JP2000009447A - Tape carrier defect detection apparatus and defect detection method - Google Patents

Abstract

(57) [PROBLEMS] To detect a defect detecting device of a tape carrier for accurately and reliably detecting a lead or a defect generated between leads. A defect detection device that detects a defect of a lead formed on a tape carrier based on an image signal obtained by photographing a tape carrier, binarizes the image signal and generates corresponding image data. Means, a window forming circuit 64 for generating a window having a length that traverses a predetermined number of leads in the width direction and a predetermined width, and extracting image data of an image included in the generated window;
Lead part / inter-lead area calculation circuit 66 for calculating the area value of the lead area and the area between the leads in the window
And an image comparison circuit 70 that compares the calculated area value with the reference value to detect chips, protrusions, pits, and residual copper generated in the lead area and the inter-lead area.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a defect detection apparatus for inspecting defects generated in leads formed on a tape carrier used for mounting an IC or the like.

[0002]

2. Description of the Related Art A tape carrier is one in which leads are formed by a copper foil on a base material of a tape in which sprocket holes and device holes are formed. A TAB (Tape Automated Bonding) tape obtained by bonding an inner lead of such a tape carrier and an IC is fixed on a PCB substrate using, for example, an adhesive.

In recent years, there has been proposed an apparatus for inspecting defects and bending of leads of a tape carrier. For example, Japanese Patent Application Laid-Open No. Hei 7-286834 discloses an illumination optical system that irradiates the inner lead of a carrier from obliquely upper sides on both sides in the lead-out direction of the inner lead in order to detect the bending of the inner lead in the Z direction. And a CCD camera arranged almost directly above the device hole of the tape carrier. The larger the bending of the inner lead in the Z direction, the higher the intensity of reflected light incident on the CCD camera. A defect inspection apparatus that determines the bending in the Z direction by examining the luminance of a predetermined area of the image obtained by the method is disclosed.

Further, in order to detect protrusions or chips on the lead, reference image data indicating the shape of the lead is stored in advance, and the reference image data and the actual product obtained by the CCD camera are used. There has been proposed a detection device that compares image data indicating the shape of a lead with a method such as pattern matching.

[0005]

SUMMARY OF THE INVENTION However, TAB
Since the tape itself expands and contracts, the formed leads may have different shapes. That is, in the tape carrier of the same lot, the shape of the formed lead is almost the same in many cases, but if the lot is different, the shape of the lead is
May be different. In general, the shrinkage of TAB tape is said to be 0.1% to 0.2%. When this is converted into the number of pixels of the image by the CCD camera,
Reach 10 pixels or more. Therefore, even if it is a non-defective product, the shape of the lead may not match the shape of the lead shown in the reference image data, and there is a problem that erroneous detection occurs.

In general, a tolerance of about ± 8 μm is recognized in the width of a lead with respect to a specification value. When this tolerance is converted into the number of pixels of the image by the CCD camera, 2
It corresponds to about a pixel or about 6 pixels. Therefore, the shape of a good lead may not match the shape of the lead shown in the reference image data depending on the tolerance of the lead width, and there is a problem that erroneous detection occurs.

[0007] The present invention has been made based on the above circumstances, and has as its object to provide a defect detection device for accurately and reliably detecting a defect generated in a lead of a tape carrier. Another object of the present invention is to provide a defect detecting device capable of detecting residual copper generated between leads, based on the above circumstances.

[0008]

According to the present invention, there is provided a tape carrier defect detecting apparatus for achieving the above object.
Capture the image of the lead formed on the tape carrier,
A defect detection device for a tape carrier that detects a defect generated in the vicinity of the lead based on the image, wherein the binarization unit binarizes the obtained image and generates corresponding image data. Generating a window having a predetermined width and a length traversing one or more leads in the width direction of the image data, the window sequentially moving in the length direction of the leads; A window generating means for extracting image data of an image included in the window, a lead area calculating means for calculating an area value of a lead area in the window for each window, Defect detection means for comparing the area value of the read area with the reference value for read to detect chips, protrusions and pits generated in the read area. To.

According to the present invention, a window having a length and a predetermined width traversing one or more leads in the width direction is sequentially generated, and an area value of a lead portion region in the window and a reference value for read are generated. And whether or not a defect has occurred in the area. Therefore, by moving the window, it is possible to reliably detect the occurrence of a chip or a protrusion in the entire lead. As the reading reference value, for example, a value of a reading area which is determined in advance by the present apparatus to be normal can be used. Alternatively, for each tape carrier lot, a value obtained from a frame visually determined to be non-defective by using a magnified image, a microscope, or the like taken in advance before the start of inspection, taking into account tolerance, may be used. good. By using such a reference value for a lead, it is possible to detect a defect occurring in the lead without being greatly affected by expansion and contraction of the tape carrier and tolerance of the lead.

[0010]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a block diagram showing a configuration of a tape carrier defect detection device according to an embodiment of the present invention. As shown in FIG. 1, the defect detection device 10 includes a feeding roller 12 for sending a tape carrier C wound on a reel on a sending side to the defect detection device 10, and a tape carrier C passing under the defect detection device 10. , A take-up roller 14 for feeding the tape carrier C, a first CCD camera 16 for photographing the tape carrier C, and a first X-axis for controlling the position of the first CCD camera 16 in the X-Y direction. Y control unit 18
And an image measurement unit 20 that performs predetermined processing on the image signal obtained by the first CCD camera 16 to determine whether or not a lead formed on the tape carrier has a defect. An image determination / control unit 22 for finally determining whether or not the tape carrier has a defect based on information on a defect of the tape carrier sent from a defect measuring unit 28 to be described later; and a first CCD camera 16.
In accordance with the position information obtained from the second CCD camera 24 disposed on the downstream side of the tape carrier C transport path and the first XY control unit 18, A second XY control unit 26 for controlling the position in the −Y direction, a defect measurement unit 28 for partially measuring the leads of the tape carrier C, and the first and second CCD cameras 1.
A display unit 25 for displaying images captured by the display units 6 and 24
A setting unit 29 for setting an inspection area and an inspection standard before performing an inspection, and a punch driving unit 32 for controlling the operation of the punch 34 according to the determination result of the image determination / control unit 22.
And a punch 34 for punching a hole in a predetermined portion of the frame of the tape carrier finally determined to be defective, and a roller driving unit 36 for driving the feed roller 12 and the take-up roller 14.

The length of the tape carrier C is about 20 m to 200 m, and the tape carrier C is wound on a reel. FIG.
Is a plan view schematically showing a part of the tape carrier C. As shown in FIG. 2, in the tape carrier C, leads 58 are formed of copper foil on a tape (base material) 56 in which sprocket holes 52 and device holes 54 are formed. The sprocket hole 52 is provided in the tape carrier C.
The device hole 54 is a hole for transporting the IC.
(Not shown). Into the device hole 54, an inner lead 58a is led out.
By connecting to C electrode, TAB tape or FP
C (Flexible Printed Circuit) is obtained. The portion of the tape carrier C where the leads are arranged around one device hole 54 is called a frame.

Generally, a polyimide resin is used as the material of the tape 56. In addition, tape carrier C
Has a two-layer structure or a three-layer structure depending on the manufacturing method. The two-layer structure includes a copper foil and a resin tape, and the three-layer structure includes a copper foil, a resin tape, and an adhesive for bonding the copper foil and the resin tape. In a tape carrier having a three-layer structure, the device holes 54 are formed by a punching method using a mold.
In the tape carrier having the two-layer structure, the device holes 54 are formed by a chemical etching method based on a photo engraving method using a photoresist.

The feed roller 12 and the take-up roller 14 drive the tape carrier C wound on one of the reels in accordance with a drive signal given from a roller drive unit 36.
Along the tape transport path (see arrow A in FIG. 1). As a result, the tape carrier C is moved between the first CCD camera 16 and the second CCD camera 16 arranged on the transport path.
It passes under the camera 24.

A first CCD camera 16 and a second CC camera
A light source (not shown) is disposed in the vicinity of the D camera 24. These CCD cameras 16 and 24 emit reflected light reflected by the tape carrier C which is irradiated from the light source and conveyed on the conveyance path. I am ready to accept. X-Y direction of the first CCD camera 16, that is,
The position of the tape carrier C in the plane direction is controlled by the first XY control unit 18. Further, the position of the second CCD camera 24 in the XY direction is controlled by the second XY control unit 26. Therefore, the first XY control unit 18
And the second XY control unit 26 causes the first CCD camera 16 and the second CCD camera 24 to
An image at a desired position on the tape carrier C can be obtained. In this embodiment, the first CCD camera 16 uses one frame of the tape carrier C for 40 frames.
An image composed of 00 pixels × 4000 pixels can be obtained. On the other hand, the second CCD camera 24 obtains an image of a more limited area in accordance with the position information given from the first XY control unit 18, so that 250,000- What is necessary is just to have a CCD element of about 350,000 pixels.

The image measuring section 20 includes the first CCD camera 1
The image signal obtained in step 6 is digitized to obtain a grayscale image of, for example, 256 gradations, which is further binarized with a predetermined threshold value, and a predetermined process is performed on the obtained binary image. In the image measuring unit 20, the tape carrier C
When it is determined that there is a defect in a certain area (lead area and / or inter-lead area) of a certain frame, the first XY control unit 18 sends a second XY control unit 26 The position information is provided, and the second XY control unit 26 positions the second CCD camera 24 according to the provided position information. Further, the defect measuring section 28 is provided with a second CCD.
The image signal obtained by the camera 24 is binarized to generate digital image data. As described above, the image data generated by the defect measurement unit 28 corresponds to an image of an area determined to have a defect by the image measurement unit 20.

The result of determination by the image measuring unit 20;
The image data obtained by the defect measurement unit 28 is
It is sent to the control unit 22. The image determination / control unit 22 finally determines whether or not the frame in the tape carrier C is defective based on the information, and if the frame is determined to be defective, the punch driving unit 32 , Punch 34
And outputs a signal instructing the driving of.

Before performing the inspection, the setting unit 29 performs an inspection on an image captured by the first CCD camera for each tape carrier in advance based on an instruction from a person in charge and an inspection target area or an inspection reference (threshold value). ) Is set. First, the setting of the inspection area will be described. 3 and 4 are views for explaining the inspection area of the tape carrier, and FIG. 4 is a partially enlarged view of FIG. In FIG. 3, an inner area including the pad portion 51 (an area surrounded by an outer dashed line in FIG. 3) is an inspection target area 100 to be inspected by the present apparatus, and is a device inside the inner lead 58 a. Area of the hole 54 (in FIG. 3, an area surrounded by an alternate long and short dash line)
Is a non-inspection area 110 where no inspection is performed by the present apparatus. By setting the non-inspection area 110 in this way, the inspection processing can be performed quickly. In this embodiment, as shown in FIG. 4, the lead between the inner lead 58a and the outer lead 58c is replaced with the intermediate lead 58.
The lead from the tip of the outer lead 58c to the pad portion 51 is referred to as a pad lead 58d. In this embodiment, only the inner lead 58a, the outer lead 58c, and the intermediate lead 58b are inspected.

The person in charge inspects the image picked up by the first CCD camera while viewing the screen of the display unit 25 such as a CRT, for example, by using a setting window or the like. 100 and a non-inspection area 110 not to be inspected are set. Next, the person in charge sets an inspection standard for each individual inspection area and each individual inspection area. The individual inspection region refers to a region where the inner leads 58a are formed, a region where the outer leads 58c are formed, a region where the intermediate leads 58b are formed, and a region where the pad leads 58d are formed. In the case of FIG. 3, the leads are drawn out in four directions.
Set the individual inspection area. The reason why such an individual inspection area is set is that, even for the same lead, the inspection standard differs depending on the location. In other words, since the inner leads are for connecting to the IC and the outer leads are for connecting to the substrate, the inspection standard should be strict. There is no need to be strict. The set inspection area and inspection standard are stored in a storage unit (not shown). Such setting is performed in advance when performing an inspection on a new product before performing the inspection. Further, once the setting is performed, the inspection for the same product can be performed immediately by reading the setting stored in advance from the storage unit.

Next, the operation of the tape carrier defect detecting device configured as described above will be described. First, a more detailed configuration of the image measuring unit 20 and processing executed by the image measuring unit 20 will be described in more detail below. FIG. 5 is a block diagram showing the configuration of the image measuring unit 20 according to this embodiment. As shown in FIG. 5, after receiving and digitizing the image signal from the first CCD camera 16, the image measuring unit 20 performs filtering on the image signal using a spatial filter, and then performs a binarization process. A filter / binarization circuit 62 to be applied, a window forming circuit 64 for applying a window to the image and extracting image data corresponding to an image area included in the window, and an image data obtained by the window forming circuit 64 A lead / inter-lead area calculation circuit 66 for obtaining data corresponding to a lead and data corresponding to an area between leads, an area image memory 68 in which predetermined image data is stored, An image comparison circuit 70 is provided for obtaining data from the area calculation circuit 66 and the area image memory 68 and comparing these data.

The processing executed by the image measuring unit 20 having the above-described configuration will be described with reference to the flowchart of FIG.
This will be described in more detail below. FIG. 6 is a flowchart showing the processing executed by the image measuring unit 20. The process shown in FIG. 6 can be used to detect both a chip and a protrusion generated in a lead.
By changing the binarization level, it becomes possible to more appropriately detect either a chip or a protrusion.

As shown in FIG. 6, the filter / binarization circuit 62 of the image measuring section 20 converts the analog image signal supplied from the first CCD camera 16 into 256 gradations (gradation 0 is a black level, It is received as a grayscale image (original image) digitized to a gray level of 255 with a white level (step 4).
01), and filtering is performed on this by a spatial filter (step 402). Thereby, noise included in the image is removed, or edges in the image are emphasized. Next, the filter / binarization circuit 62 binarizes the filtered image signal to generate binary image data (step 403). In addition, regarding the threshold value used for binarizing the image signal, it is preferable that the threshold value T1 used for detecting a chip is larger than the threshold value T2 used for detecting a protrusion. This means that the higher the binarization level, that is, the higher the threshold value, the more emphasis can be placed on the chipping in the lead,
On the other hand, as the threshold value is reduced, the protrusion generated on the lead can be more emphasized. Due to binarization, the part where the lead is formed is, for example,
The value indicates “1”, and the other parts are, for example,
The value indicates “0”. Similarly, the pits generated during the lead are more appropriately detected when binarized using the threshold value T1, while the residual copper that may occur between the leads is
Binarization using the threshold T2 can be detected more appropriately.

Window forming circuit 64 of image measuring section 20
Applies a window of a predetermined size to the image and extracts image data of a predetermined area (step 404). FIG.
FIG. 4 is a diagram for explaining a window over an image. As shown in FIG. 7, the window 500 crosses all the leads formed on one side of the frame (FIG. 2) in the width direction of the leads 501, 502,... (This is the longitudinal direction of the window). Is preferably provided. In the present embodiment, the window 500
It is preferable that the size in the length direction of the lead (which is the width direction of the window) is about (lead width) / 2.

Thereafter, the lead / inter-lead area calculation circuit 66 of the image measuring section 20 calculates the area of each lead (lead area) included in the window (step 405). More specifically, this is realized by calculating the size of the area in which the value in the window indicates “1”. For example, in FIG.
Include read areas 501, 502, 503 and 504
, The area of each of these read regions is calculated.

Next, the lead / inter-lead area calculation circuit 66 of the image measuring section 20 calculates the area of the area between the leads (inter-lead area) (step 406). More specifically, this is realized by calculating the size of the area where the value in the window indicates “0”. For example, in FIG. 7, since window 500 includes inter-lead regions 511, 512, 513, 514, and 515, the area of each of these regions is calculated.

After the areas of the respective regions are determined in steps 405 and 406, the image comparing circuit 70 compares the area values of these regions with predetermined reference values stored in the region image memory 68. (Step 407). As the reference value stored in the area image memory 68, for example, a visual check is performed for each lot of the tape carrier C using an enlarged image, a microscope, or the like taken in advance before the inspection, in consideration of the tolerance. May be a value obtained from a frame determined to be non-defective, or a window may be arranged in a predetermined area in a frame currently being processed, and the window within the window determined to be normal It may be a value obtained from each lead area and the area between leads.

In the comparison in step 407, if the area value of the region is within a predetermined range centered on the reference value, it is determined that the region is normal, while If not, the area is determined to be abnormal (step 408). In this embodiment, when the area value of the read area is within the range of 95% to 105% of the reference value (reference value for reading), it is determined that the read area is normal. On the other hand, if the area value of the read area is smaller than 95% of the reference value, it is determined that the area is missing (for example, reference numeral 521) or has a pit (for example, reference numeral 522). If it is greater than 105% of the reference value, it is determined that a protrusion (for example, reference numeral 524) has occurred in that area. If it is determined that the read area is abnormal, the coordinates of the center of gravity are calculated, and this is temporarily stored in a predetermined area of the area image memory 68.

Further, in step 408, the residual copper 523 as shown in FIG. 7A can be detected by comparing the area value of the inter-lead area with a reference value (reference value for inter-lead). Becomes Even when it is determined in step 408 that residual copper has been generated in the inter-lead area, the position of the residual copper (coordinate of the center of gravity) is calculated, and this is temporarily stored in a predetermined area of the area image memory 68. You.

When the processing of steps 405 to 408 is completed, the window is moved (step 40).
9, 410), and returns to step 405. The size of the window movement is preferably about 1/2 of the window width, that is, the window after the movement and the window before the movement overlap each other by half (window 5).
00 and 530). As a result, chips, protrusions and pits generated in the lead portion can be detected more reliably. In this way, when the processing illustrated in FIG. 6 is completed, the first XY control unit 18 determines that the projection, the chip, the pit, or the residual copper has occurred in response to the instruction from the image measurement unit 20. The position information indicating the determined position is output to the second XY control unit 26.

In this way, the image measuring unit 20
When the position information indicating the position where it is determined that the protrusion, the chip, the pit, and / or the residual copper has occurred is given to the second XY control unit 26, the second XY control unit 26 The second CCD camera 24 is moved and positioned according to the position information. Next, an image signal corresponding to the image captured by the second CCD camera 24 is provided to the defect measurement unit 28. As described above, the second CCD camera 24 can obtain a more detailed image of a predetermined partial area in a frame according to the position information.

The defect measuring section 28 receives an image signal corresponding to a more detailed image of a partial area in the frame, and digitizes, filters, binarizes, etc. the same as the image measuring section 20. And the inspection process more minute than the image measurement unit 20 is performed. The image determination / control unit 22 receives the measurement result obtained by the image measurement unit 20 and the data of the image of the partial area obtained by the defect measurement unit 28, and finally receives the frame A defect is found in the middle lead, and if so, which lead is determined. If it is determined that any of the leads has a defect, the punch driving unit 32 is instructed to drive the punch 34 to make a hole in the frame.

As described above, for a certain frame,
The frame image is photographed by the first CCD camera 16, then the frame image is photographed by the second CCD camera 24, and in some cases, a hole is formed in the frame by the punch 34. this is,
The image determination / control unit 22 controls the roller driving unit 36 to rotate the rollers 12 and 14 at a predetermined speed, convey the tape carrier C, and synchronize with the movement of the frame of the tape carrier C. , The first CCD camera 16, the second
These may be controlled so that the CCD camera 24 and the punch 34 operate.

According to this embodiment, the image is windowed to obtain image data of an area having a length including a lead formed on one side of the frame of the tape carrier, and a lead portion in this area is obtained. And the size of the region between the leads is calculated, and it is determined whether or not these area values are within a certain range from a predetermined reference value. Therefore, it is possible to detect a defect generated in the lead area or the inter-lead area without being greatly affected by the expansion and contraction of the tape carrier and the tolerance of the leads. In addition, the window is moved in the length direction of the lead so as to partially overlap the preceding window, and the area value of the lead area and the inter-lead area in the window is calculated. The detected defect can be detected without omission.

Next, a description will be given of a tape carrier defect detecting apparatus according to a second embodiment of the present invention. The configuration and operation of this defect detection apparatus are the same as those of the first embodiment except for the processing executed by the image measurement unit. Therefore, in the second embodiment, parts having the same functions as those of the first embodiment will be denoted by the same reference numerals as those of the first embodiment, and functions that are not the same but correspond to the functions of the first embodiment will be described. The description will be given using the corresponding reference numerals in the hundreds. Processing executed in the image measuring unit 120 of the defect detection device according to the second embodiment will be described with reference to the flowchart in FIG. As shown in FIG. 8, among the processes according to the second embodiment, the processes of steps 601 to 606 respectively correspond to the processes of steps 401 to 406 of FIG. After the areas of the respective regions are obtained in steps 605 and 606, the image comparison circuit 170 compares the area values of these regions with the reference values stored in the region image memory 168 (step 607). In the second embodiment,
The reference value is the area value of each region in the window preceding by a predetermined number, that is, the window preceding by a predetermined number, for example, the area value of each region determined to be normal in the immediately preceding (one preceding) window. It is.

Therefore, in step 607,
The area value of a certain area obtained in step 605 or 606 is compared with the area value of a corresponding area preceding by a predetermined number. In the comparison in step 607, when the area value of the area is included in the predetermined range from the reference value, it is determined that the area is normal, and on the other hand, the area is not included in the predetermined range. In this case, the area is determined to be abnormal (step 608). In the second embodiment, similarly to the first embodiment, when the area value of the lead region is within the range of 95% to 105% of the reference value, it is determined that the lead portion is normal. . On the other hand,
If the area value of the read area is smaller than 95% of the reference value, it is determined that the area is chipped or has pits. If the area value is larger than 105% of the reference value, the area is determined. It is determined that there is a protrusion on the surface. If it is determined that the lead area is abnormal, the barycentric coordinates of the lead part are calculated, and this is stored in the area image memory 1.
68 is temporarily stored in a predetermined area.

In step 608, the remaining copper can be detected by comparing the area value of the inter-lead region with a reference value. Even when it is determined that residual copper has occurred, the position (coordinate of the center of gravity) of the residual copper is calculated, and this is temporarily stored in a predetermined area of the area image memory 168. Next, when the image comparison circuit 170 determines in step 608 that the lead portion and the area between the leads are normal, steps 605 and 60
The area value of each region obtained in step 6 is stored in the region image memory 168 as a reference value (step 609). Also, the data in the area image memory 168 is not updated for the area value of the read area and / or the inter-read area determined to be abnormal.

When the processing of steps 605 to 609 is completed, the window is moved (step 61).
0, 611), and returns to step 605. These processes are
This corresponds to steps 409 and 410 in FIG. 6, respectively. When the processing shown in FIG. 8 ends, the first XY control unit 18
Outputs, to the second XY control unit 26, position information indicating a position where it is determined that a protrusion, a chip, a pit, or a residual copper has occurred in response to an instruction from the image measurement unit 20.

As described above, the position information indicating the position where it is determined that the protrusion, the chip, the pit, and / or the residual copper has occurred is given to the second XY control unit 126 by the image measuring unit 120. Then, the second XY control unit 126
Moves and positions the second CCD camera 124 in the same manner as in the first embodiment.
An image signal corresponding to the image captured by 24 is given to the defect measurement unit 128. The processing executed by the defect measurement unit 128 and the image determination / control unit 122 is the same as that of the first embodiment.

According to the present embodiment, the area image memory
Since the area value of the corresponding area in the preceding window is stored, regardless of the expansion and contraction of the tape due to the difference of the lot and the intersection of the leads, the defects occurring in the leads of the tape carrier can be detected accurately and reliably. It becomes possible. The present invention is not limited to the above embodiments,
It goes without saying that various modifications are possible within the scope of the invention described in the claims, and these are also included in the scope of the present invention.

For example, in the above embodiment, when the area value of the area is 95% to 105% of the reference value, it is determined that the area is normal. , Can be appropriately selected depending on the state of the tape. Further, in the above-described embodiment, the position of the center of gravity of each lead region in each window is calculated and stored, so that it is possible to detect the bending of the lead.

Further, in the above embodiment, the size of the window has a length in the width direction of the lead that traverses all the leads formed on one side of the frame, and is about half the width of the lead. However, it is needless to say that the present invention is not limited to this. Further, in this specification, means does not necessarily mean physical means, but also includes a case where the function of each means is realized by software. Further, the function of one means or member may be realized by two or more physical means or members, or the function of two or more means or members may be realized by one means or member. .

[0041]

As described above, according to the present invention, it is possible to provide a tape carrier defect detecting apparatus and a defect detecting method capable of accurately and reliably detecting a defect occurring in a lead. Further, according to the present invention, it is possible to provide a defect detection device and a defect detection method for a tape carrier capable of detecting residual copper generated between leads.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a tape carrier defect detection device according to an embodiment of the present invention.

FIG. 2 is a plan view schematically showing a part of a tape carrier C.

FIG. 3 is a diagram for explaining an inspection area of a tape carrier.

FIG. 4 is a partially enlarged view of FIG. 3;

FIG. 5 is a block diagram showing a configuration of an image measuring unit according to the embodiment.

FIG. 6 is a flowchart illustrating a process executed by the image measurement unit according to the first embodiment of the present invention.

FIG. 7 is a diagram illustrating a window over an image.

FIG. 8 is a flowchart illustrating a process executed by an image measuring unit according to the second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Defect detection apparatus 12 Sending-out roller 14 Take-up roller 16 1st CCD camera 18 1st XY control part 20 Image measurement part 22 Image judgment / control part 24 2nd CCD camera 26 2nd XY control Unit 28 defect measuring unit 32 punch driving unit 34 punch 36 roller driving unit 62 filter / binarization circuit 64 window forming circuit 66 lead unit / inter-lead area calculation circuit 68,168 area image memory 70,170 image comparison circuit 500 window 501 , 502, 503, 504 Read area 511, 512, 513, 514 Area between reads

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F065 AA00 AA58 BB13 BB15 BB27 CC27 DD03 FF01 FF04 JJ03 JJ05 JJ09 JJ26 MM03 MM22 QQ05 QQ24 QQ36 RR02 RR06 2G051 AA90 AB20 BA00 CA03 CA04 CA07 CB01 EA04 ED07 ED14 ED23 FA10 4M105 AA03 CC03 CC49 5B057 AA03 BA29 CC03 CE09 DA03 DB02 DB08 DC04 DC36 DC39

Claims (7)

[Claims] 1. A defect detection device for a tape carrier, which captures an image of a lead formed on a tape carrier and detects a defect generated in the lead and its vicinity based on the image. Binarizing means for binarizing and generating corresponding image data; and a window having a predetermined width and a length traversing one or more leads in the width direction with respect to the image data. Window generating means for generating windows that sequentially move in the length direction of the lead, and for each generated window, extracting image data of an image included in the window; and for each of the windows, a lead in the window. Read area calculating means for calculating the area value of the area of the area; comparing the calculated area value of the read area with the reference value for reading; Chipping, projections and defect detecting device of the tape carrier, characterized in that a defect detection means for detecting a pit. 2. An inter-lead area calculating means for calculating an area value of an area between the leads, wherein the defect detecting means includes a calculated inter-lead area value, an inter-lead reference value, 2. The defect detection device for a tape carrier according to claim 1, wherein the apparatus is configured to detect the residual copper generated in the inter-lead area by comparing. 3. A defect detecting means, comprising: when the defect detecting means determines that the read area is normal, storing the area value of the normal read area as the read reference value; 2. The tape carrier defect detecting device according to claim 1, wherein the reference value uses a read reference value stored in the storage unit. 4. A storage means for storing, when the defect detection means determines that the inter-read area is normal, the area value of the normal inter-read area as the inter-read reference value, 2. The tape carrier defect detecting device according to claim 1, wherein the defect detecting unit uses the reference value between leads stored in the storage unit. 5. The tape carrier according to claim 1, wherein the size of the window in the length direction of the lead is approximately one half of the width of the lead. Defect detection equipment. 6. A defect detection method for a tape carrier, wherein an image of a lead formed on a tape carrier is taken in, and a defect generated in the lead and its vicinity is detected based on the image. A window having a predetermined width and a length traversing one or more leads in the width direction with respect to the image signal. Generate windows that move sequentially in the vertical direction, extract the image data of the images contained in each generated window, and calculate the area value of the lead area in the window based on the extracted image data. Calculating, comparing the calculated area value of the lead area with the reference value for reading, detecting chips, protrusions and pits generated in the lead area, and moving the window A defect detection method for a tape carrier, wherein a defect generated in a lead is detected by detecting a chip, a protrusion, and a pit generated in a lead area every time. 7. An area value of an area between the leads is calculated, and the calculated area value of the area between the leads is compared with a reference value for the area between the leads to obtain a residual value generated in the area between the leads. 7. The method according to claim 6, wherein copper is detected.