JP2000007020A - Carrier material for chip electronic part and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier material for chip electronic parts which is capable of preventing adherence or fusion of the chip electronic parts when the chip electronic parts are stored and carried. SOLUTION: A carrier 1 for a tape-like chip electronic parts comprises a base material layer 2 in which storage holes 4 to store the chip electronic parts 7 are formed in the longitudinal direction with specified intervals, and a thermoplastic resin layer 3 having no support base material provided on one surface of the base material layer 2. The thickness of the thermoplastic resin layer 3 is about 5-150 μm, and the softening point of the thermoplastic resin layer 3 is about 60-290 deg.C, and the total light transmittance is not less than about 70%. The surface resistance of the thermoplastic resin layer 3 side is about 102-1013 Ω.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape-shaped carrier for chip-type electronic components used for transporting chip-type electronic components (hereinafter sometimes abbreviated as "chip components") and a method of manufacturing the same. About.

[0002]

2. Description of the Related Art As a method of transporting chip-type electronic components such as chip fixed resistors and multilayer ceramic capacitors, a taping reel system using an electronic component transport tape is known. FIG. 4 is a schematic perspective view showing a conventional electronic component transport tape. In this taping reel system, the lower surface of a tape-shaped cardboard (carrier tape) 11 in which a punched rectangular hole 14 for accommodating a chip-type electronic component and an automatic machine feed hole 15 are formed at regular intervals in the longitudinal direction, respectively. Heat sealing at 19 to make a storage pocket,
Immediately after that, the chip-type electronic component 17 is inserted into the storage pocket, and the top surface of the carrier tape 11 is heat-sealed with the top cover tape 16 to encapsulate the chip component 17.
It is wound and transported in a reel shape. Then, in the process of manufacturing the circuit board or the like of the transfer destination, the top cover tape 16
After peeling off, an automatic assembling system that automatically sucks the stored chip components 17 with an air nozzle and supplies the chip components 17 onto a substrate is mainly used. In the taping reel system, the carrier tape 11 may be a punched product in which a punched square hole 14 for storing electronic components and an automatic machine feed hole 15 are prepared in advance, or a non-punched product may be used. The hole 14 and the automatic machine feed hole 15 may be formed in a series of taping reel steps.

Conventionally, as the bottom cover tape 19, a layer (a conductive agent or an antistatic agent) made of a thermoplastic resin such as high-pressure polyethylene (LDPE), linear low-density polyethylene (LLDPE), ethylene-α-olefin copolymer or the like. (Which may contain an agent) on a supporting substrate such as Japanese paper. However, in the above-mentioned taping reel system, the time from heat sealing of the bottom cover tape 19 to insertion of chip components has become short in accordance with recent high-speed taping.
The chip component 17 is inserted in a state where the thermoplastic resin layer (adhesive layer) 9 is not sufficiently cooled and solidified. Therefore, there is a disadvantage that the chip component 17 adheres or fuses to the surface of the adhesive layer of the bottom cover tape 19 and causes a machine stop trouble in the automatic assembly system.

[0004] In addition to these thermal factors, the generation of static electricity due to vibrations during charging, transportation and transportation of the chip component 17 is coupled with the minimization of the weight of the chip component 17 which is further minimized. Bottom cover tape 1 for part 17
It is believed that this promoted the adhesion to No. 9. Furthermore, when the bottom cover tape 19 is heat-sealed to the carrier tape 11, heat is not sufficiently transmitted to an abnormally thick portion included in a supporting base material such as Japanese paper constituting the bottom cover tape 19, and the bottom cover tape 19 is adhered. Floating occurs in the layer.
With the recent emergence of extremely small chips, there is a possibility that the chip component 17 may fall out of the storage pocket due to the floating of the adhesive layer, and there is a concern that the reliability of component supply to the manufacturing process of a circuit board or the like may be reduced. In addition, since chip components will become increasingly smaller in the future, it is fully conceivable that the necessity of confirming the storage of chip components from the bottom cover tape side will arise as a process management when supplying components to the manufacturing process of a circuit board or the like.

[0005]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a chip type electronic component carrier material which can prevent the chip type electronic component from adhering or fusing when the chip type electronic component is stored and transported. And its manufacturing method. Another object of the present invention is to provide a chip-type electronic component carrier material which can prevent the chip-type electronic component from falling off even if the chip-type electronic component is small, and a method of manufacturing the same. It is still another object of the present invention to provide a chip-type electronic component carrier material in which the stored state of the chip-type electronic component can be visually recognized, and a method of manufacturing the same.

[0006]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and have found that one side of a base layer having a hole for accommodating a chip component does not include a supporting base. It has been found that the use of a tape-shaped carrier material provided with a thermoplastic resin layer not only prevents chip components from adhering, but also prevents chip components from falling off, and enables reliable transport, thus completing the present invention.

That is, the present invention provides a base material layer in which accommodation holes for accommodating chip-type electronic components are formed at predetermined intervals in the length direction, and a support base provided on one surface of the base material layer. Provided is a tape-shaped chip-type electronic component carrier material comprising a thermoplastic resin layer without a material.

The present invention also relates to a method of manufacturing the above-mentioned tape-shaped carrier for chip-type electronic components, wherein the accommodating holes for accommodating the chip-type electronic components are provided with a length of a wide sheet-like base material. After forming by punching at predetermined intervals in the direction and width direction, a thermoplastic resin layer is provided on one surface of the sheet-like base material, and then cut to a predetermined width to produce a carrier material for chip-type electronic components. provide.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings as necessary. FIG. 1 is a schematic perspective view showing a use state of an example of a chip-type electronic component carrier material of the present invention. FIG. 2 is a schematic cross-sectional view in a length direction showing a use state of the chip-type electronic component carrier material of FIG. FIG. 3 is a schematic cross-sectional view in the length direction showing a usage state of another example of the carrier material for a chip-type electronic component of the present invention.

In the example shown in FIGS. 1 and 2, the chip-type electronic component carrier material 1 has a storage hole 4 for storing the chip-type electronic component 7 at a predetermined interval in the length direction at the center in the width direction. It is composed of a base layer 2 formed and a thermoplastic resin layer 3 provided on one surface of the base layer 2. The thermoplastic resin layer 3 does not have a supporting substrate such as Japanese paper. Automatic machine feed holes 5 are formed in the width direction side portion of the carrier material 1 at predetermined intervals in the length direction.

The base material constituting the base layer 2 may be any material having a self-supporting property, for example, paper such as Japanese paper, crepe paper, synthetic paper, mixed paper, composite paper; non-woven fabric, cloth;
Plastic films or sheets composed of polyethylene, polypropylene, polyethylene terephthalate, polyvinyl chloride, cellophane, etc .; metal foils or thin plates composed of metals such as copper, nickel, aluminum, iron, etc., and laminates thereof . As the base material,
Paper is often used. The surface of the base material layer 2 is subjected to a conventional surface treatment, for example, a coating treatment with a release agent such as a silicone resin or a fluorine resin, a primer treatment,
Chemical or physical treatment such as chromic acid treatment, corona discharge treatment, ozone treatment, flame treatment, electron beam irradiation, and plasma treatment may be performed.

The thickness of the base material layer 2 can be appropriately selected within a range where the mechanical strength, handleability, component holding property, etc. are not impaired, and is, for example, 100 to 3000 μm, preferably 200 to 3000 μm.
程度 1500 μm. The size of the storage hole 4 can be appropriately set according to the size of the chip-type electronic component to be stored, but is usually about 0.3 to 5 mm in the length direction and the width direction of the carrier material 1, preferably 0 to 5 mm. The size is about 0.5 to 3 mm. The interval between the storage holes 4 and the interval between the automatic machine feed holes 5 can be selected within a range that does not impair the handling property and the like.
It is about 0 mm, preferably about 2 to 8 mm.

Examples of the thermoplastic resin constituting the thermoplastic resin layer 3 include various thermoplastic resins having a film forming ability, for example, polyolefin resins [for example, polyethylene (high-density polyethylene, low-pressure polyethylene, high-pressure polyethylene, Linear low-density polyethylene, etc.), polypropylene, ethylene-α-olefin copolymer (ethylene-propylene copolymer, etc.), ethylene-vinyl acetate copolymer, ethylene-acrylic copolymer (ethylene-ethyl acrylate copolymer) Polymers, ethylene-glycidyl methacrylate copolymer, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, ionomer, etc.), polyester resins (eg, polyethylene terephthalate, polybutylene terephthalate, etc.), Polystyrene resin, polyvinyl Alcohol-based resin (polyvinyl alcohol, ethylene - vinyl alcohol copolymer), polyvinyl chloride resin, polyvinylidene chloride resin, fluorine resin, cellulose resins, polycarbonate resins, and polyamide resins. These thermoplastic resins can be used alone or in combination of two or more.

The thickness of the thermoplastic resin layer 3 can be appropriately set in consideration of mechanical strength, handleability and the like, but is generally about 5 to 150 μm, preferably 10 to 100 μm.
It is about. The softening point of the thermoplastic resin layer 3 is, for example, 60
~ 290 ° C. Further, the total light (visible light) transmittance of the thermoplastic resin layer 3 is preferably 70% or more, particularly preferably 80% or more. When the total light transmittance of the thermoplastic resin layer 3 is high, whether or not the chip-type electronic component 7 is stored in the storage hole 4 can be easily visually recognized, which is advantageous in process management.

The width of the carrier material 1 can be set within a range that does not impair the handling property and varies depending on the size of the chip-type electronic component to be conveyed, but is, for example, about 3 to 50 mm, preferably about 4 to 20 mm.

In the drawing, reference numeral 6 denotes a top cover tape, for example, in a taping reel process, after a chip component 7 is inserted into a chip component storage pocket formed by the storage hole 4 and the thermoplastic resin layer 3, and then a base material is formed. It is bonded to the surface on the layer 2 side by a heat sealing method or the like. The top cover tape 6 has a function of preventing the chip component 4 from falling and dust from adhering to the chip component 4.

According to the chip-type electronic component carrier material 1, the thermoplastic resin layer 3 is provided on one surface of the base material layer 2 in which the accommodating holes 4 are formed. In addition, a chip component storage pocket is already formed by the storage hole 4 and the thermoplastic resin layer 3. Therefore, unlike the conventional case, the chip component is not inserted in a state where the thermoplastic resin layer is not sufficiently solidified,
Adhesion or fusion of the chip component to the adhesive layer can be prevented. Further, since the thermoplastic resin layer 3 does not have a supporting base material such as Japanese paper, even when the thermoplastic resin layer 3 is laminated on the base material layer 2 by thermal lamination, for example, heat conduction is ensured and floating is achieved. Lamination can be performed without generation. Therefore, the chip components 4 stored in the storage pockets hardly fall off.

The carrier material 1 for a chip-type electronic component shown in FIG. 3 has an antistatic layer 8 formed between a base material layer 2 and a thermoplastic resin layer 3 in that it is shown in FIGS. Is different from the chip-type electronic component carrier material shown in FIG.

The antistatic layer 8 can be composed of, for example, a conductivity-imparting agent and a resin having a film forming ability. In addition, when the conductivity imparting agent itself has a film forming ability, it can be constituted only by the conductivity imparting agent.

Examples of the conductivity-imparting agent include fine powders or fibers of metals such as copper, nickel, aluminum and iron; carbon powders and fibers such as carbon black; and inorganic oxides such as conductive tin oxide, silica and zinc oxide. Anionic antistatic agents (such as alkyl sulfates, alkylaryl sulfates, alkyl phosphates, and alkylamine sulfates), and cationic antistatics (quaternary ammonium salts, quaternary ammonium resins, and imidazolines). ), Nonionic antistatic agents (such as sorbitan, ether, amine and amide, ethanolamide, and polyethylene glycol), and amphoteric antistatic agents (such as betaine); T
CNQ, polyene-based polymer (such as polyacetylene),
Aromatic polymers [poly (p-phenylene), poly (2,
6-naphthalene)], a heterocyclic polymer [polypyrrole, poly (2,5-thienylene), poly (pyridine-
Conductive polymers (organic semiconductors) such as hetero-chain polymers (polyphenylene sulfide, polyaniline, etc.), copolymerized polymers (polyphenylene vinylene, polydithienyl polyene, etc.), ladder polymers (polyacene, etc.) Polymer). The conductivity imparting agent may be used alone or in combination of two or more. Examples of the resin having a film forming ability include the thermoplastic resins exemplified above.

The content of the conductivity-imparting agent in the antistatic layer 8 can be appropriately set in consideration of the mechanical strength and transparency of the carrier material 1, and varies depending on the type of the conductivity-imparting agent. Is about 0.1 to 70% by weight.

The thickness of the antistatic layer 8 is, for example, 0.01 to
It is 50 μm, preferably about 0.1 to 30 μm. The antistatic layer 8 is preferably transparent in order to increase the visibility of the chip-type electronic component 7 stored in the storage hole 4. For example, the total light transmittance transmitted through the two layers of the thermoplastic resin layer 3 and the antistatic layer 8 is preferably 70% or more, more preferably 80% or more.

The antistatic layer 8 is not necessarily formed on the base material layer 2.
It is not necessary to provide between the thermoplastic resin layer 3 and it, and it may be formed outside the thermoplastic resin layer 3. Further, the antistatic function can be provided by adding the above-described conductivity imparting agent to the thermoplastic resin layer 3 without independently providing the antistatic layer 8.

By providing an antistatic layer 8, or
By including a conductivity-imparting agent in the thermoplastic resin layer 3, the surface resistance of the carrier material 1 on the thermoplastic resin layer 3 side can be greatly reduced. For example, the surface resistance is 10 ² to
It can be reduced to about 10 ¹³ Ω. With such a carrier material, generation of static electricity due to vibration during transportation or transportation can be significantly suppressed, and thus, adhesion of chip-type electronic components can be more reliably prevented. Therefore, for example, it is possible to reliably supply chip components to a process of manufacturing a circuit board or the like in an automatic assembly system.

The chip-type electronic component carrier material of the present invention comprises:
After forming a storage hole capable of storing the chip-type electronic component by punching at predetermined intervals in the length direction and the width direction of the wide sheet-shaped base material, a thermoplastic resin layer is formed on one surface of the sheet-shaped base material. And then cut to a predetermined width.

The punching and cutting (slit) can be performed by conventional punching means and cutting means. The lamination of the sheet-like base material and the thermoplastic resin layer is, for example, an extrusion lamination in which a resin composition containing a thermoplastic resin is melt-extruded onto a sheet-like base material by a T-die or the like, a film formed of a thermoplastic resin or Thermal lamination in which the sheet is thermally fused to the surface of the sheet-like substrate by a heat roll, dry lamination or wet lamination in which the sheet-like substrate is bonded to a film or sheet made of a thermoplastic resin using an appropriate adhesive, or the like. Can be performed. Preferred lamination methods include extrusion lamination and thermal lamination.

The antistatic layer 8 as shown in FIG.
For example, the surface of a film or sheet made of a thermoplastic resin is coated with a coating solution containing a conductivity-imparting agent, or a resin composition containing a conductivity-imparting agent is melt-extruded (or co-extruded). Then, a laminate of the antistatic layer 8 and the thermoplastic resin layer 3 is formed in advance, and the laminate is laminated on the sheet-like substrate 2 by using the above-described lamination method (for example, thermal lamination). Can be provided. When the antistatic layer 8 is provided outside the thermoplastic resin layer 3, the thermoplastic resin layer 3 is provided on the surface of the sheet-like base material 2, and then the surface of the thermoplastic resin layer 3 is coated by a coating method. For example, the antistatic layer 8 can be formed.

The automatic machine feed hole 5 may be formed, for example, after the thermoplastic resin layer 3 is provided on one surface of the sheet-like base material 1 and before the sheet is cut into a predetermined width. It may be formed after cutting. The formation of the automatic machine feed hole 5 can be performed by a conventional drilling means.

The chip-type electronic component carrier material of the present invention comprises:
It can be suitably used to transport a wide range of chip-type electronic components such as resistors such as chip fixed resistors and capacitors such as multilayer ceramic capacitors.

[0030]

According to the present invention, since the thermoplastic resin layer is used in a completely cooled and solidified state, the chip-type electronic component can be stored and transported when the chip-type electronic component is stored and transported. Can be prevented from adhering or fusing to the carrier material. Also,
Since the thermoplastic resin layer is provided on one surface of the base material layer without the supporting base material, the bonding between the base material layer and the thermoplastic resin layer is reliably performed. Therefore, even if the chip-type electronic component is small, there is no risk of falling off. Further, when the total light transmittance of the thermoplastic resin layer is 70% or more, recognition accuracy of component storage confirmation from the lower surface side of the carrier material is improved in process control. Further, when the surface resistance of the thermoplastic resin layer side is 10 ² to 10 ¹³ Ω, adhesion of chip components due to static electricity generated by vibration during transportation and transportation can be prevented. In addition, chip-type electronic components can be reliably supplied to a process of manufacturing a circuit board or the like.

[0031]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

Example 1 A square hole for storing chip parts having a size of about 1.5 mm in the length direction and about 2 mm in the width direction was formed on a paperboard having a thickness of 0.6 mm and a basis weight of 485 g / m ^2. Punching was performed over the entire width direction at regular intervals of 4 mm in the direction. One surface of the paperboard is subjected to corona discharge treatment, and the corona discharge-treated surface is heated by a T-die extrusion laminator to a temperature of 250 ° C. under the die in a molten state.
After DPE (manufactured by Mitsui Petrochemical Industries, Ltd .; trade name: Mirason 10P) was laminated to a thickness of 40 μm, it was wound around a roll to obtain a rolled product. Next, at an intermediate portion between two adjacent holes of the previously formed chip component storing square hole,
A hole for automatic machine feed is provided at a distance of about 1.5 mm outside of one side parallel to the length direction of the square hole at an equal interval of 4 mm in the length direction. The carrier tape was obtained by slitting to a width of 8 mm so as to include the holes.

Example 2 A square hole for storing chip components having a size of about 1.5 mm in the length direction and about 2 mm in the width direction was formed on a paperboard having a thickness of 0.4 mm and a basis weight of 320 g / m ^2. Punching was performed over the entire width direction at equal intervals in the direction of 2 mm. One surface of the paperboard is subjected to corona discharge treatment, and the corona discharge-treated surface is heated by a T-die extrusion laminator to a P-melted state at a temperature below the die of 280 ° C.
After laminating P (manufactured by Mitsui Petrochemical Industry Co., Ltd .; trade name: Hypol LA221) to a thickness of 40 μm, it was wound up on a roll to obtain a rolled product. Next, in the intermediate portion between two adjacent holes of the previously formed chip component storing square hole, an automatic machine feed hole is extended at a position about 2 mm outside of a side parallel to the longitudinal direction of the square hole and separated by a length. After being provided at regular intervals of 4 mm in the vertical direction, the tape was slit into a width of 8 mm so as to include a square hole for storing chip components and an automatic machine feed hole to obtain a carrier tape.

Example 3 A square hole for storing chip components having a size of about 1.5 mm in the length direction and about 2 mm in the width direction was formed on a paperboard having a thickness of 0.6 mm and a basis weight of 485 g / m ^2. Punching was performed over the entire width direction at regular intervals of 4 mm in the direction. On the other hand, HDPE with a thickness of 40 μm
A film (manufactured by Mitsui Petrochemical Industry Co., Ltd .; trade name: Hizex 3300F) was coated with an antistatic adhesive (manufactured by Altec Co., Ltd .; trade name: Bondip-PA) to a thickness of 5 μm and dried to obtain a sheet. . The surface of the sheet on which the antistatic adhesive was applied was heat-sealed with a heat laminating roll to a paperboard on which the square holes for storing chip components had been processed, and the roll was rolled up to obtain a rolled product. Next, at an intermediate portion between two adjacent holes of the previously formed chip component storing square hole,
A hole for automatic machine feed is provided at a distance of about 1.5 mm outside of one side parallel to the length direction of the square hole at an equal interval of 4 mm in the length direction. The carrier tape was obtained by slitting to a width of 8 mm so as to include the holes.

Comparative Example 1 Using a T-die extrusion laminator, Japanese paper (basis weight 20 g /
m ^2, the LDPE (manufactured by Mitsubishi Chemical Corporation thickness 40 [mu] m); trade name: LC607 a), was extrusion laminated in a thickness of 20 [mu] m, to obtain a bottom tape was slit to 5.5mm widths. On the other hand, width 8mm, thickness 0.6m
m, paperboard having a basis weight of 485 g / m ² ,
A chip hole for storing chip components having a size of about 2 mm in the width direction and about 2 mm in the width direction was punched at regular intervals of 4 mm in the length direction to prepare a carrier tape.

Evaluation Test In Examples 1 to 3, the chip components were inserted into the square holes for accommodating the chip components of the obtained carrier tape, and the top cover tape was heat-sealed to seal the chip components. Was taken as a sample.

In Comparative Example 1, based on the conventional taping reel system, the bottom tape was heat-sealed on one surface of the carrier tape, and then the chip component was inserted into the square hole for storing the chip component. The tape was heat-sealed to seal the chip components, and the tape was wound into a reel to obtain a sample.

The following evaluation tests were performed on these samples. Table 1 shows the results. [Chip adhesion] While holding the sample with the top cover tape side facing the ground, peel off the top cover tape and count the number of chip components that do not fall off at that time (that is, the number of chip components adhering to the carrier tape). Was. In addition, the same operation as described above was performed on the sample that had undergone the transportation step, and the number of chip components that did not fall was counted. [Dropping of chips] The number of chip components not stored in the square hole for storing chip components (that is, the number of dropped chip components) was counted for the sample wound in a reel shape. [Total light transmittance] The total light transmittance of the thermoplastic resin layer in Examples 1 to 3 (however, the thermoplastic resin layer + the antistatic adhesive layer in Example 3), and the bottom tape for Comparative Example 1 Was measured by a haze meter.

[0039]

[Table 1]

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a use state of an example of a carrier material for a chip-type electronic component of the present invention.

FIG. 2 is a schematic cross-sectional view in a length direction showing a use state of the chip-type electronic component carrier material of FIG. 1;

FIG. 3 is a schematic cross-sectional view in a length direction showing a use state of another example of the carrier material for a chip-type electronic component of the present invention.

FIG. 4 is a schematic perspective view showing a conventional electronic component transport tape.

[Description of Signs] 1,11 Carrier material (carrier tape) for chip-type electronic components 2 Base material layer 3 Thermoplastic resin layer 4,14 Housing hole 5,15 Automatic machine feed hole 6,16 Top cover tape 7,17 Chip Type electronic parts 8 Antistatic layer 19 Bottom cover tape

Continuation of front page (72) Inventor Hiroki Ichikawa 1-2-1, Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation F-term (reference) 3E067 AA11 AB41 AC04 AC18 BA02A BB01A BB14A BB26A BC04A BC07A CA11 CA24 EA06 EB27 EC07 EE46 FA09 FB20 FC01 3E096 AA06 BA08 BB05 CA15 CB02 DA04 EA01X EA02X EA11X FA07 FA12 FA26 FA27 GA07

Claims (5)

[Claims] The present invention does not involve a base material layer in which storage holes capable of storing chip-type electronic components are formed at predetermined intervals in a length direction, and a support base material provided on one surface of the base material layer. A tape-shaped carrier material for chip-type electronic components composed of a thermoplastic resin layer. 2. The thermoplastic resin layer has a thickness of 5 to 150 μm.
The carrier material for a chip-type electronic component according to claim 1, wherein 3. The thermoplastic resin layer has a softening point of 60 to 290.
The carrier material for chip-type electronic components according to claim 1, wherein the total light transmittance at 70 ° C is 70% or more. 4. A thermoplastic resin layer having a surface resistance of 10 ² to 10 ² .
2. The carrier material for a chip-type electronic component according to claim 1, which has a resistance of 10 ¹³ Ω. 5. A method for producing a tape-shaped chip-type electronic component carrier material according to claim 1, wherein the accommodating hole for accommodating the chip-type electronic component is formed in a longitudinal direction of a wide sheet-like base material. And forming a thermoplastic resin layer on one surface of the sheet-like base material after forming by punching at predetermined intervals in the width direction, and then cutting the sheet-shaped substrate into a predetermined width.