixed stage 2, and Since the second receiving portion 14 has a planar phase difference, the rotary stage 1 can move up without interfering with the hand 300 and the fixed stage 2.

Rotation of Rotation Stage 1 and Detection of Notch Position The rotation stage 1 supporting the wafer 200 is rotated once from the fixed rotation position by the first driving means 5 (S
5). During this rotation, the notch detecting means 503 moves the wafer 2
An operation of detecting the notch position of 00 is performed (S6).

A) When the notch position can be detected (1) Notch alignment The first driving means 5 is controlled based on the notch position detected by the notch detection means 50, and the wafer 200 is notched by the rotation of the rotary stage 1. It is rotated until it reaches a predetermined reference rotation position (S7).

(2) Judgment of presence or absence of interference between the rotating stage 1 and the fixed stage 2 It is determined whether or not the rotating stage 1 after the notch alignment causes interference with the fixed stage 2 (S8). . This judgment is made by the first stage of the rotary stage 1.
This is performed based on each rotational position of the receiving part 3 and the second receiving part 14 of the fixed stage 2. When it is determined that the stages 1 and 2 interfere with each other, the fixed stage 2 is rotated by an angle that can avoid the interference (S9). On the other hand, when it is determined that the stages 1 and 2 do not interfere, the fixed stage 2 is not rotated.

(3) From the rotary stage 1 to the fixed stage 2
The lifting member 11 is lowered, and the rotary stage 1 at the upper position U is lowered to the intermediate position M (S10). Since the lowering operation of the rotary stage 1 is performed after the rotating operation for avoiding the interference of the stages 1 and 2 with the fixed stage 2 as described above, the lowering operation is smoothly performed without interfering with the fixed stage 2. It is. When the rotary stage 1 is lowered, when the first receiving portion 3 of the rotary stage 1 is lowered to the height position of the second receiving portion 14 of the fixed stage 2, the wafer supported by the first receiving portion 3 The outer peripheral portion 200a of the second
The wafer 200 is transferred from the rotary stage 1 to the fixed stage 2 in contact with the receiving portion 14.

(4) Return of the rotating stage 1 The rotating stage 1 at the intermediate position M is rotated to the original fixed rotating position, and then the rotating stage 1 is lowered to the original lower position L (S11). During this descent, the rotating stage 1
Has already returned to the fixed rotation position,
It can descend without interfering with zero.

(5) Unloading of Wafer 200 from Notch Matching Machine 100 The transfer robot advances the hand 300 in the standby state to a position below the second receiving portion 14 of the fixed stage 2 (S1).
2) Then, it is raised (S13). This hand 300
When the hand 300 rises to the height position of the second receiving portion 14 at the time of rising, the hand 300 comes into contact with the wafer 200, and the wafer 200 is transferred from the fixed stage 2 to the hand 300. Thereafter, the hand 300 is moved backward, and the wafer 200 is unloaded from the notch aligner 100 (S1).
4).

(6) Return of the fixed stage 2 When the above-mentioned rotation of the fixed stage 2 (S9) is performed, the fixed stage 2 is rotated to the original fixed rotation position,
End the operation.

B When the notch position cannot be detected When the notch is located on the first receiving portion 3 of the rotary stage 1, the notch position may not be detected in some cases. In such a case, the operation is performed as follows.

(1) Rotating stage 1 to fixed stage 2
The lifting member 11 is lowered, and the rotary stage 1 at the upper position U is lowered to the intermediate position M (S17). When the rotary stage 1 is lowered, when the first receiving portion 3 of the rotary stage 1 is lowered to the height position of the second receiving portion 14 of the fixed stage 2, the wafer supported by the first receiving portion 3 The outer peripheral portion 200a of the wafer 200 contacts the second receiving portion 14 and the wafer 200
Is transferred from the rotary stage 1 to the fixed stage 2. Thereafter, the rotation stage 1 stops descending at the intermediate position M.

(2) Rotation of Fixed Stage 2 The fixed stage 2 is rotated by a predetermined angle, for example, 10 ° by the second driving means 16 (S18). Note that this angle is
Is determined based on the circumferential width of the first receiving portion 3, and
The rotation of the fixed stage 2 causes the second arm 15 to move the hand 3
00 is set within a range in which a problem of interference with 00 can be avoided.

(3) Fixed stage 2 to rotating stage 1
The lifting member 11 is raised, and the rotary stage 1 at the intermediate position M is raised to the upper position U (S19). When the rotary stage 1 is raised, the wafer 200 is transferred from the fixed stage 2 to the rotary stage 1 by the same operation as described above, and thereafter, the rotary stage 1 stops rising at the upper position U. The wafer 200 transferred to the rotary stage 1
Is the rotation stage 1 after the rotation of the fixed stage 2 described above.
Are supported by the rotating stage 1 with a phase difference of a predetermined angle as compared with the case where the image is transferred to the rotating stage 1 by the above operation.

(4) Return of fixed stage 2 The fixed stage 2 is returned to the original rotational position (S2
0).

(5) Counting up the number of retries The number of retries for notch detection is counted up (S2).
1).

(6) Rotation of Rotation Stage 1 and Detection of Notch Position Rotation stage 1 supporting wafer 200 is rotated once from the fixed rotation position by first drive means 5 (S
5). During this rotation, the notch detecting means 50 performs the operation of detecting the notch position of the wafer 200 again (S
6).

(7) a When the Notch Position Can be Detected In the same manner as in a), the notch alignment, the transfer of the wafer 200 from the rotary stage 1 to the fixed stage 2, the return of the rotary stage 1, the wafer 200 from the notch aligner 100 Unloading and the like (S7 to S15) are performed, and the operation ends.

(7) b In the case where the notch position could not be detected In the same manner as in b, the wafer 200 was transferred from the rotary stage 1 to the fixed stage 2, the fixed stage 2 was rotated, and the wafer was transferred from the fixed stage 2 to the rotary stage 1. 200 transfer, rotation of rotary stage 1, notch position detection and fixed stage 2
(S17 to S21). When the number of retries reaches a predetermined value (S16), the notch alignment may be stopped (S22), and the operation may be terminated by unloading the wafer 200 from the notch aligner 100 as appropriate.

As described above, the notch aligner 100 according to the present embodiment uses the outer peripheral portion 200 a of the wafer 200.
Is provided with a drop-in type stage (rotary stage 1, fixed stage 2) for supporting the stage from below. For this reason, even if the notch is located on the wafer holding surface (the first receiving portion 3 and the second receiving portion 14) of the stage, the suction force is not reduced as in the case of the conventional vacuum suction, and the stage is not moved. Can be rotated at high speed, so that the time required for notch alignment can be reduced.

When a notch is located on the wafer holding surface of the stage, it is difficult to detect the notch by an optical sensor such as a light transmission type or a light reflection type.
The stage is composed of a rotating stage 1 and a fixed stage 2, and the rotating stage 1 starts rotating from a preset fixed rotating position in order to detect a notch position of the supported wafer 200. When the notch position cannot be detected during the rotation of the rotating stage 1 with respect to the fixed stage 2, the wafer 200 is received from the rotating stage 1 and rotated by a predetermined angle, and the wafer 200 is rotated. It is configured to pass to. For this reason, even if the notch cannot be detected initially,
The phase (rotational position) of the wafer 200 is changed, and the notch detection operation is performed again, so that the notch can be detected.

Since the outer peripheral portion 200a of the wafer 200 supported by the receiving portions 3 and 14 of the stages 1 and 2 is a non-device forming area, the receiving portions 3 and 14 do not contact the device forming area of the wafer 200. Therefore, it is possible to prevent a problem that the device forming area is damaged.

The hand 300 of the transfer robot moves the arm 4 of the rotary stage 1 up and down between the time when the wafer 200 is transferred to the fixed stage 2 and the time when the notched wafer 200 is received. Stand by while penetrating to a position where it will not interfere. Thus, during the notch alignment, the notch alignment can be started earlier and the wafer 2 after the notch alignment is completed, as compared with the case where the hand 300 stands by outside the notch alignment machine.
00 can be unloaded early from the notch aligner,
It is possible to reduce the total time required for loading and unloading the wafer from the notch aligner.

In the above-described embodiment, two stages including the rotary stage 1 and the fixed stage 2 are used. However, the present invention is not limited to this, and the notch alignment is performed using a single drop-in type stage. , It is possible to reduce the time required for notch alignment.

The first receiving portion 3 of the rotary stage 1 is made of a transparent material, for example, acrylic resin, so that even if the notch is located on the first receiving portion 3, a light transmitting or light reflecting sensor can be used. Makes the notch detectable. For this reason, the above-described notch position correction operation (S16 to S22) by the fixed stage 2 becomes unnecessary, and the time can be reduced.

[0063]

As described above, according to the present invention,
The adoption of the drop-in type stage enables high-speed rotation of the stage, and the time required for notch alignment can be reduced.

Further, the dropping stage is composed of two stages including a fixed stage and a rotating stage, and the rotating stage performs a rotating operation for detecting a notch, and the fixed stage adjusts the rotational position of the wafer. Even if the notch is located on the wafer holding surface of the rotary stage, the notch can be removed from the wafer holding surface of the rotary stage by adjusting the rotation position of the wafer with the fixed stage, thus enabling notch detection. Become.

By bringing the hand into a position where the lifting operation of the rotary stage is not hindered and in the standby state, it is possible to reduce the total time required for loading and unloading the wafer from the notch aligner.

Further, by forming the first receiving portion of the rotary stage from a transparent body, for example, acrylic resin, even if the notch is located on the first receiving portion, the notch can be formed by a light transmission type or light reflection type sensor. Detection becomes possible, and the notch position correction operation becomes unnecessary, and time can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part of a notch aligner according to an embodiment.

FIG. 2 is a front sectional view of a main part of the same.

FIG. 3 is a flowchart showing an operation example of the notch matching machine.

[Explanation of symbols]

REFERENCE SIGNS LIST 100 notch aligner 1 rotary stage (holding means, drop-in type stage) 2 fixed stage (holding means, drop-in type stage) 3 first receiving part (receiving part) 4 first arm (arm) 14 second receiving part (receiving part) 15 15 second arm (arm) 21 space 50 notch detecting means 200 wafer 200a outer peripheral part 300 hand

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Takashi Yoshimura 28, Kitaimaji Setona, Onishi-shi, Aichi F-term (reference) 5F031 BB09 BC01 CC12 GG02 GG15 HH05 JJ05

Claims (11)

[Claims] 1. A holding means for holding a wafer having a notch formed thereon, the holding means holding the wafer being driven to rotate, a notch position being detected during the rotation, and the notch position being set to a reference rotation position. In the notch matching machine for matching, the holding means is constituted by a drop-in type stage which supports an outer peripheral portion of the wafer from below. 2. The notch aligner according to claim 1, wherein an outer peripheral portion of the wafer supported by the stage is a non-device formation area. 3. The stage according to claim 1, wherein the stage has three receiving portions for supporting an outer peripheral portion of the wafer from below, and each receiving portion is based on a rotation center position of the stage. The receiving portions are formed at equal angular intervals, and each receiving portion is formed at an end of a narrow arm that is an L-shaped arm and linearly extends toward a rotation center position when viewed in plan. A space for allowing the transfer robot's hand for exchanging wafers with the stage to move forward, downward, ascend, and retreat. 4. The notch aligner according to claim 3, wherein the receiving portion is formed of a transparent body. 5. A holding means for holding a wafer having a notch formed therein, the holding means holding the wafer being driven to rotate, a notch position being detected during the rotation, and the notch position being set to a reference rotation position. In the notch aligning machine to be matched, the holding means is configured by a drop-down stage that supports the outer peripheral portion of the wafer from below, and the stage includes a rotating stage and a fixed stage, each rotating axis of which is arranged on the same axis. Wherein the fixed stage is configured to exchange the wafer with a hand of a transfer robot, and the rotary stage receives the wafer from the fixed stage, and for detecting a notch position of the wafer, The rotation is started from a preset fixed rotation position, and when the notch position cannot be detected during the rotation, the fixed rotation The fixed stage is configured to pass the wafer to the fixed stage, and the fixed stage is configured to correct the notch position of the wafer by rotating by a predetermined angle when receiving the wafer from the rotating stage; The stage receives the wafer after the notch position correction from the fixed stage, starts rotation again from the fixed rotation position for notch position detection, and moves the wafer, whose notch position is detected and the notch alignment is completed, to the fixed stage. Notch matching machine, characterized in that it is configured to be passed to 6. The notch aligner according to claim 5, wherein an outer peripheral portion of the wafer supported by the stage is a non-device formation area. 7. The rotary stage according to claim 5, wherein the rotary stage has three first receiving portions for supporting an outer peripheral portion of the wafer from below, and each of the first receiving portions is provided on the rotary stage. The first receiving portions are arranged at equal angular intervals based on the rotation center position, and each of the first receiving portions is formed at an end of a narrow arm that linearly extends toward the rotation center position when viewed in plan, The fixed stage has three second receiving portions that support the outer peripheral portion of the wafer from below, and each of the second receiving portions is arranged at equal angular intervals with reference to the rotation center position of the fixed stage, and Each of the second receiving portions is formed at an end of a narrow arm that is an L-shaped arm and extends linearly toward the center of rotation when viewed in a plan view.
A space is formed to allow forward, downward, upward and backward movements of the hand for exchanging wafers with the fixed stage, and each arm of the rotary stage is disposed between each arm of the fixed stage. When the rotary stage is lifted, each first receiving portion of the rotary stage is located between the second receiving portions of the fixed stage and rises to the height position of the second receiving portion. Then, the wafer supported by the second receiving portion of the fixed stage is transferred to the first receiving portion of the rotating stage, and when the rotating stage is lowered, each of the first receiving portions of the rotating stage is moved. When the part is located between the second receiving parts of the fixed stage and descends to the height position of the second receiving part, the wafer supported by the first receiving part of the rotary stage is moved to the fixed stage. Transferred to the second receiving section Further, when each of the first receiving portions of the rotary stage is in a positional relationship to interfere with the second receiving portion of the fixed stage when the rotary stage is lowered, the fixed stage rotates so as to avoid this interference. Notch matching machine characterized by the following. 8. The hand of the transfer robot according to claim 7, wherein the hand of the transfer robot has a tip of the hand of the arm of the rotary stage until the notch-aligned wafer is received after the wafer is transferred to the fixed stage. A notch aligning machine that waits in a position where it does not obstruct lifting and lowering. 9. A holding means for holding a wafer having a notch formed therein, the holding means holding the wafer being driven to rotate, a notch position being detected during the rotation, and the notch position being set to a reference rotation position. In the notch aligning machine to be matched, the holding means is configured by a drop-down stage that supports the outer peripheral portion of the wafer from below, and the stage includes a rotating stage and a fixed stage, each rotating axis of which is arranged on the same axis. The fixed stage has three second receiving portions that support the outer peripheral portion of the wafer from below, and is configured to exchange wafers with a hand of a transfer robot. The units are arranged at equal angular intervals based on the rotation center position of the fixed stage, and each second receiving unit
An L-shaped arm is formed at the end of a narrow arm that extends linearly toward the center of rotation when viewed in plan, and exchanges wafers with the fixed stage by these arms. A space is formed to allow the hand to move forward, descend, rise, and retreat, and the rotary stage includes three first receiving portions made of a transparent body that supports an outer peripheral portion of the wafer from below. Receiving the wafer from the fixed stage, sequentially performing a rotation operation for notch position detection and a rotation operation for notch alignment based on the detected notch position, and transfers the wafer after the notch alignment to the fixed stage. The first receiving portions are arranged at equal angular intervals based on the rotation center position of the rotary stage, and each of the first receiving portions is
Formed at the end of a narrow arm that extends linearly toward the center of rotation when viewed in a plane, each arm of the rotary stage is located between each arm of the fixed stage and can be moved up and down. When the rotary stage is lifted, when each of the first receiving portions of the rotary stage is located between the second receiving portions of the fixed stage and has risen to the height position of the second receiving portion, the fixed stage The wafer supported by the second receiving portion is transferred to the first receiving portion of the rotating stage, and when the rotating stage is lowered, each first receiving portion of the rotating stage is moved to the first receiving portion of the fixed stage. When the wafer is located between the two receiving portions and descends to the height of the second receiving portion, the wafer supported by the first receiving portion of the rotary stage is transferred to the second receiving portion of the fixed stage. And the rotating stage is lowered. A notch aligning machine, wherein when the first receiving portions of the rotary stage are in a positional relationship interfering with the second receiving portions of the fixed stage, the fixed stage rotates so as to avoid the interference. . 10. The notch aligner according to claim 9, wherein an outer peripheral portion of the wafer supported by the stage is a non-device formation area. 11. The hand of the transfer robot according to claim 9, wherein the hand of the transfer robot has a tip of the rotary stage during a period from when the wafer is transferred to the fixed stage to when the notched wafer is received. A notch aligning machine which stands by in a state where the arm has entered a position which does not hinder the elevation of the arm.