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JP1665228S - - Google Patents

Info

Publication number
JP1665228S
JP1665228S JPD2019-26362F JP2019026362F JP1665228S JP 1665228 S JP1665228 S JP 1665228S JP 2019026362 F JP2019026362 F JP 2019026362F JP 1665228 S JP1665228 S JP 1665228S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-26362F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-26362F priority Critical patent/JP1665228S/ja
Priority to TW109302373F priority patent/TWD212726S/en
Priority to US29/735,900 priority patent/USD958093S1/en
Application granted granted Critical
Publication of JP1665228S publication Critical patent/JP1665228S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-26362F 2019-11-28 2019-11-28 Active JP1665228S (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2019-26362F JP1665228S (en) 2019-11-28 2019-11-28
TW109302373F TWD212726S (en) 2019-11-28 2020-05-04 Part of wafer boat for substrate processing equipment
US29/735,900 USD958093S1 (en) 2019-11-28 2020-05-26 Boat of substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-26362F JP1665228S (en) 2019-11-28 2019-11-28

Publications (1)

Publication Number Publication Date
JP1665228S true JP1665228S (en) 2020-08-03

Family

ID=71843123

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-26362F Active JP1665228S (en) 2019-11-28 2019-11-28

Country Status (3)

Country Link
US (1) USD958093S1 (en)
JP (1) JP1665228S (en)
TW (1) TWD212726S (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1700777S (en) * 2021-03-15 2021-11-29 Boat for substrate processing equipment
JP1731674S (en) * 2022-05-30 2022-12-08
JP1731673S (en) * 2022-05-30 2022-12-08
JP1731675S (en) * 2022-05-30 2022-12-08
JP1741512S (en) * 2022-09-14 2023-04-11

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
KR100410982B1 (en) * 2001-01-18 2003-12-18 삼성전자주식회사 Boat for Semiconductor Manufacturing Apparatus
JP2002324830A (en) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp Holding tool for substrate heat treatment, substrate heat treating equipment method for manufacturing semiconductor device, method for manufacturing the holding tool for substrate heat treatment and method for deciding structure of the holding tool for substrate heat treatment
JP4506125B2 (en) * 2003-07-16 2010-07-21 信越半導体株式会社 Vertical boat for heat treatment and manufacturing method thereof
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
TWD166332S (en) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 Part of the wafer boat for substrate processing equipment
JP1537313S (en) * 2014-11-20 2015-11-09
JP1537629S (en) * 2014-11-20 2015-11-09
JP1584066S (en) * 2017-01-18 2017-08-21

Also Published As

Publication number Publication date
TWD212726S (en) 2021-07-21
USD958093S1 (en) 2022-07-19

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